TWI440543B - The inner circumferential processing method of brittle material substrate - Google Patents
The inner circumferential processing method of brittle material substrate Download PDFInfo
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- TWI440543B TWI440543B TW101100584A TW101100584A TWI440543B TW I440543 B TWI440543 B TW I440543B TW 101100584 A TW101100584 A TW 101100584A TW 101100584 A TW101100584 A TW 101100584A TW I440543 B TWI440543 B TW I440543B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/26—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by impact tools, e.g. by chisels or other tools having a cutting edge
- B28D1/28—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by impact tools, e.g. by chisels or other tools having a cutting edge without cutting edge, e.g. chiseling machines
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
本發明係關於對脆性材料基板沿作為內周之內側輪廓線對該基板進行切除之內周加工方法。本發明係用於例如從方形基板加工出資訊記憶裝置用之環狀基板的製程等。此處所謂之基板除玻璃基板外,亦包含陶瓷、單晶矽、半導體晶圓、藍寶石等之材料。The present invention relates to an inner peripheral processing method for cutting a substrate of a brittle material along an inner contour line as an inner circumference. The present invention is applied to, for example, a process of processing a ring-shaped substrate for an information memory device from a square substrate. The substrate referred to herein includes materials such as ceramics, single crystal germanium, semiconductor wafers, and sapphire in addition to the glass substrate.
用於硬碟等之玻璃製環狀基板,係進行從方形玻璃基板切出圓形之加工來形成。A glass-made annular substrate for a hard disk or the like is formed by cutting a circular glass substrate into a circular shape.
在對玻璃基板進行沿著圓等封閉曲線切出之內周加工之情形時,首先,係對基板之單側表面(第1面)沿作為內側輪廓線之圓使用左右刃角相異之刀輪(scribing wheel)加工出於深度方向傾斜之切線(劃線)。其次,從設有切線之面加熱使其變形,藉由此變形使沿著切線形成之裂痕(crack)滲透至相反側之面(第2面)。之後,以按壓構件按壓以內側輪廓線圍繞之部分以進行切成圓形之加工(參照專利文獻1)。又,以此方式形成具有內周圓與外周圓之環狀玻璃基板時,首先,從方形基板沿著作為外周圓之外側輪廓線以上述方法進行切除加工,接著重複相同方法,沿著作為內周圓之內側輪廓線進行切除加工,以形成環狀基板。亦即,係進行二次內周加工。When the glass substrate is subjected to inner circumferential processing which is cut along a closed curve such as a circle, first, the one-side surface (first surface) of the substrate is used as a circle having an inner contour line, and the left and right edge angles are different. The scribing wheel processes a tangent (line) that is inclined in the depth direction. Next, the surface provided with the tangent is heated and deformed, whereby the crack formed along the tangent penetrates to the opposite side (the second surface). After that, the portion surrounded by the inner contour line is pressed by the pressing member to perform a process of cutting into a circular shape (see Patent Document 1). Further, when an annular glass substrate having an inner circumference and an outer circumference is formed in this manner, first, the cutting process is performed by the above method from the square substrate along the outer contour line of the outer circumference, and then the same method is repeated, and the writing is performed. The inner contour of the circumference is cut to form a ring-shaped substrate. That is, the secondary inner circumference processing is performed.
此外,在從基板切出封閉曲線形狀時,作為可對基板劃出較一般劃線輪(scribing wheel、亦稱cutter wheel)更能使裂痕深入之切線(裂痕)的劃線輪,一種在碟狀刀輪之刃口稜線週期性的形成有相對刀輪之軸心方向傾斜之槽的具傾斜槽之劃線輪已實用化(參照專利文獻2)。In addition, when the closed curve shape is cut out from the substrate, the scribing wheel which can cut the tangential line (crack) which can penetrate the crack more than the general scribing wheel (also known as the cutter wheel), A scribing wheel having an inclined groove in which a groove slanting with respect to the axial direction of the cutter wheel is periodically formed has been put into practical use (see Patent Document 2).
圖9係顯示具傾斜槽之劃線輪22之刃口的圖。圖9(a)為前視圖、圖9(b)為側視圖、圖9(c)為A-A線剖面圖。此具傾斜槽之劃線輪22係使槽22a之切除面22b相對軸心22c傾斜,以使切除量在稜線兩側不均等。Fig. 9 is a view showing the cutting edge of the scribing wheel 22 having the inclined groove. Fig. 9(a) is a front view, Fig. 9(b) is a side view, and Fig. 9(c) is a cross-sectional view taken along line A-A. The inclined groove 22 of the inclined groove is such that the cut surface 22b of the groove 22a is inclined with respect to the axis 22c so that the amount of cut is not uniform on both sides of the ridge line.
