TWI416122B - Probe card and inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card and an inspection device easy to exchange, position, and assemble probes. <P>SOLUTION: The probe card, which is a probe card including a plurality of pogo pins contacting electrically with each electrode of an inspected body, includes a supporting substrate supporting the each pogo pin, and the supporting substrate concerned includes a strong supporting member positioning and supporting the lower part of the each pogo pin and a sheet-like flexible supporting member supporting an intermediate part of the each pogo pin. While, the inspection device, which is an inspection device including a probe card, utilizes the probe card as the probe card concerned. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

Probe card and inspection device

The present invention relates to a probe card that is inspected in electrical contact with an inspection object such as a liquid crystal panel or an integrated circuit, and an inspection device using the probe card.

An inspection apparatus having a probe card integrally supporting a plurality of pogo pins is well known. As an example of such an inspection apparatus, there is a probe of Patent Document 1. The detector is outlined in accordance with Figure 1.

The probe 1 shown in Fig. 1 is mainly composed of a main body 2, an XYZθ gantry 3, a jig 4, a probe card 5, and a probe card holder 6.

The main body 2 is a member for supporting the XYZθ gantry 3, the probe card 5, and the like. The main body 2 mainly includes a lower base 7, an upper base 8, and a stay 9 for supporting between the lower base 7 and the upper base 8. A circular opening 8A is provided in the center of the upper base 8. A fitting recess 8B for attaching the probe card holder 6 is provided on the upper side of the inner periphery of the opening 8A.

The XYZθ gantry 3 is a gantry that moves the jig 4 in the XYZ-axis direction and rotates it. The jig 4 is a mechanism for holding the wafer 11 by means of vacuum suction or the like. A heating device (not shown) is provided inside the jig 4.

The probe card 5 is a member for electrically connecting the inspection object to the test device. The probe card 5 is composed of a disk-shaped wiring substrate 13 and a ceramic substrate 14.

The wiring board 13 is a member for arranging the signal line or the like of the pogo pin 12 and supporting the entire probe card 5 via the probe card holder 6 attached to the main body 2.

The ceramic substrate 14 is a member for supporting the pogo pins 12. The ceramic substrate 14 has a shape such as a pattern or a square shape, and its upper side surface is integrally formed with the lower side surface of the wiring substrate 13. A plurality of pogo pins 12 are attached to the ceramic substrate 14. The pogo pin 12 is provided at a position corresponding to an electrode pad (not shown) of a semiconductor element formed on the wafer 11. The pogo pin 12 is inspected by contact with an electrode pad of the wafer 11 placed on the upper side of the jig 4 controlled by the XYZθ gantry 3.

The ceramic substrate 14 is generally formed into a structure as shown in Fig. 2. That is, the ceramic substrate 14 is composed of the upper ceramic probe card 16, the middle ceramic probe card 17, the lower ceramic probe card 18, the guide pin 19, and the fixing screw 20.

The upper ceramic probe card 16 is for supporting a ceramic plate on which a plurality of upper pins 12 are disposed. The upper ceramic probe card 16 is provided with an upper support hole 16A for fitting the upper portion of the spring pin 12 to be supported by the number of the spring pins 12.

The middle-stage ceramic probe card 17 is a ceramic plate for supporting the intermediate portion of each of the pogo pins 12. In the middle-stage ceramic probe card 17 at a position coincident with the upper support hole 16A of the upper ceramic probe card 16, only the same number of intermediate portion support holes 17A for supporting the intermediate portion of the spring pin 12 are provided. .

The lower stage ceramic probe card 18 is used to support a ceramic plate provided with a plurality of lower portions of the pogo pins 12. A recess 18A is provided in the center of the lower ceramic probe card 18, and the recess 18A is at a position coincident with the intermediate support hole 17A of the middle ceramic probe card 17, and only the same number of the lower portion of the spring pin 12 is provided. The lower support hole 18B that is fitted and supported.

The guide pin 19 is a latch for correctly positioning each other when the upper ceramic probe card 16 is overlapped with the middle ceramic probe card 17 and the lower ceramic probe card 18. The fixing screw 20 is a screw for fixing the upper ceramic probe card 16 and the middle ceramic probe card 17, and the middle ceramic probe card 17 and the lower ceramic probe card 18 to each other.

In the probe card 5 of the above configuration, each of the pogo pins 12 is supported by the respective support holes 16A, 17A, and 18B of the ceramic probe cards 16, 17, 18, and the lower end of each of the pogo pins 12 is The electrode pads of the wafer 11 are in contact.

Further, the support structure of the probe also has the structures of Patent Documents 2 and 3. In the probe cards of Patent Documents 2 and 3, the probe is supported by the upper and lower portions.

In the probe card of Patent Document 2, as shown in FIG. 3, the contact portion 23 of the probe 22 is supported by the lower guide 24, and the connecting portion 25 is supported by the upper guide 26.

Further, in the probe card of Patent Document 3, as shown in Fig. 4, the lower probe needle contact portion 30 of the lower side probe needle 29 of the vertical type coil spring probe 28 is supported by the lower guide plate 32 of the outer casing 31. The upper detecting needle portion 34 of the upper detecting needle 33 is supported by the upper guide 35 of the outer casing 31.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-162476

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-2852

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2006-208329

In the probe card 5 shown in Fig. 2, when the pogo pins 12 are supported by the three ceramic probe cards 16, 17, 18, the positions of the support holes of the ceramic probe cards 16, 17, and 18 are inconsistent. There is a case where the insertion of the pogo pin 12 is not easy to insert, or it is hard to insert and generate pressure, so that the ceramic probe card is broken. Specifically, the clearance between the probe diameter and the support aperture is usually set at about 5 μm. Once the ceramic probe cards 16, 17, 18 are slightly dislocated at the time of assembly, there is a spring pin 12 Pressure is generated between the side surface of the support hole and the problem of partial wear of the probe of the lower stage ceramic probe card 18, reduction of the probe, unevenness, positional displacement, and the like.

