TWI423950B - Ammonium salt and antistatic composition containing same - Google Patents

Ammonium salt and antistatic composition containing same Download PDF

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TWI423950B
TWI423950B TW097125018A TW97125018A TWI423950B TW I423950 B TWI423950 B TW I423950B TW 097125018 A TW097125018 A TW 097125018A TW 97125018 A TW97125018 A TW 97125018A TW I423950 B TWI423950 B TW I423950B
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resin
ammonium salt
thiocyanate
antistatic agent
weight
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TW097125018A
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TW200916436A (en
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Masatoshi Usui
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Koei Chemical Co
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Description

銨鹽及含有該銨鹽而構成之抗靜電性樹脂組成物 AMMONIUM SALT AND ANTISTATIC COMPOSITION CONTAINING SAMEAmmonium salt and antistatic resin composition containing the same: AMMONIUM SALT AND ANTISTATIC COMPOSITION CONTAINING SAME

本發明係有關在常溫下為液體之新穎性銨鹽、使用該銨鹽之樹脂用抗靜電劑、以及抗靜電性樹脂組成物。The present invention relates to a novel ammonium salt which is liquid at normal temperature, an antistatic agent for a resin using the ammonium salt, and an antistatic resin composition.

日本特開平10-60322號公報中揭示:可用為抗靜電劑之硫氰酸鹽作為陰離子性化合物者有硫氰酸鈉、硫氰酸鉀等之硫氰酸金屬鹽。Japanese Laid-Open Patent Publication No. Hei 10-60322 discloses that a thiocyanate which can be used as an antistatic agent may be a metal thiocyanate such as sodium thiocyanate or potassium thiocyanate.

本發明提供一種樹脂用抗靜電劑、以及含有該樹脂用抗靜電劑之抗靜電性樹脂組成物等。該樹脂用抗靜電劑之特徵係含有式(1)所示之銨鹽(亦即,硫氰酸(二癸基二甲基)銨(didecyldimethylammonium=thiocyanato))作為有效成分。The present invention provides an antistatic agent for a resin, an antistatic resin composition containing the antistatic agent for the resin, and the like. The antistatic agent for a resin is characterized by containing an ammonium salt represented by the formula (1) (i.e., didecyldimethylammonium = thiocyanato) as an active ingredient.

式(1):R1 R2 R3 R4 N+ SCN- (1)(式中,R1 及R2 分別表示癸基,R3 及R4 分別表示甲基)。Formula (1): R 1 R 2 R 3 R 4 N + SCN - (1) (wherein R 1 and R 2 each represent a fluorenyl group, and R 3 and R 4 each represent a methyl group).

本發明中,『常溫』意指25℃。In the present invention, "normal temperature" means 25 °C.

本發明之式(1)所示之銨鹽(以下稱為銨鹽(1))例如可將式(2)所示之鹵化銨(以下稱為鹵化銨(2))使用硫氰酸或其鹼金屬鹽(以下稱為硫氰酸類)並經由陰離子交換而製造。The ammonium salt represented by the formula (1) of the present invention (hereinafter referred to as ammonium salt (1)) can be, for example, an ammonium halide (hereinafter referred to as ammonium halide (2)) represented by the formula (2) using thiocyanate or An alkali metal salt (hereinafter referred to as thiocyanate) is produced by anion exchange.

式(2): R1 R2 R3 R4 N+ X-    (2)(式中,R1 至R4 表示與上述者同義,X表示鹵原子)。Formula (2): R 1 R 2 R 3 R 4 N + X - (2) (wherein R 1 to R 4 represent the same as defined above, and X represents a halogen atom).

鹵化銨(2)可使用市售品,例如可藉由使式(3)所示之胺(以下稱為胺(3))與式(4)所示之鹵烷類(以下稱為鹵烷類(4))反應而製造。A commercially available product can be used for the ammonium halide (2), for example, an amine represented by the formula (3) (hereinafter referred to as an amine (3)) and a halogenated alkane represented by the formula (4) (hereinafter referred to as a halogenated alkane). (4)) Manufactured by reaction.

R1 R2 R3 N   (3)(式中,R1 至R3 表示與上述者同義。)R 1 R 2 R 3 N (3) (wherein R 1 to R 3 represent the same as those described above.)

R4 X   (4)(式中,R4 及X表示與上述者同義。)R 4 X (4) (wherein R 4 and X represent the same as those described above.)