具體而言,係對1~20mm之刀輪徑,將槽間距設在20μm~200μm之範圍。進一步的,如圖9(c)所示,針對左右之槽深度h1、h2則係將h1設在2μm~2500μm、h2設在1μm~20μm。Specifically, the groove diameter of 1 to 20 mm is set to be in the range of 20 μm to 200 μm. Further, as shown in FIG. 9(c), h1 is set to 2 μm to 2500 μm and h2 is set to 1 μm to 20 μm for the left and right groove depths h1 and h2.
藉由使用此種特殊刃口(稱為高滲透刃口)之劃線輪,可形成滲透至一般無槽劃線輪事實上無法到達之深度之裂痕。By using a scribing wheel of such a special cutting edge (referred to as a high-permeability cutting edge), it is possible to form a crack that penetrates to a depth that is virtually unreachable by a generally grooveless scribing wheel.
又,作為使用上述高滲透刃口之環狀加工品之加工方法,已揭露了一種將較內側輪廓線外側之環狀區域加熱,並使用以噴射冷媒之噴嘴接近較內側輪廓線內側之中心區域上方,從噴嘴對中心區域噴射冷媒以使其冷卻收縮,據以進行分離中心區域之中心切除製程(參照專利文獻3)。Further, as a processing method of the annular processed article using the above-described high-permeability cutting edge, it has been disclosed that an annular region outside the inner contour line is heated, and a nozzle for jetting the refrigerant is brought close to a central portion of the inner side of the inner contour line. On the upper side, the refrigerant is sprayed from the nozzle to the central region to be cooled and contracted, whereby a center cutting process for separating the center region is performed (see Patent Document 3).
再者,亦揭露了一種作為在僅以冷媒噴射之冷卻無法分離中心區域時之輔助手段,為強制分離中心區域而降下噴嘴,使噴嘴前端抵接於中心區域並予按壓,以使其機械性分離的方法。Further, as an auxiliary means for separating the center region by cooling only by the refrigerant, the nozzle is lowered to forcibly separate the center region, and the nozzle tip abuts against the center region and is pressed to make it mechanical. The method of separation.
先行技術文獻Advanced technical literature
[專利文獻1] 日本專利第2785906號公報[Patent Document 1] Japanese Patent No. 2785906
[專利文獻2] 日本專利第2989602號公報[Patent Document 2] Japanese Patent No. 2989602
[專利文獻3] 特開2009-190905號公報[Patent Document 3] JP-A-2009-190905
在切除內側輪廓線(封閉曲線)內側中心區域之內周加工中,不僅要能確實分離中心區域,優異之分離面加工品質是非常重要的。In the inner peripheral processing of the inner central region of the cut inner contour line (closed curve), it is necessary to not only surely separate the center region, but the excellent separation surface processing quality is very important.
專利文獻3中記載之從配置在中心區域上方之冷媒噴射嘴朝向中心區域噴射冷媒,據以進行分離之中心切除方法,截至今日在板厚0.5mm~2mm程度之玻璃基板中心切除加工中廣泛的被使用,特別是在直徑為20mm程度之內圓周之切除加工中,被視為是可信賴的加工方法。According to Patent Document 3, a center cutting method for ejecting a refrigerant from a refrigerant ejection nozzle disposed above a central region toward a central region is widely used as a center cutting process for a glass substrate having a thickness of about 0.5 mm to 2 mm. It is regarded as a reliable processing method when it is used, especially in the cutting process of the inner circumference of the diameter of 20 mm.
然而,在用於硬碟等之環狀玻璃基板之內周加工中,對於欲切除之內周圓之直徑被期望能切除較目前更小之直徑,具體而言,被要求能以例如15mm以下、較佳為9mm程度之直徑進行內周加工。However, in the inner peripheral processing of an annular glass substrate for a hard disk or the like, it is desirable to cut the diameter smaller than the present diameter for the diameter of the inner circumference to be cut, and specifically, it is required to be, for example, 15 mm or less. Preferably, the inner diameter is processed to a diameter of about 9 mm.
一般而言,於內周加工中欲切除之中心區域之面積越大、中心區域本身之重量亦越大,較易分離,因此若是中心區域直徑為20mm程度的話,先前僅以噴嘴之冷媒噴射形成之收縮作用即能確實的加以分離。In general, the larger the area of the center area to be cut in the inner circumference processing, the larger the weight of the center area itself, and the easier separation. Therefore, if the diameter of the center area is about 20 mm, the refrigerant is previously formed only by the nozzle. The contraction effect can be surely separated.