Furthermore, since each of the ceramic probe cards 16, 17, and 18 requires high dimensional accuracy, there is a problem that the manufacturing cost is increased. Further, in the case where the pogo pin 12 is to be replaced, the ceramic probe cards 16, 17, and 18 must be disassembled, so that the replacement of the pogo pins 12 is not easy.

Further, in the probe card of Patent Document 2, the contact portion 23 of the probe 22 is supported by the lower guide 24, and on the other hand, the connecting portion 25 is supported by the upper guide 26, so the intermediate portion of the probe 22 It may become unstable, and there may be a problem that the position of the probe 22 is shifted or the contact is poor.

Further, in the probe card of Patent Document 3, the lower probe needle contact portion 30 of the lower side probe needle 29 of the vertical type coil spring probe 28 is supported by the lower guide plate 32 of the outer casing 31, and on the other hand, the upper side The upper detecting needle portion 34 of the detecting needle 33 is supported by the upper guide 35 of the outer casing 31, and therefore, as in Patent Document 2, the intermediate portion of the vertical type helical spring probe 28 becomes unstable, which may cause vertical Problems such as offset or poor contact of the coil spring probe 28.

The probe card of the present invention is a probe card including a plurality of pogo pins that can be electrically contacted with the electrodes of the test object, and is provided with a support substrate for supporting the respective spring pins, and the support substrate is provided with a stable support member that is positioned to support the lower portion of each of the spring pins, and a sheet-like support member for supporting the intermediate portion of each of the spring pins and having flexibility.

Moreover, the inspection apparatus of the present invention is provided with a probe card, and the probe card is a probe card using the present invention.

According to the above configuration, the present invention is to form the sheet-like supporting member at the intermediate portion of the pogo pin to form a flexible sheet-like member, whereby all the pogo pins can be easily inserted into the respective supporting holes, since the pogo pins are softly supported, Therefore, it is possible to eliminate the reduction of the pogo pins of the support member due to the inconsistent position of the guide holes of the sheet-like support members, and to prevent the spring pins from being slid, and to easily fix the spring pins.

Hereinafter, the probe card and the inspection apparatus according to the embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]

First, a first embodiment of the present invention will be described. The inspection apparatus of this embodiment can use all the inspection apparatuses provided with the probe card of this embodiment. In the following, the structure other than the probe card is the same as that of the probe of the patent document 1, and the same members as those of the probe of the patent document 1 are denoted by the same reference numerals, and the description thereof will be omitted, and the probe card will be mainly described.

Fig. 5 is a front cross-sectional view of the probe card of the embodiment, and Fig. 6 is a front cross-sectional view of the ceramic substrate of the probe card of the embodiment.

The probe card 41 of the present embodiment is mainly composed of a wiring board 42, a reinforcing member 43, and a ceramic substrate 44.

The wiring board 42 is a member for arranging a signal line or the like for electrically connecting the pogo pin 12 to the test device, and is attached to the probe card holder 6 side to support the entire probe card 41. The wiring board 42 is composed of a main board 42A and an intermediate board 42B.

The main substrate 42A is a member directly attached to the probe card holder 6 for supporting the intermediate substrate 42B, the ceramic substrate 44, and the like. A signal line or the like is disposed on the main substrate 42A.

The intermediate substrate 42B is a relay substrate for electrically connecting the pogo pins 12 and the wiring of the wiring substrate 42. An electrode pad 42C that is in electrical contact with the pogo pin 12 is provided on the lower side surface of the intermediate substrate 42B. The electrode pad 42C is a pad for electrically contacting the upper end portions of the plurality of pogo pins 12, respectively. Each of the electrode pads 42C is provided at a position that coincides with each of the pogo pins 12.

The reinforcing member 43 is a member for reinforcing the wiring substrate 42. The reinforcing member 43 is attached to the upper side surface of the wiring substrate 42 to reinforce the wiring substrate 42. The reinforcing member 43, the main substrate 42A, and the intermediate substrate 42B are integrally fixed by a fixing screw 46.

The ceramic substrate 44 is a member for properly supporting the respective spring pins 12. The ceramic substrate 44 is used to properly support the respective spring pins 12, and the upper end needle portions of the respective spring pins 12 are electrically in contact with the electrode pads 42C of the intermediate substrate 42B, respectively, so that the needle portions at the lower ends of the respective spring pins 12 are respectively inspected. Each electrode pad 11A of the wafer 11 of the target substrate is electrically contacted. The ceramic substrate 44 has a shape such as a circular shape or a square shape in accordance with the shape of the inspection target plate. The ceramic substrate 44 is composed of a ceramic base plate 48, an intermediate insulating sheet 49, an intermediate spacer 50, an upper insulating sheet 51, an upper spacer 52, a guide pin 53, and a fixing screw 54.

The ceramic base plate 48 is a support member that positions and holds the lower portion of each of the pogo pins 12 and allows them to slide. That is, the ceramic base plate 48 is a position maintaining guide for the lower portion of each of the pogo pins 12. The ceramic base plate 48 is formed in a flat plate shape, and a concave portion 48A is provided at the center thereof. The recess 48A is provided with a lower support hole 48B into which the lower portion of the pogo pin 12 is fitted and supported. The lower support hole 48B is provided with only the same number of electrode pads 11A as the electrode pads 11A of the wafer 11. Therefore, by fitting the lower portions of the respective pogo pins 12 into the respective lower support holes 48B, the lower end needle portions of the respective pogo pins 12 come into contact with the respective electrode pads 11A of the wafer 11. Further, due to the expansion and contraction function of each of the pogo pins 12, the lower portion of each of the pogo pins 12 slides in a state of being fitted into each of the lower support holes 48B in accordance with the expansion and contraction of the pogo pins 12.

