KR20120114149A - Method for processing inner periphery of brittle material substrate - Google Patents

Abstract

PURPOSE: An inner circumference processing method of brittle material substrates is provided to divide the central zone by cooling the central zone after pressing the central zone. CONSTITUTION: An inner circumference processing method of brittle material substrates comprises the following steps: forming scribing lines(C1) of the inner circumference on a first surface of the brittle material substrate by using scribing wheels having inclined grooves; pressing the central zone while supporting the substrate with a plate(42) which forms holes(49); and separating the central zone by cooling and shrinking the central zone as pressing the central zone. The inclined grooves of the scribing wheel are formed at blade edge of the scribing wheel periodically and with a slope from the axis direction of the scribing wheel. The holes of the plate are not in contact with the central zone which is placed inner side than inner edge lines.

Description

METHOD FOR PROCESSING INNER PERIPHERY OF BRITTLE MATERIAL SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner circumferential processing method in which a substrate is cut along an inner contour that becomes an inner circumference with respect to a brittle material substrate. The present invention is used in, for example, a step of processing an annular substrate for an information storage device from a rectangular substrate. The brittle material herein includes materials such as ceramics, single crystal silicon, semiconductor wafers, and sapphire in addition to the glass substrate.

The glass annular substrate used for a hard disk etc. is formed by performing the process which cuts out a circle | round | yen from a rectangular glass substrate.

In the case of performing an inner circumferential processing for cutting a glass substrate along a closed curve such as a circle, first, cutters having different left and right blade angles along a circle serving as an inner contour with respect to one side surface (first surface) of the substrate; The scribing wheel is used to process the cutting line (scribing line) inclined in the depth direction. Then, the crack is formed along the cutting line by heating from the surface where the cutting line is deformed. It penetrates and reaches to the opposite surface (2nd surface), Then, the process which cuts out circularly by pressing the part enclosed by an inner contour with a pressing member is carried out (refer patent document 1). When forming an annular glass substrate having an inner circumference circle and an outer circumference circle by this method, it is first cut out by the above method along the outer contour that becomes the outer circumference circle from the rectangular substrate. To perform, then has to bet by repeating the same procedure, cut along the medial contour is the inner circle to effect the processing to form a cyclic substrate, that is, has to perform two times the inner peripheral processing.

In addition, when cutting a closed curve shape from a substrate, a cutting line (cracks) inclined with respect to the substrate can be formed so that the cracks penetrate deeper than a normal scribing wheel (also called a cutter wheel). A scribing wheel having an inclined groove which periodically forms a groove inclined with respect to the axial direction of the wheel on the blade tip ridge of the disc-shaped wheel is put to practical use (see Patent Document 2).

Fig. 9 is a view showing the blade tip of the scribing wheel 22 having the inclined groove, Fig. 9 (a) is a front view, Fig. 9 (b) is a side view, and Fig. 9 (c) is a sectional view taken along the line A-A '. This inclined grooved scribing wheel 22 inclines the cutting surface 22b of the groove 22a with respect to the shaft center 22c, and makes the cutting amount uneven on both sides of a ridge line.

Specifically, the groove pitch is formed in the range of 20 µm to 200 µm, depending on the wheel diameter of 1 to 20 mm. As shown in Fig. 9 (c), h1 is set to 2 µm to 2500 µm and h2 is set to 1 µm to 20 µm with respect to the left and right groove depths h1 and h2.

By using this special blade tip (called a high penetration blade tip), it is possible to form oblique cracks penetrating to a depth virtually impossible with a conventional scribing wheel without grooves.

Moreover, as a processing method of the annular workpiece using said high-penetration blade tip, the nozzle for heating a annular area | region outside an inner contour line, and injecting a refrigerant above the center area | region inside an inner contour line is approached, and is centered from a nozzle. It is disclosed to perform the inner blanking step of separating the central region by injecting a coolant into the region, cooling the liquid, and shrinking it (see Patent Document 3).

In addition, as a supplementary means when the central region cannot be separated by cooling only by refrigerant injection, in order to forcibly separate the central region, the nozzle is lowered and mechanically separated by pressing the nozzle tip against the central region and pressing it. Is disclosed.

