CN114980543A - Method for repairing conductive silver circuit fine short circuit after laser etching - Google Patents
Method for repairing conductive silver circuit fine short circuit after laser etching Download PDFInfo
- Publication number
- CN114980543A CN114980543A CN202210604276.5A CN202210604276A CN114980543A CN 114980543 A CN114980543 A CN 114980543A CN 202210604276 A CN202210604276 A CN 202210604276A CN 114980543 A CN114980543 A CN 114980543A
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- CN
- China
- Prior art keywords
- circuit
- short circuit
- conductive silver
- laser etching
- electric shock
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 59
- 239000004332 silver Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000010329 laser etching Methods 0.000 title claims abstract description 31
- 230000008439 repair process Effects 0.000 claims abstract description 25
- 239000000428 dust Substances 0.000 claims abstract description 16
- 230000035939 shock Effects 0.000 claims abstract description 7
- 238000011990 functional testing Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention discloses a method for repairing a fine short circuit of a conductive silver circuit after laser etching. The repair method can effectively fuse fine dust causing short circuit, does not damage the conductive silver circuit, does not need to accurately shock the short circuit position during repair, only needs to shock at any conducting position of two short-circuited lines, optimally selects a golden finger part with a larger area, can fuse the dust, eliminates bad short circuit, saves time and labor during repair, and has high repair efficiency.
Description
Technical Field
The invention relates to the technical field of fine line short circuit repair, in particular to a method for repairing fine short circuits of a conductive silver circuit after laser etching.
Background
The manufacturing structure and the manufacturing process of the capacitive screen conductive film are various, except for an ITO conductive layer of an in-plane Visible Area (VA) and an operable area (AA), a conductive film with the thickness of 8-12 um is printed on a peripheral conductive part by using conductive silver paste generally, then laser etching is carried out by using a laser, and unnecessary parts are broken down and vaporized at high temperature to form a line with the required line width and line distance. The technology has high requirements on silver paste and environment, and because of laser etching equipment and environmental factors, fine dust which cannot be distinguished by naked eyes often exists in a line distance after partial laser etching of a silver line of peripheral silver paste, a functional test is short circuit, the specific position of the short circuit is difficult to detect visually, the short circuit cannot be wiped so as not to damage the line, the fine dust at the position of the short circuit needs to be detected through a high-power microscope, accurate positioning laser etching repair is carried out, the method is time-consuming and labor-consuming, and the production efficiency is low.
Disclosure of Invention
In view of the problems that the silver paste circuit after laser etching has short circuit caused by fine dust, the fine dust at the position of the short circuit is detected through a high-power microscope, and then laser etching repair is accurately positioned, so that time and labor are consumed, and the production efficiency is low, the invention provides a method for efficiently repairing the fine short circuit, and the method is as follows.
A method for repairing fine short circuit of conductive silver circuit after laser etching includes using current generator to electrically shock any position of short circuit by aiming at circuit with short circuit detected by function test to fuse short circuit part and repairing fine short circuit (short circuit caused by fine dust).
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the discharge voltage of the current generator is set to be 500-1500V, and the discharge current is less than or equal to 7 mA.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the discharge voltage of the current generator is set to be 1000V, and the discharge current is set to be 5 mA.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, any position of the circuit with the short circuit is subjected to electric shock for 1-10 times, and the time of each electric shock is less than or equal to 10 milliseconds.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the method performs functional test after each electric shock, stops the electric shock when the test is passed, and continues the electric shock when the test is not passed.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the position of a golden finger of the circuit with the short circuit is selected to be shocked during electric shock.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the head of the current generator is provided with a point discharge head made of metal, and the point discharge head is close to the surface of the circuit with the short circuit to 0.5-3 mm during electric shock.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the line width of the conductive silver circuit at the repaired position where the fine short circuit occurs is 40-100 mu m, and the gap width between adjacent conductive silver circuits is 3-30 mu m.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the line width of the conductive silver circuit at the repaired position where the fine short circuit occurs is more than 2 times of the width of the gap between the adjacent conductive silver circuits.
As a further improvement of the method for repairing the fine short circuit of the conductive silver circuit after laser etching, the fine short circuit is a short circuit with the resistance value of more than 2 MOmega grade caused by dust falling between two silver circuits; before the short circuit is repaired by electric shock, a universal meter is used for measuring and confirming the resistance between two silver circuits, and if the resistance is more than 2M omega, the electric shock repair is carried out.
