TWI438455B - Substrate testing device - Google Patents

Description

Substrate inspection device

The present invention relates to a substrate inspection apparatus for inspecting electrical characteristics between a plurality of wiring patterns provided on a substrate to be inspected.

Further, the present invention is not limited to the inspection of the printed wiring board, and can be applied, for example, to the inspection of the flexible wiring board, the multilayer wiring board, the liquid crystal display or the electrode board for a plasma display, and the electric wiring in various substrates such as a package substrate for a semiconductor package or a film carrier. In the present specification, the various wiring boards are referred to as "substrates".

When there is a fine short-circuit portion between the wiring patterns to be inspected, if a general potential difference occurs between the wiring patterns, the fine short-circuit portion may be burnt due to an overcurrent, and thus there may be problems such as insulation failure. The problem that the substrate is erroneously determined to be normal is checked.

In this regard, as a conventional substrate inspection device, there is a case where the potential difference applied to the wiring pattern is changed stepwise, thereby preventing over-current burnout at the insulation defect of the wiring pattern, and at the same time performing inspection (for example, a patent) Document 1).

For example, in the first-stage short-circuit test, the potential difference between the wiring patterns is set to be a false short circuit between the adjacent wiring patterns, or the small short-circuit portion is short-circuited due to the short thin portion, and the minimum short-circuit portion is not caused by The value of the current burned by a very small short circuit. Short circuit in stage 2 In the test, the potential difference between the wiring patterns is set to be higher than the potential difference of the first stage, and is used to detect a value of current leakage due to a spark between adjacent wiring patterns.

When the inspection is performed on the plurality of wiring patterns of the substrate to be inspected, the first stage inspection of the extremely small short-circuit portion and the second-stage inspection of the current leakage due to the spark are performed on the plurality of wiring patterns. The attention wiring pattern in which any of the wiring patterns is the inspection object is set in the same order.

More specifically, for example, in any of the first stage and the second stage, the wiring pattern having a large wiring area is sequentially set as the attention wiring pattern. In addition, since the wiring area of the plurality of wiring patterns is large, the wiring pattern is set as the attention wiring pattern, and the wiring pattern which is set as the attention wiring pattern at each time point is set as the attention wiring pattern at the time of the plurality of wiring patterns. A potential difference is applied between the wiring pattern and the wiring pattern formed by the wiring pattern other than the wiring pattern which has been set as the attention wiring pattern in the inspection, and the electrical characteristics between the attention wiring pattern and the opposing wiring pattern are checked. In addition, since the wiring pattern having a large wiring area is sequentially set to the attention of the wiring pattern, it takes time to apply a potential difference to the wiring pattern having a large wiring area and to charge and discharge the charge when the wiring is removed. Therefore, it is possible to reduce the potential difference of the wiring pattern having a large wiring area. The number of times (charge and discharge) is such that the inspection speed is increased.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-139036

Such a substrate inspection apparatus requires a large number of substrates to be inspected in a short period of time. Therefore, the industry is strongly required to speed up the inspection speed, and the time taken for each inspection step performed by each of the attention wiring patterns tends to be gradually shortened. On the other hand, the speed of inspection speed tends to be easy to detect due to The change in the undesired current used to perform the charge and discharge of the test causes the test result to be misjudged. Therefore, how to achieve high speed of inspection without reducing the reliability of inspection becomes a problem.

In this regard, the inventor of the present application has found that, by the above-described conventional technique, the attention wiring pattern of the inspection object is set for any of the plurality of wiring patterns, regardless of the first-stage inspection and the second-stage inspection. When the inspection is performed in the same order, the inspection speed is now no problem, but in the future, when the speed of inspection is more advanced, it is easy to detect the charge and discharge caused by the inspection. Undesirable changes in current lead to erroneous determination of test results. Specifically, when the wiring pattern having a large wiring area is sequentially set as the configuration of the attention wiring pattern, the inspection speed can be improved in the first-stage inspection in which the potential difference is small, but the second potential difference is given. In the phase test, although current leakage does not occur due to the spark, the current meter detects the discharge current and determines that there is a erroneous determination that the current leaks.

In the above-described conventional example, the order of selecting the attention wiring pattern for the plurality of wiring patterns is determined according to the wiring pattern wiring area. However, in addition to the wiring pattern wiring area, the contact contact pins of the contact wiring pattern and the wires connecting the contact pins and the like are electrostatically charged. The capacitance also greatly affects the charge and discharge characteristics when the potential difference is applied to the wiring pattern and the release is released. Therefore, in the conventional example, when the order of selection of the attention wiring pattern is determined, the influence of the electrostatic capacitance such as the contact pin and the lead wire is not sufficiently considered.

In such a substrate inspection device, there is a case where a plurality of current detecting portions are sometimes provided, and there is a problem in that the frequency of use is biased toward a part of the current detecting portion, so that deterioration of a part of the current detecting portion is easier than that of other current detecting portions.

Here, the first object to be solved by the present invention is to provide a substrate inspection apparatus which can detect the electrical characteristics between the plurality of wiring patterns provided on the substrate to be inspected, and can provide a potential difference to each wiring pattern and release the contact wiring when the wiring is applied. The electrostatic capacitance of the contact pin of the pattern determines the order of the electrical characteristic inspection of the plurality of wiring patterns, and the reliability of the inspection result can be improved without reducing the reliability of the inspection result.

A second object to be solved by the present invention is to provide a substrate inspection apparatus capable of preventing a frequency detecting portion that is biased toward a part of a plurality of current detecting units.

In the substrate inspection apparatus according to the first aspect of the present invention, the potential difference is applied between the plurality of wiring patterns provided on the substrate to be inspected, and the inspection signal is taken out at the same time, thereby verifying the electrical characteristics between the wiring patterns. The method includes a plurality of contact pins that are in contact with a plurality of inspection points set on the wiring patterns provided on the substrate to be inspected, and a power supply unit that applies a potential difference between the wiring patterns via the plurality of contact pins, and is changeable Providing a potential difference between the wiring patterns; the detecting portion detects a signal regarding electrical characteristics between the wiring patterns by the plurality of contact pins; and connecting the switching portion, comprising a plurality of switching elements, by turning on and off the respective The switching element switches the electrical connection between the plurality of contact pins and the power supply unit and the detecting unit; and the control unit controls the plurality of switching elements of the power supply unit and the connection switching unit, and according to the detecting unit The detection result checks the electrical characteristics between the wiring patterns; and the control unit performs a verification processing operation to perform electric power between the wiring patterns The bit difference value is a complex electrical characteristic test that gives a difference in the potential difference. In the complex test processing operation performed by the control unit, the complex number is sequentially set as the attention wiring pattern in the complex inspection process in the verification processing operation. And a wiring pattern which is set as the attention wiring pattern at the time of each of the wiring patterns, and a wiring pattern which is set as the attention wiring pattern at the time of the plurality of wiring patterns and In the inspection processing operation, the matching wiring pattern formed by the wiring pattern other than the wiring pattern of the attention wiring pattern is provided, and the power supply unit supplies the potential difference value corresponding to the inspection processing operation via the contact pin. a potential difference, and verifying an electrical characteristic between the target wiring pattern and the opposite wiring pattern according to a detection result of the detecting portion, wherein the electrical characteristic test is performed when the potential difference value does not reach a predetermined reference level in the complex electrical characteristic test In the plurality of wiring patterns, the number of the contact pins contacting the wiring pattern is set to be the same in order Wiring pattern, the plurality of electrical characteristics of the inspection with the potential difference in the predetermined In the electrical characteristic test of the reference level or more, in the plurality of wiring patterns, the number of the contact pins of the contact wiring pattern is set to be the attention wiring pattern in order.

