TWI442505B - A pallet type substrate transport system, a film forming method, and a manufacturing method of an electronic device - Google Patents

Description

Pallet type substrate transport system, film forming method and electronic device manufacturing method

The present invention relates to a tray-type substrate transport system that transports a substrate using a tray, and more particularly to a system in which a substrate processing apparatus that performs processing such as film formation under reduced pressure is used for transporting a substrate. Moreover, the present invention relates to a film forming method using such a substrate processing apparatus or a method of manufacturing an electronic device.

Moreover, the electronic device refers to all devices using electronic technology, such as various display elements such as a liquid crystal display or a plasma display, and solar cells.

In the manufacture of various electronic devices, it is necessary to apply a surface treatment such as heat treatment or film formation treatment to a workpiece (hereinafter referred to as a substrate).

For example, in a liquid crystal display, a process of forming a transparent electrode on a substrate surface (not a surface of an end surface) made of glass is used. The substrate processing apparatus used in such a process is provided with a chamber for processing a substrate in a predetermined environment, and the exhaust gas is evacuated to be decompressed, or a predetermined gas can be introduced into the chamber. Further, it is necessary to continuously perform different treatments or to gradually reduce the pressure by atmospheric pressure to form a configuration having a plurality of cavities.

Fig. 4 is a schematic diagram showing an example of a conventional substrate processing technique which is a conventional example of an in-line type substrate processing apparatus for vertically transporting a vertical substrate.

In the vertical transfer line inner type, a vacuum insulation chamber 408 and a plurality of process chambers 409 are vertically disposed in a straight line, and a vacuum isolation chamber 408 and a plurality of process chambers 409 are formed, and a transfer mechanism for transporting the substrate 402 is provided. Further, a gate valve 404 is provided between the chambers.

The substrate 402 is sequentially transported to each chamber by a transport mechanism in a state of being loaded on a tray (also referred to as a first tray) 406, and for example, a film formation process or the like is performed. A cavity in each cavity is a vacuum isolation chamber 408 that is opened to the atmosphere while being carried in and out of the substrate 402.

In the in-line type substrate processing apparatus that performs the vertical conveyance, the substrate held by the tray is vibrated during transportation, and thus has a large deformation, and there is a problem that the substrate is damaged or fallen off. In particular, when the glass substrate of the G6 generation (1500 mm × 1800 mm) or larger is processed, the weight of the substrate body becomes heavier, and the thickness of the substrate is reduced as the thickness of the display panel is reduced year by year. The degree of deformation is also large, and the problem of damage or falling off of the substrate occurs remarkably.

In the above-mentioned problem, the transport tray for the in-line type substrate processing apparatus that performs the vertical transport is disclosed in Patent Document 1 for transporting a mechanism that supports the substrate on the substrate processing surface by using support pins of a soft fibrous material. The composition of the tray.

Furthermore, in the lower part of the transport tray, a mechanism for absorbing the impact when transporting the substrate is provided, and the structure for suppressing damage to the large substrate is suppressed.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-204824

Patent Document 2: Japanese Laid-Open Patent Publication No. 2007-262539

As described above, the tray of the conventional in-line type substrate processing apparatus is a square-shaped tray on which a glass substrate is embedded, and is a mechanism in which only the substrate is embedded and held. Therefore, the substrate embedding space of the tray is an outer dimension of the substrate, and it is only sufficient in consideration of the extent that it is not necessary to perform the pressing. Therefore, the mechanism (robot or the like) for transferring the substrate to the tray is a substrate transfer operation requiring extremely high precision.

Further, as the size of the substrate is increased in the G6 generation (1800 mm × 1500 mm × 0.07 mm) substrate, the weight is about 5 kg, and the mechanism for transferring the substrate to the tray of the substrate processing apparatus is required. Extremely high precision, and it is required to be large and high in weight, which makes it extremely expensive.

Further, in the in-line type substrate processing apparatus, the substrate is embedded and transported to the tray, but the transport speed is also increased in order to shorten the substrate processing time. Further, the weight of the substrate is heavy, and the inertia is also large, suggesting that the displacement from the tray and the possibility of breakage or detachment of the substrate during transportation are required, and this correspondence is required.

The present invention has been made in view of the above-described problems, and an object of the present invention is to prevent a substrate from being stably held in a tray even when the accuracy of the substrate transfer mechanism of the tray is low when the substrate is transferred, and to suppress occurrence of the substrate from the transport substrate. The substrate of the tray is displaced, broken, or peeled off.