Japanese Patent No. 2785906 Japanese Patent No. 2989602 Japanese Laid-Open Patent Publication No. 2009-190905

In the inner circumferential processing in which the center region inside the inner contour (closed curve) is cut out, it is important not only that the center region can be separated reliably but also that the processing quality of the separation surface is excellent.

As for the inside blanking method of separating by injecting a refrigerant toward a center region from the refrigerant injection nozzle arrange | positioned above the center region as described in patent document 3, the plate | board thickness is about 0.5 mm-2 mm of glass so far. It is widely used in the inside blanking process of a board | substrate, and especially in the cutting process of the inner peripheral circle of about 20 mm in diameter, it became a reliable processing method.

However, in the inner circumferential processing of the annular glass substrate used for a hard disk or the like, it is desired to cut the diameter of the inner circumferential circle to be cut into a smaller diameter than ever before, specifically, 15 mm or less, more preferably about 9 mm. It is desired to perform inner workings in diameter.

In general, in the inner circumferential processing, the larger the area of the center region to be cut out, the larger the self-weight of the center region itself is, so that it tends to be separated easily. When the center region is about 20 mm in diameter, the refrigerant is injected from the nozzle. It could be separated reliably only by the contracting action.

However, when the diameter of the inner circumferential circle becomes small by about 15 mm, it may not be possible to completely separate only by cooling by refrigerant injection. Therefore, the nozzle is lowered and forced to be separated by pressing against the center region. Cases that have to be done are often seen.

In this case, it is possible to reliably separate the center region by increasing the pressure force when the nozzle is brought into contact with the substrate or by touching the nozzle momentarily, but the separation surface (inner circumference) may cause slippage. A problem of discarding occurred, and a problem sometimes occurred in terms of processing quality.

Therefore, the present invention provides an inner circumferential processing method which can reliably separate the center region when performing the inner circumferential processing for cutting the inner side of the inner contour (closed curve), and further prevents the separation from occurring on the separating surface. It aims to do it.

In order to solve the above problems, the method of processing the inner circumference of the brittle material substrate of the present invention comprises: (a) an inclined groove periodically formed with a groove inclined with respect to the axial direction of the scribing wheel on the blade ridge line of the scribing wheel; A scribing step of forming a scribe line of an inner contour which is an inner circumference on the first surface of the brittle material substrate by using a scribing wheel having the same; The pressurizing step of supporting the substrate with a plate having a hole, and applying a pressurization to the center region, and (c) in the state where the pressurization is applied, cools and contracts the center region. It consists of an inner blanking process that separates the central region.

Here, the said inner circumferential processing method may be applied when the diameter of the said inner outline is 15 mm or less circular.

According to the present invention, in the scribing step, first, the scribing wheel having the inclined groove is rolled to penetrate deeply in the depth direction (the thickness direction of the substrate) to the first surface, which is one side of the brittle material substrate. A scribe line consisting of oblique cracks is formed, thereby forming an inner contour that becomes the inner circumference. Incidentally, the inclined crack is formed to widen outward as it progresses in the depth direction from the first surface side. By using a scribing wheel with an inclined groove, the formed scribe line is, for example, 30% or more, preferably 40% or more, more preferably 50% or more relative to the thickness of the substrate (usually 80% It can be set as the deep crack of the following).

Subsequently, in the pressurization step, the substrate on which the scribe line of the inner contour is formed is placed on a plate formed with holes to support the substrate. The hole of the plate is sized such that the center area which is inward of the inner contour becomes non-contact, so that the center area can be separated through the hole.

Then, pressurization is applied to the center region of the substrate supported by the plate. The pressurization may be applied by pressing the center region with the pressing member, but the pressing force is suppressed in order to prevent the center region from being separated while the pressurization is applied at this point. That is, in the step before cooling to the center region and shrinking in the next step, only pressurization is first applied to the center region so as to pass through a state where no active cooling is performed.

Next, in the inner blanking step, the center region is cooled and shrunk while the pressurized pressure is applied. As a result, when the center region is sufficiently cooled to penetrate the inclined cracks and reach the rear surface, the center region is pressed, so that the center region is separated at once.

In this way, by first applying a pressurizing pressure to the central region and then cooling the central region, it is difficult to separate by excessively strong or instantaneous pressing force in a state where cooling is insufficient. There is no generation | occurrence | production, and the inner periphery process excellent in work quality can be performed.

