TWI415726B - Plate cutting method - Google Patents

Abstract

To cut a sheet in response to the size of a plate-like member in a state of sticking to the plate-like member a sheet of the size projecting from the outer periphery of the plate-like member such as a wafer. This sheet cutting method cuts the sheet S of the size projecting from the outer periphery of a semiconductor wafer W by a cutter blade 12 along the outer periphery of the semiconductor wafer W. This cutting method presets a moving locus of a blade 12B as a normal locus so that the sheet S does not project from the semiconductor wafer W, and adjusts an attitude of the cutter blade 12 so as to become a predetermined twin angle [alpha]1, a camber angle &agr;2 and a caster angle &agr;3, in a process of being approached to the normal locus, after inserting the blade 12B of the cutter blade 12 into a cutting starting position P separated from the normal locus in cutting.

Description

Sheet cutting method

The present invention relates to a sheet cutting method. More specifically, after a sheet exceeding an outer circumference of a sheet member is attached to a sheet member, the sheet can be cut according to the shape of the sheet member. Break method.

In the past, a semiconductor wafer (hereinafter simply referred to as "wafer") was attached with a protective sheet for protecting the circuit surface of the surface.

When the protective sheet is pasted, the protective sheet which is over the outer periphery of the wafer is pasted on the wafer, and then the cutter edge is moved along the outer circumference of the wafer, and the protective sheet is cut according to the wafer wafer. Sheet (for example, refer to Japanese Patent Document 1).

Patent Document 1: Japanese Patent No. 2919938.

However, the sheet cutting method disclosed in Japanese Patent Laid-Open No. 1 is merely a mechanism for adjusting the insertion depth of the cutter blade and changing the posture such as the angle adjustment of the cutter blade, resulting in various defects.

That is, there is a missing line as shown in Fig. 7(A), and the face of the sheet S of the wafer W which is posted on the table T is inserted substantially perpendicularly into the blade edge 50A of the cutter blade 50, along When the outer periphery of the wafer W is cut, and the back surface is polished after the cutting, the excess portion L of the sheet S is generated as shown in Fig. 7(B). In other words, the wafer W is chamfered so that the outer peripheral end expands outward, and the diameter of the wafer W is inevitably reduced, and the difference becomes the excess portion L.

Therefore, in order to prevent the excess portion L from being generated, as shown in Fig. 8(A), the cutter blade 50 is displaced in an inclined posture with respect to the surface of the sheet S to cut the sheet S. However, the missing result by this method is that when the blade 50A is inserted, as shown in the figure (B), the blade tip is easily damaged by the thickness or rigidity of the blade S.

Further, as shown in Fig. 9, in the case where the blade 50 is inserted into the sheet S in a vertical posture, the method of tilting the blade 50 is caused to occur on the wafer W corresponding to the shift amount. The sheet S produces a crepe pattern, and sometimes the wafer W is broken due to the situation.

The present invention has been made in view of the above-described deficiencies, and an object of the invention is to provide a method for preventing wrinkles or scratches of a sheet when a sheet member which is attached to a sheet member such as a wafer is cut in accordance with the shape of a plate member. The state of the wafer, and the plate does not go beyond the outer edge of the wafer.

In order to achieve the above object, the present invention employs a sheet in which the outer circumference of the plate member is pasted on the sheet member, and the sheet is cut according to the shape of the sheet member via the cutter blade. The sheet cutting method includes: moving the cutter blade relative to each other along the outer circumference of the plate-shaped member, and cutting the trajectory according to the shape of the plate-shaped member as a regular trajectory a position at which the trajectory is further displaced outward, as a cutting start position, a first step of inserting the cutter blade into the sheet; and a method of inserting the cutter blade into the sheet directly toward the regular trajectory, thereby a second step of cutting the blade relative to the blade, and a second step of cutting the blade; and the blade edge is relatively moved in a state where the blade edge is on a normal track, and the plate is shaped according to the shape of the plate member The third step of cutting the sheet.

In the present invention, between the cutting start position and the normal trajectory, the cutter blade preferably has a center line of the cutter blade which is inclined with respect to the cutting direction as viewed from the cutting direction. In the manner of the feed angle, the posture is shifted, and the blade is cut in a state where the edge of the cutter blade is closer to the outer circumference of the plate member than the back.

Further, the cutter blade may be moved between the cutting start position and the regular trajectory, and the cutter blade may be inclined to the cutting direction as the center line of the cutter blade viewed from the front side in the cutting direction. In the manner of the specific camber angle, the posture is shifted, and the cutter blade is moved on the regular trajectory while maintaining the camber angle, and the method of cutting the sheet does not exceed the outer circumference of the plate-shaped member.