The ceramic base plate 48 has a function as a position maintaining guide of the pogo pins 12 as described above, and has a function of thermal expansion of the wafer 11. That is, the ceramic base plate 48 has a thermal expansion coefficient which is consistent with the thermal expansion coefficient of the wafer 11, and can be thermally expanded at the same expansion ratio in accordance with the thermal expansion of the wafer 11 at a high temperature. Specifically, the ceramic base plate 48 is formed by selecting a material to form a coefficient of expansion that is small in thermal variation and that can vary with the wafer 11. Further, the ceramic base plate 48 has insulation properties and is set to maintain the strength of the preload of the pogo pins 12 at the time of assembly.

The intermediate insulating sheet 49 is a member for preventing a short circuit between the adjacent pogo pins 12 and maintaining the perpendicularity of the respective spring pins 12. The intermediate insulating sheet 49 is made of a synthetic resin film which is excellent in abrasion resistance and heat resistance, and has a thin structure such as a polyimide film.

The intermediate insulating sheet 49 is provided with the same number of guide holes 49A as the lower support hole 48B at a position coincident with the lower support hole 48B of the ceramic bottom plate 48. The diameter of the guide hole 49A is set to be substantially the same as the outer diameter of the pogo pin 12. Thereby, the pogo pin 12 can be inserted into the guide hole 49A to be firmly supported. Specifically, the intermediate insulating sheet 49 is made of a film-like heat-resistant material having a thickness of 100 μm or less.

The intermediate insulating sheet 49 is supported by sandwiching the peripheral edge portion thereof from the ceramic base plate 48 and the intermediate spacer 50. Thereby, the intermediate insulating sheet 49 supports the intermediate portion of each of the pogo pins 12.

The intermediate spacer 50 is a member that holds the intermediate insulating sheet 49 and the upper insulating sheet 51 at a predetermined interval, and sandwiches the intermediate insulating sheet 49 and the upper insulating sheet 51 together with the ceramic base 48 and the upper spacer 52. The intermediate spacer 50 is an annular shape forming a thick wall. Specifically, the intermediate spacer 50 has a shape in which a circular ring, a square ring, or the like is formed in conformity with the shape of the ceramic base plate 48. The thickness of the intermediate spacer 50 is configured to match the size of the pogo pin 12.

Similarly to the intermediate insulating sheet 49, the upper insulating sheet 51 is a member for preventing the short circuit between the adjacent spring pins 12 and maintaining the perpendicularity of the respective spring pins 12. Similarly to the intermediate insulating sheet 49, the upper insulating sheet 51 is made of a synthetic resin film having excellent abrasion resistance and heat resistance, and a thin structure such as a polyimide film.

The upper insulating sheet 51 is provided with the same number of guide holes 51A as the lower support holes 48B, and the guide holes 51A are the same as the guide holes 49A of the intermediate insulating sheet 49. The diameter of the guide hole 51A is set to be substantially the same as the outer diameter of the pogo pin 12. Thereby, the pogo pin 12 can be inserted into the guide hole 51A to be firmly supported. The upper insulating sheet 51 is specifically composed of a film-like heat-resistant material having a thickness of 100 μm or less.

The upper insulating sheet 51 is supported by sandwiching the peripheral portion thereof between the intermediate spacer 50 and the upper spacer 52. Thereby, the upper insulating sheet 51 supports the upper portions of the respective spring pins 12, and the upper ends of the respective spring pins 12 coincide with the electrode pads 42C of the intermediate substrate 42B.

The upper spacer 52 is a member that maintains the upper insulating sheet 51 and the intermediate substrate 42B at a predetermined interval and supports the upper insulating sheet 51 between the intermediate spacers 50. The upper spacer 52 is formed into a thick-walled ring shape similarly to the intermediate spacer 50. Specifically, the upper spacer 52 has a shape in which a circular ring, a square ring, or the like is formed in accordance with the shape of the ceramic base plate 48. The thickness of the upper spacer 52 is configured to match the size of the pogo pin 12.

The guide pin 53 is a latch that can be used to correctly position each other when the ceramic base plate 48 and the intermediate spacer 50 and the upper spacer 52 are overlapped. Further, the guide pin 53 penetrates the reinforcing member 43, the main substrate 42A, the intermediate substrate 42B, and the ceramic substrate 44, thereby realizing the positioning of each member of the probe card 41. The fixing screw 54 is a screw for fixing the entire ceramic substrate 44 integrally. The ceramic base plate 48, the intermediate insulating sheet 49, the intermediate spacer 50, the upper insulating sheet 51, and the upper spacer 52 are integrally fixed by a fixing screw 54, and are disposed to be detachably attached. Thereby, the insulating sheets 49, 51 and the intermediate spacers 50, 52 can be appropriately replaced. For example, the number of sheets of the insulating sheets 49, 51 is adjusted depending on the length of the pogo pins 12, and the spacers 50, 52 of the number and thickness of the insulating sheets 49, 51 are appropriately set. The thickness of the spacers 50, 52 is adjusted in accordance with the number of sheets of the insulating sheets 49, 51 and the size of the pogo pins 12.

A plurality of fixing screws 55 are inserted from the lower surface of the ceramic base plate 48 to penetrate the respective members, and then inserted into the reinforcing member 43, whereby the members of the probe card 41 are integrally assembled.

