TWI427450B - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- TWI427450B TWI427450B TW097112159A TW97112159A TWI427450B TW I427450 B TWI427450 B TW I427450B TW 097112159 A TW097112159 A TW 097112159A TW 97112159 A TW97112159 A TW 97112159A TW I427450 B TWI427450 B TW I427450B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/01—Control of temperature without auxiliary power
- G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
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Description
本發明係關於溫度控制裝置,其藉由使流體循環於配置在被控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲的溫度。The present invention relates to a temperature control device for controlling a temperature of a controlled object to a desired temperature by circulating a fluid to a temperature regulating portion disposed beside the controlled object.
第12圖顯示此種溫度控制裝置。儲存槽100內的流體係由泵浦102吸入,並吐出至加熱部104。加熱部104具有加熱器,可以將輸出到調溫部106的流體加熱。通過調溫部106的流體,被輸出到冷卻部108。藉由冷卻部108,可以使輸出到儲存槽100的流體冷卻。調溫部106之構成可以支撐被控制對象,藉由調節供應到調溫部106的流體之溫度,而控制由調溫部106支撐的被控制對象的溫度。在此,當欲使被控制對象的溫度上升時,在冷卻部108不使流體冷卻,並且在加熱部104將流體加熱。另一方面,當欲使被控制對象的溫度下降時,在冷卻部108使流體冷卻,並且在加熱部104不將流體加熱。藉此,而能夠將被控制對象的溫度控制在所欲的溫度。Figure 12 shows such a temperature control device. The flow system in the storage tank 100 is sucked by the pump 102 and discharged to the heating unit 104. The heating unit 104 has a heater that can heat the fluid output to the temperature adjustment unit 106. The fluid passing through the temperature adjustment unit 106 is output to the cooling unit 108. The fluid output to the storage tank 100 can be cooled by the cooling portion 108. The temperature adjustment unit 106 is configured to support the controlled object, and controls the temperature of the controlled object supported by the temperature adjustment unit 106 by adjusting the temperature of the fluid supplied to the temperature adjustment unit 106. Here, when the temperature of the controlled object is to be increased, the fluid is not cooled in the cooling portion 108, and the fluid is heated in the heating portion 104. On the other hand, when the temperature of the controlled object is to be lowered, the fluid is cooled in the cooling portion 108, and the fluid is not heated in the heating portion 104. Thereby, the temperature of the controlled object can be controlled at a desired temperature.
再者,過去的溫度控制裝置,除了第12圖所示者之外,也有如後述之專利文獻1中所記載者。In addition to the one shown in FIG. 12, the temperature control device of the past is also described in Patent Document 1 which will be described later.
專利文獻1:特開2000-89832號公報Patent Document 1: JP-A-2000-89832
但是,藉由上述溫度控制裝置將被控制對象的溫度變為 所欲之溫度需要長時間。亦即,欲使被控制對象的溫度冷卻的情況下,必須要使加熱部104停止加熱,並使冷卻部108開始冷卻,但是,即使在加熱部104停止加熱之後,因為餘熱而使得暫時仍有高溫的流體從加熱部104流出。而且,即使冷卻部108開始冷卻,流體實際上被冷卻仍需要時間,而且,儲存槽100中的流體的溫度下降需要更長的時間。因此,無法快速地變化調溫部106的溫度,而使得被控制對象的溫度無法快速改變。However, the temperature of the controlled object is changed by the above temperature control device The desired temperature takes a long time. In other words, in order to cool the temperature of the controlled object, it is necessary to stop the heating of the heating unit 104 and start the cooling of the cooling unit 108. However, even after the heating unit 104 stops heating, it is temporarily left because of the residual heat. The high temperature fluid flows out of the heating portion 104. Moreover, even if the cooling portion 108 starts to cool, it takes time for the fluid to actually be cooled, and it takes a longer time for the temperature of the fluid in the storage tank 100 to drop. Therefore, the temperature of the temperature control portion 106 cannot be quickly changed, so that the temperature of the controlled object cannot be changed rapidly.
本發明係用以解決上述問題,其目的為提供溫度控制裝置,其藉由使流體循環於配置在被控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲的溫度時,該被控制對象的溫度能夠快速達到所欲之溫度。The present invention has been made to solve the above problems, and an object thereof is to provide a temperature control device that circulates a fluid to a temperature adjustment portion disposed beside a controlled object to control a temperature of the controlled object at a desired temperature. The temperature of the controlled object can quickly reach the desired temperature.
以下記載用以解決上述課題之手段,以及其作用效果。The means for solving the above problems and the effects thereof will be described below.
手段1為,溫度控制裝置,藉由使流體循環於配置在被控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲的溫度,其特徵在於包括:加熱管路,其將該流體加熱並使其循環到該調溫部;冷卻管路,其將該流體冷卻並使其循環到該調溫部;旁通管,其使該流體不通過該加熱管路及該冷卻管路,而循環到該調溫部;調節裝置,其調節透過由該加熱管路、該冷卻管路、該旁通管匯流之合流部,而輸出到該調溫部的流體之流量比。該調節裝置係設置於該加熱管路、該冷卻管路、該旁通管的下游處,以及該合流部之上游處。The means 1 is that the temperature control means controls the temperature of the controlled object to a desired temperature by circulating the fluid to the temperature regulating portion disposed beside the controlled object, and is characterized by comprising: a heating pipe; Heating and circulating the fluid to the temperature regulating portion; cooling a conduit that cools the fluid and circulates it to the temperature regulating portion; a bypass tube that prevents the fluid from passing through the heating conduit and the cooling The pipeline is circulated to the temperature adjustment unit, and the adjustment device adjusts a flow ratio of the fluid that is output to the temperature adjustment unit through the junction of the heating conduit, the cooling conduit, and the bypass conduit. The adjusting device is disposed at the heating pipe, the cooling pipe, the downstream of the bypass pipe, and the upstream of the merging portion.
在上述手段1中,藉由調節透過由該加熱管路、該冷卻管路、該旁通管而輸出到該調溫部的流體之流量比,而能夠使輸出到調溫部的流體之溫度快速地變化。尤其是,因為流 量比是在該加熱管路、該冷卻管路、該旁通管的下游處,以及該合流部之上游處被調節,而能夠盡量使流量比的調節位置和調溫部的距離縮短,因而能夠使輸出到調溫部的流體之溫度更快速地變化。因此,當將被控制對象的溫度控制到所欲的溫度時,能夠使被控制對象的溫度快速地到達所欲之溫度。In the above-described means 1, the temperature of the fluid output to the temperature regulating portion can be adjusted by adjusting the flow ratio of the fluid that is output to the temperature regulating portion through the heating pipe, the cooling pipe, and the bypass pipe. Change quickly. Especially because of the flow The ratio is adjusted at the heating line, the cooling line, the downstream of the bypass pipe, and the upstream of the merging portion, and the distance between the adjustment position of the flow ratio and the temperature adjustment portion can be shortened as much as possible. The temperature of the fluid output to the temperature adjustment portion can be changed more rapidly. Therefore, when the temperature of the controlled object is controlled to a desired temperature, the temperature of the controlled object can be quickly reached to the desired temperature.
再者,盡量使上述合流部的流路面積小較佳,以使得通過加熱管路、冷卻管路、旁通管流入的流體之流速盡可能地低。在此,流體的流速為,流體在流通方向之進行速度。Further, it is preferable to make the flow path area of the merging portion as small as possible so that the flow velocity of the fluid flowing through the heating pipe, the cooling pipe, and the bypass pipe is as low as possible. Here, the flow velocity of the fluid is the velocity at which the fluid travels in the flow direction.
再者,該調節裝置為分別調節透過加熱管路、冷卻管路、旁通管而輸出到調溫部的流量比。Furthermore, the adjusting device adjusts the flow ratio of the output to the temperature regulating portion through the heating pipe, the cooling pipe, and the bypass pipe, respectively.
手段2為,溫度控制裝置,藉由使流體循環於配置在被控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲的溫度,其特徵在於包括:加熱管路,其將該流體加熱並使其循環到該調溫部;冷卻管路,其將該流體冷卻並使其循環到該調溫部;旁通管,其使該流體不通過該加熱管路及該冷卻管路,而循環到該調溫部;調節裝置,其分別調節該加熱管路、該冷卻管路、該旁通管的下游側之流路面積。The means 2 is that the temperature control means controls the temperature of the controlled object to a desired temperature by circulating the fluid to the temperature regulating portion disposed beside the controlled object, and is characterized by comprising: a heating pipe; Heating and circulating the fluid to the temperature regulating portion; cooling a conduit that cools the fluid and circulates it to the temperature regulating portion; a bypass tube that prevents the fluid from passing through the heating conduit and the cooling The pipeline is circulated to the temperature regulating portion; and an adjusting device that adjusts a flow path area of the heating pipe, the cooling pipe, and the downstream side of the bypass pipe, respectively.
在上述手段2中,藉由分別調節加熱管路、冷卻管路、旁通管的下游側的流路面積,而能夠調節通過加熱管路、冷卻管路、旁通管而輸出到調溫部的流量比。因此,能夠使輸出到調溫部的流體之溫度快速地變化。因此,當將被控制對象的溫度控制到所欲的溫度時,能夠使被控制對象的溫度快速地到達所欲之溫度。In the above-described means 2, by adjusting the flow path area on the downstream side of the heating pipe, the cooling pipe, and the bypass pipe, the heating pipe, the cooling pipe, and the bypass pipe can be adjusted and output to the temperature control unit. The flow ratio. Therefore, the temperature of the fluid output to the temperature adjustment portion can be quickly changed. Therefore, when the temperature of the controlled object is controlled to a desired temperature, the temperature of the controlled object can be quickly reached to the desired temperature.
手段3為該旁通管在該加熱管路及該冷卻管路之間係為 共用。Means 3 is that the bypass pipe is between the heating pipe and the cooling pipe Share.
在上述手段3中,在流體從加熱管路及旁通管輸出到調溫部的情況,以及流體從冷卻管路及旁通管輸出到調溫部的情況下,能夠使用同一支旁通管。因此,相較於必須使用個別的旁通管的情況,能夠簡化溫度控制裝置的構造。In the above-described means 3, in the case where the fluid is output from the heating pipe and the bypass pipe to the temperature regulating portion, and the fluid is output from the cooling pipe and the bypass pipe to the temperature regulating portion, the same bypass pipe can be used. . Therefore, the configuration of the temperature control device can be simplified as compared with the case where an individual bypass pipe must be used.
手段4為,在該加熱管路和該冷卻管路的上游側,設有流出管路,其使該調節裝置迂迴而使該流體流出。In the means 4, on the upstream side of the heating pipe and the cooling pipe, an outflow pipe is provided which causes the adjusting device to bypass the fluid to flow out.
當不讓流體從加熱管路或冷卻管路輸出到調溫部的情況下,調節裝置的下游側和上述被禁止的管路之間會產生溫度梯度。因此,在解除禁止之後,流出到調溫部的流體之溫度受到溫度梯度的影響,而可能使得調溫部的溫度到達所欲之溫度所需的時間拉長。此點,在上述手段4中,藉由設置流出管路,而能夠適當地控制流出管路上游側之溫度梯度,並能夠使調溫部的溫度更快地到達所欲之溫度。When the fluid is not output from the heating pipe or the cooling pipe to the temperature regulating portion, a temperature gradient is generated between the downstream side of the regulating device and the above-mentioned prohibited pipe. Therefore, after the prohibition is released, the temperature of the fluid flowing out to the temperature regulating portion is affected by the temperature gradient, and the time required for the temperature of the temperature regulating portion to reach the desired temperature may be elongated. In this regard, in the above-described means 4, by providing the outflow line, the temperature gradient on the upstream side of the outflow line can be appropriately controlled, and the temperature of the temperature adjustment part can be quickly reached to the desired temperature.
再者,手段4,也可以在該加熱管路較該調節裝置上游側,設置加熱側溫度檢測裝置以檢測其溫度,在該冷卻管路較該調節裝置上游側,設置冷卻側溫度檢測裝置以檢測其溫度。在此情況下,藉由設置該流出管路,能夠適當地抑制因為禁止流體從加熱管路或冷卻管路流到調溫部而導致該檢測裝置受到上述溫度梯度的影響。Further, in the means 4, a heating side temperature detecting means may be disposed on the upstream side of the adjusting means to detect the temperature of the heating line, and a cooling side temperature detecting means may be disposed on the upstream side of the adjusting line from the cooling line to Detect its temperature. In this case, by providing the outflow line, it is possible to appropriately suppress the influence of the temperature gradient caused by the flow of the fluid from the heating pipe or the cooling pipe to the temperature regulating portion.
手段5為更包含泵浦,其吸入該調溫部之下游側的流體,並將其輸出至該加熱管路、該冷卻管路、及該旁通管。The means 5 further includes a pump that sucks the fluid on the downstream side of the temperature regulating portion and outputs it to the heating pipe, the cooling pipe, and the bypass pipe.