Further, when the cutter blade moves from the cutting start position to the normal trajectory, the cutter blade becomes a center line of the cutter blade in the cutting direction side surface, and is inclined to the cutting direction. In the front angle mode, the posture is shifted, and the blade is cut on the regular trajectory while the angle formed by the blade and the blade edge is maintained at an acute angle, so that the plate can be cut.

Further, it is preferable to adopt a method in which the cutter blade is supported by a numerically controlled articulated robot to perform posture control.

According to the present invention, the cutter blade can be inserted at a position further outward than the normal trajectory, and the posture of the cutter blade is gradually changed by the process of the cutter blade approaching the normal trajectory, and the normal trajectory is not caused. Wrinkles are generated in the adjacent sheets, and an excessive load is not applied to the outer periphery of the wafer W, and the sheets are cut in accordance with the shape of the wafer W.

Further, it is adjustable from the cutting start position from the outer periphery of the wafer to the time when the cutter blade moves to the normal trajectory so as to be the feed angle, the camber angle, and the front angle at the time of cutting. Since the posture of the cutter blade is not caused by wrinkles or scratches of the wafer due to the posture of the cutter blade located in the normal track, it is also possible to appropriately suit the thickness and rigidity of the blade. Condition to cut the sheet.

Further, by cutting the cutter blade on the multi-joint type robot controlled by the numerical value, it is possible to perform the cutting of the trajectory of the cutter blade by the diversity of the trajectory of the cutter blade to form a complicated planar shape.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the first embodiment, the sheet cutting device 10 of the present embodiment and the wafer W mounted on the sheet cutting device 10 and supported substantially horizontally in a planar shape as a plate-like member are shown. A schematic front view of the table T on which the protective adhesive sheet S is applied to the upper surface (circuit surface) of the wafer W. In the figure, the sheet cutting device 10 is configured to include a multi-joint type robot 11 and a cutter blade 12 held by the robot 11.

The robot 11 includes a base portion 14 and first arm 15A to sixth arm 15F that are disposed on the upper surface side of the base portion 14 and are rotatably provided in directions of arrows A to F, and a front end that is attached to the sixth arm 15F. The side, that is, the tool holding chuck 19 mounted on the free end side of the robot 11. The second, third, and fifth arms 15B, 15C, and 15E are rotatably provided in the Y×Z plane in Fig. 1, and the first, fourth, and sixth arms 15A, 15D, and 15F are rotatably provided. Around the axis. The robot 11 in the present embodiment is controlled by numerical control (Numerical Control). That is, the amount of movement of each joint to the workpiece (wafer) is controlled by the corresponding numerical information, and the amount of movement is controlled by the program, and the wafer is changed every time the wafer size is changed by the same cutting device as in the past. Manually change the position of the cutter blade in a completely different way. Further, in the conventional cutting device, the posture of the cutter blade is changed (the feed angle α1, the camber angle α2, and the front angle α3 to be described later), and the cut diameter must be adjusted again every time. However, the robot 11 of the present embodiment has Even if the posture of the cutter blade is changed anyway, the cut diameter can be maintained at a high-precision set value.

As shown in Fig. 2, the tool holding chuck 19 includes a substantially cylindrical cutter blade housing 20 and a position that is disposed at a distance of substantially 120 degrees in the circumferential direction of the cutter blade housing 20. The three chuck claws 21 of the cutter blade 12 are detachably held. Each of the chuck jaws 21 is provided with a tip end portion 21A having an acute inner corner, and the air pressure can advance and retreat in the diameter direction with respect to the center of the cutter blade holder 20.

As shown in Fig. 3, the cutter blade 12 is composed of a holder 12A in which a base portion is formed, and a tip end side 12B that is detachably fixed to the holder 12A. The blade holder 12A has a substantially columnar shape, and a groove 22 is formed along the axial direction at a base end side of a position at a distance of 120 degrees in the circumferential direction of the outer peripheral surface, and the chuck 21 is engaged with the groove 22 The tip end portion 21A keeps the position of the cutter blade 12 constant with respect to the tool holding chuck 19.

Further, the blade 12B includes a base portion 12C supported by the above-described blade holder 12A, a back portion 12D along the axis of the blade holder 12A, and a blade edge 12F that faces from the tip end portion 12E of the back portion 12D toward the acute angle direction. Therefore, the width of the blade edge 12F to the side of the tip end portion 12E is smaller than the width of the side of the base portion 12C.