The probe card 41 configured as described above is incorporated in a probe or the like described in Patent Document 1, and is used for inspection of the wafer 11. Specifically, the wafer 11 is mounted on the jig 4 by a transport device (not shown). The jig 4 adsorbs the wafer 11 and is fixed, and is moved toward the pogo pin 12 side of the probe card 41 by the XYZθ gantry 3. At this time, the wafer 11 supported by the jig 4 is finely adjusted in the XY-axis direction and the rotational direction by the XYZθ gantry 3, and the electrode pads 11A of the wafer 11 are aligned with the respective pogo pins 12, and then the XYZ θ gantry 3 is used. The jigs 4 are raised to contact each other. Next, the test signal is applied to the wafer 11, and the output signal from the wafer 11 due to the test signal is detected, and the wafer 11 is inspected, that is, whether the integrated circuit formed on the wafer 11 is operating normally. .

The wafer 11 that has been inspected is removed by, for example, a transport device, and a new wafer 11 is mounted, and the above inspection is repeated.

On the other hand, in the ceramic substrate 44, when the pogo pins 12 are in contact with the electrode pads 11A of the wafer 11, the pogo pins 12 are compressed, but the lower portions of the pogo pins 12 are reliably supported by the ceramic base plates 48. Further, the intermediate portion and the upper portion of the pogo pin 12 are maintained perpendicularly by the intermediate insulating sheet 49 and the upper insulating sheet 51. Further, the upper and lower sides of the pogo pin 12 are held in contact with the electrode pad 42C and the ceramic base plate 48. Therefore, each of the pogo pins 12 is stably stretched.

Further, when the pogo pin 12 is to be replaced, the ceramic substrate 44 is removed from the wiring board 42, and the pogo pin 12 is taken up above the upper insulating sheet 51, and the new pogo pin 12 is inserted.

Further, in the case where the total length of the pogo pins 12 to be replaced is short, the intermediate spacer 50 and the upper spacer 52 are replaced with thinner members, and then the positions of the intermediate insulating sheets 49 and the upper insulating sheets 51 are adjusted to support The intermediate portion and the upper portion of the pogo pin 12 are adjusted.

As described above, by replacing the support members in the middle and the upper stage of the pogo pin 12 with the flexible sheet-like members, all the pogo pins 12 can be easily inserted into the respective support holes, and the pogo pins 12 can be flexibly supported. The reduction of the pogo 12 of the ceramic base plate 48 due to the inconsistent position of the guide holes of the respective support members can be eliminated, and the slippage is not smooth.

Further, in the probe card 41 including the vertical spring pin 12, the spring pin 12 is supported by the intermediate insulating sheet 49 and the upper insulating sheet 51. Therefore, the vertical holding of the pogo pin 12 can be realized without using a ceramic plate. And the contact of the adjacent pogo pins 12 with each other is prevented.

Further, since the pogo pin 12 is elastically supported by the intermediate insulating sheet 49 and the upper insulating sheet 51, and the upper portion of the pogo pin 12 is exposed on the upper portion of the ceramic substrate 44, the replacement of the pogo pin 12 can be easily performed.

Further, by using the intermediate spacer 50 and the upper spacer 52 which are set to have a thickness in accordance with the size of the pogo pin 12, the thickness of the ceramic substrate 44 can be freely adjusted in accordance with the size of the pogo pin 12.

In addition, the intermediate insulating sheet 49 and the upper insulating sheet 51 are easier to manufacture than the ceramic sheets, and the assembly is also simple, so that the cost can be reduced.

[Second Embodiment]

Next, a second embodiment of the present invention will be described. In the present embodiment, the structure of the inspection apparatus other than the probe card is the same as that of the inspection apparatus of the first embodiment. Therefore, the same members are denoted by the same reference numerals, and the description thereof will be omitted, and the probe card will be mainly described.

Fig. 7 is an exploded perspective view of the probe card of the embodiment, Fig. 8 is a front cross-sectional view of the probe card of the embodiment, Fig. 9 is a plan view of the probe card of the embodiment, and Fig. 10 is the embodiment Fig. 11 is an enlarged cross-sectional view of an essential part of the probe card of the embodiment.

The probe card 61 of the present embodiment is mainly composed of a plurality of pogo pins 12, a wiring board 62, a reinforcing member 63, and a support substrate 64 as shown in Figs. 7 to 11 .

The pogo pin 12 is composed of an upper end needle portion 12B of a cylindrical sleeve that encloses the compression spring 12A, and a lower end needle portion 12C that is placed in the sleeve and abuts against the compression spring 12A. Thereby, the pogo pin 12 is elastically expanded and contracted, and the upper end needle portion 12B is in contact with the electrode pad 62A of the wiring board 62 without sliding up and down, and the lower end needle portion 12C is slid up and down while the vertical movement of the wafer 11 is being engaged. The electrode pad 11A of the wafer 11 is in contact with each other.

The wiring board 62 is a member that is electrically connected to the upper portion of each of the pogo pins 12 to electrically connect the pogo pins 12 to the test device. The wiring board 62 is formed in a thick disk shape. The wiring board 62 can be provided with a signal line or the like for electrically connecting the pogo pin 12 to the test device, and is attached to the probe card holder 6 to support the entire probe card 61. On the lower side surface of the wiring board 62, as shown by the eighth circle, an electrode pad 62A that is in electrical contact with the pogo pin 12 is provided. The electrode pad 62A is a pad for electrically contacting an upper end portion of a plurality of pogo pins 12, respectively. Each of the electrode pads 62A is provided at a position that coincides with each of the pogo pins 12. On the wiring board 62, guide pin holes 62B through which the guide pins 74 to be described later are provided are provided at four positions, and screw holes 62C through which the fixing screws 75 to be described later pass are provided at eight positions.

