TWI424233B - Array substrate, substrate module, and display panel - Google Patents

Description

Array substrate, substrate module, and display panel

The present invention relates to an array substrate, a substrate module, and a display panel, and more particularly to an array substrate, a substrate module, and a display panel of good quality.

Today's social multimedia technology is quite developed, and most of them benefit from the advancement of semiconductor components or display devices. As far as the display is concerned, a liquid crystal display having superior characteristics such as high image quality, good space utilization efficiency, low power consumption, and no radiation has gradually become the mainstream of the market.

The liquid crystal display comprises a liquid crystal display panel and a backlight module, wherein the backlight module is used to provide sufficient brightness, and the liquid crystal display panel can display images. Briefly, the liquid crystal display panel mainly includes a TFT Array Substrate, a color filter, and a liquid crystal layer disposed between the thin film transistor array substrate and the color filter substrate. Generally, in order to allow the liquid crystal layer to be stored between the two substrates, the frame glue is first formed on the thin film transistor array substrate or the color filter substrate before the two substrates are assembled, and then The liquid crystal molecules are dropped on one of the two substrates. Thereafter, the two substrates are pressed together to form a liquid crystal display panel, or the two substrates are first pressed together, and liquid crystal molecules are poured between the two substrates.

When the liquid crystal display panel is assembled, the position of the sealant must have good flatness so that the thin film transistor array substrate and the color filter substrate are parallel to each other to maintain a fixed gap. However, in the design of the thin film transistor array substrate, some of the wires are disposed in an area overlapping the frame glue, wherein the wires have different thickness designs due to different impedance requirements. Therefore, when the sealant is assembled with the color filter array substrate and the color filter substrate, the phenomenon that the substrate is skewed due to the unevenness of the position where the sealant is disposed may also be referred to as a seesaw phenomenon.

The invention provides an array substrate, wherein a part of the wires disposed on the wire have different thicknesses in the glue-bonding zone and the non-frame rubber zone to meet specific impedance requirements, and all the wires in the glue-blocking zone have the same thickness.

The invention provides a substrate module, and the phenomenon of the seesaw is not easy to occur.

The present invention provides a display panel in which a display medium is filled between two substrates that are parallel to each other, and a sealant that groups the two substrates together has a substantially uniform thickness.

The invention provides an array substrate comprising a substrate, a sealant, an active device array and at least one first wire. The substrate has a display area and a sealant area surrounding the display area. The sealant is placed in the sealant area. The active device array is arranged in the display area. The first wire is disposed on the substrate and extends from the display area into the sealant area. The first wire has a first thickness in the display region and a second thickness in the seal region, and the first thickness is greater than the second thickness.

The invention further provides a substrate module comprising an array substrate, a pair of substrates and a sealant. The array substrate includes a substrate, an active device array, and at least one first wire. The substrate has a display area and a sealant area surrounding the display area. The active device array is arranged in the display area. The first wire is disposed on the substrate and extends from the display area into the sealant area. The first wire has a first thickness in the display region and a second thickness in the seal region, and the first thickness is greater than the second thickness. The opposite substrate and the array substrate face each other. The sealant is disposed in the sealant region and the array substrate and the opposite substrate are grouped together.

The invention further provides a display panel comprising an array substrate, a pair of substrates, a frame glue and a display medium. The array substrate includes a substrate, an active device array, and at least one first wire. The substrate has a display area and a sealant area surrounding the display area. The active device array is arranged in the display area. The first wire is disposed on the substrate and extends from the display area into the sealant area. The first wire has a first thickness in the display region and a second thickness in the seal region, and the first thickness is greater than the second thickness. The opposite substrate and the array substrate face each other. The sealant is disposed in the sealant region and the array substrate and the opposite substrate are grouped together. The display medium is disposed between the array substrate, the opposite substrate, and the sealant.

The invention further provides an array substrate comprising a substrate, a sealant, an active device array and at least one first wire. The substrate has a display area and a sealant area surrounding the display area. The sealant is placed in the sealant area. The active device array is arranged in the display area. The first wire is disposed on the substrate and extends from the display area into the sealant area. The first conductive line is formed by at least a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are disposed on the substrate in an overlapping manner in the display region, and juxtaposed in the sealant region. Disposed on the substrate.

