TW200842539A - Temperature control device - Google Patents

Temperature control device Download PDF

Info

Publication number
TW200842539A
TW200842539A TW097112159A TW97112159A TW200842539A TW 200842539 A TW200842539 A TW 200842539A TW 097112159 A TW097112159 A TW 097112159A TW 97112159 A TW97112159 A TW 97112159A TW 200842539 A TW200842539 A TW 200842539A
Authority
TW
Taiwan
Prior art keywords
temperature
fluid
pipe
cooling
heating
Prior art date
Application number
TW097112159A
Other languages
Chinese (zh)
Other versions
TWI427450B (en
Inventor
Kazuya Nagaseki
Yoshiyuki Kobayashi
Koichi Murakami
Ryo Nonaka
Yoshihisa Sudoh
Itafuji Hiroshi
Kokubo Norio
Original Assignee
Tokyo Electron Ltd
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Ckd Corp filed Critical Tokyo Electron Ltd
Publication of TW200842539A publication Critical patent/TW200842539A/en
Application granted granted Critical
Publication of TWI427450B publication Critical patent/TWI427450B/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/01Control of temperature without auxiliary power
    • G05D23/02Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)

Abstract

A temperature control device controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit 11 arranged near the controlled object. The temperature control device comprises a heating pathway 40 that heats and circulates the fluid in the temperature adjustment unit 11; a cooling pathway 20 that cools and circulates the fluid in the temperature adjustment unit 11; a bypass pathway 30 that does not pass the fluid through the heating pathway 40 and cooling pathway 20, but circulates the fluid in the temperature adjustment unit 11; and several adjustment means 44, 24 and 34 for adjusting a flow ratio of the fluid supplied from the heating pathway 40, cooling pathway 20, and bypass pathway 30 to the temperature adjustment unit 11 via a confluence unit 12 that combines these flows; the adjustment means44, 24 and 34 are provided on a downstream side of each of the heating pathway 40, the cooling pathway 20, and the bypass pathway 30 and on the upstream side of the confluence unit 12.