The invention has the beneficial effects that: the repairing method can effectively fuse fine dust (the dust is silver paste dust generally) causing short circuit, does not damage conductive silver circuits, does not need to accurately shock electricity aiming at the short circuit position during repairing, only needs to shock electricity at any conducting position of two lines with short circuit, preferentially selects a golden finger part with a larger area, can fuse the dust, eliminates the bad short circuit, saves time and labor during repairing, and has high repairing efficiency.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments are briefly described below, and it is obvious that the drawings described below are only some of the implementation diagrams of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a microscopic image of a fine short circuit of a conductive silver circuit after laser etching.
Fig. 2 is a microscopic image of a fine short before and after the repair method of the present invention is used.
Fig. 3 is a schematic diagram of a current generator including a pointed discharge head.
Detailed Description
In order to make the technical solution of the present invention clearer and more complete, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
A method for repairing the fine short circuit of silver circuit after laser carving features that when the conductive silver circuit with short circuit is detected, a current generator is used to electrically shock any position of said circuit to fuse the short circuit.
The phenomenon of fine short circuit is shown in FIG. 1, wherein the white portion represents conductive silver circuit and the black portion represents void. One of the black thin lines is broken, which indicates that the position is a fine short circuit of two adjacent conductive silver circuits.
As shown in fig. 2, are microscopic images of a fine short before and after the repair method of the present invention was used. It can be seen that: before repair, the particle phenomenon is obvious; after repair, the particles are basically disappeared, and the main line is not obviously damaged. And (4) performing function test on the repaired product, so that the short circuit abnormality disappears and other abnormalities are not brought. The repair method is proved to be capable of effectively fusing fine dust causing short circuit, the conductive silver circuit is not damaged, accurate electric shock to the short circuit position is not needed during repair, electric shock is only needed to be carried out at any conducting position of two short-circuited lines, the golden finger part with large area is preferably selected, the dust can be fused, the short circuit is eliminated, repair time and labor are saved, and efficiency is high.
Known as 1mm 2 The maximum bearable current of the silver wire with the cross section area is 15-18A, 1 square millimeter is 1000000 square micrometers, namely, the maximum bearable current per square micrometer is 0.000015A (0)015 milliamperes) after the existing silver paste is in a laser shape, the width of the circuit is 60 micrometers, the thickness of the circuit is 8 micrometers, the cross section area of the circuit is 480 square micrometers, and the maximum bearing current can be calculated to be 7.2 milliamperes. Therefore, when the method is used for repairing the short circuit, the discharge voltage of the current generator can be set to be 500-1500V, and the discharge current is less than or equal to 7 mA. For example, the discharge voltage of the current generator may be set to 1000V and the discharge current 5 mA. When the method is used for repairing the short circuit, the electric shock can be carried out on any position of the short circuit for 1-10 times, and the time of each electric shock is less than or equal to 10 milliseconds. The principle of the repairing method is as follows: at the moment when the homogeneous conductor is subjected to external high voltage and low current, the resistance peak formed by the non-homogeneous part can be blown by the current impact.
In the repair process, the functional test can be carried out after one or more times of electric shock, the electric shock is stopped when the test is passed (namely, no short circuit condition exists), and the electric shock is continued when the test is not passed.
During electric shock, the golden finger position (the starting end or the tail end of the short-circuit line) of the short-circuit line is preferably selected for electric shock, and the golden finger area is large, so that the electric shock is not easy to deviate from a target line.
The line width of the conductive silver circuit at the repaired position where the fine short circuit occurs is 40-100 μm, and the gap width between adjacent conductive silver circuits is 3-30 μm. To make the repair more effective, the line width of the repaired conductive silver circuit at the position where the fine short circuit occurs is more than 2 times of the gap width between the adjacent conductive silver circuits. For example, the conductive silver lines have a line width of 60 μm and a gap width between adjacent conductive silver lines is 30 μm or less. Therefore, in the short-circuit line, the resistance of the conductor in the homogeneous section is obviously smaller than that of the non-homogeneous part, and the resistance peak formed by the non-homogeneous part is more easily blown out by current impact at the moment of bearing external high-voltage low-current electricity.
The above-mentioned fine short circuit is a short circuit in which dust falls between two silver paths, and the resistance of the two silver paths is generally above 2M Ω. Optionally, before the short circuit is repaired by electric shock, a universal meter is used for measuring and confirming the resistance between the two silver circuits, and if the resistance is more than 2M Ω, the electric shock repair is performed to improve the repair accuracy.
As shown in fig. 3, in one form of the current generator used in the repairing method, the tip discharge head 1 made of metal is mounted on the head, and when an electric shock occurs, the surface of the metal finger is 0.5 to 3mm close to the short-circuited circuit, so that the electric shock can be effectively generated without damaging the metal finger.
The working process of the repairing method of the invention is as follows:
1. firstly, aiming at the lines with short circuit detected by functional test, for example, the 1 st to 20 th parallel lines are tested, and the test software displays that the 2 nd and 3 rd lines result in short circuit.