在上述手段5中,能夠使用泵浦而使流體循環。尤其是,相較於設置在加熱管路、冷卻管路、旁通管之下游側且在調溫部上游側,藉由將泵浦設置在加熱管路、冷卻管路、旁通 管之上游側,能夠縮短在調節裝置和調溫部之間的流體的流動路徑。因此,能夠使得從調節裝置輸出的流體快速地到達調溫部,而且能夠使調溫部的溫度更快速地到達所欲的溫度。In the above means 5, the pump can be used to circulate the fluid. In particular, the pump is disposed in the heating pipe, the cooling pipe, and the bypass as compared with the downstream side of the heating pipe, the cooling pipe, and the bypass pipe and on the upstream side of the temperature regulating portion. On the upstream side of the tube, the flow path of the fluid between the adjusting device and the temperature regulating portion can be shortened. Therefore, the fluid output from the regulating device can be quickly reached to the temperature regulating portion, and the temperature of the temperature regulating portion can be more quickly reached to the desired temperature.
手段6為,在該加熱管路、該冷卻管路、該旁通管之上游側及該調溫部的下游側設置有用以存放該流體的儲存裝置,該儲存裝置具有吸收該流體因為溫度而產生之體積變化的功能。The means 6 is provided with a storage device for storing the fluid on the heating pipe, the cooling pipe, the upstream side of the bypass pipe and the downstream side of the temperature regulating portion, the storage device having the temperature of absorbing the fluid The function of producing volume changes.
在流體的體積隨溫度而變化的情況下,因為流體之溫度變化而造成其體積變化,而有可能會使得流體受到阻礙。此點,在手段6中,因為儲存裝置具有吸收該流體因為溫度而產生之體積變化的功能,即使在流體體積變化的情況下,也能夠維持流體的循環。而且,相較於將儲存裝置設置在該加熱管路、該冷卻管路、該旁通管之上游側及該調溫部的下游側及調溫部的上游側,藉由將儲存裝置設置在該加熱管路、該冷卻管路、該旁通管之上游側及該調溫部的上游側,能夠縮短在調節裝置和調溫部之間的流體的流動路徑。In the case where the volume of the fluid changes with temperature, the volume of the fluid changes due to the temperature change of the fluid, and the fluid may be hindered. In this regard, in the means 6, since the storage means has a function of absorbing the volume change of the fluid due to the temperature, the circulation of the fluid can be maintained even in the case where the volume of the fluid changes. Further, the storage device is disposed on the heating pipe, the cooling pipe, the upstream side of the bypass pipe, the downstream side of the temperature control portion, and the upstream side of the temperature control portion. The heating duct, the cooling duct, the upstream side of the bypass duct, and the upstream side of the temperature regulating portion can shorten a flow path of the fluid between the adjusting device and the temperature regulating portion.
手段7為,更包含操作裝置,其操作該調節裝置,以將該調溫部旁的流體的溫度控制至目標值。The means 7 further includes an operating device that operates the adjusting device to control the temperature of the fluid adjacent to the temperature regulating portion to a target value.
在上述手段7中藉由設置操作裝置,而能夠將調溫部的溫度調節到所欲之溫度。In the above means 7, by providing an operating device, the temperature of the temperature control unit can be adjusted to a desired temperature.
在手段8中,該操作裝置,將由檢測該調溫部旁流體之溫度的輸出溫度檢測裝置所得之檢測值對目標值進行回饋控制。In the means 8, the operating means controls the detection value obtained by the output temperature detecting means for detecting the temperature of the fluid adjacent to the temperature regulating portion to the target value.
在上述手段8中,因為執行回饋控制,而能夠使檢測值精確地達到目標值。In the above means 8, since the feedback control is executed, the detected value can be accurately reached to the target value.
在手段9中,該調節裝置係為分別調節該加熱管路、該冷卻管路、該旁通管的下游側的流路面積的裝置;該操作裝置包含轉換裝置,其將依據該檢測值和該目標值的差異的量,轉換為該加熱管路、該冷卻管路、該旁通管的個別之流路面積操作量。In the means 9, the adjusting device is a device for respectively adjusting the heating pipe, the cooling pipe, and the flow path area on the downstream side of the bypass pipe; the operating device includes a switching device which will be based on the detected value and The amount of difference in the target value is converted into an operation amount of the individual flow path area of the heating pipe, the cooling pipe, and the bypass pipe.
在上述手段9中,藉由設置轉換裝置,就因為將檢測值和該目標值的差異定量化為單一的量,依據該定量化的量,而能夠調節(操作)上述3個管路的流路面積。In the above-described means 9, by providing the conversion means, since the difference between the detected value and the target value is quantified into a single amount, the flow of the above three pipes can be adjusted (operated) according to the quantified amount. Road area.
再者,以此為佳:轉換裝置,在檢測值大於目標值的情況下,相對於該差異之變化,而變化冷卻管路和旁通管的流路面積,在檢測值小於目標值的情況下,相對於該差異之變化,而變化加熱管路和旁通管的流路面積。Furthermore, it is preferable that the conversion device changes the flow path area of the cooling pipe and the bypass pipe with respect to the change of the difference when the detected value is larger than the target value, and the detected value is smaller than the target value. Next, the flow path area of the heating pipe and the bypass pipe is changed with respect to the change of the difference.
在手段10中,該操作裝置操作該調節裝置,在該目標值變化後之特定期間,不用上述回饋控制,而依據檢測該旁通管溫度之旁通溫度檢測裝置的檢測值,以開放迴路控制該調溫部旁流體之溫度。In the means 10, the operating device operates the adjusting device to control the detection value of the bypass temperature detecting device that detects the temperature of the bypass pipe in a specific period after the target value is changed, without using the feedback control, and in an open loop control The temperature of the fluid next to the temperature control unit.
當目標值變化時,為了藉由回饋控制而使檢測值快速地到達目標值,而要求加大該控制的增益值。而且,在加大該控制的增益值的情況下,檢測值在目標值上下變動的變動量也變大。如此,在回饋控制中,提高反應性和抑制變動量之間具有相互交換的關係。此點,在手段10中,在目標值變化之後的特定期間內不用回饋控制而使用開放迴路控制,因此,即使設定回饋控制以抑制檢測值在目標值上下變動的變動量,也能夠提高目標值變化時的反應性。When the target value is changed, in order to quickly reach the target value by the feedback control, it is required to increase the gain value of the control. Further, when the gain value of the control is increased, the amount of fluctuation in which the detected value fluctuates above and below the target value also increases. As described above, in the feedback control, the relationship between the improvement of the reactivity and the suppression of the fluctuation amount is mutually exchanged. In this case, in the means 10, the open loop control is used without the feedback control in the specific period after the target value change. Therefore, even if the feedback control is set to suppress the fluctuation amount of the detected value from moving up and down the target value, the target value can be increased. Reactivity when changing.
在手段11中,該調節裝置係為分別調節該加熱管路、該 冷卻管路、該旁通管的下游側的流路面積的裝置;該操作裝置,當該目標值變化時,在該旁通管內之流體的溫度高於該目標值的情況下,操作該旁通管及該冷卻管路的流路面積,藉此,開放迴路控制該調溫部的溫度至目標值,在該旁通管內之流體的溫度低於該目標值的情況下,操作該旁通管及該加熱管路的流路面積,藉此,開放迴路控制該調溫部的溫度至目標值。In the means 11, the adjusting device adjusts the heating pipe separately, a cooling pipe, a flow passage area on a downstream side of the bypass pipe; the operating device, when the target value is changed, if the temperature of the fluid in the bypass pipe is higher than the target value, operating the a flow path area of the bypass pipe and the cooling pipe, whereby the open circuit controls the temperature of the temperature regulating portion to a target value, and when the temperature of the fluid in the bypass pipe is lower than the target value, operating the The flow path area of the bypass pipe and the heating pipe, whereby the open circuit controls the temperature of the temperature control unit to a target value.
在上述手段11中,相較於也使用加熱通路,在旁通管內之流體的溫度高於該目標值的情況下,藉由操作該旁通管及該冷卻管路的流路面積,能夠降低能量之消耗。再者,相較於也使用冷卻管路,在該旁通管內之流體的溫度低於該目標值的情況下,操作該旁通管及該加熱管路的流路面積,能夠降低能量之消耗。In the above-described means 11, the heating path is also used, and when the temperature of the fluid in the bypass pipe is higher than the target value, the flow path area of the bypass pipe and the cooling pipe can be operated. Reduce energy consumption. Furthermore, when the temperature of the fluid in the bypass pipe is lower than the target value, the flow path area of the bypass pipe and the heating pipe can be reduced as compared with the case where the cooling pipe is also used. Consumption.
手段12為,更包含過渡時目標值設定裝置,其在關於該調溫部之溫度的要求改變的情況下,使該目標值較該要求變化更大幅度變化。The means 12 further includes a transition time target value setting means for causing the target value to vary more greatly than the required change when the request for the temperature of the temperature adjustment unit is changed.
為了在目標值變化之後使調溫部的溫度到達目標值,必須藉由經過溫度調節的流體而使調溫部的溫度變化,因此,在向著目標值變化時會產生反應延遲。而且,為了變化被控制對象的溫度,在調溫部的溫度變化之後,必須在被控制對象和調溫部之間進行能量交換,所以被控制對象的溫度變化之反應延遲會更為明顯。在此,在上述手段12中,當實際要求變化時,藉由使該目標值較該要求變化更大幅度變化,而能夠使得調溫部或被控制對象的溫度,快速地到達所要求之溫度。In order to bring the temperature of the temperature adjustment unit to the target value after the target value is changed, it is necessary to change the temperature of the temperature adjustment unit by the temperature-regulated fluid, and therefore, a reaction delay occurs when the temperature is changed toward the target value. Further, in order to change the temperature of the controlled object, after the temperature of the temperature adjustment unit is changed, energy exchange must be performed between the controlled object and the temperature control unit, so that the reaction delay of the temperature change of the controlled object is more remarkable. Here, in the above-mentioned means 12, when the actual request is changed, the temperature of the temperature control unit or the controlled object can be quickly reached to the required temperature by making the target value change more greatly than the required change. .
手段13為,更包含開放迴路控制配合支援裝置,其要求選取關於該開放迴路控制的增益值、該開放迴路控制的持續時間、及該開放迴路控制時的目標值之設定中至少一者的複數個選項中任意一者,並對應於選取的值進行該溫度控制。The means 13 further includes an open loop control cooperation support device that requests a plural of at least one of a gain value of the open loop control, a duration of the open loop control, and a target value of the open loop control. Any of the options, and the temperature control is performed corresponding to the selected value.
在開放迴路控制中,其增益或持續時間、及目標值之最佳設定,係隨著被控制對象而異。因此,在溫度控制裝置中,這些參數從一開始就是固定的,而使得被控制對象無法執行最佳的開放迴路控制。此點,在手段13中,藉由設置配合支援裝置,能夠降低溫度控制裝置的使用者在對應於被控制對象而使用參數時的勞力。In open loop control, the gain or duration, and the optimal setting of the target value vary with the object being controlled. Therefore, in the temperature control device, these parameters are fixed from the beginning, so that the controlled object cannot perform optimal open loop control. In this regard, in the means 13, by providing the cooperation supporting means, it is possible to reduce the labor of the user of the temperature control device when using the parameter in accordance with the controlled object.
在手段14中,該調節裝置係為分別調節該加熱管路、該冷卻管路、該旁通管的下游側的流路面積的裝置;該操作裝置,在該調溫部的溫度處於不變狀態的情況下,禁止由該調節裝置對該加熱管路及該冷卻管路調節之流路面積為0。In the means 14, the adjusting device is a device for respectively adjusting the heating pipe, the cooling pipe, and the flow passage area on the downstream side of the bypass pipe; the operating device has the temperature in the temperature regulating portion unchanged In the case of the state, the flow path area adjusted by the adjusting device to the heating pipe and the cooling pipe is prohibited to be zero.
在禁止流體從加熱管路或冷卻管路流到調溫部的情況下,調節裝置的下游側和上述被禁止的管路之間會產生溫度梯度。因此,在解除禁止之後,流出到調溫部的流體之溫度受到溫度梯度的影響,而可能使得調溫部的溫度到達所欲之溫度所需的時間拉長。此點,在上述手段14中,在該調溫部的溫度處於不變狀態的情況下,禁止由該調節裝置對該加熱管路及該冷卻管路調節之流路面積為0,藉此,能夠適當地抑制溫度梯度,而且,能夠使得更快速地使調溫部的溫度到達所欲之溫度。In the case where fluid is prohibited from flowing from the heating pipe or the cooling pipe to the temperature regulating portion, a temperature gradient is generated between the downstream side of the regulating device and the above-mentioned prohibited pipe. Therefore, after the prohibition is released, the temperature of the fluid flowing out to the temperature regulating portion is affected by the temperature gradient, and the time required for the temperature of the temperature regulating portion to reach the desired temperature may be elongated. In this case, in the above-mentioned means 14, when the temperature of the temperature adjustment unit is in a constant state, the flow path area for adjusting the heating pipe and the cooling pipe by the adjusting device is prohibited from being 0, whereby It is possible to appropriately suppress the temperature gradient, and it is possible to make the temperature of the temperature control portion reach the desired temperature more quickly.
再者,在手段14中,也可以在該加熱管路較該調節裝置上游側,設置加熱側溫度檢測裝置以檢測其溫度,在該冷卻 管路較該調節裝置上游側,設置冷卻側溫度檢測裝置以檢測其溫度。在此情況下,藉由設置該流出管路,能夠適當地抑制因為禁止流體從加熱管路或冷卻管路流到調溫部而導致該檢測裝置受到上述溫度梯度的影響。Furthermore, in the means 14, the heating side temperature detecting means may be provided on the upstream side of the adjusting means to detect the temperature of the heating line, and the cooling may be performed. The pipeline is provided on the upstream side of the regulating device, and a cooling side temperature detecting device is provided to detect the temperature thereof. In this case, by providing the outflow line, it is possible to appropriately suppress the influence of the temperature gradient caused by the flow of the fluid from the heating pipe or the cooling pipe to the temperature regulating portion.
