TWI444742B - Electrophoretic display panel - Google Patents

Description

Electrophoretic display panel

The present invention relates to a display panel, and more particularly to an electrophoretic display panel (EPD).

In recent years, as various display technologies continue to flourish, after continuous research and development, products such as electrophoretic displays, liquid crystal displays, plasma displays, and organic light-emitting diode displays have been gradually commercialized and applied to various sizes. And display devices of various sizes. With the increasing popularity of portable electronic products, flexible displays (such as e-paper, e-books, etc.) have gradually gained market attention. In general, e-paper and e-book use electrophoretic display technology to achieve display. Taking an e-book showing black and white as an example, the sub-pixel is mainly composed of a black electrophoresis liquid and white charged particles doped in a black electrophoresis liquid, and the white charged particles can be driven by applying a voltage to make each pixel Display black, white, or gray with different tones.

In the prior art, the electrophoretic display mostly uses the reflection of the external light source to achieve the purpose of display, and the white charged particles doped in the electrophoresis liquid by the voltage driving can make each sub-pixel display the desired gray scale. In general, the main structure of an electrophoretic display is a combination of a TFT array substrate, an ESD film, and a barrier film. 1 is a partial cross-sectional view of a conventional electrophoretic display. Referring to FIG. 1 , the electrophoretic display 100 includes a thin film transistor array substrate 110 , an electrophoretic display film 130 , and an adhesive layer 140 . The adhesive layer 140 is used to bond the thin film transistor array substrate 110 and the electrophoretic display film 130 .

In the thin film transistor array substrate 110, the first metal layer 114, the dielectric layer 116, the second metal layer 118, the protective layer 120, the planarization layer 122, the third metal layer 124, and the transparent conductive layer 126 are sequentially stacked on the substrate. 112 on. In order to electrically connect the first metal layer 114 and the second metal layer 118, the conventional electrophoretic thin film transistor array substrate is formed by forming a plurality of contact windows in the dielectric layer 116, the protective layer 120, and the planar layer 122, respectively. A portion of the first metal layer 114 and the second metal layer 118 are exposed, and the first metal layer 114 and the second metal layer 118 are overlapped by the third metal layer 124 and the transparent conductive layer 126 through the contact window.

However, for the electrophoretic display process, the thin film transistor array substrate 110 exposed to the air has a relatively high probability of occurrence of metal wire oxidative corrosion or film surface scratching before the electrophoretic display film 130 and the waterproof film are protected. Bad effects such as injuries. In addition, in the case where the third metal layer 124 and the transparent conductive layer 126 are used for lap joint, since the third metal layer 124 composed of the molybdenum/aluminum/molybdenum (Mo/Al/Mo) layer is covered only with a transparent layer Since the conductive layer 126, the chemical substance in the adhesive layer 140 easily reacts with the third metal layer 124 in the thin film transistor array substrate 110, thereby causing corrosion. As a result, the metal corrosion problem occurring in the thin film transistor array substrate 110 affects the element characteristics of the thin film transistor, which in turn leads to poor display quality or reliability of the electrophoretic display.

The invention provides an electrophoretic display panel with better corrosion resistance.

The invention provides an electrophoretic display panel comprising an active device array substrate and an electrophoretic display film. The active device array substrate includes a substrate, a first conductive pattern, a first dielectric layer, a second conductive pattern, and a second dielectric layer. The first conductive pattern is disposed on the substrate. The first dielectric layer is disposed on the substrate to cover the first conductive pattern, and the first dielectric layer has a contact window to expose a partial region of the first conductive pattern. The second conductive pattern is disposed on the first dielectric layer, and the second conductive pattern is electrically connected to the first conductive pattern through the contact window. The second dielectric layer is disposed on the first dielectric layer to cover the second conductive pattern. The electrophoretic display film is disposed on the second dielectric layer.

In an embodiment of the invention, the electrophoretic display film comprises a conductive layer, an insulating layer and a plurality of electrophoretic display media. The insulating layer is disposed on the conductive layer, wherein the insulating layer has a plurality of micro-cups arranged in an array, and the insulating layer is located between the conductive layer and the active device array substrate. The electrophoretic display medium is disposed in the microcup of the insulating layer.

In an embodiment of the invention, each of the electrophoretic display media comprises an electrophoretic fluid and a plurality of charged particles, wherein the charged particles are doped in the electrophoresis liquid.

In one embodiment of the invention, the electrophoretic fluid is a black electrophoretic fluid and the charged particles are white charged particles.