Description

200842539 九、發明說明: 【發明所屬之技術領域】 本發明係關於溫度控制裝置,其藉由使流體循環於配置 在被控制對象旁的調溫部,以將該被控制對象的溫度控制在 所欲的溫度。 【先前技術】 r 第12圖顯示此種溫度控制裝置。儲存槽100内的流體係 、由泵浦102吸入,並吐出至加熱部i 〇4。加熱部1 〇4具有加熱 可以將輸出到調溫部1 〇 6的流體加熱。通過調溫部1 〇 6 的流體,被輸出到冷卻部108。藉由冷卻部1〇8,可以使輸出 到儲存槽100的流體冷卻。調溫部1〇6之構成可以支撐被控 制對象,藉由調節供應到調溫部1〇6的流體之溫度,而控制 由調溫部106支撐的被控制對象的溫度。在此,當欲使被控 制對象的溫度上升時,在冷卻部1〇8不使流體冷卻,並且在 加熱口Ρ 104將流體加熱。另一方面,當欲使被控制對象的溫 度I降時,在冷卻部108使流體冷卻,並且在加熱部104不 將&體加熱。藉此’而能夠將被控制對象的溫度控制在所欲 的溫度。 再者’過去的溫度控制裝置,除了第12圖所示者之外,也有 如後述之專利文獻1中所記載者。 專利文獻1 ··特開2000-89832號公報、 【發明内容】 疋藉由上述/m度控制裝置將被控制對象的溫度變為 2238~9394-PF;Ahddub 5 200842539 所欲之溫度需要長時間。亦即,欲使被控制對象的溫度冷卻 的情況下’必須要使加熱部104停止加熱,並使冷卻部ι〇8 開始冷卻,但是,即使在加熱部1Q4停止加熱之後,因為餘 熱而使得暫時仍有高溫的流體從加熱部1〇[流出。而且,即 使冷卻部1G8開始冷卻,流體實際上被冷卻仍需要時間,而 且,儲存槽100中的流體的溫度下降需要更長的時間。因此, 無法快速地變化調溫部⑽的溫度,而使得被控制對象的溫 度無法快速改變。 本發明制續決上㈣題,其目的為提供溫度控制裝 置,其藉由使流體循環於配置在被控制對象旁的調溫部,以 將該被控制對象的溫度控制在所欲的溫度時,該被控制對象 的溫度能夠快速達到所欲之溫度。 以下記制以解決上述課題之手段,以及其作用效果。 手& 1為/JBL度控制裝置’藉由使流體循環於配置在被 控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲 的度其特徵在於包括:加熱管路,其將該流體加孰並使 其循環到該調溫部;冷卻管路,其將該流體冷卻並使其循環 到j-周/皿’旁通f,其使該流體不通過該加熱管路及該冷 卻管路,而循環到該調溫部;調節裝置,其調節透過由該二 '、,、吕路豸冷部菅路、該旁通管匯流之合流部,而輸出到噹 調溫部的流體之流量比。該調節裝置係設置於該加埶管路°、 該冷卻管路、該旁通管的下游處,以及該合流部之上游處。 在上述手殺 1 Aj ^ 甲’藉由調節透過由該加熱管路、該冷卻 吕路、該旁通官而輸出到該調溫部的流體之流量比,而能夠 使輸出到凋派邛的流體之溫度快速地變化。尤其是,因為流 2238-9394-PF/Ahddub Γ 200842539 里比疋在該加熱管路、該冷卻管路、該旁通管的下游處,以 及該合流部之上游處被調節,而能夠盡量使流量比的調節位 置和凋λ的距離縮短,因而能夠使輸出到調溫部的流體之 溫度更快速地變化。因此,當將被控制對象的溫度控制到所 欲的溫度時,能夠使被控制對象的溫度快速地到達所欲之溫 度。 再者版里使上述合流部的流路面積小較佳,以使得通 過加熱皆路、冷卻管路、旁通管流入的流體之流速盡可能地 低。在此,流體的流速為,流體在流通方向之進行速度。 再者,該調節裝置為分別調節透過加熱管路、冷卻管路、 旁通管而輸出到調溫部的流量比。 手段2為,溫度控制裝置,藉由使流體循環於配置在被 控制對象旁的調溫部,以將該被控制對象的溫度控制在所欲 的溫度,其特徵在於包括:加熱管路,其將該-體加熱並使 其循%到該調溫部;冷卻管路,其將該流體冷卻並使其循環 到該調溫部;旁通管,其使該流體不通過該加熱管路及該冷 卻管路,而循環到該調溫部;調節裝置,其分別調節該加熱 管路、該冷卻管路、該旁通管的下游側之流路面積。 在上述手段2中,藉由分別調節加熱管路、冷卻管路、 方通营的下游侧的流路面積,而能夠調節通過加熱管路、冷 部官路、旁通管而輸出到調溫部的流量比。因此,能夠使輸 出到調溫部的流體之溫度快速地變化。因此,當將被控制對 象的溫度控制到所欲的溫度時,能夠使被控制對象的溫度快 速地到達所欲之溫度。 .手段3為該旁通管在該加熱管路及該冷卻管路之間係為 2238-9394-PF;Ahddub 7 200842539 共用。 瓤 在上述手段3中,在流體從加熱管路及旁通管輸出到調 溫部的情況,以及流體從冷卻管路及旁通管輸出到調溫部的 情況下,能夠使用同一支旁通管。因此,相較於必須使用個 別的旁通官的情況,能夠簡化溫度控制裝置的構造。 手段4為,在該加熱管路和該冷卻管路的上游侧,設有 流出管路’其使該調節裝置迂迴而使該流體流出。 當不讓流體從加熱管路或冷卻管路輸出到調溫部的情況 下,調節裝置的下游側和上述被禁止的管路之間會產生溫度 梯度。因此,在解除禁止之後,流出到調溫部的流體之溫度 受到溫度梯度的影響,而可能使得調溫部的溫度到達所欲之 溫度所需的時間拉長。此點,在上述手段4中,藉由設置流 出管路’而能夠適當地控制流出管路上游侧之溫度梯度,並 能夠使調溫部的溫度更快地到達所欲之溫度。 再者’手段4,也可以在該加熱管路較該調節裝置上游 侧’設置加熱側溫度檢測裝置以檢測其溫度,在該冷卻管路 ’ 較該調節裝置上游侧,設置冷卻侧溫度檢測裝置以檢測其溫 度。在此情況下,藉由設置該流出管路,能夠適當地抑制因 為禁止流體從加熱管路或冷卻管路流到調溫部而導致該檢測 裝置受到上述溫度梯度的影響。 手段5為更包含泵浦,其吸入該調溫部之下游側的流體, 並將其輸出至該加熱管路、該冷卻管路、及該旁通管。 在上述手段5中,能夠使用泵浦而使流體循環。尤其是, 相較於設置在加熱管路、冷卻管路、旁通管之下游側且在調 …溫部上游側,藉由將泵浦設置在加熱管路、冷卻管路、旁通 8 2238-9394~PF;Ahddub 200842539 • 官之上游側’能夠縮短在調節裝置和調溫部之間的流體的流 動路徑。因此,能夠使得從調節裝置輸出的流體快速地到達 調溫部,而且能夠使調溫部的溫度更快速地到達所欲的溫度。 手段6為,在該加熱管路、該冷卻管路、該旁通管之上 游侧及該調溫部的下游側設置有用以存放該流體的儲存裝 置,該儲存裝置具有吸收該流體因為溫度而產生之體積變化 的功能。 在流體的體積隨溫度而變化的情況下,因為流體之溫度 變化而造成其體積變化,而有可能會使得流體受到阻礙。此 點’在手段6中’因為儲存裝置具有吸收該流體因為溫度而 產生之體積變化的功能,即使在流體體積變化的情況下,也 能夠維持流體的循環。而且,相較於將儲存裝置設置在該加 熱管路、該冷卻管路、該旁通管之上游侧及該調溫部的下游 侧及調溫部的上游侧,藉由將儲存裝置設置在該加熱管路、 該冷卻管路、該㈣管之上游侧及該調溫部的上游侧,能約 縮短在調節裝置和調溫部之間的流體的流動路徑。 手丰又7為,更包含麵作裝置,其操作該調節裝置,以將 該調溫部旁的流體的溫度控制至目標值。 在上述手段7中藉由設置操作裝置,而能夠將調溫部的 温度調節到所欲之溫度。 在手段8中,該操作裝置,將由檢測該調溫部旁流體之 溫度的輸出溫度檢測裝置所得之檢測值對目標值進行回饋 制。 工 在上述手段8中,因為執行回饋控制,而能夠使檢測值 精確地達到目標值。 2238-9394-PF;Ahddub 9 200842539 * 在手#又9中’該调郎裝置係為分別調節該加熱管路、該 冷卻管路、該旁通管的下游侧的流路面積的|置;該操作裝 置包含轉換裝置,其將依據該檢測值和該目標值的差異= 量,轉换為該加熱管路、該冷卻管路、該旁通管的個別之流 路面積操作量。 在上述手段9中,藉由設置轉換裝置,就因為將檢測值 和該目標值的差異定量化為單一的量,依據該定量化的量, 而能夠調節(操作)上述3個管路的流路面積。 再者,以此為佳:轉換裝置,在檢測值大於目標值的情 況下,相對於該差異之變化,而變化冷卻管路和旁通管的流 路面積,在檢測值小於目標值的情況下,相對於該差異之變 化,而變化加熱管路和旁通管的流路面積。 在手段10中,該操作裝置操作該調節裝置,在該目標值 變化後之特定期間,不用上述回饋控制,而依據檢測該旁通 官溫度之旁通溫度檢測裝置的檢測值,以開放迴路控制該調 溫部旁流體之溫度。 當目標值變化時,為了藉由回饋控制而使檢測值快速地 到達目標值,而要求加大該控制的增益值。而且,在加大該 控制的增益值的情況下,檢測值在目標值上下變動的變動量 也變大。如此,在回饋控制中,提高反應性和抑制變動量之 間具有相互交換的關係。此點,在手段1〇中,在目標值變化 之後的特定期間内不用回饋控制而使用開放迴路控制,因 此,即使設定回饋控制以抑制檢測值在目標值上下變動的變 動量,也能夠提高目標值變化時的反應性。 在手段11中,該調節裝置係為分別調節該加熱管路、該 2238-9394-PF;Ahddub 10 200842539 冷卻管路、該旁通官的下游側的流路面積的裝置;該操作裝 置,當該目標值變化時,在該旁通管内之流體的溫度高於該 目標值的情況下,操作該旁通管及該冷卻管路的流路面積, 藉此,開放迴路控制談調溫部的溫度至目標值,在該旁通管 内之流體的溫度低於該目標值的情況下,操作該旁通管及該 加熱管路的流路面積,藉此,開放迴路控制該調溫部的溫度 至目標值。 在上述手段11中,相較於也使用加熱通路,在旁通管内 之流體的溫度兩於該目標值的情況下,藉由操作該旁通管及 該冷卻管路的流路面積,能夠降低能量之消耗。再者,相較 於也使用冷卻管路,在該旁通管内之流體的溫度低於該目標 值的情況下,操作該旁通管及該加熱管路的流路面積,能夠 降低能量之消耗。 手段12為,更包含過渡時目標值設定裝置,其在關於該 調溫部之溫度的要求改變的情況下,使該目標值較該要求變 化更大幅度變化。 為了在目標值變化之後使調溫部的溫度到達目標值,必 須藉由經過溫度調節的流體而使調溫部的溫度變化,因此, 在向著目標值變化時會產生反應延遲。而且,為了變化被控 制對象的溫度,在調溫部的溫度變化之後,必須在被控制對 象和調溫部之間進行能量交換,所以被控制對象的溫度變化 之反應延遲會更為明顯。在此,在上述手段12中,當實際要 求變化時’藉由使該目標值較該要求變化更大幅度變化,而 施夠使得調溫部或被控制對象的溫度,快速地到達所要求之 溫度。 11 2238-9394-PF;Ahddub 200842539 • 13為’更包含開放迴路控制配合支援裝置,其要 選取關於該開放迴路控制的增益值、該開放迴路控制的持嘖 時間、及該開放迴路控制時的目標值之設定中至少一者的複 數個&項t任忍-者’並對應於選取的值進行該溫度控制。 在開放路控制中,其增益或持續時間、及目標值之最 佳設定,係隨著被控制對象而異。因此,在溫度控制裝置中, 這些參數從-開始就是固定的,而使得被㈣對象無法執行 最佳的開放迴路控制。此點,在手段13中,藉由設置配合支 援裝置,能夠降低溫度控制裝置的使用者在對應於被控制對 象而使用參數時的勞力。 在手段14中,該調節裝置係為分別調節該加熱管路、該 冷卻管路、該旁通管的下游侧的流路面積的裝置;該操作裝 f,在該調温部的溫度處於不變狀態的情況下,禁止由該調 即裝置對該加熱管路及該冷卻管路調節之流路面積為〇。 在π止机體從加熱管路或冷卻管路流到調溫部的情況 下,調節裝置的下游侧和上述被禁止的管路之間會產生溫度 梯度。因此,在解除禁止之後,流出到調溫部的流體之溫度 受到溫度梯度的影響,而可能使得調溫部的溫度到達所欲之 溫度所需的時間拉長。此點,在上述手段14中,在該調溫部 的酿度處於不變狀態的情況下,禁止由該調節裝置對該加熱 管路及該冷卻管路調節之流路面積為〇,藉此,能夠適當地抑 制溫度梯度,而且,能夠使得更快速地使調溫部的溫度到達 所欲之溫度。 再者,在手段14中,也可以在該加熱管路較該調節裝置 上游侧,設置加熱側溫度檢測裝置以檢測其溫度,在該冷卻 2238-9394-PF;Ahddub 12 200842539 ^ 管路較該調節裝置上游侧,設置冷卻側溫度檢測裝置以檢測 其溫度。在此情況下,藉由設置該流出管路,能夠適當地抑 制因為禁止流體從加熱管路或冷卻管路流到調溫部而導致該 檢測裝置受到上述溫度梯度的影響。 【實施方式】 [第1實施型態] 以下參照圖式,說明本發明溫度控制裝置的第丨實施型 9 態。 第1圖顯示依據本發明第1實施型態的溫度控 整體構成圖。 ' 圖示的溫度控制裝置係用於例如生物工學的領域或化學 工業的領域之加工/製造工程、生物學/化學實驗、半導體製 造程序、或精密機器的製造程序中。溫度控制裝置具有調溫 板10。調溫板10,其上承載了被控制對象,係為可以從垂直 下方支撐被控制對象之板狀元件,並和被控制對象交換熱 能。詳言之,在調溫板10的内部設有管路(調溫部u),以供 透過合流部12而進入之非壓縮性流體(以作為熱能交換介質 之液狀媒體(液狀溫度媒體)為佳)流動之用,藉由該流體的溫 度而調節調溫板10的溫度。再者,被控制對象為,例如被驗 化學物質、半導體晶圓、精密機器等。 在調溫板10中流動的流體,透過流出管路14而流入儲 存槽16。儲存槽16係由液體所充填,但是,在其上部有空隙, 並注入氣體。因此,即使流體的體積因為温度變化而有改變, 該變化係由作為壓縮性流體之氣體而吸收。因此,藉此能夠 2238-9394-PF;Ahddub 13 200842539 - 避免因為流體體積變化而造成流體流動之阻礙。 儲存槽16的流體,係由泵浦18所吸入,並輸出到分岔 部19。在此,泵浦18可以由隔膜泵浦、渦流泵浦、串級泵浦 等構成。上述分岔部19係與冷卻管路20、旁通管30及加埶 管路40連接。 口… 冷卻管路2G係將從分岔部19流入之流體冷卻,並使其 流出到合流部12。冷卻管路2〇設有冷卻部22包覆在其一部 份上。冷卻部22將從分岔部19流入之流體冷卻。詳言之, 冷卻部22設有管路以供冷卻到特定溫度之流體(水、油、冷 媒)流動之用,藉由該流體使得冷卻管路2〇中的流體冷卻。 冷卻管路20在冷卻部22上游側端部和下游側端部之^具有 彎曲的管路構造,藉此擴大冷卻部22内之冷卻管路2〇 ^的 容積。再者,不使用該彎曲構造,而使用例如僅在冷卻部22 内擴大其流路面積,藉此擴大冷卻部22内的容積亦可。 再者,在冷卻管路20的下游側,設有連續調節冷卻管路 2〇之内的流路面積的冷卻用閥24。而且,在冷卻管路中 車乂^部用閥24上游處,設有檢測冷卻管路2〇内流體溫度的 冷部用溫度感測H 26,在較冷卻關24τ游處,則設有檢測 冷卻管路2G内流體之質量流量或容積流量的冷卻用流 28 〇 " 再者,冷卻管路20,在比冷卻部22更下游之處,其流路 面積大致上為固定較佳。 另一方面’旁通管30係將從分岔部19流入之流體直接 透過合流部12流出到調溫部η。在旁通管⑽的下游側,設 有連續調節旁通管30之内的流路面積的旁通用閥34。而且, 2238-9394-PF;Ahddub 14 200842539 在旁通管30中較旁摘田?目0y) 流體溫产的旁Έ用、w "上游處,設有檢測旁通管30内 现又、、溫度感測器36,在較旁通用閥34下游 則设有檢測旁通管3η向、7^:触 ^ 流量器38。 ^體之f量流量或容積流量的旁通用 加熱官路4〇 ’係將從分岔部19流人之流體加熱 出到合流部12。加熱管路40設有加熱部42包覆在生_;; 份上。加熱部42將從分岔部19流入之流體加熱。詳;之:200842539 IX. OBJECTS OF THE INVENTION: The present invention relates to a temperature control device for controlling a temperature of a controlled object by circulating a fluid to a temperature regulating portion disposed beside the controlled object. Desire temperature. [Prior Art] r Fig. 12 shows such a temperature control device. The flow system in the storage tank 100 is sucked by the pump 102 and discharged to the heating unit i 〇4. The heating unit 1 〇4 has heating to heat the fluid output to the temperature regulating unit 1 〇 6 . The fluid passing through the temperature control unit 1 〇 6 is output to the cooling unit 108. The fluid output to the storage tank 100 can be cooled by the cooling unit 1〇8. The temperature adjustment unit 1〇6 is configured to support the controlled object, and controls the temperature of the controlled object supported by the temperature adjustment unit 106 by adjusting the temperature of the fluid supplied to the temperature adjustment unit 1〇6. Here, when the temperature of the controlled object is to be raised, the fluid is not cooled at the cooling portion 1〇8, and the fluid is heated at the heating port 104. On the other hand, when the temperature I of the controlled object is to be lowered, the fluid is cooled in the cooling portion 108, and the & body is not heated in the heating portion 104. By this, it is possible to control the temperature of the controlled object at a desired temperature. In addition to the one shown in Fig. 12, the temperature control device of the past is also described in Patent Document 1 which will be described later. Patent Document 1: JP-A-2000-89832, SUMMARY OF THE INVENTION The temperature of a controlled object is changed to 2238 to 9939-PF by the above-described /m degree control device; the desired temperature of Ahddub 5 200842539 takes a long time. . In other words, in order to cool the temperature of the controlled object, it is necessary to stop the heating of the heating unit 104 and start the cooling of the cooling unit 10, but even after the heating unit 1Q4 stops heating, it is temporarily caused by the residual heat. There is still a high temperature fluid flowing from the heating section 1 [outflow. Moreover, even if the cooling portion 1G8 starts to cool, it takes time for the fluid to actually be cooled, and it takes a longer time for the temperature of the fluid in the storage tank 100 to drop. Therefore, the temperature of the temperature adjustment portion (10) cannot be quickly changed, so that the temperature of the controlled object cannot be changed rapidly. The invention provides a temperature control device for circulating a fluid to a temperature regulating portion disposed beside a controlled object to control the temperature of the controlled object at a desired temperature by circulating a fluid. The temperature of the controlled object can quickly reach the desired temperature. The following is a means for solving the above problems, and the effects thereof. The hand & 1 is a /JBL degree control device' by controlling the temperature of the controlled object to a desired degree by circulating the fluid to the temperature regulating portion disposed beside the controlled object, characterized by including: a heating pipe Causing and circulating the fluid to the tempering section; a cooling line that cools the fluid and circulates it to the j-week/dish' bypass f, which prevents the fluid from passing through the heating tube The road and the cooling pipe are circulated to the temperature regulating portion; and the adjusting device adjusts the flow through the junction of the two ', ,, Lülu 豸 cold section, and the bypass pipe, and outputs to the switch The flow ratio of the fluid in the warm section. The adjusting device is disposed at the twisting pipe, the cooling pipe, the downstream of the bypass pipe, and the upstream of the joining portion. In the above-mentioned hand killing 1 Aj ^ A ', by adjusting the flow ratio of the fluid output to the temperature regulating portion through the heating pipe, the cooling road, and the bypassing officer, the output can be output to the The temperature of the fluid changes rapidly. In particular, since the flow 2238-9394-PF/Ahddub Γ 200842539 is adjusted in the heating pipe, the cooling pipe, the downstream of the bypass pipe, and the upstream of the merging portion, it is possible to make The adjustment position of the flow ratio and the distance of the λ are shortened, so that the temperature of the fluid output to the temperature adjustment portion can be changed more rapidly. Therefore, when the temperature of the controlled object is controlled to the desired temperature, the temperature of the controlled object can be quickly reached to the desired temperature. Further, in the plate, the flow path area of the merging portion is preferably small so that the flow rate of the fluid flowing through the heating circuit, the cooling pipe, and the bypass pipe is as low as possible. Here, the flow velocity of the fluid is the velocity at which the fluid travels in the flow direction. Furthermore, the adjusting device adjusts a flow ratio that is output to the temperature regulating portion through the heating pipe, the cooling pipe, and the bypass pipe, respectively. The means 2 is that the temperature control means controls the temperature of the controlled object to a desired temperature by circulating the fluid to the temperature regulating portion disposed beside the controlled object, and is characterized by comprising: a heating pipe; Heating the body and passing it to the temperature regulating portion; cooling a pipe that cools the fluid and circulates it to the temperature regulating portion; a bypass pipe that prevents the fluid from passing through the heating pipe and The cooling circuit is circulated to the temperature regulating portion, and the adjusting device adjusts the flow path area of the heating pipe, the cooling pipe, and the downstream side of the bypass pipe, respectively. In the above-mentioned means 2, by adjusting the flow path areas on the downstream side of the heating pipe, the cooling pipe, and the side of the square, the temperature can be adjusted to be output to the temperature regulation through the heating pipe, the cold section, and the bypass pipe. The flow ratio of the department. Therefore, the temperature of the fluid output to the temperature regulating portion can be rapidly changed. Therefore, when the temperature of the controlled object is controlled to a desired temperature, the temperature of the controlled object can be quickly reached to the desired temperature. The means 3 is that the bypass pipe is 2238-9394-PF between the heating pipe and the cooling pipe; Ahddub 7 200842539 is shared. In the above means 3, in the case where the fluid is output from the heating pipe and the bypass pipe to the temperature regulating portion, and the fluid is output from the cooling pipe and the bypass pipe to the temperature regulating portion, the same bypass can be used. tube. Therefore, the configuration of the temperature control device can be simplified as compared with the case where a separate bypass officer must be used. The means 4 is such that, on the upstream side of the heating pipe and the cooling pipe, an outflow pipe is provided which causes the adjusting device to bypass and the fluid to flow out. When the fluid is not output from the heating pipe or the cooling pipe to the temperature regulating portion, a temperature gradient is generated between the downstream side of the adjusting device and the above-mentioned prohibited pipe. Therefore, after the prohibition is released, the temperature of the fluid flowing out to the temperature regulating portion is affected by the temperature gradient, and the time required for the temperature of the temperature regulating portion to reach the desired temperature may be elongated. In this regard, in the above-described means 4, by providing the discharge line ', the temperature gradient on the upstream side of the outflow line can be appropriately controlled, and the temperature of the temperature adjustment unit can be quickly reached to the desired temperature. Furthermore, in the means 4, the heating side temperature detecting means may be disposed on the upstream side of the heating device to detect the temperature thereof, and the cooling side temperature detecting means is provided on the upstream side of the adjusting line To detect its temperature. In this case, by providing the outflow line, it is possible to appropriately suppress the influence of the temperature gradient caused by the flow of the fluid from the heating pipe or the cooling pipe to the temperature regulating portion. The means 5 further includes a pump that sucks the fluid on the downstream side of the temperature regulating portion and outputs it to the heating pipe, the cooling pipe, and the bypass pipe. In the above means 5, the pump can be used to circulate the fluid. In particular, compared to the downstream side of the heating pipe, the cooling pipe, and the bypass pipe, and on the upstream side of the temperature control section, by placing the pump in the heating pipe, the cooling pipe, and the bypass 8 2238 -9394~PF; Ahddub 200842539 • The upstream side of the official' can shorten the flow path of the fluid between the adjustment device and the temperature control unit. Therefore, the fluid output from the regulating device can be quickly reached to the temperature regulating portion, and the temperature of the temperature regulating portion can be made to reach the desired temperature more quickly. The means 6 is provided with a storage device for storing the fluid on the heating pipe, the cooling pipe, the upstream side of the bypass pipe and the downstream side of the temperature regulating portion, the storage device having the temperature of absorbing the fluid The function of producing volume changes. In the case where the volume of the fluid changes with temperature, the volume of the fluid changes due to the temperature change of the fluid, and the fluid may be hindered. This point 'in means 6' is because the storage device has a function of absorbing the volume change of the fluid due to temperature, and the circulation of the fluid can be maintained even in the case where the volume of the fluid changes. Further, the storage device is disposed on the heating pipe, the cooling pipe, the upstream side of the bypass pipe, the downstream side of the temperature control portion, and the upstream side of the temperature control portion. The heating pipe, the cooling pipe, the upstream side of the (four) pipe, and the upstream side of the temperature regulating portion can shorten the flow path of the fluid between the adjusting device and the temperature regulating portion. The hand is also 7 and further includes a faceting device that operates the adjusting device to control the temperature of the fluid adjacent to the temperature regulating portion to a target value. In the above means 7, by setting the operating means, the temperature of the temperature regulating portion can be adjusted to a desired temperature. In the means 8, the operating means returns the detected value obtained by the output temperature detecting means for detecting the temperature of the fluid adjacent to the temperature regulating portion to the target value. In the above means 8, since the feedback control is executed, the detected value can be accurately reached to the target value. 2238-9394-PF; Ahddub 9 200842539 * In the hand #又9', the lang device is to adjust the heating circuit, the cooling pipe, and the flow path area on the downstream side of the bypass pipe; The operating device includes a switching device that converts the individual flow path area operation amount of the heating pipe, the cooling pipe, and the bypass pipe according to the difference between the detected value and the target value. In the above-described means 9, by providing the conversion means, since the difference between the detected value and the target value is quantified into a single amount, the flow of the above three pipes can be adjusted (operated) according to the quantified amount. Road area. Furthermore, it is preferable that the conversion device changes the flow path area of the cooling pipe and the bypass pipe with respect to the change of the difference when the detected value is larger than the target value, and the detected value is smaller than the target value. Next, the flow path area of the heating pipe and the bypass pipe is changed with respect to the change of the difference. In the means 10, the operating device operates the adjusting device, and in the specific period after the change of the target value, the feedback control is not used, and the detection value of the bypass temperature detecting device for detecting the temperature of the bypass officer is controlled by an open loop. The temperature of the fluid next to the temperature control unit. When the target value is changed, in order to quickly reach the target value by the feedback control, it is required to increase the gain value of the control. Further, when the gain value of the control is increased, the amount of fluctuation in which the detected value fluctuates above and below the target value also increases. Thus, in the feedback control, there is a mutual exchange relationship between the improvement of the reactivity and the suppression of the variation. In this case, in the means 1〇, the open loop control is used without the feedback control in the specific period after the target value change. Therefore, even if the feedback control is set to suppress the fluctuation of the detected value from the target value, the target can be improved. Reactivity when the value changes. In the means 11, the adjusting device is a device for respectively adjusting the heating pipe, the 2238-9394-PF, the Ahddub 10 200842539 cooling pipe, and the flow path area of the downstream side of the bypass officer; When the target value is changed, when the temperature of the fluid in the bypass pipe is higher than the target value, the flow path area of the bypass pipe and the cooling pipe is operated, thereby controlling the temperature adjustment part of the open circuit control The temperature reaches a target value, and when the temperature of the fluid in the bypass pipe is lower than the target value, the flow path area of the bypass pipe and the heating pipe is operated, whereby the open circuit controls the temperature of the temperature regulating portion To the target value. In the above-described means 11, the heating path is also used, and when the temperature of the fluid in the bypass pipe is equal to the target value, the flow path area of the bypass pipe and the cooling pipe can be reduced. Energy consumption. Furthermore, compared with the cooling line, when the temperature of the fluid in the bypass pipe is lower than the target value, the flow path area of the bypass pipe and the heating pipe can be operated, thereby reducing energy consumption. . The means 12 further includes a transition time target value setting means for causing the target value to vary more greatly than the required change in the case where the request for the temperature of the temperature adjustment portion is changed. In order to bring the temperature of the temperature adjustment portion to the target value after the target value is changed, the temperature of the temperature adjustment portion must be changed by the temperature-adjusted fluid, and therefore, a reaction delay occurs when the temperature is changed toward the target value. Further, in order to change the temperature of the object to be controlled, after the temperature change of the temperature adjustment portion, energy exchange must be performed between the controlled object and the temperature control portion, so that the reaction delay of the temperature change of the controlled object becomes more conspicuous. Here, in the above-mentioned means 12, when the actual demand changes, 'by making the target value change more greatly than the required change, the temperature of the temperature control unit or the controlled object is quickly reached, and the required temperature is quickly reached. temperature. 11 2238-9394-PF; Ahddub 200842539 • 13 is a more open loop control coordination support device, which selects the gain value of the open loop control, the hold time of the open loop control, and the open loop control The plurality of & items t of the target value are set to be forbearing and the temperature control is performed corresponding to the selected value. In open-circuit control, the gain or duration, and the optimal setting of the target value vary with the controlled object. Therefore, in the temperature control device, these parameters are fixed from the beginning, so that the (four) object cannot perform the optimal open loop control. At this point, in the means 13, by providing the mating support means, it is possible to reduce the labor of the user of the temperature control means when using the parameters corresponding to the controlled object. In the means 14, the adjusting device is a device for adjusting the flow path area of the heating pipe, the cooling pipe, and the downstream side of the bypass pipe; the operation f is not in the temperature of the temperature regulating portion In the case of a variable state, the flow path area adjusted by the adjustment device to the heating pipe and the cooling pipe is prohibited to be 〇. In the case where the π stop body flows from the heating pipe or the cooling pipe to the temperature regulating portion, a temperature gradient occurs between the downstream side of the adjusting device and the above-mentioned prohibited pipe. Therefore, after the prohibition is released, the temperature of the fluid flowing out to the temperature regulating portion is affected by the temperature gradient, and the time required for the temperature of the temperature regulating portion to reach the desired temperature may be elongated. In this case, in the above-described means 14, when the brewing degree of the temperature regulating portion is in a constant state, the flow path area adjusted by the adjusting device to the heating pipe and the cooling pipe is prohibited, thereby The temperature gradient can be appropriately suppressed, and the temperature of the temperature adjustment portion can be made to reach a desired temperature more quickly. Furthermore, in the means 14, the heating side temperature detecting means may be provided on the upstream side of the heating device to detect the temperature thereof, in the cooling 2238-9394-PF; Ahddub 12 200842539 ^ On the upstream side of the adjusting device, a cooling side temperature detecting device is provided to detect the temperature thereof. In this case, by providing the outflow line, it is possible to appropriately suppress the detection device from being affected by the above temperature gradient because the flow of the fluid from the heating pipe or the cooling pipe to the temperature regulating portion is prohibited. [Embodiment] [First Embodiment] A third embodiment of a temperature control device according to the present invention will be described below with reference to the drawings. Fig. 1 is a view showing the overall configuration of a temperature control according to a first embodiment of the present invention. The illustrated temperature control device is used in, for example, the field of biotechnology or the processing/manufacturing engineering, biological/chemical experiments, semiconductor manufacturing processes, or manufacturing processes of precision machines in the field of the chemical industry. The temperature control device has a temperature regulating plate 10. The temperature regulating plate 10, on which the controlled object is carried, is a plate-like member that can support the controlled object from vertically below, and exchanges heat with the controlled object. In detail, a pipe (tempering portion u) is provided inside the temperature regulating plate 10 for the non-compressible fluid that enters through the merging portion 12 (for liquid medium as a heat exchange medium (liquid temperature medium) Preferably, for flow, the temperature of the temperature regulating plate 10 is adjusted by the temperature of the fluid. Further, the controlled object is, for example, a chemical substance to be tested, a semiconductor wafer, a precision machine, or the like. The fluid flowing in the temperature regulating plate 10 flows into the storage tank 16 through the outflow line 14. The storage tank 16 is filled with a liquid, but has a space in the upper portion thereof and injects a gas. Therefore, even if the volume of the fluid changes due to temperature changes, the change is absorbed by the gas as a compressive fluid. Therefore, it is possible to avoid 2238-9394-PF; Ahddub 13 200842539 - to avoid the obstruction of fluid flow due to fluid volume changes. The fluid in the storage tank 16 is sucked by the pump 18 and output to the branching portion 19. Here, the pump 18 may be constituted by a diaphragm pump, a vortex pump, a cascade pump, or the like. The branching portion 19 is connected to the cooling duct 20, the bypass pipe 30, and the twisting pipe 40. Port 2 The cooling line 2G cools the fluid flowing from the branching portion 19 and flows out to the merging portion 12. The cooling duct 2 is provided with a cooling portion 22 covering a part thereof. The cooling unit 22 cools the fluid flowing from the branching portion 19 . In detail, the cooling portion 22 is provided with a line for the flow of a fluid (water, oil, refrigerant) cooled to a specific temperature, by which the fluid in the cooling line 2 is cooled. The cooling duct 20 has a curved piping structure at the upstream end portion and the downstream side end portion of the cooling portion 22, thereby expanding the volume of the cooling duct 2〇 in the cooling portion 22. Further, without using the curved structure, for example, the flow path area may be enlarged only in the cooling portion 22, thereby increasing the volume in the cooling portion 22. Further, on the downstream side of the cooling pipe 20, a cooling valve 24 for continuously adjusting the flow path area in the cooling pipe 2'' is provided. Further, in the cooling pipe, the upstream portion of the valve 24 for the rim portion is provided with a temperature sensing H 26 for detecting the temperature of the fluid in the cooling pipe 2, and is provided at the lower cooling point 24τ. The cooling flow of the mass flow rate or the volume flow rate of the fluid in the cooling line 2G 〇" Further, the cooling line 20 is substantially fixed in the flow path area further downstream than the cooling portion 22. On the other hand, the bypass pipe 30 directly flows the fluid flowing from the branching portion 19 through the merging portion 12 to the temperature regulating portion η. On the downstream side of the bypass pipe (10), a bypass common valve 34 for continuously adjusting the flow passage area in the bypass pipe 30 is provided. Moreover, 2238-9394-PF; Ahddub 14 200842539 in the bypass pipe 30 in the side of the field? Item 0y) The side of the fluid temperature production, w " upstream, with the detection bypass 30, the temperature sensor 36, downstream of the side of the common valve 34 is provided with a detection bypass 3n To, 7^: touch the flow device 38. The side-by-side heating path 4' of the volume flow rate or the volume flow rate of the body is heated to the confluence portion 12 from the fluid flowing from the branching portion 19. The heating pipe 40 is provided with a heating portion 42 to cover the raw portion. The heating unit 42 heats the fluid flowing from the branching portion 19 . Detailed;