鹵烷類(4)之例可列舉如:氯甲烷、溴甲烷、碘甲烷等。Examples of the halogenated hydrocarbons (4) include methyl chloride, methyl bromide, methyl iodide and the like.

鹵烷類(4)之使用量,相對於1莫耳之胺(3),一般為0.5莫耳至5莫耳,以0.6莫耳至3莫耳為佳,以0.8莫耳至2莫耳更佳。The amount of haloalkane (4) used is generally from 0.5 moles to 5 moles, preferably from 0.6 moles to 3 moles, and from 0.8 moles to 2 moles, relative to 1 mole of amine (3). Better.

胺(3)與鹵烷類(4)之反應可在無溶劑下實施,亦可在溶劑存在下實施。在溶劑存在下實施反應時之溶劑之例,可列舉如:甲醇、乙醇、異丙醇等醇類溶劑;乙腈、丙腈等腈類溶劑;乙酸乙酯、乙酸丁酯等酯類溶劑;四氫呋喃、1, 4-二烷等醚類溶劑;甲苯、二甲苯等芳族烴類溶劑;己烷、環己烷等脂族或脂環式烴類溶劑等。溶劑之使用量並無特別限制,惟相對於1重量份之胺(3),一般為10重 量份以下,以0.1至5重量份為佳,以0.1至1重量份更佳。The reaction of the amine (3) with the halogenated alkane (4) can be carried out without a solvent or in the presence of a solvent. Examples of the solvent in the case of carrying out the reaction in the presence of a solvent include alcohol solvents such as methanol, ethanol, and isopropanol; nitrile solvents such as acetonitrile and propionitrile; ester solvents such as ethyl acetate and butyl acetate; and tetrahydrofuran. 1, 4 - 2 An ether solvent such as an alkane; an aromatic hydrocarbon solvent such as toluene or xylene; an aliphatic or alicyclic hydrocarbon solvent such as hexane or cyclohexane; The amount of the solvent to be used is not particularly limited, but is usually 10 parts by weight or less, preferably 0.1 to 5 parts by weight, more preferably 0.1 to 1 part by weight, per part by weight of the amine (3).

胺(3)與鹵烷類(4)之反應,例如將胺(3)、鹵烷類(4)以及溶劑之混合物,經由一般為20℃以上(以60℃至140℃為佳)之溫度加熱並攪拌而實施。The reaction of the amine (3) with the halogenated alkane (4), for example, a mixture of the amine (3), the halogenated alkane (4) and the solvent, preferably at a temperature of 20 ° C or higher (preferably 60 ° C to 140 ° C) It is carried out by heating and stirring.

如上述之實施,可在得到含有鹵化銨(2)之反應混合物後,將所得反應混合物直接使用在製造本發明之銨鹽(1)之反應中。且如有必要,可將該反應混合物濃縮而得到以鹵化銨(2)為主要成分之殘渣,並將該殘渣直接使用在製造本發明之銨鹽(1)之反應中。再者,如有必要,亦可將所得殘渣與有機溶劑混合,並將該殘渣中所含未反應原料等溶解於有機溶劑後進行過濾,並將所得經精製之鹵化銨(2)使用在製造本發明之銨鹽(1)之反應中。As described above, after the reaction mixture containing the ammonium halide (2) is obtained, the obtained reaction mixture can be used as it is in the reaction for producing the ammonium salt (1) of the present invention. And if necessary, the reaction mixture can be concentrated to obtain a residue containing ammonium halide (2) as a main component, and the residue can be used as it is in the reaction for producing the ammonium salt (1) of the present invention. Further, if necessary, the obtained residue may be mixed with an organic solvent, and an unreacted raw material or the like contained in the residue may be dissolved in an organic solvent, filtered, and the obtained purified ammonium halide (2) may be used in the production. In the reaction of the ammonium salt (1) of the present invention.

硫氰酸類之例可列舉如:硫氰酸、硫氰酸鈉、硫氰酸鉀、硫氰酸鋰等,其中以硫氰酸鈉、硫氰酸鉀為佳。該硫氰酸類之使用量,相對於1莫耳之鹵化銨(2),一般為0.5莫耳以上,以1莫耳至2莫耳為佳。Examples of the thiocyanic acid include thiocyanic acid, sodium thiocyanate, potassium thiocyanate, and lithium thiocyanate. Among them, sodium thiocyanate or potassium thiocyanate is preferred. The amount of the thiocyanic acid used is generally 0.5 mol or more with respect to 1 mol of ammonium halide (2), and preferably 1 mol to 2 mol.

