CN101028966B - Base-plate splitter and splitting method - Google Patents
Base-plate splitter and splitting method Download PDFInfo
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- CN101028966B CN101028966B CN2007100965071A CN200710096507A CN101028966B CN 101028966 B CN101028966 B CN 101028966B CN 2007100965071 A CN2007100965071 A CN 2007100965071A CN 200710096507 A CN200710096507 A CN 200710096507A CN 101028966 B CN101028966 B CN 101028966B
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Abstract
An apparatus for dividing a substrate by cracking is composed of a bench for putting a substrate on it, a press cracking block for pressing on said substrate, a drive unit for driving said press cricking block, and a servo motor for driving said drive unit. Its method includes such steps as pre-forming cracks on the bottom of substrate, moving the press cracking block toward the substrate, and pressing.
Description
Technical field
The present invention relates to a kind of substrate mitotic apparatus and adopt this substrate mitotic apparatus substrate splitted method, relate to do not relate to a kind of glass substrate mitotic apparatus and adopt this glass from the substrate mitotic apparatus with glass substrate splitted method.
Background technology
Glass board material, organic polymer sheet material and other various sheet material are to be widely used in liquid crystal flat display apparatus and other flat display apparatus.The application of sheet material comprises substrate as membrane transistor, as the substrate of general circuit, as optical element or other application.For cooperating the display unit production of different size, need the sheet material of monoblock is cut into various size.In addition, carrying out to consider the material character of various sheet material when sheet material cuts, and taking into account the plate construction intensity after cutting, to guarantee the qualification rate of product.
The example that is cut into glass substrate.Figure 1 shows that the board equipment synoptic diagram that tradition cuts glass substrate.As shown in Figure 1, cut board and include table top 70.Be to carry to be provided with by flow to be written into glass substrate 20 on the table top 70.On the board 70 and set up a support 30.Support 30 belows then are linked with substrate cleavage block 50.Substrate cleavage block 50 is to move up and down with respect to support 30, and corresponding to a pre-crackle (not illustrating) of glass substrate 20 bottom surfaces.The top of substrate cleavage block 50 is provided with a hammering device, and when hammering device shot down downwards, substrate cleavage block 50 promptly moved down, and on hammering glass substrate 20 end faces with respect to the position of pre-crackle.20 transverse direction from pre-crackle of glass substrate this moment are split and dimidiation, to reach the purpose of glass-cutting substrate 20.
Yet in this cutting mode,, therefore cause breaking of glass substrate 20 easily because the speed that hammering produces substrate cleavage block 50 is very fast.Do not reduce the situation of fragmentation, need the degree of depth of pre-crackle is deepened.Yet the position of pre-crackle is the place, edge of glass substrate 20 after future, cutting was finished.When deepening pre-crackle,, therefore can influence the marginal texture intensity of cutting back glass substrate simultaneously owing to the structure of its processing mode to glass substrate 20 impacts.
Summary of the invention
A purpose of the present invention is to provide a kind of substrate mitotic apparatus and using method thereof, for promoting the structural strength of cutting apart the metacoxa edge.
Another object of the present invention is to provide a kind of substrate mitotic apparatus and using method thereof, can promote the qualification rate of product.
Another object of the present invention is to provide a kind of substrate mitotic apparatus and using method thereof, can cooperate the cutting manufacture craft of thin substrate.
The substrate mitotic apparatus comprises servomotor, transmission mechanism, substrate pressure break piece, board, servo processor and pressure-sensing device.Wherein board has a board table top, and servomotor, transmission mechanism and substrate pressure break piece all are arranged at board table top top.One end of transmission mechanism directly or indirectly is connected in servomotor, for the power of output servomotor.Substrate pressure break piece directly or indirectly is connected in the other end of transmission mechanism.The board table top of board is with respect to substrate pressure break piece, and servomotor is to move playing surface towards board by actuator drives substrate pressure break piece.Substrate is arranged on the board table top, and its bottom surface is formed with pre-crackle.The bearing of trend of substrate pressure break piece is identical with pre-crackle, and servo motor driven substrate pressure break piece towards or away from the direction of pre-crackle on move.Wherein this servo processor signal connects this servomotor, this pressure-sensing device directly or indirectly connects this substrate pressure break piece, and signal is connected in this servo processor, this pressure-sensing device is detected the pressure on this substrate pressure break piece, and be converted to signal and be sent to this servo processor, to control the actuating speed of this servomotor.