As shown in Fig. 1, the table T is composed of an outer table 41 having a substantially square shape in plan view and an inner table 42 having a substantially circular shape. The outer table 41 is disposed to accommodate the concave shape of the inner table 42 in a state where a gap is formed with the outer edge of the inner table 42, and is disposed to be liftable to the base via the single-axis robot 44. . On the one hand, the inner table 42 is arranged to be lifted and lowered for the outer table 41 via the single-axis robot 46. Therefore, the outer table 41 and the inner table 42 can be integrally raised and lowered, and can be raised and lowered independently of each other, whereby the thickness can be adjusted to a specific height position in accordance with the thickness of the sheet S and the thickness of the wafer W.

On the upper side of the stage T, a sheet unwinding unit that winds the sheet S onto the wafer W is disposed, and the sheet S that is unwound from the sheet unwinding unit onto the wafer W is attached. The combined roller (not shown) moves on the sheet S and moves in the direction in which the sheet is unwound, and the sheet S is placed on the upper surface of the wafer W.

Next, a method of cutting the sheet S of the present embodiment will be described with reference to Figs. 4 to 6 . Further, the sheet S is attached to the wafer W in accordance with the teachings disclosed in Japanese Patent Application No. 2005-198806.

As shown in Fig. 4, the center line of the cutter blade 12 is inclined at an infeed angle α1 along the cutting direction of the outer circumference of the wafer W, as shown in Fig. 5, and the cutting direction is as shown in Fig. 5 The front side of the cutter blade 12 is inclined at an inclination angle α2. As shown in FIG. 6, the center line of the cutter blade 12 is inclined toward the cutting direction before the inclination angle α3 as the initial setting. Enter them separately to the controller. The reason why the feed angle α1, the camber angle α2, and the rake angle α3 are set is to be cut under the most appropriate conditions in accordance with the thickness, rigidity, and the like of the sheet S.

Further, when the blade 12B maintains the above-described respective angles α1, α2, and α3 to cut the sheet S, the cutting trajectory for cutting the sheet S in accordance with the shape of the wafer W is used as a normal trajectory and is input to the controller. . The normal trajectory can be set by the diameter of the wafer W. Further, a specific position (refer to the dotted dotted line position in FIG. 4) leaving the normal trajectory is input as the cutting start position P.

Next, the wafer W is placed on the stage T, and the sheet S is attached to the upper surface side of the wafer W. At the time of the posting, the cutter blade 12 held by the robot 11 stands by at a specific position so as not to interfere with the sheet S in position.

When the sheet S is finished, the blade 12B is moved to the cutting start position P via the robot 11, and the axis of the holder 12A is changed to a substantially vertical direction, and the blade 12B is inserted into the surface of the sheet S to a certain depth.

In this manner, in a state where the blade 12B is inserted into the surface of the sheet S, the cutter blade 12 is indicated by a dotted dotted line in Fig. 4, and the upper side is viewed along a substantially arc-shaped trajectory, and one side approaches the aforementioned regular The trajectory is cut while the sheet S is being cut, and the posture is gradually shifted to become the set angle α1, the camber angle α2, the front angle α3, and the edge 12F is moved to a position substantially contacting the outer circumference of the wafer W. That is, when moving to a normal trajectory (refer to the solid line position in FIG. 4), each angle α1, α2, and α3 becomes a set angle.

Then, while maintaining these angles, the blade 12B moves directly on the normal trajectory via the robot, and substantially passes through a revolution, and the sheet S is cut in accordance with the shape of the wafer W.

After the cutting of the sheet S, the cutter blade 12 is returned to the specific standby position. On the other hand, after the wafer W is transported by the transport device (not shown), the sheet on the outer side is not generated by the cutting. In part, it is wound up to a winding device (not shown), and the next wafer W is placed on the table T, and then the cutting operation is performed in accordance with the same method.

Therefore, according to such an embodiment, since the posture of the blade edge 12B of the cutter blade 12 is moved to a regular trajectory which is in contact with the outer periphery of the wafer W while being gradually displaced, it is obtained that the sheet S is wrinkled. The scratching of the outer peripheral portion of the wafer W can be effectively avoided, and even if the back surface of the wafer W is polished, the absence of the sheet S beyond the outer circumference of the wafer W can solve the effect.

The above-described optimum configuration, method, and the like for carrying out the present invention have been described above, but the present invention is not limited thereto.

The present invention has been illustrated and described with respect to the specific embodiments. However, as long as the spirit and the scope of the present invention are not deviated from the scope of the present invention, the embodiments may be Configuration, etc., to apply various changes in response to demand.