陰離子交換反應通常在水溶劑中進行。水之使用量並無特別限制,惟相對於1重量份之鹵化銨(2),一般為20重量份以下,以0.3至10重量份為佳,以0.5至3重量份更佳。The anion exchange reaction is usually carried out in an aqueous solvent. The amount of water used is not particularly limited, but is usually 20 parts by weight or less, preferably 0.3 to 10 parts by weight, more preferably 0.5 to 3 parts by weight, per part by weight of the ammonium halide (2).

鹵化銨(2)、硫氰酸類以及水之混合順序並無特別限定,可將鹵化銨(2)與水混合之後再添加硫氰酸類;亦可將硫氰酸類與水混合後,以活性碳等脫色劑(decolorants) 處理,再將過濾而得之濾液使用在陰離子交換反應中。The order of mixing the ammonium halide (2), the thiocyanate, and the water is not particularly limited, and the ammonium halide (2) may be mixed with water and then added with thiocyanate; or the thiocyanate may be mixed with water to form activated carbon. Decolorants (decolorants) After treatment, the filtrate obtained by filtration is used in an anion exchange reaction.

反應溫度通常在0℃以上,以10至80℃為佳,又以20至60℃為特佳。The reaction temperature is usually above 0 ° C, preferably from 10 to 80 ° C, and particularly preferably from 20 to 60 ° C.

反應結束後,由所得反應混合物中取出本發明之銨鹽(1)之方法可列舉如:將反應液分離成有機層與水層,並依所需將有機層進行水洗後,藉由濃縮有機層而得到該銨鹽(1)之方法;將不溶於水之有機溶劑(例如:甲苯、乙酸乙酯、二氯甲烷等)在反應中或反應後添加,由不溶於水之有機溶劑中萃取該銨鹽,並依所需而將所得之萃取層進行水洗,接著藉由餾除有機溶劑而得到該銨鹽(1)之方法等。After the completion of the reaction, the method for extracting the ammonium salt (1) of the present invention from the obtained reaction mixture may be, for example, separating the reaction liquid into an organic layer and an aqueous layer, and washing the organic layer as needed, followed by concentrating the organic layer. a method of obtaining the ammonium salt (1); adding an organic solvent insoluble in water (for example, toluene, ethyl acetate, dichloromethane, etc.) during or after the reaction, and extracting from an organic solvent insoluble in water The ammonium salt is washed with water as needed, and then the organic salt is distilled off to obtain the ammonium salt (1).

本發明之樹脂用抗靜電劑,係由含有本發明之銨鹽(1)作為有效成分而構成者,可單獨使用作為樹脂用抗靜電劑,亦可依所需將穩定劑等添加劑或溶劑等混合使用。含有該銨鹽(1)之樹脂用抗靜電劑,在無損及樹脂之透明性的情況下,可對樹脂賦予優異之抗靜電功能。The antistatic agent for a resin of the present invention is composed of the ammonium salt (1) of the present invention as an active ingredient, and may be used alone as an antistatic agent for a resin, or may be an additive such as a stabilizer or a solvent as required. Mixed use. The antistatic agent for a resin containing the ammonium salt (1) imparts an excellent antistatic function to the resin without impairing the transparency of the resin.

依照將該樹脂用抗靜電劑添加於樹脂等之方法,即可製造含有該樹脂用抗靜電劑之樹脂組成物。而含有該樹脂用抗靜電劑之樹脂組成物具透明性,係顯示低表面電阻值之抗靜電性者。According to the method of adding the antistatic agent for a resin to a resin or the like, a resin composition containing the antistatic agent for the resin can be produced. Further, the resin composition containing the antistatic agent for a resin has transparency and is an antistatic property which exhibits a low surface resistance value.

使用於本發明之抗靜電性樹脂組成物之樹脂,通常可列舉:熱塑性樹脂、熱硬化性樹脂、以及光硬化性樹脂(例如:丙烯酸系光硬化性樹脂)。The resin to be used for the antistatic resin composition of the present invention is usually a thermoplastic resin, a thermosetting resin, and a photocurable resin (for example, an acrylic photocurable resin).

