TWI426273B - Probe and probe support construction - Google Patents

Description

Probe and probe support structure

The present invention relates to a probe used for electrical property inspection of an IC chip or a circuit on a substrate.

With the miniaturization and miniaturization of the semiconductor device, the arrangement pitch of the input and output terminals has been reduced as much as possible, and the probe has been narrowed in accordance with the narrowing of the arrangement pitch of the input and output terminals.

In view of the above probes,

(1) A conductive needle is inserted through a gap in a center of an outer conductor formed in a cylindrical shape, and a spacer made of an insulating material is placed at an appropriate portion in the axial direction of the outer conductor, and the spacer is inserted through the spacer. A constructor that supports a conductive needle (for example, refer to Patent Document 1), or

(2) A gap between the conductive needle and the external conductor is filled with an insulator made of a foamed resin material.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-257849

In recent years, the narrowing of the arrangement pitch of the input and output terminals of the semiconductor device has increased the demand for the diameter of the probe. Although the diameter reduction has progressed to about 0.3 mm, it is preferable to further reduce the diameter.

Moreover, in order to ensure the desired high frequency characteristics, it is also required to increase the dielectric constant of the insulator in the probe.

Moreover, since the probe is such that the front end (inspection end) of the conductive pin is pressed against the inspection object at a predetermined pressure, it is preferable to sufficiently ensure the drawing strength of the conductive body in the axial direction of the insulator so that the conductive is not for the insulator. The sliding force is displaced in the axial direction due to the pressing force.

In response to such a request, according to the above-described conventional structure (1), since a gap as an air insulating layer is formed between the conductive pin and the outer conductor surrounding the hole, a certain degree of dielectric constant can be obtained, but The air insulating layer formed by the gap is cut off by the spacer disposed at an appropriate portion in the axial direction, so that the boundary between the gap and the spacer becomes a main cause of high frequency reflection, and it is difficult to use a high frequency of several GHz or more. region.

Further, according to the above-described conventional structure (1), in order to form the air insulating layer, the spacer is disposed in a structure of an appropriate portion in the axial direction, and the support length penetrates the axial direction of the conductive needle supported by the spacer, The length of the conductive needle is shortened, and it is difficult to reduce the diameter of the probe, and the dielectric constant of the insulator is increased and the drawing strength in the axial direction of the conductive needle is sufficiently enhanced.

Further, in the above-described conventional structure (2), in order to increase the dielectric constant of the insulator, it is necessary to increase the expansion ratio or increase the diameter of the insulator, but the current foamed insulator does not ensure the desired strength (conductivity). The pull strength of the needle) increases the foaming rate to more than 50%, and only increases the diameter of the insulator to ensure the desired high frequency characteristics. However, the thinning of the probe in this way becomes difficult.

Further, in the above conventional structure (2), although the insulator has been in contact with the conductive needle in the axial direction, since the insulating system is formed by extrusion molding, the degree of adhesion of the insulator to the outer circumference of the conductive needle is low, and It is difficult to sufficiently increase the drawing strength of the conductive needle.

Further, in the above conventional structure (2), in order to increase the dielectric constant of the insulator, it is necessary to increase the expansion ratio or increase the diameter of the insulator. However, if the expansion ratio of the insulator is increased, the degree of adhesion between the insulator and the conductive needle is lowered, and it is difficult to secure the desired drawing strength. Further, increasing the diameter of the insulator, as described above, prevents the diameter of the probe from being reduced.

The present invention is constructed in view of the above points, and the main purpose is to:

‧Provides a probe that can be used in higher frequency regions and has the additional purpose of:

‧Providing a probe that can be used for thinning and high frequency regions

‧ Fully ensure the drawing strength of the conductive needle.

In order to achieve the above object, a probe according to the present invention includes: a conductive pin; an insulator disposed around the conductive pin; and an outer conductor disposed concentrically with the conductive pin on an outer circumference of the insulator; the insulator is disposed through the insulator A through hole in the axial direction of the conductive needle.

According to this configuration, since the air insulating layer formed by the gap is continuous in the axial direction, good signal reception without reflection can be performed even in a high frequency region of several GHz or more. Further, a gap that penetrates the axial direction and forms an air insulating layer may be used as a path of the light beam.