Substrate divisional mode of the present invention comprises the following step: at first form pre-crackle on substrate.Then controlling servo motor driven substrate pressure break piece moves towards substrate.Last control basal plate pressure break piece is from pre-crackle correspondence position compressing substrate.Wherein the servomotor controlled step comprises when substrate pressure break piece during in different travel position, changes the actuating speed of servomotor; And the top side location by pressure-sensing device detecting substrate, change the position of servomotor speed with decision.In addition, substrate compressing step comprises by the force value on the pressure-sensing device sensing substrate pressure break piece; When force value arrives a preset pressure value, promptly stop to advance of substrate pressure break piece.
Description of drawings
Fig. 1 is the synoptic diagram of conventional substrate mitotic apparatus;
Fig. 2 is the embodiment front view of substrate mitotic apparatus of the present invention;
Fig. 3 is a side-view embodiment illustrated in fig. 2;
Fig. 4 a is the isolating embodiment synoptic diagram of transmission mechanism and substrate pressure break piece;
Fig. 4 b is the illustrative view of Fig. 4 a illustrated embodiment;
Fig. 5 a is the embodiment synoptic diagram that substrate pressure break piece is positioned at first stroke;
Fig. 5 b is the embodiment synoptic diagram that substrate pressure break piece is positioned at second stroke;
Fig. 6 a is the embodiment synoptic diagram that comprises coupling shaft;
Fig. 6 b contains the substrate pressure break piece of coupling shaft and the embodiment synoptic diagram of substrate contacts;
Fig. 7 is the embodiment synoptic diagram that comprises shock absorbing device;
Fig. 8 a is the embodiment synoptic diagram that comprises servo processor and pressure-sensing device;
Fig. 8 b is another embodiment synoptic diagram of pressure-sensing device;
Fig. 9 is another embodiment synoptic diagram of transmission mechanism;
Figure 10 is the embodiment schema of substrate splitting method of the present invention;
Figure 11 is another embodiment schema of substrate splitting method;
Figure 12 is another embodiment schema of substrate splitting method.
The main element nomenclature:
100 servomotors
110 rotating screw bolts
200 substrates
210 pre-crackles
300 transmission mechanisms
301 power input parts
303 power efferents
310 power intakes
330 clutch ends
400 guide rails
500 substrate pressure break pieces
610 first strokes
620 second strokes
700 boards
710 board table tops
750 coupling shafts
770 shock absorbing devices
910 servo processors
930 pressure-sensing devices
Embodiment
The invention provides a kind of substrate mitotic apparatus and adopt this substrate mitotic apparatus substrate splitted method.What the substrate of this place speech was preferable is the flat display apparatus substrate; Yet in different embodiment, substrate also can be circuit substrate, wafer substrate and other various substrates.In addition, in preferred embodiment, the material of substrate is a glass material; Yet in other embodiments, substrate also can organic resin or other unlike materials form.
In the embodiment shown in Figure 2, the substrate mitotic apparatus comprises servomotor 100, transmission mechanism 300, substrate pressure break piece 500 and board 700.Wherein board 700 has a board table top 710, and servomotor 100, transmission mechanism 300 and substrate pressure break piece 500 all are arranged at board table top 710 tops.Servomotor 100 preferably refer to control speed or drive the motor 100 in path, its kind comprises the servomotor of constant speed servomotor, speed change servomotor, dc servomotor, AC servomotor and other patterns.
As shown in Figure 2, an end of transmission mechanism 300 is directly or indirectly to be connected in servomotor 100, for the power of output servomotor 100.In the embodiment shown in Figure 2, transmission mechanism 300 has power intake 310 and clutch end 330, and wherein power intake 310 directly or indirectly is connected in servomotor 100.Servomotor 100 includes rotating screw bolt 110, and the power intake 310 of transmission mechanism 300 is provided with corresponding screw.Screw fit rotating screw bolt 110.When rotating screw bolt 110 rotates, and when restricted power input terminus 310 does not rotate accordingly simultaneously, can produce displacement along rotating screw bolt 110 axial directions by drive transmission 300.
