CN104199210A - Display device and manufacturing method thereof - Google Patents
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- CN104199210A CN104199210A CN201410380460.1A CN201410380460A CN104199210A CN 104199210 A CN104199210 A CN 104199210A CN 201410380460 A CN201410380460 A CN 201410380460A CN 104199210 A CN104199210 A CN 104199210A
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Abstract
The embodiment of the invention discloses a display device and a manufacturing method of the display device and relates to the technical field of display. The COG mura of the display device can be effectively reduced. The display device comprises a backlight module, a lower polarizer, an array substrate, a liquid crystal molecule layer, a color film substrate and an integrated circuit. The array substrate and the color film substrate are oppositely arranged on the two sides of the liquid crystal molecule layer, the array substrate comprise a combining area and a binding area, the lower polarizer is located on the side, away from the color film substrate, of the array substrate, and the combining area and the binding area are covered with the lower polarizer; the integrated circuit is located on the face, not covered with the lower polarizer, of the binding area; the backlight module is located on the face, covered with the lower polarizer, of the binding area.
Description
Technical field
The present invention relates to display technique field, relate in particular to a kind of display device and preparation method thereof.
Background technology
As shown in Figure 1, liquid crystal indicator comprises the structures such as the backlight module 1 ' setting gradually, lower polaroid 2 ', array base palte 3 ', layer of liquid crystal molecule 4 ', color membrane substrates 5 ', upper polaroid 6 ' and integrated circuit 7 '.Wherein, array base palte 3 ' comprise to box region and binding region, to box region for and color membrane substrates 5 ' to box, binding region be used for binding integrated circuit 7 '.
Particularly, the attaching of lower polaroid 2 ', upper polaroid 6 ', the binding of integrated circuit 7 ' and the assembling process of backlight module 1 ' are as follows: after array base palte 3 ' and color membrane substrates 5 ' are to box, array base palte 3 ' to box region away from the one side of color membrane substrates 5 ' on attach under polaroid 2 ', in one side at color membrane substrates 5 ' away from array base palte 3 ', attach upper polaroid 6 ', then, in the one side near color membrane substrates 5 ', bind integrated circuit 7 ' in binding region; Finally, in the one side away from color membrane substrates 5 ', assemble backlight module 1 '.Wherein, the process of assembling backlight module 1 ' is as follows: first, the photo-shield strip 11 ' of backlight module 1 ' upper attach step glue 12 ' (step glue 12 ' for make up binding region and attached time polaroid 2 ' to the difference in height between box region), then, make step glue 12 ' bonding with binding region, photo-shield strip 11 ' is bonding with the edge of lower polaroid 2 ', thereby realizes 1 ' assembling of backlight module.
Inventor finds, in the time that integrated circuit 7 ' is bound in binding on region, can cause the distortion in binding region, in the time that the display mode of liquid crystal indicator is the display modes such as ADS, IPS and FFS, the distortion in binding region can cause liquid crystal indicator to occur that (phenomenon that causes Show Color and brightness to change due to the binding of integrated circuit is called COG (chip on glass to COG mura, integrated circuit is bundled on substrate) mura), display device occurs that the ratio of COG mura is 1～3%.Assemble in the process of backlight module 1 ' on binding region follow-up, the stress producing is concentrated on and is bound on region by photo-shield strip 11 ' and step glue 12 ', and then the deflection of binding region is significantly increased, greatly increase the weight of COG mura, cause display device to occur that the ratio of COG mura is 10～15%, and then cause the yields of liquid crystal indicator to decline.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of display device and preparation method thereof, can effectively reduce the COG mura of display device.
For solving the problems of the technologies described above, the embodiment of the present invention provides a kind of display device, adopts following technical scheme:
A kind of display device comprises backlight module, lower polaroid, array base palte, layer of liquid crystal molecule, color membrane substrates and integrated circuit, described array base palte and described color membrane substrates are relatively arranged on described layer of liquid crystal molecule both sides, described array base palte comprises box region and binding region, described lower polaroid is positioned at described array base palte away from described color membrane substrates one side, and described lower polaroid covers described to box region and described binding region;
Described integrated circuit is positioned at described binding region not by the one side of described lower polaroid covering;
Described backlight module is positioned at described binding region and has covered in the one side of described lower polaroid.