以下參照圖式,說明本發明溫度控制裝置的第1實施型態。Hereinafter, a first embodiment of the temperature control device of the present invention will be described with reference to the drawings.
第1圖顯示依據本發明第1實施型態的溫度控制裝置之整體構成圖。Fig. 1 is a view showing the overall configuration of a temperature control device according to a first embodiment of the present invention.
圖示的溫度控制裝置係用於例如生物工學的領域或化學工業的領域之加工/製造工程、生物學/化學實驗、半導體製造程序、或精密機器的製造程序中。溫度控制裝置具有調溫板10。調溫板10,其上承載了被控制對象,係為可以從垂直下方支撐被控制對象之板狀元件,並和被控制對象交換熱能。詳言之,在調溫板10的內部設有管路(調溫部11),以供透過合流部12而進入之非壓縮性流體(以作為熱能交換介質之液狀媒體(液狀溫度媒體)為佳)流動之用,藉由該流體的溫度而調節調溫板10的溫度。再者,被控制對象為,例如被驗化學物質、半導體晶圓、精密機器等。The illustrated temperature control device is used in, for example, the field of biotechnology or the processing/manufacturing engineering, biological/chemical experiments, semiconductor manufacturing processes, or manufacturing processes of precision machines in the field of the chemical industry. The temperature control device has a temperature regulating plate 10. The temperature regulating plate 10, on which the controlled object is carried, is a plate-like element that can support the controlled object from vertically below, and exchanges thermal energy with the controlled object. In detail, a pipe (tempering portion 11) is provided inside the temperature regulating plate 10 for the non-compressible fluid that enters through the merging portion 12 (for liquid medium as a heat exchange medium (liquid temperature medium) Preferably, for flow, the temperature of the temperature regulating plate 10 is adjusted by the temperature of the fluid. Further, the controlled object is, for example, a chemical substance to be tested, a semiconductor wafer, a precision machine, or the like.
在調溫板10中流動的流體,透過流出管路14而流入儲存槽16。儲存槽16係由液體所充填,但是,在其上部有空隙,並注入氣體。因此,即使流體的體積因為溫度變化而有改變,該變化係由作為壓縮性流體之氣體而吸收。因此,藉此能夠 避免因為流體體積變化而造成流體流動之阻礙。The fluid flowing in the temperature regulating plate 10 flows into the storage tank 16 through the outflow line 14. The storage tank 16 is filled with a liquid, but has a space in the upper portion thereof and injects a gas. Therefore, even if the volume of the fluid changes due to temperature changes, the change is absorbed by the gas as a compressive fluid. Therefore, it is possible to Avoid the obstruction of fluid flow due to fluid volume changes.
儲存槽16的流體,係由泵浦18所吸入,並輸出到分岔部19。在此,泵浦18可以由隔膜泵浦、渦流泵浦、串級泵浦等構成。上述分岔部19係與冷卻管路20、旁通管30及加熱管路40連接。The fluid in the storage tank 16 is sucked by the pump 18 and output to the branching portion 19. Here, the pump 18 may be constituted by a diaphragm pump, a vortex pump, a cascade pump, or the like. The branching portion 19 is connected to the cooling duct 20, the bypass pipe 30, and the heating pipe 40.
冷卻管路20係將從分岔部19流入之流體冷卻,並使其流出到合流部12。冷卻管路20設有冷卻部22包覆在其一部份上。冷卻部22將從分岔部19流入之流體冷卻。詳言之,冷卻部22設有管路以供冷卻到特定溫度之流體(水、油、冷媒)流動之用,藉由該流體使得冷卻管路20中的流體冷卻。冷卻管路20在冷卻部22上游側端部和下游側端部之間具有彎曲的管路構造,藉此擴大冷卻部22內之冷卻管路20內的容積。再者,不使用該彎曲構造,而使用例如僅在冷卻部22內擴大其流路面積,藉此擴大冷卻部22內的容積亦可。The cooling duct 20 cools the fluid flowing in from the branching portion 19 and causes it to flow out to the merging portion 12. The cooling line 20 is provided with a cooling portion 22 covering a part thereof. The cooling unit 22 cools the fluid flowing from the branching portion 19 . In detail, the cooling portion 22 is provided with a conduit for cooling a fluid (water, oil, refrigerant) cooled to a specific temperature by which the fluid in the cooling conduit 20 is cooled. The cooling duct 20 has a curved piping structure between the upstream end portion and the downstream side end portion of the cooling portion 22, thereby expanding the volume in the cooling duct 20 in the cooling portion 22. Further, without using the curved structure, for example, the flow path area may be enlarged only in the cooling portion 22, thereby increasing the volume in the cooling portion 22.
再者,在冷卻管路20的下游側,設有連續調節冷卻管路20之內的流路面積的冷卻用閥24。而且,在冷卻管路20中較冷卻用閥24上游處,設有檢測冷卻管路20內流體溫度的冷卻用溫度感測器26,在較冷卻用閥24下游處,則設有檢測冷卻管路20內流體之質量流量或容積流量的冷卻用流量器28。Further, on the downstream side of the cooling duct 20, a cooling valve 24 for continuously adjusting the flow passage area in the cooling duct 20 is provided. Further, in the cooling pipe 20, upstream of the cooling valve 24, a cooling temperature sensor 26 for detecting the temperature of the fluid in the cooling pipe 20 is provided, and downstream of the cooling valve 24, a detecting cooling pipe is provided. A flow rate device 28 for cooling the mass flow or volume flow of the fluid in the road 20.
再者,冷卻管路20,在比冷卻部22更下游之處,其流路面積大致上為固定較佳。Further, in the cooling duct 20, the flow passage area is substantially fixed at a position further downstream than the cooling portion 22.
另一方面,旁通管30係將從分岔部19流入之流體直接透過合流部12流出到調溫部11。在旁通管30的下游側,設有連續調節旁通管30之內的流路面積的旁通用閥34。而且, 在旁通管30中較旁通用閥34上游處,設有檢測旁通管30內流體溫度的旁通用溫度感測器36,在較旁通用閥34下游處,則設有檢測旁通管30內流體之質量流量或容積流量的旁通用流量器38。On the other hand, the bypass pipe 30 directly flows out of the fluid flowing from the branching portion 19 through the merging portion 12 to the temperature adjustment portion 11. On the downstream side of the bypass pipe 30, a bypass common valve 34 that continuously adjusts the flow passage area in the bypass pipe 30 is provided. and, In the bypass pipe 30, upstream of the side common valve 34, a side common temperature sensor 36 for detecting the temperature of the fluid in the bypass pipe 30 is provided, and downstream of the side common valve 34, a bypass pipe 30 is provided. A side-by-side flow meter 38 for mass flow or volumetric flow of the internal fluid.
加熱管路40,係將從分岔部19流入之流體加熱,並使其流出到合流部12。加熱管路40設有加熱部42包覆在其一部份上。加熱部42將從分岔部19流入之流體加熱。詳言之,加熱部42設有管路以供加熱到特定溫度之流體(水、油、熱媒)流動之用,藉由該流體使得加熱管路40中的流體加熱。加熱管路40在加熱部42上游側端部和下游側端部之間具有彎曲的管路構造,藉此擴大加熱部42內之加熱管路40內的容積。再者,不使用該彎曲構造,而使用例如僅在加熱部42內擴大其流路面積亦可。The heating pipe 40 heats the fluid flowing in from the branching portion 19 and flows out to the merging portion 12. The heating pipe 40 is provided with a heating portion 42 covering a part thereof. The heating unit 42 heats the fluid flowing from the branching portion 19 . In detail, the heating portion 42 is provided with a conduit for flowing a fluid (water, oil, heat medium) heated to a specific temperature, by which the fluid in the heating conduit 40 is heated. The heating pipe 40 has a curved piping structure between the upstream end portion and the downstream side end portion of the heating portion 42, thereby expanding the volume in the heating pipe 40 in the heating portion 42. Further, the curved structure may not be used, and for example, the flow path area may be enlarged only in the heating portion 42.
再者,在加熱管路40的下游側,設有連續調節加熱管路40之內的流路面積的加熱用閥44。而且,在加熱管路40中較加熱用閥44上游處,設有檢測加熱管路40內流體溫度的加熱用溫度感測器46,在較加熱用閥44下游處,則設有檢測加熱管路40內流體之質量流量或容積流量的加熱用流量器48。Further, on the downstream side of the heating pipe 40, a heating valve 44 for continuously adjusting the flow path area in the heating pipe 40 is provided. Further, in the heating pipe 40, upstream of the heating valve 44, a heating temperature sensor 46 for detecting the temperature of the fluid in the heating pipe 40 is provided, and downstream of the heating valve 44, a detecting heating pipe is provided. A flow vessel 48 for heating the mass flow or volume flow of the fluid in the path 40.
再者,加熱管路40,在比加熱部42更下游之處,其流路面積大致上為固定較佳。Further, in the heating pipe 40, the flow path area is substantially fixed at a position further downstream than the heating portion 42.
冷卻管路20、旁通管30及加熱管路40,係連接於位於其下游位置的合流部12。在此,相較於冷卻管路20、旁通管30及加熱管路40的流路面積,在不使流體流速變慢的範圍內,盡量不擴大合流部12內的流路面積或合流部12和調溫 部11之間的流路面積較佳。亦即,合流部12或合流部12和調溫部11之間的流路面積,設定為能夠抑制因為其容積而造成的流體之滯留,以盡量使得從冷卻用閥24、加熱用閥44流出的流體之流速不降低。The cooling line 20, the bypass pipe 30, and the heating pipe 40 are connected to the merging portion 12 at a position downstream thereof. Here, as compared with the flow path area of the cooling duct 20, the bypass pipe 30, and the heating pipe 40, the flow path area or the merging portion in the merging portion 12 is not enlarged as much as possible in a range where the fluid flow rate is not slowed down. 12 and temperature adjustment The flow path area between the sections 11 is preferred. In other words, the flow path area between the merging portion 12 or the merging portion 12 and the temperature regulating portion 11 is set so as to suppress the retention of the fluid due to the volume thereof, so as to flow out from the cooling valve 24 and the heating valve 44 as much as possible. The flow rate of the fluid does not decrease.
上述合流部12和調溫部11之間,設有用以檢測由調溫部11輸出之流體的溫度的輸出溫度感測器51。An output temperature sensor 51 for detecting the temperature of the fluid outputted from the temperature adjustment unit 11 is provided between the merging portion 12 and the temperature adjustment portion 11.
另一方面,控制裝置50,對應於被控制對象之溫度的要求值(要求溫度Tr)而操作冷卻用閥24、旁通用閥34、或加熱用閥44,藉此以調節調溫部11內之流體的溫度,並藉此間接地控制調溫板10上的被控制對象之溫度。此時,控制裝置50適當地參照冷卻用溫度感測器26、旁通用溫度感測器36、加熱用溫度感測器46、冷卻用流量器28、旁通用流量器38、加熱用流量器48等的檢測值。On the other hand, the control device 50 operates the cooling valve 24, the bypass valve 34, or the heating valve 44 in accordance with the required value of the temperature of the controlled object (required temperature Tr), thereby adjusting the temperature adjusting unit 11 The temperature of the fluid, and thereby indirectly controls the temperature of the controlled object on the temperature regulating plate 10. At this time, the control device 50 appropriately refers to the cooling temperature sensor 26, the bypass temperature sensor 36, the heating temperature sensor 46, the cooling flow rate 28, the bypass general flow device 38, and the heating flow rate 48. The detected value of etc.
再者,控制裝置50包括:用以驅動冷卻用閥24、旁通用閥34、或加熱用閥44的驅動部,以及依據上述各種檢測裝置的檢測值計算上述驅動部輸出之操作訊號的計算部。該計算部可以由專用的硬體裝置構成,並且,也可以具有微電腦。再者,也可以具有一般通用的個人電腦,以及使其進行計算的程式。Further, the control device 50 includes a drive unit for driving the cooling valve 24, the bypass valve 34, or the heating valve 44, and a calculation unit that calculates an operation signal output from the drive unit based on the detected values of the various detection devices. . The calculation unit may be constituted by a dedicated hardware device, and may also have a microcomputer. Furthermore, it is also possible to have a general-purpose personal computer and a program for making calculations.
依據上述溫度控制裝置,對應於要求溫度Tr的變化,能夠使調溫部11內之流體的溫度快速變化。亦即,在冷卻管路20內的流體溫度低於要求溫度Tr,且加熱管路40內流體的溫度高於要求溫度Tr的範圍中,不論要求溫度Tr的值為何,都能夠藉由調節從冷卻管路20、旁通管30、及加熱管路40流出的流體流量,而能夠使調溫部11內之流體的溫度快速變 為所欲之溫度。According to the temperature control device described above, the temperature of the fluid in the temperature control unit 11 can be rapidly changed in accordance with the change in the required temperature Tr. That is, in the range where the temperature of the fluid in the cooling line 20 is lower than the required temperature Tr and the temperature of the fluid in the heating line 40 is higher than the required temperature Tr, regardless of the value of the required temperature Tr, it can be adjusted by The flow rate of the fluid flowing out of the cooling line 20, the bypass pipe 30, and the heating pipe 40 can rapidly change the temperature of the fluid in the temperature regulating portion 11. For the desired temperature.
