JP2007157169A - Flow control system of cooling water supply device in semiconductor manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flow control system capable of automatically adjusting flow rate. <P>SOLUTION: This system comprises a branch conduit for supplying cooling water to each semiconductor manufacturing device 51-53; a branch pipe flow control valve; a semiconductor manufacturing device operation part for inputting a setting condition of flow rate of cooling water; a branch pipe flow sensor; a semiconductor manufacturing device instruction processing part including a flow control comparator outputting a signal related to control of the branch pipe flow control valve; an automatic input means 50 automatically inputting a setting condition that is the total sum of supply quantity of cooling water to each semiconductor device; an operation part 32 receiving the setting condition input by the automatic input means 50; a flow control valve 34 provided in a common conduit 16; a flow sensor 26 for detecting the flow rate of cooling water within the common conduit 16; and an instruction processing part 40 including a flow control comparator 36 for comparing a set signal inputted from the operation part 32 with a detection signal by the flow sensor 26 and outputting a signal related to control of the flow control valve 34. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a flow rate control system for a cooling water supply apparatus in a semiconductor manufacturing apparatus, and more specifically, selectively supplies a circulating water to a part or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system. The present invention relates to a flow rate control system for a cooling water supply device in a semiconductor manufacturing apparatus.

  Usually, in a cooling water supply device, in order to supply a predetermined amount of cooling water, the flow rate of the cooling water is measured by a flow meter, and an operator opens and closes the needle valve. As for the opening and closing of the needle valve itself, there are those that can be opened and closed by a remote operation using the power of a servo motor or the like, in addition to the operator turning the knob or the handle.

  In addition, in a cooling water supply apparatus in a semiconductor manufacturing apparatus that selectively supplies cooling water to a part or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system, each semiconductor manufacturing apparatus is generally configured as described above. The flow rate is adjusted. This cooling water supply device includes, for example, a cooling water supply device that selectively supplies cooling water to some or all of a plurality of semiconductor manufacturing devices constituting a predetermined system in a semiconductor device manufacturing factory. This cooling water supply apparatus supplies cooling water from a single cooling water supply source to a plurality of semiconductor manufacturing apparatuses, and can easily be provided with a constant quality (for example, 20 °) anywhere in the factory by line piping. C constant temperature) cooling water can be obtained.

  However, in the cooling water supply apparatus in the conventional semiconductor manufacturing apparatus, the flow rate is adjusted by an operation by an operator, which is troublesome and difficult to cope with the fluctuating required amount of cooling water. There was a problem. In addition, in a semiconductor device manufacturing factory, it has been required to control the flow rate of cooling water with very high accuracy in response to severe temperature control conditions of each processing apparatus. In particular, when some or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system are selectively operated and the required amount of cooling water continuously changes, it is possible to respond promptly to the changing conditions. is necessary. For example, when many processing devices are operated at a time, the supply pressure of the cooling water decreases, so that a predetermined flow rate cannot be flowed. Conversely, when only one of a plurality of processing devices is operated. In this case, since the supply pressure of the cooling water rises, cooling water of a predetermined flow rate or more flows and cools excessively.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a flow rate control system for a cooling water supply apparatus in a semiconductor manufacturing apparatus with good responsiveness, which can appropriately adjust the flow rate, and can cope with the fluctuating required amount of cooling water. There is.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, the present invention relates to a flow rate control system for a cooling water supply apparatus in a semiconductor manufacturing apparatus that selectively supplies circulating water to a part or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system. A common pipe for supplying cooling water to the semiconductor manufacturing apparatus, a branch pipe branched from the common pipe and supplying cooling water to each of the semiconductor manufacturing apparatuses, and provided in each of the branch pipes. A branch pipe flow rate adjusting valve that automatically changes the opening degree in response to a signal from the semiconductor manufacturing apparatus, an operation unit for inputting a flow rate of cooling water supplied to each semiconductor manufacturing apparatus, and the branch pipe flow rate adjusting valve From the branch pipe flow sensor for detecting the flow rate of the cooling water supplied to each semiconductor manufacturing apparatus, the setting signal output from the semiconductor manufacturing apparatus operation unit, and the detection by the branch pipe flow sensor. A command processing unit for a semiconductor manufacturing apparatus provided with a comparator for flow rate adjustment that compares a signal and outputs a signal related to control of the flow rate adjustment valve for the branch pipe, and each semiconductor supplied by the flow rate adjustment valve for the branch pipe An automatic input means for automatically inputting setting conditions that are the total amount of cooling water supplied to the manufacturing apparatus, an operation unit for inputting the setting conditions from the automatic input means, and the common pipe are provided, A flow rate adjusting valve that automatically changes the opening degree according to a signal from the outside, a flow rate sensor that detects the flow rate of cooling water in a common pipe supplied by the flow rate adjusting valve, and a setting signal that is input from the operation unit And a command processing unit including a comparator for flow rate adjustment that outputs a signal related to control of the flow rate adjustment valve.