(Means and effects to solve other problems)

In the pressurization step of (b) of the invention, the outer region of the inner contour may be heated by a heating mechanism provided on the plate.

As a result, the temperature difference between the center region and the outer region can be made larger, so that the inclined cracks easily penetrate and can be separated more reliably.

In the pressurization step of (b) of the invention, the pressurization to the center area is applied by pressing the metal member on which the inflow path of the cooling medium is formed to the center area, and in the inner blanking step of (c), the center area. The cooling may be performed by introducing the cooling medium into the inflow path of the cooling medium of the metal member.

According to this, pressurization is performed in a state where no cooling medium is introduced into the metal member, and cooling can be performed in a state where pressurization is applied first by introducing the cooling medium into the inflow path of the metal member after the pressing.

BRIEF DESCRIPTION OF THE DRAWINGS It is the whole block diagram which shows an example of the processing system which implements the processing method of this invention.
It is a figure which shows the structure of the scribing apparatus in the processing system of FIG.
It is a figure which shows the structure of the brake apparatus in the machining system of FIG.
It is a figure which shows the structure of the annular plate of the brake apparatus of FIG.
It is a figure which shows the processing state by a scribe apparatus.
It is a figure which shows one of the processing states by a brake apparatus.
It is a figure which shows one of the processing states by a brake apparatus.
It is a figure which shows one of the processing states by a brake apparatus.
9 is a view showing the blade tip of the scribing wheel having an inclined groove.

(Mode for carrying out the invention)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings. Here, the inner peripheral process which cut | disconnects the inner peripheral circle of 15 mm with respect to the center part of disk-shaped glass substrate G is demonstrated as an example.

Such an inner circumferential process is applied, for example, when producing a glass annular substrate used for a hard disk.

1 is a schematic view showing the overall configuration of a machining system MS1 suitable for implementation of a machining method of the present invention. The processing system MS1 is comprised by the board | substrate carrying-in part 1, the scribe apparatus 2, the brake apparatus 3, the board | substrate carrying out part 4, and the transfer robot 5. As shown in FIG.

In the board | substrate carrying-in part 1, the cassette which accommodates board | substrate G is provided, and many board | substrate G before carrying out an inner periphery process is carried in.

The scribing apparatus 2 forms the scribe line which becomes an inner contour on the board | substrate G using the scribing wheel 22 with the inclined groove shown in FIG. Here, a 15 mm circle is carved on the first surface of the substrate G as the inner contour. In addition, the specific structure of the scribe device 2 is mentioned later.

The brake apparatus 3 performs the process which performs inside blanking of the center area | region which is inside of an inside outline with respect to the board | substrate G in which the inside outline was formed. In addition, the specific structure of the brake apparatus 3 is mentioned later.

As for the board | substrate carrying-out part 4, the cassette which accommodates the board | substrate G is provided similarly to the board | substrate carrying-in part 1, and the board | substrate G processed inside the blanking process is carried out.

The transfer robot 5 holds and conveys the board | substrate G one by one by the arm provided with the vacuum suction mechanism at the front end, and carries the board | substrate loading part 1, the scribe apparatus 2, and the brake apparatus 3 ) And transfer between the respective portions of the substrate carrying out portion 4.

Next, the scribe device 2 is demonstrated. 2 is a diagram illustrating a schematic configuration of a scribe device.

The scribe device 2 has a table 11 and a scribe head 12. The table 11 is a Y stage on which the X stage 15 on which the rotary stage 13, the rotation drive mechanism 14, and the rotation stage 13 are mounted, the X stage drive mechanism 16, and the X stage 15 are mounted. The scribe head 12 is provided with the stage 17 and the Y stage drive mechanism 18, and rotates or translates the board | substrate G on the rotating stage 13 in the XY direction. The substrate G is relatively moved with respect to the.

The scribing head 12 has a scribing wheel 22 (high penetrating blade tip) having an inclined groove, and a scribing wheel 22 having an inclined groove to the substrate G placed on the rotating stage 13. The wheel support mechanism 23 which has the adjustment mechanism which adjusts the pressure contact load of (), and the arm 24 which adjusts the position of the wheel support mechanism 23 and the scribing wheel 22 with an inclined groove.