The flatness of described lower polaroid is less than or equal to 0.03mm.
On described backlight module, be pasted with photo-shield strip, described photo-shield strip is not bonding with the one side that described binding region has covered described lower polaroid with the one side that described backlight module is pasted.
Described integrated circuit comprises drive integrated circult and flexible PCB.
The width in described binding region is 3.5～4mm.
The embodiment of the present invention provides a kind of display device, this display device comprises backlight module, lower polaroid, array base palte, layer of liquid crystal molecule, color membrane substrates and integrated circuit, wherein, array base palte and color membrane substrates are relatively arranged on layer of liquid crystal molecule both sides, array base palte comprises box region and binding region, lower polaroid is positioned at array base palte away from color membrane substrates one side, and lower polaroid covers box region and binding region; Integrated circuit is positioned in the one side that do not covered by lower polaroid of binding region; Backlight module is positioned at binding region and has covered in the one side of time polaroid.Because lower polaroid covers box region and binding region, therefore, the stress dispersion producing when assembling backlight module is to whole lower polaroid, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
In order further to solve the problems of the technologies described above, the embodiment of the present invention provides a kind of method for making of display device, adopts following technical scheme:
A kind of method for making of display device comprises:
Make array base palte and color membrane substrates, described array base palte comprises box region and binding region;
Described array base palte described to box region or described color membrane substrates on dispenser method, make described array base palte described to box region and described color membrane substrates to box;
Polaroid under described array base palte attaches on away from the one side of described color membrane substrates, described lower polaroid covers described to box region and described binding region;
In the one side not covered by described lower polaroid in described binding region, bind integrated circuit;
Cover in described binding region in the one side of described lower polaroid and assembled backlight module.
The flatness of described lower polaroid is less than or equal to 0.03mm.
In the described one side that has covered described lower polaroid in described binding region, assemble backlight module, comprising:
On described backlight module, paste photo-shield strip;
Described photo-shield strip is not bonding with the one side that described binding region has covered described lower polaroid with the one side that described backlight module is pasted.
In the described one side not covered by described lower polaroid in described binding region, bind integrated circuit, comprising:
In the one side not covered by described lower polaroid in described binding region, bind drive integrated circult;
On the described binding region of having bound described drive integrated circult, bind flexible PCB.
The width in described binding region is 3.5～4mm.
The embodiment of the present invention provides a kind of method for making of display device, adopt said method to make in the process of display device, first polaroid under array base palte attaches on away from the one side of color membrane substrates, lower polaroid covers box region and binding region, then in the one side not covered by lower polaroid in binding region, bind drive integrated circult and flexible PCB, cover in the one side of time polaroid and assembled backlight module in binding region again, because lower polaroid covers box region and binding region, therefore, the stress dispersion producing when assembling backlight module is to whole lower polaroid, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic diagram of liquid crystal indicator of the prior art;
Fig. 2 is the schematic diagram of the display device in the embodiment of the present invention;
Fig. 3 is the array base palte schematic diagram of the display device that is ADS of the display mode in the embodiment of the present invention;
Fig. 4 is the method for making process flow diagram of the display device in the embodiment of the present invention.
Description of reference numerals:
1-backlight module; 11-photo-shield strip; 2-lower polaroid;
3-array base palte; The 30-the first underlay substrate; 31-grid;
32-public electrode; 33-gate insulator; 34-active layer;
35-source electrode; 36-drain electrode; 37-passivation layer;
38-pixel electrode; 4-layer of liquid crystal molecule; 5-color membrane substrates;
6-integrated circuit; 7-upper polaroid.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment mono-
The embodiment of the present invention provides a kind of display device, can effectively reduce the COG mura of display device.The display mode of display device can be ADS, IPS or FFS.As shown in Figure 2, this display device comprises: backlight module 1, lower polaroid 2, array base palte 3, layer of liquid crystal molecule 4, color membrane substrates 5 and integrated circuit 6.