Further, in the substrate inspection apparatus according to the second aspect of the present invention, the potential difference is applied between the plurality of wiring patterns provided on the substrate to be inspected, and the inspection signal is taken out at the same time, thereby checking the electrical characteristics between the wiring patterns. The plurality of contact pins are in contact with a plurality of inspection points set on the respective wiring patterns provided on the substrate to be inspected, and the power supply unit applies a potential difference between the wiring patterns via the plurality of contact pins, and the wiring pattern can be changed and given a potential difference between the detecting portion, the signal for detecting electrical characteristics between the wiring patterns by the plurality of contact pins; and a connection switching portion including a plurality of switching elements, wherein the switching elements are switched by turning on and off the switching elements a plurality of contact pins, and an electrical connection relationship between the power supply unit and the detecting unit; and a control unit that controls the plurality of switching elements of the power supply unit and the connection switching unit, and according to the detection result of the detecting unit Verifying electrical characteristics between the wiring patterns; and the control unit performs a verification processing operation to impart a potential difference between the wiring patterns In the complex inspection process performed by the control unit, the complex electrical characteristic test having the difference in potential difference is used to sequentially set the complex wiring pattern as the attention wiring pattern in the complex inspection process in the verification processing operation. And in each of the inspection steps, the wiring pattern set to the attention wiring pattern at the time, and the wiring pattern set to the attention wiring pattern at the time of the plurality of wiring patterns and within the inspection processing operation Between the opposing wiring patterns formed by the wiring patterns other than the wiring pattern of the attention wiring pattern, the power supply unit supplies a potential difference corresponding to the potential difference value corresponding to the inspection processing operation via the contact pin, according to the Detector The detection result of the measuring unit checks the electrical characteristics between the attention wiring pattern and the relative wiring pattern, and the plurality of electrical characteristic tests include the first type and the second type of short-circuit test, and in the one type of short-circuit test, the assignment is set. The potential difference is a pseudo short circuit between the adjacent wiring patterns, or a very small short-circuit guide due to a short thin portion short circuit And not because of the minimal short-circuiting portion short-circuit current at the minimum value of the burned portion of the flow, In the second short-circuit test, the applied potential difference is set to be higher than the applied potential difference of the first short-circuit test, and is used to detect a value of current leakage caused by a spark between adjacent wiring patterns. In the first short-circuit inspection, the number of the contact pins contacting the wiring pattern is set to be the attention wiring pattern in the plurality of wiring patterns, and the second wiring is used in the second short-circuit inspection. In the pattern, the number of the contact pins of the contact wiring pattern is set to be the attention wiring pattern in order.

Further, in the substrate inspection device according to the third aspect of the present invention, the substrate inspection device according to the first or second aspect of the present invention, wherein, in the plurality of inspection processing operations performed by the control unit, the complex electrical characteristic is checked from the small difference in the applied potential difference Start in order.

The substrate inspection apparatus according to any one of the first to third aspects of the present invention, wherein the detection unit includes a plurality of current detecting units, and the plurality of current detecting units are respectively assigned to The plurality of contact pins are divided into a plurality of groups of contact pins, and the contact pins belonging to the corresponding contact pin groups are detected to flow between the target wiring pattern or the opposite wiring pattern and the power supply portion. Current, The control unit selects the current detecting unit of the detecting unit for detecting the current in each of the electrical characteristic tests, and disperses the frequency of use of the complex current detecting unit.

According to the substrate inspection apparatus according to the first aspect of the present invention, the order of selecting the attention wiring pattern for the plurality of wiring patterns in each electrical characteristic inspection is determined according to the number of contact pins that contact the wiring pattern at the time of inspection. The larger the wiring pattern wiring area is, the more the contact pin number of the contact wiring pattern tends to be. Therefore, by determining the order of the attention wiring pattern according to the number of contact pins, the wiring pattern, the contact pin contacting the wiring pattern, and the contact pin can be connected. The overall capacitance of the wire or the like determines the order in which the attention wiring pattern is selected.

And in the electrical characteristic test in which the potential difference value is not up to the predetermined reference level, the number of contact pins of the contact wiring pattern is set to be the same as the number of contact pins in the plurality of wiring patterns. In the electrical characteristic test in which the potential difference value is equal to or greater than the predetermined reference level in the verification of the plurality of electrical characteristics, the number of contact pins of the contact wiring pattern is set as the attention wiring pattern in order from the plurality of wiring patterns. Therefore, in the electrical characteristic test in which the potential difference value does not reach the predetermined reference level in the verification of the plurality of electrical characteristics, there are many contact pins that are in contact with each other, and the wiring pattern including the contact pin or the like having a large overall capacitance is sequentially set as the attention. By the wiring pattern, it is possible to suppress the potential difference from being applied to the wiring pattern having a large overall capacitance and the number of times of the release. As a result, it is possible to shorten the time required for the potential difference to be applied to the wiring pattern and to release the time (the time required for charge and discharge, etc.), and to increase the speed of the inspection. On the other hand, in the electrical characteristic test in which the potential difference value is equal to or higher than the predetermined reference level, the number of contact pins to be contacted is small, and the wiring pattern including the contact pin or the like having a small overall capacitance is sequentially set as By paying attention to the wiring pattern, it is possible to suppress erroneous determination of the inspection result and to reduce the reliability of the avoidance test. As a result, the reliability of the test result can be not reduced, and the test speed is improved.

According to the substrate inspection apparatus according to the second aspect of the present invention, the order of selecting the attention wiring pattern for the plurality of wiring patterns in each electrical characteristic inspection is determined according to the number of contact pins of the contact wiring pattern at the time of inspection. The larger the wiring pattern wiring area, the more the number of contact pins contacting the wiring pattern tends to be. Therefore, the order of selection of the attention wiring pattern is determined according to the number of contact pins, and the wiring pattern, the contact pin contacting the wiring pattern, and the contact pin can be connected. The overall capacitance of the wire or the like determines the order in which the attention wiring pattern is selected.

In the first type of short-circuit test in which the value of the contact potential is set to a small value corresponding to the inspection of the extremely short-circuit portion between the wiring patterns, the number of contact pins of the contact wiring pattern is set in order from the plurality of wiring patterns. In the second short-circuit test in which the potential difference value is set to a larger value corresponding to the test for causing current leakage due to the spark between the wiring patterns, the contact pin of the contact wiring pattern is selected from the plurality of wiring patterns. The smaller number is set as the attention wiring pattern in order. Therefore, in the first type of short-circuit test in which the potential difference is small, the number of contact pins to be contacted is large, and the wiring pattern including the contact pin or the like having a large overall capacitance is sequentially set as the attention wiring pattern, thereby suppressing the overall alignment. The wiring pattern having a large electrostatic capacitance gives a potential difference and the number of times of the release. As a result, it is possible to shorten the time required for the potential difference to be applied to the wiring pattern and to release the time (the time required for charge and discharge, etc.), and to increase the speed of the inspection. On the other hand, the difference in potential is given In the second type of short-circuit test, the number of contact pins to be contacted is small, and the wiring pattern including the contact pin or the like having a small overall capacitance is sequentially set as the attention wiring pattern, thereby suppressing erroneous determination of the inspection result and reliably avoiding the inspection. Degree is reduced. As a result, the reliability of the test result can be improved without increasing the test speed.