再者,上述溫度控制裝置藉由設置旁通管30,能夠降低用以將調溫部11內的溫度維持於定值所耗用的能量。以下就此點說明之。Further, by providing the bypass pipe 30, the temperature control device can reduce the energy used to maintain the temperature in the temperature control unit 11 at a constant value. This is explained below.
例如,循環於調溫部11的流體為水,冷卻管路20中的溫度為攝氏10度,加熱管路40內的溫度為攝氏70度,流動於調溫部11中的流體之流量為20L/分。再者,當實現將輸出溫度感測器51的檢測值Td控制在攝氏40度的穩定狀態時,從調溫部11流出的流體的溫度上升到攝氏43度。在此情況下,藉由使冷卻管路20及旁通管30的流體流出到調溫部11,並且不使用加熱管路40內的流體,而能夠執行溫度控制。探究此時的能量消耗量。For example, the fluid circulating in the temperature regulating portion 11 is water, the temperature in the cooling pipe 20 is 10 degrees Celsius, the temperature in the heating pipe 40 is 70 degrees Celsius, and the flow rate of the fluid flowing in the temperature regulating portion 11 is 20L. /Minute. Further, when the detected value Td of the output temperature sensor 51 is controlled to a steady state of 40 degrees Celsius, the temperature of the fluid flowing out of the temperature regulating portion 11 rises to 43 degrees Celsius. In this case, temperature control can be performed by causing the fluid of the cooling line 20 and the bypass pipe 30 to flow out to the temperature adjustment portion 11 and not using the fluid in the heating pipe 40. Explore the amount of energy consumed at this time.
從冷卻管路20流出到調溫部11的流體之流量為「Wa」,則下式成立。When the flow rate of the fluid flowing out from the cooling pipe 20 to the temperature adjustment unit 11 is "Wa", the following formula is established.
20(L/分)×40(℃)=10(℃)×Wa+43(℃)×(20-Wa)20 (L / min) × 40 (°C) = 10 (°C) × Wa + 43 (°C) × (20-Wa)
由此可知Wa≒1.8L/分。This shows that Wa ≒ 1.8 L / min.
因此,在冷卻部22消耗之能量消耗量Qa如下。Therefore, the energy consumption amount Qa consumed in the cooling unit 22 is as follows.
Qc=(43-10)×1.8×60(秒)÷(860:轉換係數)=4.1kWQc=(43-10)×1.8×60 (seconds)÷(860: conversion factor)=4.1kW
相對於此,在不具有旁通管30之構成的情況下,冷卻部22的能量消耗量Qa和加熱部42的能量消耗量Qc如下。On the other hand, when the configuration of the bypass pipe 30 is not provided, the energy consumption amount Qa of the cooling unit 22 and the energy consumption amount Qc of the heating unit 42 are as follows.
Qa=(43-10)×10(L/分)×60(秒)÷860≒23kW Qc=(70-43)×10(L/分)×60(秒)÷860≒19kWQa=(43-10)×10(L/min)×60 (seconds)÷860≒23kW Qc=(70-43)×10(L/min)×60 (seconds)÷860≒19kW
因此,能量消耗量Q為「42kW」,係為設置旁通管30的情況之大約10倍。Therefore, the energy consumption amount Q is "42 kW", which is about 10 times that of the case where the bypass pipe 30 is provided.
繼之,詳述實施型態之控制裝置50執行之溫度控制。第 2圖顯示控制裝置50執行的處理中的回饋控制之處理程序。例如,該處理係由控制裝置50重複地週期性執行。Next, the temperature control performed by the control device 50 of the embodiment is detailed. First 2 is a view showing a processing procedure of the feedback control in the processing executed by the control device 50. For example, the processing is repeatedly performed periodically by the control device 50.
在該一連串的處理中,首先在步驟S10中,判斷是否為開放迴路控制。該處理係為判斷回饋控制的實行條件是否成立。開放迴路控制係為在後述之條件下實行,此時不執行回饋控制。In the series of processes, first, in step S10, it is determined whether or not the open loop control is performed. This processing is to determine whether or not the execution condition of the feedback control is established. The open loop control is performed under the conditions described later, and the feedback control is not executed at this time.
在步驟S10中判斷為否的情況下,在步驟S12中,取得輸出溫度感測器51的檢測值Td。在繼之的步驟S14中,算出用以將檢測值Td回饋控制到目標值Tt的基本操作量MB。在此,目標值Tt為依據要求溫度Tr而決定之值,在回饋控制時視為要求溫度Tr。基本操作量MB為,依據檢測值Td對於目標值Tt之差異所算出之量。詳言之,在本實施型態中,依據檢測值Td和目標值Tt之差△的PID(比例微分積分)而算出基本操作量MB。If the determination in step S10 is NO, the detected value Td of the output temperature sensor 51 is obtained in step S12. In the next step S14, the basic operation amount MB for feeding back the detected value Td to the target value Tt is calculated. Here, the target value Tt is a value determined according to the required temperature Tr, and is regarded as a required temperature Tr at the time of feedback control. The basic operation amount MB is an amount calculated based on the difference of the detected value Td with respect to the target value Tt. In detail, in the present embodiment, the basic operation amount MB is calculated based on the PID (proportional differential integral) of the difference Δ between the detected value Td and the target value Tt.
繼之,在步驟S16中,將基本操作量MB轉換為冷卻用閥24、旁通用閥34、及加熱用閥44個別之操作量(開度Va,Vb,Vc)。在此係使用第3圖所示之關係。在此,在基本操作量MB未達0的情況下,冷卻用閥24的開度Va隨著基本操作量MB的增加而單方向明顯減少,其在基本操作量MB大於0的情況下則為0。此係為,檢測值Td高於目標值Tt越多則使冷卻管路20的流量增加,並且,在檢測值Td低於目標值Tt的情況下,使得冷卻管路20不被使用而為之設定。再者,加熱用閥44的開度Vb,在基本操作量MB大於0的情況下,隨著基本操作量MB的增加而單向地明顯增加,在基本操作量MB小於0的情況下則為0。此係為,檢測值Td低於目標值Tt越多則使 加熱管路40的流量增加,並且,在檢測值Td高於目標值Tt的情況下,使得加熱管路40不被使用而為之設定。再者,旁通用閥34的開度,隨著基本操作量MB離0越遠,則其單向地明顯減少。再者,在第3圖中,各開度之設定,係使得從3個管路中流出之總和流量不隨著基本操作量MB的值而變化較佳。Then, in step S16, the basic operation amount MB is converted into the individual operation amounts (opening degrees Va, Vb, Vc) of the cooling valve 24, the bypass common valve 34, and the heating valve 44. Here, the relationship shown in Fig. 3 is used. Here, in the case where the basic operation amount MB is less than 0, the opening degree Va of the cooling valve 24 is significantly reduced in one direction as the basic operation amount MB is increased, and in the case where the basic operation amount MB is larger than 0, 0. In this case, the more the detected value Td is higher than the target value Tt, the flow rate of the cooling duct 20 is increased, and in the case where the detected value Td is lower than the target value Tt, the cooling duct 20 is not used. set up. Further, in the case where the basic operation amount MB is larger than 0, the opening degree Vb of the heating valve 44 is unidirectionally increased as the basic operation amount MB is increased, and when the basic operation amount MB is less than 0, 0. In this case, the more the detected value Td is lower than the target value Tt, the more The flow rate of the heating line 40 is increased, and in the case where the detected value Td is higher than the target value Tt, the heating line 40 is set without being used. Further, the opening degree of the bypass valve 34 is significantly reduced unidirectionally as the basic operation amount MB is further away from zero. Further, in Fig. 3, the setting of each opening degree is such that the total flow rate flowing out of the three pipes does not change with the value of the basic operation amount MB.
藉由此設定,依據檢測值Td和目標值Tt之差△的單一的PID的計算而算出基本操作量MB,能夠設定冷卻用閥24、旁通用閥34、加熱用閥44之3個閥的操作量。By setting this, the basic operation amount MB is calculated based on the calculation of the single PID of the difference Δ between the detected value Td and the target value Tt, and the three valves of the cooling valve 24, the bypass valve 34, and the heating valve 44 can be set. The amount of operation.
當前述之第2圖的步驟S16的處理結束時,在步驟S18中,操作冷卻用閥24、旁通用閥34、加熱用閥44之3個閥。再者,在步驟S10中判斷為否定的情況,或在步驟S18的處理結束的情況下,結束此一連串的處理。When the process of step S16 in the second drawing described above is completed, in step S18, three valves of the cooling valve 24, the bypass valve 34, and the heating valve 44 are operated. In addition, when it is judged as negative in step S10, or when the process of step S18 is completed, this series of processes is ended.
藉由如上述地使用回饋控制,能夠使檢測值Td精密地隨著目標值Tt而變。但是,為了藉由回饋控制使得檢測值Td對於目標值Tt的反應性提高,必須要求加大回饋控制的增益值,但是當增益值變大,檢測值在目標值上下變動的變動量也變大。如此一來,在回饋控制中,提高對於目標值Tt之變化的反應性和降低檢測值Td的變動量之間具有相互交換的關係。因此,在降低變動量的情況下,就犧牲了反應性。在第4圖中,顯示在目標值Tt變化時使用回饋控制之情況下,檢測值Td及被控制對象之溫度的變化。By using the feedback control as described above, the detected value Td can be precisely changed in accordance with the target value Tt. However, in order to increase the reactivity of the detected value Td with respect to the target value Tt by the feedback control, it is necessary to increase the gain value of the feedback control, but when the gain value becomes larger, the fluctuation amount of the detected value fluctuates above and below the target value. . As a result, in the feedback control, the relationship between the reactivity with respect to the change in the target value Tt and the amount of change in the detected value Td is increased. Therefore, in the case of reducing the amount of variation, the reactivity is sacrificed. In the fourth diagram, the detected value Td and the temperature of the controlled object are changed when the feedback control is used when the target value Tt changes.
如圖所示,在檢測值Td到達目標值Tt之前產生反應延遲,而且,被控制對象的溫度到達目標值Tt之前需要更長的時間。此係為,為了使被控制對象的溫度變化,必須要調溫 部11的溫度變化,透過調溫板10和調溫部11的熱能交換而使調溫板10的溫度變化,調溫板10和被控制對象之間產生的熱能交換之故。因此,為了降低檢測值Td的變動量,而設定回饋控制,難以藉由回饋控制而使得被控制對象的溫度快速到達目標值Tt。在本實施型態中,在外部傳來的要求溫度Tr變化的情況下,係使用開放迴路控制。再者,此時,使該目標值Tt的變化較該要求溫度Tr的變化更大幅度。As shown in the figure, a reaction delay is generated before the detected value Td reaches the target value Tt, and it takes a longer time before the temperature of the controlled object reaches the target value Tt. In this case, in order to change the temperature of the controlled object, it is necessary to adjust the temperature. The temperature change of the portion 11 changes the temperature of the temperature regulating plate 10 through the exchange of heat energy between the temperature regulating plate 10 and the temperature regulating portion 11, and the heat energy generated between the temperature regulating plate 10 and the controlled object is exchanged. Therefore, in order to reduce the amount of fluctuation of the detected value Td, the feedback control is set, and it is difficult to quickly reach the target value Tt by the feedback control by the temperature of the controlled object. In the present embodiment, in the case where the required temperature Tr transmitted from the outside changes, open loop control is used. Further, at this time, the change in the target value Tt is made larger than the change in the required temperature Tr.
第5圖顯示本實施型態中目標值的設定處理之程序。該處理係由控制裝置50以例如週期性地重複執行。Fig. 5 is a view showing the procedure of the setting process of the target value in the present embodiment. This processing is repeatedly performed by the control device 50, for example, periodically.
在此一連串的處理中,首先在步驟S20中,判斷偏差控制執行旗標是否為開啟(On)。在此之偏差控制執行旗標,係為執行使目標值Tt大幅變化之偏差控制的旗標。而且,在偏差控制執行旗標為開啟的情況下,則進行步驟S22。在步驟S22中,判斷要求溫度Tr的變化量△Tr的絕對值是否在臨界值α以上。在此,臨界值α係為,用以判斷是否為如前述第2圖中藉由回饋控制無法使被控制對象的溫度快速達到要求的變化的情況。而且,在判斷為在臨界值α以上的情況下,在步驟S24中,使偏差控制執行旗標為開啟,並且開始計時動作以對偏差控制時間計時。In this series of processes, first, in step S20, it is judged whether or not the deviation control execution flag is ON. The deviation control execution flag here is a flag for performing deviation control for causing the target value Tt to vary greatly. Moreover, when the deviation control execution flag is on, step S22 is performed. In step S22, it is determined whether or not the absolute value of the amount of change ΔTr of the required temperature Tr is equal to or greater than the critical value α. Here, the threshold value α is used to determine whether or not the temperature of the controlled object cannot be quickly brought to the required change by the feedback control as in the above-described second drawing. Further, when it is determined that the threshold value α is equal to or greater than the threshold value α, the deviation control execution flag is turned on in step S24, and the timing operation is started to time the deviation control time.