Based on the above, in the array substrate of the present invention, the same wire has different thicknesses in the sealant region and the non-frame seal region, wherein the portion of the wire in the sealant region and the other wires located in the sealant region may have the same thickness. And the thickness in the non-frame rubber area is larger. As a result, such a wire can have a desired impedance and does not deteriorate the flatness of the seal region. Therefore, the sealant can have ideal flatness when disposed in the sealant region, and the substrate module and the display panel can have the required wire impedance and good assembly yield by using the array substrate of the present invention.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic view of an array substrate according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1, and FIG. 3 is a cross-sectional line II" of FIG. 1 to 3, the array substrate 100 includes a substrate 110, a sealant 120, an active device array 130, and at least a first lead 140. The substrate 110 has a display area 112 and surrounding the display area. A frame rubber portion 114 of the 112. The frame glue 120 is disposed in the sealant region 114, that is, the position of the sealant 120 is the glue seal region 114. The active device array 130 is disposed in the display region 112. The first wire 140 It is disposed on the substrate 110 and extends from the display area 112 into the sealant region 114. It is worth mentioning that the first wire 140 has a first thickness t1 in the display area 112 and one in the sealant area 114. The second thickness t2, and the first thickness t1 is greater than the second thickness t2. In addition, the first wire 140 may extend into an outer region 116 of the substrate 110, and the glue region 114 is located at the outer region 116 and displayed. Between the regions 112. As shown in FIG. 1, the first wire 140 is adjacent to the sealant region 114 when it enters from the display region 112. A portion of the display area 112 of the sealant region 114 has a second thickness t2, which is not limited thereto.

In this embodiment, the first wire 140 can be electrically connected to the active device array 130 for transmitting a scan signal, transmitting a data signal, or transmitting a common communication number. Alternatively, the first wire 140 can be used as a repair line without transmitting a signal. As the size of the array substrate 100 increases, the length of the first wire 140 is necessarily increased to increase the load. Therefore, in order to maintain a certain signal transmission quality, the impedance of the first wire 140 cannot be too high.

In general, the impedance of the first wire 140 is, for example, inversely proportional to its thickness under a fixed line width design. That is, the thicker the thickness, the lower the impedance of the first wire 140, and vice versa. Therefore, the present embodiment makes the first thickness t1 of the first wire 140 in the display region 112 large to help reduce the impedance of the first wire 140. The first wire 140 also has, for example, a first thickness t1 in the outer region 116 to maintain uniformity of impedance. In addition, in the present embodiment, the first wire 140 is thinner at the second thickness t2 of the sealant region 114, which makes the sealant 120 less likely to cause surface unevenness in the sealant region 114. Therefore, the thickness of the first wire 140 is designed such that the sealant 120 is disposed on a substantially flat surface, and the thickness of the sealant 120 is not easily uneven.

As can be seen from FIG. 1, in order to maintain a uniform impedance, the first wire 140 can be distributed along the cross-sectional line I-I' and the cross-sectional line II" when passing through the sealant region 114. With such a design, the first wire The 140 may have a different first thickness t1 and a second thickness t2 in the display region 112 and in the sealant region 114, but the first wire 140 may still have substantially the same in the display region 112 and in the sealant region 114. That is, the first wire 140 of the present embodiment can be disposed along the two paths in the sealant region 114 without increasing the impedance because the second thickness t2 in the sealant region 114 is thin. The first wire 140 can have not only a desired impedance but also an unevenness in the surface of the sealant region 114.

Further, Fig. 4 is a schematic cross-sectional view taken along line II-II' of Fig. 1. Referring to FIG. 1 and FIG. 4 simultaneously, the array substrate 100 may further include a plurality of second wires 150 disposed on the substrate 110. The second wire 150 also extends from the display region 112 into the sealant region 114. In particular, the second wires 150 are each formed, for example, of a single conductive layer. The impedance of the second wire 150 need not be particularly lowered, so the third wire 150 has a third thickness t3 which may be substantially the thickness of the single conductive layer.

In the present embodiment, the first wire 140 must have a lower impedance, so the first thickness t1 of the first wire 140 in the display region 112 is greater than the thickness of the single conductive layer. If the first wire 140 having such a thickness is also disposed in the sealant region 114, the surface flatness of the sealant region 114 will be deteriorated. That is, the surface where the second wire 150 is located is relatively low and the surface where the first wire 140 is located is relatively high. At this time, the placement of the sealant 120 in the highly uneven rubber seal region 114 tends to cause the thickness of the sealant 120 to be uneven, which is disadvantageous for the subsequent assembly process.

Therefore, in the embodiment, in order to arrange the sealant 120 on the flat surface, the first wire 140 may have only the second thickness t2 in the sealant region 114, wherein the third thickness t3 of each second wire 150 is substantially It is equal to the second thickness t2 of the first wire 140 at the sealant region 114. That is, the present embodiment makes the first thickness 140 of the first wire 140 at the second thickness t2 of the sealant region 114 equal to the third thickness t3 of the other wires (for example, the second wire 150), thereby making the sealant 120 have the same thickness. These wires are used to maintain the thickness uniformity of the sealant 120. In this embodiment, the first wire 140 can be disposed by means of such a split line, so that the first wire 140 has the characteristics of low impedance while maintaining the flatness of the position of the sealant 120.