然而,當內周圓之直徑小至15mm程度時,僅使用冷媒噴射之冷卻會產生無法完全分離之情形,因此,過去常見到必須降下噴嘴抵接於中心區域並按壓以進行強制分離的案例。However, when the diameter of the inner circumference is as small as about 15 mm, the cooling using only the refrigerant injection may cause a situation in which separation cannot be completely performed. Therefore, in the past, it has been common to lower the nozzle to abut against the center area and press for forced separation.
此時,若增加噴嘴抵接於基板時之按壓力、或瞬間的將噴嘴抵接於基板的話,雖能確實的分離中心區域,但卻會於分離面(內周面)產生缺口而在加工品質面產生問題。In this case, if the pressing force at the time of the nozzle abutting on the substrate is increased or the nozzle is brought into contact with the substrate in an instant, the center region can be surely separated, but the gap is formed on the separation surface (inner peripheral surface). There is a problem with the quality side.
因此,本發明之目的在提供一種在進行切除內側輪廓線(封閉曲線)內側之內周加工時,能確實的分離中心區域、且分離面不會產生缺口的內周加工方法。Accordingly, an object of the present invention is to provide an inner peripheral machining method capable of reliably separating a center region and preventing a gap from being formed on the separation surface when the inner circumference of the inner contour line (closed curve) is cut.
為解決上述課題而為之本發明之脆性材料基板之內周加工方法,係由下列步驟構成:(a)使用在劃線輪之刃口稜線週期性的形成有相對劃線輪之軸心方向傾斜之槽的劃線輪,於脆性材料基板之第1面上形成作為內周之內側輪廓線之劃線的劃線步驟;(b)以為了與較該內側輪廓線內側之中心區域非接觸而設有孔之板片支承該基板,並對該中心區域賦予壓力的增壓步驟;以及(c)在增壓之狀態下,冷卻該中心區域使其收縮以分離該中心區域之中心切除步驟。In order to solve the above problems, the inner peripheral processing method of the brittle material substrate of the present invention is constituted by the following steps: (a) using the edge line of the edge of the scribing wheel to form a direction perpendicular to the axis of the scribing wheel a scribing wheel of the inclined groove, a scribing step of forming a scribe line as an inner contour line of the inner circumference on the first surface of the brittle material substrate; (b) for non-contact with a central area inside the inner contour line a step of pressurizing the substrate to support the substrate and applying a pressure to the central region; and (c) cooling the central region to contract to separate the central region of the central region in a pressurized state .
此處,上述內周加工方法可適用於前述內側輪廓線之直徑為15mm以下之圓形。Here, the inner circumferential processing method described above can be applied to a circular shape in which the inner contour line has a diameter of 15 mm or less.
根據本發明,於劃線步驟,首先使具傾斜槽之劃線輪滾動以在脆性材料基板單側面之第1面,形成由在深度方向(基板之厚度方向)深深滲透之斜向裂痕構成之劃線(scribe line),據此形成作為內周之內側輪廓線。斜向裂痕係形成為從第1面側越往深度方向越向外擴張。藉由具傾斜槽之劃線輪之使用,所形成之劃線可以是相對基板厚度為例如30%以上、較佳為40%以上、更佳為50%以上(一般為80%以上)深度之深裂痕。According to the present invention, in the scribing step, first, the scribing wheel having the inclined groove is rolled to form the first surface of the single side surface of the brittle material substrate, and the oblique crack is formed by the deep penetration in the depth direction (the thickness direction of the substrate). A scribe line is formed as an inner contour of the inner circumference. The oblique crack is formed so as to expand outward in the depth direction from the first surface side. The scribing formed by using the scribing wheel having the inclined groove may have a relative substrate thickness of, for example, 30% or more, preferably 40% or more, more preferably 50% or more (generally 80% or more). Deep cracks.
接著,於增壓步驟,將形成有內側輪廓線之劃線之基板裝載於設有孔之板片以支承基板。藉由將板片之孔設為與內側輪廓線內側之中心區域非接觸之大小,能透過此孔分離中心區域。Next, in the pressurizing step, the substrate on which the inner contour line is formed is placed on the sheet provided with the hole to support the substrate. By arranging the hole of the plate to be non-contact with the central region inside the inner contour line, the central region can be separated through the hole.
其次,對以板片支承之基板中心區域賦予壓力。雖然增壓係以按壓構件按壓中心區域即可,但此時間點為作成在施加壓力之狀態下中心區域不至於分離,因此按壓力係抑制得較低。亦即,在次一步驟進行對中心區域之冷卻而使其收縮前之階段,係經過一先對中心區域進行增壓而未進行積極之冷卻的狀態。Next, pressure is applied to the central region of the substrate supported by the sheet. Although it is only necessary to press the center region with the pressing member, the pressure point is such that the center region is not separated in the state where the pressure is applied, so that the pressing force is suppressed to be low. That is, in the next step, the stage before the cooling of the central region is performed to contract, the state in which the center region is first pressurized and the positive cooling is not performed is performed.