In an embodiment of the invention, the second dielectric layer comprises a protective layer and a flat layer. The protective layer is disposed on the first dielectric layer to cover the second conductive pattern. The flat layer is disposed on the protective layer, and the electrophoretic display film is disposed on the flat layer.

The invention further provides an electrophoretic display panel comprising an active device array substrate and an electrophoretic display film. The active device array substrate includes a substrate, a first conductive pattern, a first dielectric layer, a second conductive pattern, a second dielectric layer, a third conductive pattern, a protective layer, and a fourth conductive pattern. The first conductive pattern is disposed on the substrate. The first dielectric layer is disposed on the substrate to cover the first conductive pattern, and the first dielectric layer has a first contact window to expose a partial region of the first conductive pattern. The second conductive pattern is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer to cover the second conductive pattern, the second dielectric layer has a second contact window and a third contact window, and the second contact window exposes a partial region of the second conductive pattern, The third contact window is located above the first contact window. The third conductive pattern is disposed on the second dielectric layer, wherein the third conductive pattern is electrically connected to the second conductive pattern through the second contact window, and the third conductive pattern is transmitted through the first contact window and the third contact window and the first The conductive patterns are electrically connected. The protective layer is disposed on the second dielectric layer to cover the third conductive pattern. The fourth conductive pattern is disposed on the protective layer. The electrophoretic display film is disposed on the second dielectric layer.

In an embodiment of the invention, the electrophoretic display film comprises a conductive layer, an insulating layer and a plurality of electrophoretic display media. The insulating layer is disposed on the conductive layer, wherein the insulating layer has a plurality of microcups arranged in an array, and the insulating layer is located between the conductive layer and the active device array substrate. The electrophoretic display medium is disposed in the microcup of the insulating layer.

In an embodiment of the invention, each of the electrophoretic display media comprises an electrophoretic fluid and a plurality of charged particles, wherein the charged particles are doped in the electrophoresis liquid.

In one embodiment of the invention, the electrophoretic fluid is a black electrophoretic fluid and the charged particles are white charged particles.

In an embodiment of the invention, the second conductive pattern does not cover the first contact window.

The invention further provides an electrophoretic display panel comprising an active device array substrate and an electrophoretic display film. The active device array substrate includes a substrate, a first conductive pattern, a first dielectric layer, a second conductive pattern, a second dielectric layer, and a third conductive pattern. The first conductive pattern is disposed on the substrate. The first dielectric layer is disposed on the substrate to cover the first conductive pattern, and the first dielectric layer has a first contact window to expose a partial region of the first conductive pattern. The second conductive pattern is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer to cover the second conductive pattern, the second dielectric layer has a second contact window and a third contact window, and the second contact window exposes a partial region of the second conductive pattern, The third contact window is located above the first contact window. The third conductive pattern is disposed on the second dielectric layer, the third conductive pattern includes a pure metal layer disposed on the second dielectric layer and a transparent conductive layer disposed on the pure metal layer, wherein the pure metal layer transmits through the second contact The window is electrically connected to the second conductive pattern, and the pure metal layer is electrically connected to the first conductive pattern through the first contact window and the third contact window. The electrophoretic display film is disposed on the second dielectric layer.

In an embodiment of the invention, the electrophoretic display film comprises a conductive layer, an insulating layer and a plurality of electrophoretic display media. The insulating layer is disposed on the conductive layer, wherein the insulating layer has a plurality of microcups arranged in an array, and the insulating layer is located between the conductive layer and the active device array substrate. The electrophoretic display medium is disposed in the microcup of the insulating layer.

In an embodiment of the invention, each of the electrophoretic display media comprises an electrophoretic fluid and a plurality of charged particles, wherein the charged particles are doped in the electrophoresis liquid.

In one embodiment of the invention, the electrophoretic fluid is a black electrophoretic fluid and the charged particles are white charged particles.

In an embodiment of the invention, the second dielectric layer comprises a protective layer and a flat layer. The protective layer is disposed on the first dielectric layer to cover the second conductive pattern. The flat layer is disposed on the protective layer, and the electrophoretic display film is disposed on the flat layer.

In an embodiment of the invention, the second conductive pattern does not cover the first contact window.

In an embodiment of the invention, the pure metal layer comprises a titanium layer or a molybdenum layer.

Based on the above, in the electrophoretic display panel of the present invention, by improving the bridging structure of the first conductor pattern and the second conductor pattern in the active device array substrate, it is possible to reduce the contact with the air or the adhesion layer in the active device array substrate. Oxidation and metal corrosion phenomena, which in turn make the electrophoretic display panel have better corrosion resistance.