A first aspect of the present invention is a tray type substrate transport system, which is a tray type substrate transport system that transports a substrate using a tray, and includes: a first tray on which the substrate can be loaded; and the first tray loading a pressure-feeding mechanism that applies pressure to an end surface of the substrate to hold the substrate on the first tray, and a second tray on which the first tray is detached; and is horizontally disposed on the first substrate In the state of the substrate of the tray, the transport mechanism of the second tray of the first tray is transported in an upright state.

A second aspect of the present invention is a film forming method, comprising: a step of loading a substrate on a first tray; and applying pressure to an end surface of the substrate loaded on the first tray to the first tray a step of holding the substrate; and a step of mounting the first tray holding the substrate on the second tray; and transporting the first tray in an upright state from a state in which the substrate held by the first tray is horizontally disposed a step of moving the second tray of the tray into the chamber; and transporting the second tray in the chamber, and applying the predetermined treatment to the substrate held by the first tray integrated with the second tray step.

A third aspect of the present invention is a tray for holding a substrate and transporting the tray, comprising: a first tray on which the substrate can be loaded; and a first tray provided on the substrate a pressure applying mechanism having a surface in contact with an end surface of the substrate in the first tray, wherein the surface is configured to apply pressure to an end surface of the substrate, and the surface is variably formed inside the first tray And an outer pressure feeding mechanism; and a second tray detachably forming the first tray.

According to the present invention, even when the accuracy of the substrate transfer mechanism of the tray at the time of transferring the substrate is low, the substrate can be stably held for the tray, and the occurrence of displacement or breakage of the substrate from the tray when the substrate is transferred can be suppressed. Fall off.

Hereinafter, embodiments of the present invention will be described based on the drawings.

In the drawings, elements that are substantially the same as those described in FIG. 4 are denoted by the same reference numerals.

Fig. 1 is a schematic view showing a substrate transfer system and a substrate processing apparatus according to the present embodiment, and shows that the apparatus shown in Fig. 1 is an in-line type apparatus for vertical transport. The substrate processing apparatus shown in FIG. 1 includes a plurality of crystal cassette units 101 on which a plurality of substrates 102 are mounted, and a substrate transfer robot unit 103. The substrate transfer robot unit 103 functions to transfer the substrate 102 to the substrate processing apparatus by the cassette unit 101 , and to collect the processed substrate 102 into the cassette unit 101 .

In the present embodiment, the tray on which the substrate can be mounted [indicator 110 in Fig. 3(a)] has the first tray 106 provided with a holding mechanism for holding the substrate, and the configuration is separable from the first tray 106. And a second tray 107 for holding the first tray 106.

The substrate processing apparatus of the present embodiment has a stage 105 that cooperates with the substrate transfer robot unit 103 to transfer the substrate 102 to the first tray 106. The stage 105 is such that the mounting surface of the first tray 106 on which the platform 105 is placed is horizontal (vertical direction to the direction of gravity), and the first tray 106 is placed horizontally when the substrate 102 is placed on the first tray 106. On the platform 105. Therefore, the substrate 102 transported by the substrate transfer robot unit 103 by the cassette unit 61 is horizontally transferred to the first tray 106 by the substrate transfer robot unit 103 on the stage 105. When the substrate 102 is transferred onto the first tray 106, the substrate 102 is held by the first tray 106 by applying pressure to the substrate 102 by a pressure applying mechanism described below. At this time, for example, using the stitch-shaped mechanism extended by the stage 105, the substrate 102 of the substrate transfer robot unit 103 may be transferred to the first tray 106 once placed on the upper surface.

As described above, when the substrate 102 is loaded on the tray 110, the first tray 106 can be separated from the second tray 107, and the substrate arrangement area in which the substrate 102 is disposed in the first tray 106 (symbol in FIG. 3) 111) The first tray 106 can be placed on the platform 105 in a horizontal manner. Therefore, the substrate 102 can be transported to the substrate arrangement area 111 held horizontally. Therefore, even when the substrate 102 is bent in the thickness direction thereof, the substrate 102 can be easily disposed in the substrate arrangement area 111.

