TWI439655B - 加熱器支撐裝置 - Google Patents
加熱器支撐裝置 Download PDFInfo
- Publication number
- TWI439655B TWI439655B TW100116455A TW100116455A TWI439655B TW I439655 B TWI439655 B TW I439655B TW 100116455 A TW100116455 A TW 100116455A TW 100116455 A TW100116455 A TW 100116455A TW I439655 B TWI439655 B TW I439655B
- Authority
- TW
- Taiwan
- Prior art keywords
- support
- support member
- members
- support members
- concave
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 claims description 63
- 239000012212 insulator Substances 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000009413 insulation Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Furnace Details (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108968 | 2010-05-11 | ||
| JP2011058673A JP5787563B2 (ja) | 2010-05-11 | 2011-03-17 | ヒータ支持装置及び加熱装置及び基板処理装置及び半導体装置の製造方法及び基板の製造方法及び保持用ピース |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201207344A TW201207344A (en) | 2012-02-16 |
| TWI439655B true TWI439655B (zh) | 2014-06-01 |
Family
ID=44912091
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103114186A TWI555959B (zh) | 2010-05-11 | 2011-05-11 | 加熱器支撐裝置、加熱器、半導體製造設備、半導體製造方法及支撐構件 |
| TW100116455A TWI439655B (zh) | 2010-05-11 | 2011-05-11 | 加熱器支撐裝置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103114186A TWI555959B (zh) | 2010-05-11 | 2011-05-11 | 加熱器支撐裝置、加熱器、半導體製造設備、半導體製造方法及支撐構件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9779970B2 (enExample) |
| JP (1) | JP5787563B2 (enExample) |
| KR (3) | KR101273843B1 (enExample) |
| TW (2) | TWI555959B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646297B (zh) * | 2018-01-24 | 2019-01-01 | 鴻成國際科技股份有限公司 | 加熱器支撐裝置 |
| CN110087354A (zh) * | 2018-01-26 | 2019-08-02 | 鸿成国际科技股份有限公司 | 一种加热器支撑装置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014186833A (ja) * | 2013-03-22 | 2014-10-02 | Tokyo Electron Ltd | ヒータ装置及び熱処理装置 |
| CN104253064A (zh) * | 2013-06-28 | 2014-12-31 | 上海华虹宏力半导体制造有限公司 | 一种半导体熔炉加热器固定装置 |
| KR101466816B1 (ko) * | 2013-09-23 | 2014-12-10 | 국제엘렉트릭코리아 주식회사 | 히터 부재 및 그것을 갖는 기판 처리 장치 |
| CN110081712B (zh) * | 2019-05-14 | 2024-04-30 | 广东世创金属科技股份有限公司 | 一种搁丝砖及低热损、高热效电热结构 |
| CN112333855B (zh) * | 2019-08-05 | 2023-02-28 | 信和发瑞斯股份有限公司 | 线圈型加热结构 |
| CN112461005A (zh) * | 2019-09-09 | 2021-03-09 | 信源陶磁股份有限公司 | 热处理设备载具防破裂的结构及其方法 |
| KR20240072549A (ko) * | 2022-11-17 | 2024-05-24 | 주식회사 불카누스 | 배기라인용 히팅 파이프 |
| CN120313356A (zh) * | 2024-01-12 | 2025-07-15 | 北京北方华创微电子装备有限公司 | 炉体结构和半导体工艺设备 |
| CN118299324A (zh) * | 2024-03-15 | 2024-07-05 | 北京北方华创微电子装备有限公司 | 支撑装置、加热器和半导体工艺设备 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3846619A (en) * | 1973-11-12 | 1974-11-05 | Emerson Electric Co | Open coil electric heater |
| JPH0110921Y2 (enExample) * | 1984-11-05 | 1989-03-29 | ||
| JPS6410921U (enExample) | 1987-07-08 | 1989-01-20 | ||
| JPH079036Y2 (ja) * | 1990-11-13 | 1995-03-06 | 東京エレクトロン東北株式会社 | 縦型熱処理炉 |
| US5578232A (en) * | 1995-05-04 | 1996-11-26 | Hart & Cooley, Inc. | Open-coil heater assembly and insulator therefor |
