TWI430592B - 無線區域網路通信模組與積體式晶片封裝（四） - Google Patents

無線區域網路通信模組與積體式晶片封裝（四） Download PDF

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Publication number
TWI430592B
TWI430592B TW095120031A TW95120031A TWI430592B TW I430592 B TWI430592 B TW I430592B TW 095120031 A TW095120031 A TW 095120031A TW 95120031 A TW95120031 A TW 95120031A TW I430592 B TWI430592 B TW I430592B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
antenna
package
signal
division multiplexing
Prior art date
Application number
TW095120031A
Other languages
English (en)
Chinese (zh)
Other versions
TW200727601A (en
Inventor
傑諾夫斯基 艾力克Ｂ.
Original Assignee
邁威爾世界貿易有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 邁威爾世界貿易有限公司 filed Critical 邁威爾世界貿易有限公司
Publication of TW200727601A publication Critical patent/TW200727601A/zh
Application granted granted Critical
Publication of TWI430592B publication Critical patent/TWI430592B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
TW095120031A 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（四） TWI430592B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package

Publications (2)

Publication Number Publication Date
TW200727601A TW200727601A (en) 2007-07-16
TWI430592B true TWI430592B (zh) 2014-03-11

Family

ID=36649116

Family Applications (4)

Application Number Title Priority Date Filing Date
TW095120031A TWI430592B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（四）
TW095120026A TWI495278B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（二）
TW095120028A TWI438873B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（三）
TW095120024A TWI446517B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（一）

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW095120026A TWI495278B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（二）
TW095120028A TWI438873B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（三）
TW095120024A TWI446517B (zh) 2005-06-21 2006-06-06 無線區域網路通信模組與積體式晶片封裝（一）

Country Status (6)

Country Link
US (1) US20060285480A1 (cg-RX-API-DMAC10.html)
EP (4) EP1737065B1 (cg-RX-API-DMAC10.html)
JP (4) JP4728172B2 (cg-RX-API-DMAC10.html)
CN (4) CN1885847A (cg-RX-API-DMAC10.html)
SG (4) SG128569A1 (cg-RX-API-DMAC10.html)
TW (4) TWI430592B (cg-RX-API-DMAC10.html)

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US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
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US20110316139A1 (en) * 2010-06-23 2011-12-29 Broadcom Corporation Package for a wireless enabled integrated circuit
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
US8901945B2 (en) * 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
CN102800923A (zh) * 2012-08-10 2012-11-28 上海华勤通讯技术有限公司 移动终端内置天线及其移动终端
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
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US20170347490A1 (en) * 2016-05-24 2017-11-30 Texas Instruments Incorporated High-frequency antenna structure with high thermal conductivity and high surface area
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Also Published As

Publication number Publication date
CN1885850B (zh) 2013-08-28
JP4728172B2 (ja) 2011-07-20
SG128568A1 (en) 2007-01-30
TWI495278B (zh) 2015-08-01
SG128569A1 (en) 2007-01-30
TWI438873B (zh) 2014-05-21
EP1737068B1 (en) 2018-03-21
SG128566A1 (en) 2007-01-30
JP2007028591A (ja) 2007-02-01
US20060285480A1 (en) 2006-12-21
JP2007037101A (ja) 2007-02-08
JP4732959B2 (ja) 2011-07-27
EP1737067A1 (en) 2006-12-27
EP1737068A1 (en) 2006-12-27
CN1885804A (zh) 2006-12-27
JP2007037100A (ja) 2007-02-08
TW200701431A (en) 2007-01-01
CN1885850A (zh) 2006-12-27
TW200701417A (en) 2007-01-01
SG128565A1 (en) 2007-01-30
EP1737065B1 (en) 2017-11-01
EP1737067B1 (en) 2016-12-28
TWI446517B (zh) 2014-07-21
CN1885847A (zh) 2006-12-27
TW200727601A (en) 2007-07-16
JP4660428B2 (ja) 2011-03-30
TW200707929A (en) 2007-02-16
JP2007006471A (ja) 2007-01-11
EP1737069B1 (en) 2017-01-11
EP1737065A1 (en) 2006-12-27
CN1885804B (zh) 2013-01-23
CN1885851A (zh) 2006-12-27
EP1737069A1 (en) 2006-12-27
JP4704961B2 (ja) 2011-06-22

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MM4A Annulment or lapse of patent due to non-payment of fees