5 and 6 show an embodiment of the cross-sectional line I-I' and the cross-sectional line II" of Fig. 1. Referring also to Figures 1, 5 and 6, in an embodiment, A wire 140 is formed by at least a first conductive layer 142 and a second conductive layer 144, and the first conductive layer 142 and the second conductive layer 144 are disposed on the substrate 110 in an overlapping manner in the display region 112. The region 114 is juxtaposed on the substrate 110. That is, the first wire 140 is distributed in the sealant region 114 in two different paths (the path of the line I-I' and the line II).

It is to be noted that the first conductive layer 142 and the second conductive layer 144 are disposed on the substrate 110 in the display region 112 and the outer region 116, and are arranged side by side on the substrate 110 in the sealant region 114. As such, the first conductive line 140 is composed of the first conductive layer 142 and the second conductive layer 144 in the display region 112, the sealant region 114, and the outer region 116. Therefore, the first wire 140 may have a uniform impedance, and the impedance of the first wire 140 may be increased in a partial region without requiring a thinner thickness in the sealant region 114.

In detail, the first conductive layer 142 includes a first portion 142A, a second portion 142B, and a third portion 142C that are sequentially connected. The first portion 142A is located in the display region 112 and overlaps the second conductive layer 144. The third portion 142C overlaps the sealant 120 and is juxtaposed with the second conductive layer 144, and the second portion 142B is coupled to the first portion 142A. Between the third part 142C.

Similarly, the second conductive layer 144 also includes a first portion 144A, a second portion 144B, and a third portion 144C that are sequentially connected. The first portion 144A is located in the display region 112 and overlaps the first conductive layer 142. The third portion 144C overlaps the sealant 120 and is juxtaposed with the first conductive layer 142, and the second portion 144B is coupled to the first portion 144A. Between the third part 144C. The second portion 144B of the second conductive layer 144 is, for example, a bend corresponding to the line I-I" in the upper view of FIG.

In this embodiment, as shown in FIG. 5 , the first conductive layer 142 and the second conductive layer 144 are relatively close to the film layer of the substrate 110 . However, the invention is not limited thereto. In other embodiments, the stacking order of the first conductive layer 142 and the second conductive layer 144 may be interchanged. That is, the present invention does not particularly limit the embodiment in which the first conductive layer 142 is stacked on the second conductive layer 144 or the embodiment in which the second conductive layer 144 is stacked on the first conductive layer 142.

In addition, the first conductive layer 142 and the second conductive layer 144 have substantially the same thickness, that is, the thickness of the single conductive layer, which may be composed of a stack of multiple metal layers or may be composed of only one metal layer. That is, the first thickness t1 of the first wire 140 at the display region 112 may be twice the second thickness t2 of the first wire 140 at the sealant region 114. Of course, in FIG. 4, the third thickness t3 of the second wire 150 may be equal to the thickness of one of the first conductive layer 142 and the second conductive layer 144. Specifically, the second wire 150 may be the same film layer as the first conductive layer 142 or the second conductive layer 144. Since the first conductor layer 142 and the second conductor layer 144 can be patterned via different reticle, they can have different routing paths to achieve the spirit of the present invention.

FIG. 7 is a schematic diagram of a substrate module according to an embodiment of the invention. Referring to FIG. 7 , the substrate module 200 includes an array substrate 100 and a pair of substrates 210 . The array substrate 100 can be referenced to FIG. 1 and a related description, which includes at least a substrate 110, a sealant 120, and the active device array 130 and the at least one first wire 140 illustrated in FIG. 1 . The counter substrate 210 is disposed opposite to the array substrate 100, and the sealant 120 assembles the array substrate 100 and the counter substrate 210 together. The opposite substrate 210 may be a color filter substrate. It can be seen from the foregoing embodiment that the sealant region 114 provided by the sealant 120 has uniform flatness, so that the thickness of the sealant 120 can assume a uniform state. Therefore, in the substrate module 200, the opposite substrate 210 and the array substrate 100 are substantially parallel to each other. That is to say, the substrate module 200 is less prone to warp phenomenon.

FIG. 8 is a schematic diagram of a display panel according to an embodiment of the invention. Referring to FIG. 8 , the display panel 300 includes the substrate module 200 and the display medium 310 of the foregoing embodiment. The display medium 310 is disposed between the array substrate 100 , the opposite substrate 210 , and the sealant 120 . The display medium 310 may be a liquid crystal layer, an electrophoretic display medium, an electrowetting display medium, an organic electroluminescent display medium, or the like. Since the opposing substrate 210 of the substrate module 200 and the array substrate 100 can maintain an arrangement relationship parallel to each other, the gap between the opposing substrate 210 and the array substrate 100 can be maintained at a constant value. Therefore, the display medium 310 can have a uniform thickness to help provide a desired display effect.