As described above, the inclined grooved scribing wheel 22 (see Fig. 9) is a groove 22a inclined with respect to the axial direction of the scribing wheel along the blade tip ridge of the scribing wheel 22. ) Is formed periodically. By forming a groove in the blade ridge, the penetration depth in the crack thickness direction can be made deeper than in the case where the blade edge without a groove is used, and the groove formed can be inclined with respect to the shaft center to form a crack formed as an inclined crack. have.

By using the inclined grooved scribing wheel 22, a crack (scribe line) having a penetration depth of about 50% or more of the plate thickness can be easily formed if the plate thickness is about 2 mm. Can be. Further, as described later, the direction in which the scribing wheel 22 is rolled, as the crack penetrates in the depth direction so that when the inner contour (closed curve) is cut out, the inner side of the closed curve falls to allow the inner blanking process. It is inclined in the direction which spreads outward. Specifically, by rotating the scribing wheel 22 in the direction in which the deep side of the groove 22a faces the outside of the closed curve, the scribing wheel 22 is inclined in the direction of spreading out the closed curve as the crack penetrates in the depth direction.

The wheel support mechanism 23 incorporates a pressure load adjustment mechanism (not shown) using a spring, and adjusts the pressure contact force between the substrate G and the scribing wheel 22 having the inclined groove. The penetration depth of the inclined crack formed in the substrate G can be adjusted.

The arm 24 is supported by the frame 25, and in association with the X stage drive mechanism 16 and the Y stage drive mechanism 18, the scribing wheel 22 having an inclined groove for the table 11. Adjust the position of. That is, by adjusting the position of the inclined grooved scribing wheel 22 by the arm 24 and rotating the rotation stage 13, a circle (inner outline) having a desired diameter is formed on the substrate G. You can scribe. Moreover, by translating the X stage 15 and the Y stage 17 of the table 11, it moves to the position which can take over the board | substrate G between the transfer robot 5 (refer FIG. 1). It is supposed to be.

Next, the brake device 3 will be described. 3 is a diagram illustrating a schematic configuration of the brake device 3.

The brake device 3 consists of an annular plate 42 and an inner blanking mechanism 43. 4: is a figure which shows the structure of the annular plate 42, FIG. 4 (a) is a perspective view, FIG. 4 (b) is sectional drawing.

On the upper surface 46 of the annular plate 42 surrounded by the inner circumference circle and the outer circumference circle, a plurality of adsorption holes 47 are formed and can be fixed when the substrate G is placed. The heater 48 is built in the annular plate 42, and the area | region which contacts the upper surface 46 of the board | substrate G on which it was mounted is heated.

The center of the annular plate 42 has a hole having a diameter larger than the maximum diameter of the center region G0 so that it can fall when the center region G0 (original plate having a diameter of 15 mm) to be cut out from the substrate G is separated ( 49), and a hole 49 serving as an inner circumferential surface having a diameter of 20 mm is formed.

The inner blanking mechanism 43 includes an air jet 51 for supplying cooled air (refrigerant) through a supply line (not shown), a nozzle 52 for injecting cooled air, an air jet 51 and a nozzle The holder 53 which supports 52, and the lifting mechanism 55 which raises and lowers the holder 53 via the arm 54 are comprised. The tip portion of the nozzle 52 is formed of a resin (e.g., Teflon (registered trademark) resin) softer than the substrate G, and the substrate G is damaged when the nozzle 52 is in contact with the substrate G. It is not supposed to be. Moreover, the diameter d of the front-end | tip of the nozzle 52 is formed so that it may become smaller than the diameter D of the center area | region G0 of the board | substrate G, and the board | substrate G put on the annular plate 42 by this. Only the center area G0 of the head) can be pressed downward from the tip of the nozzle 52. In addition, a cushion mechanism is built in the holder 53, and when the nozzle 52 contacts the substrate G, a predetermined pressure or more is not applied to the substrate.

Next, the procedure of the inner circumferential processing method of the present invention using the scribe device 2 and the brake device 3 of the processing system MS1 will be described with reference to the drawings.

First, as shown in FIG. 5, with respect to the board | substrate G conveyed from the board | substrate carrying-in part 1 on the rotation stage 13 of the scribing apparatus 2, to the scribing wheel 22 with an inclined groove. As a result, the inner circumferential circle C1 serving as the inner contour is formed on the first surface of the substrate G. FIG. At this time, the inclined crack penetrates to about half the depth of the plate thickness of the substrate is formed, and the inclined crack is widened to the outside as it proceeds in the depth direction.

