JP2006055935A - Protective tape sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To smoothly cut out a protective tape along the outer size of a semiconductor wafer in an excellent state by quickly adjusting and setting a cutter blade at proper position and attitude corresponding to the semiconductor wafer and the protective tape. <P>SOLUTION: A protective tape cutting mechanism 9 is provided with: a cutter elevating means for elevating the cutter blade 12 from a standby position on an upper side to a cutting acting position on a lower side; a cutter turning means for turning the cutter blade 12 at the cutting action position around a vertical axial center X passing an almost center of a chuck table 5; and an adjusting means for changing the direction of the cutter blade 12 around prescribed axial centers Z and P, or a plurality of adjusting means for changing the position of the cutter blade 12 in a prescribed direction Y. Each of the plurality of adjusting means is constituted to independently control actuators 29 and 37, etc. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention, after pasting the protective tape on the surface of the semiconductor wafer placed and held on the chuck table, then running the cutter blade along the outer periphery of the wafer in a state where the cutter blade is stuck into the stuck protective tape, The present invention relates to a protective tape attaching apparatus configured to cut out an attached protective tape along a wafer outer shape.

As a means for cutting out and cutting the protective tape attached to the surface of the semiconductor wafer, for example, as disclosed in Patent Document 1, the protective tape is supplied to the surface of the wafer placed and held on the chuck table, and the attaching roller The protective tape is affixed to the surface of the wafer by rolling, and then the cutter blade is moved along the outer periphery of the wafer by rotating the table with the cutter blade stuck into the protective tape. By cutting along the wafer periphery and changing and adjusting the crossing angle of the cutter blade with respect to the wafer surface, the amount of protrusion of the protective tape with respect to the outer periphery of the wafer can be adjusted to the thickness of the wafer and the chamfering form of the wafer outer periphery. What was comprised so that it can adjust arbitrarily according to it is known.
JP 2004-25438 A

  The protective tape cutting means adopts a structure that changes and adjusts the tilt angle of the cutter unit around a fulcrum set at a high position above the table as means for changing and adjusting the crossing angle of the cutter blade with respect to the wafer surface. Therefore, if the angle of the cutter blade is changed, the vertical position of the entire cutter blade will change and the cutting position of the protective tape will change, and it will be necessary to adjust the angle and height of the cutter blade. Yes, it took time to make adjustments.

  The present invention has been made paying attention to such a situation, and the cutter blade is quickly adjusted and set to an appropriate position and orientation corresponding to the semiconductor wafer and the protective tape, and the protective tape is cut and cut along the outer shape of the wafer. The main purpose is to provide a protective tape applying device that can smoothly and smoothly perform the above.

  According to a first aspect of the present invention, there is provided a protective tape supplying means for supplying a protective tape to the surface of a semiconductor wafer placed and held on a chuck table; Protection equipped with an affixing unit and a protective tape cutting mechanism that cuts off the affixed protective tape along the wafer outline by running the cutter blade along the outer periphery of the wafer while the cutter blade is pierced into the affixed protective tape In the tape applicator, the protective tape cutting mechanism has a cutter lifting / lowering means for moving the cutter blade up and down between an upper standby position and a lower cutting action position, and the cutter blade at the cutting action position passes through the approximate center of the chuck table. A cutter turning means for turning around the longitudinal axis, and a plurality of adjusting means for changing the posture and position of the cutter blade. Characterized in that a adjusting means are independently capable of controlling an actuator, respectively.

  According to the above configuration, in the protective tape cutting process after applying the protective tape to the surface of the semiconductor wafer, the plurality of adjusting means are operated to change the cutter blade posture and position into various types such as the size of the semiconductor wafer and the type of the protective tape. Adjust and control according to conditions. In this case, since each adjustment operation is controlled independently using an actuator, setting the specification program of each adjustment control corresponding to various cutting conditions in advance makes it easy to input and set the conditions to be processed. A suitable protective tape cutting process can be performed promptly.

  According to a second invention, in the first invention, one of the plurality of adjusting means is an adjusting means for changing the direction of the cutter blade around a predetermined axis, and the adjusting means is provided on the cutter blade. The cutter blade is rotationally changed by an actuator around an axis along the blade edge, and the cutting angle with respect to the traveling direction of the cutter blade is changed.