Further, in the present invention, it is preferable that the through holes are provided in a plurality of portions around the conductive needle. In this way, a gap that penetrates the axial direction and forms an air insulating layer can be utilized as a path of the light beam, and any one of the plurality of through holes can be utilized for the incident path of the light beam, and the other through holes can be utilized for the return path of the reflected light beam. To perform position detection of the line portion where the probe is in contact with conduction.

Further, it is preferable that a plurality of the through holes are disposed at positions which are point symmetrical with respect to the axis of the conductive needle. In this way, the incident path of the light beam and the return path of the reflected light beam can be positioned at a diagonal position with respect to the conductive needle, and the position detection of the target portion where the front end of the conductive pin is in contact with conduction can be performed with high precision. Further, by making the air insulating layer point-symmetrical with respect to the axis of the conductive needle, the insulation of the outer circumference of the conductive needle is well balanced and the electrical characteristics are excellent.

Further, in the present invention, it is preferable that the conductive needle is made of a tungsten material containing a tungsten alloy. Thus, the strength and durability of the conductive needle can be improved, and the diameter of the probe can be reduced.

Further, in the present invention, the porosity of the insulator is preferably 60% or more. In this way, the ratio of the pores in the gap between the conductive needle and the outer conductor can be sufficiently increased to increase the dielectric constant of the insulator, and the desired high frequency characteristics can be ensured while the probe is sufficiently thinned.

Further, in the invention, it is preferable that the insulator includes an inner layer body provided to cover the outer peripheral surface of the conductive needle, an outer layer body provided to cover an inner peripheral surface of the outer conductor, and a plurality of radial ribs. The inner layer body radially protrudes outward in the radial direction, and is coupled to the inner peripheral side of the outer layer body. The radial rib portion is continuously provided in the longitudinal direction of the conductive needle.

In this way, since the air insulating layer formed by the gap is continuous in the longitudinal direction of the conductive pin, good signal reception without reflection can be performed even in a high frequency region of several GHz or more. Further, the ratio of the voids in the gap between the conductive needle and the outer conductor can be sufficiently increased to increase the dielectric constant of the insulator, and the desired high frequency characteristics can be ensured while the probe is sufficiently reduced in diameter.

Further, in the invention, it is preferable that a spirally wound tape layer is disposed as an insulating sheath on the outer peripheral surface of the outer conductor, and the wound layer is formed by winding at a half overlap.

Thus, by forming the insulating sheath of the probe by the 1/2 overlap wound winding layer, the insulator is tightly wound from the outer circumference and firmly adhered to the conductive needle to improve the drawing strength of the conductive needle.

Further, since the insulating sheath of the probe is formed by a 1/2 overlap wound winding layer, the insulating system is tightly wound from the outer periphery and firmly adheres to the conductive needle, thereby improving the drawing strength of the conductive needle.

Further, the insulating sheath of the probe is formed by winding a 1/2 overlap winding to wind up a two-layer tape layer, thereby improving the overall bending strength of the probe, and pressing the inspection at the inspection end of the conductive needle. When the object is used, the probe is largely bent and deformed by the pressing force to prevent insufficient contact pressure to the inspection object.

Further, the outer peripheral surface of the winding layer constituting the outer peripheral surface of the probe is formed by 1/2 overlap winding to form a smooth surface having no winding step. Therefore, when the base of the probe is fixedly supported by the fixing plate, and the inspection end side of the probe is slidably supported by the sliding plate so as to be close to the inspection object, the pressing force against the inspection object can be made. The bent and deformed probe smoothly slides the slide plate with less resistance, and the inspection end of the conductive needle can be pressed against the inspection object with a suitable contact pressure by the bending and restoring force of the probe.

Further, it is preferable that a plurality of wires are spirally wound to form the outer conductor, and the spiral winding direction of the tape layer is opposite to the spiral winding direction of the wire. In this way, the winding of the wire can be loosened and the winding of the tape layer can be prevented from being mutually prevented, and the bending strength of the probe can be highly maintained.

Further, it is preferable that a heat-fusible layer is provided on the back surface of the tape layer. In this manner, the tape winding layer can be wound around the outer conductor with a high adhesion by superimposing the heating after the winding of the tape layer or the overlapping winding process of heating, thereby improving the tightness effect of the probe. The increase in bending strength is more effective.