According to the substrate inspection apparatus according to the third aspect of the present invention, the plurality of electrical characteristic tests are sequentially performed from the case where the potential difference is small, so that the minimum short-circuit portion can be avoided due to overcurrent burning during the inspection, and at the same time, the electrical wiring between the wiring patterns Characteristics are tested.

According to the substrate inspection apparatus of the fourth aspect of the present invention, the current detecting unit for detecting the current in each of the inspection steps is selected in each of the electrical characteristic tests, and the frequency of use of the complex current detecting unit is dispersed. The frequency of use can be prevented from being biased toward a part of the current detecting portion, and the deterioration of a part of the current detecting portion is prevented from being faster than that of other current detecting portions.

A, A1-A4‧‧‧ Current Detection Department

N, N1-N4, Na1-Na4‧‧‧ wiring pattern

P, P1, P2, P1-P64, P65-P128, P129-P192, P193-P256‧‧‧ contact pin

PG, PG1, PG2‧‧‧ sales group

Sa1-Sa3, Sb1-Sb3‧‧‧ inspection steps

ST1, ST2‧‧‧ steps

SW1, SW2, SW2a-SW2c, SWb‧‧‧ switching elements

V‧‧‧potential difference detection unit

1‧‧‧Substrate inspection device

2‧‧‧Tested substrate

11‧‧‧Power Department

12‧‧‧Connection Switching Department

13‧‧‧Control Department

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the electrical configuration of a substrate inspection apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view showing the configuration of a wiring pattern provided on a substrate to be inspected.

Fig. 3 is a view showing an example of the correspondence relationship between the wiring pattern of the substrate to be inspected of Fig. 2 and the number of contact pins contacting the wiring pattern.

4 is a flow chart showing the inspection sequence of the substrate inspection apparatus of FIG. 1.

Fig. 5 is a view for explaining the order of setting the attention wiring pattern and the relative wiring pattern in each of the first and second short-circuit inspection inspection steps.

Fig. 6 is a view showing a modification of the substrate inspection device of Fig. 1 for explaining a use form of the complex current detecting portion.

A substrate inspection apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 to 5 . As shown in FIGS. 1 and 2, the substrate inspection apparatus 1 includes a plurality of contact pins P1, P2, ... (collectively referred to as such In the case of the symbol "P"), the power supply unit 11, the complex current detecting units A1, A2, ... (the symbol "A" is used when referring to these), the potential difference detecting unit V, the connection switching unit 12, and the control unit 13 The electric potential between the wiring patterns N is checked by applying a potential difference between the plurality of wiring patterns N1, N2, ... (the symbol "N" used in the case of the above-mentioned substrate 2) and taking out the inspection signal. In the detecting unit of the present invention, the current detecting unit A and the potential difference detecting unit V correspond to each other.

1 or a plurality of contact pins P contact the respective wiring patterns N provided on the substrate 2 to be inspected in accordance with the role of the wiring pattern N (power supply wiring, ground wiring, signal wiring, etc.) and the form (wiring length, wiring shape, etc.) at the time of inspection. At this time, the wiring pattern N having a larger wiring area tends to contact the contact pin P which is more contacted. In the example shown in FIG. 2, the two contact pins P contact the wiring pattern N1, and the three contact pins P contact the wiring pattern N2.

The contact pin P is used to form an electrical connection point with respect to each of the wiring patterns N of the substrate inspection apparatus 1, and is held together with the holding member by a lifting mechanism or the like (not shown) while being held by an insulating holding member (not shown). At the time of inspection, the front end portion contacts the corresponding contact point of the wiring pattern N. The rear end portion of the contact pin P is electrically connected to the wire on the main body side of the connection substrate inspection device 1 via the electrode portion. Further, the contact pin P is divided into a plurality of pin groups PG1, PG2, ... formed by the plurality of contact pins P (the symbol "PG" is used when referring to these).

The power supply unit 11 is provided with a potential difference for detecting electrical characteristics between the wiring patterns N between the respective wiring patterns N via the contact pins P under the control of the control unit 13 to be described later. The magnitude of the potential difference applied between the wiring patterns N by the power supply unit 11 can be changed by the control of the control unit 13.

The current detecting unit A is disposed one by one in each of the pin groups PG, and is provided as a whole, and detects a current flowing between the wiring pattern N and the power supply unit 11 via the contact pin P of the corresponding pin group PG. The control unit 13 detects the result. The current detecting unit A is inserted into a conductive path connecting, for example, the switching element SW2a of the second stage of the connection switching unit 12 and the output unit (for example, the positive side output unit) of the power supply unit 11. Further, as a modification, the current detecting unit A may be inserted in a conductive path between the switching element SW2b of the second stage connected to the connection switching unit 12 and the other side output unit (for example, the negative side output unit) of the power supply unit 11. .

The potential difference detecting unit V detects the potential difference given between the wiring patterns N by the power supply unit 11 by the contact pin P, and gives the control unit 13 a detection result.

Further, in the present embodiment, both the current detecting unit A and the potential difference detecting unit V are provided, but the potential difference between the respective wiring patterns N can be obtained based on the output potential difference or the output current value of the power supply unit 11. When the information on the current value of the attention wiring pattern is supplied from the power supply unit 11, one of the current detecting unit A and the potential difference detecting unit V may be omitted.

The connection switching unit 12 includes a plurality of switching elements (for example, semiconductor switching elements) SW1 and SW2 that are turned on and off by the control of the control unit 13. Moreover, the electrical connection relationship between each contact pin P and the apparatus main body side configuration (the power supply unit 11, the current detecting unit A, and the potential difference detecting unit V) is switched by turning on and off the switching elements SW1 and SW2. In the present embodiment, the complex switching element SW1 and the complex switching element SW2 are formed in a two-stage configuration.

The first switching element SW1 is provided in each of the contact pins P, and the switching pin SW1 is turned on, and the contact pin P of the plurality of contact pins P corresponding to the switching element SW1 is connected to the main body side of the device via the second switching element SW2. (Power supply unit 11, current detecting unit A, and potential difference detecting unit V).

The second-stage switching element SW2 is provided one by one for each pin group PG. When one of the three switching elements SW2 is turned on, the contact pin P corresponding to the pin group PG of the three switching elements SW2 is connected to one side output terminal of the power supply unit 11 via the first switching element SW1 (for example, positive The side output terminal), the other side output terminal of the power supply unit 11 (for example, the negative side output terminal), and the ground potential. For example, when the switching element SW2a is turned on, the contact pin P corresponding to the pin group PG is connected to one side output terminal (for example, the positive side output terminal) of the power supply unit 11 via the first switching element SW1. When the switching element SW2b is turned on, the contact pin P corresponding to the pin group PG is connected to the other side output terminal (for example, the negative side output terminal) of the power supply unit 11 via the first switching element SW1. When the switching element SW2c is turned on, the contact pin P corresponding to the pin group PG is connected to the ground potential via the first-stage switching element SW1.