加熱部42設有管路以供加熱到特定溫度之流體(水、油、熱 媒k動之用’藉由該流體使得加熱管路4〇中的流體加熱。 加熱s路4G在加熱部42 ±游侧端部和下游側端部之間具有 f曲的&路構造’藉此擴大加熱部42内之加熱管路40内的 容積。再者’不使用該f曲構造,而使用例如僅在加熱部^ 内擴大其流路面積亦可。 再者,在加熱官路4〇的下游侧,設有連續調節加熱管路 4〇之内的流路面積的加熱用閥44。而且,在加熱管路4〇中 較加熱用Μ 44上游處,設有檢測加熱管路4()内流體溫度的 加熱用溫度感測器46,在較加熱用閥44下游處,則設有檢測 加熱管路40内流體之質量流量或容積流量的加熱用流量器 48。 再者,加熱管路40,在比加熱部42更下游之處,其流路 面積大致上為固定較佳。 冷卻管路20、旁通管30及加熱管路40,係連接於位於 其下游位置的合流部12。在此,相較於冷卻管路20、旁通管 30及加熱管路40的流路面積,在不使流體流速變慢的範圍 .内’盡量不擴大合流部12内的流路面積或合流部12和調溫 2238-9394-PP;Ahddub 15 200842539 部π之間的流路面積較佳。亦即,合流部12或合流部12和 调溫部11之間的流路面積,設定為能夠抑制因為其容積而造 成的肌體之滞召’以盡量使得從冷卻用閥24、加熱用閥44 流出的流體之流速不降低。 上述口抓邛12和調溫部丨丨之間,設有用以檢測由調溫 部11輸出之流體的溫度的輸出溫度感測器5卜 另一方面,控制裝置50,對應於被控制對象之溫度的要 求值(要求,1度Tr)而操作冷卻用閥24、旁通關%、或加熱 用閥44’藉此以調節調溫部u内之流體的溫度,並藉此間接 也m皿板1 〇上的被控制對象之溫度。此時,控制裝置別 適當地參照冷卻用溫度感測器26、旁通用溫度感測器36、加 熱用溫度感測器46、冷卻用流量器28、旁通用流量器38、加 熱用流量器48等的檢測值。 再者,控制裝置50包括:用以驅動冷卻用閥%、旁通用 閥34、或加熱用目44㈣動部,以及依據上述各種檢測裝置 的檢測值4算上述驅動部輸出之操作訊號的計算部。該計算 部可以由專料硬體裝置構成,並且,也可以具有微電腦。 再者’也可以具有-般通用的個人電腦,以及使其進行計算 的程式。 依據上述溫度控制裝置,對應於要求溫度Tr的變化,能 夠使調溫部11内之流體的溫度快速變化。亦即,在冷卻管路 2〇内㈣體溫度低於要求溫度Tr,且加熱管路4()内流體的 溫度高於要求溫度Tr的範圍中,不論要求溫度&的值為何, 都能狗藉由調節從冷卻管路2α、旁通管3()、及加熱管路4〇 流出的流體流量,而能夠使調溫部u内之流體的溫度快速變 2238-9394-PF;Ahddub 16 200842539 . 為所欲之溫度。 再者,上述溫度控制裝置藉由設置旁通管3〇,能夠降低 用以將調溫部11内的溫度維持於定值所耗用的能量。以下就 此點說明之。 例如,循環於調溫部11的流體為水,冷卻管路20中的 溫度為攝氏10度,加熱管路4〇内的溫度為攝氏7〇度,流動 於調溫部11中的流體之流量為2〇L/分。再者,當實現將輸出 溫度感測器51的檢測值Td控制在攝氏40度的穩定狀態時, 從調溫部11流出的流體的溫度上升到攝氏43度。在此情況 下,藉由使冷卻管路20及旁通管30的流體流出到調溫部u, 並且不使用加熱管路40内的流體,而能夠執行溫度控制。探 究此時的能量消耗量。 從冷卻管路20流出到調溫部u的流體之流量為「骷」, 則下式成立。 2〇(L/分)x40(°C ) = l〇(°C )xWa+43(°C )x(20-Wa) 由此可知Wa与1· 8L/分。 因此,在冷卻部22消耗之能量消耗量Qa如下。The heating portion 42 is provided with a pipe for heating to a specific temperature (water, oil, heat medium k for use) by the fluid to heat the fluid in the heating pipe 4 。. The heating s road 4G is in the heating portion 42 The ±curvature & road structure ' between the side of the swim side and the end of the downstream side expands the volume in the heating duct 40 in the heating unit 42. Again, 'the f-curve structure is not used, but for example Further, the flow path area may be enlarged only in the heating unit. Further, a heating valve 44 for continuously adjusting the flow path area in the heating line 4A is provided on the downstream side of the heating main path 4〇. In the heating pipe 4, upstream of the heating crucible 44, a heating temperature sensor 46 for detecting the temperature of the fluid in the heating pipe 4 () is provided, and downstream of the heating valve 44, the detecting heating is provided. The flow rate of the fluid in the line 40 or the volume flow rate of the flow rate of the flow vessel 48. Further, the flow path area of the heating line 40 is substantially fixed downstream of the heating portion 42. 20. The bypass pipe 30 and the heating pipe 40 are connected to the confluence portion 12 at a downstream position thereof. Compared with the flow path area of the cooling line 20, the bypass pipe 30, and the heating pipe 40, the flow path area or the confluence portion 12 in the confluence portion 12 is not enlarged as much as possible in a range where the fluid flow rate is not slowed. And the temperature adjustment 2238-9394-PP; Ahddub 15 200842539 is better in the flow path area between the portions π, that is, the flow path area between the merging portion 12 or the merging portion 12 and the temperature regulating portion 11 is set to be able to suppress The flow rate of the body caused by the volume is not reduced as much as possible. The flow rate of the fluid flowing out from the cooling valve 24 and the heating valve 44 is not lowered as much as possible. The output temperature sensor 5 of the temperature of the fluid output from the temperature control unit 11 is on the other hand, the control device 50 operates the cooling valve 24, next to the required value of the temperature of the controlled object (required, 1 degree Tr). The valve closing % or the heating valve 44' is used to adjust the temperature of the fluid in the temperature adjusting portion u, and thereby indirectly also the temperature of the controlled object on the plate 1. The control device is not appropriately referred to at this time. Cooling temperature sensor 26, side common temperature sensor 36, heating temperature The detected value of the sensor 46, the cooling flow rate device 28, the bypass general flow rate device 38, the heating flow rate device 48, etc. Further, the control device 50 includes: a cooling valve %, a bypass valve 34, or heating The calculation unit for calculating the operation signal outputted by the drive unit is calculated by using the target 44 (four) moving portion and the detection value 4 of the above various detecting devices. The calculation portion may be constituted by a dedicated hardware device, and may also have a microcomputer. It is also possible to have a general-purpose personal computer and a program for calculating the same. According to the temperature control device described above, the temperature of the fluid in the temperature control unit 11 can be rapidly changed in accordance with the change in the required temperature Tr. In the cooling line 2, the body temperature is lower than the required temperature Tr, and the temperature of the fluid in the heating line 4 () is higher than the required temperature Tr, regardless of the required temperature & The flow rate of the fluid flowing out from the cooling line 2α, the bypass pipe 3 (), and the heating pipe 4〇 can rapidly change the temperature of the fluid in the temperature control unit u to 2238-9394-PF; Ahddub 16 200842539. Desire temperature . Further, by providing the bypass pipe 3〇, the temperature control device can reduce the energy used to maintain the temperature in the temperature control unit 11 at a constant value. This is explained below. For example, the fluid circulating in the temperature regulating portion 11 is water, the temperature in the cooling pipe 20 is 10 degrees Celsius, the temperature in the heating pipe 4 is 7 degrees Celsius, and the flow rate of the fluid flowing in the temperature regulating portion 11 It is 2〇L/min. Further, when the detected value Td of the output temperature sensor 51 is controlled to a steady state of 40 degrees Celsius, the temperature of the fluid flowing out of the temperature regulating portion 11 rises to 43 degrees Celsius. In this case, temperature control can be performed by causing the fluid of the cooling line 20 and the bypass pipe 30 to flow out to the temperature adjustment portion u and without using the fluid in the heating pipe 40. Exploring the amount of energy consumed at this time. When the flow rate of the fluid flowing out from the cooling pipe 20 to the temperature adjustment unit u is "骷", the following formula holds. 2〇(L/min)x40(°C) = l〇(°C)xWa+43(°C)x(20-Wa) From this, it can be seen that Wa and 1·8 L/min. Therefore, the energy consumption amount Qa consumed in the cooling unit 22 is as follows.

Qc=(43-10)χ1· 8x60(秒)+ (860:轉換係數)=4. lkW 相對於此’在不具有旁通管3 〇之構成的情況下,冷卻部 22的能量消耗量Qa和加熱部42的能量消耗量qc如下。Qc=(43-10)χ1·8x60 (seconds)+ (860: conversion coefficient)=4. lkW relative to this case, in the case where the configuration of the bypass pipe 3 is not provided, the energy consumption amount Qa of the cooling unit 22 The energy consumption amount qc of the heating unit 42 is as follows.

Qa=(43-10)xl〇(L/分)X60(秒)+860 与 23kW Qc=(70-43)xl〇(L/分)χ60(秒)+860与 19kW 因此,能量消耗量Q為「42kW」,係為設置旁通管30的 情況之大約10倍。 繼之’詳述實施型態之控制裝置5 〇執行之溫度控制。第 2238-9394-PF;Ahddub 17 842539 2圖顯示控制裝置50執行的處理中的回 例如,該處理係由控制裝置5〇重複地週期料行处理程序。 二==為it在步驟S1”,判斷是否為 J 3處理係為判斷回饋控制的 立。開放迴路控制係為在後述之條件下實行 饋控制。 T此時不執仃回Qa=(43-10)xl〇(L/min)X60(seconds)+860 and 23kW Qc=(70-43)xl〇(L/min)χ60(seconds)+860 and 19kW Therefore, energy consumption Q The "42 kW" is about 10 times as large as the case where the bypass pipe 30 is provided. Following the detailed control of the implementation of the control device 5 温度 temperature control. 2238-9394-PF; Ahddub 17 842539 2 shows a return in the process performed by the control device 50. For example, the process is repeated by the control device 5 to periodically cycle the line processing program. Two == is it in step S1", and it is judged whether or not the J3 processing system is for judging the feedback control. The open loop control is to perform the feed control under the conditions described later.