For example, in the above embodiment, the semiconductor wafer is illustrated as a plate member, but the present invention is not limited thereto, and the glass, the steel plate, the resin plate, and other plate members may be used. As a target application, the semiconductor wafer may also be a germanium wafer or a compound semiconductor wafer. Further, the planar shape of the plate-shaped member is not limited to a substantially circular shape, and may be an elliptical shape, a polygonal shape, or the like, and has various planar shape shapes.

10. . . Plate cutting device

11. . . robot

12. . . Cutter blade

12B. . . Blade

12D. . . Back

12F. . . Edge

P. . . Cutting start position

S. . . Plate

W. . . Semiconductor wafer (plate member)

11. . . Feed angle

22. . . Camber

33. . . Pre-angle

Fig. 1 is a schematic front view showing a sheet cutting device and a table of the embodiment.

Fig. 2 is an enlarged perspective view showing a front end side region of the robot.

Figure 3 is an enlarged perspective view of the cutter blade.

Fig. 4 is an explanatory view of the operation of cutting the sheet by maintaining the feed angle.

Fig. 5 is an explanatory view of the operation of cutting the sheet by maintaining the camber angle.

Fig. 6 is an explanatory view of the operation of cutting the sheet by maintaining the front angle.

Fig. 7(A) is a cross-sectional view showing a conventional example of cutting a sheet along the outer circumference of the wafer.

Fig. 7(B) is a partially enlarged cross-sectional view showing a state in which an excess portion is generated by grinding the back surface of the wafer after cutting the sheet.

Fig. 8(A) is a cross-sectional view showing a state in which the blade is inserted into the sheet while maintaining the tilt posture.

Fig. 8(B) is a cross-sectional view showing a state in which the blade is damaged when the blade is inserted into the sheet in a state in which the tilt posture is maintained.

Fig. 9 is a cross-sectional view for explaining the absence of the case where the blade is tilted after being inserted into the sheet in a vertical posture.

10. . . Plate cutting device

11. . . robot

12. . . Cutter blade

12A. . . Knife holder

12B. . . Tip side

14. . . Base body

15A. . . First arm

15B. . . Second arm

15C. . . Third arm

15D. . . Arm 4

15D. . . Arm 4

15E. . . Arm 5

15F. . . Sixth arm

19. . . Tool holding chuck

20. . . Cutter blade holder

twenty one. . . Chuck claw

41. . . Outside workbench

42. . . Inner workbench

46. . . Single axis robot

T. . . Workbench

Claims (5)

A sheet cutting method is a sheet in which a sheet having a size beyond the outer circumference of a sheet member is attached to the sheet member, and the sheet is cut according to the shape of the sheet member via a cutter blade. The cutting method is characterized in that the cutter blade is relatively moved along the outer circumference of the plate-shaped member, and the trajectory of cutting the sheet into a regular trajectory according to the shape of the plate-shaped member includes: a position shifted further outward than the normal trajectory, a first step of inserting a cutter blade into the sheet as a cutting start position; and a step of inserting the cutter blade into the sheet to directly approach the regular trajectory a second project in which the cutter blade is relatively moved to cut the plate; and the cutter blade is relatively moved in a state where the cutter blade is located on a normal track, in accordance with the shape of the plate member. a third project for cutting the plate; the cutter blade approaches the normal trajectory from the cutting start position, and the cutter blade is cut from the cutting direction In the surface, the center line of the cutter blade is tilted to a specific camber angle, and the posture is shifted. When the camber angle is maintained, the cutter blade moves on the regular trajectory, and the cutter blade does not move. Exceeding the outer circumference of the aforementioned plate member, cutting Broken piece. The sheet cutting method according to the first aspect of the invention, wherein the cutter blade is moved from the cutting start position to the regular trajectory, and the cutter blade is viewed from the cutting direction The center line of the cutter blade is shifted in a posture in which the cutting direction is inclined to a specific toe-in angle, and the edge of the cutter blade is closer to the plate than the back on the regular track. The sheet is cut in a state of the outer circumference of the member. The sheet cutting method according to the first or second aspect of the invention, wherein the cutter blade is moved from the cutting start position to the regular trajectory, and the cutter blade is in the cutting direction side surface. Looking at the center line of the cutter blade, the posture is shifted in such a manner that the cutting direction is inclined at a specific caster angle, and the angle formed by the sheet and the blade edge is maintained at an acute angle. The cutter blade moves on the aforementioned regular trajectory to cut the aforementioned sheet. The sheet cutting method according to any one of claims 1 to 2, wherein the cutter blade is supported by a numerically controlled articulated robot for posture control. The sheet cutting method according to the third aspect of the invention, wherein the cutter blade is supported by a numerically controlled articulated robot to perform posture control.