TWI421968B - 基板供給裝置 - Google Patents
基板供給裝置 Download PDFInfo
- Publication number
- TWI421968B TWI421968B TW101121540A TW101121540A TWI421968B TW I421968 B TWI421968 B TW I421968B TW 101121540 A TW101121540 A TW 101121540A TW 101121540 A TW101121540 A TW 101121540A TW I421968 B TWI421968 B TW I421968B
- Authority
- TW
- Taiwan
- Prior art keywords
- platen
- substrate
- small
- supply device
- pin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Description
本發明係關於用以對加工基板之裝置供給及排出基板的基板供給裝置。
平面顯示器之製造等中,具有使用模具塗裝機於玻璃基板進行塗裝之步驟。為了於基板形成厚度均一之塗膜,有必要移動模具頭,而將基板正確地定位固持使基板與模具頭之間隙保持固定。因此,如同特開2002-200450號公報所揭示,一般係使用於固持基板之台板上固定有用以使模具頭移動之軌道的裝置。
又,為了於如前述之台板上配置及排出(交換)基板,如同例如特開平5-45641號公報所揭示,設置由台板藉由突出之銷舉起基板並插入機器人之臂取出基板之構造。惟,為了使塗裝周期縮短而於塗佈了塗料後立刻由銷舉起基板,則基板會彎曲且在塗料朝凹陷部分流動之狀態下乾燥,因此膜厚會變得不均勻。故,由於基板之塗裝周期之縮短會犧牲膜厚之均勻性,因此製造能力無法提升。
於特開2002-102771號公報中揭示有於大台板上設置載置基板之2個平台,並配置有模具塗裝機而使其可於2個平台上移動的裝置。該裝置中,由於只要在其中一個平台塗佈基板時,交換另一個平台之基板即可,因此處理能力
提高。惟,必須要有對2個平台分別交換基板之機器人,因此會有裝置變為大型化且高價格之問題。又,由於模具頭之移動量大亦容易產生誤差。
有鑑於前述問題點,本發明以提供一種可於短時間交換基板的基板供給裝置為課題。
為解決前述課題,本發明之基板供給裝置係包含有:複數臂,係對稱地配置於旋轉軸周圍且設置成可一體地旋轉及升降;複數小台板,分別以具有遊隙之方式支撐於前述臂且可用以固持基板;及主台板,係藉由前述臂之旋轉及升降來載置前述小台板,且具有將前述小台板於前述遊隙之範圍內定位並固持的台板固持機構者。
根據該構成,由於在固持於小台板之狀態下將基板於塗佈裝置或加工裝置供給或排出,因此可於塗佈(加工)後直接不彎曲基板而將其排出,並供給下個基板。因此,不縮短塗佈(加工)後舉起基板為止之時間而可縮短塗佈周期。又,藉由設置小台板與臂之間之遊隙可於主台板上微調小台板之位置或姿勢,且正確地定位塗裝或加工時之基板之位置及姿勢。又,本發明之基板供給裝置,處理機板之基器人只要一台即可,由於不用加大塗裝裝置或加工裝置之可動範圍,因此可便宜地提供。
又,本發明之基板供給裝置中,前述小台板內藏有突
出於表面且而可舉起前述基板的支撐銷,該基板供給裝置更具有驅動機構,該驅動機構配置為當前述臂之一者將前述小台板固持於前述主台板之上時位於其他前述臂所支撐之前述小台板的下側,且具有可推升前述支撐銷的驅動銷,且前述驅動銷與前述支撐銷係構成為藉由磁力相互吸著。
藉由該構成,由於可藉由磁力配合驅動銷之後退而確實使支撐銷後退,因此不需要於小台板之內部配置對支撐銷賦予勢能支構件,且構造簡單,而小台板之厚度不會變大。
又,本發明之基板供給裝置中,前述台板固持機構具有可藉由空氣壓來支撐前述小台板之空氣墊。
藉由該構成,支撐小台板之重量之部分為非接觸,因此能防止磨損所造成之固持基板之高度的變化。
又本發明之基板供給裝置中,前述主台板係可支撐用以加工前述基板之裝置。