當上述步驟S24的處理結束,或在步驟S20中判斷為肯定時,在步驟S26中,判斷變化量△Tr是否大於0。該處理係用以判斷是否產生使溫度上升的要求。而且在變化量△Tr大於0的情況下,執行步驟S28。在步驟S28中,將目標值Tt設定為:從加熱管路40中流體之溫度減去特定之補償值β之值。在此,目標值Tt越接近加熱.管路40內的溫度,則 能夠使被控制對象的溫度越快上升。但是,在目標值Tt高於加熱管路40內之溫度的情況下,就無法執行控制了。而且,可以藉由使流體在加熱管路40循環而使得加熱管路40內的溫度變化。因此,將目標值Tt設定為加熱管路40內的溫度減去補償值β。When the processing of the above step S24 is ended, or if the determination in step S20 is affirmative, in step S26, it is judged whether or not the amount of change ΔTr is greater than zero. This process is used to determine whether a request to increase the temperature is generated. Further, in a case where the amount of change ΔTr is greater than 0, step S28 is performed. In step S28, the target value Tt is set to subtract the value of the specific compensation value β from the temperature of the fluid in the heating line 40. Here, the closer the target value Tt is to the temperature in the heating pipe 40, then The temperature of the controlled object can be increased faster. However, in the case where the target value Tt is higher than the temperature in the heating pipe 40, the control cannot be performed. Moreover, the temperature within the heating line 40 can be varied by circulating the fluid in the heating line 40. Therefore, the target value Tt is set to the temperature in the heating line 40 minus the compensation value β.
另一方面,在步驟S26中判斷變化量△Tr低於0的情況下,在步驟S30中,將目標值Tt設定為冷卻管路20內的流體之溫度加上特定的補償值γ。在此,補償值γ的設定和上述補償值β的設定具有相同的意義。On the other hand, if it is determined in step S26 that the amount of change ΔTr is lower than 0, the target value Tt is set to the temperature of the fluid in the cooling duct 20 plus a specific compensation value γ in step S30. Here, the setting of the compensation value γ has the same meaning as the setting of the above-described compensation value β.
步驟S28及S30的處理中之目標值Tt的設定在偏差繼續時間Tbi內持續進行(步驟S32)。而且,在經過偏差繼續時間Tbi後,在步驟S34中,使目標值Tt為要求溫度Td。並且,使偏差控制執行旗標為關閉(Off)並且結束對偏差控制時間進行計時的計時動作。再者,在步驟S34的處理結束,或在上述步驟S22及S32中判斷為否定的情況下,結束此一連串的處理。The setting of the target value Tt in the processing of steps S28 and S30 is continued within the deviation continuing time Tbi (step S32). Then, after the deviation continuation time Tbi has elapsed, the target value Tt is made the required temperature Td in step S34. Then, the deviation control execution flag is turned off (Off) and the timing operation for counting the deviation control time is ended. Furthermore, when the process of step S34 is completed, or if the determination in steps S22 and S32 is negative, the series of processes is ended.
第6圖係顯示本實施型態中溫度控制的處理程序。該處理係由控制裝置50重複地週期性執行。Fig. 6 is a view showing the processing procedure of the temperature control in the present embodiment. This processing is repeatedly performed periodically by the control device 50.
在該一連串的處理中,首先在步驟S40中,判斷意味著執行開放迴路控制的旗標之開放迴路控制旗標是否為開啟(On)。並且,在開放迴路控制旗標不是開啟的情況下,進行步驟S42。在步驟S42中,判斷目標值Tt的變化量△Tt的絕對值是否在臨界值ε以上。而且,在判斷為在臨界值ε以上的情況下,在步驟S44中,使意味著執行開放迴路控制的旗標之開放迴路控制旗標為開啟,並且開始計時動作以對開放 迴路控制計時。In the series of processes, first, in step S40, it is judged whether or not the open loop control flag of the flag indicating the execution of the open loop control is ON. And, if the open loop control flag is not on, step S42 is performed. In step S42, it is determined whether or not the absolute value of the amount of change ΔTt of the target value Tt is equal to or greater than the critical value ε. Further, when it is determined that the threshold value is ε or more, in step S44, the open loop control flag of the flag indicating that the open loop control is executed is turned on, and the timing operation is started to be open. Loop control timing.
當上述步驟S44的處理結束,或在步驟S40中判斷為肯定時,進行步驟S46。在步驟S46中,判斷目標值Tt是否高於由旁通用溫度感測器36所檢測出的旁通管30內的流體之溫度Tb。該處理係為用以判斷使用旁通管30和加熱管路40來執行開放迴路控制,或使用旁通管30和冷卻管路20來執行開放迴路控制。When the processing of the above step S44 is ended, or if the determination in step S40 is affirmative, step S46 is performed. In step S46, it is determined whether or not the target value Tt is higher than the temperature Tb of the fluid in the bypass pipe 30 detected by the bypass common temperature sensor 36. This processing is for determining whether to use the bypass pipe 30 and the heating pipe 40 to perform open loop control, or to use the bypass pipe 30 and the cooling pipe 20 to perform open loop control.
繼之,在判斷目標溫度Tt高於旁通管30內的流體之溫度Tb的情況下,進行步驟S48。在步驟S48中,使用旁通管30和加熱管路40來執行開放迴路控制。亦即,若目標溫度Tt高於旁通管30內的流體之溫度Tb,則使用冷卻管路20只是浪費能量而已,所以使用旁通管30和加熱管路40來執行開放迴路控制。詳言之,使用加熱用溫度感測器46的溫度Tc及加熱用流量器48的流量Fc,以及旁通用溫度感測器36的溫度Tb和旁通用流量器38的流量Fb,以操作加熱用閥44及旁通用閥34,使得輸出到調溫部11的流體之溫度為目標值Tt。換言之,操作加熱用閥44及旁通用閥34,以使得下式成立。Next, when it is judged that the target temperature Tt is higher than the temperature Tb of the fluid in the bypass pipe 30, step S48 is performed. In step S48, the open loop control is performed using the bypass pipe 30 and the heating pipe 40. That is, if the target temperature Tt is higher than the temperature Tb of the fluid in the bypass pipe 30, the use of the cooling pipe 20 is only a waste of energy, so the bypass pipe 30 and the heating pipe 40 are used to perform the open circuit control. Specifically, the temperature Tc of the heating temperature sensor 46 and the flow rate Fc of the heating flow rate 48, and the temperature Tb of the bypass common temperature sensor 36 and the flow rate Fb of the bypass common flow meter 38 are used to operate the heating. The valve 44 and the bypass valve 34 cause the temperature of the fluid output to the temperature adjustment portion 11 to be the target value Tt. In other words, the heating valve 44 and the bypass valve 34 are operated such that the following equation is established.
Tt×(Fc+Fb)=Tc×Fc+Tb×FbTt × (Fc + Fb) = Tc × Fc + Tb × Fb
另一方面,在步驟S46中,在判斷目標溫度Tt低於旁通管30內的流體之溫度Tb的情況下,進行步驟S50。在步驟S50中,使用旁通管30和冷卻管路20來執行開放迴路控制。亦即,若目標溫度Tt低於旁通管30內的流體之溫度Tb,則使用加熱管路40只是浪費能量而已,所以使用旁通管30和冷卻管路20來執行開放迴路控制。詳言之,使用冷卻用溫度 感測器26的溫度Ta及冷卻用流量器28的流量Fa,以及旁通用溫度感測器36的溫度Tb和旁通用流量器38的流量Fb,以操作冷卻用閥24及旁通用閥34,使得輸出到調溫部11的流體之溫度為目標值Tt。換言之,操作冷卻用閥24及旁通用閥34,以使得下式成立。On the other hand, in step S46, when it is judged that the target temperature Tt is lower than the temperature Tb of the fluid in the bypass pipe 30, step S50 is performed. In step S50, the bypass circuit 30 and the cooling line 20 are used to perform open loop control. That is, if the target temperature Tt is lower than the temperature Tb of the fluid in the bypass pipe 30, the use of the heating pipe 40 is only a waste of energy, so the bypass pipe 30 and the cooling pipe 20 are used to perform the open circuit control. In detail, use the cooling temperature The temperature Ta of the sensor 26 and the flow rate Fa of the cooling flow rate 28, and the temperature Tb of the bypass common temperature sensor 36 and the flow rate Fb of the bypass common flow meter 38 to operate the cooling valve 24 and the bypass valve 34, The temperature of the fluid output to the temperature adjustment unit 11 is made the target value Tt. In other words, the cooling valve 24 and the bypass valve 34 are operated such that the following equation is established.
Tt×(Fa+Fb)=Ta×Fa+Tb×FbTt × (Fa + Fb) = Ta × Fa + Tb × Fb
當上述步驟S48及S50的處理結束時,進行步驟S52。在步驟S52中,判斷是否已經過特定的期間Top。在此,特定的期間Top係用以決定開放迴路控制繼續的時間。在本實施型態中,為了使得依據上述第5圖所示之處理而使目標值Tt和要求溫度Tr不同之偏差繼續時間Tbi內不進行回饋控制,而將特定的期間Top設定為較偏差繼續時間Tbi長。而且,在判斷為已經過特定的期間Top的情況下,在步驟S54中,使開放迴路控制旗標為關閉(Off),並使得用以對開放迴路控制計時之計時動作結束。When the processes of steps S48 and S50 described above are completed, step S52 is performed. In step S52, it is judged whether or not a specific period Top has passed. Here, the specific period Top is used to determine the time during which the open loop control continues. In the present embodiment, in order to prevent the feedback control from being performed within the deviation continuation time Tbi in which the target value Tt and the required temperature Tr are different according to the processing shown in the fifth embodiment, the specific period Top is set to be more variable. Time Tbi is long. Further, when it is determined that the specific period Top has passed, in step S54, the open loop control flag is turned off, and the timing operation for timing the open loop control is ended.
再者,在步驟S54的處理結束,或步驟S42及S52中判斷為否定的情況下,結束此一連串的處理。In addition, when the process of step S54 is completed or the determination in steps S42 and S52 is negative, the series of processes is ended.
第7圖係顯示同時使用第6及5圖的處理之情況下的溫度控制樣態。如圖所示,相較於上述第4圖所示之情況,被控制對象的溫度能夠快速地到達目標值Tt。Fig. 7 shows the temperature control pattern in the case where the processes of Figs. 6 and 5 are used at the same time. As shown in the figure, the temperature of the controlled object can quickly reach the target value Tt as compared with the case shown in Fig. 4 described above.
藉由上述詳述的本實施型態,可以得到後述之效果。According to the present embodiment described in detail above, the effects described later can be obtained.
(1)本實施型態的溫度控制裝置具有:加熱管路40,其將該流體加熱並使其循環到調溫部11;冷卻管路20,其將該流體冷卻並使其循環到調溫部11;旁通管30,其使該流體不通過加熱管路40及冷卻管路20,而循環到調溫部11;加熱用 閥44、冷卻用閥24、旁通用閥34,其分別調節透過由該加熱管路40、該冷卻管路20、該旁通管30匯流之下游側的流路面積。藉此,在將被控制對象的溫度控制為所欲之溫度時,能夠使該被控制對象的溫度快速地到達所欲之溫度。(1) The temperature control device of the present embodiment has a heating pipe 40 that heats and circulates the fluid to the temperature adjustment portion 11 and a cooling pipe 20 that cools the fluid and circulates it to the temperature adjustment portion. Part 11; a bypass pipe 30 that circulates the fluid to the temperature regulating portion 11 without passing through the heating pipe 40 and the cooling pipe 20; The valve 44, the cooling valve 24, and the bypass common valve 34 are respectively adjusted to pass through the flow path area on the downstream side of the heating line 40, the cooling line 20, and the bypass pipe 30. Thereby, when the temperature of the controlled object is controlled to a desired temperature, the temperature of the controlled object can be quickly reached to the desired temperature.
(2)加熱管路40和冷卻管路20共用旁通管30。藉此,當流體從加熱管路40和旁通管30輸出到調溫部11的情況下,以及流體從冷卻管路20和旁通管30輸出到調溫部11的情況下,可以使用共通的旁通管30。因此,相較於必須使用個別的旁通管的情況,能夠簡化溫度控制裝置的構造。(2) The heating pipe 40 and the cooling pipe 20 share the bypass pipe 30. Thereby, in the case where the fluid is output from the heating pipe 40 and the bypass pipe 30 to the temperature regulating portion 11, and the fluid is output from the cooling pipe 20 and the bypass pipe 30 to the temperature regulating portion 11, common use can be used. Bypass pipe 30. Therefore, the configuration of the temperature control device can be simplified as compared with the case where an individual bypass pipe must be used.