在步驟S1G中判斷為否的情況下,在步驟犯中 輸出溫度感測器51的檢測值Td。在繼之的步驟su中,曾^ 用以將檢測值Td回饋控制到目標值Tt的基本操作量在 二見二,為依據要求溫η而決定之值,在回饋控制 以為要求溫度Tr。基本操作量仙為,依據檢測值以對於 ^值Tt之差異所算出之量。詳言之’在本實施型態中,依 據檢測值T d和目擇插了 + + μ λ 和目仏值Tt之差△的PID(比例微分積分)而算 出基本操作量mb。In the case where the determination in step S1G is NO, the detected value Td of the temperature sensor 51 is outputted in the step. In the subsequent step su, the basic operation amount for controlling the detection value Td to the target value Tt is 2, and the value determined according to the required temperature η is determined by the feedback control as the required temperature Tr. The basic operation amount is the amount calculated based on the difference between the value T and the detected value. In the present embodiment, the basic operation amount mb is calculated based on the detected value T d and the PID (proportional differential integral) in which the difference Δ between the + + μ λ and the target value Tt is inserted.

繼之,在步驟S16中,將基本操作量仙轉換為冷卻用閥 24、旁通用閥34、及加熱用閥44個別之操作量(開度%化Then, in step S16, the basic operation amount is converted into the operation amount of the cooling valve 24, the bypass valve 34, and the heating valve 44 (the opening degree is reduced).

Vc) °在此係使用第3圖所示之關係。在此,在基本操作量MB 未達〇的情況下,冷卻用閥24的開度Va隨著基本操作量MB 的增加而單方向明顯減少,其在基本操作量Μβ大於〇的情況 下則為〇。此係為,檢測值Td高於目標值Tt越多則使冷卻管 路20的流量增加’並且,在檢測值Td低於目標值Tt的情況 下,使付冷部管路2〇不被使用而為之設定。再者,加熱用閥 44的開度Vb ’在基本操作量Mb大於〇的情況下,隨著基本 操作篁MB的增加而單向地明顯增加,在基本操作量〇小於〇 的情況下則為0。此係為,檢測值Td低於目標值Tt越多則使 2238-9394-PF;Ahddub 18 200842539 加熱管路40的流量增加,並且,在檢測值Td高於目標值η 的情況下,使得加熱管路4〇不被使用而為之設定。再者,旁 通用閥34的開度,隨著基本操作量Μβ0 〇越遠,則其單向 地明顯減少。再者’在第3圖中’各開度之設定,係使得從3 個管路中流出之總和流量不隨著基本操作量e的值而變化較 佳。 藉由此設定,依據檢測值Td和目標值η之差△的單一 的PID的计异而算出基本操作量〇,能夠設定冷卻用閥μ、 旁通用閥34、加熱用閥44之3個閥的操作量。 當前述之第2圖的步驟S16的處理結束時,在步驟si8 中,操作冷卻用閥24、旁通用閥34、加熱用閥44之3個閥。 再者,在步驟S10中判斷為否定的情況,或在步驟_的處 理結束的情況下,結束此一連串的處理。 藉由如上述地使用回饋控制,能夠使檢測值μ精密地隨 著目枯值Tt而變。但是’為了藉由回饋控制使得檢測值Td 對於目仏值Tt的反應性提㊄,必須要求力σ大回饋控制的增益 值,但是當增益值變大,檢測值在目標值上下變動的變動量 也變大。如此一來,在回饋控制中,提高對於目標值Tt之變 化的反應性和降低檢測值Td的變動量之間具有相互交換的關 係。因此,在降低變動量的情況下,就犧牲了反應性。在第4 圖中,顯示在目標值Tt變化時使用回饋控制之情況下,檢測 值Td及被控制對象之溫度的變化。 如圖所示,在檢測值Td到達目標值Tt之前產生反應延 遲,而且,被控制對象的溫度到達目標值Tti前需要更長的 時間。此係為,為了使被控制對象的溫度變化,必須要調溫 2238-9394-PF;Ahddub 19 200842539 P 1 1的》JDL度變化’透過調溫板1 〇和調溫部1 1的熱能交換而 使調溫板10的溫度變化,調溫板10和被控制對象之間產生 的熱能交換之故。因此,為了降低檢測值Td的變動量,而設 定回饋控制,難以藉由回饋控制而使得被控制對象的溫度快 速到達目標值Tt。在本實施型態中,在外部傳來的要求溫度 Tr變化的情況下,係使用開放迴路控制。再者,此時,使該 目標值Tt的變化較該要求溫度Tr的變化更大幅度。Vc) ° The relationship shown in Figure 3 is used here. Here, in the case where the basic operation amount MB is less than 〇, the opening degree Va of the cooling valve 24 is significantly reduced in one direction as the basic operation amount MB is increased, and in the case where the basic operation amount Μβ is larger than 〇, Hey. In this case, the more the detected value Td is higher than the target value Tt, the flow rate of the cooling line 20 is increased 'and the cold portion 2 is not used when the detected value Td is lower than the target value Tt. And set it for it. Further, in the case where the basic operation amount Mb is larger than 〇, the opening degree Vb' of the heating valve 44 is unidirectionally increased as the basic operation 篁MB is increased, and when the basic operation amount 〇 is smaller than 〇, 0. In this case, the more the detected value Td is lower than the target value Tt, the 2238-9394-PF; the flow rate of the Ahddub 18 200842539 heating pipe 40 is increased, and in the case where the detected value Td is higher than the target value η, the heating is caused. The line 4 is set without being used. Further, the opening degree of the bypass common valve 34 is significantly reduced unidirectionally as the basic operation amount Μβ0 〇 is further. Further, the setting of each opening degree in 'Fig. 3' is such that the total flow rate flowing out of the three pipes does not change as the value of the basic operation amount e does not change. By setting this, the basic operation amount 算出 is calculated based on the difference of the single PID of the difference Δ between the detected value Td and the target value η, and the three valves of the cooling valve μ, the bypass valve 34, and the heating valve 44 can be set. The amount of operation. When the process of step S16 in the second drawing described above is completed, in step si8, three valves of the cooling valve 24, the bypass valve 34, and the heating valve 44 are operated. Furthermore, in the case where the determination in step S10 is negative, or in the case where the processing in step_ is completed, the series of processing is ended. By using the feedback control as described above, it is possible to accurately change the detected value μ with the target value Tt. However, in order to increase the reactivity of the detected value Td to the target value Tt by the feedback control, the gain value of the force σ large feedback control must be required, but when the gain value becomes larger, the detected value fluctuates above and below the target value. It also gets bigger. As a result, in the feedback control, the relationship between the reactivity with respect to the change of the target value Tt and the amount of fluctuation of the detected value Td is improved. Therefore, in the case of reducing the amount of variation, the reactivity is sacrificed. In Fig. 4, the detected value Td and the temperature of the controlled object are changed when the feedback control is used when the target value Tt changes. As shown in the figure, the reaction delay is generated before the detected value Td reaches the target value Tt, and it takes a longer time before the temperature of the controlled object reaches the target value Tti. In order to change the temperature of the controlled object, it is necessary to adjust the temperature of 2238-9394-PF; Ahddub 19 200842539 P 1 1 "JDL degree change" through the heat exchange between the temperature regulating plate 1 and the temperature control unit 1 The temperature of the temperature regulating plate 10 is changed, and the heat energy generated between the temperature regulating plate 10 and the controlled object is exchanged. Therefore, in order to reduce the amount of fluctuation of the detected value Td, the feedback control is set, and it is difficult to quickly reach the target value Tt by the feedback control by the temperature of the controlled object. In the present embodiment, in the case where the required temperature Tr transmitted from the outside changes, open loop control is used. Further, at this time, the change in the target value Tt is made larger than the change in the required temperature Tr.

第5圖顯示本實施型態中目標值的設定處理之程序。該 處理係由控制裝置50以例如週期性地重複執行。 在此一連串的處理中,首先在步驟S2〇中,判斷偏差控 制執行旗標是否為開啟(0n)。在此之偏差控制執行旗標,: 為執行使目標值Tt大幅變化之偏差控制的旗標。而且,在偏 差控制執行旗標為開啟的情況下,則進行步驟S22。在步驟 S22中,判斷要求溫度^的變化量ΔΤγ的絕對值是否在臨界 ,α以上。在此,臨界值α係為,用以判斷是否為如前述Fig. 5 is a view showing the procedure of the setting process of the target value in the present embodiment. This processing is repeatedly performed by the control device 50, for example, periodically. In this series of processing, first, in step S2, it is judged whether or not the deviation control execution flag is ON (0n). The deviation control execution flag here is: a flag for performing a deviation control that causes the target value Tt to vary greatly. Further, in the case where the deviation control execution flag is on, step S22 is performed. In step S22, it is judged whether or not the absolute value of the change amount ΔΤγ of the required temperature ^ is equal to or greater than α. Here, the critical value α is used to determine whether it is as described above.

弟2圖巾藉由回饋控制無法使被控制對象的溫度快速達到要 求的變化的情況。而且,在判斷為在臨界值減上的情況下, 在步驟S24巾,使偏差控制執行旗標為開啟,並且開始計時 動作以對偏差控制時間計時。 當上述步驟S24的處理έ士壶,十— 处理…朿,或在步驟S20中判斷為肯 定時,在步驟S26中,判斷變化量 „ |艾儿里δγγ是否大於0。該處理 係用以判斷是否產生使溫度上井 反上开的要求。而且在變化量ATr 大於〇的情況下,執行步驟Sm。—止 丁^鄉S28。在步驟S28中,將目標值The case where the control towel cannot quickly bring the temperature of the controlled object to the required change by the feedback control. Further, in the case where it is judged that the threshold value is decreased, the deviation control execution flag is turned on in step S24, and the timing operation is started to time the deviation control time. When the processing of the gentleman pot, the tenth processing...朿 in the above step S24, or the determination in the step S20 is affirmative, in step S26, it is judged whether the change amount „ | 艾里里 δγγ is greater than 0. The processing is used for judging Whether or not the requirement is made to open the temperature on the well, and in the case where the amount of change ATr is greater than 〇, step Sm is performed. - Stop Ding ^ S28. In step S28, the target value is

Tt没定為:從加熱管路4〇申、、*碘 4U中机體之溫度減去特定之補償值 /5之值。在此,目標值Tt趟接拼4> 越接近加熱管路40内的溫度,則 2238-9394-PF;Ahddub 20 200842539 • 能夠使被控制對象的溫度越快上升。但是,在目標值Τΐ高於 加熱管路4G内之溫度的情況下,就無法執行控制了。而且, 可以藉由使流體在加熱管路4〇循環而使得加熱管路4〇内的 /皿度艾化。因此’將目標值Tt設定為加熱管路内的溫度 減去補償值;5 〇 另一方面,在步驟S26中判斷變化量ATr低於〇的情況 下,在步驟S30中,將目標值Tt設定為冷卻管路2〇内的流 體之1度加上特定的補償值^。在此,補償值^的設定和上 述補侦值/3的設定具有相同的意義。 步驟S28及S30的處理中之目標值Tt的設定在偏差繼續 時間Tbi内持續進行(步驟S32)。而且,在經過偏差繼續時間Tt is not determined as: the value of the specific compensation value /5 is subtracted from the temperature of the body in the heating line 4, and * iodine 4U. Here, the target value Tt 趟 拼 4> is closer to the temperature in the heating pipe 40, then 2238-9394-PF; Ahddub 20 200842539 • The temperature of the controlled object can be increased faster. However, in the case where the target value Τΐ is higher than the temperature in the heating pipe 4G, the control cannot be performed. Moreover, the degree of / inside the heating line 4 can be made by circulating the fluid in the heating line 4 . Therefore, 'the target value Tt is set to the temperature in the heating line minus the compensation value; 5 〇 On the other hand, in the case where it is judged in step S26 that the amount of change ATr is lower than 〇, the target value Tt is set in step S30. A specific compensation value ^ is added to 1 degree of the fluid in the cooling line 2〇. Here, the setting of the compensation value ^ has the same meaning as the setting of the above-described compensation value /3. The setting of the target value Tt in the processing of steps S28 and S30 is continued within the deviation continuing time Tbi (step S32). Moreover, after the deviation continues

Tbl後,在步驟S34巾,使目標值Tt為要求溫度Td。並且, 使偏差控制執行旗標為關閉(〇ff)並且結束對偏差控制時間 進行計時的計時動作。再者,在步驟S34的處理結束,或在 上述步驟S22 A S32中判斷為否定的情況下,結束此一連串 的處理。 第6圖係顯示本實施型態中溫度控制的處理程序。該處 理係由控制裝置50重複地週期性執行。 在該一連串的處理中,首先在步驟S4〇中,判斷意味著 執行開放迴路控制的旗標之開放迴路控制旗標是否為開啟 (On) ^並且,在開放迴路控制旗標不是開啟的情況下,進行 步驟S42。在步驟S42令,判斷目標值^的變化量的絕 對值是否在臨界值£ m且,在判斷為在臨界值以上 的情況下,在步驟S44中,使意味著執行開放迴路控制的旗 標之開放迴路控制旗標為開啟,並且開始計時動作以對開放 2238-9394-PF;Ahddub 21 200842539 迴路控制計時。 當上述步驟S44的處 处里、、、口束或在步驟S40中判斷為肯 疋%,進仃步驟S46。在步 驟中,判斷目標值Tt是否高 、: 用溫度感測器36所檢測出的旁通管3〇内的流體之 2 該處理係為用以判斷使用旁通管3G和加熱管路40 來執行開放迴路控制,或傕 乂便用旁通皆30和冷卻管路20來執 行開放迴路控制。 繼之,在判斷目標溫度Tt高於旁通管3〇内的流體之溫 度Tbm下,進行步驟S48。在步驟㈣巾,使用旁通管 3〇和加熱g路40來執行開放迴路控制。亦即,若目標溫度 门於方通f 30内的流體之溫度Tb,則使用冷卻管路只 是浪費能量而已’所以使用旁通管3G和加熱管路4G來執行 開放迴路控制。詳言之,使用加熱用溫度感測器46的溫度Tc 及加熱用机里器48的流量Fc,以及旁通用溫度感測器36的 溫度Tb和旁通用流量器38的流量Fb,以操作加熱用閥44 及旁通用閥34,使得輸出到調溫部n的流體之溫度為目標值After Tbl, in step S34, the target value Tt is set to the required temperature Td. Then, the deviation control execution flag is turned off (〇 ff) and the timing operation for counting the deviation control time is ended. Furthermore, when the processing of step S34 is ended, or if the determination in steps S22 A S32 is negative, the series of processing ends. Fig. 6 is a view showing the processing procedure of the temperature control in the present embodiment. This processing is repeatedly performed periodically by the control device 50. In the series of processes, first in step S4, it is judged whether the open loop control flag of the flag indicating the execution of the open loop control is ON (and), and in the case where the open loop control flag is not turned on. Go to step S42. In step S42, it is judged whether or not the absolute value of the change amount of the target value ^ is at the critical value £m, and if it is determined to be equal to or greater than the critical value, in step S44, the flag indicating that the open loop control is executed is made. The open loop control flag is on and the timing action is started to time the open 2238-9394-PF; Ahddub 21 200842539 loop control. When the above-mentioned step S44 is in the middle, the mouth, or the step S40 is judged to be 疋%, the process proceeds to step S46. In the step, it is judged whether the target value Tt is high or not: the fluid in the bypass pipe 3〇 detected by the temperature sensor 36 is used to determine the use of the bypass pipe 3G and the heating pipe 40. Open loop control is performed, or the bypass circuit 30 and the cooling line 20 are used to perform open loop control. Then, in a case where it is judged that the target temperature Tt is higher than the temperature Tbm of the fluid in the bypass pipe 3, step S48 is performed. In step (4), the bypass tube 3 is used and the heating path 40 is used to perform open loop control. That is, if the target temperature gate is at the temperature Tb of the fluid in the square port f 30, the use of the cooling pipe is only a waste of energy. Therefore, the bypass pipe 3G and the heating pipe 4G are used to perform the open circuit control. In detail, the temperature Tc of the heating temperature sensor 46 and the flow rate Fc of the heating machine 48, and the temperature Tb of the side common temperature sensor 36 and the flow rate Fb of the bypass general flow meter 38 are used to operate the heating. The valve 44 and the bypass valve 34 are used to make the temperature of the fluid output to the temperature adjustment portion n a target value.