  According to the above configuration, by changing and controlling the cutting angle according to the travel position detection of the cutter blade, for example, a semiconductor wafer with an orientation flat for wafer positioning, a semiconductor wafer with a notch for positioning, etc. Even when the angle changes, tape cutting along the outer shape can be performed smoothly.

  In a third aspect based on the second aspect, the adjusting means is configured to set the cutter blade with respect to a member forcedly rotated by an actuator within a set range about the axis along the back edge of the blade edge. The cutter blade is supported so as to be rotatable relative to the cutter blade, and the cutter blade is urged to rotate in a direction opposite to the cutter turning direction.

  According to the above configuration, when a cutting resistance of a predetermined level or more is applied to the cutting edge of the cutter blade, the cutting angle of the cutter blade is automatically changed against the rotational biasing force, and good cutting is continued.

  In a fourth aspect based on the first aspect, one of the plurality of adjustment means is an adjustment means for changing a posture of the cutter blade around a predetermined axis, and the adjustment means The cutter blade is forcibly tilted by an actuator around the tape cutting portion to change the crossing angle of the cutter blade with respect to the surface of the semiconductor wafer.

  Therefore, according to the fourth invention, by changing and adjusting the crossing angle of the cutter blade with respect to the surface of the semiconductor wafer, the amount of protrusion of the protective tape with respect to the outer peripheral edge of the wafer depends on the wafer thickness, the chamfering form of the outer peripheral edge of the wafer, etc. Can be adjusted. In this case, by setting in advance a control program for adjusting the crossing angle of the cutter blade with respect to the specifications of the semiconductor wafer, the conditions to be processed are input and set using appropriate input means such as operation keys or a barcode reader. Only by this, the cutting process at a suitable crossing angle can be started quickly.

  In addition, since the cutter blade is tilted about the tape cutting point, the height of the cutting portion of the cutter blade does not change greatly by this adjustment, and the time required for adjustment when the processing target changes Will be short.

  In a fifth aspect based on the first aspect, one of the plurality of adjusting means is an adjusting means for changing a position of the cutter blade in a predetermined axial direction. The cutter blade is forcibly moved by an actuator to a plurality of positions having different distances from the turning center.

  According to the above configuration, the cutter blade can be repositioned to a turning radius suitable for the processing target by appropriately setting the processing target using the input means.

  In a sixth aspect based on the first aspect, one of the plurality of adjusting means is an adjusting means for changing a position of the cutter blade in a predetermined axial direction. The cutter blade is supported so as to be movable in the turning radius direction, and the cutter blade is urged in a direction approaching the turning center, and the urged cutter blade is forcibly moved in a direction opposite to the urging direction by an actuator. is there.

  According to the above configuration, at the beginning of the tape cutting process, the cutter blade is forcibly displaced to a position slightly outside the wafer outline by using an actuator, so that the cutter blade can be lowered and protected without contacting the wafer. The cutter blade can be stabbed, and then the forced displacement operation by the actuator is released to enable the cutter blade to be urged and moved toward the center of rotation. Thus, highly accurate tape cutting along the wafer outer shape can be performed.

  Therefore, according to the present invention, the process from sticking of the protective tape to cutting and cutting can be performed quickly without taking time for adjustment corresponding to the processing target, and the protective tape sticking and cutting process to the semiconductor wafer is performed. Can be performed efficiently.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing the overall configuration of the protective tape attaching device. This protective tape affixing device includes a wafer supply / recovery unit 1 loaded with a cassette C containing a semiconductor wafer (hereinafter simply referred to as “wafer”) W, a wafer transfer mechanism 3 having a robot arm 2, an alignment stage. 4. Chuck table 5 on which the wafer W is placed and sucked and held, a tape supply unit 6 for supplying a protective tape T for surface protection toward the wafer W, and a protective tape T with a separator supplied from the tape supply unit 6 The separator s from the separator W, the sticking unit 8 for sticking the protective tape T to the wafer W placed on the chuck table 5 and sucked and held, and the protective tape T attached to the wafer W on the wafer W. A tape cutting mechanism 9 that cuts and cuts along the outer shape, and a peeling unit that peels off the unnecessary tape T ′ after being attached to the wafer W and cut. A knit 10, a tape collecting unit 11 for winding and collecting the unnecessary tape T 'peeled off by the peeling unit 10, and the like are provided, and a specific configuration of each of the structural units and mechanisms will be described below.