接著,於中心切除步驟,在增壓狀態下冷卻中心區域使其收縮。其結果,中心區域被充分冷卻而斜向裂痕滲透,在到達背面時,由於中心區域係被按壓的狀態,因此中心區域即一下子被分離。Next, in the center cutting step, the central region is cooled in a pressurized state to contract. As a result, the central region is sufficiently cooled and penetrates obliquely, and when the back surface is reached, since the central region is pressed, the central region is immediately separated.
如前所述,藉由先對中心區域賦予壓力、接著再冷卻中心區域,即能避免在冷卻不充分的狀態下,以強的按壓力或瞬間的按壓力勉強進行分離而導致缺口之產生等不良情形,進行加工品質優異的內周加工。As described above, by first applying pressure to the central region and then cooling the central region, it is possible to avoid the occurrence of a gap by a strong pressing force or an instantaneous pressing force in a state where the cooling is insufficient. In the case of failure, the inner circumference processing with excellent processing quality is performed.
用以解決其他課題之手段及效果Means and effects to solve other problems
於上述發明之(b)之增壓步驟中,可以設於板片之加熱機構加熱內側輪廓線之外側區域。In the pressurizing step of (b) of the above invention, the heating means provided on the sheet may heat the outer side region of the inner contour line.
如此,由於能加大中心區域與外側區域之溫度差,因此斜向裂痕易於滲透,能更為確實的進行分離。In this way, since the temperature difference between the central region and the outer region can be increased, the oblique crack is easily infiltrated, and the separation can be performed more reliably.
於上述發明之(b)之增壓步驟中,對中心區域之增壓可藉由將形成有冷卻媒體之流入路之金屬構件按壓於中心區域以賦予壓力;於(c)之中心切除步驟中,中心區域之冷卻可藉由對金屬構件之冷卻媒體之流入路導入冷卻媒體來進行。In the pressurizing step of (b) of the above invention, the pressurization of the central region may be performed by pressing the metal member forming the inflow path of the cooling medium to the central region to impart pressure; in the center cutting step of (c) The cooling of the central region can be carried out by introducing a cooling medium into the inflow path of the cooling medium of the metal member.
如此,在未將冷卻媒體導入金屬構件之狀態下進行按壓,於按壓後將冷卻媒體導入當該金屬構件之流入路,即能在先增壓之常態下進行冷卻。In this manner, the cooling medium is pressed in a state where the cooling medium is not introduced into the metal member, and after the pressing, the cooling medium is introduced into the inflow path of the metal member, that is, it can be cooled in the normal state of the first pressurization.
以下,參照圖式說明本發明之實施形態。此處,係以對圓板狀玻璃基板G之中心部,切除15mm內圓周之內周加工為例進行說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, the inner peripheral processing of the inner circumference of the disk-shaped glass substrate G and the inner circumference of 15 mm is cut out as an example.
此種內周加工,係適用於製造例如用於硬碟之玻璃製環狀基板之場合。Such inner peripheral processing is suitable for the production of, for example, a glass-made annular substrate for a hard disk.
圖1係顯示適於本發明加工方法之加工系統MS1之全體構成的概略圖。加工系統MS1係由基板搬入部1、劃線裝置2、折斷裝置3、基板搬出部4及搬送機器人5構成。Fig. 1 is a schematic view showing the overall configuration of a processing system MS1 suitable for the processing method of the present invention. The processing system MS1 is composed of a substrate loading unit 1, a scribing device 2, a breaking device 3, a substrate carrying unit 4, and a transfer robot 5.
於基板搬入部1設有用以收納基板G之收納匣,其中搬入了進行內周加工前之多數片基板G。The substrate carrying unit 1 is provided with a housing cassette for housing the substrate G, and a plurality of sheet substrates G before the inner circumference processing is carried in.
劃線裝置2,使用圖9所示之具傾斜槽之劃線輪22於基板G形成作為內側輪廓線之劃線。此處,係將15mm之圓作為內側輪廓線刻於基板G之第1面。關於劃線裝置2之具體構成留待後敘。The scribing device 2 forms a scribe line as an inner contour line on the substrate G using the scribing wheel 22 having the inclined groove shown in FIG. Here, a circle of 15 mm is engraved on the first surface of the substrate G as an inner contour line. The specific configuration of the scribing device 2 will be described later.