Further, in the present invention, the winding structure of the winding layer which is expressed by 1/2 overlap winding means that the tape layers adjacent to each other by winding are layered with each other by a 1/2 tape width. The structure of the winding tape layer.

The probe supporting structure of the present invention is a supporting probe, which is characterized in that the base end side of the probe is fixedly supported on the fixing plate, so that the inspection end side of the probe is slidably supported by the sliding plate to be fixed. The fixing plate and the sliding plate are spaced apart from the inspection object so that the inspection end of the probe is pressed against the inspection object.

According to this configuration, since the outer peripheral surface of the winding layer constituting the outer peripheral surface of the probe is formed by 1/2 overlap winding to form a smooth surface having no winding step, the lower portion of the probe is slidably displaced upward with respect to the slider. At the time of penetration with the slide plate, the lower portion of the probe can smoothly slide and slide with less resistance.

Further, the insulating sheath of the probe is formed by winding a layer of two layers wound by 1/2 overlap winding, thereby increasing the bending strength of the entire probe, and pressing the inspection at the inspection end of the conductive needle. When the object is used, it is possible to avoid a large bending deformation due to the pressing force.

In this way, according to the probe of the present invention, it is possible to perform inspection with stable characteristics in a relatively high frequency region where the conventional inspection is difficult.

Further, it is possible to reduce the diameter and perform inspection in a stable high-frequency region in a high-frequency region where the conventional inspection is difficult.

Further, it is possible to obtain a probe which can sufficiently ensure the drawing strength of the conductive needle, and can also be used in a high-frequency region while reducing the diameter.

(First embodiment)

Fig. 1 is a view showing the appearance of a probe 1A according to a first embodiment of the present invention, and Fig. 2 is a cross-sectional view thereof. The probe 1A includes a conductive pin 2A, an insulator 3A whose center is inserted through the conductive pin 2A, an outer conductor 4A that is provided around the outer periphery of the insulator 3A coaxially with the conductive pin 2A, and an insulating sheath 5A that covers the outer periphery of the outer conductor 4A. The probe 1A is formed in an extremely thin line shape having a length of about 20 mm in the axial direction and an outer diameter of about 0.3 mm. The conductive needle 2A is formed of a tungsten wire having a diameter of about 0.1 mm. In this example, the lower end of the detecting end is formed to be flat. The outer conductor 4A winds 20 pieces of tin-plated copper alloy thin wires having a diameter of 0.03 mm into a spiral shape. The insulator 3A is made of an insulating resin material such as PFA (tetrafluoroethylene, perfluoroalkyl vinyl ether copolymer), and is connected to the inner layer body 3Aa and the coil for inserting the conductive needle 2A by the radial rib 3Ac. The outer conductor 4A outer layer body 3Ab has a cross-sectional shape formed in a honeycomb shape. In this example, the six through holes 6A having a fan-shaped cross-sectional shape surrounded by the inner layer body 3Aa, the outer layer body 3Ab, and the radial rib portion 3Ac are point-symmetric with respect to the axis of the conductive needle 2A. They are arranged at equal intervals in the circumferential direction, and each of the through holes 6A penetrates through the center of the conductive needle shaft It is open to the lower end of the insulator 3A. The insulating sheath 5A is formed by winding a PET (polyethylene terephthalate) tape having a thickness of 0.008 mm.

The probe 1A is configured as described above, and as shown in FIG. 4, the distal end of each of the conductive pins 2A connected to the probe 1A of one of the inspection devices 8 is electrically connected to the terminal of the IC wafer 10 mounted on the substrate 9. Or a predetermined line portion of the substrate 9, and a high frequency inspection signal is applied to the two probes 1A to perform characteristic inspection of the circuit.

At this time, since the air insulating layer formed by the through hole 6A is continuous in the axial direction, good signal reception without reflection can be performed even in a high frequency region of several GHz or more. Further, the conductive needle 2A is supported by the inner layer body 3Aa of the insulator 3A over substantially the entire length thereof, thereby increasing the drawing strength of the conductive needle 2A.

Further, as shown in FIG. 5, the illumination light source 100 provided at the upper end of any of the through holes 6A of the insulator 3A of the probe 1A is incident on the inspection light such as a laser beam to be irradiated toward the inspection target portion, and is reflected. The other through hole 7A located at a point symmetry with the incident through hole 7A is guided to the light receiver 101, and the metal portion (terminal or circuit pattern portion) of the inspection target portion is detected from the change in the reflected light. Position to utilize the positioning control of the probe 1A.