熱塑性樹脂之例係如:聚乙烯、聚丙烯、乙烯或丙烯與例如乙酸乙酯、α- 烯烴、(甲基)丙烯酸酯等其他乙烯系單體之共聚物,降冰片烯類之加成聚合物,降冰片烯類與α-烯烴之加成共聚物,降冰片烯類之開環聚合物加氫聚合物,環戊二烯之開環聚合物加氫聚合物,環己二烯之開環聚合物加氫聚合物等聚烯烴;聚氯乙烯、聚偏氯乙烯等含氯樹脂;聚苯乙烯、AS樹脂、ABS樹脂、MS樹脂、MBS樹脂等苯乙烯樹脂;聚丙烯酸、聚甲基丙烯酸、聚甲基丙烯酸甲酯等(甲基)丙烯酸樹脂;由芳族二羥基化合物(例如:雙酚A)與碳醯氯或碳酸二苯酯所製造之芳族聚碳酸酯等聚碳酸酯;尼龍4、尼龍6、尼龍8、尼龍11、尼龍12、尼龍66等聚醯胺;聚醚醯亞胺等熱塑性聚醯亞胺;聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯;以及該等之混合物等。Examples of thermoplastic resins are: polyethylene, polypropylene, ethylene or propylene with, for example, ethyl acetate, alpha- Copolymers of other vinyl monomers such as olefins and (meth) acrylates, addition polymers of norbornenes, addition copolymers of norbornenes and α-olefins, ring-opening polymerization of norbornenes Hydrogenated polymer, cyclopentadiene ring-opening polymer hydrogenated polymer, cyclohexadiene ring-opening polymer hydrogenated polymer and other polyolefin; polyvinyl chloride, polyvinylidene chloride and other chlorine-containing resin; Styrene resin such as polystyrene, AS resin, ABS resin, MS resin, MBS resin; (meth)acrylic resin such as polyacrylic acid, polymethacrylic acid, polymethyl methacrylate, etc.; by aromatic dihydroxy compound (for example) : bisphenol A) polycarbonate such as aromatic polycarbonate produced by carbon chlorohydrin or diphenyl carbonate; polyamines such as nylon 4, nylon 6, nylon 8, nylon 11, nylon 12, nylon 66; Thermoplastic polyimine such as ether quinone; polyester such as polyethylene terephthalate or polybutylene terephthalate; and mixtures thereof.

該等樹脂中,以(甲基)丙烯酸樹脂為佳。Among these resins, a (meth)acrylic resin is preferred.

熱硬化性樹脂之例係如:環氧樹脂(例如:雙酚A型環氧樹脂、雙酚F型環氧樹脂、氫化雙酚A型環氧樹脂、酚醛型環氧樹脂等);熱硬化性聚醯亞胺(例如:均苯四甲酸酐與雙(4-胺基苯基)醚之縮聚物等);聚胺基甲酸酯;酚樹脂;胺基樹脂(例如:三聚氰胺樹脂、脲樹脂等),其中以環氧樹脂為佳。Examples of thermosetting resins are epoxy resins (for example, bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, phenolic epoxy resin, etc.); thermosetting Polyimine (for example, polycondensate of pyromellitic anhydride and bis(4-aminophenyl)ether); polyurethane; phenol resin; amine resin (for example: melamine resin, urea) Resin, etc.), of which epoxy resin is preferred.

本發明之樹脂組成物中,相對於樹脂,本發明之樹脂用抗靜電劑之含量為0.05至50重量%,以0.5至25重量%為佳,以2至10重量%為特佳。In the resin composition of the present invention, the antistatic agent for the resin of the present invention is contained in an amount of 0.05 to 50% by weight, preferably 0.5 to 25% by weight, particularly preferably 2 to 10% by weight based on the resin.

[實施例][Examples]

以下,根據實施例具體說明本發明,惟本發明並不受限於該等實施例。另外,在以下實施例中,表面電阻值係使用三菱化學(股)製造之HirestaHT-210,於施加電壓500V下測定。Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to the examples. Further, in the following examples, the surface resistance value was measured using an IrrestaHT-210 manufactured by Mitsubishi Chemical Corporation at an applied voltage of 500V.

[實施例1][Example 1]