Substrate pressure break piece 500 is connected in transmission mechanism 300, and preferably is connected in the clutch end 330 of transmission mechanism 300 directly or indirectly.In addition, substrate pressure break piece 500 also can adopt separable mode to be connected with transmission mechanism 300; That is substrate pressure break piece 500 and 300 generations that relative displacement also can be arranged of transmission mechanism.As shown in Figures 2 and 3, substrate pressure break piece 500 is a strip setting, and is transverse to board table top 710.What the material of substrate pressure break piece 500 was preferable is organic resin; Yet in different embodiment, also can adopt metal or other materials.
As shown in Figures 2 and 3, the board table top 710 of board 700 is with respect to substrate pressure break piece 500, and servomotor 100 drives substrate pressure break piece 500 by transmission mechanism 300 and moves towards board table top 710.Substrate 200 preferably is sent on the board table top 710 by a flow mechanism (not illustrating).The bottom surface of substrate 200 preferably is formed with pre-crackle 210, and its generation type comprises cutting, boring or other machineries, laser or chemical process mode.The bearing of trend of substrate pressure break piece 500 is identical with pre-crackle 210, and servomotor 100 drive substrate pressure break pieces 500 towards or away from the direction of pre-crackle on move.
As shown in Figures 2 and 3, substrate mitotic apparatus and include guide rail 400.Transmission mechanism 300 is arranged on the guide rail 400 with substrate pressure break piece 500.Guide rail 400 is preferably perpendicular to board table top 710; In other words, guide rail 400 guiding transmission mechanisms 300 are moving on reaching away from the direction of board table top 710 with substrate pressure break piece 500, and restriction transmission mechanism 300 and substrate pressure break piece 500 displacement or rotation in the other direction.Guide rail 400 directly is arranged on the board 700; Yet in different embodiment, guide rail 400 also can sus-pension be arranged at board table top 710 tops.
In the embodiment shown in Fig. 4 a, transmission mechanism 300 also can produce relative displacement with substrate pressure break piece 500 on guide rail 400.In other words, transmission mechanism 300 is to be connected with substrate pressure break piece 500 in separable mode.Shown in Fig. 4 b, when transmission mechanism 300 was subjected to servomotor 100 to drive along guide rail 400 contact substrate pressure break pieces 500, the clutch end 330 of transmission mechanism 300 promptly promoted substrate pressure break piece 500 and advances towards board table top 710.
Shown in Fig. 5 a, be reference point with the bottom surface of substrate pressure break piece 500, substrate pressure break piece 500 has first stroke 610 and second stroke 620, wherein second stroke 620 than first stroke 610 near board table top 710.Angle with Fig. 5 a is seen it, and substrate pressure break piece 500 is to enter second stroke 620 back via first stroke 610 to make and contact near board table tops 710 and with its substrate 200 of going up setting.In preferred embodiment, the distance on the zero position of second stroke 620 and substrate 200 surfaces is less than 2mm; In other words, the distance of board table top 710 adds the thickness of upper substrate 200 less than 2mm.The zero position of second stroke 620 promptly is equal to the end position of first stroke 610.In preferred embodiment, substrate pressure break piece 500 is to have finished moderating process when this position, and lowering speed is reduced to second speed by first speed.
Shown in Fig. 5 a, when substrate pressure break piece 500 was in the scope of first stroke 610, it was first speed that servomotor 100 drives substrate pressure break piece 500 progressive speed.Shown in Fig. 5 b, when substrate pressure break piece 500 was in the scope of second stroke 620, it was second speed that servomotor 100 drives substrate pressure break piece 500 progressive speed.In this embodiment, first speed is greater than second speed, to save the whole time of manufacture craft; Yet in different embodiment, servomotor 100 also can all drive substrate pressure break piece 500 from start to finish and keep a constant speed and advance.In addition, second speed is preferably less than 10mm/s; Yet in better embodiment, second speed is less than 2mm/s.When with slower second speed as with the contact velocity of substrate 200 time, the slow pressure effect of substrate pressure break piece 500 can will have substrate 200 divisions of more shallow pre-crackle 210, to increase the marginal texture intensity of division metacoxa 200.Particularly at the substrate 200 of thinner thickness, substrate pressure break piece 500 needs to use slower second speed to carry out pressure break.For example when substrate 200 thickness during less than 0.3mm, second speed is preferably less than 2mm/s.