Then, the first tray 106 provided on the stage 105 and loaded with the substrate 102 is attached to the vertically loaded state with a slightly inclined state by a tray setting robot (not shown) in a state where the first tray 106 is vertically placed. The second tray 107 is integrated. Thereafter, the first tray 106 mounted on the second tray 107 is a transporting rail 302 (shown in FIG. 3(a)) provided in the lower portion of the second tray 107, and a transport roller 303 provided in the substrate processing apparatus. (Illustrated in Fig. 3(b)), it is transported to the vacuum isolation chamber 108 and the process chamber 109. Further, a gate valve 104 is provided between the vacuum isolation chamber 108 and the process chamber 109, and between the process chamber 109.

In the processing chamber 109, when the tray 110 provided with the substrate 102 is placed in the processing chamber 109, the substrate 102 is subjected to a predetermined process. For example, a predetermined gas is introduced into the pressure reducing process chamber 109 to form a film on the substrate 102 at a predetermined position.

At this time, in the case where the second tray 107 is formed during the film formation process, the particles are not removed from the inside of the substrate processing apparatus in which the vacuum is maintained, and the outside of the atmospheric pressure is not formed in order to prevent the particles from being peeled off due to deposition. relationship.

As shown in Fig. 3(a), the second tray 107 is formed to hold the holding portion 304 for holding the first tray 106, and the first tray 106 is detachably formed on the tray setting surface 305 provided with the first tray 106. . Further, as described above, the second tray 107 is provided with a transport rail 302 that engages with the transport roller 303 to move the second tray 107 (that is, the tray 110). In the present embodiment, the transport rail 302 and the transport roller 303 function as a transport mechanism for transporting the tray 110. Further, in the present embodiment, as shown in FIG. 3(b), when the transport rail 302 is engaged with the transport roller 303, the tray installation surface 305 is directed upward in the gravity direction, and the tray installation surface 305 is located. The state parallel to the gravity direction is a state in which the opposite direction to the tray installation surface 305 of the second tray 107 is inclined only by a predetermined angle, and the conveyance rail 302 and the conveyance roller 303 are comprised. Therefore, when the substrate 102 is transported by the tray 110, the transport mechanism is configured to transport the first tray 106 in an inclined posture, the substrate 102 disposed on the first tray 106, and the second tray 107.

In the present embodiment, the tray setting surface 305 is disposed obliquely. When the first tray 106 is disposed on the second tray 107, only the first tray 106 is placed vertically on the second tray 107 by the holding portion 304. The first tray 106 can be placed on the second tray 107. That is, it is easier and more stable to transport the substrate 102 in an inclined posture.

Further, in the present embodiment, the configuration in which the transport tray 110 (that is, the substrate 102) is carried in an inclined posture will be described, but the tray 110 may be vertically erected. That is, if the tray setting surface 305 (that is, the substrate 102 provided on the first tray 106) is horizontally disposed, the erected state can be established [including the in-plane direction of the tray setting surface 305 is perpendicular to the horizontal direction In the case where the in-plane direction of the tray setting surface 305 is inclined in the vertical direction (vertical tray), any configuration can be applied as the second tray 107.

Further, in the present embodiment, the tray setting surface 305 is provided with the second tray 107 in an inclined manner, and the first tray 106 is placed vertically by the second tray 107, and the first tray 106 is placed on the second tray 107. However, it is not limited to this method. For example, a plurality of convex portions (concave portions) are provided in the first tray 106, and concave portions (protrusions) engageable with the convex portions (concave portions) are provided in the second tray 107, and the convex portions and the concave portions are fitted by the fitting. The first tray 106 may be provided in the second tray 107. Alternatively, the first tray 106 may be fixed to the second tray 107 by using screws and nuts, and in the state where the tray setting surface 305 is erected in a horizontally disposed state, if the tray setting surface 305 is provided on the tray setting surface 305 The first tray 106 can be provided, and any configuration of the first tray 106 for the second tray 107 can be used.

Hereinafter, the tray type substrate transfer system of the present embodiment will be described in more detail with reference to Fig. 2 and Fig. 3(a) and Fig. 3(b). Fig. 2 is a schematic view of the first tray 106 of the embodiment. Further, Fig. 3(a) is a schematic side view showing an embodiment before the first tray 106 and the second tray 107 of the embodiment are mounted, and Fig. 3(b) is a view showing the case of transporting the substrate (installation) A schematic view of the first tray 106 and the second tray 107.