將180.6g(0.4莫耳)之Arquad 210-80E[氯化(二癸基二甲基)銨之含乙醇水溶液(濃度80.2%),註冊商標;LION AKZO(股)製造]、48.6g(0.6莫耳)之硫氰酸鈉以及115.4g之離子交換水混合,於25℃攪拌1小時。反應結束後,以分液操作分離有機層,並以115.4g之離子交換水清洗2次。將所得有機層在減壓下濃縮,得到常溫下為液體之硫氰酸(二癸基二甲基)銨(以下簡稱為DDDMA-SCN)146.2g(收率為95.0%)。以下呈示DDDMA-SCN之NMR數據以及熔點數據。180.6 g (0.4 mol) of Arquad 210-80E [dichlorodimethylammonium chloride-containing aqueous solution of ethanol (concentration 80.2%), registered trademark; manufactured by LION AKZO Co., Ltd.], 48.6 g (0.6 Sodium thiocyanate and 115.4 g of ion-exchanged water were mixed and stirred at 25 ° C for 1 hour. After completion of the reaction, the organic layer was separated by a liquid separation operation and washed twice with 115.4 g of ion-exchanged water. The obtained organic layer was concentrated under reduced pressure to give 146.2 g (yield: 95.0%) of dimethyl thiocyanate (hereinafter referred to as DDDMA-SCN) which was liquid at normal temperature. The NMR data of DDDMA-SCN and the melting point data are presented below.

1 H-NMR (CDCl3 )σ:0.89 (t, 6H)、1.26-1.39 (m, 28H)、1.75-1.78 (m, 4H)、3.30 (s, 6H)、3.42-3.46 (m, 4H) 1 H-NMR (CDCl 3 ) σ: 0.89 (t, 6H), 1.26-1.39 (m, 28H), 1.75-1.78 (m, 4H), 3.30 (s, 6H), 3.42-3.46 (m, 4H)

熔點:23℃Melting point: 23 ° C

[實施例2][Embodiment 2]

於100重量份之2液交聯型丙烯酸黏著劑SK-DYNE 909A(註冊商標;綜研化學(股)製造)中,添加5重量份之DDDMA-SCN、0.2重量份之丙烯酸樹脂用硬化劑L-45(綜研化學(股)製造)、以及150重量份作為稀釋溶劑之乙酸乙酯/甲乙酮(50/50),調製成黏著劑塗佈液。將該黏著劑塗佈液以棒塗器塗佈在聚酯膜上使乾燥後之膜厚度約成為10 μm,其後在80℃下加熱2分鐘使之硬化而製成評估用試驗膜。將製成之試驗膜在15至20℃、50% RH之環境中保持24小時後,於20℃、50% RH下測定塗佈面之表面電阻值。在透明性方面,以目視觀察,透明時為「○」,不透明時為「×」。並將其結果示於表1。To 100 parts by weight of a two-liquid cross-linking type acrylic adhesive SK-DYNE 909A (registered trademark; manufactured by Soken Chemical Co., Ltd.), 5 parts by weight of DDDMA-SCN and 0.2 parts by weight of a hardener L-based for acrylic resin are added. 45 (manufactured by Soken Chemical Co., Ltd.) and 150 parts by weight of ethyl acetate/methyl ethyl ketone (50/50) as a diluent solvent to prepare an adhesive coating liquid. This adhesive coating liquid was applied onto a polyester film by a bar coater to have a film thickness of about 10 μm after drying, and then heated at 80 ° C for 2 minutes to be hardened to prepare a test film for evaluation. The test film thus prepared was kept in an environment of 15 to 20 ° C and 50% RH for 24 hours, and then the surface resistance value of the coated surface was measured at 20 ° C and 50% RH. In terms of transparency, it is visually observed that "○" when transparent, and "x" when it is opaque. The results are shown in Table 1.

[比較例1]以及[比較例2][Comparative Example 1] and [Comparative Example 2]

除了使用表1所示之抗靜電劑取代實施例2所記載之DDDMA-SCN之外,進行與實施例2之相同操作製作試驗膜,對於該試驗膜進行與實施例2相同之表面電阻值測定。並將該等結果示於表1。同時,表1中之DDDMA-NO3 與DDDMA-PTS分別表示硝酸(二癸基二甲基)銨與對甲苯磺酸(二癸基二甲基)銨。A test film was produced in the same manner as in Example 2 except that the antistatic agent shown in Table 1 was used instead of the DDDMA-SCN described in Example 2, and the same surface resistance value as in Example 2 was measured for the test film. . The results are shown in Table 1. Meanwhile, DDDMA-NO 3 and DDDMA-PTS in Table 1 represent (didecyldimethyl)ammonium nitrate and (didecyldimethyl)ammonium p-toluenesulfonate, respectively.

由表1之結果可知,添加本發明之樹脂用抗靜電劑的丙烯酸樹脂組成物,與使用硫氰酸根離子以外者作為陰離子之銨鹽的情況相比,表面電阻值雖呈示略等程度之值,惟在樹脂之透明性方面較佳。As is clear from the results of Table 1, the surface resistivity of the acrylic resin composition to which the antistatic agent for a resin of the present invention is added is a slight value compared with the case where an ammonium salt of an anion other than the thiocyanate ion is used. However, it is preferable in terms of transparency of the resin.