Hereinafter, the results of comparing the characteristics of the structure of the first embodiment with the conventional structure (including the foamed insulator) will be described below. In general, the degree of foaming of a conventional structure using a foamed insulator and the porosity of the structure of the first embodiment (foaming degree = porosity) are: structure of the first embodiment: 60% min

Conventional construction: 50% min

Therefore, the outer diameters of the probes of the first embodiment (porosity: 60%) and the conventional structures (foaming degree: 50%) of the conductive needles having the same diameter were compared.

In the structure of the first embodiment,

Outer diameter: do1

Conductive needle diameter: di

Void: A1

Porosity: 0.6

Porosity = A1/[π/4×(do1 ² -di ² )]

Therefore, if the substitution porosity = 0.6, it becomes

0.6=A1/[π/4×(do1 ² -di ² )]

On the other hand, in the conventional structure,

Outer diameter: do2

Conductive needle diameter: di

Void: A2

Foaming degree: 0.5

At the time, the degree of foaming = A2 / [π / 4 × (do2 ^{2 -} di ² )]

Therefore, if the substitution porosity = 0.5, it becomes

0.5 = A2 / [π / 4 × (do2 ^{2 -} di ² )].

Further, the term "void" as used herein refers to the total of the area of the pores perpendicular to one of the axes.

In order to make the electrical characteristics of the probe 1A of the first embodiment equivalent to the electrical characteristics of the conventional structure, it is necessary to make the gap A1 of the structure of the first embodiment the same as the gap A2 of the conventional structure (A1=A2).

therefore,

0.6×π/4×(do1 ² -di ² )=0.5×π/4×(do2 ² -di ² )

If the formula is deformed, it becomes

Do2=√[(0.6/0.5)×do1 ² -(0.1/0.5)×di ² ].

Hereinafter, the conductive needle diameter di is assumed to be 0.1 mm, and the outermost diameter do1 of the probe 1A is 0.2 mm. at this time,

Do2=√[(0.6/0.5)×0.2 ² -(0.1/0.5)×0.1 ² ]=0.214.

Therefore, do2:do1=0.214:0.2=1.07:1.0.

That is, in order to obtain the same electrical characteristics, it is necessary to have an outer diameter of 1.07 times the structure of the first embodiment in the conventional structure.

However, in the above description, the outermost diameter of the conventional structure having the maximum degree of foaming (50%) is compared with the outermost diameter of the probe 1A of the first embodiment having the smallest porosity (60%). However, the degree of foaming of the insulator generally used in the conventional structure is 48%, and in the present embodiment, it is predicted that the porosity of the insulator 3A generally used is 61%. When the general configuration is compared with the above calculation formula, it is do2:do1=1.1:1.0, and in order to obtain the same electrical characteristics, it is necessary to have an outer diameter of 1.1 times the structure of the first embodiment in the conventional structure.

(Modification of the first embodiment)

The first embodiment can also be implemented in the following aspects.

(1) The shape of the front end of the conductive needle 2A can be arbitrarily set to a tapered shape of the conductive needle 2A as shown in Fig. 6A, in addition to the shape of the flat shape as described in the first embodiment. ', or the hook-shaped conductive needle 2A'' shown in Fig. 6B or the like.

(2) A gold-plated tungsten wire may be used as the conductive pin 2A is required.

(3) The copper alloy ribbon may also be wound to form the outer conductor 4A.

(4) The number of the through holes 6A is not limited to the number described in the first embodiment, and may be an even number of four or eight, or an odd number of five or seven.

(5) The cross section of the through hole 6A may be formed into a circular shape or a polygonal shape.

(6) In the above description of the first embodiment, the radial ribs 3Ac are formed in a straight line parallel to the axis of the conductive needle 2A, but may be continuous and gentle in the longitudinal direction of the conductive needle 2A. shape.

(Second embodiment)

Hereinafter, several second embodiments of the present invention will be described based on the drawings. 7 to 10 are views showing a probe 1B according to a second embodiment of the present invention, and Fig. 7 is an external perspective view of the probe 1B, Fig. 8 is a longitudinal sectional front view, and Fig. 9 is an enlarged front view of a main part thereof, Fig. 10 It is a cross-sectional top view.