The first tray 106 of the present embodiment is used for transporting and processing the substrate 102 while holding the substrate 102 in a vertical direction, for example, in a large substrate of a size of 1800 mm × 1500 mm or more in the G6 generation. By. In the present embodiment, the substrate 102 is used as a glass substrate for large-scale display, and is used as a film formation process by sputtering.

First, the substrate 102 is transferred to the first tray 106 horizontally placed on the stage 105 by the substrate transfer robot unit 103. As shown in Fig. 3(b), the substrate 102 is formed to be slightly inclined to the non-treated surface 306 (hereinafter, referred to as the side of the substrate 102 where no treatment is applied, or if the film is formed by sputtering) The treatment refers to the posture on the side of the back side of the substrate 102 that is not formed. At this time, a pressure applying mechanism that applies pressure to the substrate 102 is provided in such a manner that the substrate 102 is stabilized and held in the first tray 106. In the present embodiment, a positioning frame 202 is provided as the pressure applying mechanism. Specifically, the substrate holding pins 201 as a plurality of convex members are provided on the first tray 106, and the substrate 102 is supported on the non-processing surface 306 by the substrate holding pins 201. The substrate holding stitch 201 is made of, for example, a resin. Further, the end surface of the substrate 102 is pressed by the positioning frame 202 provided on at least one of the lower portion or the side portion of the first tray 106 to position the substrate 102.

Fig. 5 is a schematic view showing a positioning frame 202 as an example of the pressure applying mechanism of the embodiment.

In FIG. 5, the positioning frame 202 is disposed outside the substrate arrangement area 111 on the first tray 106, and has a support plate 202a, for example, an elastic body 202b having a spring or the like, a resin 202c as a pressing portion, and Handle 202d. The support plate 202a is fixed to the first tray 106, and one end of the elastic body 202b is connected to the support plate 202a. The other end of the elastic body 202b is connected to the resin 202c, and the resin 202c is slidably formed on the first tray 106 without being fixed to the first tray 106. Therefore, when the elastic body 202b is deformed, the resin 202c and the end surface 202c of the resin 202c are movable in the arrow direction P by the restoring force of the elastic body 202b. Further, the resin 202c is provided with a handle 202d, and the user uses the handle 202d to position the resin 202c and the end surface 202e in the arrow direction P. In this manner, the positioning frame 202 as the pressure applying mechanism is configured to have the resin 202c and the end surface movably formed on the outer side (the arrow direction Q in FIG. 5) and the inner side (the arrow direction R in the fifth figure) of the first tray 106. 202e, and the resin 202c (that is, the end surface 202e) constitutes an end surface 102a on which the substrate 102 can be pressed.

In the present embodiment, when the substrate 102 is placed on the substrate arrangement area 111, the support plate 202a is provided so that the elastic body 202b is in a reduced state. Therefore, when the substrate 102 is placed in the substrate arrangement area 111, the reduced elastic body 202b acts to restore the original restoring force, and the resin 202c (end surface 202e) pushes the end surface of the substrate 102 toward the arrow direction R of the fifth drawing. 102a. As shown in Fig. 2, the pair of positioning frames 202 are disposed to sandwich the substrate arrangement area by the pair, whereby the substrate 102 is subjected to pressure from both sides of the opposite end surface 102c. Therefore, the positioning frame 202 is to hold the substrate 102 by the pressure applied to the end surface 102a.

In such a configuration, when the substrate 102 is placed on the first tray 106, the user applies a force toward the arrow direction Q to the handle 202d of each of the positioning frames 202, and the resin 202c moves in the arrow direction Q. A space K is formed between the substrate arrangement area 111 and the resin 202. This space K is destroyed by the movement of the restoring force which is restored to the original by the reduced elastic body 202b toward the arrow direction R of the resin 202c. In other words, when the end surface 202e of the resin 202c coincides with the end portion 111a of the substrate arrangement area 111 (that is, when the substrate 102 is held by the resin 202c as shown in Fig. 5), the space K is not provided. As shown in FIG. 6, for example, when the substrate 102 is placed on the first tray 106, by moving the resin 202c in the arrow direction Q, only the space K can be set to be limited to the substrate arrangement area 111.