In the embodiment shown in Fig. 6 a and Fig. 6 b, the substrate mitotic apparatus comprises coupling shaft 750 in addition.Transmission mechanism 500 is by the be coupling stage casing part of substrate pressure break piece 500 of coupling shaft 750, and coupling shaft 750 is perpendicular to the travel direction of transmission mechanism 500.In this embodiment, coupling shaft 750 crosscut substrate pressure break pieces 500, and parallel with board table top 710.When substrate pressure break piece 500 contacts with substrate 200, shown in Fig. 6 b, may cause the bottom surface of substrate pressure break piece 500 to fail parallel because of substrate thickness inequality or other reasons with substrate 200 surfaces.This moment, coupling shaft 750 promptly allowed substrate pressure break piece 500 slightly to rotate to and the parallel state in substrate 200 surfaces, concentrated the qualification rate that causes to descend to avoid producing stress.
In the embodiment shown in fig. 7, the substrate mitotic apparatus further comprises shock absorbing device 770.Shock absorbing device 770 is arranged at the outside of coupling shaft 750, that is is positioned on the different plumb lines with coupling shaft 750.Shock absorbing device 770 is between transmission mechanism 500 and substrate pressure break piece 500; When substrate pressure break piece 500 rotated with respect to coupling shaft 750, shock absorbing device 770 can absorb and rotate the energy that brings, and slowed down the speed that substrate pressure break piece 500 rotates.In this preferred embodiment, shock absorbing device 770 is arranged at the both sides of coupling shaft 750 in pairs; Yet in different embodiment, shock absorbing device 770 also can only be arranged at a side of coupling shaft 750.In addition, shock absorbing device 770 is preferable comprises damping system, for transforming the kinetic energy that 500 rotations of substrate pressure break piece produce; Yet shock absorbing device 770 also can comprise elastic elements such as spring.
Shown in Fig. 8 a, the substrate mitotic apparatus comprises servo processor 910 and pressure-sensing device 930 in addition.Servo processor 910 signals are connected in servomotor 100, for the output rating or the speed of control servomotor 100.Pressure-sensing device 930 directly or indirectly is connected in substrate pressure break piece 500, and signal is connected in servo processor 910.In the embodiment shown in Fig. 8 a, pressure-sensing device 930 directly is arranged at the top of substrate pressure break piece 500, and corresponding to the clutch end 330 of transmission mechanism 300.When transmission mechanism 300 presses down the top that makes clutch end 330 contact substrate pressure break pieces 500, need first compressive pressure sensing apparatus 930 could drive substrate briquetting 500.This moment pressure-sensing device 930 be with substrate pressure break piece 500 placed in-line mode sensing substrate pressure break pieces 500 on pressure.Yet in different embodiment, shown in Fig. 8 b, pressure-sensing device 930 also can be arranged on the clutch end 330 of transmission mechanism 300.When clutch end 330 compressing substrate pressure break pieces 500, pressure-sensing device 930 also can detect the pressure on the substrate pressure break piece 500.In addition, pressure-sensing device 930 also can be connected with parallel way with substrate pressure break piece 500.
In the embodiment shown in fig. 9, transmission mechanism 300 comprises isolating power input part 301 and power efferent 303.Power input part 301 is connected in servomotor 100 movably, and wherein power intake 310 is arranged on the power input part 301.Power efferent 303 and substrate pressure break piece 500 interlocks, that is substrate pressure break piece 500 is to be coupling on power efferent 303 by coupling shaft 750.Shock absorbing device 770 is arranged between power efferent 303 vertical flanges and the substrate pressure break piece 500. Power input part 301 and 303 preferable all being arranged on the guide rail 400 of power efferent, and can produce relative displacement along the direction of vertical board table top 710.
As shown in Figure 9, pressure-sensing device 930 is arranged between power input part 301 and the power efferent 303, and is positioned on the power efferent 303.Yet in different embodiment, pressure-sensing device 930 also can be arranged on the power input part 301.This moment, pressure-sensing device 930 was connected with substrate pressure break piece 500 indirectly.In the embodiment of Fig. 9, when the power input part 301 of servomotor 100 drive transmissions 300, power input part 301 is that driving pressure sensing apparatus 930 is with propulsion power efferent 303.This moment pressure-sensing device 930 can detect the pressure that bears on the substrate pressure break piece 500.