Relative position relation and the detail of each structure below display device being comprised are described:
Array base palte 1 and color membrane substrates 2 are relatively arranged on layer of liquid crystal molecule 4 both sides, and array base palte 3 comprises box region and binding region.Wherein, the width in binding region is 3.5～4mm.
Further, array base palte 3 comprises the first underlay substrate and is arranged at crisscross grid line and the data line on the first underlay substrate, grid line and data line surround pixel cell, are arranged at the structures such as thin film transistor (TFT), public electrode and pixel electrode in pixel cell.On color membrane substrates 5, be provided with the structures such as black matrix, color filter layer, protective clear layer and chock insulator matter.
In the time that the display mode of display device is ADS, the public electrode on array base palte 3 and pixel electrode different layers arrange, and on public electrode or pixel electrode, have slit.In the time that the display mode of display device is IPS, the public electrode on array base palte 3 and pixel electrode with interlayer every setting.In the time that the display mode of display device is FFS, public electrode on array base palte 3 and pixel electrode different layers arrange, on public electrode and pixel electrode, all there is slit, slit on public electrode is corresponding to pixel electrode position, and the slit on pixel electrode is corresponding to public electrode position.
Exemplarily, in the time that the display mode of display device is ADS, as shown in Figure 3, array base palte 3 comprises grid line (not shown), grid 31 and public electrode 32, gate insulator 33, active layer 34, the data line (not shown) arranging with layer, source electrode 35 and drain electrode 36, the passivation layer 37 that is set in turn in the same layer setting on the first underlay substrate 30 and the pixel electrode 38 with slit, wherein on passivation layer 37, have via hole, pixel electrode 38 is connected with drain electrode 36 by via hole.
Lower polaroid 2 is positioned at array base palte 3 away from color membrane substrates 5 one sides, and lower polaroid 2 covers box region and binding region.
In prior art, as shown in Figure 1, on backlight module 1 ', be pasted with photo-shield strip 11 ', the upper step glue 12 ' that attaches of photo-shield strip 11 ', step glue 12 ' is bonding with binding region, and photo-shield strip 11 ' is bonding with the edge of lower polaroid 2 '.Now, the reason that assembling backlight module 1 ' causes the deflection of binding region to increase comprises two aspects: on the one hand, the stress producing when assembling backlight module 1 ' is concentrated on and is bound on region by photo-shield strip 11 ' and step glue 12 ', has increased the deflection of binding region; On the other hand, due to the restriction of existing technique, the flatness of photo-shield strip 11 ' and step glue 12 ' is poor, generally between 0.2～0.3mm, while backlight module 1 ' being assembled on binding region by photo-shield strip 11 ' and step glue 12 ', the stress further having aggravated on binding region is concentrated, and has further increased the deflection in binding region, the COG mura of display device is increased the weight of, and the yields of display device declines.From the above, the flatness of the structure contacting with binding region has a significant impact the deflection in binding region, the structure contacting with binding region is in embodiments of the present invention that lower polaroid 2 covers whole array base palte 3, therefore, in the embodiment of the present invention, the flatness of preferably lower polaroid 2 is less than or equal to 0.03mm.
Integrated circuit 6 is positioned in the one side that do not covered by lower polaroid 2 of binding region.Exemplarily, integrated circuit 6 comprises drive integrated circult and flexible PCB.
Backlight module 1 is positioned at binding region and has covered in the one side of time polaroid 2.