In the present embodiment, when the end surface 202e of the resin 202c is located at the end portion 111a of the substrate arrangement area 111, the end surface 102a of the substrate 102 is also located at the end portion 111a, so that the substrate 102 is correctly positioned on the substrate arrangement area 111. . Therefore, for example, when the substrate 102 is placed on the first tray 106 in the state shown in FIG. 6, the end surface 102a is located in the space K, and the substrate 102 is mounted on the substrate holding stitch 201, for example, by the reduced elasticity. The restoring force of the body 202b moves the resin 202c in the arrow direction R, whereby the end surface 202e of the resin 202c and the end surface 102a existing in the space K are moved toward the arrow direction R side toward the end surface 102a (that is, the substrate 102). . Further, as shown in Fig. 5, when the end surface 202e and the end surface 102a coincide with the end portion 111a of the substrate arrangement area 111, the resin 202c is stationary, and the substrate 102 is correctly placed on the substrate arrangement area 111.

As described above, in the present embodiment, even if the substrate 102 is not accurately mounted on the substrate arrangement area 111, the restoring force of the reduced elastic body 202b is utilized in the process of returning the resin 202c to the original position. The movement of the resin 202c automatically positions the substrate 102 in the correct position. That is, the resin 202c (end surface 202e) contacting the end surface 102a of the substrate 102 can realize the correct positioning of the substrate 102 by a series of actions generated by applying pressure to the end surface 102a, and the substrate 102 holding the correct position. .

Therefore, even if the substrate 102 is loaded on the first tray 106 with a high precision, the positioning frame 202 moves the substrate 102 to the field of the substrate 102 (that is, the substrate configuration field 111), and at the position of the substrate The substrate 102 can be held by applying pressure to 102. Therefore, even when the substrate transfer robot unit 103 does not have high substrate placement accuracy with respect to the first tray 106, the substrate 102 can be accurately placed, and the substrate 102 can be held at the correct position.

Further, in the present embodiment, the configuration in which the substrate is placed on the tray is not conventionally used, and the pressure is applied to the end surface 102a of the substrate 102 by the positioning frame 202 as the pressure applying mechanism to form the holding substrate 102. Therefore, the first tray 106 is thus constantly stable to hold the substrate 102. Therefore, for example, the transport speed of the tray 110 is increased, or the weight of the substrate 102 is increased, and even if the inertia applied to the substrate 102 is increased, the displacement or falling of the substrate 102 can be reduced. Moreover, the interface between the end surface 202e of the resin 202c and the end surface of the end surface 102a of the substrate 102 can be flexibly displaced in the arrow direction P by the presence of the elastic body 202b. Therefore, even if the vibration of the tray 110 during transportation becomes large, This vibration can also be alleviated by the deformation of the elastic body 202b, and the damage of the substrate can be reduced.

Further, in the case where it is extremely important in the present embodiment, the substrate 102 once disposed on the first tray 106 is correctly positioned on the substrate arrangement area 111 by the pressure applying mechanism, and is positioned in the substrate arrangement area 111. The end face 102a of the substrate 102 is given a predetermined pressure. If such an action is exerted, the pressure applying mechanism is not limited to the above-described positioning frame 202. For example, a configuration in which the resin 202c can be moved to the positioning frame 202 by an electromagnetic driving mechanism (for example, a driving mechanism such as an actuator is provided, and a configuration of the driving mechanism is controlled by a control device) may be employed.

The substrate holding stitch 201 has a function of holding the substrate 102 in a state where the contact area is narrow. Further, for example, when the substrate 102 is heated, it is preferable that the gas in the vacuum is released less. At this time, the substrate holding stitch 201 has a narrow contact area with the substrate 102, and the heat transferred to the first tray 106 is less lost, so that the uniformity of heating of the substrate can be improved.

The heating of the substrate 102 may be from the processing surface side of the substrate 102 or from the non-processing surface 306 side of the substrate 102, and when the substrate 106 is heated from a non-processing surface 306 side by a heating means (not shown), As shown in Fig. 2, it is preferable that the opening portion 210 is formed in the first tray 106.

Further, as the resin for forming the substrate holding stitch 201 that is in contact with the substrate 102, for example, polyether ether ketone (PEEK) resin, heat resistance of a polyimide (polyimide: PI) resin, or the like can be used. High resin.

Further, the shape of the substrate holding stitch 201 is, for example, a cylindrical shape having a height of 1 cm and a diameter of 2 cm, but is not limited thereto. The number of the four substrates to be placed on the first tray 106 is usually four or more, and the number of the substrates 102 to be processed is determined by the number of substrates to be processed, and the like.