根據該構成,由於主台板與加工裝置之位置關係不變,因此藉由於小台板定位基板之位置且於主台板定位小台板之位置,可保證基板與加工裝置間之位置關係。
如同前述,由於將複數小台板藉由臂之旋轉(回旋)配置於主台板上,因此可將朝小台板之基板之配置與基板之加工並行實施。又,由於藉由於小台板與臂之間設置遊隙,可於主台板上微調小台板,因此可於加工時精確度佳地固
持基板。
第1圖係具有本發明之1個實施形態之基板供給裝置的基板塗裝裝置之透視圖。
第2圖係第1圖之基板塗裝裝置之側面圖。
第3圖係第1圖之基板塗裝裝置之部分擴大剖面圖。
藉此,針對發明之實施形態一面參考圖式一面加以說明。於第1及第2圖顯示具有本發明之1個實施形態之基板供給裝置1的基板塗裝裝置。基板供給裝置1係包含:旋轉桌3,係以藉由旋轉驅動部2可於垂直之軸周圍旋轉且垂直地升降的方式被支撐者;2對臂4,係2支成對地設置且由旋轉桌3向直徑方向外側延伸;小台板6,分別由臂4之各一對所支撐且可吸附固持玻璃基板5;主台板7,可固持其中一個小台板6;及銷驅動機構8,用以由另一個小台板6將玻璃基板5舉起。
臂4之對係於旋轉驅動部2之旋轉軸周圍相互成對,亦即,以180°之角度配置。主台板7與銷驅動機構8係配置於旋轉驅動部之軸周圍之對稱位置,其中一個小台板6固持於主台板7上時,銷驅動機構8會位於另一個小台板6正下方的位置。
主台板7及銷驅動機構8係分別具有抵接於小台板6之側邊而可決定小台板6之水平位置及方向的複數位置決定
裝置9。位置決定裝置9係可調節與個別小台板6之抵接位置的致動器,可與設在主台板7、銷驅動機構8及旋轉桌3之氣缸10連動,而將小台板6之水平位置及方向決定於與臂4之遊隙之範圍內。
小台板6於底面具有承接臂4之溝11,而溝11以之寬度較臂4之寬度寬且具有遊隙之方式被支撐。因此,小台板6可於臂4上於該遊隙之範圍內水平移動或水平旋轉。
旋轉驅動部2係將旋轉桌3及臂4在上升至旋轉時沒有障礙物之高度(第2圖之二重虛線所示之位置)之狀態下180°旋轉,將小台板6配置於主台板7之上方後使旋轉桌3及臂4下降,藉此將小台板6載置於主台板7上,再將臂4下降至與溝11間產生間隙之位置。
主台板7具有藉由空氣壓以非接觸狀態支撐小台板6的空氣墊12。空氣墊12係固持為藉由個別空氣壓之調整等可調節高度,而調節使小台板6支上面呈預定高度之水平,小台板6係成為僅以空氣墊12之空氣壓固持之狀態。
空氣墊12即位置決定裝置9可對每個小台板6設定不同固持位置。藉此,即使於各小台板6有輕微傾斜或形狀之不同,吸附於小台板6之玻璃基板5可相對於主台板7固持為一定之位置及方向。
又,本實施形態中,由於在空氣墊12係藉由空氣壓以非接觸之狀態承受小台板6之重量,因此小台板6及空氣墊12不會有摩擦損耗,一旦,於每個小台板6設定了空氣墊12之高度,則可每次將玻璃基板5正確地固持於同樣位置。
又,位置決定裝置9或氣缸10之位置決定亦以非常小之外力而可瞬間進行。
主台板7具有可引導門形行走框架14之引導軌15,該門形行走框架14可固持對玻璃基板5進行塗裝之模具頭13。亦即,主台板7支撐藉由使模具頭13移動對玻璃基板5進行塗裝的加工裝置,使模具頭13相對於主台板7嚴格地平行移動。因此膜具頭13可於正確地定位固持於主台板7上之玻璃基板5形成均勻的塗膜。
又,於第3圖係顯示小台板6之內部構造。小台板6係藉由銷驅動機構8驅動,且內藏有可將玻璃基板5由小台板6舉起之支撐銷16。支撐銷16係突出設置於可於埋在小台板6之引導筒17內滑動之滑塊18。滑塊18係於下側安裝有磁性金屬片19。
銷驅動機構8係具有突出設置於框架21上之驅動銷22,且該框架21係藉由氣缸20固持且可升降。於驅動銷22之前端安裝有可吸附磁性金屬片19之永久磁鐵23。
藉由使銷驅動機構8之框架21上升並以驅動銷22將支撐支撐銷16之圓柱8推升,而將玻璃基板5由小台板6舉起。接著,如第1圖所示,機器人手24插入玻璃基板5之下側而由小台板6上移除玻璃基板5。
接著,機器人手24將新的玻璃基板5載置於支撐銷16上。撤回機器人手24後,藉由銷驅動機構8使驅動銷22下降將支撐銷16容收於小台板6之內部,而玻璃基板5係載置於小台板6上。