Particularly, be pasted with photo-shield strip 11 on backlight module 1, photo-shield strip 11 is not bonding with the one side that binding region has covered time polaroid 2 with the one side that backlight module 1 is pasted.Now, backlight module 1 contacts with lower polaroid 2 by photo-shield strip 11, and then stress dispersion assembling being produced when backlight module 1 by photo-shield strip 11 is to whole lower polaroid 2, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module 1, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
In addition, display device also comprises and is positioned at the first alignment films (not shown) of array base palte 3 near color membrane substrates 5 one side, be positioned at the second alignment films (not shown) of color membrane substrates 5 near array base palte 3 one sides, and be positioned at color membrane substrates 5 away from the upper polaroid 7 in array base palte 3 one sides, wherein, the axial direction of printing opacity that the first alignment films and the second alignment films make the liquid crystal molecule in layer of liquid crystal molecule 4 be parallel to lower polaroid 2 along major axis is arranged, and the light transmission shaft direction of upper polaroid 7 is mutually vertical with the light transmission shaft direction of lower polaroid 2.
The embodiment of the present invention provides a kind of display device, this display device comprises backlight module, lower polaroid, array base palte, layer of liquid crystal molecule, color membrane substrates and integrated circuit, wherein, array base palte and color membrane substrates are oppositely arranged, array base palte comprises box region and binding region, lower polaroid is positioned at array base palte away from color membrane substrates one side, and lower polaroid covers box region and binding region; Integrated circuit is positioned in the one side that do not covered by lower polaroid of binding region; Backlight module is positioned at binding region and has covered in the one side of time polaroid.Because lower polaroid covers box region and binding region, therefore, the stress dispersion producing when assembling backlight module is to whole lower polaroid, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
Embodiment bis-
The embodiment of the present invention provides a kind of method for making of display device, can effectively reduce the COG mura of display device.The method for making of this display device can be the display device of ADS, IPS or FFS for making display mode.
As shown in Figure 4, the method for making of this display device comprises:
Step S401, making array base palte and color membrane substrates, array base palte comprises box region and binding region.
Particularly, making array base palte 3 is included on the first underlay substrate and forms crisscross grid line and data line, and grid line and data line surround pixel cell; Form thin film transistor (TFT), thin film transistor (TFT) is positioned at pixel cell; Form public electrode; Form pixel electrode etc., to form array base palte 3.The array base palte 3 forming comprises that, to box region and binding region, wherein, the width in binding region is 3.5～4mm.
It should be noted that, the order that forms each structure on array base palte is not limited above, those skilled in the art can, according to the corresponding order of the structure choice of concrete array base palte 3, also can form multiple structures simultaneously.
In the time of the array base palte 3 of the making display device that is ADS for display mode, the public electrode of formation and pixel electrode different layers arrange, and on public electrode or pixel electrode, have slit.In the time of the array base palte 3 of the making display device that is IPS for display mode, the public electrode of formation and pixel electrode with interlayer every setting.In the time of the array base palte 3 of the making display device that is FFS for display mode, the public electrode forming and pixel electrode different layers arrange, on public electrode and pixel electrode, all there is slit, slit on public electrode is corresponding to pixel electrode position, and the slit on pixel electrode is corresponding to public electrode position.
Exemplarily, in the time of the array base palte 3 of the making display device that is ADS for display mode, the manufacturing process of array base palte 3 specifically comprises:
On the first underlay substrate 30, form gate metal layer, form the figure that comprises grid line and grid 31 through composition technique.
Forming on the first underlay substrate 30 of the figure that comprises grid line and grid 31, forming common electrode layer, forming the figure that comprises tabular public electrode 32 through composition technique, tabular public electrode 32 arranges with layer with grid line and grid 31.
Forming on the first underlay substrate 30 of the figure that comprises public electrode 32, forming gate insulator 33.
On the first underlay substrate 30 that has formed gate insulator 33, form semiconductor layer, form the figure that comprises active layer 34 through composition technique.
Forming on the first underlay substrate 30 of the figure that comprises active layer 34, forming source-drain electrode metal level, forming the figure that comprises data line, source electrode 35 and drain electrode 36 through composition technique.
Forming on the first underlay substrate 30 of the figure that comprises data line, source electrode 35 and drain electrode 36, form passivation layer 37, make to form on passivation layer 37 via hole corresponding to drain electrode 36 through composition technique.