In the present embodiment, as described above, in the second drawing, the positioning frame 202 is given a pressure which does not cause deformation to the end surface 102a of the substrate 102 while being positioned, and the substrate 102 is moved to the first tray 106. The required accuracy of the substrate transfer robot unit 103 at the time of loading is alleviated, and the substrate 102 due to the vibration at the time of transport can be restored to a predetermined initial position.

Further, the positioning frame 202 uses the resin 202c at the portion in contact with the end surface 102a of the substrate 102, and also applies pressure to the substrate 102 in conjunction with the elastic body 202b, and is not completely fixed. Therefore, it is possible to suppress the conveyance. The damage of the substrate 102 due to vibration or the like.

In addition, the first tray 106 may include a substrate displacement preventing plate 203 that suppresses displacement of the substrate 102 in the processing plane direction due to vibration during transportation. By the substrate displacement preventing plate 203, the substrate 102 being conveyed is displaced in the direction of the processing surface, and the substrate 102 is prevented from being damaged or peeled off.

Further, the substrate displacement preventing plate 203 can simultaneously reduce the friction with the first tray 106 caused by the displacement of the substrate 102, and can suppress the occurrence of particles that affect the quality after film formation.

The substrate displacement preventing plate 203 is formed of a resin, and a plurality of first trays 106 are provided, and the substrate 102 and the substrate displacement preventing plate 203 are provided with a slight gap and are disposed in a non-contact state. Therefore, when displacement due to vibration at the time of conveyance occurs, the substrate 102 is brought into surface contact to suppress displacement.

Further, the substrate displacement preventing plate 203 is provided with a structure (not shown) that opens and closes toward the processing surface of the substrate 102 for mounting and attaching and detaching the substrate 102.

In addition, the first tray 106 may include a substrate displacement preventing lever 204 that suppresses vibration of the substrate 102 in the non-processed surface direction due to vibration during transportation.

The substrate displacement preventing lever 204 has a plurality of branches that are bent in the first tray 106, and a plurality of resin substrate supporting portions 205 are provided in a portion in contact with the substrate 102. By the substrate displacement preventing lever 204 and the substrate holding portion 205, it is possible to suppress the bending of the substrate 102 in the direction of the non-processed surface in the central portion of the substrate which is generated by the large-sized processing substrate, and it is possible to suppress the falling and breakage of the substrate 102.

As described above, in the present embodiment, the pressing portion is movable toward the inside and the outside of the first tray 106, and the positioning frame 202 formed by pressing the end surface 102a of the substrate 102 is capable of properly positioning the substrate 102. And maintain the function of the substrate. Therefore, even if the substrate transfer robot unit 103 does not correctly arrange the substrate 102 in the field in which the first tray 106 is to be provided (substrate arrangement area 111), the substrate 102 can be placed on the substrate arrangement area 111 by the positioning frame 202.

In addition, when the substrate is placed in the tray in a state where the tray is horizontally placed, when the substrate is to be placed on the tray, the substrate transport robot 103 needs to be placed on the tray in a state of being vertically held. Therefore, even if the positioning frame 202 is used in the present description, it is difficult to properly arrange the substrate.

On the other hand, in the present embodiment, the second tray 107 connected to the transport mechanism and the first tray 106 detachably attached to the second tray 107 are used, and the second tray 107 is held in a state of being erected on the substrate. The mode is made in association with the transport mechanism. Therefore, the first tray 106 can be separated from the second tray 107 engaged with the transport mechanism when the substrate is placed. Therefore, when the substrate 102 is placed, the first tray 106 can be horizontally disposed, and the substrate transfer robot portion 103 can simply arrange the substrate 102 for the first tray 106. Moreover, the second tray 107 detachably attached to the first tray 106 is associated with the transport mechanism in advance in a state in which the first tray 106 is held horizontally, and thus the first tray 106 is attached only to the second tray. The substrate 102 can be transported in an inclined posture or a vertical posture. In other words, even when the substrate is placed on the first tray 106, the second tray 107 that is different from the first tray 106 is connected to the transport mechanism so that the state in which the tray arrangement surface 305 is horizontally placed is maintained in an upright state. Therefore, whenever the substrate is placed on the tray, the tray is not required to be attached to the transport mechanism at a desired angle.