[實施例3][Example 3]

將100重量份之雙酚A型環氧樹脂EPIKOTE 828(環氧當量186g/eq,註冊商標;日本環氧樹脂(股)製造)、14.1重量份作為硬化劑之亞胺基雙丙胺以及5.7重量份之DDDMA-SCN(相對於樹脂為5重量%)混合,得到環氧樹脂組成物。將該環氧樹脂組成物注入直徑50mm×深度5mm之圓形模型中,在50℃加熱1小時,再於100℃加熱6小時使之熱硬化,製成評估用試驗片。將製成之試驗片在23℃、50% RH之環境下放置6小時後,在23℃、50% RH下測定試驗片之表面電阻。在透明性方面,以目視觀察,透明時為「○」,不透明時為「×」。並將其結果示於表2。100 parts by weight of bisphenol A type epoxy resin EPIKOTE 828 (epoxy equivalent: 186 g/eq, registered trademark; manufactured by Nippon Epoxy Co., Ltd.), 14.1 parts by weight of imino dipropylamine as a hardening agent, and 5.7 weight The DDDMA-SCN (5% by weight relative to the resin) was mixed to obtain an epoxy resin composition. This epoxy resin composition was poured into a circular mold having a diameter of 50 mm and a depth of 5 mm, and heated at 50 ° C for 1 hour, and further heated at 100 ° C for 6 hours to be thermally cured to prepare a test piece for evaluation. The prepared test piece was allowed to stand in an environment of 23 ° C and 50% RH for 6 hours, and then the surface resistance of the test piece was measured at 23 ° C and 50% RH. In terms of transparency, it is visually observed that "○" when transparent, and "x" when it is opaque. The results are shown in Table 2.

[比較例3]以及[比較例4][Comparative Example 3] and [Comparative Example 4]

除了使用表2所示之抗靜電劑取代實施例3所記載之DDDMA-SCN之外,進行與實施例3之相同操作製作試驗片,對於該試驗片進行與實施例3相同之表面電阻值測定。在透明性方面,亦以與實施例3之相同方法進行,並將該等之結果示於表2。A test piece was produced in the same manner as in Example 3 except that the antistatic agent shown in Table 2 was used instead of the DDDMA-SCN described in Example 3, and the same surface resistance value as in Example 3 was measured for the test piece. . In terms of transparency, the same procedure as in Example 3 was also carried out, and the results of the results are shown in Table 2.

由表2之結果可知,添加本發明之樹脂用抗靜電劑的環氧樹脂組成物,與使用硫氰酸根離子以外者作為陰離子之銨鹽的情況相比,呈示同等程度之透明性以及低表面電阻值。As is clear from the results of Table 2, the epoxy resin composition to which the antistatic agent for a resin of the present invention is added exhibits the same degree of transparency and low surface as compared with the case of using an ammonium salt other than thiocyanate ion as an anion. resistance.

[產業上之可利用性][Industrial availability]

由於本發明之銨鹽在常溫下為液體,因此操作容易而可期待運用在各種領域。含有該銨鹽之樹脂用抗靜電劑在無損及樹脂透明性的情況下,可對樹脂賦予優異之抗靜電功能。另外,含有該樹脂用抗靜電劑之樹脂組成物具透明性,係顯示低表面電阻值之抗靜電性者。Since the ammonium salt of the present invention is a liquid at normal temperature, it is easy to handle and can be expected to be used in various fields. The antistatic agent for a resin containing the ammonium salt imparts an excellent antistatic function to the resin without impairing the transparency of the resin. Further, the resin composition containing the antistatic agent for a resin has transparency and is an antistatic property which exhibits a low surface resistance value.

Claims (3)

一種化合物,其係硫氰酸(二癸基二甲基)銨。A compound which is (didecyldimethyl)ammonium thiocyanate. 一種樹脂用抗靜電劑,其特徵係:含有硫氰酸(二癸基二甲基)銨作為有效成分。An antistatic agent for a resin characterized by containing (dimercaptodimethylammonium) thiocyanate as an active ingredient. 一種抗靜電性樹脂組成物,其特徵係:含有如申請專利範圍第2項之樹脂用抗靜電劑。An antistatic resin composition characterized by containing an antistatic agent for a resin as in the second aspect of the patent application.
TW097125018A 2007-07-05 2008-07-03 Ammonium salt and antistatic composition containing same TWI423950B (en)

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