Tt。換言之,操作加熱用閥44及旁通用閥34,以使得下式成 立。Tt. In other words, the heating valve 44 and the bypass valve 34 are operated so that the following formula is established.

Ttx(Fc+Fb)=TcxFc+TbxFb 另一方面,在步驟S46中,在判斷目標溫度Tt低於旁通 管30内的流體之溫度Tb的情況下,進行步驟S50。在步驟 S50中,使用旁通管3〇和冷卻管路2〇來執行開放迴路控制。 亦即,若目標溫度Tt低於旁通管30内的流體之溫度Tb,則 使用加熱管路40只是浪費能量而已,所以使用旁通管3〇和 冷卻管路20來執行開放迴路控制。詳言之,使用冷卻用溫度 2238-9394-PF;Ahddub 22 200842539 感測器26的溫度Ta及冷卻用流量器28的流量Fa,以及旁通 用溫度感測器36的溫度Tb和旁通用流量器狀的流量Fb,以 操作冷卻㈣24及旁通㈣34 ’使得輪出到調溫部i i的流 體之溫度為目標值Tt。換言之,操作冷部㈣24 &旁通用閥 34,以使得下式成立。Ttx (Fc + Fb) = TcxFc + TbxFb On the other hand, in step S46, when it is judged that the target temperature Tt is lower than the temperature Tb of the fluid in the bypass pipe 30, step S50 is performed. In step S50, the open loop control is performed using the bypass pipe 3〇 and the cooling pipe 2〇. That is, if the target temperature Tt is lower than the temperature Tb of the fluid in the bypass pipe 30, the use of the heating pipe 40 is only a waste of energy, so the bypass pipe 3 and the cooling pipe 20 are used to perform the open circuit control. In detail, the cooling temperature 2238-9394-PF is used; Ahdub 22 200842539 The temperature Ta of the sensor 26 and the flow rate Fa of the cooling flow meter 28, and the temperature Tb of the side common temperature sensor 36 and the bypass general flow meter The flow rate Fb is set to operate the cooling (four) 24 and the bypass (four) 34' such that the temperature of the fluid that is rotated out to the temperature regulating portion ii is the target value Tt. In other words, the cold portion (four) 24 & side common valve 34 is operated so that the following formula holds.