The control unit 13 dictates the control of the substrate inspection apparatus 1 and the inspection processing for the substrate 2 to be inspected. The control operation of the control unit 13 includes turning on and off the output of the power supply unit 11, and changing or adjusting the magnitude of the potential difference between the wiring patterns N by the power supply unit 11, and turning on the switching elements SW1 and SW2 of the connection switching unit 12, The cutting operation switches the electrical connection relationship between the plurality of contact pins P and the apparatus main body side configuration (the power supply unit 11, the current detecting unit A, and the potential difference detecting unit V).

The inspection process controlled by the control unit 13 includes a verification processing operation for performing a complex electrical characteristic test in which the potential difference values of the potential differences between the wiring patterns N are different. In each of the inspection processing operations, in the plurality of inspection steps in the inspection processing operation, one of the plurality of wiring patterns N is sequentially set as the attention wiring pattern. In the respective inspection steps, the wiring pattern N set to the attention wiring pattern is formed at the time point, and the wiring pattern N set to the attention wiring pattern at the time of the plurality of wiring patterns N is within the inspection processing operation. The potential difference between the opposing wiring patterns formed by the wiring pattern N other than the wiring pattern N of the attention wiring pattern N is set to the potential difference of the potential difference corresponding to the inspection processing operation via the contact pin P via the power supply unit 11. Moreover, the electrical characteristics (insulation in the present embodiment) between the attention wiring pattern and the opposite wiring pattern are checked based on the detection results of the current detecting unit A and the potential difference detecting unit V.

The inspection of the insulation between the attention wiring pattern and the opposing wiring pattern is performed, for example, as follows. That is, the potential difference is given by the power supply unit 11 between the two wiring patterns. At this time, the potential difference detecting portion V detects the potential difference between the two wiring patterns, and the current detecting portion A detects between the two wiring patterns. Current flowing. Further, the virtual resistance value is divided by the detected potential difference, and the virtual resistance value between the two wiring patterns is calculated. If the resistance value is greater than or equal to the reference resistance value of the determination criterion, the resistance value is determined to be appropriate, and the resistance value is less than the reference value. The resistance value was judged to be defective. Further, the reference resistance value of the determination criterion is preferably set to the value of the corresponding test object for each electrical characteristic test.

And the plurality of electrical property tests are sequentially performed from the case where the potential difference is small.

In the electrical characteristic test in which the potential difference value is not higher than the predetermined reference level in the verification of the plurality of electrical characteristics, the number of contact pins P contacting the wiring pattern N in the plurality of wiring patterns N is sequentially set as the attention wiring pattern. On the other hand, in the complex electrical property test, the potential difference is given at a given base. In the electrical characteristic test of the above-described level, the number of contact pins P contacting the wiring pattern N in the plurality of wiring patterns N is set as the attention wiring pattern in order.

More specifically, in the present embodiment, the first type and the second type of short-circuit test are performed as the complex electrical characteristic test. In the first short-circuit test, the potential difference is set to be a false short between the adjacent wiring patterns N, or a small short-circuit portion that is short-circuited by a fine thin portion is turned on, and the extremely short-circuit portion is not caused by the extremely short-circuit portion. The value of current burnout (the first potential difference). In the second type of short-circuit test, the difference between the applied potentials is set to be higher than the applied potential difference of the first short-circuit test, and the value of the current leakage due to the spark between the adjacent wiring patterns is detected (the second applied potential difference). Further, the reference level with respect to the potential difference value is set to a value larger than the first applied potential difference value and equal to or lower than the second applied potential difference value (for example, 150 to 250 V). Further, in the present embodiment, two types of electrical characteristic tests including the first and second short-circuit tests are performed as the complex electrical characteristic test, but three or more types of electrical characteristics may be tested.

Therefore, in the first short-circuit test in which the potential difference is small, the number of contact pins P that contact the wiring pattern N in the plurality of wiring patterns N is sequentially set as the attention wiring pattern. In the second short-circuit test in which the potential difference is large, the number of contact pins P that contact the wiring pattern N in the plurality of wiring patterns N is sequentially set as the attention wiring pattern.

More specifically, in the first type of short-circuit test, it is checked whether or not there is a false short circuit between the wiring patterns N or an insulation failure due to a very small short-circuit portion of a short thin portion short-circuited. The extremely short-circuit portion includes the minute short-circuit portion shown in FIGS. 3(a) and 3(b) of Patent Document 1 described in the present specification, and the suspected short-circuit portion as shown in FIG.

The fine short-circuit portion is caused by, for example, an etching residue left after the etching process of the wiring pattern N is performed, and the unnecessary wiring material is not completely removed. Since the thickness of such a fine short-circuit portion is as small as, for example, a micron order or the like, if a large potential difference is applied to the wiring pattern N during the short-circuit inspection, the current flowing in the minute short-circuit portion may be burned out. The resistance value of such a minute short-circuit portion is mostly about 100 Ω or less.

The suspected short-circuit portion causes the adjacent wiring pattern N to be short-circuited and causes insulation failure, and is formed intermittently between the adjacent wiring patterns N as a bridge, and the potential difference applied to the suspected short-circuit portion increases from the non-conduction state. It is a bad state of conduction. Such a suspected short-circuit portion is formed by, for example, intermittently connecting between adjacent wiring patterns N, or a plurality of fine conductor particles or fine conductor sheets (for example, a fine conductor powder or a fine conductor sheet composed of a material of the wiring pattern N). Composition. Further, even in the case of such a short-circuited portion, if a large potential difference is applied to the wiring pattern N during the short-circuit inspection, the current flowing in the suspected short-circuit portion may be burned out. It is thus suspected that the resistance value of the short-circuit portion is mostly from about 10 MΩ to about 100 MΩ.

In the second type of short-circuit test, the insulation failure between the wiring patterns N is checked by detecting the presence or absence of the adjacent wiring pattern N due to the current leakage caused by the spark. In the insulation defect where the current leaks due to the spark, the pattern approaching portion shown in FIG. 5 of Patent Document 1 of the present specification is exemplified. The pattern approaching portion of FIG. 5 is caused by a pattern defect or the like when the wiring pattern N is formed, and is a portion where the adjacent wiring patterns N are abnormally close to each other, and insulation failure is caused by the spark. The resistance value of the pattern approaching portion is substantially infinite before the spark is generated, and the spark is generated at a finite value corresponding to the gap size or the like, for example, about 1 MΩ.

Next, as a specific example, a case will be described in which the first type and the second type of short-circuit inspection are performed on the four wiring patterns N1 - N4 shown in the table of FIG. According to the table of Fig. 3, the wiring pattern N1 contacts the two contact pins P, the wiring pattern N2 contacts the three contact pins P, the wiring pattern N3 contacts the five contact pins P, and the wiring pattern N4 contacts the seven contact pins P.