The above described features and advantages of the present invention will be more apparent from the following description.

[First Embodiment]

2 is a schematic cross-sectional view of an electrophoretic display panel in accordance with a first embodiment of the present invention. Referring to FIG. 2 , the electrophoretic display panel 200 of the present embodiment includes an active device array substrate 210 and an electrophoretic display film 230 . The active device array substrate 210 includes a substrate 212, a first conductive pattern 214, a first dielectric layer 216, a second conductive pattern 218, and a second dielectric layer 220.

The substrate 212 is, for example, a rigid substrate or a flexible substrate. In one embodiment, the substrate 212 is, for example, a glass substrate, a quartz substrate, or a hard substrate of other materials. In other embodiments, the substrate 212 is, for example, a plastic substrate or a flexible substrate of other materials. In addition, the first conductive pattern 214 is disposed on the substrate 212, and the material of the first conductive pattern 214 is, for example, a metal or an alloy.

The first dielectric layer 216 is disposed on the substrate 212 to cover the first conductive pattern 214, and the first dielectric layer 216 has a contact window 216a to expose a portion of the first conductive pattern 214. The material of the first dielectric layer 216 is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride.

The second conductive pattern 218 is disposed on the first dielectric layer 216 , and the second conductive pattern 218 is electrically connected to the first conductive pattern 214 through the contact window 216 a. The material of the second conductive pattern 218 is, for example, a metal or an alloy.

The second dielectric layer 220 is disposed on the first dielectric layer 216 to cover the second conductive pattern 218 . In this embodiment, the second dielectric layer 220 includes a protective layer PV and a flat layer PL. The protective layer PV is, for example, disposed on the first dielectric layer 216 to cover the second conductive pattern 218. The flat layer PL is disposed, for example, on the protective layer PV. The material of the protective layer PV is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride. The flat layer PL may be a single layer structure or a multilayer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination of the above materials.

Specifically, the active device array substrate 210 further includes a plurality of active elements T and a plurality of pixel electrodes PE. The active device T and the pixel electrode PE are disposed on the substrate 212, and the pixel electrode PE is electrically connected to the active device T. The active element T is, for example, a thin film transistor. In an embodiment, the active device T is mainly composed of a gate G, a gate insulating layer GI covering the gate G, a channel layer CH above the gate GI, a source S and a drain D, wherein the protective layer PV and the flat layer Layer PL covers source S and drain D. The gate electrode G and the source electrode S are electrically connected to a scan line (not shown) and a data line (not shown), and the pixel electrode PE is electrically connected to the drain D through the opening of the protective layer PV and the flat layer PL. Specifically, in this embodiment, the first conductive pattern 214 and the gate G of the active device T are patterned, for example, by the same conductive film layer, and the second conductive pattern 218 and the source of the active device T S and the drain D are patterned, for example, from the same conductive film layer. The pixel electrode PE may be a single layer structure or a multilayer structure, and the material thereof is, for example, a transparent material (such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (indium zinc oxide (IZO)). Al doped ZnO, AZO), Indium-Gallium-Zinc Oxide (IGZO), Ga doped zinc oxide (GZO), zinc-tin oxide (ZTO), oxidation Indium (In ₂ O ₃ ), zinc oxide (ZnO) or tin dioxide (SnO ₂ )), non-transparent materials (such as gold, silver, copper, aluminum, molybdenum, titanium, niobium, other suitable materials, the above materials) An alloy, a nitride of the above material, an oxide of the above material, a nitrogen oxide of the above material or a combination of the above materials, or a combination of the above transparent material and a non-transparent material.

The electrophoretic display film 230 is disposed on the second dielectric layer 220. As shown in FIG. 2, the electrophoretic display film 230 is disposed, for example, on the flat layer PL. The electrophoretic display film 230 includes a conductive layer 232, an insulating layer 234, and a plurality of electrophoretic display media 236. The material of the conductive layer 232 is, for example, a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (Aldoped ZnO, AZO), indium gallium zinc. Indium-Gallium-Zinc Oxide (IGZO), Ga doped zinc oxide (GZO), zinc-tin oxide (ZTO), indium oxide (In ₂ O ₃ ), zinc oxide (ZnO) or tin dioxide (SnO ₂ ) or the like.

The insulating layer 234 has a plurality of microcups 234a arranged in an array via patterning, and the insulating layer 234 is located between the conductive layer 232 and the active device array substrate 210. Each of the microcups 234a may be a polygonal cylinder space, an elliptical cylinder space, or a cylindrical space, which is not particularly limited herein. The material of the insulating layer 234 may be a dielectric material.