折斷裝置3,對形成有內側輪廓線之基板G進行內側輪廓線內側中心區域之切除。關於折斷裝置3之具體構成亦留待後敘。The breaking device 3 cuts off the inner center region of the inner contour line on the substrate G on which the inner contour line is formed. The specific configuration of the breaking device 3 is also left to be described later.
基板搬出部4,與基板搬入部1同樣的設有收納基板G之收納匣,搬出經中心切除加工之基板G。The substrate carrying-out unit 4 is provided with a storage cassette that houses the substrate G similarly to the substrate loading unit 1 and carries out the substrate G that has been subjected to the center cutting process.
搬送機器人5,以前端裝備有真空吸附機構之機械臂一次保持一片加以搬送,以進行基板搬入部1、劃線裝置2、折斷裝置3、基板搬出部4之各部件間之搬送。The transport robot 5 transports the robot arm that is equipped with the vacuum suction mechanism at the tip end at a time, and transports the components between the substrate loading unit 1, the scribing device 2, the breaking device 3, and the substrate carrying unit 4.
其次,說明劃線裝置2。圖顯示劃線裝置之概略構成的圖。Next, the scribing device 2 will be described. The figure shows a schematic configuration of a scribing device.
劃線裝置2具有裝載台11與劃線12。裝載台11具備旋轉台13、旋轉驅動機構14、搭載X載台之Y載台17、及Y載台驅動機構18,旋轉裝載於旋轉台13上之基板G或於XY方向並進移動,以相對劃線頭12移動基板G。The scribing device 2 has a loading table 11 and a scribe line 12. The loading table 11 includes a rotating table 13, a rotation driving mechanism 14, a Y stage 17 on which an X stage is mounted, and a Y stage driving mechanism 18, and the substrate G rotatably mounted on the rotating table 13 is moved in the XY direction to be relatively The scribing head 12 moves the substrate G.
劃線頭12,由具傾斜槽的劃線輪22(高滲透刃口)、具備用以調整具傾斜槽之劃線輪22對裝載在旋轉台13上之基板G之壓接荷重的輪支承機構23、以及調整輪支承機構23及具傾斜槽之劃線輪22之位置的機械臂24構成。The scribing head 12 is provided with a scribing wheel 22 (high-permeability cutting edge) having an inclined groove, and a wheel support for adjusting the crimping load of the scribing wheel 22 having the inclined groove to the substrate G loaded on the rotary table 13 The mechanism 23 and the mechanical arm 24 that adjusts the position of the wheel support mechanism 23 and the scribing wheel 22 having the inclined groove are formed.
具傾斜槽之劃線輪22(參照圖9),如前所述,沿著劃線輪22之刃口稜線,週期性的形成有相對劃線輪之軸心方向傾斜之槽22a。由於在刃口稜線形成有槽,與使用無槽刃口之情形相較能使裂痕於板厚方向之滲透深度更深,此外,藉由使此槽相對軸心傾斜,可使形成之裂痕成為斜向裂痕。The scribing wheel 22 having an inclined groove (see Fig. 9) is periodically formed with a groove 22a inclined with respect to the axial direction of the scribing wheel along the edge ridge line of the scribing wheel 22. Since the groove is formed in the edge ridge line, the penetration depth of the crack in the thickness direction is deeper than in the case of using the grooveless edge, and further, by forming the groove to be inclined with respect to the axis, the crack formed can be inclined. To the crack.
藉由此種具傾斜槽之劃線輪22之使用,若板厚係到2mm程度之玻璃基板的話,能簡單的形成具有板厚之50%程度、或更深之滲透深度的裂痕(劃線)。又,劃線輪22之滾動方向,如後所述,為了使切除內側輪廓線(封閉曲線)時封閉曲線之內側會掉落而能進行中心切除,係使裂痕往深度方向越滲透越向外側擴張之方向傾斜。具體而言,係使劃線輪22往槽22a之深側朝向封閉曲線外側之方向滾動,據以使裂痕隨著往深度方向滲透而向封閉曲線外側擴張之方向傾斜。By using the scribing wheel 22 having the inclined groove, if the thickness of the glass substrate is about 2 mm, cracks (line) having a depth of 50% or more deep can be easily formed. . Further, as shown in the following, in the rolling direction of the scribing wheel 22, in order to make the inner side of the closed curve fall when the inner contour line (closed curve) is cut off, the center cut can be performed, so that the crack penetrates further toward the outer side in the depth direction. The direction of expansion is inclined. Specifically, the scribing wheel 22 is rolled toward the outer side of the closed curve toward the outer side of the closed curve, so that the crack is inclined in the direction in which the outer side of the closed curve is expanded as it penetrates in the depth direction.