  According to the present invention, in the cooling water supply apparatus in the semiconductor manufacturing apparatus, the setting signal output from the operation unit is compared with the detection signal from the flow sensor by the flow rate adjustment comparator, and the flow rate adjustment valve is controlled. A signal can be output to automatically adjust the flow rate of the cooling water one by one. Therefore, according to the present invention, it is possible to suitably cope with the fluctuating required amount of cooling water and to effectively control the flow rate of the cooling water with good responsiveness.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
(Basic form)
FIG. 1 is an explanatory view schematically showing a basic form of a flow rate control system of a cooling water supply device. Reference numeral 32 denotes an operation unit, which can input setting conditions for the flow rate of the cooling water to be supplied. The setting conditions input here are converted into electrical signals (setting signals) and output to the comparator 36 described later.

  A flow sensor 26 is provided in the cooling water pipe (common pipe) 16, measures the flow rate of the cooling water supplied to the pipe 16 and flows, and outputs the measurement (detection) result. The detection signal can be suitably obtained as an electric signal such as a current value in a predetermined range, for example.

  Reference numeral 34 denotes a motor valve, which is an example of a flow rate adjusting valve that automatically changes the opening degree according to an external signal. The motor valve 34 has a function of opening and closing by the power of the servo motor 33. For example, the rotational power of the servo motor 33 can be transmitted to the handle of the valve via a speed reducer, and the opening degree can be automatically changed. This is a flow control valve. The flow rate adjusting valve that automatically adjusts the opening degree of the cooling water pipe 16 using a control signal is not limited to the motor valve 34 described above, and other means such as an electromagnetic valve (proportional electromagnetic valve) may be used. Is also possible.

  Reference numeral 40 denotes a command processing unit, which includes a flow rate adjustment comparator 36 that compares a setting signal output from the operation unit 32 with a detection signal from the flow sensor 26 and outputs a signal related to control of the motor valve 34. The opening degree of the motor valve 34 is adjusted.

  By controlling the motor valve 34 by the command processing unit 40 in this way, feedback control is suitably performed based on the electrical signal output from the flow meter (flow sensor 26). When the pressure of the supplied cooling water rises and the flow rate increases from a predetermined set value, the opening degree of the motor valve 34 is lowered, the pressure of the supplied cooling water decreases and the flow rate becomes higher than the predetermined set value. If it also decreases, the opening degree of the motor valve 34 is increased and control is performed so that a predetermined flow rate flows continuously. Thereby, even when the pressure of the cooling water supply source fluctuates, a predetermined flow rate can be suitably supplied. That is, fully automatic remote control is possible, and responsive flow rate control is possible.

(Example)
FIG. 2 is an explanatory view schematically showing a flow rate control system (Example) of a cooling water supply device in a semiconductor device manufacturing factory. The flow rate control system of this embodiment is an embodiment relating to a cooling water supply apparatus that selectively supplies cooling water to a part or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system. The apparatus is a circulation type cooling water supply apparatus that supplies cooling water to circulate and cool the semiconductor device manufacturing apparatus.

  Reference numeral 32 denotes an operation unit which can input setting conditions for the total flow rate of cooling water supplied to a predetermined system. A flow sensor 26 detects a total flow rate of the cooling water supplied to a predetermined system. Reference numeral 34 denotes a motor valve, which is an example of a flow rate adjusting valve that automatically changes the opening degree according to an external signal. Reference numeral 40 denotes a command processing unit, which compares a setting signal output from the operation unit 32 with a detection signal from the flow sensor 26 and outputs a flow rate adjusting comparator 36 that outputs a signal related to control of the motor valve 34. I have.

  Reference numeral 50 denotes an automatic input unit that automatically inputs setting conditions to the operation unit 32. In this embodiment, whether or not the cooling water is supplied to some or all of the plurality of semiconductor device manufacturing apparatuses 51, 52, and 53 constituting a predetermined system is determined according to the on-off valves 51a and 52a corresponding to the respective manufacturing apparatuses. , 53a is detected, and the setting condition is automatically input to the operation unit 32. With this automatic input means 50, the total flow rate of the cooling water supplied to the plurality of semiconductor manufacturing apparatuses 51, 52, 53 constituting the predetermined system can be automatically and suitably managed with good responsiveness.

  Further, the pipe line 16 of this embodiment is connected to a pump (not shown), and is formed in a circulation flow path so as to collect and circulate the cooling water flowing out from the plurality of semiconductor device manufacturing apparatuses 51, 52, 53. Has been. Further, the temperature of the cooling water is kept constant by temperature adjusting means (not shown). The temperature adjusting means can be composed of a known cooling device and / or heating device. Since the cooling water is circulated, it can be used efficiently. Thus, in the system for supplying cooling water in the semiconductor device manufacturing factory of the embodiment, since it is a circulation system and the capacity of the pump is limited, a water source with a stable supply pressure such as tap water is used. Unlike the case, the pressure fluctuation of the supply water source is large. On the other hand, according to the flow rate control system of the present invention, it is possible to flow a predetermined flow rate regardless of fluctuations in the pressure of the supply water source, and the problem can be solved preferably.