  The wafer supply / collection unit 1 can be loaded with two cassettes C in parallel. In each cassette C, a large number of wafers W with the wiring pattern surface facing upward are inserted and stored in multiple stages in a horizontal posture. Yes.

  The robot arm 2 provided in the wafer transfer mechanism 3 is configured to be able to move forward and backward horizontally, and can be driven and swung up and down as a whole. At the tip of the robot arm 2, a horseshoe-shaped vacuum suction type wafer holder 2a is provided, and the wafer holder 2a is inserted into the gap between the wafers W stored in multiple stages in the cassette C. Are sucked and held from the back surface, and the wafer W sucked and held is pulled out from the cassette C and conveyed in the order of the alignment stage 4, the chuck table 5, and the wafer supply / recovery unit 1.

  The alignment stage 4 aligns the wafer W loaded and placed by the wafer transport mechanism 3 based on an orientation flat, a notch or the like formed on the outer periphery thereof.

  The chuck table 5 is configured to vacuum-suck the wafer W transferred from the wafer transfer mechanism 3 and placed in a predetermined alignment posture. Further, a cutter running groove 13 (FIG. 2) is provided on the upper surface of the chuck table 5 in order to cut a protective tape T by rotating a cutter blade 12 provided in a tape cutting mechanism 9 to be described later along the outer shape of the wafer W. Reference) is formed.

  The tape supply unit 6 is configured to guide the protective tape T with a separator drawn out from the supply bobbin 14 around the guide roller 15 group and guide the protective tape T from which the separator s has been peeled off to the affixing unit 8. The supply bobbin 14 is configured to give an appropriate rotational resistance so that excessive tape feeding is not performed.

  In the separator collection unit 7, the collection bobbin 16 that winds up the separator s peeled from the protective tape T is driven to rotate in the winding direction.

  The affixing unit 8 is provided with an affixing roller 17 that faces forward and horizontally, and is reciprocated horizontally by a slide guide mechanism 18 (see FIG. 7) and a screw feed type drive mechanism (not shown).

  The peeling unit 10 is provided with a peeling roller 19 that is horizontally oriented forward, and is reciprocated horizontally by the slide guide mechanism 18 and a screw feed type driving mechanism (not shown).

  The tape collecting unit 11 is configured so that the collecting bobbin 20 that takes up the unnecessary tape T ′ is driven to rotate in the winding direction.

  The tape cutting mechanism 9 basically has a support arm 22 (see FIG. 2) that can be driven and swiveled around a vertical axis X passing through the approximate center of the chuck table 5 at the bottom of a movable base 21 that can be driven up and down. Is mounted in a cantilevered horizontal posture, and a cutter blade 12 with its blade tip facing downward is mounted on a cutter unit 23 provided on the distal end side of the support arm 22, and the support arm 22 pivots around the axis X Thus, the cutter blade 12 is configured to travel along the outer periphery of the wafer W to cut out the protective tape T, and its detailed structure is shown in FIGS.

  As shown in FIG. 2, the movable base 21 is screwed up and down along the vertical rail 25 by driving the motor 24 forward and backward, and is provided at the free end of the movable base 21. A rotating body 26 is supported by the boss portion 21a so as to be rotatable about the longitudinal axis X. The rotating body 26 is decelerated and linked to a motor 27 provided on the movable base 21 via two belts 28, and the rotating body 26 is rotated in a predetermined direction at a low speed by the operation of the motor 27. It is like that.

  A support arm 22 is supported below the rotating body 26 by an air cylinder (actuator) 29 so as to advance and retreat in the horizontal direction Y, and a cutter unit 23 is mounted on the free end 22a of the support arm 22 as will be described later. By mounting and supporting the air cylinder 29 and controlling the movement of the support arm 22 in the horizontal direction Y, the turning radius of the cutter blade 12 can be adjusted and controlled in accordance with the wafer diameter. .

  As shown in FIG. 3, the cutter unit 23 is an inverted L-shaped rotation bracket 31 that is supported by a tip end portion 22 a of a support arm 22 via a support shaft 30 so as to be rotatable about a longitudinal axis Z. The movable member 32 supported on the front surface of the vertical side portion 31a of the rotating bracket 31, the cutter support member 33 connected and supported on the front surface of the movable member 32, the cutter holder 34 attached to the cutter support member 33, etc. The cutter blade 12 is attached to the cutter holder 34 such that the blade edge of the cutter tip substantially coincides with the axis Z.