The electrophoretic display medium 236 is disposed in the microcup 234a of the insulating layer 234. In one embodiment, each electrophoretic display medium 236 includes an electrophoretic fluid 236a and a plurality of charged particles 236b, wherein the charged particles 236b are doped in the electrophoretic fluid 236a. The electrophoresis liquid 236a is, for example, a black electrophoresis liquid, and the charged particles 236b are, for example, white charged particles. Of course, in other embodiments, the electrophoretic fluid 236a and the charged particles 236b may also have other colors.

In one embodiment, the electrophoretic display panel 200 further includes an adhesive layer 240 disposed between the active device array substrate 210 and the electrophoretic display film 230 to bond the active device array substrate 210 and the electrophoretic display film 230. The material of the adhesive layer 240 is, for example, a polyacrylate.

In detail, in this embodiment, the adhesive layer 240 is adhered between the flat layer PL and the electrophoretic display film 230, for example, and the active device array substrate 210 and the electrophoretic display film 230 are bonded to each other by the adhesive layer 240. In this way, the first conductive pattern 214 is overlapped in order to meet the requirements of a test key, an IC-bonding area, an ESD protection device, or a pixel internal design. When the second conductive pattern 218 is used, the second conductive pattern 218 can be electrically connected to the first conductive pattern 214 through the contact window 216a to form a direct contact structure, so that the outermost metal structure does not need to be used ( The third metal layer 124) as shown in FIG. 1 overlaps the first conductive pattern 214 and the second conductive pattern 218. In addition, the direct overlapping structure of the first conductive pattern 214 and the second conductive pattern 218 of the embodiment is protected by two layers of the upper protective layer PV and the flat layer PL, which can help to significantly enhance the corrosion resistance of the electrophoretic display panel 200. Ability.

[Second embodiment]

3 is a cross-sectional view of an electrophoretic display panel in accordance with a second embodiment of the present invention. It is to be noted that in FIG. 3, the same members as those in FIG. 2 are denoted by the same reference numerals and the description thereof will be omitted. Referring to FIG. 3 , the electrophoretic display panel 300 includes an active device array substrate 310 and an electrophoretic display film 230 . The electrophoretic display panel 300 of the present embodiment is substantially similar to the main constituent members of the electrophoretic display panel 200 in the first embodiment, but the difference between the two is mainly the detailed structure of the active device array substrate 310. The active device array substrate 310 includes a substrate 312 , a first conductive pattern 314 , a first dielectric layer 316 , a second conductive pattern 318 , a second dielectric layer 320 , a third conductive pattern 322 , a protective layer 324 , and a fourth conductive pattern 326 . .

The substrate 312 is, for example, a rigid substrate or a flexible substrate. In one embodiment, the substrate 312 is, for example, a glass substrate, a quartz substrate, or a hard substrate of other materials. In other embodiments, the substrate 212 is, for example, a plastic substrate or a flexible substrate of other materials. In addition, the first conductive pattern 314 is disposed on the substrate 312, and the material of the first conductive pattern 314 is, for example, a metal or an alloy.

The first dielectric layer 316 is disposed on the substrate 312 to cover the first conductive pattern 314, and the first dielectric layer 316 has a first contact window 316a to expose a partial region of the first conductive pattern 314. The material of the first dielectric layer 316 is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride.

The second conductive pattern 318 is disposed on the first dielectric layer 316. In an embodiment, the second conductive pattern 318 does not cover the first contact window 316a. The material of the second conductive pattern 318 is, for example, a metal or an alloy.

The second dielectric layer 320 is disposed on the first dielectric layer 316 to cover the second conductive pattern 318, the second dielectric layer 320 has a second contact window 320a and a third contact window 320b, and the second contact window 320a will be the second A portion of the conductive pattern 318 is exposed while the third contact window 320b is above the first contact window 316a. The material of the second dielectric layer 320 is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride.

The third conductive pattern 322 is disposed on the second dielectric layer 320, wherein the third conductive pattern 322 is electrically connected to the second conductive pattern 318 through the second contact window 320a, and the third conductive pattern 322 is transmitted through the first contact window 316a. The third contact window 320b is electrically connected to the first conductive pattern 314. The material of the third conductive pattern 322 is, for example, a metal or an alloy.

The protective layer 324 is disposed on the second dielectric layer 320 to cover the third conductive pattern 322. The protective layer 324 may be a single layer structure or a multilayer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination of the above materials.