輪支承機構23內藏有使用彈簧之按壓荷重調整機構(未圖示),藉調整基板G與具傾斜槽之劃線輪22間之壓接力,而能調整形成於基板G之裂痕之滲透深度。The wheel support mechanism 23 incorporates a pressing load adjusting mechanism (not shown) using a spring, and can adjust the penetration depth of the crack formed on the substrate G by adjusting the pressure contact between the substrate G and the scribing wheel 22 having the inclined groove. .
機械臂24被支承於框架25,可與X載台驅動機構16及Y載台驅動機構18一起動作以調整具傾斜槽之劃線輪22對裝載台11之位置。亦即,以機械臂24調整具傾斜槽之劃線輪22之位置,藉由使旋轉台13旋轉而能於基板G刻劃出具有所欲直徑之圓(內側輪廓線)。又,藉由使裝載台11之X載台15、Y載台17並進,可移動至能在與搬送機器人5(參照圖1)之間進行基板G之收授的位置。The robot arm 24 is supported by the frame 25 and is movable together with the X stage drive mechanism 16 and the Y stage drive mechanism 18 to adjust the position of the scribing wheel 22 having the inclined groove to the loading table 11. That is, the position of the scribing wheel 22 having the inclined groove is adjusted by the mechanical arm 24, and by rotating the rotary table 13, a circle having a desired diameter (inner outline) can be scored on the substrate G. Further, by bringing the X stage 15 and the Y stage 17 of the loading table 11 in parallel, it is possible to move to a position where the substrate G can be received between the transfer robot 5 (see FIG. 1).
其次,說明折斷裝置3。圖3係顯示折斷裝置3之概略構成的圖。Next, the breaking device 3 will be described. FIG. 3 is a view showing a schematic configuration of the breaking device 3.
折斷裝置3係由含環狀板42與中心切除機構43構成。圖4係顯示環狀板之構成的圖,圖4(a)為立體圖、圖4(b)為剖面圖。The breaking device 3 is composed of an annular plate 42 and a center cutting mechanism 43. 4 is a view showing a configuration of an annular plate, and FIG. 4(a) is a perspective view and FIG. 4(b) is a cross-sectional view.
在被內圓周與外圓周圍繞之環狀板42的上面46形成有多數個吸附孔47,可在裝載基板G時加以固定。於環狀板42內部內藏有加熱器48,用以加熱所裝載之基板G中、與上面46接觸之區域。A plurality of suction holes 47 are formed in the upper surface 46 of the annular plate 42 surrounded by the inner circumference and the outer circumference, and can be fixed when the substrate G is loaded. A heater 48 is housed inside the annular plate 42 for heating the area of the mounted substrate G that is in contact with the upper surface 46.
環狀板42之中央,為了使欲從基板G切除之中心區域G0(直徑15mm之圓板)在分離時能掉落,係作成較中心區域G0之最大直徑更大之直徑的孔49,具體而言,形成有作為直徑20mm之內周面的孔49。In the center of the annular plate 42, in order to allow the central region G0 (a circular plate having a diameter of 15 mm) to be cut off from the substrate G to be dropped when separated, a hole 49 having a larger diameter than the largest diameter of the central portion G0 is formed. In other words, a hole 49 as an inner peripheral surface having a diameter of 20 mm was formed.
中心切除機構43,係由透過供應線(未圖示)供應經冷卻之空氣(冷媒)的空氣噴射器51、噴射經冷卻之空氣的噴嘴52、支承空氣噴射器51及噴嘴52的保持具53、以及透過機械臂54使保持具53昇降的昇降機構55構成。噴嘴52之前端部分係以較基板G軟之樹脂(例如鐵氟龍(註冊商標)樹脂)形成,以避免在噴嘴52抵接於基板G時造成基板G之損傷。又,噴嘴52前端之直徑d係形成為較基板G之中心區域G0之直徑D小,如此,能僅將裝載於環狀板42之基板G之中心區域G0以噴嘴52之前端壓向下方。此外,於保持具53內藏有緩衝機構,在噴嘴52抵接於基板G時,不會有一定以上之按壓力施加至基板G。The center cutting mechanism 43 is an air ejector 51 that supplies cooled air (refrigerant) through a supply line (not shown), a nozzle 52 that sprays the cooled air, and a holder 53 that supports the air ejector 51 and the nozzle 52. And an elevating mechanism 55 that moves the holder 53 up and down by the robot arm 54. The front end portion of the nozzle 52 is formed of a resin (for example, Teflon (registered trademark) resin) which is softer than the substrate G to prevent damage of the substrate G when the nozzle 52 abuts against the substrate G. Further, the diameter d of the tip end of the nozzle 52 is formed to be smaller than the diameter D of the center region G0 of the substrate G. Thus, only the center region G0 of the substrate G mounted on the annular plate 42 can be pressed downward with the front end of the nozzle 52. Further, a buffer mechanism is housed in the holder 53, and when the nozzle 52 abuts against the substrate G, a predetermined pressing force is not applied to the substrate G.