此時,將機器人手24載置玻璃基板5之位置利用圖像處理技術或內藏於小台板6之位置決定機構(不圖示)等而正確地控制,藉此可將玻璃基板5相對於小台板6正確地定位並吸附固持。使玻璃基板5與小台板6之相對位置每次都相同,藉此僅於主台板7決定小台板6之位置,則主台板7與玻璃基板5之相對位置亦可每次都相同。
如此,本實施形態中,將固持了藉由模具頭13塗裝前之玻璃基板5的小台板6供給至用以塗裝玻璃基板5之主台板7,並將固持了塗裝後之玻璃基板5的小台板6由主台板7搬移出。
形成有塗膜之玻璃基板5係在固持於小台板6之狀態下直接藉由臂4旋轉180°來移動至銷驅動機構8上後,藉由支撐銷16由小台板6舉起俾與新的玻璃基板5進行交換。亦即,經塗裝之玻璃基板5在臂4旋轉期間係固持於小台板6之狀態而並非將經塗裝塗料後之玻璃基板5立刻舉起。因此,玻璃基板5會保持固持在小台板6之平坦之狀態直接讓塗料乾燥。之後,玻璃基板5即使藉由銷驅動機構8舉起而產生彎曲,由於塗料已經乾燥,因此塗料不會流動至凹陷部分而造成膜後不均勻。
因此,可一面延長玻璃基板5之塗膜到藉由支撐銷16舉起為止之時間,一面增加塗裝之玻璃基板5之片數。
在此,本發明中,由於構成為在與臂4相對之遊隙之中定位小台板6,而臂4不會完全離開小台板6,因此不需要將臂4相對於小台板6定位、或是用以確保臂4之小台板6之固
持之特別之機構。
又,本實施形態中,固持於小台板6之厚度中之支撐銷16由於構成為以驅動銷22推升,因此銷驅動機構8之氣缸20之行程較小台板6之厚度小為佳,可減少驅動銷22之升降所需要之時間而可增加生產量。
又,驅動銷22之永久磁鐵23吸附於與支撐銷成一體移動之磁性金屬片19,因此驅動銷22之下降會使在重力之外將支撐銷16吸引至小台板6之中的力作用。藉此,即使沒有設置將支撐銷16朝容收方向賦予適能之彈簧等,亦可達成確實容收支撐銷16。因此,固持支撐銷16之構造簡單而可實現小台板6之薄型化。
1‧‧‧基板供給裝置
2‧‧‧旋轉驅動部
3‧‧‧旋轉桌
4‧‧‧臂
5‧‧‧玻璃基板
6‧‧‧小台板
7‧‧‧主台板
8‧‧‧銷驅動機構
9‧‧‧位置決定裝置
10‧‧‧氣缸
11‧‧‧溝
12‧‧‧空氣墊
13‧‧‧模具頭
14‧‧‧門形行走框架
15‧‧‧引導軌
16‧‧‧支撐銷
17‧‧‧引導筒
18‧‧‧滑塊
19‧‧‧磁性金屬片
20‧‧‧氣缸
21‧‧‧框架
22‧‧‧驅動銷
23‧‧‧永久磁鐵
24‧‧‧機器人手
第1圖係具有本發明之1個實施形態之基板供給裝置的基板塗裝裝置之透視圖。
第2圖係第1圖之基板塗裝裝置之側面圖。
第3圖係第1圖之基板塗裝裝置之部分擴大剖面圖。
1‧‧‧基板供給裝置
2‧‧‧旋轉驅動部
3‧‧‧旋轉桌
4‧‧‧臂
5‧‧‧玻璃基板
6‧‧‧小台板
7‧‧‧主台板
8‧‧‧銷驅動機構
9‧‧‧位置決定裝置
10‧‧‧氣缸
11‧‧‧溝
12‧‧‧空氣墊
13‧‧‧模具頭
14‧‧‧門形行走框架
15‧‧‧引導軌
21‧‧‧框架
22‧‧‧驅動銷
24‧‧‧機器人手
Claims (5)
- 一種基板供給裝置,其特徵在於包含有:複數臂,係對稱地配置於旋轉軸周圍且設置成可一體地旋轉及升降;複數小台板,分別以具有遊隙之方式支撐於前述臂且可用以吸附固持基板;及主台板,係藉由前述臂之旋轉及升降來載置吸附固持著前述基板之前述小台板,且具有將吸附固持著前述基板之前述小台板於前述遊隙之範圍內定位並固持的台板固持機構。
- 如申請專利範圍第1項之基板供給裝置,其中,前述小台板內藏有突出於表面且而可舉起前述基板的支撐銷,該基板供給裝置更具有驅動機構,該驅動機構配置為當前述臂之一者將前述小台板固持於前述主台板之上時位於其他前述臂所支撐之前述小台板的下側,且具有可推升前述支撐銷的驅動銷,且前述驅動銷與前述支撐銷係構成為藉由磁力相互吸著。
- 如申請專利範圍第1項之基板供給裝置,其中前述台板固持機構具有可藉由空氣壓來支撐前述小台板之空氣墊。
- 如申請專利範圍第2項之基板供給裝置,其中前述台板固持機構具有可藉由空氣壓來支撐前述小台板之空氣墊。