On the first underlay substrate 30 that has formed passivation layer 37, form pixel electrode layer, through composition technique, form the figure that comprises the pixel electrode 38 with slit, pixel electrode 38 is connected with drain electrode 36 by via hole.
Particularly, the manufacturing process of color membrane substrates 5 is included on the second underlay substrate and forms black matrix, forms color filter layer, forms protective clear layer, forms chock insulator matter etc.
Step S402, array base palte to box region or color membrane substrates on dispenser method, by array base palte to box region and color membrane substrates to box.
Step S403, under array base palte attaches on away from the one side of color membrane substrates polaroid, lower polaroid covers box region and binding region.
In prior art, as shown in Figure 1, on backlight module 1 ', be pasted with photo-shield strip 11 ', the upper step glue 12 ' that attaches of photo-shield strip 11 ', step glue 12 ' is bonding with binding region, and photo-shield strip 11 ' is bonding with the edge of lower polaroid 2 '.Now, the reason that assembling backlight module 1 ' causes the deflection of binding region to increase comprises two aspects: on the one hand, the stress producing when assembling backlight module 1 ' is concentrated on and is bound on region by photo-shield strip 11 ' and step glue 12 ', has increased the deflection of binding region; On the other hand, due to the restriction of existing technique, the flatness of photo-shield strip 11 ' and step glue 12 ' is poor, generally between 0.2～0.3mm, while backlight module 1 ' being assembled on binding region by photo-shield strip 11 ' and step glue 12 ', the stress further having aggravated on binding region is concentrated, and has further increased the deflection in binding region, the COG mura of display device is increased the weight of, and the yields of display device declines.From the above, the flatness of the structure contacting with binding region has a significant impact the deflection in binding region, the structure contacting with binding region is in embodiments of the present invention lower polaroid 2, therefore, in the embodiment of the present invention, the flatness of preferably lower polaroid 2 is less than or equal to 0.03mm.
Step S404, in the one side that do not covered by lower polaroid of binding region, bind integrated circuit.
Exemplarily, in the time that the integrated circuit 6 of needs binding comprises drive integrated circult and flexible PCB, in the one side not covered by lower polaroid 2 in binding region, binding integrated circuit 6 comprises: first, in the one side not covered by lower polaroid 2, bind drive integrated circult in binding region; Then, on the binding region of having bound drive integrated circult, bind flexible PCB, also just scold on the binding region that first drive integrated circult is arranged on to array base palte 3, and then flexible PCB is bundled on array base palte 3, (comprise data cable lead wire end or other need to input or output signal end) is connected with drive integrated circult by flexible PCB so that the lead end of the various signal wires on array base palte 3.
Step S405, cover in the one side of time polaroid and assembled backlight module in binding region.
Particularly, first, on backlight module 1, paste photo-shield strip 11, then, photo-shield strip 11 is not bonding with the one side that binding region has covered time polaroid 2 with the one side that backlight module 1 is pasted.Now, backlight module 1 contacts with lower polaroid 2 by photo-shield strip 11, and then the stress producing while making to assemble backlight module 1 is dispersed on whole lower polaroid 2 by photo-shield strip 11, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module 1, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
It should be noted that, while adopting the method for making making display device of above-mentioned display device, can adopt existing technological parameter and equipment, without increasing cost.
In addition, the method for making of the display device that the embodiment of the present invention provides is also included in color membrane substrates 5 and attaches upper polaroid 7 away from the one side of array base palte 3, in one side at array base palte 3 near color membrane substrates 5, form the first alignment films, in one side at color membrane substrates 5 near array base palte 3, form the steps such as the second alignment films, the embodiment of the present invention repeats no more.