In the embodiment shown in fig. 10, substrate divisional mode of the present invention is preferable comprises step 1010, forms pre-crackle 210 on substrate 200.The generation type of pre-crackle 210 comprises cutting, boring or other machineries, laser or chemical process mode.Step 1030 moves towards substrate 200 for control servomotor 100 drives substrate pressure break piece 500.In preferred embodiment, the rotational power of servomotor 100 outputs is that beginning output drives substrate pressure break piece 500 after being converted to linear power via transmission mechanism 300.Step 1050 comprises control basal plate pressure break piece 500 from pre-crackle 210 correspondence positions compressing substrate 200.The bearing of trend of substrate pressure break piece 500 preferably is parallel to the direction of pre-crackle 210.In addition, because the preferable bottom surface that is formed at substrate 200 of pre-crackle 210, and the end face of substrate pressure break piece 500 compressing substrates 200, so substrate pressure break piece 500 is preferably oppressed the opposite of pre-crackle 210.
In the embodiment shown in fig. 11, servomotor controlled step 1030 comprises step 1031, and when substrate pressure break piece 500 was in first stroke 610, control basal plate pressure break piece 500 advanced with first speed; And step 1033, when substrate pressure break piece 500 was in second stroke 620, control basal plate pressure break piece 500 advanced with second speed.Second stroke 620 is near substrate 200, and first speed is greater than second speed.Yet in different embodiment, servomotor 100 also may command substrate pressure break piece 500 is kept a fixed speed and is moved.Second speed is preferably less than 10mm/s; Yet in better embodiment, second speed is less than 2mm/s.When with slower second speed as with the contact velocity of substrate 200 time, the slow pressure effect of substrate pressure break piece 500 can will have substrate 200 divisions of more shallow pre-crackle 210, to increase the marginal texture intensity of division metacoxa 200.Particularly at the substrate 200 of thinner thickness, substrate pressure break piece 500 needs to use slower second speed to carry out pressure break.For example when substrate 200 thickness during less than 0.3mm, second speed is preferable less than 2mm/s.
As shown in figure 11, servomotor controlled step 1030 more can comprise the top side location of step 1035 with pressure-sensing device 930 detecting substrates 200.This step is when first plate base 200 in batch substrate 200 is written into usually.In this step, servo motor driven substrate pressure break piece 500 descends and contacts with substrate 200.When pressure-sensing device 930 is initial detect during the force value of substrate pressure break piece 500, can orientating as at that time, the basal surface position of substrate pressure break piece 500 is the top side location of substrate 200.Step 1037 comprises the zero position that determines second stroke 620 according to top side location.In preferred embodiment, the distance of the zero position of second stroke 620 and substrate 200 top side location is less than 2mm.In addition, in the embodiment shown in fig. 11, also can omit step 1035 and step 1037.The zero position of the location of top side location and second stroke 620 can replace by directly manually setting the mode of servo processor 910 with control servomotor 100.
In the embodiment shown in fig. 12, substrate compressing step 1050 comprises step 1051, pressure-sensing device 930 is set directly or indirectly connects substrate pressure break piece 500.Wherein the mode of connection of pressure-sensing device 930 and substrate pressure break piece 500 comprises and is connected in series and is connected in parallel.Step 1053 comprises the pressure that bears by pressure-sensing device 930 detecting substrate pressure break pieces 500.The counter-force that this pressure produces when oppressing substrates 200 by substrate pressure break piece 500 is formed.Therefore get over for a long time when substrate pressure break piece 500 compressing substrates 200, this force value also increases thereupon.
Step 1055 comprises when pressure reaches a preset pressure value, promptly stops to advance of substrate pressure break piece 500.Because the thickness of substrate 200 and the degree of depth of pre-crackle 210 all can be set in advance, therefore can be by experiment or other analysis modes learn pressure required when causing the disconnected system in pre-crackle 210 positions on the substrate 200.This pressure can be set in the servo processor 910 as preset pressure.When the pressure on the pressure-sensing device 930 detecting substrate pressure break pieces 500 reaches this preset pressure, can judge that substrate 200 ruptures when pre-crackle.Servo processor 910 was promptly controlled servomotor 100 and was stopped outputting power or reverse outputting power this moment, to stop to advance of substrate pressure break piece 500.
The substrate divisional mode more can comprise and shock absorbing device 770 is set in 500 of transmission mechanism 300 and substrate pressure break pieces.By the setting of this shock absorbing device 770, but the vibrations that produce when absorptive substrate pressure break piece 500 contacts with substrate 200.In addition, substrate pressure break piece 500 also can coupling shaft 750 be coupling.When substrate pressure break piece 500 and substrate 200 end faces are non-parallel, the stress distribution when coupling shaft 750 makes 500 rotations of substrate pressure break piece contact with substrate 200 with average substrate pressure break piece 500, and and then the qualification rate of increase production.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that the embodiment that has disclosed does not limit the scope of the invention.On the contrary, being contained in the modification of the spirit of claim and scope and equalization is provided with and all is contained in the scope of the present invention.