The reinforcing member 63 is a member for reinforcing the wiring substrate 62. The reinforcing material 63 is formed in a solid dish shape having a smaller diameter than the wiring board 62 as shown in FIGS. 7 to 9 . The reinforcing member 63 is attached to the upper side surface of the wiring substrate 62 to reinforce the wiring substrate 62. The reinforcing member 63 is provided with guide pin holes 63A through which the guide pins 74 to be described later are provided at four positions, and screw holes 63B corresponding to the fixing screws 75 to be described later are provided at eight positions.

The support substrate 64 is a member for properly supporting each of the pogo pins 12. Specifically, the support substrate 64 is a member that holds and secures the lower portion of each of the pogo pins 12 and holds them securely and securely and accurately supports the upper portions of the respective spring pins 12 to maintain the perpendicularity of the respective spring pins 12. The support substrate 64 is configured to accurately support the respective spring pins 12, and the upper end needle portions of the respective spring pins 12 are electrically in contact with the electrode pads 62A of the wiring substrate 62, respectively, so that the lower end needle portions of the respective spring pins 12 are respectively inspected. Each electrode pad 11A of the wafer 11 of the target substrate is electrically contacted. The support substrate 64 has a circular shape in plan view. The support substrate 64 is composed of a ceramic base plate 68, an intermediate insulating sheet 69, an intermediate spacer 70, an upper insulating sheet 71, an upper spacer 72, and an insulating sheet 73 as shown in Figs. 7, 8, 10, and 11.

The ceramic base plate 68 is a support member for holding the lower portion of each of the pogo pins 12 in a stable and correct position, and is made of an insulating material such as a ceramic material. The ceramic bottom plate 68 is formed of a solid plate material, that is, a ceramic plate material, and has a concave portion 68A at the center thereof. The recessed portion 68A is provided with a lower support hole 68B into which the lower end needle portion of the pogo pin 12 is fitted and supported. The lower support hole 68B is provided in the same number as the electrode pads 11A at positions coincident with the electrode pads 11A of the wafer 11. Therefore, by fitting the lower portions of the pogo pins 12 into the respective lower support holes 68B, the lower portions of the pogo pins 12 can be correctly positioned and held, and the lower end needle portions of the pogo pins 12 and the wafer 11 can be respectively held. The electrode pads 11A are identical. The lower support holes 68B are arranged in two rows in each of the figures. The front end of the lower end needle portion of each of the pogo pins 12 penetrates the lower support hole 68B so that the front end thereof protrudes from the lower surface of the ceramic base plate. When the tip end of the lower end needle portion of the pogo pin 12 is pressed against the electrode pad 11A of the wafer 11, and is raised and raised, the lower support hole 68B becomes a guide for the lower end needle portion. On the ceramic bottom plate 68, guide pin holes 68C through which the guide pins 74 to be described later are provided are provided at four positions, and screw holes 68D through which the fixing screws 75 to be described later pass are provided at eight positions.

The ceramic bottom plate 68 has a function of positioning and holding the pogo pin 12 as described above, and has a function of thermally expanding the wafer 11 as in the first embodiment.

The intermediate insulating sheet 69 is a sheet-like supporting member for supporting each of the pogo pins 12 in a soft and correct manner to prevent short-circuiting between the adjacent pogo pins 12 and to maintain the perpendicularity of the respective pogo pins 12. The intermediate insulating sheet 69 is made of a synthetic resin film which is flexible, elastic, abrasion resistant, and heat resistant, and has a thin structure such as a polyimide film. Thereby, the upper portion (middle portion) of each of the pogo pins 12 is softly and correctly supported by the intermediate insulating sheet 69 in a state where the lower portion (lower end portion) of each of the pogo pins 12 is stably and accurately supported by the ceramic bottom plate 68, and can be supported by the intermediate insulating sheet 69 softly and correctly. The verticality of each of the pogo pins 12 is maintained. Thereby, the upper end portions of the respective pogo pins 12 are properly positioned and supported.

The intermediate insulating sheet 69 is provided with the same number of support holes 69A as the lower supporting hole 68B at a position coincident with the lower supporting hole 68B of the ceramic bottom plate 68. The diameter of the support hole 69A is set to be substantially the same as the outer diameter of the needle portion at the upper end of the pogo pin 12. The upper end needle portion 12B of the pogo pin 12 is a sleeve portion that surrounds the compression spring 12A inside, and has a larger diameter than the lower end needle portion 12C. Thereby, the upper end needle portion 12B of the pogo pin 12 can be inserted into the support hole 69A, and is stably and surely supported.

The intermediate insulating sheet 69 is specifically composed of a film-like heat-resistant material such as a polyimide film having a thickness of 100 μm or less. On the intermediate insulating sheet 69, guide pin holes 69B through which the guide pins 74 to be described later pass are provided at four positions.

The intermediate insulating sheet 69 is supported by the ceramic bottom plate 68 and the intermediate spacer 70 in a state in which the four guide pins 74 are positioned by the guide pin holes 69B. Thereby, the intermediate insulating sheet 69 can support the intermediate portion of each of the pogo pins 12.

The intermediate spacer 70 is a member that holds the intermediate insulating sheet 69 and the upper insulating sheet 71 at a predetermined interval, and sandwiches the intermediate insulating sheet 69 and the upper insulating sheet 71 together with the ceramic base 68 and the upper spacer 72. The intermediate spacer 70 is formed into a thick-walled ring shape and is formed of a strong material such as a metal or ceramic material. The thickness of the intermediate spacer 70 is configured to match the size of the pogo pin 12 or the number of the intermediate insulating sheets 69 and the upper insulating sheets 71. The intermediate spacer 70 is provided with guide pin holes 70A through which the guide pins 74 to be described later are provided at four positions, and screw holes 70B through which the fixing screws 75 to be described later pass are provided at eight positions.