(3)本實施型態的溫度控制裝置更包含泵浦18,其吸入該調溫部11之流體,並將其輸出至該加熱管路40、該冷卻管路20、及該旁通管30。相較於設置在加熱管路40、冷卻管路20、旁通管30之下游側且在調溫部11上游側,藉由將泵浦18設置在加熱管路40、冷卻管路20、旁通管30之上游側,能夠縮短在加熱用閥44、冷卻用閥24、旁通用閥34和調溫部11之間的流體的流動路徑。因此,能夠使得從加熱用閥44、冷卻用閥24、旁通用閥34輸出的流體快速地到達調溫部11,而且能夠使調溫部11的溫度更快速地到達所欲的溫度。(3) The temperature control device of the present embodiment further includes a pump 18 that sucks the fluid of the temperature adjustment portion 11 and outputs it to the heating pipe 40, the cooling pipe 20, and the bypass pipe 30. . The pump 18 is disposed on the heating pipe 40, the cooling pipe 20, and the pumping pipe 18, on the downstream side of the heating pipe 40, the cooling pipe 20, and the bypass pipe 30, and on the upstream side of the temperature regulating portion 11. The upstream side of the pipe 30 can shorten the flow path of the fluid between the heating valve 44, the cooling valve 24, the bypass valve 34, and the temperature control unit 11. Therefore, the fluid output from the heating valve 44, the cooling valve 24, and the bypass valve 34 can be quickly reached to the temperature adjustment unit 11, and the temperature of the temperature adjustment unit 11 can be more quickly reached the desired temperature.
(4)本實施型態的溫度控制裝置中,在該加熱管路40、該冷卻管路20、該旁通管30之上游側及該調溫部11的下游側設置有用以存放流體的儲存槽16,儲存槽16的上部係為氣體所填充。藉此,能夠吸收該流體因為溫度而產生之體積變化,而且不論溫度造成之流體的體積變化,而能夠適當地維持流體的循環。(4) In the temperature control device of the present embodiment, a storage for storing a fluid is provided on the heating pipe 40, the cooling pipe 20, the upstream side of the bypass pipe 30, and the downstream side of the temperature regulating portion 11. The groove 16 and the upper portion of the storage tank 16 are filled with gas. Thereby, it is possible to absorb the volume change of the fluid due to the temperature, and to appropriately maintain the circulation of the fluid regardless of the volume change of the fluid caused by the temperature.
(5)將由檢測該調溫部11旁流體之溫度的輸出溫度檢測 裝置51所得之檢測值Td對目標值Tt進行回饋控制。藉此,能夠使檢測值Td精確地達到目標值Tt。(5) detecting the output temperature of the fluid adjacent to the temperature adjusting portion 11 The detected value Td obtained by the device 51 is subjected to feedback control of the target value Tt. Thereby, the detected value Td can be accurately reached to the target value Tt.
(6)在上述回饋控制時,依據檢測值Td對於目標值Tt之差異而將基本操作量MB轉換為加熱管路40、冷卻管路20及旁通管30之個別之流路面積操作量(開度Va,Vb,Vc)。藉此,依據單一的基本操作量MB,能夠操作(調節)上述3個管路的流路面積。(6) In the above feedback control, the basic operation amount MB is converted into the individual flow path area operation amount of the heating pipe 40, the cooling pipe 20, and the bypass pipe 30 in accordance with the difference of the detected value Td with respect to the target value Tt ( Opening degrees Va, Vb, Vc). Thereby, the flow path area of the above three pipes can be operated (adjusted) in accordance with a single basic operation amount MB.
(7)在目標值Tt變化之後的特定期間內不用回饋控制,而依據檢測該旁通管30溫度之旁通溫度檢測裝置36的檢測值,以開放迴路控制該調溫部11旁流體之溫度。藉此,即使設定回饋控制以抑制檢測值Td在目標值Tt上下變動的變動量,也能夠提高目標值Tt變化時的反應性。(7) The feedback control value of the bypass temperature detecting means 36 for detecting the temperature of the bypass pipe 30 is not used in the specific period after the change of the target value Tt, and the temperature of the fluid adjacent to the temperature regulating portion 11 is controlled by the open circuit. . Thereby, even if the feedback control is set to suppress the fluctuation amount in which the detected value Td fluctuates up and down the target value Tt, the reactivity at the time of the change of the target value Tt can be improved.
(8)當該目標值Tt變化時,在該旁通管30內之流體的溫度高於該目標值Tt的情況下,操作該旁通管30及該冷卻管路20的流路面積,藉此,開放迴路控制該調溫部11的溫度至目標值Tt,在該旁通管30內之流體的溫度低於目標值Tt的情況下,操作該旁通管30及該加熱管路40的流路面積,藉此,開放迴路控制該調溫部11的溫度至目標值。藉此,能夠在盡量降低能量消耗量的情況下進行開放迴路控制。(8) When the target value Tt changes, if the temperature of the fluid in the bypass pipe 30 is higher than the target value Tt, the flow path area of the bypass pipe 30 and the cooling pipe 20 is operated, Therefore, the open circuit controls the temperature of the temperature adjustment unit 11 to the target value Tt, and when the temperature of the fluid in the bypass pipe 30 is lower than the target value Tt, the bypass pipe 30 and the heating pipe 40 are operated. The flow path area, whereby the open circuit controls the temperature of the temperature adjustment unit 11 to a target value. Thereby, open loop control can be performed while reducing the amount of energy consumption as much as possible.
(9)在關於該調溫部11之溫度的要求改變的情況下,使該目標值Tt較該要求變化更大幅度變化。藉此,能夠使得調溫部11或被控制對象的溫度,更快速地朝向所要求之溫度變化。(9) When the request for the temperature of the temperature adjustment unit 11 is changed, the target value Tt is changed more largely than the required change. Thereby, the temperature of the temperature control unit 11 or the object to be controlled can be made to change toward the required temperature more quickly.
以下針對第2實施型態,以其和第1實施型態之差異為 中心參照圖面說明之。The following is a description of the second embodiment, and the difference between the first embodiment and the first embodiment is The center explains this with reference to the drawings.
第8圖顯示依據本實施型態的溫度控制裝置之整體構成圖。如圖所示,在本實施型態中,流出管路60連接於冷卻管路20中介於冷卻用溫度感測器26和冷卻用閥24之間,以使得冷卻管路20內的流體流出到流出管路14。另外,流出管路62連接於加熱管路40中介於加熱用溫度感測器46和加熱用閥44之間,以使得加熱管路40內的流體流出到流出管路14。Fig. 8 is a view showing the overall configuration of a temperature control device according to this embodiment. As shown in the figure, in the present embodiment, the outflow line 60 is connected between the cooling temperature sensor 26 and the cooling valve 24 in the cooling line 20 so that the fluid in the cooling line 20 flows out to Flow out of line 14. Further, the outflow line 62 is connected between the heating temperature sensor 46 and the heating valve 44 in the heating line 40 so that the fluid in the heating line 40 flows out to the outflow line 14.
這些流出管路60及62,都比冷卻管路20、加熱管路40的流路面積小很多。此係因為,流出管路60及62在冷卻用閥24或加熱用閥44關閉時,為了使流體少量地從冷卻管路20或加熱管路40流到流出管路14。These outflow lines 60 and 62 are much smaller than the flow path areas of the cooling line 20 and the heating line 40. This is because the outflow lines 60 and 62 are caused to flow a small amount from the cooling line 20 or the heating line 40 to the outflow line 14 when the cooling valve 24 or the heating valve 44 is closed.
亦即,在禁止流體從加熱管路40或冷卻管路20流到調溫部11的情況下,加熱用閥44或冷卻用閥24的下游側和上述被禁止的管路之間會產生溫度梯度。因此,在解除禁止之後,流出到調溫部11的流體之溫度受到溫度梯度的影響,而可能使得調溫部11的溫度到達所欲之溫度所需的時間拉長。再者,在此情況下,冷卻用溫度感測器26或加熱用溫度感測器46的溫度因為受到溫度梯度的影響,而檢測出偏離冷卻部22附近的溫度或加熱部42附近之溫度。因此,有可能使得目標值Tt變化時之開放迴路控制的控制性降低。That is, when the flow of the fluid from the heating pipe 40 or the cooling pipe 20 to the temperature regulating portion 11 is prohibited, a temperature is generated between the downstream side of the heating valve 44 or the cooling valve 24 and the prohibited pipe. gradient. Therefore, after the prohibition is released, the temperature of the fluid flowing out to the temperature adjustment portion 11 is affected by the temperature gradient, and the time required for the temperature of the temperature adjustment portion 11 to reach the desired temperature may be elongated. Further, in this case, the temperature of the cooling temperature sensor 26 or the heating temperature sensor 46 is detected by the temperature gradient, and the temperature in the vicinity of the cooling portion 22 or the temperature in the vicinity of the heating portion 42 is detected. Therefore, it is possible to reduce the controllability of the open loop control when the target value Tt changes.
相對於此,本實施型態中,藉由設置流出管路60及62,在加熱用閥44或冷卻用閥24為關閉狀態的情況下,能夠藉由流出管路60及62而適當地抑制上游側的溫度梯度,而且能夠使調溫部的溫度更快地到達所欲之溫度。On the other hand, in the present embodiment, when the heating valve 44 or the cooling valve 24 is in the closed state by providing the outflow pipes 60 and 62, the outflow pipes 60 and 62 can be appropriately suppressed. The temperature gradient on the upstream side, and the temperature of the temperature regulating portion can reach the desired temperature more quickly.
藉由上述說明之本實施型態,除了可以得到上述第1實 施型態之上述(1)~(9)的效果之外,更可以得到下列的效果。According to the embodiment described above, in addition to the first real thing described above In addition to the effects of the above (1) to (9), the following effects can be obtained.
(10)在加熱用溫度感測器46中加熱用閥44之上游側,以及冷卻管路20中冷卻用閥24的上游側設置流出管路60及62。藉此,能夠更適當地執行當目標值Tt變化時的溫度控制。(10) The upstream side of the heating valve 44 in the heating temperature sensor 46 and the upstream side of the cooling valve 24 in the cooling line 20 are provided with the outflow lines 60 and 62. Thereby, the temperature control when the target value Tt is changed can be performed more appropriately.
以下針對第3實施型態,以其和第1實施型態之差異為中心參照圖面說明之。Hereinafter, the third embodiment will be described with reference to the differences between the first embodiment and the first embodiment.
第9圖係顯示本實施型態之基本操作量MB及冷卻用閥24、旁通用閥34、加熱用閥44的開度Va,Vb,Vc的關係。如圖所示,在本實施型態中,冷卻用閥24的開度Va和加熱用閥44的開度Vb係設定為平時不處於全閉狀態。亦即,在基本操作量MB未達0的情況下,冷卻用閥24的開度Va隨著基本操作量MB的增加而單方向明顯減少,其在基本操作量MB大於0的情況下則為最小開度(>0)。再者,加熱用閥44的開度Vb,在基本操作量MB大於0的情況下,隨著基本操作量MB的增加而單向地明顯增加,在基本操作量MB小於0的情況下則為最小開度(>0)。Fig. 9 is a view showing the relationship between the basic operation amount MB of the present embodiment, the opening degrees Va, Vb, and Vc of the cooling valve 24, the bypass valve 34, and the heating valve 44. As shown in the figure, in the present embodiment, the opening degree Va of the cooling valve 24 and the opening degree Vb of the heating valve 44 are set to be not in the fully closed state. That is, in the case where the basic operation amount MB is less than 0, the opening degree Va of the cooling valve 24 is significantly reduced in one direction as the basic operation amount MB is increased, and in the case where the basic operation amount MB is larger than 0, Minimum opening (>0). Further, in the case where the basic operation amount MB is larger than 0, the opening degree Vb of the heating valve 44 is unidirectionally increased as the basic operation amount MB is increased, and when the basic operation amount MB is less than 0, Minimum opening (>0).
藉此,不具有如上述第8圖之流出管路60及62,在主要以旁通管30之流體的流出來穩定調溫部11的溫度控制時,能夠抑制冷卻用閥24或加熱用閥44之上游側的溫度梯度。Therefore, when the temperature control of the temperature adjustment unit 11 is stabilized by the flow of the fluid mainly flowing through the bypass pipe 30, the cooling valve 24 or the heating valve can be suppressed. The temperature gradient on the upstream side of 44.
藉由上述說明之本實施型態,除了可以得到上述第1實施型態之上述(1)~(9)的效果之外,更可以得到下列的效果。According to the present embodiment described above, in addition to the effects (1) to (9) of the first embodiment described above, the following effects can be obtained.
(11)冷卻用閥24的開度Va和加熱用閥44的開度Vb係設定為平時不處於全閉狀態。藉此,能夠抑制冷卻用閥24或加熱用閥44之上游側的溫度梯度,而且能夠使得調溫部11 的溫度更快地到達所欲之溫度。(11) The opening degree Va of the cooling valve 24 and the opening degree Vb of the heating valve 44 are set to be not in the fully closed state. Thereby, the temperature gradient on the upstream side of the cooling valve 24 or the heating valve 44 can be suppressed, and the temperature adjustment unit 11 can be caused. The temperature reaches the desired temperature faster.
以下針對第4實施型態,以其和第1實施型態之差異為中心參照圖面說明之。Hereinafter, the fourth embodiment will be described with reference to the differences between the first embodiment and the first embodiment.
在上述第1實施型態中,當目標值Tt變化時,藉由開放迴路控制調溫部11附近的溫度,而使得被控制對象的溫度更快地到達所欲之溫度。該開放迴路控制的增益值、偏差繼續時間Tbi、繼續開放迴路控制的特定的期間Top之最佳值,係可以隨著調溫板10或被控制對象而異。另一方面,當使用者改變被控制對象時,以手動方式變更這些參數是很費力的。因此,在本實施型態中,控制裝置50更裝設配合支援裝置。第10圖係顯示本實施型態之配合支援處理的程序。該處理係由控制裝置50重複地週期性執行。In the first embodiment described above, when the target value Tt changes, the temperature in the vicinity of the temperature adjustment unit 11 is controlled by the open circuit, so that the temperature of the controlled object reaches the desired temperature more quickly. The gain value of the open loop control, the deviation continuation time Tbi, and the optimum value of the specific period Top for continuing the open loop control may vary depending on the temperature regulating plate 10 or the controlled object. On the other hand, when the user changes the controlled object, it is very laborious to manually change these parameters. Therefore, in the present embodiment, the control device 50 is further provided with a cooperation supporting device. Fig. 10 is a view showing the procedure of the cooperation support processing of this embodiment. This processing is repeatedly performed periodically by the control device 50.