  Reference numeral 30 denotes a flow rate control means, which includes an operation unit 32 for inputting setting conditions for the flow rate of the cooling water, a motor valve 34 that opens and closes by the power of the motor 33, and an automatic operation for automatically inputting setting conditions to the operation unit 32 An input unit 50 and a flow rate adjustment comparator 36 that compares a setting signal from the operation unit 32 with a detection signal from the flow rate sensor 26 and outputs a signal relating to a flow rate parameter (a signal relating to control of the motor valve 34). It has.

  In addition, a command processing unit 40 that is a feedback control system is configured by the configuration including the comparator 36 for flow rate adjustment. The detection or input signal from the flow sensor 26 and the automatic input means 50 is, for example, appropriately converted into a current value within a predetermined range and processed by an arithmetic device or the like (not shown) to control the motor valve 34. It is output as a control signal having a current value in a predetermined range. The instruction processing unit 40 can be configured by a known circuit and performs sequence control. In addition to the simple sequence control, the flow rate control means 30 may of course be controlled with the condition set empirically by the command processing unit 40 operated by a program. The conditioning includes, for example, the value of heat capacity calculated by the product of the flow rate and the temperature difference, or factors over time, and more accurate temperature management can be performed by performing arithmetic processing based on these factors and controlling them. It becomes possible. In other words, so-called PID control (proportional, integral, and differential operations can be combined), fuzzy control, and the like may be performed.

  According to the present embodiment, the flow rate parameter is continuously monitored by the flow rate sensor 26, and the flow rate control of the cooling water is performed based on the detection data as described above. Accordingly, the temperature of the semiconductor device manufacturing apparatus can be controlled in a timely and responsive manner. For example, the semiconductor device can be processed and manufactured under uniform conditions while maintaining the temperature constant. That is, the temperature control of the manufacturing apparatus of each semiconductor device can be performed with high accuracy, and as a result, the processing accuracy when manufacturing the semiconductor device can be improved.

It goes without saying that the flow rate control system of the cooling water supply device in the semiconductor manufacturing apparatus according to the present invention may use both the basic mode and the flow rate control system according to the embodiment. For example, it is needless to say that the flow rate control system of the cooling water supply device according to the basic mode can be used for the control of each opening / closing of the opening / closing valves 51a, 52a, 53a of the embodiment. The preferred embodiments of the present invention have been described above in various ways. However, the present invention is not limited to these embodiments, and it goes without saying that more modifications can be made without departing from the spirit of the invention. That is.
According to the present invention, in the cooling water supply apparatus in the semiconductor manufacturing apparatus, the setting signal output from the operation unit is compared with the detection signal from the flow sensor by the flow rate adjustment comparator, and the flow rate adjustment valve is controlled. A signal can be output to automatically adjust the flow rate of the cooling water one by one. Therefore, according to the present invention, it is possible to suitably cope with the fluctuating required amount of cooling water and to effectively control the flow rate of the cooling water with good responsiveness.

It is explanatory drawing explaining the basic form of the flow control system of a cooling water supply apparatus. It is explanatory drawing explaining the Example of the flow control system of the cooling water supply apparatus in the semiconductor manufacturing apparatus concerning this invention.

Explanation of symbols

16 Pipe line 26 Flow rate sensor 30 Flow rate control means 32 Operation part 34 Motor valve 36 Comparator for flow rate adjustment 40 Command processing part 50 Automatic input means

Claims (1)

In a flow rate control system for a cooling water supply apparatus in a semiconductor manufacturing apparatus that selectively supplies circulating water to a part or all of a plurality of semiconductor manufacturing apparatuses constituting a predetermined system,
A common pipe for supplying cooling water to the plurality of semiconductor manufacturing apparatuses;
A branch pipe branched from the common pipe and supplying cooling water to each semiconductor manufacturing apparatus;
A branch pipe flow rate adjusting valve that is provided in each of the branch pipes and automatically changes the opening degree according to an external signal;
A semiconductor manufacturing apparatus operation unit for inputting a setting condition of a flow rate of cooling water supplied to each of the semiconductor manufacturing apparatuses;
A branch pipe flow sensor for detecting the flow rate of cooling water supplied from the branch pipe flow control valve to each semiconductor manufacturing apparatus;
Comparing a setting signal output from the semiconductor manufacturing apparatus operation unit with a detection signal from the branch pipe flow sensor, and a flow rate adjustment comparator for outputting a signal related to the control of the branch pipe flow control valve. An instruction processing unit for semiconductor manufacturing equipment;
Automatic input means for automatically inputting setting conditions that are the sum of the amount of cooling water supplied to each semiconductor manufacturing apparatus supplied by the branch pipe flow control valve;
An operation unit for inputting the setting condition from the automatic input means;
A flow rate adjusting valve that is provided in the common pipe and automatically changes the opening according to an external signal;
A flow rate sensor for detecting a flow rate of cooling water in the common pipe supplied by the flow rate regulating valve;
A command processing unit including a flow rate adjustment comparator that compares a setting signal input from the operation unit with a detection signal from the flow rate sensor and outputs a signal related to control of the flow rate adjustment valve; A flow rate control system for a cooling water supply device in a semiconductor manufacturing apparatus.

Images