- 如申請專利範圍第1項至第4項中任一項之基板供給裝置,其中前述主台板係可支撐用以加工前述基板之裝置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011197396A JP5243585B2 (ja) | 2011-09-09 | 2011-09-09 | 基板供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201312689A TW201312689A (zh) | 2013-03-16 |
TWI421968B true TWI421968B (zh) | 2014-01-01 |
Family
ID=47921832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101121540A TWI421968B (zh) | 2011-09-09 | 2012-06-15 | 基板供給裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5243585B2 (zh) |
KR (1) | KR101318600B1 (zh) |
CN (1) | CN102992642B (zh) |
TW (1) | TWI421968B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102278083B1 (ko) * | 2019-05-23 | 2021-07-16 | 세메스 주식회사 | 기판 지지 유닛 및 이를 가지는 기판 처리 장치 |
KR102303595B1 (ko) * | 2019-06-12 | 2021-09-23 | 세메스 주식회사 | 지지유닛 및 기판 처리 장치 |
CN112191427A (zh) * | 2020-09-27 | 2021-01-08 | 铜陵市肆得科技有限责任公司 | 一种金属冲压件加工用喷涂设备 |
JP2023002003A (ja) * | 2021-06-22 | 2023-01-10 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002102771A (ja) * | 2000-09-27 | 2002-04-09 | Toray Ind Inc | 塗布装置および塗布方法、ならびにカラーフィルター製造装置および製造方法 |
JP2003068620A (ja) * | 2001-08-28 | 2003-03-07 | Sendai Nikon:Kk | 露光装置 |
JP2007042799A (ja) * | 2005-08-02 | 2007-02-15 | Hitachi High-Technologies Corp | 真空搬送装置およびこれを備えた荷電粒子線検査装置 |
JP2007172292A (ja) * | 2005-12-22 | 2007-07-05 | Hitachi Ltd | 情報処理装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4435730B2 (ja) * | 2005-11-22 | 2010-03-24 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | 基板検査装置 |
JP4665037B2 (ja) * | 2009-02-06 | 2011-04-06 | 東京エレクトロン株式会社 | 基板処理システム |
-
2011
- 2011-09-09 JP JP2011197396A patent/JP5243585B2/ja active Active
-
2012
- 2012-06-15 KR KR1020120064233A patent/KR101318600B1/ko active IP Right Grant
- 2012-06-15 TW TW101121540A patent/TWI421968B/zh active