The probe 1B includes a conductive pin 2B, an insulator 3B that is inserted through the conductive pin 2B at the center, an outer conductor 4B that is disposed around the outer periphery of the insulator 3B coaxially with the conductive pin 2B, and an outer sheath that covers the outer periphery of the outer conductor 4B and serves as an insulating sheath. The tape winding layer 5B is formed in an extremely thin line shape having a length of about 20 mm in the axial direction and an outer diameter of 0.3 mm or less.

The conductive needle 2B is formed of a tungsten wire having a diameter of about 0.1 mm made of tungsten or a tungsten alloy. In this example, the lower end of the detecting end is formed flat. The outer conductor 4B is formed by winding and winding a wire 4Ba composed of 20 pieces of tin-plated copper alloy thin wires having a diameter of 0.03 mm.

The insulator 3B is a foamed material composed of a resin material such as PFA (tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer) or FEP (tetrafluoroethylene/hexafluoropropylene copolymer) and having a foaming ratio of several tens%. It is formed by extrusion molding.

As the tape layer 5B of the insulating sheath, a PET tape having a thickness of 0.004 mm is spirally wound with a 1/2 of the tape width w (refer to FIG. 9) and a spiral of the conductor 4Ba forming the outer conductor 4C. It is formed by spiral winding (1/2 overlap winding) in the opposite direction. In this way, the outer peripheral surface of the 1/2 overlap-wound web layer 5B is a smooth surface having no winding step difference. Further, the heat-fusible layer 20 is formed on the back surface (inner surface) of the tape layer 5B, and the tape winding layer 5B has a high adhesion by the heating after the winding process or the overlapping winding process while heating. It is wound around the outer conductor 4B.

Further, as shown in Fig. 9 and the like, in the present invention, the winding structure of the winding layer 5B in which the 1/2 overlap winding is expressed means that the tape layer 5B adjacent to each other by winding is 1/2. A structure in which the belt widths are laminated to each other and the winding layer 5B is wound. Therefore, in the wound tape layer 5B after winding, the tape thickness of all the cross-sections is twice as large as the thickness of the original tape, and the surface of the tape is a smooth surface having no step.

The probe 1B of the second embodiment is configured as described above, and as shown in FIG. 4, the distal end of each of the conductive pins 2B connected to the probe 1B of one of the inspection devices 8 is electrically connected to the substrate 9 The input/output terminal of the IC chip 10 or the predetermined line portion of the substrate 9 is applied to the two probes 1B to perform characteristic inspection of the circuit.

11A and 11B show the support structure of the probe 1B when the above-described characteristic inspection is performed. At this time, the probe 1B is held in a vertical posture, and the support plate 11 and the lower slide plate 12 which are covered by the upper support are penetrated, and the base end side of the upper portion of the probe 1B is inserted and fixed to the fixed plate 11 and the probe 1B is The lower inspection end side is slidably supported by the slide plate 12 so as to be slidable up and down.

The fixing plate 11 and the slide plate 12 which support the probe 1B in the vertical posture are integrally lifted and lowered in a state in which the upper and lower intervals are fixed, and the supported probe 1B is moved toward and away from the inspection object S.

The fixed plate 11 and the slide plate 12 that are integrally lifted and lowered are brought into contact with the inspection object S by a predetermined amount after the lower end (inspection end) of the conductive needle 2B of the probe 1B contacts the inspection object S. At this time, as shown in FIG. 11B, the pressing force applied to the inspection object S is applied upward to the probe 1B, and the lower portion of the probe 1B is slidably displaced upward relative to the slider 12 by the pressing force. The needle 1B is elastically bent and deformed between the fixed plate 11 and the slide plate 12, and the lower end (inspection end) of the conductive needle 2B is pressed against the inspection object S with a predetermined contact pressure by the elastic restoring force.

Here, since the outer peripheral surface of the probe 1B, that is, the outer peripheral surface of the take-up layer 5B is a smooth surface having no winding step difference, when the lower portion of the probe 1B is slidably displaced upward relative to the slider 12 as described above, In the penetration portion with the slide plate 12, the lower portion of the probe 1B can smoothly slide and slide with less resistance.