The embodiment of the present invention provides a kind of method for making of display device, adopt said method to make in the process of display device, first polaroid under array base palte attaches on away from the one side of color membrane substrates, lower polaroid covers box region and binding region, then in the one side not covered by lower polaroid in binding region, bind drive integrated circult and flexible PCB, cover in the one side of time polaroid and assembled backlight module in binding region again, because lower polaroid covers box region and binding region, therefore, the stress dispersion producing when assembling backlight module is to whole lower polaroid, avoid the stress in binding region to concentrate, make to assemble that in the process of backlight module, to bind the deflection in region unchanged, and then can effectively reduce the COG mura of display device, improve the yields of display device.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, any be familiar with those skilled in the art the present invention disclose technical scope in; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (10)
1. a display device, comprise backlight module, lower polaroid, array base palte, layer of liquid crystal molecule, color membrane substrates and integrated circuit, described array base palte and described color membrane substrates are relatively arranged on described layer of liquid crystal molecule both sides, described array base palte comprises box region and binding region, it is characterized in that
Described lower polaroid is positioned at described array base palte away from described color membrane substrates one side, and described lower polaroid covers described to box region and described binding region;
Described integrated circuit is positioned at described binding region not by the one side of described lower polaroid covering;
Described backlight module is positioned at described binding region and has covered in the one side of described lower polaroid.
2. display device according to claim 1, is characterized in that, the flatness of described lower polaroid is less than or equal to 0.03mm.
3. display device according to claim 1 and 2, is characterized in that, on described backlight module, is pasted with photo-shield strip, and described photo-shield strip is not bonding with the one side that described binding region has covered described lower polaroid with the one side that described backlight module is pasted.
4. display device according to claim 1 and 2, is characterized in that, described integrated circuit comprises drive integrated circult and flexible PCB.
5. display device according to claim 1, is characterized in that, the width in described binding region is 3.5～4mm.
6. a method for making for display device, is characterized in that, comprising:
Make array base palte and color membrane substrates, described array base palte comprises box region and binding region;
Described array base palte described to box region or described color membrane substrates on dispenser method, make described array base palte described to box region and described color membrane substrates to box;
Polaroid under described array base palte attaches on away from the one side of described color membrane substrates, described lower polaroid covers described to box region and described binding region;
In the one side not covered by described lower polaroid in described binding region, bind integrated circuit;
Cover in described binding region in the one side of described lower polaroid and assembled backlight module.
7. the method for making of display device according to claim 6, is characterized in that, the flatness of described lower polaroid is less than or equal to 0.03mm.
8. according to the method for making of the display device described in claim 6 or 7, it is characterized in that, in the described one side that has covered described lower polaroid in described binding region, assemble backlight module, comprising:
On described backlight module, paste photo-shield strip;
Described photo-shield strip is not bonding with the one side that described binding region has covered described lower polaroid with the one side that described backlight module is pasted.
9. according to the method for making of the display device described in claim 6 or 7, it is characterized in that, in the described one side not covered by described lower polaroid in described binding region, bind integrated circuit, comprising:
In the one side not covered by described lower polaroid in described binding region, bind drive integrated circult;
On the described binding region of having bound described drive integrated circult, bind flexible PCB.
10. the method for making of display device according to claim 6, is characterized in that, the width in described binding region is 3.5～4mm.
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| CN106950760A (en) * | 2017-05-12 | 2017-07-14 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| CN107219694A (en) * | 2017-07-28 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, display device |
| CN108292054A (en) * | 2015-11-26 | 2018-07-17 | 华为技术有限公司 | A kind of liquid crystal display device |
| CN108508648A (en) * | 2018-04-04 | 2018-09-07 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and preparation method thereof |
| WO2018177144A1 (en) * | 2017-03-31 | 2018-10-04 | 京东方科技集团股份有限公司 | Array substrate, display panel and display apparatus |
| CN108873421A (en) * | 2018-08-13 | 2018-11-23 | 武汉华星光电技术有限公司 | A kind of liquid crystal display device and preparation method thereof |
| WO2024216887A1 (en) * | 2023-04-18 | 2024-10-24 | 惠科股份有限公司 | Display device |
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Application publication date: 20141210 |