接著,以圖式說明使用上述加工系統MS1之劃線裝置2與折斷裝置3之本發明之內周工方法之程序。Next, the procedure of the inner circumference method of the present invention using the scribing device 2 and the breaking device 3 of the above-described processing system MS1 will be described with reference to the drawings.
首先,如圖6所示,對從基板搬入部1搬送至劃線裝置2之旋轉台13上之基板G,以具傾斜槽之劃線輪22於基板G之第1面形成作為內側輪廓線之內周圓C1。此時,係形成能滲透至基板板厚一半程度、並隨著往深度方向前進而往外側擴張之斜向裂痕。First, as shown in FIG. 6, the substrate G conveyed from the substrate loading unit 1 to the rotary table 13 of the scribing device 2 is formed as an inner contour line on the first surface of the substrate G by the scribing wheel 22 having the inclined groove. Within the circumference of C1. At this time, an oblique crack which can penetrate to the thickness of the substrate sheet by half and expand outward in the depth direction is formed.
接著,如圖6所示,將基板G從劃線裝置2搬至折斷裝置3,裝載於環狀板42。此時,係以基板G之中心區域G0位於孔49上之方式對準環狀板42及基板G之中心軸之位置,以搬送機器人5裝載基板G。Next, as shown in FIG. 6, the substrate G is carried from the scribing device 2 to the breaking device 3, and is placed on the annular plate 42. At this time, the position of the central axis of the annular plate 42 and the substrate G is aligned so that the central region G0 of the substrate G is positioned on the hole 49, and the substrate G is loaded by the transport robot 5.
又,環狀板42係將溫度設定為中心區域G0不至於從基板G突然掉落。亦即,過度加熱的話斜向裂痕會滲透至背面而在此階段完全分離,因此溫度之設定須避免此情形之發生。當基板G薄時,可不加熱。Further, the annular plate 42 sets the temperature so that the central region G0 does not suddenly fall from the substrate G. That is, if the overheating occurs, the oblique crack will penetrate to the back surface and be completely separated at this stage, so the temperature setting must avoid this. When the substrate G is thin, it may not be heated.
接著,如圖7所示,在賦予壓力W之狀態下從噴嘴52噴射冷媒J,以冷卻中心區域G0。Next, as shown in FIG. 7, the refrigerant J is ejected from the nozzle 52 in a state where the pressure W is applied to cool the central region G0.
其結果,中心區域G0即因冷卻作用而收縮,斜向裂痕滲透。不久後,在斜向裂痕到達背面時中心區域G0即分離。如此,不會有在冷卻不足的狀態下以衝擊性的按壓力強行進行分離之情形,因此能進行不會在內周面產生缺口之分離。As a result, the center region G0 shrinks due to the cooling action, and the oblique crack penetrates. Soon after, the central region G0 is separated when the oblique crack reaches the back. In this way, there is no case where the separation is forcibly performed with an impact pressure in a state where the cooling is insufficient, so that separation without causing a notch on the inner peripheral surface can be performed.
上述實施形態中,雖係使噴射冷媒之噴嘴52下降以對中心區域賦予壓力W,但亦可另外設置與噴嘴52不同之棒狀按壓構件來賦予壓力。In the above-described embodiment, the nozzle 52 for ejecting the refrigerant is lowered to apply the pressure W to the center region. However, a rod-shaped pressing member different from the nozzle 52 may be separately provided to apply the pressure.
又,上述實施形態中作為冷卻手段雖係使用冷媒噴射嘴,但亦可以帕耳帖(Peltier)元件來進行冷卻。Further, in the above embodiment, the refrigerant injection nozzle is used as the cooling means, but the Peltier element may be used for cooling.
此外,上述實施形態雖係進行直徑15mm程度之內周加工,但亦可進行更小直徑之內周加工。例如,已確認了在0.9mm程度下亦能以高可靠性進行內周加工。Further, in the above embodiment, the inner circumference processing is performed to a diameter of about 15 mm, but the inner circumference processing of the smaller diameter may be performed. For example, it has been confirmed that the inner circumference processing can be performed with high reliability even at a level of 0.9 mm.
又,內周加工並不限於圓形,亦可以是橢圓或其他封閉曲線。Further, the inner circumference processing is not limited to a circular shape, and may be an ellipse or other closed curve.