Similarly to the intermediate insulating sheet 69, the upper insulating sheet 71 is a sheet-like supporting member for preventing short-circuiting between the adjacent pogo pins 12 and maintaining the perpendicularity of the respective spring pins 12. The upper insulating sheet 71 has the same configuration as the intermediate insulating sheet 69. Therefore, the same portions are denoted by the same reference numerals and the description thereof will be omitted.

The upper spacer 72 is a member that maintains the upper insulating sheet 71 and the wiring substrate 62 at a predetermined interval and supports the upper insulating sheet 71 between the intermediate spacers 70. The upper spacer 72, like the intermediate spacer 70, is formed into a thick-walled ring shape and is formed of a strong material such as a metal or ceramic material. In the upper spacer 72, guide pin holes 72A through which the guide pins 74 to be described later are provided are provided at four positions, and screw holes 72B through which the fixing screws 75 to be described later pass are provided at eight positions.

The insulating sheet 73 is a sheet for insulating the wiring substrate 62 from the upper spacer 72. The insulating sheet 73 is formed in a ring shape having the same size as the upper spacer 72. In the insulating sheet 73, guide pin holes 73A through which the guide pins 74 to be described later are provided are provided at four positions, and screw holes 73B through which the fixing screws 75 to be described later pass are provided at eight positions.

The guide pin 74 is a pin that can be correctly positioned when the ceramic base plate 68 is overlapped with the reinforcing member 63. The guide pin 74 penetrates the respective guide pin holes 63A, 62B, 73A, 72A, 71A, 70A, 69B, 68C to position the members correctly.

The fixing screw 75 is a screw for fixing the entire body. The members from the ceramic bottom plate 68 to the reinforcing member 63 are integrally fixed by the fixing screws 75 in a state of being positioned by the guide pins 74, and are disposed to be detachably attached. Thereby, the intermediate insulating sheet 69, the upper insulating sheet 71, the intermediate spacer 70, and the upper spacer 72 can be appropriately replaced. For example, the number of the intermediate insulating sheets 69 and the upper insulating sheets 71 is adjusted according to the length of the spring pins 12, and the number and thickness of the intermediate insulating sheets 69 and the upper insulating sheets 71 are appropriately set. Intermediate spacer 70, upper spacer 72. The thickness of the intermediate spacer 70 and the upper spacer 72 is adjusted in accordance with the number of the intermediate insulating sheets 69 and the upper insulating sheets 71 and the size of the spring pins 12.

The probe card 61 configured as described above is loaded into a probe or the like as described in Patent Document 1, and is used for inspection of the wafer 11. Specifically, the inspection is performed in the same manner as in the first embodiment.

The wafer 11 after the inspection is removed by, for example, a transport device, and the new wafer 11 is mounted, and the above inspection is repeated.

On the other hand, in the support substrate 64, when the pogo pins 12 are in contact with the electrode pads 11A of the wafer 11, although the pogo pins 12 are compressed, the lower portion of the pogo pins 12 is stabilized and correct by the ceramic base plate 68. Positioned and maintained. Further, the intermediate portion and the upper portion of the pogo pin 12 are softly and accurately supported by the intermediate insulating sheet 69 and the upper insulating sheet 71, and the verticality of each of the pogo pins 12 is maintained. Further, the upper and lower sides of the pogo pin 12 are held in contact with the electrode pad 62A and the ceramic base plate 68. Therefore, each of the pogo pins 12 is stably stretched.

Further, when the pogo pin 12 is to be replaced, the support substrate 64 is removed from the wiring board 62, and then the pogo pin 12 is pulled upward above the upper insulating sheet 71, and the new pogo pin 12 is inserted.

Further, in the case where the spring needle 12 having a shorter overall length is replaced, the intermediate spacer 70 and the upper spacer 72 are replaced with thinner spacers, and then the positions of the intermediate insulating sheet 69 and the upper insulating sheet 71 are adjusted. The intermediate portion and the upper portion of the spring pin 12 are supported to be adjusted.

According to the above, in the present embodiment, the same effects as those of the first embodiment described above can be obtained.

In particular, the support substrate 64 holds the lower portion of each of the pogo pins 12 in a stable and correct position, and supports the upper portion of each of the pogo pins 12 in a soft and correct manner to maintain the perpendicularity of the respective pogo pins 12, thereby preventing the ceramic base plate from being formed. The spring pin 12 of the 68 is partially worn or the like, and each of the pogo pins 12 can be supported correctly and surely.

Further, when the probe card 61 is to be assembled, the spring pin 12 can be easily positioned and assembled by inserting the pogo pin 12 into the support holes of the intermediate insulating sheet 69 and the upper insulating sheet 71 after the support substrate 64 is assembled. Thereby, the assembly workability of the probe card 61 and the workability at the time of maintenance can be improved.

[Third embodiment]

Next, a third embodiment of the present invention will be described. This embodiment is a modification technique of the intermediate insulating sheet 69 and the upper insulating sheet 71 in the second embodiment. Therefore, the same members as those in the second embodiment are denoted by the same reference numerals, and their description will be omitted, and the intermediate insulating sheet will be mainly described. Fig. 12 is a plan view showing an insulating sheet of the probe card of the embodiment, and Fig. 13 is an enlarged view of a main part of the insulating sheet of Fig. 12.

As shown in Fig. 12, the surface of the intermediate insulating sheet 80 of the present embodiment corresponding to the intermediate insulating sheet 69 of the second embodiment is provided with a reinforcing film 80A capable of suppressing the deflection accompanying the expansion and contraction of the intermediate insulating sheet 80. According to the reinforcing film 80A, the intermediate insulating sheet 80 is composed of an insulating sheet supporting surface portion 80B that supports the intermediate insulating sheet 80 itself, and a pogo pin supporting surface portion 80C that supports the respective spring pins 12.