The procedure of the inspection is as shown in Fig. 4. After the first short-circuit test is performed in step ST1, the second short-circuit test is performed in step ST2.

In the first short-circuit test, the potential difference value given between the target wiring pattern and the opposite wiring pattern by the power supply unit 11 is set to be the first applied potential difference value (for example, 10 V), as shown in the upper part of the table of FIG. The order of the inspection step Sa1, the inspection step Sa2, and the inspection step Sa3 progresses.

In the inspection step Sa1, the wiring pattern N4 having the largest number of contact pins P (hereinafter referred to as "pin number") is set as the attention wiring pattern, and all the other wiring patterns N1 - N3 are set as the opposite wiring patterns, and the wiring pattern N4 is performed. Insulation inspection of a very short circuit between the wiring patterns N1-N3. As a specific operation, for example, the first switching element SW1 of the connection switching unit 12 corresponding to the contact pin P of the contact wiring patterns N1 - N4 is turned on, and the contact pin P of the second switching element SW2 that is in contact with the contact wiring pattern N4 is turned on. Any of the switching elements SW2a turns on any one of the switching elements SW2b corresponding to the contact pin P of the contact wiring pattern N1, turns on any of the switching elements SW2b corresponding to the contact pin P of the contact wiring pattern N2, and conducts contact with the contact wiring pattern N3. Any one of the switching elements SW2b corresponding to the pin P. At this time, all the other switching elements SW2 in the second stage are cut off.

Thereby, the wiring pattern N4 of the attention wiring pattern is connected to one side output portion (for example, the positive side output portion) of the power source portion 11 via the contact pin P and the switching element SW1 and the switching element SW2a of the connection switching portion 12. Further, the wiring patterns N1 - N3 with respect to the wiring pattern are connected to the other side output portion (for example, the negative side output portion) of the power supply portion 11 via the contact pin P and the switching element SW1 and the switching element SW2b of the connection switching portion 12. Further, the power supply unit 11 applies a potential difference of the first applied potential difference between the wiring pattern N4 and the wiring patterns N1 - N3, and the current detecting portion A detects the wiring pattern N4 and the wiring patterns N1 - N3 at this time. The current flowing between the currents (strictly speaking, the current flowing between the one side output portion of the power supply unit 11 and the wiring pattern N4) is detected by the potential difference detecting portion V in the wiring pattern N4 and the wiring patterns N1 - N3 The potential difference between the two. Then, the virtual resistance value between the wiring pattern N4 and the wiring pattern N1 - N3 is calculated based on the detected current value and the potential difference, and the presence or absence of a very small short circuit between the wiring pattern N4 and the wiring pattern N1 - N3 is determined based on the resistance value. unit. Thereby, the first short-circuit inspection for the wiring pattern N4 is completed.

In the state in which the first-stage switching element SW1 corresponding to the contact pin P of the contact wiring pattern N1-N4 is turned on, the switch corresponding to the contact pin P of the contact wiring pattern N1-N4 in the second-stage switching element SW2 is turned on. The element SW2c and the wiring patterns N1-N4 are connected to the ground potential via the contact pin P and the switching elements SW1 and SW2c. Thereby, the electric charge remaining in the wiring patterns N1 - N4 due to the potential difference is discharged.

Next, in the inspection step Sa2, the wiring pattern N3 having the second largest number of pins is set as the attention wiring pattern. The wiring patterns N1 and N2 remaining except the wiring pattern N3 and the wiring pattern N4 which has been set as the attention wiring pattern are set as the opposite wiring patterns. Further, for example, the first switching element SW1 of the connection switching portion 12 corresponding to the contact pin P of the contact wiring pattern N1-N3 is turned on, and the contact pin P of the second switching element SW2 corresponding to the contact wiring pattern N1 is turned on. The switching element SW2b turns on any one of the switching elements SW2b corresponding to the contact pin P of the contact wiring pattern N2. At this time, all the other switching elements SW2 in the second stage are cut off.

Thereby, the wiring pattern N3 of the attention wiring pattern is connected to one side output portion (for example, the positive side output portion) of the power source portion 11 via the contact pin P, the switching element SW1 of the connection switching portion 12, and the switching element SW2a. The wiring patterns N1 and N2 of the wiring pattern are connected to the other side output unit (for example, the negative side output unit) of the power supply unit 11 via the contact pin P and the switching element SW1 and the switching element SW2b of the connection switching unit 12. Further, the power supply unit 11 applies a potential difference of the first applied potential difference between the wiring pattern N3 and the wiring patterns N1 and N2, and the current detecting unit A detects the wiring pattern N3 and the wiring patterns N1 and N2 at this time. The current flowing between the current (the current flowing between one of the output portions of the power supply unit 11 and the wiring pattern N3) is detected by the potential difference detecting portion V in the wiring pattern N3 and the wiring patterns N1, N2. The potential difference between the two. Then, the virtual resistance value between the wiring pattern N3 and the wiring patterns N1, N2 is calculated based on the detected current value and the potential difference, and the presence or absence of a very small short circuit between the wiring pattern N3 and the wiring patterns N1, N2 is determined based on the resistance value. unit. Thereby, the first short-circuit inspection for the wiring pattern N3 is completed.

In the state in which the first-stage switching element SW1 corresponding to the contact pin P of the contact wiring pattern N1-N3 is turned on, the switch corresponding to the contact pin P of the contact wiring pattern N1-N3 in the second-stage switching element SW2 is turned on. The element SW2c and the wiring patterns N1-N3 are connected to the ground potential via the contact pin P and the switching elements SW1 and SW2c. Thereby, the electric charge remaining in the wiring patterns N1 - N3 due to the potential difference is discharged.

Next, in the inspection step Sa3, the wiring pattern N2 having the third largest number of pins is set as the attention wiring pattern. The wiring pattern N1 remaining except the wiring pattern N2 and the wiring patterns N4 and N3 which have been set as the attention wiring patterns is set as the opposite wiring pattern. Also, for example, the conduction and contact wiring patterns N1. The contact pin P of N2 corresponds to the first-stage switching element SW1 of the connection switching unit 12, and turns on any one of the switching elements SW2b corresponding to the contact pin P of the contact wiring pattern N1 in the second-stage switching element SW2. At this time, all the other switching elements SW2 in the second stage are cut off.

Thereby, the wiring pattern N2 of the attention wiring pattern is connected to one side output unit (for example, the positive side output unit) of the power supply unit 11 via the contact pin P and the switching element SW1 and the switching element SW2a of the connection switching unit 12. Further, the wiring pattern N1 with respect to the wiring pattern is connected to the other side output portion (for example, the negative side output portion) of the power supply portion 11 via the contact pin P, the switching element SW1 of the connection switching portion 12, and the switching element SW2b. Further, the power supply unit 11 applies a potential difference of the first applied potential difference between the wiring pattern N2 and the wiring pattern N1, and the current detecting unit A detects the current flowing between the wiring pattern N2 and the wiring pattern N1 at this time. (Strictly speaking, a current flowing between the one side output portion of the power supply unit 11 and the wiring pattern N2), and the potential difference detecting unit V detects the potential difference applied between the wiring pattern N2 and the wiring pattern N1. Then, a virtual resistance value between the wiring pattern N2 and the wiring pattern N1 is calculated based on the detected current value and the potential difference, and the presence or absence of an extremely small short-circuit portion between the wiring pattern N2 and the wiring pattern N1 is determined based on the resistance value. Thereby, the first short-circuit inspection for the wiring pattern N2 is completed, and the first short-circuit inspection for the wiring pattern N1 is also completed, and all of the first short-circuit inspections for the wiring patterns N1 - N4 are completed.