- 2012-09-06 CN CN201210327831.0A patent/CN102992642B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002102771A (ja) * | 2000-09-27 | 2002-04-09 | Toray Ind Inc | 塗布装置および塗布方法、ならびにカラーフィルター製造装置および製造方法 |
JP2003068620A (ja) * | 2001-08-28 | 2003-03-07 | Sendai Nikon:Kk | 露光装置 |
JP2007042799A (ja) * | 2005-08-02 | 2007-02-15 | Hitachi High-Technologies Corp | 真空搬送装置およびこれを備えた荷電粒子線検査装置 |
JP2007172292A (ja) * | 2005-12-22 | 2007-07-05 | Hitachi Ltd | 情報処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102992642B (zh) | 2015-01-14 |
TW201312689A (zh) | 2013-03-16 |
JP5243585B2 (ja) | 2013-07-24 |
JP2013058690A (ja) | 2013-03-28 |
KR20130028634A (ko) | 2013-03-19 |
KR101318600B1 (ko) | 2013-10-15 |
CN102992642A (zh) | 2013-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI421968B (zh) | 基板供給裝置 | |
TWI551462B (zh) | 圖案形成裝置及圖案形成方法 | |
JP2010050436A5 (zh) | ||
TW201828397A (zh) | 塗布裝置及塗布方法 | |
KR101771838B1 (ko) | 박리 장치 | |
JP2007088344A5 (zh) | ||
TWI605738B (zh) | 轉印裝置及轉印方法 | |
JP6151053B2 (ja) | 塗布装置、塗布方法およびディスプレイ用部材の製造方法 | |
KR101074169B1 (ko) | 코팅 장치의 코팅 높이 조정 장치 및 방법, 및 이를 구비한 코팅 장치 | |
KR101830009B1 (ko) | 전사 장치 및 전사 방법 | |
JP2013115125A (ja) | 塗布装置 | |
JP2006303341A (ja) | 導電性ボール配列装置 | |
KR101489055B1 (ko) | 패턴 형성 장치 | |
TW201446475A (zh) | 圖案形成裝置及圖案形成方法 | |
JP5977044B2 (ja) | 印刷装置および印刷方法 | |
KR102317003B1 (ko) | 기판 처리 장치 | |
KR101485654B1 (ko) | 패턴 형성 방법 및 패턴 형성 장치 | |
JP2009082794A (ja) | 塗液の塗布装置および口金の移載装置 | |
JP5878822B2 (ja) | パターン転写装置およびパターン転写方法 | |
TW202408668A (zh) | 塗布裝置 | |
JP4342210B2 (ja) | ステージ装置、それを用いたペースト塗布装置、及びペースト塗布方法 | |
JP2010279865A (ja) | 塗布液の塗布装置及び吐出量調整方法 | |
TW202031366A (zh) | 塗布裝置 | |
JP2010118478A (ja) | 基板浮上装置、及び、基板検査装置 | |
JP2022163357A (ja) | 塗布装置、塗布方法およびディスプレイ用部材の製造方法 |