The fourth conductive pattern 326 is disposed on the protective layer 324. The material of the fourth conductive pattern 326 may be a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum doped ZnO (AZO), indium. Indium-Gallium-Zinc Oxide (IGZO), Ga doped zinc oxide (GZO), zinc-tin oxide (ZTO), indium oxide (In ₂ O ₃ ), Zinc oxide (ZnO) or tin dioxide (SnO ₂ ).

The active device array substrate 310 further includes a plurality of active elements T and a plurality of pixel electrodes PE. In this embodiment, the first conductive pattern 314 and the gate G of the active device T are patterned, for example, by the same conductive film layer, and the second conductive pattern 318 and the source S and the drain D of the active device T. For example, the same conductive film layer is patterned, and the fourth conductive pattern 326 and the pixel electrode PE are patterned, for example, by the same conductive film layer.

The electrophoretic display film 230 is disposed on the second dielectric layer 320. As shown in FIG. 3, the electrophoretic display film 230 is disposed, for example, on the fourth conductive pattern 326. In this embodiment, the adhesive layer 240 is adhered between the fourth conductive pattern 326 and the electrophoretic display film 230, for example, and the active device array substrate 310 and the electrophoretic display film 230 are bonded to each other by the adhesive layer 240. It is worth mentioning that the adhesive layer 240 of the embodiment is not in direct contact with the third conductive pattern 322. In other words, the protective layer 324 is interposed between the adhesive layer 240 and the third conductive pattern 322. The first conductive pattern 314 and the second conductive pattern 318 are electrically connected by the third conductive pattern 322 disposed under the protective layer 324. Therefore, the manner in which the third conductive pattern 322 is formed to be internally overlapped may be further utilized by the protective layer 324. The third conductive pattern 322 is protected while reducing the chance of the third conductive pattern 322 being corroded.

[Third embodiment]

4 is a cross-sectional view showing an electrophoretic display panel in accordance with a third embodiment of the present invention. It is to be noted that in FIG. 4, the same members as those in FIG. 2 are denoted by the same reference numerals and the description thereof will be omitted. Referring to FIG. 4 , the electrophoretic display panel 400 includes an active device array substrate 410 and an electrophoretic display film 230 . The electrophoretic display panel 400 of the present embodiment is substantially similar to the main constituent members of the electrophoretic display panel 200 in the first embodiment, but the difference between the two is mainly the detailed structure of the active device array substrate 410. The active device array substrate 410 includes a substrate 412, a first conductive pattern 414, a first dielectric layer 416, a second conductive pattern 418, a second dielectric layer 420, and a third conductive pattern 422.

The substrate 412 is, for example, a rigid substrate or a flexible substrate. In one embodiment, the substrate 212 is, for example, a glass substrate, a quartz substrate, or a hard substrate of other materials. In other embodiments, the substrate 212 is, for example, a plastic substrate or a flexible substrate of other materials. In addition, the first conductive pattern 414 is disposed on the substrate 412, and the material of the first conductive pattern 414 is, for example, a metal or an alloy.

The first dielectric layer 416 is disposed on the substrate 412 to cover the first conductive pattern 414, and the first dielectric layer 416 has a first contact window 416a to expose a portion of the first conductive pattern 414. The material of the first dielectric layer 416 is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride.

The second conductive pattern 418 is disposed on the first dielectric layer 416. In an embodiment, the second conductive pattern 418 does not cover the first contact window 416a. The material of the second conductive pattern 418 is, for example, a metal or an alloy.

The second dielectric layer 420 is disposed on the first dielectric layer 416 to cover the second conductive pattern 418, the second dielectric layer 420 has a second contact window 420a and a third contact window 420b, and the second contact window 420a will be the second A portion of the conductive pattern 418 is exposed while the third contact window 420b is above the first contact window 416a. In this embodiment, the second dielectric layer 420 includes a protective layer PV and a flat layer PL. The protective layer PV is, for example, disposed on the first dielectric layer 416 to cover the second conductive pattern 418. The flat layer PL is disposed, for example, on the protective layer PV. The material of the protective layer PV is, for example, a dielectric material such as tantalum nitride, hafnium oxide or tantalum oxynitride. The flat layer PL may be a single layer structure or a multilayer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination of the above materials.