Ttx(Fa+Fb)=TaxFa+TbxFb 當上述步驟S48及S50的處理結束時,進行步驟聊。在 步驟S52中,判斷是否已經過特定的期間τ〇ρ。在此,特定的 期間Top係用以決定開放迴路控制繼續的時間。在本實施型 態中,為了使得依據上述第5圖所示之處理而使目標值”和 要求溫度Tr不同之偏差繼續時間加内不進行回饋控制,而 將特定的期間TqP設定為較偏差繼續時間ΤΗ長。而且,在 判斷為已經過特定的期間τ〇ρ的情況下,在步驟娜中,使 開放迴路㈣旗標為__),並使得用以對開放迴路控制 計時之計時動作結束。 再者,在步驟S54的處理結束,或步驟S42及S52中判 斷為否定的情況下’結束此一連串的處理。 第7圖係顯示同時使用第6及5圖的處理之情況下的溫 又控制樣態。如圖所示,相較於上述第4圖所示之情況,被 控制對象的溫度能夠快速地到達目標值h。 藉由上^詳述的本實施型態,可以得到後述之效果。 態的溫度控制裝置具有··加熱管路,其將 二:體加熱並使其循環到調溫部11;冷卻管路2。,其將該流 其循環到調溫部11;旁通管3〇,其使該流體不通 過加熱管路4。及冷卻管路2〇,而循環到調溫部ιι;加熱用 2238-9394-PF;Ahddub 23 200842539 ㈤44、冷卻關24、旁通賴34,其分別調節透過由該加熱 管路40、該冷卻管路2〇、該旁通管3〇匯流之下游侧的流路 面積。藉此,在將被控制對象的溫度控制為所欲之溫度時, 能夠使該被控制對象的溫度快速地到達所欲之溫度。 ⑵加熱管路4〇和冷卻管路2()共用旁通管。藉此,當 流體從加熱管路40和旁通管3〇輸出到調溫部u的情況下, 以及流體從冷卻管路2Q和旁通f 3()輸_調温部丨丨的情況 下,可以使用共通的旁通管30。因此’相較於必須使用個別 ( 的旁通管的情況,能夠簡化溫度控制裝置的構造。 ⑶本實施型態的溫度控制裝置更包含泵浦18,其吸入該 調溫部11之流體’並將其輸出至該加熱管路“、該冷卻管路 2〇、及該旁通管3G。相較於設置在加熱管路40、冷卻管路20、 旁通管3G之下游侧且在調溫部n上游側,藉由將系浦㈣ 置在加熱管路40、冷卻管路2G、旁通f 3q之上游侧,能夠 縮短在加熱用閥44、冷卻„ 24、旁通㈣%和調溫部n ^間的流體的流動路徑。因此,能夠使得從加熱用閱44、冷 部用閥24、旁通用閥34輸出的流體快速地到達調溫部11, 而且能夠使調溫部11的溫度更快速地到達所欲的溫度。 ⑷本實施型態的温度控制裝置中,在該加熱管路4〇、該 :卻管路20、該旁通管3Q之上游侧及該調溫部_下游側 设置有用以存放流體的儲存槽16,儲存槽16的上部係為氣體 所填充。藉此’能夠吸收該流體因為溫度而產生之體積變化, 而且不論溫度造成之流體龍積變化,而㈣適當 體的循環。 、#付机 ⑸將由檢測該調溫部n旁流體之溫度的輸出溫度檢測 2238-9394-PF;Ahddub 24 200842539 哀置51所得之檢測值Td對目標值Tt進行回饋控制。藉此, 能夠使檢測值Td精確地達到目標值Tt。 (6) 在上述回饋控制時,依據檢測值Td對於目標值以之 差異而將基本操作量MB轉換為加熱管路4〇、冷卻;^路2〇及 旁通官30之個別之流路面積操作量(開度ν&,vb,Vc)。藉 此,依據單一的基本操作量Μβ,能夠操作(調節)上述」個管 路的流路面積。 (7) 在目標值Tt變化之後的特定期間内不用回饋控制, 而依據檢測該旁通管30溫度之旁通溫度檢測裝置%的檢測 值,以開放迴路控制該調溫部u旁流體之溫度。藉此,即使 設定回饋控制以抑制檢測值1(1在目標值Ttji下變動的變動 Ϊ ’也能夠提高目標值Tt變化時的反應性。 一⑻當該目標值Tt變化時,在該旁通管3〇内之流體的溫 度高於該目標值Tt的情況下,操作該旁通管3〇及該冷卻管 路20的流路面積,藉此,開放迴路控制該調溫部^的溫度 至目標值Tt,在該旁通管30内之流體的溫度低於目標值 的情況下,操作該旁通管30及該加熱管路4〇的流路面積, 藉此,開放迴路控制該調溫部η的溫度至目標值。藉此,能 夠在盡量降低能量消耗量的情況下進行開放迴路控制。 (9)在關於該調溫部11之溫度的要求改變的情況下,使 該目標值Π較該要求變化更大幅度變化。藉此,能夠使得調 溫部11或被控制對象的溫度,更快速地朝向所要求之溫度變 化° [第2實施型態] 以下針對第2實施型態,以其和第!實施型態之差異為 2238-9394-PF/Ahddub 25 200842539 中心參照圖面說明之。 第8圖顯示依據本實施型態的溫度控制裝置之整體構成 圖。如圖所示,在本實施型態中,流出管路60連接於冷卻管 路20中介於冷卻甩溫度感測器26和冷卻用閥24之間,以使 知冷卻官路20内的流體流出到流出管路14。另外,流出管路 62連接於加熱管路4〇中介於加熱用溫度感測器46和加熱用 閥44之間,以使得加熱管路4〇内的流體流出到流出管路14。 這些流出管路60及62,都比冷卻管路20、加熱管路40 的流路面積小很多。此係因為,流出管路60及62在冷卻用 閥24或加熱用閥44關閉時,為了使流體少量地從冷卻管路 20或加熱管路40流到流出管路14。 亦即在7^止流體從加熱管路4 0或冷卻管路2 〇流到調 溫部11的情況下,加熱用閥44或冷卻用閥24的下游侧和上 述被禁止的管路之間會產生溫度梯度。因此,在解除禁止之 後,流出到調溫部11的流體之溫度受到溫度梯度的影響,而 可能使得調溫部11的溫度到達所欲之溫度所需的時間拉長。 再者,在此情況下,冷卻用溫度感測器26或加熱用溫度感測 器46的溫度因為受到溫度梯度的影響,而檢測出偏離冷卻部 22附近的溫度或加熱部42附近之溫度。因此,有可能使得目 標值Tt變化時之開放迴路控制的控制性降低。 相對於此,本實施型態中,藉由設置流出管路6〇及62, 在加熱用閥44或冷卻用閥24為關閉狀態的情況下,能夠藉 由流出管路60及62而適當地抑制上游侧的溫度梯度,而且 能夠使調溫部的溫度更快地到達所欲之溫度。 .藉由上述說明之本實施型態,除了可以得到上述第1每 2238-9394-PF;Ahddub 26 200842539 施型態之上述⑴〜⑻的效果之外,更可以得到下列的 (附加熱用溫度感測器46中加熱用間44之上游側, 以及冷卻管路20中冷卻用鬥μ L Α 。藉此,能夠更適當地執㈣ [第3實施型態] 心變化時的溫度控制。 以下針對第3實施型態,以其和態 中心參照圖面說明之。 左吳為 Γ 第9圖係顯示本實施型態之基本操作量抓及冷卻用閥 24、旁通用閥34、加熱用閥“的開度%化γ。的關係。 如圖所示,在本實施型態中,冷卻用間24的開度仏和加孰 用閥44的開度Vb係設定為平時不處於全閉狀態。亦即 2操作錢未達0的情況下,冷卻用㈣㈣度%隨著 土本㈣里MB的增加而單方向明顯減少’其在基本操作量仳 大於〇的情況下則為最小開度⑽。再者,加熱用閥44的開 度Vb,在基本操作量MB大於〇的情況下,隨著基本操作量 MB的增加而單向地明顯增加,在基本操作量肋小於〇 下則為最小開度(>〇)。 藉此’不具有如上述第.8圖之流出管路6〇及62,在主要 以旁通管30之流體的流出來穩定調溫部u的溫度控制時, 能夠抑制冷卻用閥24或加熱關44之上游側的溫度梯度。 藉由上述說明之本實施型態’除了可以得到上述第工實 施型態之上述⑴〜⑻的效果之外,更可以得到下列的效果。 (11)冷卻用閥24的開度Va和加熱用閥44的開度vb係 設定為平時不處於全閉狀態。藉此,能夠抑制冷卻用闕^或 加熱用閥44之上游側的溫度梯度’而且能夠使得調溫部u 2238-9394-PF;Ahddub 27 200842539 的溫度更快地到達所欲之溫度。 [第4實施型態] 以下針對第4實施型態,以其和第〗實施型態之差異為 中心參照圖面說明之。 在上述第1實施型態中,當目標值Tt變化時,藉由開放 迴路控制調溫部11附近的溫度,而使得被控制對象的溫度更 快地到達所欲之溫度。該開放迴路控制的增益值、偏差繼續 時間Tbi、繼續開放迴路控制的特定的期間τ〇ρ之最佳值,係 可以隨著調溫板1〇或被控制對象而異。另一方面,當使用者 改變被控制對象時,以手動方式變更這些參數是很費力的。 因此,在本實施型態中,控制裝置5〇更裝設配合支援裝置。 第10圖係顯示本實施型態之配合支援處理的程序。該處理係 由控制裝置50重複地週期性執行。 在該一連串的處理中,首先在步驟S7〇中,判斷是否為 執行開放迴路控制配合的模式(測試模式)。在此,例如藉由 在控制裝置50具有用於讓使用者指示測試模式的功能,來判 斷有無測試模式亦可。而且,在判斷為測試模式的情況下, 在« S72 +,以使用者可以目視確認的顯示方式顯示偏差 繼縯時間Tbi的選項。在此,偏差繼續時間ΤΗ的選項係設 疋為彳以侍到對於在該溫度控制襞置中預設的被控制對象 之適當的值之範圍。 …在步驟S74中,判斷是否輸入偏差繼續時間ΤΜ。該處理 係為,判斷使用者是否選擇偏差繼續時間Tbi之選項中的一 者。並且’在判斷使用者已選取特定的選項的情況下(步驟 S74:是)’在步驟S76中,使用選取之選項以開始溫度控制。 2238-9394-PF;Ahddub 28 200842539 . 繼之,當溫度控制結束時,在步驟S78中,以使用者可以目 視確認的顯示方式詢問使用者是否決定偏差繼續時間^卜並 且,在使用者輸入不決定的指令的情況下(步驟·•否),重 新執行上述步驟S72〜S78的處理。 相對於此,當使用者輸入欲以先前已選擇的選項中任一 者作為最終的偏差繼續時間Tbi的指令之情況下(步驟s8〇: 是),在步驟S82中,記憶偏差繼續時間ΤΜ。再者,當步驟 S82的處理結束,或在步驟S7〇中判斷為否定的情況下,結束 此一連串的處理。 藉由上述說明之本實施型態,除了可以得到上述第丨實 施型態之上述(1)〜(9)的效果之外,更可以得到下列的效果。 (12)具有開放迴路控制配合支援裝置,其促請使用者就 偏差繼續時間Tbi的複數選項中選擇任意一者,對應於選取 之值而進行溫度控制。藉此,能夠降低溫度控制裝置的使用 者在使開放迴路控制配合對應的開放迴路控制時的勞力。 [其他實施型態] 再者,上述各實施型態,亦可以如下述般變更而實施。 •依據上述第4實施型態從該第i實施型態的變更點, 來變更上述第2、第3實施型態亦可。 < •士在上述第4實施型態中,在執行開放迴路控制的配合 支援時的配合參數,並不限於偏差繼續時間吓卜例如,以開 放迴路控制的持續時間(特定的期間τ〇ρ)作為配合參數亦 I。再者’例如以前述第5圖所示之偏差控制中目標值之設 定(補償值/3,r )作為配合參數亦可。再者,以複數個上述 參數作為配合參數亦可。 29 2238-9394-PF;Ahddub 200842539 • •在上述第4實施型態中,係支援使用者對應於被控制 對象而選取適當的配合參數,但是配合的方法並不限於此。 例如對於上述偏差繼續時間Tbi、特定的期間τ〇ρ、補償值 A、τ t各參數分別任意地設定㈣值以進行溫度控制時, 監視被控制對象的溫度(或調溫板1〇的溫度),當到達1目护 值的延遲時間不在容許範圍_,自動執行變更上述參數^ 至少-個的處理亦可。藉此,因為可以自動地配合開放迴路 控制以使得到達其目標值的延遲時間在容許㈣,所以能夠 f 進一步減輕使用者的勞力。 •將基本操作量MB轉換為冷卻用閥24、旁通用闕3心 及加熱用閥44個別之操作量的方法,並不限於第3及9圖所 I者。在第3及9圖中’均是對於目標值以和檢測值以的 溫度差Δ _化,而變化冷卻用閥24、旁通用閥34、及加 熱用閥44中任意兩者的操作量,但其並不以此為限,例如變 化所有的操作量亦可。再者,在第3及9圖中,冷卻用間以、 ^ 旁通關34、及加熱用閥個別之操作量為溫度差△的〇 ί.; 次或1次的係數,但其並不以此為限。 •在第3實施型態中’不論基本操作量MB為何,冷卻用 闕24、旁通用闕34、及加熱用閥44都不可以為全閉狀態, 但其並不以此為限。僅在基本操作量仙接近〇的情況,禁止 冷卻用閥24及加熱用閥44為全閉狀態亦可。亦即,因為考 慮到在要求溫度ΊΥ變化之前,檢測值Td為目標值以而使 測值Td為固定的狀態,所以,僅在此情況下應該為目標值η 的變化預作準備’僅在基本操作量MB接近〇的情況,禁止冷 卻用閥24及加熱用閥44為全閉狀態亦可。再者,此時,^ 2238-9394-PF/Ahddub 30 200842539 基本操作量MB低於〇的情況下 之變化詈女於4曰 使传冷部用閥24的操作量 大於加熱用閥44之操作量的變 操作量MB大於〇的情況下, 在基本 ㈢丨&人 力熱用閥44的操作量之變化 1小於冷卻用閥24的操作量之變化量較佳。 ^化 •流出管路6 〇、6 2並不限於笛ο 一 不限於第2實施型態(第8圖)所例 不廷。例如,如第U圖所示,也 』以具有繞過冷部用閥24 而連接冷卻管路20中冷卻用閥24 其 〜4的上游側和下游側的流出 &路60’以及繞過加熱„44而連接加熱管路⑼中加轨用 閥44的上游侧和下游側的流出管路62。再者,在此之流出管 路60及62’設置於冷卻用溫度感測器26或加熱用溫度感測 器46之下游側較佳。 •上述各實施型態中,係分別設定開放迴路控制持續的 特定的期間Top以及偏差繼續時間Tbi,但其並不以此為限, 其為一致亦可。 •回饋控制不限於PID控制。例如ρι控制或丨控制亦可。 在此,例如,如上述各實施型態一般,在目標值變化時執行 開放迴路控制的構成中,回饋控制的目的係為在正常時使檢 測值Td精確地和目標值Tt 一致,或者盡量減少檢測值Td的 變動。因此,如積分控制一般,其尤其適用於依據表示檢測 值Td和目標值Tt的差異的累積值,而使檢測值Td回饋控制 到目標值Tt。 •開放迴路控制不限於上述實施型態中所例示者。例 如’在旁通管30内的流體之溫度高於目標值Tt的情況下, 冷卻用閥24和旁通用閥34的開度之設定,係參照如上述第3 圖所示的開度之比率而為之亦可,在旁通管30内的.流體之溫 2238-9394-PF;Ahddub 31 200842539 _ 度低於目標值Tt的情況下,加熱用閥44和旁通用閥34的開 度之設定,係參照如上述第3圖所示的開度之比率而為之亦 可。在此對應於所使用之管路内的流體溫度,藉由計算以哪 一個開度比库之2個閥可以達到目標值Tt,而可以執行開放 匕路控制尤其疋,藉由此種方法,能夠避免使用流量計。 因為流置计係浸泡在流體中,在加熱管路4〇内的流體溫度和 冷卻管路20内的流體溫度之間的溫度範圍中長時間使用而難 以維持其可靠性,所以以不使用流量計之簡單的開放迴路控 f 制為佳。再者,不使用第3圖所示之開度比率,例如在旁通 & 30内的流體之溫度高於目標值Τΐ的情況下,將冷卻用閥 24及旁通用閥34的開度,設定為對應於冷卻管路2〇内的流 體對於目t值Tt之差及目標值Tt對於加熱管路4〇内的流體 之溫度之差的比率較佳。同樣地,在旁通管3〇内的流體之溫 度低於目標值Tt的情況下,加熱用閥44及旁通用閥34的開 度,設定為對應於旁通管30内的流體之溫度對於目標值η , 之差,以及目標值Tt對於加熱管路40内的流體之溫度之差 、 的比率較佳。 •不限定於執行回饋控制,僅執行第6圖的步驟S48及 S50所示之開放迴路控制亦可。再者,不論目標值是否變化, 將藉由第6圖的步驟S48AS5〇所示之開放迴路控制而決定 之基本操作量MB’以回饋控祕正之,而算出最終的基本操 作量MB亦可。再者,相反地,不論目標值是否變化,僅執行 回饋控制亦可。即使是在這種情況下,當要求溫度^變化時, 使該目標值Tt的變化較該要求溫度Tr的變化更大幅度之上 述偏差控較有效的。亦即,在回料射,.降低反應延遲 2238-9394-PF;Ahddub 32 200842539 和降低檢測值Td對目標值Tt的變動係互為交換的關係,但 疋藉由執行偏差控制,以回饋控制的增益值而言可以降低反 應延遲,所以能夠在降低上述變動的同時也降低反應延遲。 •回饋控制不限於,藉由將回饋控制的要求量(基本操作 里MB)轉換為冷卻用閥24、旁通用閥34、及加熱用閥44個別 之插作量而執行,例如,依據目標值Τΐ和檢測值T(i之差, 分別設定冷卻用閥24、旁通用閥34、及加熱用閥44個別之 操作里亦可。但是,即使是在此種情況下,當目標值Τΐ高於 檢測值Td的情況下,僅以旁通用閥34和冷卻用閥24的操作 量為變更對象,當目標值Τΐ低於檢測值Td的情況下,僅以 旁通用閥34和加熱用閥44的操作量為變更對象較佳。 •具有吸收該流體因為溫度而產生之體積變化的功能之 儲存裝置不限於,如上述各實施型態中所例示,儲存槽16中 不裝滿流體,而具有由氣體所填充之空間的構成。例如,儲 存槽16中無缝隙地被流體所填充的構成,並且,使館存槽16 的體積隨著流體對於儲存槽丨6的内壁施加的壓力而變化亦 可。 •在上述實施型態中,調節從冷卻管路20、旁通管3〇 及加熱管路40流到調溫板10的流體之流量比的調節裝置, 係使用冷卻用閥24、旁通用閥34及加熱用閥44,但其不阳 於此。例如,分別具有複數支這些管路,並且,設置分別執 订開關兩種動作的閥,以流體輸出到調溫板的管路之數旦 為操作量亦可。再者,準備複數支管路,並且,操作這些2 個管路是否連接於冷卻部22、加熱部42及泵浦18中任一者 之下游側亦可。再者,冷卻管路20、旁通管30及加熱管路 2238-9394-PF;Ahddub 33 200842539 ,旦0刀別,又置個別的泵浦,藉由分別控制其輸出能力而進行流 里比的調節亦可。 •另外,調溫板10不限於薄型長方體狀的板狀元件,例 如也可以為薄型圓柱狀的板狀元件。總之,只要調溫部^設 置於為可以從垂直下方支撐被控制對象的板狀元件内部即 可,例如,直接和被控制對象之複數侧面接觸而控制其溫度 亦可。 【圖式簡單說明】 第1圖顯示依據本發明第丨實施型態的溫度控制裝置之 整體構成圖。 第2圖顯示同實施型態之回饋控制的處理程序之流程圖。 第3圖顯示同實施型態之冷卻用閥、旁通用閥、加熱用 閥的操作量之設定方法的示意圖。 第4圖顯示同實施型態中僅以回饋控制進行溫度控制的 情況之被控制對象的溫度變化的時間圖。 第5圖顯示同實施型態之目標值的設定處理之程序的流 程圖。 第6圖係顯示同實施型態的開放迴路控制的處理程序之 流程圖。 第7圖係顯示同時使用開放迴路控制的情況之被控制對 象的溫度變化的時間圖。 第8圖顯示依據本發明第2實施型態的溫度控制裝置之 整體構成圖。 第9圖係顯示第3實施型態之冷卻用閥、旁通用閥、加 2238-9394-PF;Ahddub 34 200842539 、熱用閥的操作量之設定方法的示意圖。 第10圖係顯示第4實施型態之開放迴路控制配合支援處 理的程序之流程圖。 第11圖係顯示依據本發明第2實施型態的變形例溫度控 制裝置之整體構成圖。 第12圖係顯示過去的溫度控制裝置的構成示意圖。Ttx (Fa + Fb) = TaxFa + TbxFb When the processing of the above steps S48 and S50 is completed, a step chat is performed. In step S52, it is judged whether or not a specific period τ 〇 ρ has elapsed. Here, the specific period Top is used to determine the time during which the open loop control continues. In the present embodiment, the specific period TqP is set to be less biased in order to make the deviation control time different from the target temperature φ and the required temperature Tr according to the processing shown in FIG. 5 described above. In the case where it is judged that the specific period τ 〇 ρ has been passed, in the step Na, the open circuit (four) is flagged as __), and the timing operation for timing the open loop control is ended. In addition, when the process of step S54 is completed, or the determination in steps S42 and S52 is negative, the process of "continuing the series of processes is completed." Fig. 7 shows the temperature in the case where the processes of Figs. 6 and 5 are simultaneously used. As shown in the figure, the temperature of the controlled object can reach the target value h quickly compared to the case shown in Fig. 4. By the present embodiment described above, the latter can be obtained. The temperature control device of the state has a heating pipe that heats and circulates the body to the temperature regulating portion 11; the cooling pipe 2, which circulates the flow to the temperature regulating portion 11; Tube 3〇, which makes the fluid not The heating line 4 and the cooling line 2〇 are circulated to the temperature regulating unit ιι; the heating is used for 2238-9394-PF; the Ahddub 23 200842539 (5) 44, the cooling off 24, and the bypass 34 are respectively adjusted to pass through the heating. The flow path area on the downstream side of the line 40, the cooling line 2〇, and the downstream side of the bypass line 3〇, whereby the controlled object can be controlled when the temperature of the controlled object is controlled to a desired temperature The temperature quickly reaches the desired temperature. (2) The heating line 4〇 and the cooling line 2 () share the bypass tube. Thereby, when the fluid is output from the heating line 40 and the bypass line 3〇 to the temperature regulating unit u In the case where the fluid is supplied from the cooling line 2Q and the bypassing f 3 () to the temperature regulating unit ,, a common bypass pipe 30 can be used. Therefore, it is necessary to use an individual bypass. In the case of the tube, the configuration of the temperature control device can be simplified. (3) The temperature control device of the present embodiment further includes a pump 18 that sucks the fluid of the temperature adjustment portion 11 and outputs it to the heating pipe. Pipe 2〇, and the bypass pipe 3G. Compared with the heating pipe 40, the cooling pipe 20, and the side The downstream side of the pipe 3G and the upstream side of the temperature adjustment unit n are placed on the upstream side of the heating pipe 40, the cooling pipe 2G, and the bypass f 3q, whereby the heating valve 44 and the cooling can be shortened. „24. The flow path of the fluid between the bypass (four)% and the temperature regulation unit n^. Therefore, the fluid output from the heating use 44, the cold portion valve 24, and the bypass valve 34 can be quickly reached to the temperature adjustment unit 11 Moreover, the temperature of the temperature adjustment unit 11 can be more quickly reached the desired temperature. (4) In the temperature control device of the present embodiment, in the heating line 4, the: conduit 20, the bypass tube 3Q A storage tank 16 for storing a fluid is disposed on the upstream side and the temperature regulating portion_downstream side, and the upper portion of the storage tank 16 is filled with gas. Thereby, it is possible to absorb the volume change of the fluid due to the temperature, and the fluid dragon product changes regardless of the temperature, and (4) the circulation of the appropriate body. (#) The output temperature detected by the temperature of the fluid adjacent to the temperature adjustment unit n is detected 2238-9394-PF; Ahdub 24 200842539 The detection value Td obtained by the 51 is feedback control of the target value Tt. Thereby, the detected value Td can be accurately reached to the target value Tt. (6) In the above feedback control, the basic operation amount MB is converted into the heating pipe 4〇, cooling according to the difference of the detection value Td with respect to the target value; the channel area of the individual channel 2〇 and the bypass officer 30 Operation amount (opening degree ν &, vb, Vc). Thereby, the flow path area of the above-mentioned "pipes" can be operated (adjusted) in accordance with a single basic operation amount Μβ. (7) The feedback control is not used in the specific period after the target value Tt is changed, and the temperature of the fluid adjacent to the temperature adjustment unit u is controlled by the open circuit according to the detection value of the bypass temperature detecting device % detecting the temperature of the bypass pipe 30. . Thereby, even if the feedback control is set to suppress the detection value 1 (the fluctuation 1 in the target value Ttji), the reactivity at the time when the target value Tt changes can be improved. (8) When the target value Tt changes, the bypass is performed. When the temperature of the fluid in the tube 3 is higher than the target value Tt, the flow path area of the bypass pipe 3〇 and the cooling pipe 20 is operated, whereby the open circuit controls the temperature of the temperature control unit to The target value Tt, when the temperature of the fluid in the bypass pipe 30 is lower than the target value, the flow path area of the bypass pipe 30 and the heating pipe 4〇 is operated, thereby controlling the temperature adjustment by the open circuit The temperature of the portion η is set to the target value. Thereby, the open loop control can be performed while reducing the amount of energy consumption. (9) When the request for the temperature of the temperature adjustment unit 11 is changed, the target value is set Π The temperature change portion 11 or the temperature of the controlled object can be more quickly changed toward the required temperature. [Second embodiment] The second embodiment is described below. The difference between it and the implementation form is 2238-9394-PF /Ahddub 25 200842539 The center is described with reference to the drawings. Fig. 8 shows the overall configuration of the temperature control device according to the present embodiment. As shown, in the present embodiment, the outflow line 60 is connected to the cooling line. 20 is interposed between the cooling weft temperature sensor 26 and the cooling valve 24 so that the fluid in the cooling official passage 20 flows out to the outflow line 14. In addition, the outflow line 62 is connected to the heating line 4 The heating temperature sensor 46 and the heating valve 44 are arranged such that the fluid in the heating line 4〇 flows out to the outflow line 14. These outflow lines 60 and 62 are both smaller than the cooling line 20 and the heating line. The flow path area of 40 is much smaller because the outflow lines 60 and 62 are closed when the cooling valve 24 or the heating valve 44 is closed, so that a small amount of fluid flows from the cooling line 20 or the heating line 40 to the outflow tube. In the case where the fluid is turbulent from the heating pipe 40 or the cooling pipe 2 to the temperature regulating portion 11, the downstream side of the heating valve 44 or the cooling valve 24 and the above-mentioned prohibited pipe There is a temperature gradient between the roads. Therefore, after the prohibition is lifted, the flow is out to the tone. The temperature of the fluid of the portion 11 is affected by the temperature gradient, and may cause the time required for the temperature of the temperature regulating portion 11 to reach the desired temperature to be elongated. Further, in this case, the temperature sensor 26 for cooling or heating The temperature of the temperature sensor 46 is detected to be deviated from the temperature in the vicinity of the cooling portion 22 or the temperature in the vicinity of the heating portion 42 due to the influence of the temperature gradient. Therefore, it is possible to control the open loop control when the target value Tt is changed. On the other hand, in the present embodiment, by providing the outflow lines 6A and 62, when the heating valve 44 or the cooling valve 24 is in the closed state, it is possible to flow out of the lines 60 and 62. The temperature gradient on the upstream side is appropriately suppressed, and the temperature of the temperature control portion can be quickly reached to the desired temperature. According to the present embodiment described above, in addition to the effects (1) to (8) of the first every 2238-9394-PF; Ahddub 26 200842539, the following (additional heat temperature) can be obtained. The upstream side of the heating chamber 44 in the sensor 46 and the cooling bucket μ L 冷却 in the cooling duct 20 can thereby more appropriately perform (four) [third embodiment] temperature control at the time of cardiac change. For the third embodiment, the center of the state is described with reference to the drawings. Zuowuwei Γ Figure 9 shows the basic operation amount grasping and cooling valve 24, the bypass valve 34, and the heating valve of the present embodiment. In the present embodiment, the opening degree 冷却 of the cooling chamber 24 and the opening degree Vb of the twisting valve 44 are set to be not fully closed at ordinary times. In the case where the operation cost is less than 0, the cooling (4) (four) degree % is significantly reduced in one direction as the MB in the soil (4) increases, and the minimum opening degree is (10) in the case where the basic operation amount is greater than 〇. Further, the opening degree Vb of the heating valve 44 is, in the case where the basic operation amount MB is larger than 〇, With the increase of the basic operation amount MB, the unidirectionally significant increase is performed, and the minimum opening degree (>〇) is obtained when the basic operation amount rib is smaller than the squat. Thus, the flow line 6 of the above-mentioned Fig. 8 is not provided. And 62, when the temperature control of the temperature stabilization unit u is mainly caused by the flow of the fluid from the bypass pipe 30, the temperature gradient on the upstream side of the cooling valve 24 or the heating shutoff 44 can be suppressed. In addition to the effects (1) to (8) of the above-described first embodiment, the following effects can be obtained. (11) The opening degree Va of the cooling valve 24 and the opening degree vb of the heating valve 44 are set. In order to prevent the temperature of the cooling unit u 2238-9394-PF and the Ahddub 27 200842539 from being faster, the temperature gradient of the upstream side of the cooling valve 44 or the heating valve 44 can be suppressed. [Fourth Embodiment] The following describes the fourth embodiment, and the description will be made with reference to the differences between the fourth embodiment and the first embodiment. In the first embodiment described above, the target is When the value Tt changes, the temperature adjustment unit 11 is attached by the open circuit. The temperature of the controlled object reaches the desired temperature more quickly. The gain value of the open loop control, the deviation duration Tbi, and the optimum value of the specific period τ 〇 ρ of the open loop control can be The temperature adjustment plate varies depending on the object to be controlled. On the other hand, when the user changes the controlled object, it is laborious to manually change these parameters. Therefore, in the present embodiment, the control device 5 Fig. 10 shows a program for the cooperation support processing of the present embodiment. This processing is repeatedly executed periodically by the control device 50. In the series of processing, first in step S7. Determine whether it is the mode (test mode) in which the open loop control is performed. Here, the presence or absence of the test mode may be determined, for example, by the control device 50 having a function for allowing the user to instruct the test mode. Further, when it is determined that the test mode is selected, the option of the deviation relay time Tbi is displayed in «S72 + in a display manner that the user can visually confirm. Here, the option of the deviation continuation time 系 is set to 侍 to the range of appropriate values for the controlled object preset in the temperature control device. ... In step S74, it is judged whether or not the deviation continuing time 输入 is input. This processing is one of the options for determining whether or not the user selects the deviation continuation time Tbi. And 'in the case where it is judged that the user has selected a specific option (step S74: YES)' In step S76, the selected option is used to start temperature control. 2238-9394-PF; Ahddub 28 200842539. Then, when the temperature control ends, in step S78, the user is asked to visually confirm the display mode to ask the user whether to decide the deviation continuation time ^ and, if the user inputs In the case of the determined command (step·•No), the processing of steps S72 to S78 described above is re-executed. On the other hand, when the user inputs an instruction to use either of the previously selected options as the final deviation continuation time Tbi (step s8: YES), in step S82, the deviation continuation time ΤΜ is memorized. Furthermore, when the processing of step S82 ends, or if the determination in step S7 is negative, the series of processing ends. According to the present embodiment described above, in addition to the effects (1) to (9) of the above-described third embodiment, the following effects can be obtained. (12) An open loop control cooperation support device is provided which urges the user to select any one of the plural options of the deviation continuing time Tbi, and performs temperature control corresponding to the selected value. Thereby, it is possible to reduce the labor of the user of the temperature control device when the open circuit control is matched with the corresponding open circuit control. [Other Embodiments] Further, the above embodiments may be implemented as described below. According to the fourth embodiment described above, the second and third embodiments may be changed from the point of change of the i-th embodiment. < • In the fourth embodiment described above, the matching parameter at the time of performing the cooperation support of the open loop control is not limited to the deviation continuation time, for example, the duration of the open loop control (specific period τ 〇 ρ As a matching parameter, I also. Further, for example, the setting of the target value (compensation value /3, r) in the deviation control shown in Fig. 5 may be used as the matching parameter. Furthermore, a plurality of the above parameters may be used as the matching parameters. 29 2238-9394-PF; Ahddub 200842539 • In the fourth embodiment described above, the user is required to select an appropriate matching parameter corresponding to the controlled object, but the method of cooperation is not limited thereto. For example, when the respective values of the deviation duration Tbi, the specific period τ〇ρ, the compensation values A, and τ t are arbitrarily set to (4) values for temperature control, the temperature of the controlled object (or the temperature of the temperature regulating plate 1〇) is monitored. When the delay time to reach the protection value of 1 mesh is not within the allowable range _, the process of changing the above parameter ^ at least one may be automatically performed. Thereby, since the open loop control can be automatically matched so that the delay time to reach the target value is allowed (4), the user's labor can be further reduced. The method of converting the basic operation amount MB into the operation amount of the cooling valve 24, the bypass common 阙3 center, and the heating valve 44 is not limited to those of the third and ninth embodiments. In the third and ninth diagrams, the operation amount of any one of the cooling valve 24, the bypass valve 34, and the heating valve 44 is changed for the target value and the temperature difference Δ_ with the detected value. However, it is not limited to this, for example, changing all the operations. Further, in the third and ninth diagrams, the respective operation amounts of the cooling chamber, the bypass switch 34, and the heating valve are the temperature difference Δ, or the coefficient of one or one time, but it is not This is limited. In the third embodiment, the cooling unit 24, the bypass unit 34, and the heating valve 44 may not be fully closed regardless of the basic operation amount MB, but it is not limited thereto. It is also possible to prohibit the cooling valve 24 and the heating valve 44 from being fully closed only when the basic operation amount is close to 〇. That is, since it is considered that the detected value Td is a target value before the required temperature ΊΥ change, the measured value Td is fixed, and therefore, only the change of the target value η should be prepared in this case. When the basic operation amount MB is close to the 〇, the cooling valve 24 and the heating valve 44 are prohibited from being fully closed. Furthermore, at this time, ^ 2238-9394-PF/Ahddub 30 200842539 The basic operation amount MB is lower than that in the case of 〇, and the operation amount of the passage portion 24 of the passage portion is larger than the operation of the heating valve 44 When the amount of change operation MB is larger than 〇, the change 1 in the operation amount of the basic (3) amp & human heat valve 44 is smaller than the amount of change in the operation amount of the cooling valve 24. ^ The outflow line 6 〇, 6 2 is not limited to the flute ο. It is not limited to the second embodiment (Fig. 8). For example, as shown in Fig. U, the flow out & 60' of the upstream side and the downstream side of the cooling valves 24 to 4 in the cooling line 20 is connected to the bypass portion 24, and the bypass Heating „44 to connect the upstream and downstream outflow lines 62 of the railing valve 44 in the heating line (9). Further, the outflow lines 60 and 62' are provided in the cooling temperature sensor 26 or Preferably, the downstream side of the heating temperature sensor 46 is provided. In each of the above embodiments, the specific period Top and the deviation continuing time Tbi in which the open loop control continues are set, but not limited thereto, which is not limited thereto. The feedback control is not limited to the PID control. For example, the ρι control or the 丨 control may be used. Here, for example, as in the above-described respective embodiments, in the configuration in which the open loop control is performed when the target value is changed, the feedback control is performed. The purpose is to make the detected value Td exactly coincide with the target value Tt at normal time, or to minimize the variation of the detected value Td. Therefore, as in the integral control, it is particularly suitable for the difference between the detected value Td and the target value Tt. Cumulative value, and The detection value Td is fed back to the target value Tt. • The open loop control is not limited to those exemplified in the above embodiment. For example, when the temperature of the fluid in the bypass pipe 30 is higher than the target value Tt, the cooling valve The setting of the opening degree of the 24 and the bypass valve 34 is also referred to as the ratio of the opening degree as shown in the above third drawing, and the temperature of the fluid in the bypass pipe 30 is 2238-9394-PF; Ahddub 31 200842539 When the degree _ is lower than the target value Tt, the setting of the opening degree of the heating valve 44 and the bypass common valve 34 may be referred to the ratio of the opening degree as shown in the above-mentioned third figure. Corresponding to the temperature of the fluid in the pipeline used, it is possible to perform the open loop control by calculating which opening ratio the two valves of the reservoir can reach the target value Tt, and in this way, it can be avoided The flow meter is used. Since the flow meter is immersed in the fluid, it is difficult to maintain its reliability in the temperature range between the temperature of the fluid in the heating line 4〇 and the temperature of the fluid in the cooling line 20 for a long time. Simple open loop control without flow meter Further, the opening ratio shown in FIG. 3 is not used. For example, when the temperature of the fluid in the bypass & 30 is higher than the target value Τΐ, the cooling valve 24 and the bypass valve 34 are used. The opening degree is set to correspond to a ratio of the difference between the target t value Tt of the fluid in the cooling line 2〇 and the difference between the target value Tt and the temperature of the fluid in the heating line 4〇. Similarly, the bypass is performed. When the temperature of the fluid in the tube 3 is lower than the target value Tt, the opening degree of the heating valve 44 and the bypass valve 34 is set to correspond to the difference between the temperature of the fluid in the bypass pipe 30 and the target value η. And the ratio of the target value Tt to the difference in temperature of the fluid in the heating line 40 is preferred. • It is not limited to the execution of the feedback control, and only the open loop control shown in steps S48 and S50 of Fig. 6 may be performed. Further, regardless of whether or not the target value has changed, the basic operation amount MB' determined by the open loop control shown in step S48AS5 of Fig. 6 is used to feedback the control, and the final basic operation amount MB may be calculated. Furthermore, conversely, only feedback control may be performed regardless of whether the target value changes. Even in this case, when the temperature change is required, the variation of the target value Tt is made more significant than the change of the required temperature Tr. That is, in the return shot, the reaction delay is reduced by 2238-9394-PF; Ahddub 32 200842539 and the decrease detection value Td are exchanged with each other for the target value Tt, but the feedback control is performed by feedback control. The gain value can reduce the reaction delay, so that the above variation can be reduced and the reaction delay can be reduced. The feedback control is not limited to being performed by converting the required amount of the feedback control (MB in the basic operation) into the insertion amount of the cooling valve 24, the bypass valve 34, and the heating valve 44, for example, according to the target value. Τΐ and the detected value T (i difference), the cooling valve 24, the bypass valve 34, and the heating valve 44 may be individually operated. However, even in this case, when the target value Τΐ is higher than In the case of the detected value Td, only the operation amount of the bypass valve 34 and the cooling valve 24 is changed, and when the target value Τΐ is lower than the detected value Td, only the bypass valve 34 and the heating valve 44 are used. The amount of operation is preferably a change target. • The storage device having a function of absorbing a volume change due to the temperature of the fluid is not limited to, as exemplified in the above embodiments, the storage tank 16 is not filled with fluid, but has The configuration of the space in which the gas is filled, for example, the storage tank 16 is filled with the fluid without gaps, and the volume of the storage tank 16 may vary depending on the pressure applied to the inner wall of the storage tank 6 by the fluid. • Above In the embodiment, the adjusting device for adjusting the flow ratio of the fluid flowing from the cooling line 20, the bypass pipe 3, and the heating pipe 40 to the temperature regulating plate 10 is a cooling valve 24, a bypass valve 34, and heating. The valve 44 is used, but it is not positive. For example, each of the plurality of pipes is provided, and a valve for respectively performing the two actions of the switch is provided, and the number of times the fluid is output to the temperature regulating plate is an operation amount. Further, a plurality of branch lines are prepared, and it is also possible to operate whether or not the two lines are connected to the downstream side of any one of the cooling unit 22, the heating unit 42, and the pump 18. Further, the cooling line 20 , Bypass pipe 30 and heating pipe 2238-9394-PF; Ahddub 33 200842539, once a knife, and a separate pump, by adjusting the output capacity of the flow ratio can be adjusted separately. The temperature regulating plate 10 is not limited to a thin rectangular parallelepiped plate-like element, and may be, for example, a thin cylindrical plate-shaped element. In short, the temperature regulating portion is provided in a plate-like element that can support the controlled object from vertically below. Yes, for example, the direct and controlled objects The temperature can be controlled by the side contact. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a temperature control device according to a third embodiment of the present invention. Fig. 2 is a view showing the processing procedure of the feedback control of the same embodiment. Fig. 3 is a schematic view showing a method of setting the operation amount of the cooling valve, the bypass common valve, and the heating valve of the same embodiment. Fig. 4 shows the temperature control by the feedback control only in the same embodiment. The time chart of the temperature change of the controlled object in the case. Fig. 5 is a flow chart showing the procedure for setting the target value of the same embodiment. Fig. 6 is a flow chart showing the processing procedure of the open loop control of the same embodiment. Fig. 7 is a time chart showing the temperature change of the controlled object in the case where the open loop control is used at the same time. Fig. 8 is a view showing the overall configuration of a temperature control device according to a second embodiment of the present invention. Fig. 9 is a view showing a method of setting the operation amount of the cooling valve, the bypass common valve, the addition of 2238-9394-PF, the Ahddub 34 200842539, and the heat valve of the third embodiment. Fig. 10 is a flow chart showing the procedure of the open loop control cooperation support processing of the fourth embodiment. Fig. 11 is a view showing the overall configuration of a temperature control device according to a modification of the second embodiment of the present invention. Fig. 12 is a view showing the configuration of a conventional temperature control device.