Subsequently, as shown in FIG. 6, it is conveyed from the scribe device 2 to the brake device 3 and placed on the annular plate 42. At this time, the transfer robot 5 places the board | substrate so that the position of the annular plate 42 and the center axis | shaft of the board | substrate G may be aligned so that the center area | region G0 of the board | substrate G may come on the hole 49.

Moreover, the annular plate 42 sets the temperature so that the center area | region G0 may not abruptly fall from the board | substrate G. As shown in FIG. In other words, excessive heating causes inclined cracks to penetrate to the rear surface and completely separate at this stage, so the temperature is set to avoid this. It is not necessary to heat when the board | substrate G is thin.

Subsequently, as shown in FIG. 7, the nozzle 52 of the brake device 3 is lowered while not injecting a coolant, and brought into contact with the substrate G so as to lightly apply the pressurization pressure W. At this time, the pressurization pressure applied as the pressurization pressure W is set so that the center area | region G0 may not fall abruptly from the board | substrate G.

Next, as shown in FIG. 8, the coolant J is injected from the nozzle 52 in the state which applied the pressurization pressure W, and the center area | region G0 is cooled.

As a result, due to the cooling action, the central region G0 contracts and the inclined crack penetrates. The center region then separates when the oblique crack reaches to the back. Therefore, in the state of lack of cooling, since the separation by forceful pressure does not occur forcibly, it becomes possible to perform separation which does not generate | occur | produce in an inner peripheral surface.

In the said embodiment, although the nozzle 52 which sprays a coolant is lowered and the pressurization pressure W was applied to the center area | region, you may provide a pressurization pressure by providing a rod-shaped press member separately from the nozzle 52. FIG.

In addition, although the refrigerant injection nozzle was used as a cooling means in the said embodiment, you may make it cool by a Peltier element.

In addition, in the said embodiment, although the inner peripheral process of about 15 mm in diameter was performed, you may perform the inner peripheral process of a smaller diameter. For example, it was confirmed that the inner circumferential processing can be performed with high reliability even at about 0.9 mm.

The inner circumferential processing is not limited to a circular shape, but may be an ellipse or other closed curve.

This invention can be used at the time of the inner periphery which cut | disconnects circular shapes etc. with respect to the brittle material substrates including a glass substrate.

1: board | substrate loading part
2: scribe device
3: Brake device
4 board | substrate carrying out part
5: carrier robot
11: table
12: scribe head
13: rotating stage
15: X stage
17: Y stage
22: scribing wheel with inclined groove
42: annular plate
43: inner blanking mechanism
48: heater
49: hole
51: Air Jet
52: nozzle
53: Holder
55 lifting mechanism

Claims (5)

(a) On the first surface of the brittle material substrate, using a scribing wheel having an inclined groove periodically formed on the blade ridge of the scribing wheel with a groove inclined with respect to the axial direction of the scribing wheel. A scribing step of forming a scribe line of an inner contour that becomes an inner circumference,
(b) a pressurizing step of supporting the substrate with a plate having a hole for making non-contact with the center region inside the inner contour, and applying pressurization to the center region;
(c) The inner peripheral processing method of a brittle material substrate which consists of an inner blanking process which cools and contracts the said center area | region and isolate | separates the said center area | region in the state in which pressurization was applied. The method of claim 1,
A method for processing an inner circumference of a brittle material substrate having a circular diameter of 15 mm or less. The method according to claim 1 or 2,
In the pressurization step of (b), the inner peripheral processing method of the brittle material substrate which heats the outer region of the inner contour with a heating mechanism provided on the plate. The method according to claim 1 or 2,
In the pressurization step of (b), the pressurization to the center region is applied by pressing the metal member on which the inflow path of the cooling medium is formed to the center region,
In the inner blanking step of (c), cooling of the central region is performed by introducing the cooling medium into the inflow path of the cooling medium of the metal member. The method of claim 3,
In the pressurization step of (b), the pressurization to the center region is applied by pressing the metal member on which the inflow path of the cooling medium is formed to the center region,
In the inner blanking step of (c), cooling of the central region is performed by introducing the cooling medium into the inflow path of the cooling medium of the metal member.

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