  A rotation plate 31c is connected to the upper end of the base end boss 31b of the rotation bracket 31, and a support plate 35 is provided so as to be relatively rotatable around the axis Z with respect to the rotation plate 31c. A pulse motor (actuator) 37 attached to the tip of 22 via a stay 36 and a support plate 35 are wound and interlocked via a belt 38.

  As shown in FIG. 13, the support plate 35 and the rotation plate 31 c are axially centered by engaging a stopper pin 40 provided on the support plate 35 with a notch recess 39 formed in the rotation plate 31 c. The relative rotation range around Z is limited, and a spring 42 is stretched between the pin 41 provided on the rotation plate 31 c and the stopper pin 40 of the support plate 35. 31c is urged to rotate around the axis Z with respect to the support plate 35 in the direction opposite to the cutter turning direction F. Normally, the rotating plate 31c is relatively rotated as shown in FIG. Energized and held at one end of the range.

  According to the above configuration, by operating the pulse motor 37 to control the rotation posture of the support plate 35, the entire rotation bracket 31 can be rotated around the axis Z via the rotation plate 31c. Thus, the cutting angle α (see FIG. 11) with respect to the traveling direction of the cutter blade 12 can be controlled. Further, when the rotation plate 31c is forcibly rotated around the axis Z against the spring 42 in a state where the predetermined cutting angle α is provided, the cutter blade 12 is rotated around the axis Z. The angle of cut α is set to be larger than the angle of cut α set by adjusting the rotation of the support plate 35.

  As shown in FIGS. 3 to 5, the movable member 32 is slidably connected to the vertical side portion 31 a of the rotating bracket 31 via a slide guide mechanism 45. The slide guide mechanism 45 includes a partially arcuate guide rail 46 attached to the front surface of the vertical side portion 31a, and a slide block 47 attached to the back surface of the movable member 32 and slidably fitted to the guide rail 46. By moving the slide block 47 along the guide rail 46, the movable member 32 can slide and rotate with respect to the vertical side portion 31a with the center of curvature P of the guide rail 46 as a fulcrum. It has become. The center of curvature P of the guide rail 46 is set so as to be positioned at the tape cutting portion C at the cutting edge of the cutter blade 12. By this slide rotation adjustment, the crossing angle β of the cutter blade 12 with respect to the wafer surface (see FIG. 6). ) Can be changed and adjusted within a predetermined range.

  And the drive structure which drives the movable member 32 along the guide rail 46 is comprised as follows. That is, an arc-shaped rack gear 48 that is bent downward is provided at the lower portion of the movable member 32, and a pinion gear 49 that is engaged with the rack gear 48 is pivotally supported on the lower front surface of the vertical side portion 31a of the rotating bracket 31. The pinion gear 49 is wound around and interlocked with a pulse motor (actuator) 50 provided on the upper portion of the rotation bracket 31 via a belt 51, and the pulse motor 51 is operated to control the rotation of the pinion gear 49. As a result, the rack gear 48 is relatively engaged and moved, and the movable member 32 having the rack gear 48 is controlled to slide along the guide rail 46.

  Further, the cutter support member 33 is parallel to the advancing / retreating direction Y of the support arm 22 via the linear guide rail 52 and the slide block 53 fitted to the movable guide 32 with respect to the movable member 32 controlled to slide and rotate as described above. It is supported so that it can slide linearly. Then, the cutter support member 33 approaches the axis X, which is the center of cutter rotation, by a spring 56 stretched between the spring support fitting 54 provided on the movable member 32 and the spring support fitting 55 provided on the cutter support member 33. The piston rod 58a of the air cylinder (actuator) 58 attached to the movable member 32 via the bracket 57 is arranged so as to be able to contact the spring receiving bracket 55, and the piston rod 58a is extended. The cutter support member 33 is slid and displaced in a direction away from the axis X against the spring 54 by being driven out and pressing the spring support 55.

  Next, a series of basic operations for sticking the protective tape T on the surface of the wafer W and cutting it out using the above-described embodiment apparatus will be described.