產業上之可利用性Industrial availability
本發明可在對以玻璃基板為首之脆性材料基板進行圓形等切除之內周加工時加以利用。The present invention can be utilized in the inner peripheral processing for cutting a brittle material substrate such as a glass substrate by circular or the like.
1...基板搬入部1. . . Substrate loading unit
2...劃線裝置2. . . Scribing device
3...折斷裝置3. . . Fracture device
4...基板搬出部4. . . Substrate carry-out
5...搬送機器人5. . . Transport robot
11...裝載台11. . . Loading station
12...劃線頭12. . . Dash head
13...旋轉台13. . . Rotary table
14...旋轉驅動機構14. . . Rotary drive mechanism
15...X載台15. . . X stage
16...X載台驅動機構16. . . X stage drive mechanism
17...Y載台17. . . Y stage
18...Y載台驅動機會18. . . Y stage drive opportunity
22...具傾斜槽之劃線輪twenty two. . . Dash wheel with inclined groove
22a...槽22a. . . groove
22b...切除面22b. . . Cut surface
22c...軸心22c. . . Axis
23...輪支承機構twenty three. . . Wheel support mechanism
24、54...機械臂24, 54. . . Robotic arm
25...框架25. . . frame
42...環狀板42. . . Annular plate
43...中心切除機構43. . . Central resection mechanism
46...基板之上面46. . . Above the substrate
47...吸附孔47. . . Adsorption hole
48...加熱器48. . . Heater
49...孔49. . . hole
51...空氣噴射器51. . . Air ejector
52...噴嘴52. . . nozzle
53...保持具53. . . Holder
55...昇降機構55. . . Lifting mechanism
C1...內周圓C1. . . Inner circumference
d...噴嘴前端之直徑d. . . Diameter of the front end of the nozzle
D...中心區域之直徑D. . . Diameter of the central area
G...基板G. . . Substrate
G0...中心區域G0. . . Central region
J...冷媒J. . . Refrigerant
MS1...加工系統MS1. . . Processing system
圖1係顯示實施本發明加工方法之加工系統之一例的全體構成圖。Fig. 1 is a view showing the entire configuration of an example of a processing system for carrying out the processing method of the present invention.
圖2係顯示圖1之加工系統中之劃線裝置之構成的圖。Fig. 2 is a view showing the configuration of a scribing device in the processing system of Fig. 1.
圖3係顯示圖1之加工系統中之折斷裝置之構成的圖。Figure 3 is a diagram showing the construction of a breaking device in the processing system of Figure 1.
圖4係顯示圖3之折斷裝置之環狀板之構成的圖。Fig. 4 is a view showing the configuration of an annular plate of the breaking device of Fig. 3.
圖5係顯示使用劃線裝置之加工狀態的圖。Fig. 5 is a view showing a processing state using a scribing device.
圖6係顯示使用折斷裝置之一加工狀態的圖。Fig. 6 is a view showing a state of processing using one of the breaking devices.
圖7係顯示使用折斷裝置之一加工狀態的圖。Fig. 7 is a view showing a state of processing using one of the breaking devices.
圖8係顯示使用折斷裝置之一加工狀態的圖。Fig. 8 is a view showing a state of processing using one of the breaking devices.
圖9係顯示具傾斜槽之劃線輪之刃口的圖。Fig. 9 is a view showing a cutting edge of a scribing wheel having an inclined groove.
C1...內側輪廓線C1. . . Inside contour
G...脆性材料基板G. . . Brittle material substrate
G0...中心區域G0. . . Central region
42...板片42. . . Plate
49...孔49. . . hole
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JP5055158B2 (en) * | 2008-02-12 | 2012-10-24 | 三星ダイヤモンド工業株式会社 | Processing system and processing method for brittle material annular workpiece |
JP2009269762A (en) * | 2008-04-30 | 2009-11-19 | Fuji Electric Device Technology Co Ltd | Glass raw material, molding die for the same, and method for manufacturing glass substrate for magnetic disk |
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2011
- 2011-04-06 JP JP2011084777A patent/JP5285736B2/en not_active Expired - Fee Related
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2012
- 2012-01-06 TW TW101100584A patent/TWI440543B/en not_active IP Right Cessation
- 2012-01-25 KR KR1020120007159A patent/KR101323673B1/en not_active IP Right Cessation
- 2012-03-07 CN CN201210062901.4A patent/CN102729345B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP5285736B2 (en) | 2013-09-11 |
JP2012218962A (en) | 2012-11-12 |
KR20120114149A (en) | 2012-10-16 |
KR101323673B1 (en) | 2013-10-30 |
CN102729345A (en) | 2012-10-17 |
CN102729345B (en) | 2015-02-18 |
TW201240787A (en) | 2012-10-16 |
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