【主要元件符號說明】 10〜調溫板; 12〜合流部; 16〜儲存槽; 19〜分岔部; 22〜冷卻部; 26〜冷卻用溫度感測器; 30〜旁通管; 36〜旁通用溫度感測器; 4 0〜加熱管路; 44〜加熱用閥; 48〜加熱用流量器; 51〜輸出溫度感測器; 6 2〜流出管路。 11〜調溫部; 14〜流出管路; 18〜泵浦; 20〜冷卻管路; 24〜冷卻用閥; 28〜冷卻用流量器; 34〜旁通用閥; 38〜旁通用流量器; 42〜加熱部; 46〜加熱用溫度感測器; 50〜控制裝置; 60〜流出管路; 2238-9394-PF;Ahddub 35[Main component symbol description] 10~ thermostat plate; 12~ confluence section; 16~ storage tank; 19~ branching section; 22~ cooling section; 26~ cooling temperature sensor; 30~ bypass pipe; 36~ Side common temperature sensor; 4 0~ heating line; 44~ heating valve; 48~ heating flow meter; 51~ output temperature sensor; 6 2~ outflow line. 11~temperature control section; 14~outflow pipeline; 18~pump; 20~cooling pipeline; 24~cooling valve; 28~cooling flowmeter; 34~side general valve; 38~side universal flowmeter; ~ heating section; 46~ heating temperature sensor; 50~ control device; 60~ outflow line; 2238-9394-PF; Ahddub 35

Claims (1)