The third conductive pattern 422 is disposed on the second dielectric layer 420. The third conductive pattern 422 includes a pure metal layer 424 disposed on the second dielectric layer 420 and a transparent conductive layer 426 disposed on the pure metal layer 424. The pure metal layer 424 is electrically connected to the second conductive pattern 418 through the second contact window 420a, and the pure metal layer 424 is electrically connected to the first conductive pattern 414 through the first contact window 416a and the third contact window 420b. The pure metal layer 424 is, for example, a titanium layer or a molybdenum layer, or a layer composed of other oxidation resistant metals. The material of the transparent conductive layer 426 is, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum doped ZnO (AZO), indium gallium zinc oxide (Indium). -Gallium-Zinc Oxide, IGZO), Ga doped zinc oxide (GZO), zinc-tin oxide (ZTO), indium oxide (In ₂ O ₃ ), zinc oxide (ZnO) or Tin dioxide (SnO ₂ ) and the like.

The active device array substrate 410 further includes a plurality of active elements T and a plurality of pixel electrodes PE. In this embodiment, the first conductive pattern 414 and the gate G of the active device T are patterned, for example, by the same conductive film layer, and the second conductive pattern 418 and the source S and the drain D of the active device T. For example, the same conductive film layer is patterned, and the transparent conductive layer 426 and the pixel electrode PE in the third conductive pattern 422 are patterned, for example, by the same conductive film layer.

The electrophoretic display film 230 is disposed on the flat layer PL of the second dielectric layer 420. As shown in FIG. 4, the electrophoretic display film 230 is disposed, for example, on the transparent conductive layer 426 of the third conductive pattern 422. In this embodiment, the adhesive layer 240 is adhered between the third conductive pattern 422 and the electrophoretic display film 230, for example, and the active device array substrate 410 and the electrophoretic display film 230 are bonded to each other by the adhesive layer 240. It is worth mentioning that even if only the transparent conductive layer 426 is disposed between the adhesive layer 240 and the pure metal layer 424, the pure metal layer 424 of the embodiment has oxidation resistance, so that the adhesive layer 240 can be reduced to corrode the pure metal layer 424. The situation happened. In addition, such a third conductive pattern 422 structure including the pure metal layer 424 can be applied to various active device array substrates.

Here, although the third embodiment is described by arranging the pure metal layer 424 on the flat layer PL, the present invention is not limited thereto. According to other embodiments, the third conductive pattern 322 under the protective layer 324 in the second embodiment may be changed to a pure metal material (such as titanium or molybdenum), and the electrophoretic display of the second embodiment is further improved. The corrosion resistance of the panel 300.

In order to prove that the electrophoretic display panel of the above embodiment of the present invention does have excellent corrosion resistance, the corrosion resistance effect of the electrophoretic display panel and the several electrophoretic display panels of the above embodiments will be respectively exemplified. Table 1 below lists the effects of metal corrosion in accordance with the conventional electrophoretic display 100 shown in FIG. 1 and the electrophoretic display panels 200, 300, 400 shown in FIGS. 2 to 4 to determine the effect of corrosion resistance.

It can be seen from the results of Table 1 above that the conventional electrophoretic display 100 shown in FIG. 1 will appear in 40 hours under the condition of continuous operation of high temperature and high humidity screen of RA 40 ° C and relative humidity of 90% (RA 40/90). The phenomenon of metal corrosion; as shown in Fig. 2, the electrophoretic display panel 200 under the condition of continuous operation of high temperature and high humidity screen of RA 40 ° C and relative humidity of 90%, it is difficult to observe the phenomenon of metal corrosion even after 500 hours; The electrophoretic display panel 300 shown in FIG. 3 is difficult to observe metal corrosion even after 500 hours under the condition that the RA 40° C. and the relative humidity of 90% of the high temperature and high humidity screen are continuously operated; Under the condition that the display panel 400 is continuously operated under the high temperature and high humidity screen of RA 40 ° C and relative humidity of 90%, it is difficult to observe the phenomenon of metal corrosion even after 168 hours. In other words, the electrophoretic display panels 200, 300, 400 of the first to third embodiments of the present invention have better corrosion resistance than the conventional electrophoretic display 100.

It is noted that although the distribution area of the microcup 234a is equivalent to the distribution area of the pixel electrode PE in the embodiment shown in FIGS. 2 to 4, the present embodiment does not limit the distribution area of the microcup 234a and the active component. . In other possible embodiments, the distribution area of the microcups 234a may be comparable to the distribution area of the plurality of pixel electrodes PE. Further, in the above description, the electrophoretic display film 230 has the structure shown in FIGS. 2 to 4 as an example, but the electrophoretic display film 230 may have other structures. In other words, the present invention does not limit the electrophoretic display film 230 in the electrophoretic display panels 200, 300, and 400. The electrophoretic display film 230 can be any electrophoretic display film suitable for the electrophoretic display panel, which is generally known to those skilled in the art. The foregoing embodiments are susceptible to variations and applications, and thus are not described herein.