In summary, the present invention utilizes a splitting manner such that the same wire can have different thicknesses in different regions, and the impedance can be maintained consistent. Therefore, the wires do not necessarily cause significant height fluctuations on the array substrate. When the sealant is to be disposed on the array substrate, the sealant can be disposed on the substantially flat surface without uneven thickness. When the array substrate and the opposite substrate are grouped together, it is not easy to have a seesaw phenomenon. Therefore, both the substrate module and the display panel can have good assembly yield, and all the wires can have ideal impedance.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100. . . Array substrate

110. . . Substrate

112. . . Display area

114. . . Frame glue zone

116. . . Outer zone

120. . . Frame glue

130. . . Active component array

140. . . First wire

142. . . First conductive layer

142A, 144A. . . first part

142B, 144B. . . Second part

142C, 144C. . . Part III

144. . . Second conductive layer

150. . . Second wire

200. . . Substrate module

210. . . Counter substrate

300. . . Display panel

310. . . Display medium

I-I', I-I", II-II'...

T1. . . First thickness

T2. . . Second thickness

T3. . . Third thickness

FIG. 1 is a schematic diagram of an array substrate according to an embodiment of the invention.

Figure 2 is a cross-sectional view taken along line I-I' of Figure 1.

Figure 3 is a cross-sectional view taken along line I-I" of Figure 1.

Fig. 4 is a schematic cross-sectional view taken along line II-II' of Fig. 1.

5 and 6 illustrate an embodiment of a section line I-I' and a section line I-I" of Fig. 1.

FIG. 7 is a schematic diagram of a substrate module according to an embodiment of the invention.

FIG. 8 is a schematic diagram of a display panel according to an embodiment of the invention.

100. . . Array substrate

110. . . Substrate

112. . . Display area

114. . . Frame glue zone

116. . . Outer zone

120. . . Frame glue

130. . . Active component array

140. . . First wire

150. . . Second wire

I-I', I-I", II-II'...

Claims (10)

An array substrate comprising: a substrate having a display area and a sealant area surrounding the display area; a frame glue disposed in the sealant area; an active element array disposed in the display area; and at least a first wire disposed on the substrate, extending from the display area to the sealant region, wherein the first wire has a first thickness in the display area, and the frame is in the sealant area and the frame The thickness of the portion where the glue overlaps is a second thickness, and the first thickness is greater than the second thickness. The array substrate of claim 1, wherein the first conductive wire is composed of at least a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are in the display region. The two are arranged on the substrate in an overlapping manner, and are arranged side by side on the substrate in the sealant region. The array substrate of claim 2, wherein the first conductive layer comprises a first portion, a second portion and a third portion sequentially connected, wherein the first portion is located in the display area And being disposed together with the second conductive layer, the third portion is overlapped with the sealant region and juxtaposed with the second conductive layer, and the second portion is connected between the first portion and the third portion . The array substrate of claim 2, wherein the first conductive layer and the second conductive layer have substantially the same thickness. The array substrate of claim 2, wherein the second conductive stack is disposed on the first conductive layer in the display region. The array substrate of claim 2, wherein the first conductive stack is disposed on the second conductive layer in the display region. The array substrate of claim 1, wherein the first wire extends into an outer region of the substrate, the glue region is located between the outer region and the display region, and the first wire is The outer region has the first thickness, wherein the first conductive line is composed of a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are in the display area and the outer area They are disposed on the substrate in an overlapping manner, and are arranged side by side on the substrate in the sealant region. The array substrate of claim 1, further comprising a plurality of second wires disposed on the substrate, extending from the display region into the sealant region, wherein a third thickness of each of the second wires The second thickness is equal to the second thickness, wherein the second wires are each composed of a single conductive layer. The array substrate of claim 1, wherein the first wire is electrically connected to the active device array, wherein the first wire does not transmit a signal, transmits a scan signal, transmits a data signal or a total communication number. . A substrate module includes an array substrate, comprising: a substrate having a display area and a sealant area surrounding the display area; a frame glue disposed in the sealant region; an active component array disposed on the substrate In the display area; at least one first wire extending from the display area to the sealant area The first wire has a first thickness in the display area, and the thickness of the portion in the glue block and overlapping the frame glue is a second thickness, and the first thickness is greater than the second thickness a thickness; and a pair of substrates disposed opposite the array substrate, and the frame glue grouping the array substrate and the opposite substrate together.