Claims (26)
1. substrate mitotic apparatus comprises:
One servomotor;
One transmission mechanism, an end of this transmission mechanism connects this servomotor, and wherein this transmission mechanism is exported the power of this servomotor;
One substrate pressure break piece is connected in this transmission mechanism;
One board table top is provided with respect to this substrate pressure break piece; Wherein this servomotor is moved playing surface towards this board by this substrate pressure break piece of this actuator drives;
One servo processor, signal connect this servomotor; And
One pressure-sensing device, this pressure-sensing device directly or indirectly connect this substrate pressure break piece, and signal is connected in this servo processor;
Wherein, this pressure-sensing device is detected the pressure on this substrate pressure break piece, and is converted to signal and is sent to this servo processor, to control the actuating speed of this servomotor.
2. substrate mitotic apparatus as claimed in claim 1, wherein this servomotor comprises a rotating screw bolt, and this transmission mechanism comprises:
One power intake can connect this rotating screw bolt with moving axially, and this power intake has a screw, and this screw cover is should rotating screw bolt; And
One clutch end, corresponding this substrate pressure break piece that drives produces displacement.
3. substrate mitotic apparatus as claimed in claim 1, further comprise a guide rail, wherein this transmission mechanism and this substrate pressure break piece are arranged on this guide rail, and this transmission mechanism guided by this guide rail and this substrate pressure break piece is moving on reaching away from the direction of this board table top.
4. substrate mitotic apparatus as claimed in claim 1, wherein relative this board table top of this substrate pressure break piece has one first stroke and one second stroke, this second stroke than this first stroke near this board table top, when this substrate pressure break piece was displaced in this first stroke, the speed that this substrate pressure break piece of this servo motor driven moves was one first speed; When this substrate pressure break piece was displaced in this second stroke, the speed that this substrate pressure break piece of this servo motor driven moves was a second speed, and this first speed is greater than this second speed.
5. substrate mitotic apparatus as claimed in claim 4, wherein the distance of one of this second stroke initial position and this board table top adds a substrate thickness less than 2mm.
6. substrate mitotic apparatus as claimed in claim 4, wherein this second speed is less than 10mm/s.
7. substrate mitotic apparatus as claimed in claim 4, wherein this second speed is less than 2mm/s.
8. substrate mitotic apparatus as claimed in claim 1 further comprises a coupling shaft, and wherein this transmission mechanism is by be coupling a stage casing part of this substrate pressure break piece of this coupling shaft, and this coupling shaft is perpendicular to the travel direction of this transmission mechanism.
9. substrate mitotic apparatus as claimed in claim 8 further comprises a shock absorbing device, is arranged at the outside of this coupling shaft, and wherein this shock absorbing device is between this transmission mechanism and this substrate pressure break piece.
10. substrate mitotic apparatus as claimed in claim 9, wherein this shock absorbing device comprises a damping system.
11. substrate mitotic apparatus as claimed in claim 1, wherein this pressure-sensing device is to be connected in this substrate pressure break piece with parallel way.
12. substrate mitotic apparatus as claimed in claim 1, wherein this pressure-sensing device is to be connected in this substrate pressure break piece with series system.
13. substrate mitotic apparatus as claimed in claim 12, wherein this transmission mechanism comprises:
One power input part connects this servomotor movably; And
One power efferent is with this substrate pressure break piece interlock; Wherein this pressure-sensing device is arranged between this power input part and this power efferent, and this power input part system drives this pressure-sensing device to drive this power efferent.
14. substrate mitotic apparatus as claimed in claim 12, wherein this pressure-sensing device is arranged between this transmission mechanism and this substrate pressure break piece, and this power input part drives this pressure-sensing device to drive this substrate pressure break piece.
15. one kind is adopted according to claim 1, and the substrate mitotic apparatus comprises the following step with substrate splitted mode:
On a substrate, form a pre-crackle;
Controlling this substrate pressure break piece of this servo motor driven moves towards this substrate; And
Control this substrate pressure break piece and oppress this substrate from this pre-crackle correspondence position.