In summary, in the electrophoretic display panel of the present invention, the first conductor pattern and the first conductor pattern are designed by protecting the conductor pattern from the upper protective layer and/or the flat layer or by using an anti-oxidation pure metal layer. The two-conductor pattern is bridged, thereby reducing oxidation and metal corrosion caused by contact with air or an adhesive layer in the active device array substrate. In this way, the active device array substrate can have better component characteristics, thereby improving the display quality or reliability of the electrophoretic display. In addition, in the electrophoretic display panel of the present invention, the first conductor pattern and the second conductor pattern of the active device array substrate can be integrated into the existing process, and can be widely applied to various electrophoretic display panels.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100. . . Electrophoretic display

110. . . Thin film transistor array substrate

112, 212, 312, 412. . . Substrate

114. . . First metal layer

116. . . Dielectric layer

118. . . Second metal layer

120, 324, PV. . . The protective layer

122, PL. . . Flat layer

124. . . Third metal layer

126, 426. . . Transparent conductive layer

130, 230. . . Electrophoretic display film

140, 240. . . Adhesive layer

200, 300, 400. . . Electrophoretic display panel

210, 310, 410. . . Active device array substrate

214, 314, 414. . . First conductive pattern

216, 316, 416. . . First dielectric layer

216a. . . Contact window

218, 318, 418. . . Second conductive pattern

220, 320, 420. . . Second dielectric layer

232. . . Conductive layer

234. . . Insulation

234a. . . Microcup

236. . . Electrophoretic display medium

236a. . . Electrophoresis fluid

236b. . . Charged particle

316a, 416a. . . First contact window

320a, 420a. . . Second contact window

320b, 420b. . . Third contact window

322, 422. . . Third conductive pattern

326. . . Fourth conductive pattern

424. . . Pure metal layer

CH. . . Channel layer

D. . . Bungee

G. . . Gate

GI. . . Brake insulation

PE. . . Pixel electrode

S. . . Source

T. . . Active component

1 is a partial cross-sectional view of a conventional electrophoretic display.

2 is a schematic cross-sectional view of an electrophoretic display panel in accordance with a first embodiment of the present invention.

3 is a cross-sectional view of an electrophoretic display panel in accordance with a second embodiment of the present invention.

4 is a cross-sectional view showing an electrophoretic display panel in accordance with a third embodiment of the present invention.

200. . . Electrophoretic display panel

210. . . Active device array substrate

212. . . Substrate

214. . . First conductive pattern

216. . . First dielectric layer

216a. . . Contact window

218. . . Second conductive pattern

220. . . Second dielectric layer

230. . . Electrophoretic display film

232. . . Conductive layer

234. . . Insulation

234a. . . Microcup

236. . . Electrophoretic display medium

236a. . . Electrophoresis fluid

236b. . . Charged particle

240. . . Adhesive layer

CH. . . Channel layer

D. . . Bungee

G. . . Gate

GI. . . Brake insulation

PE. . . Pixel electrode

PL. . . Flat layer

PV. . . The protective layer

S. . . Source

T. . . Active component

Claims (17)