Further, since the insulating sheath of the probe 1B is constituted by the winding layer 5B which is wound by 1/2 overlap, the insulator 3B is tightly wound from the outer periphery and is firmly adhered to the conductive needle 2B to improve the conductive needle 2B. Pull strength. Further, the insulating sheath of the probe 1B is formed by winding 1/2 overlap winding to wind up the two-layered tape layer 5B, thereby improving the overall bending strength of the probe 1B, as described above in the conductive pin 2B. When the lower end (inspection end) is pressed against the inspection target S, the pressing force is largely bent and deformed, so that the contact pressure with respect to the inspection target S is prevented from being lowered in advance.

(Third embodiment)

12 to 14 are views showing a probe 1C according to a third embodiment of the present invention, and Fig. 12 is an external perspective view of the probe 1C, Fig. 13 is a longitudinal sectional front view, and Fig. 14 is a cross-sectional plan view thereof.

The probe 1C of the present embodiment includes a conductive pin 2C, an insulator 3C in which the conductive pin 2C is inserted in the center, an outer conductor 4C that is disposed around the outer periphery of the insulator 3C coaxially with the conductive pin 2C, and a periphery for covering the outer conductor 4C. The tape winding layer 5C of the insulating sheath and the structure other than the insulator 3C are the same as those of the second embodiment.

The insulator 3C of the present embodiment is made of a resin material such as PFA (tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer), and is formed to have an inner layer body 3Ca provided to cover the outer peripheral surface of the conductive needle 2C, and to cover The outer layer body 3Cb provided on the inner peripheral surface of the outer conductor 4C and the honeycomb structure in which the inner layer body 3Ca radially protrudes outward in the radial direction and are connected to the plurality of radial ribs 3Cc on the inner peripheral side of the outer layer body 3Cb. Further, the six through holes 6C having a fan-shaped cross-sectional shape surrounded by the inner layer body 3Ca, the outer layer body 3Cb, and the radial rib portion 3Cc are formed at equal intervals in the circumferential direction, and each of the through holes 6C is penetrated through the conductive The needle axial direction is open at the lower end of the insulator 3C, and the porosity of the insulator 3C is 60% or more.

According to this insulator structure, since the air insulating layer formed by the through hole 6C is continuous in the axial direction, good signal reception can be performed even in a high frequency region of several GHz or more.

Further, the conductive needle 2C is supported by the inner layer body 3Ca of the insulator 3C over substantially the entire length thereof, and the insulator 3C is wound into two layers from the outer circumference by the winding layer 5C, whereby the conductive needle 2C is firmly adhered to the insulator 3C. To increase the drawing strength of the conductive needle 2C.

The drawing strength of the structure of the present embodiment including the winding layer 5C and the drawing strength of the conventional structure (the insulating sheath not including the winding layer 5C) were measured as follows. That is, the pull strength of the conventional structure is 1.04N. On the other hand, the drawing strength of the structure of this embodiment is 1.93N. It can also be seen from the measurement results that the drawing strength can be improved by adopting the configuration of the embodiment. Further, in the above measurement, the drawing strength of the two structures (conductive needles) having a length of 20.0 mm was also measured.

[Modification of Second and Third Embodiments]

These embodiments can also be implemented in the following forms.

(1) The shape of the distal end portion for the inspection of the conductive needles 2B and 2C is not limited to the shape that is cut into a flat shape as described above, and the distal end portion may be arbitrarily set to a tapered shape or a shape corresponding to the object to be inspected. The front end portion is bent into a hook shape or the like.

(2) A tungsten-plated tungsten wire may be used as the conductive pin 2B, 2C.

(3) The copper alloy strip may also be wound to form the outer conductors 4B, 4C.

(4) The number of the through holes 6B, 6C formed in the insulators 3B, 3C is not limited to the number of the above-described configurations, and may be an odd number of four or eight, or an odd number of five or seven.

1A‧‧‧Probe

2A‧‧‧conductive needle

3A‧‧‧Insulator

4A‧‧‧External conductor

6A‧‧‧through hole

1B‧‧‧Probe

2B‧‧‧conductive needle

3B‧‧‧Insulator

4B‧‧‧External conductor

5B‧‧‧ tape layer

1C‧‧‧ probe

2C‧‧‧conductive needle

3C‧‧‧Insulator

3Ca‧‧‧ inner layer

3Cb‧‧‧Outer body

3Cc‧‧‧radial ribs

4C‧‧‧External conductor

5C‧‧‧ tape layer

Fig. 1 is an external perspective view of a probe according to a first embodiment of the present invention.