在該一連串的處理中,首先在步驟S70中,判斷是否為執行開放迴路控制配合的模式(測試模式)。在此,例如藉由在控制裝置50具有用於讓使用者指示測試模式的功能,來判斷有無測試模式亦可。而且,在判斷為測試模式的情況下,在步驟S72中,以使用者可以目視確認的顯示方式顯示偏差繼續時間Tbi的選項。在此,偏差繼續時間Tbi的選項係設定為,可以得到對於在該溫度控制裝置中預設的被控制對象之適當的值之範圍。In the series of processes, first, in step S70, it is determined whether or not the mode (test mode) in which the open loop control is performed is performed. Here, for example, the presence or absence of the test mode may be determined by the control device 50 having a function for allowing the user to instruct the test mode. Further, when it is determined that the test mode is present, in step S72, the option of the deviation continuing time Tbi is displayed in a display manner that the user can visually confirm. Here, the option of the deviation continuation time Tbi is set such that a range of appropriate values for the controlled object preset in the temperature control device can be obtained.
在步驟S74中,判斷是否輸入偏差繼續時間Tbi。該處理係為,判斷使用者是否選擇偏差繼續時間Tbi之選項中的一者。並且,在判斷使用者已選取特定的選項的情況下(步驟S74:是),在步驟S76中,使用選取之選項以開始溫度控制。 繼之,當溫度控制結束時,在步驟S78中,以使用者可以目視確認的顯示方式詢問使用者是否決定偏差繼續時間Tbi。並且,在使用者輸入不決定的指令的情況下(步驟S80:否),重新執行上述步驟S72~S78的處理。In step S74, it is determined whether or not the deviation continuing time Tbi is input. This processing is one of the options for determining whether the user selects the deviation continuation time Tbi. And, in the case where it is judged that the user has selected a specific option (step S74: YES), in step S76, the selected option is used to start temperature control. Then, when the temperature control ends, in step S78, the user is asked whether or not to determine the deviation continuation time Tbi in a display manner that the user can visually confirm. When the user inputs an instruction that is not determined (step S80: NO), the processing of steps S72 to S78 described above is re-executed.
相對於此,當使用者輸入欲以先前已選擇的選項中任一者作為最終的偏差繼續時間Tbi的指令之情況下(步驟S80:是),在步驟S82中,記憶偏差繼續時間Tbi。再者,當步驟S82的處理結束,或在步驟S70中判斷為否定的情況下,結束此一連串的處理。On the other hand, when the user inputs an instruction to use any one of the previously selected options as the final deviation continuation time Tbi (step S80: YES), in step S82, the deviation continuation time Tbi is memorized. Furthermore, when the process of step S82 ends, or if the determination in step S70 is negative, the series of processes is ended.
藉由上述說明之本實施型態,除了可以得到上述第1實施型態之上述(1)~(9)的效果之外,更可以得到下列的效果。According to the present embodiment described above, in addition to the effects (1) to (9) of the first embodiment described above, the following effects can be obtained.
(12)具有開放迴路控制配合支援裝置,其促請使用者就偏差繼續時間Tbi的複數選項中選擇任意一者,對應於選取之值而進行溫度控制。藉此,能夠降低溫度控制裝置的使用者在使開放迴路控制配合對應的開放迴路控制時的勞力。(12) An open loop control cooperation support device is provided which urges the user to select any one of the plural options of the deviation continuing time Tbi, and performs temperature control corresponding to the selected value. Thereby, it is possible to reduce the labor of the user of the temperature control device when the open circuit control is matched with the corresponding open circuit control.
再者,上述各實施型態,亦可以如下述般變更而實施。Furthermore, each of the above embodiments may be implemented as described below.
.依據上述第4實施型態從該第1實施型態的變更點,來變更上述第2、第3實施型態亦可。. According to the fourth embodiment described above, the second and third embodiments may be changed from the point of change of the first embodiment.
.在上述第4實施型態中,在執行開放迴路控制的配合支援時的配合參數,並不限於偏差繼續時間Tbi。例如,以開放迴路控制的持續時間(特定的期間Top)作為配合參數亦可。再者,例如以前述第5圖所示之偏差控制中目標值之設定(補償值β,γ)作為配合參數亦可。再者,以複數個上述參數作為配合參數亦可。. In the fourth embodiment described above, the fitting parameter at the time of performing the cooperation support of the open loop control is not limited to the deviation continuing time Tbi. For example, the duration of the open loop control (specific period Top) may be used as a matching parameter. Further, for example, the setting of the target value (compensation value β, γ) in the deviation control shown in the fifth drawing may be used as the matching parameter. Furthermore, a plurality of the above parameters may be used as the matching parameters.
.在上述第4實施型態中,係支援使用者對應於被控制對象而選取適當的配合參數,但是配合的方法並不限於此。例如對於上述偏差繼續時間Tbi、特定的期間Top、補償值β、γ之各參數分別任意地設定初期值以進行溫度控制時,監視被控制對象的溫度(或調溫板10的溫度),當到達其目標值的延遲時間不在容許範圍內時,自動執行變更上述參數中至少一個的處理亦可。藉此,因為可以自動地配合開放迴路控制以使得到達其目標值的延遲時間在容許範圍,所以能夠進一步減輕使用者的勞力。. In the fourth embodiment described above, the user is required to select an appropriate fitting parameter corresponding to the controlled object, but the method of cooperation is not limited thereto. For example, when the initial values are arbitrarily set for each of the parameters of the deviation continuing time Tbi, the specific period Top, the compensation values β, and γ to perform temperature control, the temperature of the controlled object (or the temperature of the temperature regulating plate 10) is monitored. When the delay time to reach the target value is not within the allowable range, the process of changing at least one of the above parameters may be automatically performed. Thereby, since the open loop control can be automatically matched so that the delay time to reach the target value is within the allowable range, the labor of the user can be further reduced.
.將基本操作量MB轉換為冷卻用閥24、旁通用閥34、及加熱用閥44個別之操作量的方法,並不限於第3及9圖所示者。在第3及9圖中,均是對於目標值Tt和檢測值Td的溫度差△的變化,而變化冷卻用閥24、旁通用閥34、及加熱用閥44中任意兩者的操作量,但其並不以此為限,例如變化所有的操作量亦可。再者,在第3及9圖中,冷卻用閥24、旁通用閥34、及加熱用閥44個別之操作量為溫度差△的0次或1次的係數,但其並不以此為限。. The method of converting the basic operation amount MB into the individual operation amounts of the cooling valve 24, the bypass valve 34, and the heating valve 44 is not limited to those shown in FIGS. 3 and 9. In the third and ninth diagrams, the temperature difference Δ between the target value Tt and the detected value Td is changed, and the operation amounts of either the cooling valve 24, the bypass valve 34, and the heating valve 44 are changed. However, it is not limited to this, for example, changing all the operations. Further, in the third and ninth diagrams, the individual operation amounts of the cooling valve 24, the bypass valve 34, and the heating valve 44 are coefficients of zero or one time difference of the temperature difference Δ, but this is not limit.
.在第3實施型態中,不論基本操作量MB為何,冷卻用閥24、旁通用閥34、及加熱用閥44都不可以為全閉狀態,但其並不以此為限。僅在基本操作量MB接近0的情況,禁止冷卻用閥24及加熱用閥44為全閉狀態亦可。亦即,因為考慮到在要求溫度Tr變化之前,檢測值Td為目標值Tt而使檢測值Td為固定的狀態,所以,僅在此情況下應該為目標值Tt的變化預作準備,僅在基本操作量MB接近0的情況,禁止冷卻用閥24及加熱用閥44為全閉狀態亦可。再者,此時,在 基本操作量MB低於0的情況下,使得冷卻用閥24的操作量之變化量大於加熱用閥44之操作量的變化量,並且,在基本操作量MB大於0的情況下,使加熱用閥44的操作量之變化量小於冷卻用閥24的操作量之變化量較佳。. In the third embodiment, the cooling valve 24, the bypass valve 34, and the heating valve 44 are not fully closed regardless of the basic operation amount MB, but are not limited thereto. When the basic operation amount MB is close to 0, the cooling valve 24 and the heating valve 44 may not be fully closed. That is, since it is considered that the detected value Td is the target value Tt and the detected value Td is fixed before the required temperature Tr changes, it is only necessary to prepare for the change of the target value Tt in this case, only in the case When the basic operation amount MB is close to 0, the cooling valve 24 and the heating valve 44 may not be fully closed. Again, at this time, at When the basic operation amount MB is less than 0, the amount of change in the operation amount of the cooling valve 24 is made larger than the amount of change in the operation amount of the heating valve 44, and in the case where the basic operation amount MB is larger than 0, the heating is used. The amount of change in the amount of operation of the valve 44 is smaller than the amount of change in the amount of operation of the cooling valve 24.
.流出管路60、62並不限於第2實施型態(第8圖)所例示這。例如,如第11圖所示,也可以具有繞過冷卻用閥24而連接冷卻管路20中冷卻用閥24的上游側和下游側的流出管路60,以及繞過加熱用閥44而連接加熱管路40中加熱用閥44的上游側和下游側的流出管路62。再者,在此之流出管路60及62,設置於冷卻用溫度感測器26或加熱用溫度感測器46之下游側較佳。. The outflow lines 60, 62 are not limited to those exemplified in the second embodiment (Fig. 8). For example, as shown in FIG. 11, the outflow line 60 that connects the upstream side and the downstream side of the cooling valve 24 in the cooling line 20 may be connected to the cooling valve 24, and may be connected by bypassing the heating valve 44. The outflow line 62 on the upstream side and the downstream side of the heating valve 44 in the heating line 40 is heated. Further, it is preferable that the outflow lines 60 and 62 are provided on the downstream side of the cooling temperature sensor 26 or the heating temperature sensor 46.
.上述各實施型態中,係分別設定開放迴路控制持續的特定的期間Top以及偏差繼續時間Tbi,但其並不以此為限,其為一致亦可。. In each of the above embodiments, the specific period Top and the deviation continuing time Tbi in which the open loop control continues are set, but the present invention is not limited thereto, and may be identical.
.回饋控制不限於PID控制。例如PI控制或I控制亦可。在此,例如,如上述各實施型態一般,在目標值變化時執行開放迴路控制的構成中,回饋控制的目的係為在正常時使檢測值Td精確地和目標值Tt一致,或者盡量減少檢測值Td的變動。因此,如積分控制一般,其尤其適用於依據表示檢測值Td和目標值Tt的差異的累積值,而使檢測值Td回饋控制到目標值Tt。. Feedback control is not limited to PID control. For example, PI control or I control is also possible. Here, for example, in the configuration in which the open loop control is executed when the target value is changed, for example, in the configuration in which the target value is changed, the purpose of the feedback control is to accurately match the detected value Td with the target value Tt at normal time, or to minimize it. The change in the detected value Td. Therefore, as in the integral control, it is particularly suitable for controlling the detected value Td to the target value Tt in accordance with the cumulative value indicating the difference between the detected value Td and the target value Tt.
.開放迴路控制不限於上述實施型態中所例示者。例如,在旁通管30內的流體之溫度高於目標值Tt的情況下,冷卻用閥24和旁通用閥34的開度之設定,係參照如上述第3圖所示的開度之比率而為之亦可,在旁通管30內的流體之溫 度低於目標值Tt的情況下,加熱用閥44和旁通用閥34的開度之設定,係參照如上述第3圖所示的開度之比率而為之亦可。在此對應於所使用之管路內的流體溫度,藉由計算以哪一個開度比率之2個閥可以達到目標值Tt,而可以執行開放迴路控制。尤其是,藉由此種方法,能夠避免使用流量計。因為流量計係浸泡在流體中,在加熱管路40內的流體溫度和冷卻管路20內的流體溫度之間的溫度範圍中長時間使用而難以維持其可靠性,所以以不使用流量計之簡單的開放迴路控制為佳。再者,不使用第3圖所示之開度比率,例如在旁通管30內的流體之溫度高於目標值Tt的情況下,將冷卻用閥24及旁通用閥34的開度,設定為對應於冷卻管路20內的流體對於目標值Tt之差及目標值Tt對於加熱管路40內的流體之溫度之差的比率較佳。同樣地,在旁通管30內的流體之溫度低於目標值Tt的情況下,加熱用閥44及旁通用閥34的開度,設定為對應於旁通管30內的流體之溫度對於目標值Tt之差,以及目標值Tt對於加熱管路40內的流體之溫度之差的比率較佳。. The open loop control is not limited to those exemplified in the above embodiment. For example, when the temperature of the fluid in the bypass pipe 30 is higher than the target value Tt, the setting of the opening degree of the cooling valve 24 and the bypass valve 34 refers to the ratio of the opening degree as shown in the above-mentioned FIG. And for this reason, the temperature of the fluid in the bypass pipe 30 When the degree is lower than the target value Tt, the setting of the opening degree of the heating valve 44 and the bypass valve 34 may be referred to the ratio of the opening degree as shown in the above-mentioned third drawing. Here, corresponding to the temperature of the fluid in the pipeline used, open loop control can be performed by calculating which of the opening ratios of the two valves can reach the target value Tt. In particular, with this method, the use of a flow meter can be avoided. Since the flow meter is immersed in the fluid, it is difficult to maintain its reliability in the temperature range between the temperature of the fluid in the heating line 40 and the temperature of the fluid in the cooling line 20, so that the flow meter is not used. Simple open loop control is preferred. Further, when the opening ratio shown in FIG. 3 is not used, for example, when the temperature of the fluid in the bypass pipe 30 is higher than the target value Tt, the opening degrees of the cooling valve 24 and the bypass valve 34 are set. The ratio of the difference between the target value Tt and the difference between the target value Tt and the temperature of the fluid in the heating line 40 corresponding to the fluid in the cooling line 20 is preferred. Similarly, when the temperature of the fluid in the bypass pipe 30 is lower than the target value Tt, the opening degree of the heating valve 44 and the bypass common valve 34 is set to correspond to the temperature of the fluid in the bypass pipe 30 for the target. The difference between the values Tt and the ratio of the target value Tt to the difference in temperature of the fluid in the heating line 40 is preferred.