As described above, in the present embodiment, the tray is separated into a first function for horizontally providing the substrate, and a second function for holding the substrate upright, and the first function can be realized by using the first tray 106 for the first function. The second function is created for the second function by using the second tray 107.

(Example)

In the substrate of 730 mm × 920 mm, the substrate processing apparatus according to the embodiment of the present invention described in FIG. 1 , FIG. 2 , FIG. 3 , FIG. 5 , and FIG. 6 is used as a film forming method. As an example, an ITO transparent conductive film for producing a display element was produced within the following conditions.

Further, the film formation treatment is performed by sputtering using a magnetron-type cathode, and excellent characteristics can be obtained as an electronic device within any range of conditions.

‧ Pressure: 0.3 to 0.7 [Pa]

‧Electricity: 36[kW]

‧ substrate temperature: room temperature ~ 120 [°C]

Moreover, as an example of the manufacturing method of the electronic device, the manufacturing method of the above-mentioned display element is mentioned, but it can manufacture by the normal method with respect to the part of the above-mentioned film-forming method.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the embodiments, and the technical scope as defined in the claims It can be changed into various forms.

101. . . Crystal box

102. . . Substrate

103. . . Substrate transfer robot

104. . . gate

105. . . platform

106. . . First tray

107. . . Second tray

108. . . Vacuum isolation chamber

109. . . Process chamber

110. . . tray

111. . . Substrate configuration field

201. . . Substrate hold pin

202. . . Positioning frame

202a. . . Support plate

202b. . . Elastomer

202c. . . Resin

202d. . . handle

202e. . . End face

203. . . Substrate displacement preventing plate

204. . . Substrate displacement preventing rod

205. . . Substrate maintenance unit

302. . . Transport rail

303. . . Transport roller

304. . . Holding department

305. . . Tray setting surface

306. . . Non-processing surface

402. . . Substrate

404. . . gate

406. . . tray

408. . . Vacuum isolation chamber

409. . . Process chamber

Fig. 1 is a schematic view showing a substrate transfer system and a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view of a tray according to an embodiment of the present invention.

Fig. 3 is a schematic view of a tray according to an embodiment of the present invention, wherein (a) is a view showing a state in which the first tray and the second tray are separated, and (b) is a view showing the integrated first tray and the second tray. The schema of the state.

Fig. 4 is a view showing a schematic mechanism of an in-line type substrate processing apparatus for vertically transporting a substrate by an example of a typical substrate processing technique.

Fig. 5 is a schematic view showing a pressure applying mechanism according to an embodiment of the present invention.

Figure 6 is a view for explaining a pattern in which a substrate is provided on a first tray according to an embodiment of the present invention.

101. . . Crystal box

102. . . Substrate

103. . . Substrate transfer robot

104. . . gate

105. . . platform

106. . . First tray

107. . . Second tray

108. . . Vacuum isolation chamber

109. . . Process chamber

Claims (5)

A tray type substrate transport system is a tray type substrate transport system that transports a substrate using a tray, and includes: a first tray on which the substrate can be mounted; and a first tray on which the substrate is loaded a pressure feeding mechanism that holds the pressure on the end surface of the substrate and holds the substrate in the first tray; and a second tray on which the first tray is detached; and a state in which the substrate mounted on the first tray is horizontally arranged to be erected In the state, the transport mechanism of the second tray of the first tray is transported. A substrate processing apparatus comprising the tray substrate transfer system according to claim 1 of the patent application. A film forming method comprising: a step of loading a substrate on a first tray; and a step of applying pressure to an end surface of the substrate loaded on the first tray to hold the substrate in the first tray; and a step of holding the first tray of the substrate on the second tray; and transporting the second tray to the chamber in which the first tray is mounted in an upright state from a state in which the substrate held by the first tray is horizontally disposed And a step of performing a predetermined process on the substrate held by the first tray integrated with the second tray in the chamber by the second tray being conveyed. A method of manufacturing an electronic device, comprising: the film forming method according to claim 3 of the patent application. A tray for holding a substrate and transporting the tray, comprising: a first tray on which a substrate can be loaded; and a first tray provided on the first tray, wherein the substrate is mounted on the first tray a pressure applying mechanism for a surface on which the end surface of the substrate contacts; the pressure is applied to the end surface of the substrate by the surface, and the surface is variably formed on the inner side and the outer side of the first tray; and The second tray of the first tray is detachably constructed.