An electrophoretic display panel includes: an active device array substrate, comprising: a substrate; an active device having a gate, a gate insulating layer, a channel layer, a source, and a drain, wherein the gate insulating layer is located Between the gate and the channel layer; a first conductive pattern disposed on the substrate, wherein the first conductive pattern and the gate are patterned by the same conductive layer film; a first dielectric layer And being disposed on the substrate to cover the first conductive pattern, the first dielectric layer having a contact window to expose a portion of the first conductive pattern, wherein the first dielectric layer and the gate insulating layer are a second conductive pattern disposed on the first dielectric layer, the second conductive pattern is electrically connected to the first conductive pattern through the contact window; and a second dielectric layer is disposed The second conductive pattern is completely covered on the first dielectric layer and the active device; and an electrophoretic display film is disposed on the second dielectric layer. The electrophoretic display panel of claim 1, wherein the electrophoretic display film comprises: a conductive layer; an insulating layer disposed on the conductive layer, wherein the insulating layer has a plurality of microcups arranged in an array, And the insulating layer is located between the conductive layer and the active device array substrate; A plurality of electrophoretic display media are disposed in the microcups of the insulating layer. The electrophoretic display panel of claim 2, wherein each of the electrophoretic display media comprises: an electrophoretic fluid; and a plurality of charged particles doped in the electrophoretic fluid. The electrophoretic display panel of claim 3, wherein the electrophoretic fluid is a black electrophoretic fluid, and the charged particles are white charged particles. The electrophoretic display panel of claim 1, wherein the second dielectric layer comprises: a protective layer disposed on the first dielectric layer to cover the second conductive pattern; and a flat layer, configured On the protective layer, the electrophoretic display film is disposed on the flat layer. An electrophoretic display panel includes: an active device array substrate, comprising: a substrate; an active device having a gate, a gate insulating layer, a channel layer, a source, and a drain, wherein the gate insulating layer is located Between the gate and the channel layer; a first conductive pattern disposed on the substrate, wherein the first conductive pattern and the gate are patterned by the same conductive layer film; a first dielectric layer And being disposed on the substrate to cover the first conductive pattern, the first dielectric layer having a first contact window to expose a partial region of the first conductive pattern; a second conductive layer disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer to cover the second conductive pattern, the second dielectric layer having a second a contact window and a third contact window, the second contact window exposing a partial area of the second conductive pattern, wherein the third contact window is located above the first contact window; and a third conductive pattern disposed on the second On the dielectric layer, the third conductive pattern is electrically connected to the second conductive pattern through the second contact window, and the third conductive pattern is transmitted through the first contact window and the third contact window. a conductive pattern is electrically connected; a protective layer is disposed on the second dielectric layer and the active device to completely cover the third conductive pattern; and a fourth conductive pattern is disposed on the protective layer; An electrophoretic display film is disposed on the second dielectric layer. The electrophoretic display panel of claim 6, wherein the electrophoretic display film comprises: a conductive layer; an insulating layer disposed on the conductive layer, wherein the insulating layer has a plurality of microcups arranged in an array, The insulating layer is located between the conductive layer and the active device array substrate; and a plurality of electrophoretic display media are disposed in the microcups of the insulating layer. The electrophoretic display panel of claim 7, wherein each of the electrophoretic display media comprises: an electrophoretic fluid; and a plurality of charged particles doped in the electrophoretic fluid. The electrophoretic display panel of claim 8, wherein the electrophoretic fluid is a black electrophoretic fluid, and the charged particles are white charged particles. The electrophoretic display panel of claim 6, wherein the second conductive pattern does not cover the first contact window. An electrophoretic display panel includes: an active device array substrate, comprising: a substrate; an active device having a gate, a gate insulating layer, a channel layer, a source, and a drain, wherein the gate insulating layer is located Between the gate and the channel layer; a first conductive pattern disposed on the substrate, wherein the first conductive pattern and the gate are patterned by the same conductive layer film; a first dielectric layer And disposed on the substrate to cover the first conductive pattern, the first dielectric layer has a first contact window to expose a portion of the first conductive pattern; and a second conductive pattern disposed on the first conductive layer a second dielectric layer disposed on the first dielectric layer to cover the second conductive pattern, the second dielectric layer having a second contact window and a third contact window, the second The contact window exposes a portion of the second conductive pattern, and the third contact window is located above the first contact window; and a third conductive pattern is disposed on the second dielectric layer, the third conductive pattern includes Disposed on the second dielectric layer And a metal layer disposed on the transparent conductive layer of the pure metal layer, wherein the The pure metal layer is electrically connected to the second conductive pattern through the second contact window, and the pure metal layer is electrically connected to the first conductive pattern through the first contact window and the third contact window; And an electrophoretic display film disposed on the second dielectric layer. The electrophoretic display panel of claim 11, wherein the electrophoretic display film comprises: a conductive layer; an insulating layer disposed on the conductive layer, wherein the insulating layer has a plurality of microcups arranged in an array, The insulating layer is located between the conductive layer and the active device array substrate; and a plurality of electrophoretic display media are disposed in the microcups of the insulating layer. The electrophoretic display panel of claim 12, wherein each of the electrophoretic display media comprises: an electrophoretic fluid; and a plurality of charged particles doped in the electrophoretic fluid. The electrophoretic display panel of claim 13, wherein the electrophoretic fluid is a black electrophoretic fluid, and the charged particles are white charged particles. The electrophoretic display panel of claim 11, wherein the second dielectric layer comprises: a protective layer disposed on the first dielectric layer to cover the second conductive pattern; and a flat layer, configured On the protective layer, the electrophoretic display film is disposed on the flat layer. An electrophoretic display panel according to claim 11, wherein The second conductive pattern does not cover the first contact window. The electrophoretic display panel of claim 11, wherein the pure metal layer comprises a titanium layer or a molybdenum layer.