The insulating sheet supporting surface portion 80B is an annular portion around the circular intermediate insulating sheet 80. The insulating sheet supporting surface portion 80B is provided with a reinforcing film 80A in its entirety, and can reliably support the intermediate insulating sheet 80 itself. Thereby, the insulating sheet supporting face portion 80B has sufficient strength. Further, on the insulating sheet supporting surface portion 80B, guide pin holes 80D through which the guide pins 74 pass are provided at four positions. The insulating sheet supporting surface portion 80B is sandwiched by the ceramic bottom plate 68 and the intermediate spacer 70 to obtain a stable support.

The pogo pin support surface portion 80C is a portion for softly and correctly supporting each of the pogo pins 12. The pogo pin supporting surface portion 80C is formed in a circular shape on the inner side of the annular insulating sheet supporting surface portion 80B. Since the pogo pin support surface portion 80C supports the respective spring pins 12 in a soft and accurate manner, the insulating sheet 80 is formed in a pattern in which the insulating sheet 80A is formed so as not to expand and contract. Specifically, in the pogo pin supporting surface portion 80C, the reinforcing film 80A is formed in a lattice shape in which the square holes are aligned in the vertical and horizontal directions. The size of each square hole is set to be slightly larger than the outer diameter of the pogo pin 12. Thereby, the insulating sheet of the portion of the spring pin supporting the face portion 80C is formed so as to suppress the deflection accompanying expansion and contraction in the portion of the lattice-shaped reinforcing film 80A.

The intermediate insulating sheet 80 is provided with the same number of support holes 80E as the lower supporting hole 68B at a position coincident with the lower supporting hole 68B of the ceramic bottom plate 68. Specifically, the support holes 80E are provided in two rows of ten. The diameter of the support hole 80E is set to be substantially the same as the outer diameter of the pogo pin 12. Thereby, the pogo pin 12 is stably and surely supported by the support hole 80E. The intermediate insulating sheet 80 is specifically composed of a film-like heat-resistant material such as a polyimide film having a thickness of 100 μm or less. The reinforcing film 80A is formed of a film formed by plating or sputtering.

In the intermediate insulating sheet 80, the insulating sheet supporting surface portion 80B is sandwiched by the ceramic bottom plate 68 and the intermediate spacer 70 in a state in which the four guide pins 74 are positioned by the guide pin holes 80D. Thereby, the intermediate insulating sheet 80 can support the intermediate portion of each of the pogo pins 12.

The intermediate insulating sheet 80 of the above configuration is incorporated in the probe card 61 in place of the intermediate insulating sheet 69 and the upper insulating sheet 71 of the second embodiment, and is used in an inspection apparatus.

Thereby, the same actions and effects as those of the second embodiment described above can be obtained.

In particular, the strength for suppressing the expansion and contraction of the intermediate insulating sheet 80 can be enhanced, and the upper portion of each of the pogo pins 12 can be supported softly and correctly, and the verticality of each of the pogo pins 12 can be more surely maintained.

[Modification]

Further, in the first embodiment, the insulating sheet is set to two sheets (the intermediate insulating sheet 49 and the upper insulating sheet 51), but the insulating sheet may be set to one or three or more depending on various conditions such as the size of the pogo pin 12. . This point is also the same in the second embodiment and the third embodiment. Also in this case, the same actions and effects as those of the above embodiments can be obtained.

In the third embodiment, the reinforcing film 80A (the spring pin supporting surface portion 80C) is provided around the support hole 80E of the intermediate insulating sheet 80 at a predetermined distance from the peripheral edge of the supporting hole 80E. However, as shown in Fig. 14, The reinforcing film 82 is provided around the circumference of the support hole 80E. Thereby, the strength of the support hole 80E itself can be increased, and the pogo pin 12 can be more reliably supported.

These are also the same in the upper insulating sheet 71.

In the third embodiment, the reinforcing film 80A is provided on the surface of the synthetic resin film to constitute the intermediate insulating sheet 80. However, the reinforcing film 80A may be provided inside the synthetic resin film. The intermediate insulating sheet 80 may be formed into a three-layer structure or a structure of four or more layers, and the reinforcing film 80A may be formed into one of the layers.

In the third embodiment, the pogo pin supporting surface portion 80C of the intermediate insulating sheet 80 is formed in a lattice shape. However, other shapes and patterns may of course be formed.

[Industry use possibility]

The probe card of the present invention can be widely applied to a probe card in which a ceramic substrate is a vertical support probe. Moreover, the inspection apparatus of the present invention is fully applicable to all vertical probe devices.