In the state in which the first-stage switching element SW1 corresponding to the contact pin P of the contact wiring patterns N1 and N2 is turned on, the switch corresponding to the contact pin P of the contact wiring patterns N1 and N2 in the second-stage switching element SW2 is turned on. The element SW2c and the wiring patterns N1 and N2 are connected to the ground potential via the contact pin P and the switching elements SW1 and SW2c. Thereby, the electric charge remaining in the wiring patterns N1 and N2 due to the potential difference is discharged.

Next, a second short-circuit test is performed. In the second short-circuit test, the potential difference value given between the target wiring pattern and the opposite wiring pattern by the power supply unit 11 is set to be the second applied potential difference value (for example, 250 V), as shown in the lower part of the table of FIG. 5, The progress is in the order of the inspection step Sb1, the inspection step Sb2, and the inspection step Sb3.

In the second type of short-circuit test, the switching operation by the switching elements SW1 and SWb of the connection switching unit 12 is performed, and the order of the attention of the plurality of wiring patterns N1 - N4 is opposite to that of the first type of short-circuit test. The difference is the same as that in the case of the first short-circuit test, and detailed description is omitted.

In the first inspection step Sb1, the wiring pattern N1 having the smallest number of pins is set as the attention wiring pattern, and all the other wiring patterns N2-N3 are set as the opposite wiring patterns, and the power supply unit 11 passes through the contact pin P and the connection switching unit 12 A potential difference of the second applied potential difference is given between the wiring pattern N1 and the wiring pattern N2-N4. The current detecting unit A detects the current flowing between the wiring pattern N1 and the wiring pattern N2-N4 at this time (strictly, the current flowing between the output portion of the power supply unit 11 and the wiring pattern N1) The potential difference detection unit V detects the potential difference applied between the wiring pattern N1 and the wiring pattern N2-N4. Then, the virtual resistance value between the wiring pattern N1 and the wiring pattern N2-N4 is calculated based on the detected current value and the potential difference, and the presence or absence of the spark between the wiring pattern N1 and the wiring pattern N2-N4 is determined based on the resistance value. Leakage current caused. Thereby, the second short-circuit inspection for the wiring pattern N1 is completed. Further, the wiring patterns N1 - N4 are connected to the ground potential via the contact pin P and the connection switching portion 12, and the electric charges remaining in the wiring patterns N1 - N4 due to the potential difference are discharged.

Next, in the inspection step Sb2, the wiring pattern N2 having the second smallest number of pins is set as the attention wiring pattern. The wiring patterns N3 and N4 remaining except the wiring pattern N2 and the wiring pattern N1 which has been set as the attention wiring pattern are set as the opposite wiring patterns. Further, the power supply unit 11 applies a potential difference between the second applied potential difference between the wiring pattern N2 and the wiring patterns N3 and N4, and the current detecting unit A detects the wiring pattern N2 and the wiring patterns N3 and N4 at this time. The current flowing between the current (the current flowing between one of the output portions of the power supply unit 11 and the wiring pattern N2) is detected by the potential difference detecting portion V in the wiring pattern N2 and the wiring patterns N3 and N4. The potential difference between the two. Then, the virtual resistance value between the wiring pattern N2 and the wiring patterns N3 and N4 is calculated based on the detected current value and the potential difference value, and the presence or absence of the spark between the wiring pattern N2 and the wiring patterns N3 and N4 is determined based on the resistance value. Leakage current caused. Thereby, the second short-circuit inspection for the wiring pattern N2 is completed. Further, the wiring patterns N2-N4 are connected to the ground potential via the contact pin P and the connection switching unit 12, and discharge charges that are stored in the wiring patterns N2-N4 due to the potential difference.

Next, in the inspection step Sb3, the wiring pattern N3 having the third smallest number of pins is set as the attention wiring pattern. The wiring pattern N4 remaining except the wiring pattern N3 and the wiring patterns N1 and N2 which have been set as the attention wiring patterns is set as the opposite wiring pattern. In addition, the power supply unit 11 applies a potential difference between the second applied potential difference between the wiring pattern N3 and the wiring pattern N4, and the current detecting unit A detects the current flowing between the wiring pattern N3 and the wiring pattern N4 at this time. (Strictly speaking, the current flowing between the one side output portion of the power supply unit 11 and the wiring pattern N3), and the potential difference detecting unit V detects the potential difference applied between the wiring pattern N3 and the wiring pattern N4. Then, the virtual resistance value between the wiring pattern N3 and the wiring pattern N4 is calculated based on the detected current value and the potential difference, and the leakage current caused by the spark between the wiring pattern N3 and the wiring pattern N4 is determined based on the resistance value. . Thereby, the second short-circuit inspection for the wiring pattern N3 is completed, and the second short-circuit inspection for the wiring pattern N4 is also completed, and all of the second short-circuit inspections for the wiring patterns N1 - N4 are completed. Moreover, the wiring patterns N3 and N4 are connected to the ground potential via the contact pin P and the connection switching unit 12, and the electric charges stored in the wiring patterns N3 and N4 due to the potential difference are discharged.

As described above, according to the present embodiment, the order of selecting the attention wiring pattern for the plurality of wiring patterns N in the first type and the second type of short-circuit inspection is determined based on the number of contact pins P that contact the wiring pattern N at the time of inspection. The larger the wiring pattern N wiring area, the greater the number of contact pins P that contact the wiring pattern N. Therefore, the order of selection of the attention wiring pattern is determined according to the number of contact pins P, and the contact pattern N and the contact with the wiring pattern N can be considered. The overall capacitance of the pin P and the wire connecting the contact pin P determines the order in which the attention wiring pattern is selected.

In the first short-circuit test in which the potential difference is set to a small value corresponding to the inspection of the extremely short-circuit portion between the wiring patterns N, the number of contact pins P contacting the wiring pattern N from the plurality of wiring patterns N is large. In the second short-circuit test in which the potential difference value is set to a larger value corresponding to the test for causing the current leakage between the wiring pattern N, the contact wiring pattern is set to be the contact wiring pattern, and the contact wiring pattern is selected from the plurality of wiring patterns N. When the number of contact pins P of N is small, it is sequentially set as the attention wiring pattern.

Therefore, in the first short-circuit test in which the potential difference is small, the number of contact pins P that are in contact with each other is large, and the wiring pattern N including the contact pins P and the like having a large overall capacitance is sequentially set as the attention wiring pattern. It is suppressed that the potential difference is given to the wiring pattern N having a large overall capacitance and the number of times of the release is given. As a result, the time required for applying the potential difference to the wiring pattern N and releasing the time (the time required for charge and discharge, etc.) can be shortened, and the inspection speed can be increased.