| JP3848442B2 (ja) * | 1997-08-20 | 2006-11-22 | 株式会社日立国際電気 | ヒータ支持装置及び半導体製造装置及び半導体装置の製造方法 |
| US6596974B2 (en) * | 2000-09-21 | 2003-07-22 | Tutco, Inc. | Support apparatus for resistive coils and insulators in electric heaters |
| US20070169701A1 (en) | 2006-01-21 | 2007-07-26 | Integrated Materials, Inc. | Tubular or Other Member Formed of Staves Bonded at Keyway Interlocks |
| JP4145328B2 (ja) * | 2006-04-05 | 2008-09-03 | 株式会社日立国際電気 | ヒータ支持装置及び加熱装置及び半導体製造装置及び半導体装置の製造方法 |
| KR20060133505A (ko) * | 2006-11-17 | 2006-12-26 | 에이스하이텍 주식회사 | 열처리 장치의 히터 어셈블리 |
| JP5096182B2 (ja) * | 2008-01-31 | 2012-12-12 | 東京エレクトロン株式会社 | 熱処理炉 |
-
2011
- 2011-03-17 JP JP2011058673A patent/JP5787563B2/ja active Active
- 2011-05-05 US US13/101,625 patent/US9779970B2/en active Active
- 2011-05-09 KR KR1020110043653A patent/KR101273843B1/ko active Active
- 2011-05-11 TW TW103114186A patent/TWI555959B/zh active
- 2011-05-11 TW TW100116455A patent/TWI439655B/zh active
-
2012
- 2012-10-22 KR KR1020120117401A patent/KR101319197B1/ko active Active
-
2013
- 2013-04-22 KR KR1020130044188A patent/KR101353231B1/ko active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646297B (zh) * | 2018-01-24 | 2019-01-01 | 鴻成國際科技股份有限公司 | 加熱器支撐裝置 |
| CN110087354A (zh) * | 2018-01-26 | 2019-08-02 | 鸿成国际科技股份有限公司 | 一种加热器支撑装置 |
| CN110087354B (zh) * | 2018-01-26 | 2022-05-03 | 鸿成国际科技股份有限公司 | 一种加热器支撑装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201430307A (zh) | 2014-08-01 |
| KR101273843B1 (ko) | 2013-06-11 |
| TW201207344A (en) | 2012-02-16 |
| KR101353231B1 (ko) | 2014-01-17 |
| US9779970B2 (en) | 2017-10-03 |
| KR20120131136A (ko) | 2012-12-04 |
| JP5787563B2 (ja) | 2015-09-30 |
| KR101319197B1 (ko) | 2013-10-16 |
| TWI555959B (zh) | 2016-11-01 |
| US20110281226A1 (en) | 2011-11-17 |
| KR20130062301A (ko) | 2013-06-12 |
| KR20110124719A (ko) | 2011-11-17 |
| JP2011258544A (ja) | 2011-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI439655B (zh) | 加熱器支撐裝置 | |
| CN107004619B (zh) | 用以减少边缘热峰的基座设计 | |
| US20180223424A1 (en) | Deposition apparatus | |
| TWI425584B (zh) | 熱處理爐 | |
| JP6539929B2 (ja) | ウェハ支持機構、化学気相成長装置およびエピタキシャルウェハの製造方法 | |
| KR20150110207A (ko) | 보트 | |
| WO2007023855A1 (ja) | 基板処理装置及びこれに用いられる加熱装置並びにこれらを利用した半導体の製造方法 | |
| CN100511589C (zh) | 隔热壁体、发热体保持构造体、加热装置及基板处理装置 | |
| TW201814823A (zh) | 用於寬範圍溫度控制的加熱器基座組件 | |
| JPH1167424A (ja) | ヒータ支持装置 | |
| JP2006100755A (ja) | 基板処理装置並びに基板処理装置用電気ヒーター及びこれを備えた基板処理装置 | |
| TWI646297B (zh) | 加熱器支撐裝置 | |
| WO2007084492A2 (en) | Tubular or other member formed of staves bonded at keyway interlocks | |
| KR102399208B1 (ko) | 측벽으로부터의 피처부들을 갖는 프로세싱 챔버 | |
| KR101361711B1 (ko) | 공정챔버의 지지유닛 및 이를 포함하는 기판처리장치 | |
| KR20250169195A (ko) | 유지 메커니즘을 갖는 시일 조립체 | |
| CN106030779A (zh) | 平台支撑结构 | |
| TW202534841A (zh) | 用於碳化矽基板的基座 | |
| JP2006344997A (ja) | 基板処理装置および基板処理方法 | |
| JP5383752B2 (ja) | 断熱壁体、加熱装置、基板処理装置および半導体装置の製造方法 | |
| JP2011202865A (ja) | 基板処理装置 | |
| JP2008078459A (ja) | 基板処理装置 |