2. The current generator is used for carrying out electric shock on any position between the 2 nd line and the 3 rd line, and the position of a golden finger with a larger area is generally subjected to electric shock.
3. And repeating the test function after electric shock, wherein if the test result shows PASS, the repair is OK, and otherwise, repeating the electric shock.
The repair method can optimize the production yield, can perform nondestructive repair on the 2M omega-level short circuit which cannot be visually detected, does not need to be accurately aligned at the repair position, does not need to find any position of the short circuit line accurately, performs electric shock repair, and ensures that the repaired line can pass reliability test.
Claims (10)
1. A method for repairing fine short circuit of conductive silver circuit after laser etching is characterized by comprising the following steps: aiming at the circuit with short circuit detected by function test, a current generator is used to shock the circuit with short circuit at any position to fuse the short circuit part.
2. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 1, wherein: the discharge voltage of the current generator is set to be 500-1500V, and the discharge current is less than or equal to 7 mA.
3. The method for repairing conductive silver circuit fine short circuit after laser etching according to claim 2, characterized in that: the discharge voltage of the current generator is set to 1000V, and the discharge current is set to 5 mA.
4. The method for repairing fine short circuits of conductive silver circuit after laser etching according to any one of claims 1 to 3, wherein the method comprises the following steps: and (3) carrying out electric shock on any position of the short-circuited line for 1-10 times, wherein the time of each electric shock is less than or equal to 10 milliseconds.
5. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 4, wherein: and performing functional test after each electric shock, stopping the electric shock if the test is passed, and continuing the electric shock if the test is not passed.
6. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 1, wherein: and when in electric shock, selecting the position of the golden finger of the short-circuited line for electric shock.
7. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 1, wherein: the head of the current generator is provided with a point discharge head made of metal materials, and the point discharge head is close to the surface of a short-circuit line to 0.5-3 mm during electric shock.
8. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 1, wherein: the line width of the conductive silver circuit at the repaired position where the fine short circuit occurs is 40-100 μm, and the gap width between adjacent conductive silver circuits is 3-30 μm.
9. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 8, wherein: the line width of the repaired conductive silver circuit at the position where the fine short circuit occurs is more than 2 times of the gap width between the adjacent conductive silver circuits.
10. The method for repairing fine short circuit of conductive silver circuit after laser etching according to claim 1, wherein: the fine short circuit is a short circuit with the resistance value of more than 2 MOmega level caused by dust falling between two silver paths; before the short circuit is repaired by electric shock, a universal meter is used for measuring and confirming the resistance between two silver circuits, and if the resistance is more than 2M omega, the electric shock repair is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210604276.5A CN114980543A (en) | 2022-05-31 | 2022-05-31 | Method for repairing conductive silver circuit fine short circuit after laser etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210604276.5A CN114980543A (en) | 2022-05-31 | 2022-05-31 | Method for repairing conductive silver circuit fine short circuit after laser etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114980543A true CN114980543A (en) | 2022-08-30 |
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ID=82957335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210604276.5A Pending CN114980543A (en) | 2022-05-31 | 2022-05-31 | Method for repairing conductive silver circuit fine short circuit after laser etching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114980543A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201326853A (en) * | 2011-10-06 | 2013-07-01 | Nidec Read Corp | Substrate testing device |
| CN105446519A (en) * | 2014-09-24 | 2016-03-30 | 深圳市比亚迪电子部品件有限公司 | Touch screen and processing method thereof |
| CN111863628A (en) * | 2020-07-07 | 2020-10-30 | 广东泰奇克光电科技有限公司 | Process method for eliminating micro short circuit in production of functional chip by using megohmmeter |
| CN112037701A (en) * | 2020-09-10 | 2020-12-04 | 苏州清越光电科技股份有限公司 | Display screen aging method and display screen aging processing device |
-
2022
- 2022-05-31 CN CN202210604276.5A patent/CN114980543A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201326853A (en) * | 2011-10-06 | 2013-07-01 | Nidec Read Corp | Substrate testing device |
| CN105446519A (en) * | 2014-09-24 | 2016-03-30 | 深圳市比亚迪电子部品件有限公司 | Touch screen and processing method thereof |
| CN111863628A (en) * | 2020-07-07 | 2020-10-30 | 广东泰奇克光电科技有限公司 | Process method for eliminating micro short circuit in production of functional chip by using megohmmeter |
| CN112037701A (en) * | 2020-09-10 | 2020-12-04 | 苏州清越光电科技股份有限公司 | Display screen aging method and display screen aging processing device |
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Application publication date: 20220830 |