On the other hand, in the second short-circuit test in which the potential difference is large, the contact pin P that is in contact with each other is small, and the wiring pattern N including the small contact capacitance of the contact pin P or the like is sequentially set as the attention wiring pattern. This can suppress the erroneous determination of the test result, and the reliability of the avoidance test is lowered.

In the second short-circuit test, the wiring pattern N having a small number of pins is sequentially set as the erroneous determination of the inspection result of the attention-grabbing wiring pattern, for the following reasons.

First, the reason for the erroneous determination of the test result in the second short-circuit test in the prior art is reviewed. In the second type of short-circuit test, a large potential difference is applied between the wiring patterns N. Therefore, the amount of charge of the attention wiring pattern, the contact pin, and the like is large due to the potential difference. Therefore, the discharge time required to discharge the electric charge accumulated in the attention wiring pattern to the ground potential at the time of shifting to the next inspection step is long. On the other hand, in order to speed up the inspection speed, the industry tends to shorten the distribution time allocated to each inspection step. In this case, in the second short-circuit test, when the insulation inspection between the target wiring pattern and the opposite wiring pattern is performed in each inspection step, the discharge from the wiring pattern N in which the previous inspection step is set as the attention wiring pattern is performed. This may cause the wrong result of the test result.

In the second type of short-circuit inspection, the conventional inspection apparatus is configured such that the wiring pattern having the largest wiring area is sequentially set as the attention wiring pattern, and when the inspection steps are completed and the next inspection step is completed, the phase is often performed. The discharge is larger than the wiring pattern in which the wiring pattern wiring area of the attention wiring pattern is set to be larger in the next inspection step (this is the wiring pattern of the attention wiring pattern in the previous inspection step). Therefore, the discharge from the wiring pattern which is set as the attention wiring pattern in the previous inspection step is likely to be more susceptible to the insulation inspection for the attention wiring pattern in each inspection step.

On the other hand, in the insulation inspection for the attention wiring pattern of each of the second short-circuit inspection inspection steps Sb1 - Sb3 in the second short-circuit inspection, the wiring pattern N having a small number of pins is sequentially set as the attention wiring pattern. Thereby, when the respective inspection steps Sb1 - Sb3 are completed and the process proceeds to the next inspection step, the overall electrostatic capacitance of the contact pin P or the like included in the wiring pattern N of the previous inspection step Sb1 - Sb3 is set to be smaller than the contact pin P of the attention wiring pattern The entire electrostatic capacitance of the contact pin P or the like which is set as the wiring pattern N of the attention wiring pattern in the next inspection step Sb1 - Sb3 is included. Therefore, when the transfer between the inspection steps Sb1 - Sb3 is performed, the discharge from the wiring pattern N which has been set as the attention wiring pattern in the previous inspection steps Sb1 - Sb3 is set to be noticed as compared with the pair in the next inspection steps Sb1 - Sb3 The time required for charging when the potential difference by the wiring pattern N of the wiring pattern is given can be ended in a short time. As a result, it is considered that the probability that the discharge from the wiring pattern N which has been set as the attention wiring pattern in the previous inspection steps Sb1 - Sb3 affects the insulation inspection of the attention wiring pattern in the next inspection steps Sb1 - Sb3 can be suppressed.

As described above, according to the first embodiment, the test speed is increased in the first type of short-circuit test, and the reliability of the test result is improved in the second type of short-circuit test which is prone to erroneous determination of the test result due to the increase in the speed of the test. One type and the second type of short-circuit test as a whole can improve the inspection speed without reducing the reliability of the test results.

Further, the first type and the second type of short-circuit test are sequentially performed from the case where the potential difference is small. Therefore, it is possible to avoid the occurrence of an extremely small short-circuit portion due to an overcurrent at the time of inspection, and at the same time, inspect the insulation between the wiring patterns N.

Next, a modification of the substrate inspection apparatus 1 according to the above embodiment will be described with reference to Fig. 6 . In this modification, the control unit 13 selects the current detecting unit A for detecting the current in each of the test steps in the first short-circuit test and the second short-circuit test, and uses the complex current detecting unit A. Frequency dispersion (use frequency should be equal).

The selection operation of the current detecting unit A by the control unit 13 will be described based on a specific example shown in FIG. In the example shown in Fig. 6, four current detecting units A1-A4 are provided, and 64 connections are allocated. The contact pin P is supplied to each of the current detecting portions A1 - A4. More specifically, the contact pins P1-P64 are assigned to the current detecting portion A1, the contact pins P65-P128 are assigned to the current detecting portion A2, the contact pins P129-P192 are assigned to the current detecting portion A3, and the contact pins P193-P256 are assigned. The current detecting unit A4 is supplied.

Further, in the first type and the second type of short-circuit inspection, the wiring patterns Na1 - Na4 were subjected to insulation inspection. In the example of the column of "correspondence between wiring pattern and contact pin" in Fig. 6, in the wiring pattern Na1, the number of contact pins P (number of pins) contacted is 2, and any one of the contact pins P1 - P64 is contact pin P, Any one of the contact pins P65-P128 is in contact. In the wiring pattern Na2, the number of pins is two, and any two of the contact pins P1 to P64 are in contact with each other. In the wiring pattern Na3, the number of pins is 4, any one of the contact pins P1-P64, one of the contact pins P65-P128, and one of the contact pins P129-P192 and the contact pin P193- Any contact pin P in P256 is in contact. In the wiring pattern Na4, the number of pins is two, and any one of the contact pins P129-P192 is in contact with any one of the contact pins P193-P256.

According to the example of the column "corresponding to the wiring pattern and the contact pin" in Fig. 6, when the wiring pattern Na2 is set as the attention wiring pattern, the current flowing through the wiring pattern Na2 can be detected only by the current detecting unit A1, but the other is set separately. When the wiring patterns Na1, Na3, and Na4 are the attention wiring patterns, there are plural options in the current detecting portions A1 - A4 for detecting the current flowing in the wiring patterns Na1, Na3, and Na4. Specifically, when the wiring pattern Na1 is set to be the attention wiring pattern, it can be selected from the two current detecting units A1 and A2. When the wiring pattern Na3 is set as the attention wiring pattern, it can be selected from the four current detecting units A1-A4. When the wiring pattern Na4 is set as the attention wiring pattern, it can be selected from the two current detecting units A3 and A4.

However, in the conventional inspection apparatus, there is no concern about the frequency of use of the complex current detecting sections A1 - A4, even when the complex current detecting sections A1 - A4 are selectable, for example, FIG. 6 "Wiring pattern and contact pin" As shown by the circular mark of the corresponding column, the current detecting portions A1 - A4 corresponding to the contact pin P having the smallest pin number are often used.

Here, in the configuration of the modification, for example, as shown in the square symbol of the column "corresponding to the wiring pattern and the contact pin" in FIG. 6, each wiring pattern Na1-Na4 is set as the attention wiring in each inspection step. In the case where the pattern can select the complex current detecting portion A1-A4, the current detecting portion A1-A4 is selected, and the frequency of the current detecting portion A1-A4 is dispersed in the first type and the second type of short-circuit check. (The frequency of use should be equal). Specifically, when the wiring pattern Na1 is set as the attention wiring pattern, the current detecting unit A2 is used, when the wiring pattern Na2 is set as the attention wiring pattern, the current detecting unit A1 is used, and when the wiring pattern Na3 is set as the attention wiring pattern, the current detecting unit is used. A3, when the wiring pattern Na4 is set as the attention wiring pattern, the current detecting unit A4 is used.