Fig. 2 is a longitudinal sectional front view of the probe of the first embodiment.

Fig. 3 is a cross-sectional view showing the probe of the first embodiment.

Fig. 4 is a schematic block diagram showing a form of use of each embodiment of the present invention.

Fig. 5 is a schematic view showing a position detection mode according to each embodiment of the present invention.

Fig. 6A is a longitudinal sectional front view showing a main part of a modification in which the shape of the tip end of the conductive needle is different.

Fig. 6B is a longitudinal sectional front view showing a main part of a modification in which the shape of the tip end of the conductive needle is different.

Fig. 7 is a perspective view showing the appearance of a probe according to a second embodiment of the present invention.

Fig. 8 is a longitudinal sectional front view of the probe of the second embodiment.

Fig. 9 is a front elevational view showing an enlarged portion of a probe of the second embodiment.

Fig. 10 is a cross-sectional plan view of the probe of the second embodiment.

Fig. 11A is a schematic front view showing a first state of a support structure of a probe according to a second embodiment.

Fig. 11B is a schematic front view showing a second state of the support structure of the probe according to the second embodiment.

Fig. 12 is a perspective view showing the appearance of a probe according to a third embodiment of the present invention.

Fig. 13 is a longitudinal sectional front view of the probe of the third embodiment.

Figure 14 is a cross-sectional plan view of the probe of the third embodiment.

1A. . . Probe

2A. . . Conductive needle

3A. . . Insulator

4A. . . External conductor

5A. . . Insulating skin

6A. . . Through hole

Claims (11)

A probe comprising: a conductive pin; an insulator disposed around the conductive pin; and an outer conductor disposed coaxially with the conductive pin on an outer circumference of the insulator; wherein the insulator is provided through the axis of the conductive pin Hole; the porosity of the insulator is above 60%. The probe of claim 1, wherein the through hole is disposed at a plurality of locations around the conductive pin. The probe of claim 2, wherein the plurality of through holes are disposed at a point symmetry with respect to an axis of the conductive pin. The probe of claim 1, wherein the conductive needle is made of a tungsten material containing a tungsten alloy. The probe according to claim 1, wherein the insulator comprises: an inner layer body provided to cover the outer peripheral surface of the conductive needle; an outer layer body provided to cover an inner peripheral surface of the outer conductor; and a plurality of radiation The rib portion radially protrudes outward from the inner layer body in the radial direction, and is coupled to the inner peripheral side of the outer layer body, and the radial rib portion is continuously provided in the longitudinal direction of the conductive needle. The probe according to claim 1, wherein the spirally wound tape layer is disposed as an insulating sheath on the outer peripheral surface of the outer conductor, and the tape layer is formed by 1/2 overlap winding. For example, the probe of the sixth application patent scope, in which the spiral winding is more A plurality of wires are formed to form the outer conductor, and the spiral winding direction of the tape layer is opposite to the spiral winding direction of the wire. A probe according to claim 6 wherein a heat-fusible layer is provided on the back side of the tape layer. A probe supporting structure for supporting the probe of claim 6 is characterized in that: the base end side of the probe is fixedly supported on the fixing plate, so that the inspection end side of the probe is slidably supported through The sliding plate causes the fixed plate and the sliding plate to be close to the inspection object so that the inspection end of the probe contacts the inspection object. A probe comprising: a conductive pin; an outer conductor disposed coaxially with the conductive pin through a gap; and an insulator disposed in the gap; the insulator having: an inner layer body covering the outer circumference of the conductive pin Providing a surface; an outer layer covering the inner peripheral surface of the outer conductor; and a plurality of radial ribs projecting radially outward from the inner layer body and connected to an inner peripheral side of the outer layer body; The radial rib is continuously disposed in the longitudinal direction of the conductive needle. a probe comprising: a conductive pin; an outer conductor disposed coaxially with the conductive pin through the gap; And an insulator is disposed in the gap; a spirally wound tape layer is disposed as an insulating sheath on the outer peripheral surface of the outer conductor, and the tape layer is formed by overlapping winding at 1/2.