200842539 十、申請專利範圍: i· 一種溫度控制裝置,藉由使流體循環於配置在被控制 對象方的凋溫部,以將該被控制對象的溫度控制在所欲的溫 度, 其特徵在於包括: 力…、&路,其將該流體加熱並使其循環到該調溫部; 、卻&路,其將該流體冷卻並使其循環到該調溫部·, 旁通i,其使該流體不通過該加熱管路及該冷卻管路, 而循環到該調溫部; 凋節裝置,其調節透過由該加熱管路、該冷卻管路、該 方通官匯流之合流部,而輸出到該調溫部的流體之流量比; 該凋節裝置係設置於該加熱管路、該冷卻管路、該旁通 管的下游處,以及該合流部之上游處。 2· 一種溫度控制裝置,藉由使流體循環於配置在被控制 對象旁的調溫部,以將該被控制對象的溫度控制在所欲的溫 度, J 其特徵在於包括: 加熱管路,其將該流體加熱並使其循環到該調溫部; 、卻^路,其將該流體冷卻並使其循環到該調溫部; 旁通管,其使該流體不通過該加熱管路及該冷卻管路, 而循環到該調溫部; 凋節裝置,其分別調節該加熱管路、該冷卻管路、該旁 通官的下游側之流路面積。 3·如申請專利範圍第丨或2項所述之溫度控制裝置,其 中該旁通管在該加熱管路及該冷卻管路之間係為共用。 36 2238-9394-PF;Ahddub 200842539 4·如申請專利範圍第丨至3項中任一項所述之溫度控制 裝置’其中在該加熱管路和該冷卻管路的上游侧,設有流出 管路’其繞過該調節裝置而使該流體流出。 5 ·如申睛專利範圍第Λ至4項中任一項所述之溫度控制 裝置,其中更包含泵浦,其吸入該調溫部之下游側的流體, 並將其輸出至該加熱管路、該冷卻管路、及該旁通管。200842539 X. Patent application scope: i. A temperature control device for controlling the temperature of the controlled object at a desired temperature by circulating a fluid to a warming portion disposed on the controlled object, characterized by including : a force ..., & the path, which heats the fluid and circulates it to the tempering section; and the & road, which cools the fluid and circulates it to the tempering section, bypassing i, Discharging the fluid to the temperature regulating portion without passing through the heating pipe and the cooling pipe; and adjusting the passage through the heating pipe, the cooling pipe, and the confluence of the side pipe And a flow ratio of the fluid outputted to the temperature regulating portion; the wetting device is disposed at the heating pipe, the cooling pipe, the downstream of the bypass pipe, and the upstream of the merging portion. 2. A temperature control device for controlling a temperature of a controlled object to a desired temperature by circulating a fluid to a temperature regulating portion disposed beside the controlled object, characterized in that: the heating pipe includes Heating the fluid and circulating it to the temperature regulating portion; however, cooling the fluid and circulating it to the temperature regulating portion; a bypass pipe that prevents the fluid from passing through the heating pipe and the The cooling pipe is circulated to the temperature regulating portion; and the wilting device adjusts the flow path area of the heating pipe, the cooling pipe, and the downstream side of the bypass officer, respectively. 3. The temperature control device of claim 2 or 2, wherein the bypass pipe is shared between the heating pipe and the cooling pipe. 36 2238-9394-PF; Ahddub 200842539. The temperature control device according to any one of claims 3 to 3, wherein an outflow pipe is provided on the heating pipe and the upstream side of the cooling pipe The road 'passes the adjustment device to cause the fluid to flow out. The temperature control device according to any one of the preceding claims, further comprising a pump that sucks a fluid on a downstream side of the temperature control portion and outputs the same to the heating pipe The cooling line and the bypass pipe. 6·如申請專利範圍第1至5項中任一項所述之溫度控制 裝置,其中在該加熱管路、該冷卻管路、該旁通管之上游侧 及該調溫部的下游侧設置有用以存放該流體的儲存裝置, 該儲存裝置具有吸收該流體因為溫度而產生之體積變化 的功能。 7.如申請專利範圍第!至6項中任—項所述之溫度控制 裝置’其中更包含操作裝置,其操作該調節裝置,以將該調 溫部旁的流體的溫度控制至目標值。 8.如申請專利範圍第7項所述之溫度控制裝置,其中該 操作裝置,將由檢測該調溫部旁流體之溫度的輸出溫度檢測 裝置所得之檢測值對目標值進行回饋控制。 9.如申咐專利耗圍第8項所述之溫度控制裝置,其中該 調節裝置係為分㈣節該加熱管路、該冷卻㈣、該旁通管 的下游側的流路面積的裝置; 該操作裝置包含韓拖署 & ' /、將依據該檢測值和該目輕 值的差異的量’轉換為該加敎營 …、Β路、該冷部营路、該旁通管 的個別之流路面積操作量。 10·如申請專利範圍第8或 中該操作裝置操作該調節裝置 9項所述之溫度控制裝置,其 在該目標值變化後之特定期 37 2238-9394-PF;Ahddub 200842539 間’不用上述回饋控制,而依據檢測該旁通管溫度之旁通溫 度檢測裝置的檢測值,以開放迴路控制該調溫部旁流體之溫 度。 11.如申請專利範圍第1Q項所述之溫度控制裝置,並中 該調節裝置係為分別調節該加熱管路、該冷卻管路、該旁通 管的下游侧的流路面積的裝置; 該操作裝置’當該目標值變化時,在該旁通管内之流體 的溫度高於該目標值的情況下’操作該旁通管及該冷卻管路 的流路面積’藉此,開放迴路控制該調溫部的溫度至目標值, 在該旁通管内之流體的溫度低於該目標值的情況下,操作該 旁通管及該加熱管路的流路面積,藉此,開放迴路控制該調 溫部的溫度至目標值。 12·如申請專利範圍第7至u項中任—項所述之溫度控 制裝置’其中更包含過渡時目標值較裝置,其在關於該調 溫部之溫度的要求改變的情況下’使該目標值較該要求變化 更大幅度變化。 13. 如申請專利範圍第10至12項中任一項所述之溫度控 制裝置,其中更包含開放迴路控制配合支援裝置,其要求選 取關於該開放迴路控制的增益值、該開放迴路控制的持續時 間、及該開放迴路控制時的目標值之設定中至少一者的複數 個選項中任意一者,並對應於選取的值進行該溫度控制。 14. 如申請專利範圍第7至13項中任一項所述之溫度控 制裝置,其中該調節裝置係為分別調節該加熱管路' 該冷卻 官路、該旁通管的下游側的流路面積的裝置; 該操作裝置,在該調溫部的溫度處於不變狀態的情況 2238-9394-PF;Ahddub 38 200842539 下,禁止由該調節裝置對該加熱管路及該冷卻管路調節之流 尊 路面積為〇。 2238-9394-PF;Ahddub 39The temperature control device according to any one of claims 1 to 5, wherein the heating pipe, the cooling pipe, the upstream side of the bypass pipe, and the downstream side of the temperature regulating portion are disposed There is a storage device for storing the fluid, the storage device having a function of absorbing a volume change of the fluid due to temperature. 7. If you apply for a patent range! The temperature control device of any of the above-mentioned items, further comprising an operating device that operates the adjusting device to control the temperature of the fluid adjacent to the temperature regulating portion to a target value. 8. The temperature control device according to claim 7, wherein the operation device performs feedback control on the target value by the detected value obtained by the output temperature detecting means for detecting the temperature of the fluid adjacent to the temperature regulating portion. 9. The temperature control device according to claim 8, wherein the adjusting device is a device for dividing the heating circuit, the cooling (four), and the flow path area on the downstream side of the bypass pipe; The operating device includes a Korean trailer & ', and converts the amount according to the difference between the detected value and the light value into the camping camp, the road, the cold camp road, and the individual of the bypass pipe The flow area area operation amount. 10. If the operating device operates the temperature control device described in item 8 or in the specific range of the target value 37 2238-9394-PF; Ahddub 200842539 'does not use the above feedback Control, and according to the detection value of the bypass temperature detecting device for detecting the temperature of the bypass pipe, the temperature of the fluid adjacent to the temperature regulating portion is controlled by an open circuit. 11. The temperature control device according to claim 1Q, wherein the adjustment device is a device for separately adjusting a flow path area of the heating pipe, the cooling pipe, and a downstream side of the bypass pipe; When the target value is changed, when the temperature of the fluid in the bypass pipe is higher than the target value, 'operating the bypass pipe and the flow path area of the cooling pipe', the open circuit controls the The temperature of the temperature regulating portion reaches a target value, and when the temperature of the fluid in the bypass pipe is lower than the target value, the flow path area of the bypass pipe and the heating pipe is operated, thereby controlling the adjustment by the open circuit The temperature of the warmth reaches the target value. 12. The temperature control device of any one of clauses 7 to 5, further comprising a transition time target value comparison device, wherein the condition of the temperature of the temperature adjustment portion is changed, The target value changes more dramatically than the required change. The temperature control device according to any one of claims 10 to 12, further comprising an open loop control cooperation support device, which requires selection of a gain value for the open loop control, and a duration of the open loop control Any one of a plurality of options of at least one of a time and a target value at the time of the open loop control, and the temperature control is performed corresponding to the selected value. 14. The temperature control device according to any one of claims 7 to 13, wherein the adjusting device is configured to separately adjust the heating circuit 'the cooling official road, the flow path on the downstream side of the bypass pipe The device of the area; the operating device, in the case where the temperature of the temperature regulating portion is in a constant state, 2238-9394-PF; Ahddub 38 200842539, the flow regulating the heating pipe and the cooling pipe by the adjusting device is prohibited The area of Zun Road is 〇. 2238-9394-PF; Ahddub 39
TW097112159A 2007-04-27 2008-04-03 Temperature control device TWI427450B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007118071A JP4978928B2 (en) 2007-04-27 2007-04-27 Temperature control device

Publications (2)

Publication Number Publication Date
TW200842539A true TW200842539A (en) 2008-11-01
TWI427450B TWI427450B (en) 2014-02-21

Family

ID=40054326

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112159A TWI427450B (en) 2007-04-27 2008-04-03 Temperature control device

Country Status (5)

Country Link
US (1) US20080314564A1 (en)
JP (1) JP4978928B2 (en)
KR (1) KR101327114B1 (en)
CN (1) CN101295186B (en)
TW (1) TWI427450B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113168196A (en) * 2018-12-27 2021-07-23 株式会社Kelk Temperature control device
TWI735124B (en) * 2019-01-10 2021-08-01 日商科理克股份有限公司 Temperature control system and temperature control method

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5172615B2 (en) * 2008-11-12 2013-03-27 Ckd株式会社 Temperature control device
US9109843B1 (en) * 2009-06-29 2015-08-18 Paragon Space Development Corporation Radiator systems
US8714079B2 (en) * 2009-08-18 2014-05-06 Rohde Brothers, Inc. Energy-efficient apparatus for making cheese
JP5519992B2 (en) * 2009-10-14 2014-06-11 東京エレクトロン株式会社 Temperature control system for substrate mounting table and temperature control method thereof
US8612063B2 (en) * 2011-05-02 2013-12-17 Honeywell International, Inc. Temperature control setpoint offset for ram air minimization
KR20130031945A (en) * 2011-09-22 2013-04-01 삼성전자주식회사 Apparatus for controlling temperature of loading chuck and method of controlling temperature
US10274270B2 (en) * 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5912439B2 (en) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 Temperature control system, semiconductor manufacturing apparatus, and temperature control method
US10553463B2 (en) 2011-11-15 2020-02-04 Tokyo Electron Limited Temperature control system, semiconductor manufacturing device, and temperature control method
JP5951384B2 (en) * 2012-07-20 2016-07-13 東京エレクトロン株式会社 Temperature control fluid supply method and storage medium for temperature control system
US9366157B2 (en) 2013-08-08 2016-06-14 General Electric Company Lube oil supply system and method of regulating lube oil temperature
KR102264655B1 (en) 2014-10-14 2021-06-15 삼성디스플레이 주식회사 Display apparatus
JP6361074B2 (en) * 2015-05-13 2018-07-25 三菱重工サーマルシステムズ株式会社 Number control device, energy supply system, number control method and program
JP6570390B2 (en) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 Temperature control apparatus and substrate processing apparatus
JP6639193B2 (en) * 2015-11-06 2020-02-05 伸和コントロールズ株式会社 Temperature control device
JP6684025B2 (en) * 2016-07-14 2020-04-22 株式会社日立ハイテク Automatic analyzer
CN106123636A (en) * 2016-08-05 2016-11-16 江苏新美星包装机械股份有限公司 A kind of sterilized water register
CN106814769B (en) * 2017-03-27 2018-08-10 成都深冷科技有限公司 A kind of high/low temperature cyclic control system and high/low temperature fast control method
US11164759B2 (en) * 2018-05-10 2021-11-02 Micron Technology, Inc. Tools and systems for processing one or more semiconductor devices, and related methods
JP7042158B2 (en) * 2018-05-23 2022-03-25 東京エレクトロン株式会社 Inspection device and temperature control method
CN113227932B (en) * 2018-12-27 2024-01-26 伸和控制工业股份有限公司 Valve unit and temperature control device
JP2021009590A (en) * 2019-07-02 2021-01-28 株式会社Kelk Temperature control system and temperature control method
CN113156806B (en) * 2021-03-18 2024-03-22 广州埃克森生物科技有限公司 Temperature control method, device, equipment and medium based on PID algorithm
CN114200977A (en) * 2021-11-05 2022-03-18 广州国显科技有限公司 Temperature control system and temperature control method applied to display panel
CN114442693B (en) * 2021-12-31 2023-04-07 北京京仪自动化装备技术股份有限公司 Coupling temperature control system and method
CN114442696B (en) * 2022-01-24 2023-05-05 成都市绿色快线环保科技有限公司 Temperature control system and method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3259175A (en) * 1964-06-15 1966-07-05 Robert A Kraus Heating and cooling system for molds
DE1778068B2 (en) * 1968-03-25 1976-05-06 Konus-Kessel Gesellschaft für Wärmetechnik mbH & Co KG, 6832 Hockenheim DEVICE FOR SUCCESSIVE HEATING AND COOLING OF A PROCESSING DEVICE
US4463574A (en) * 1982-03-15 1984-08-07 Honeywell Inc. Optimized selection of dissimilar chillers
JP3298024B2 (en) * 1993-01-05 2002-07-02 株式会社日立製作所 Process control method and process control device
CA2178644A1 (en) * 1994-01-11 1995-07-13 Thomas F. Zurek Apparatus and method for thermal cycling nucleic acid assays
JP3010443B2 (en) * 1998-01-27 2000-02-21 株式会社小松製作所 Temperature control device and temperature control method
US20030037919A1 (en) * 2001-08-17 2003-02-27 Takashi Okada Connected chilling-heating system
US7000691B1 (en) * 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
JP2004158355A (en) * 2002-11-07 2004-06-03 Nissan Motor Co Ltd Cooling device of fuel cell
JP2006080194A (en) * 2004-09-08 2006-03-23 Nikon Corp Temperature controller, exposure device and manufacturing method therefor
JP4602140B2 (en) * 2005-03-30 2010-12-22 日揮株式会社 Temperature control device
US8025097B2 (en) * 2006-05-18 2011-09-27 Centipede Systems, Inc. Method and apparatus for setting and controlling temperature
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113168196A (en) * 2018-12-27 2021-07-23 株式会社Kelk Temperature control device
CN113168196B (en) * 2018-12-27 2023-03-28 株式会社Kelk Temperature control device
TWI735124B (en) * 2019-01-10 2021-08-01 日商科理克股份有限公司 Temperature control system and temperature control method
US11797033B2 (en) 2019-01-10 2023-10-24 Kelk Ltd. Temperature control system and temperature control method

Also Published As

Publication number Publication date
JP2008276439A (en) 2008-11-13
US20080314564A1 (en) 2008-12-25
KR101327114B1 (en) 2013-11-07
CN101295186B (en) 2013-08-28
JP4978928B2 (en) 2012-07-18
KR20080096426A (en) 2008-10-30
CN101295186A (en) 2008-10-29
TWI427450B (en) 2014-02-21

Similar Documents

Publication Publication Date Title
TW200842539A (en) Temperature control device
TWI408524B (en) A temperature control device
EP3106764B1 (en) Hot and cold water mixing device
KR101831804B1 (en) Boiler for heating and hot-water supply and the control method thereof
JP5295985B2 (en) Hot water system
JP5101548B2 (en) Hot water system
JP2007040588A (en) Water heater
JP5312508B2 (en) Automatic water heater
JP2011196569A (en) Hot water supply system
JP5241576B2 (en) Hot water system
JP2009002599A (en) Heat pump type water heater
JP2012078041A (en) Hot-water storage type hot-water supply device
JP6121864B2 (en) Water heater
JP4812682B2 (en) Automatic water heater
JP2012013335A (en) Hot water supply system
JP6757967B2 (en) Hot water supply system
WO2022224690A1 (en) Temperature adjustment device
JP5455958B2 (en) Automatic water heater
JP5928511B2 (en) Water heater
JP5478354B2 (en) Hot water system
JP6475982B2 (en) Hot water system
JP6684581B2 (en) Bath hot water system
JP2005345075A (en) Hot water storage type water heater
JP2003130449A (en) Bath water heater
JP3287701B2 (en) Water heater control device