Therefore, in the first type and the second type of short-circuit test, it is possible to prevent the use frequency from being biased toward a part of the current detecting portions A1 - A4, and to prevent the deterioration of a part of the current detecting portions A1 - A4 from being faster than the other current detecting portions A1 - A4 .

As another modification of the configuration of the modification, in the case where each of the wiring patterns Na1 - Na4 is set as the attention wiring pattern in each inspection step, the plurality of current detecting portions A1 - A4 can be selected, and the same can be used at the same time. The plurality of current detecting units A1-A4 and the plurality of discharge paths are selected. Thereby, the current value flowing through the current detecting portions A1 - A4 can be reduced, the burden on the current detecting portions A1 - A4 can be reduced, and the charge and discharge time can be shortened.

In the above-described substrate inspection apparatus 1, the first and second types of short-circuit inspections are exemplified, and when a potential difference is applied between the attention wiring pattern and the opposite wiring pattern, the potential difference 俾 the attention wiring pattern is the positive side, but In another modification of the substrate inspection apparatus 1, the potential difference 赋予 may be set to the positive side with respect to the wiring pattern, or the potential difference polarity may be changed between the attention wiring pattern and the opposite wiring pattern, and the potential difference may be applied twice to perform inspection.

A1-A2‧‧‧ Current Detection Department

P1, P2‧‧‧ contact pin

PG1, PG2‧‧‧ sales group

SW1, SW2, SW2a-SW2c‧‧‧ switching elements

V‧‧‧potential difference detection unit

1‧‧‧Substrate inspection device

11‧‧‧Power Department

12‧‧‧Connection Switching Department

13‧‧‧Control Department

Claims (4)

A substrate inspection apparatus that applies a potential difference between a plurality of wiring patterns provided on a substrate to be inspected, and simultaneously extracts an inspection signal, thereby checking electrical characteristics between the wiring patterns, and is characterized by comprising: a plurality of contact pins, and setting And contacting a plurality of inspection points of the wiring patterns provided on the substrate to be inspected; the power supply unit applies a potential difference between the wiring patterns via the plurality of contact pins, and can change a potential difference between the wiring patterns; a signal for detecting electrical characteristics between the wiring patterns by the plurality of contact pins; and a connection switching portion including a plurality of switching elements for switching the plurality of contact pins and the power source by turning on and off the switching elements And a control unit that controls the plurality of switching elements of the power supply unit and the connection switching unit, and checks the electrical connection between the wiring patterns according to the detection result of the detecting unit a characteristic; and the control unit performs a verification processing operation to perform a plurality of potential difference values given to the potential difference between the wiring patterns In the complex inspection processing operation performed by the control unit, in the plurality of inspection steps in the inspection processing operation, the plurality of wiring patterns are sequentially set as the attention wiring pattern, and In each of the inspection steps, the time difference is set between the wiring pattern of the target wiring pattern and the opposing wiring pattern, and the potential difference corresponding to the applied potential difference corresponding to the inspection processing operation is given from the power supply unit via the contact pin, and The detection result of the detecting unit checks the electrical characteristics between the attention wiring pattern and the opposite wiring pattern, and the relative wiring pattern is set to the wiring pattern of the attention wiring pattern at the time of the plurality of wiring patterns. In the inspection processing operation, a wiring pattern other than the wiring pattern of the attention wiring pattern is formed; in the electrical characteristic test, the electric potential difference is not up to the predetermined reference level, and the plurality When the number of the contact pins of the contact wiring pattern in the wiring pattern is large, the contact wiring pattern is sequentially set. And in the electrical characteristic test in which the potential difference value is greater than the predetermined reference level in the verification of the complex electrical characteristics, the number of the contact pins of the contact wiring pattern in the plurality of wiring patterns is set to be sequentially For this attention wiring pattern. A substrate inspection apparatus that applies a potential difference between a plurality of wiring patterns provided on a substrate to be inspected, and simultaneously extracts an inspection signal, thereby checking electrical characteristics between the wiring patterns, and is characterized by comprising: a plurality of contact pins, and setting And contacting a plurality of inspection points of the wiring patterns provided on the substrate to be inspected; the power supply unit applies a potential difference between the wiring patterns via the plurality of contact pins, and can change a potential difference between the wiring patterns; a signal for detecting electrical characteristics between the wiring patterns by the plurality of contact pins; and a connection switching portion including a plurality of switching elements for switching the plurality of contact pins and the power supply portion by turning on and off the switching elements And an electrical connection relationship between the detecting unit; and a control unit that controls the plurality of switching elements of the power supply unit and the connection switching unit, and checks electrical characteristics between the wiring patterns according to the detection result of the detecting unit And the control unit performs a verification processing operation to perform a plurality of potential differences that are given to the potential difference between the wiring patterns In the complex check processing operation performed by the control unit, in the complex check processing in the check processing operation, the complex wiring pattern is sequentially set as the attention wiring pattern, and In each of the inspection steps, the time difference is set between the wiring pattern of the target wiring pattern and the opposing wiring pattern, and the potential difference corresponding to the applied potential difference corresponding to the inspection processing operation is given from the power supply unit via the contact pin, and The detection result of the detecting unit checks the electrical characteristics between the attention wiring pattern and the opposite wiring pattern, and the relative wiring pattern is set to the wiring pattern of the attention wiring pattern at the time of the plurality of wiring patterns. In the inspection processing operation, a wiring pattern other than the wiring pattern of the attention wiring pattern is formed; the first electrical characteristic inspection includes the first type and the second short-circuit inspection, and in the one type of short-circuit inspection, the assignment is set. The potential difference is: a short circuit between the adjacent wiring patterns, or a short circuit shorted by a fine thin line portion. And the value of the minimum short-circuit portion that is not burned by the current flowing through the minimum short-circuit portion, and in the second short-circuit test, the set potential difference is set higher than the first short-circuit test. a potential difference value and used to detect a value of current leakage caused by a spark between adjacent wiring patterns, In the first short-circuit inspection, the number of the contact pins contacting the wiring pattern is set to be the attention wiring pattern in the plurality of wiring patterns, and the second wiring is used in the second short-circuit inspection. In the pattern, the number of the contact pins of the contact wiring pattern is set to be the attention wiring pattern in order. The substrate inspection apparatus according to claim 1 or 2, wherein in the complex inspection processing operation by the control unit, the plurality of electrical characteristic inspections are sequentially performed from the small difference in the applied potential difference. The substrate inspection device of claim 1 or 2, wherein the detection unit includes a plurality of current detection units, and the plurality of current detection units are respectively assigned to the plurality of contact pins divided into a plurality of groups The contact pin group detects a current flowing between the target wiring pattern or the opposite wiring pattern and the power supply portion by a contact pin belonging to the corresponding contact pin group, and the control portion is configured to be electrically In the characteristic test, the current detecting portion of the detecting portion for detecting the current in each of the detecting steps is selected to disperse the frequency of use of the complex current detecting portion.