.不限定於執行回饋控制,僅執行第6圖的步驟S48及S50所示之開放迴路控制亦可。再者,不論目標值是否變化,將藉由第6圖的步驟S48及S50所示之開放迴路控制而決定之基本操作量MB,以回饋控制修.正之,而算出最終的基本操作量MB亦可。再者,相反地,不論目標值是否變化,僅執行回饋控制亦可。即使是在這種情況下,當要求溫度Tr變化時,使該目標值Tt的變化較該要求溫度Tr的變化更大幅度之上述偏差控制是有效的。亦即,在回饋控制中,降低反應延遲 和降低檢測值Td對目標值Tt的變動係互為交換的關係,但是藉由執行偏差控制,以回饋控制的增益值而言可以降低反應延遲,所以能夠在降低上述變動的同時也降低反應延遲。. It is not limited to the execution of the feedback control, and only the open loop control shown in steps S48 and S50 of Fig. 6 may be performed. Further, regardless of whether or not the target value is changed, the basic operation amount MB determined by the open loop control shown in steps S48 and S50 of FIG. 6 is corrected by the feedback control, and the final basic operation amount MB is also calculated. can. Furthermore, conversely, only feedback control may be performed regardless of whether the target value changes. Even in this case, when the required temperature Tr is changed, the above-described deviation control which makes the change of the target value Tt larger than the change of the required temperature Tr is effective. That is, in the feedback control, the reaction delay is reduced. The fluctuation of the detection value Td with respect to the target value Tt is mutually exchanged. However, by performing the deviation control, the reaction delay can be reduced by the gain value of the feedback control, so that the variation can be reduced while reducing the reaction delay. .
.回饋控制不限於,藉由將回饋控制的要求量(基本操作量MB)轉換為冷卻用閥24、旁通用閥34、及加熱用閥44個別之操作量而執行,例如,依據目標值Tt和檢測值Td之差,分別設定冷卻用閥24、旁通用閥34、及加熱用閥44個別之操作量亦可。但是,即使是在此種情況下,當目標值Tt高於檢測值Td的情況下,僅以旁通用閥34和冷卻用閥24的操作量為變更對象,當目標值Tt低於檢測值Td的情況下,僅以旁通用閥34和加熱用閥44的操作量為變更對象較佳。. The feedback control is not limited to being performed by converting the required amount of the feedback control (the basic operation amount MB) into the individual operation amounts of the cooling valve 24, the bypass valve 34, and the heating valve 44, for example, according to the target value Tt and The difference between the detected values Td and the individual operation amounts of the cooling valve 24, the bypass valve 34, and the heating valve 44 may be set. However, even in this case, when the target value Tt is higher than the detected value Td, only the operation amount of the bypass valve 34 and the cooling valve 24 is changed, and when the target value Tt is lower than the detected value Td. In the case of the change, the operation amount of the bypass valve 34 and the heating valve 44 is preferably changed.
.具有吸收該流體因為溫度而產生之體積變化的功能之儲存裝置不限於,如上述各實施型態中所例示,儲存槽16中不裝滿流體,而具有由氣體所填充之空間的構成。例如,儲存槽16中無縫隙地被流體所填充的構成,並且,使儲存槽16的體積隨著流體對於儲存槽16的內壁施加的壓力而變化亦可。. The storage device having a function of absorbing a volume change due to the temperature of the fluid is not limited to the configuration in which the storage tank 16 is filled with a fluid and has a space filled with the gas, as exemplified in the above embodiments. For example, the storage tank 16 is configured to be filled with fluid without gaps, and the volume of the storage tank 16 may vary depending on the pressure applied to the inner wall of the storage tank 16 by the fluid.
.在上述實施型態中,調節從冷卻管路20、旁通管30及加熱管路40流到調溫板10的流體之流量比的調節裝置,係使用冷卻用閥24、旁通用閥34及加熱用閥44,但其不限於此。例如,分別具有複數支這些管路,並且,設置分別執行開關兩種動作的閥,以流體輸出到調溫板10的管路之數量為操作量亦可。再者,準備複數支管路,並且,操作這些各個管路是否連接於冷卻部22、加熱部42及泵浦18中任一者之下游側亦可。再者,冷卻管路20、旁通管30及加熱管路 40分別設置個別的泵浦,藉由分別控制其輸出能力而進行流量比的調節亦可。. In the above embodiment, the adjusting device for adjusting the flow ratio of the fluid flowing from the cooling line 20, the bypass pipe 30, and the heating pipe 40 to the temperature regulating plate 10 is a cooling valve 24, a bypass valve 34, and The valve 44 for heating is not limited thereto. For example, each of the plurality of pipes is provided, and a valve for performing two operations of the switches is provided, and the number of pipes for outputting the fluid to the temperature regulating plate 10 may be an operation amount. Further, a plurality of branch lines are prepared, and whether or not these respective lines are connected to the downstream side of any of the cooling unit 22, the heating unit 42, and the pump 18 may be operated. Furthermore, the cooling line 20, the bypass pipe 30 and the heating pipe 40 separately set individual pumps, and the flow ratio can be adjusted by controlling the output capability thereof separately.
.另外,調溫板10不限於薄型長方體狀的板狀元件,例如也可以為薄型圓柱狀的板狀元件。總之,只要調溫部11設置於為可以從垂直下方支撐被控制對象的板狀元件內部即可,例如,直接和被控制對象之複數側面接觸而控制其溫度亦可。. Further, the temperature regulating plate 10 is not limited to a thin rectangular parallelepiped plate-like element, and may be, for example, a thin cylindrical plate-shaped element. In short, the temperature adjustment unit 11 may be provided so as to be able to support the inside of the plate-shaped element to be controlled from the vertical direction. For example, the temperature may be directly controlled in contact with the plurality of side surfaces of the object to be controlled.
10‧‧‧調溫板10‧‧‧tempering plate
11‧‧‧調溫部11‧‧‧Temperature Department
12‧‧‧合流部12‧‧ ‧ Confluence Department
14‧‧‧流出管路14‧‧‧Outflow line
16‧‧‧儲存槽16‧‧‧ storage tank
18‧‧‧泵浦18‧‧‧ pump
19‧‧‧分岔部19‧‧ ‧ Division
20‧‧‧冷卻管路20‧‧‧Cooling line
22‧‧‧冷卻部22‧‧‧Department of Cooling
24‧‧‧冷卻用閥24‧‧‧Cooling valve
26‧‧‧冷卻用溫度感測器26‧‧‧Stage temperature sensor for cooling
28‧‧‧冷卻用流量器28‧‧‧Flower for cooling
30‧‧‧旁通管30‧‧‧bypass
34‧‧‧旁通用閥34‧‧‧Side general purpose valve
36‧‧‧旁通用溫度感測器36‧‧‧side universal temperature sensor
38‧‧‧旁通用流量器38‧‧‧side universal flowmeter
40‧‧‧加熱管路40‧‧‧heating line
42‧‧‧加熱部42‧‧‧ heating department
44‧‧‧加熱用閥44‧‧‧heating valve
46‧‧‧加熱用溫度感測器46‧‧‧heating temperature sensor
48‧‧‧加熱用流量器48‧‧‧heating flow meter
50‧‧‧控制裝置50‧‧‧Control device
51‧‧‧輸出溫度感測器51‧‧‧Output temperature sensor
60‧‧‧流出管路60‧‧‧Outflow line
62‧‧‧流出管路62‧‧‧Outflow line
第1圖顯示依據本發明第1實施型態的溫度控制裝置之整體構成圖。Fig. 1 is a view showing the overall configuration of a temperature control device according to a first embodiment of the present invention.
第2圖顯示同實施型態之回饋控制的處理程序之流程圖。Fig. 2 is a flow chart showing the processing procedure of the feedback control of the same embodiment.
第3圖顯示同實施型態之冷卻用閥、旁通用閥、加熱用閥的操作量之設定方法的示意圖。Fig. 3 is a view showing a method of setting the operation amount of the cooling valve, the bypass common valve, and the heating valve of the embodiment.
第4圖顯示同實施型態中僅以回饋控制進行溫度控制的情況之被控制對象的溫度變化的時間圖。Fig. 4 is a timing chart showing the temperature change of the controlled object in the case where the temperature control is performed only by the feedback control in the embodiment.
第5圖顯示同實施型態之目標值的設定處理之程序的流程圖。Fig. 5 is a flow chart showing the procedure of the setting process of the target value of the embodiment.
第6圖係顯示同實施型態的開放迴路控制的處理程序之流程圖。Figure 6 is a flow chart showing the processing procedure of the open loop control of the same embodiment.
第7圖係顯示同時使用開放迴路控制的情況之被控制對象的溫度變化的時間圖。Fig. 7 is a time chart showing the temperature change of the controlled object in the case where the open loop control is used at the same time.
第8圖顯示依據本發明第2實施型態的溫度控制裝置之整體構成圖。Fig. 8 is a view showing the overall configuration of a temperature control device according to a second embodiment of the present invention.
第9圖係顯示第3實施型態之冷卻用閥、旁通用閥、加 熱用閥的操作量之設定方法的示意圖。Figure 9 is a view showing a cooling valve, a side-by-side valve, and a third embodiment. Schematic diagram of the method of setting the amount of operation of the heat valve.
第10圖係顯示第4實施型態之開放迴路控制配合支援處理的程序之流程圖。Fig. 10 is a flow chart showing the procedure of the open loop control cooperation support processing of the fourth embodiment.
第11圖係顯示依據本發明第2實施型態的變形例溫度控制裝置之整體構成圖。Fig. 11 is a view showing the overall configuration of a temperature control device according to a modification of the second embodiment of the present invention.
第12圖係顯示過去的溫度控制裝置的構成示意圖。Fig. 12 is a view showing the configuration of a conventional temperature control device.
10‧‧‧調溫板10‧‧‧tempering plate
11‧‧‧調溫部11‧‧‧Temperature Department
12‧‧‧合流部12‧‧ ‧ Confluence Department
14‧‧‧流出管路14‧‧‧Outflow line
16‧‧‧儲存槽16‧‧‧ storage tank
18‧‧‧泵浦18‧‧‧ pump
19‧‧‧分岔部19‧‧ ‧ Division
20‧‧‧冷卻管路20‧‧‧Cooling line
22‧‧‧冷卻部22‧‧‧Department of Cooling
24‧‧‧冷卻用閥24‧‧‧Cooling valve
26‧‧‧冷卻用溫度感測器26‧‧‧Stage temperature sensor for cooling
28‧‧‧冷卻用流量器28‧‧‧Flower for cooling
30‧‧‧旁通管30‧‧‧bypass
34‧‧‧旁通用閥34‧‧‧Side general purpose valve
36‧‧‧旁通用溫度感測器36‧‧‧side universal temperature sensor
38‧‧‧旁通用流量器38‧‧‧side universal flowmeter
40‧‧‧加熱管路40‧‧‧heating line
42‧‧‧加熱部42‧‧‧ heating department
44‧‧‧加熱用閥44‧‧‧heating valve
46‧‧‧加熱用溫度感測器46‧‧‧heating temperature sensor
48‧‧‧加熱用流量器48‧‧‧heating flow meter
50‧‧‧控制裝置50‧‧‧Control device
51‧‧‧輸出溫度感測器51‧‧‧Output temperature sensor
Claims (11)
Applications Claiming Priority (1)
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JP2007118071A JP4978928B2 (en) | 2007-04-27 | 2007-04-27 | Temperature control device |
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TW200842539A TW200842539A (en) | 2008-11-01 |
TWI427450B true TWI427450B (en) | 2014-02-21 |
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TW097112159A TWI427450B (en) | 2007-04-27 | 2008-04-03 | Temperature control device |
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US (1) | US20080314564A1 (en) |
JP (1) | JP4978928B2 (en) |
KR (1) | KR101327114B1 (en) |
CN (1) | CN101295186B (en) |
TW (1) | TWI427450B (en) |
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CN101295186A (en) | 2008-10-29 |
CN101295186B (en) | 2013-08-28 |
JP4978928B2 (en) | 2012-07-18 |
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