1. . . detector

2. . . main body

3. . . XYZθ platform

4. . . Fixture

5. . . Probe card

6. . . Probe card holder

7. . . Lower base

8. . . Upper base

8A. . . Opening

8B. . . Fitting recess

9. . . pillar

11. . . Wafer

11A. . . Electrode pad

12. . . Spring pin

12A. . . compressed spring

12B. . . Upper needle

12C. . . Lower needle

13. . . Wiring substrate

14. . . Ceramic substrate

16. . . Upper ceramic probe card

16A. . . Upper support hole

17. . . Middle section ceramic probe card

17A. . . Intermediate support hole

18. . . Lower ceramic probe card

18A. . . Concave

18B. . . Lower support hole

19. . . Guide pin

twenty two. . . Probe

twenty three. . . Contact

twenty four. . . Lower guide

25. . . Connection

26. . . Upper guide

28. . . Vertical coil spring probe

29. . . Lower probe

30. . . Lower probe contact

31. . . shell

32. . . Lower guide

33. . . Upper probe

34. . . Upper side probe

35. . . Upper guide

41. . . Probe card

42. . . Wiring substrate

42A. . . Main substrate

42B. . . Intermediate substrate

42C. . . Electrode pad

43. . . Reinforcement

44. . . Ceramic substrate

46. . . Fixing screw

48. . . Ceramic base plate

48A. . . Concave

48B. . . Lower support hole

49. . . Intermediate insulation sheet

49A. . . Guide hole

50. . . Intermediate spacer

51. . . Upper insulation sheet

51A. . . Guide hole

52. . . Upper spacer

53. . . Guide pin

54. . . Fixing screw

55. . . Fixing screw

61. . . Probe card

62. . . Wiring substrate

62A. . . Electrode pad

62B. . . Guide pin hole

62C. . . Threaded hole

63. . . Reinforcement

63A. . . Guide pin hole

63B. . . Threaded hole

64. . . Support substrate

68. . . Ceramic base plate

68A. . . Concave

68B. . . Lower support hole

68C. . . Guide pin hole

68D. . . Threaded hole

69. . . Intermediate insulation sheet

69A. . . Support hole

69B. . . Guide pin hole

70. . . Intermediate spacer

70A. . . Guide pin hole

70B. . . Threaded hole

71. . . Upper insulation sheet

72. . . Upper spacer

72B. . . Threaded hole

73. . . Insulating sheet

73A. . . Guide pin hole

73B. . . Threaded hole

74. . . Guide pin

75. . . Fixing screw

80. . . Intermediate insulation sheet

80A. . . Reinforcement film

80B. . . Insulation sheet supports the face

80C. . . Spring pin supports the face

80D. . . Guide pin hole

80E. . . Support hole

82. . . Reinforcement film

Figure 1 is a schematic front view of a prior detector.

Fig. 2 is a front cross-sectional view of a prior ceramic substrate.

Fig. 3 is an enlarged cross-sectional view of an essential part of the prior ceramic substrate.

Fig. 4 is an enlarged cross-sectional view of an essential part of the prior ceramic substrate.

Fig. 5 is a front sectional view showing the probe card according to the first embodiment of the present invention.

Fig. 6 is a front cross-sectional view showing a ceramic substrate of the probe card according to the first embodiment of the present invention.

Fig. 7 is an exploded perspective view of the probe card according to the second embodiment of the present invention.

Fig. 8 is a front sectional view showing a probe card according to a second embodiment of the present invention.

Fig. 9 is a plan view showing a probe card according to a second embodiment of the present invention.

Fig. 10 is a bottom view of the probe card according to the second embodiment of the present invention.

Fig. 11 is an enlarged cross-sectional view showing the essential part of the probe card according to the second embodiment of the present invention.

Fig. 12 is a plan view showing an insulating sheet of a probe card according to a third embodiment of the present invention.

Fig. 13 is an enlarged view of an essential part of the insulating sheet of Fig. 12.

Fig. 14 is an enlarged view of an essential part of a modification of the present invention.

12. . . Spring pin

61. . . Probe card

62. . . Wiring substrate

63. . . Reinforcement

64. . . Support substrate

68. . . Ceramic base plate

68A. . . Concave

69. . . Intermediate insulation sheet

69A. . . Support hole

70. . . Intermediate spacer

71. . . Upper insulation sheet

72. . . Upper spacer

73. . . Insulating sheet

74. . . Guide pin

75. . . Fixing screw

Claims (11)

A probe card comprising a plurality of spring pins electrically connectable to respective electrodes of a test object, comprising: a wiring board provided with wiring connectable to the test device; and a support for supporting each of the foregoing A support substrate for a pogo pin including a stable support member for positioning the lower portion of each of the pogo pins, and a flexible sheet-like support member for supporting an intermediate portion of each of the pogo pins. The probe card according to claim 1, wherein the support member includes a lower support hole through which the lower portion of the pogo pin can pass, and the lower portion of each of the pogo pins is positioned to be slidably held. The sheet-like support member is provided with a support hole through which the intermediate portion of the pogo pin can pass, to prevent short-circuiting between adjacent pin springs, and to securely and accurately support each of the pogo pins to maintain the perpendicularity of each of the pogo pins. The probe card according to claim 2, wherein each of the spring pins is supported by the support hole passing through the support hole of the support member and the support hole of the sheet-shaped support member. The upper end portion of the pogo pin is in contact with the electrode pad of the aforementioned wiring substrate. The probe card according to the first aspect of the invention, wherein the inside or the surface of the sheet-shaped support member is provided with a reinforcing film capable of suppressing deflection accompanying expansion and contraction of the sheet-shaped support member. The probe card according to claim 4, wherein the reinforcing film is formed of a film such as plating provided on the surface of the sheet-shaped supporting member or an intermediate layer of a plurality of layers, and the film is formed with The pattern or form a solid surface. The probe card according to claim 5, wherein the pattern of the reinforcing film is provided around a circumference of the support hole. The probe card according to claim 1, wherein the sheet-like support member is provided with two sheets, and the intermediate position of the pogo pins is supported at two places. The probe card according to claim 1, wherein the pogo pin has an upper end needle portion that encloses a cylindrical sleeve of a compression spring; and a slide that is placed in the sleeve and abuts against the compression spring The lower end needle portion of the valve, the support member supports the lower end needle portion of the pogo pin and allows sliding, and the sheet-shaped support member supports the upper end needle portion of the pogo pin alone. The probe card according to claim 1, wherein the spacer is supported by the sheet supporting member that holds the intermediate portion of each of the spring pins at a position of the intermediate portion, and the spacer is free The loading and unloading ground is installed only in an amount corresponding to the number of sheets of the aforementioned sheet-like supporting members. The probe card according to claim 9, wherein the thickness of the spacer is adjusted in accordance with the number of sheets of the sheet-shaped supporting member and the size of the probe. An inspection apparatus comprising a probe card, wherein the probe card is the probe card according to any one of claims 1 to 10.