16. mode as claimed in claim 15, wherein this servomotor controlled step comprises:
When this substrate pressure break piece is in one first stroke, controls this substrate pressure break piece and advance with one first speed; And
When this substrate pressure break piece is in one second stroke, controls this substrate pressure break piece and advance with a second speed; Wherein this second stroke is near this substrate, and this first speed is greater than this second speed.
17. mode as claimed in claim 16, wherein this second speed is less than 10mm/s.
18. mode as claimed in claim 17, wherein this second speed is less than 2mm/s.
19. mode as claimed in claim 16, wherein the distance of one of this second stroke initial position and this board table top adds a substrate thickness less than 2mm.
20. mode as claimed in claim 16, wherein this servomotor controlled step comprises:
Detect a top side location of this substrate with a pressure-sensing device; And
Determine an initial position of this second stroke according to this top side location.
21. mode as claimed in claim 15 further comprises and a shock absorbing device is set in this transmission mechanism and this substrate pressure break interblock, the vibrations that produce when absorbing this substrate pressure break piece and this substrate contacts.
22. mode as claimed in claim 15 further comprises with a coupling shaft this substrate pressure break piece that is coupling, the stress distribution during with average this substrate pressure break piece and this substrate contacts.
23. mode as claimed in claim 15, wherein this substrate compressing step comprises:
One pressure-sensing device is set directly or indirectly connects this substrate pressure break piece;
Detect the pressure that this substrate pressure break piece bears by this pressure-sensing device; And
When this pressure reaches a preset pressure value, stop to advance of this substrate pressure break piece.
24. mode as claimed in claim 23, wherein this pressure-sensing device is provided with step and comprises with series system and connect this pressure-sensing device and this substrate pressure break piece.
25. mode as claimed in claim 23, wherein this pressure-sensing device is provided with step and comprises with parallel way and connect this pressure-sensing device and this substrate pressure break piece.
26. mode as claimed in claim 15, further comprise limit this substrate thickness less than 0.3mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100965071A CN101028966B (en) | 2007-04-11 | 2007-04-11 | Base-plate splitter and splitting method |
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| CN2007100965071A CN101028966B (en) | 2007-04-11 | 2007-04-11 | Base-plate splitter and splitting method |
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| CN101028966A CN101028966A (en) | 2007-09-05 |
| CN101028966B true CN101028966B (en) | 2010-08-11 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5285736B2 (en) * | 2011-04-06 | 2013-09-11 | 三星ダイヤモンド工業株式会社 | Inner perimeter processing method of brittle material substrate |
| KR101807496B1 (en) * | 2011-05-31 | 2018-01-18 | 주식회사 탑 엔지니어링 | A breaking apparatus of glass panel and a method for measuring horizontal level using the same |
| KR101796928B1 (en) * | 2011-08-01 | 2017-11-13 | 주식회사 탑 엔지니어링 | A breaking apparatus using breaking bar |
| CN103302687A (en) * | 2012-03-13 | 2013-09-18 | 均豪精密工业股份有限公司 | Cutting and scraping device and cutting and scraping method thereof |
| CN103951179A (en) * | 2014-05-05 | 2014-07-30 | 苏州太丰玻璃饰品有限公司 | Convenient loss prevention glass cutting machine |
| CN108436288A (en) * | 2018-03-30 | 2018-08-24 | 中南民族大学 | A kind of sliver segmenting device and dividing method for fragile material |
| CN110526563A (en) * | 2019-09-09 | 2019-12-03 | 东莞通华液晶有限公司 | A kind of cutting splitting method of slim liquid crystal glass base |
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| US5873922A (en) * | 1995-01-24 | 1999-02-23 | Lisec; Peter | Process for dividing glass panels into blanks |
| CN2513993Y (en) * | 2001-12-05 | 2002-10-02 | 财团法人工业技术研究院 | Glass substrate cutter apron device |
| CN2786110Y (en) * | 2005-04-22 | 2006-06-07 | 孙春雨 | Device for cracking glasses |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5873922A (en) * | 1995-01-24 | 1999-02-23 | Lisec; Peter | Process for dividing glass panels into blanks |
| CN2513993Y (en) * | 2001-12-05 | 2002-10-02 | 财团法人工业技术研究院 | Glass substrate cutter apron device |
| CN2786110Y (en) * | 2005-04-22 | 2006-06-07 | 孙春雨 | Device for cracking glasses |
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