  (1) When a sticking command is issued, first, the robot arm 2 in the wafer transfer mechanism 3 is moved toward the cassette C mounted and loaded on the wafer supply / recovery unit 1, and the wafer holding unit 2a is accommodated in the cassette C. The wafer W is inserted into the gap between the wafers, and the wafer W is sucked and held from the back surface (lower surface) by the wafer holder 2a, and the wafer W taken out is transferred to the alignment stage 4.

  (2) The wafer W placed on the alignment stage 4 is aligned using a notch formed on the outer periphery of the wafer W, and the aligned wafer W is unloaded again by the robot arm 2 and chucked. Placed on the table 5.

  (3) The wafer W placed on the chuck table 5 is sucked and held in a state where the wafer W is aligned so that the center thereof is on the center of the chuck table 5. At this time, as shown in FIG. 7, the affixing unit 8 and the peeling unit 10 are waiting at the left initial position, and the cutter blade 12 of the tape cutting mechanism 9 is waiting at the upper initial position.

  (4) Next, as shown by the phantom line in FIG. 7, the affixing roller 17 of the affixing unit 8 is lowered, and the adhering roller 17 moves forward on the wafer W while pressing the protective tape T downward ( In this way, the protective tape T is applied to the entire surface of the wafer W (see FIG. 8).

  (5) Next, when the affixing unit 8 reaches the end position, as shown in FIG. 9, the cutter blade 12 that has been waiting in the upper predetermined turning phase is lowered, and in the cutter running groove 13 of the chuck table 5. The protective tape T is pierced.

  Prior to the lowering operation of the cutter blade 12, based on the information of the processing target such as the type and size of the wafer W inputted in advance, the type of the protective tape T, the chamfering specification of the outer peripheral edge of the wafer, Adjustment control is performed.

  That is, the operation of the air cylinder 29 shown in FIG. 2 is controlled based on the input information, the support arm 22 is advanced and retracted, and the cutter blade 12 is moved and adjusted to a reference position where the turning radius of the cutter blade 12 becomes the wafer radius. At the same time, the piston rod 58a of the air cylinder 58 shown in FIG. 5 is driven to extend to a predetermined position where the spring receiving metal 55 is pushed and moved slightly against the spring, and the cutter blade 12 is moved from the outer peripheral edge of the wafer W. The cutter blade s12 is pierced into the protective tape T without interfering contact with the wafer W by being corrected to a position slightly outside and being lowered in this state.

  In this case, the pulse motor 37 shown in FIG. 3 is controlled based on the input information, and the cutter blade 12 is pierced into the protective tape T in a state where the cutting angle α with respect to the traveling direction of the cutter blade 12 is adjusted. Thereafter, the pulse motor 50 shown in FIG. 3 is controlled based on the input information to adjust the crossing angle β of the cutter blade 12 with respect to the wafer surface.

  (6) When the cutter blade 12 is stabbed into the protective tape T in a predetermined position at a predetermined position, the support arm 22 is driven and rotated in a predetermined direction by the motor 27 shown in FIG. Rotates around the axis X, and the protective tape T is cut along the outer shape of the wafer. In this case, when the forward travel of the cutter blade 12 is started, the air cylinder 58 in FIG. 5 is switched to the freely stretchable state, and the cutter support member 33 is slid and urged toward the cutter blade turning center by the spring 56. Become. Accordingly, the cutter blade 12 travels while being in sliding contact with the outer peripheral edge of the wafer W with an appropriate pressure by the sliding biasing force of the spring 56, and the tape cutting along the outer shape of the wafer W is performed.

  As shown in FIG. 11, when a wafer W having an orientation flat of alignment on the outer periphery is targeted, the cutter blade 12 is swung around one end of the orientation flat of as a tape cutting base point. Corresponding to the position detection of the cutter blade 12 in the turning direction, the pulse motor 37 is controlled on the basis of a program set in advance, so that the cutting angle α with respect to the traveling direction of the cutter blade 12 is maintained at a predetermined value. .

  When the wafer W having the notch n for alignment on the outer periphery is targeted, as shown in FIG. 12, when the cutter blade 12 reaches the formation range of the notch n, the turning direction of the cutter blade 12 is reached. The pulse motor 37 is controlled in accordance with a preset input program corresponding to the position detection at, so that the cutting angle α is changed as the cutter blade 12 advances so that the cutter blade 12 bites into the notch n. Control is performed, and tape cutting is performed with less uncut portion of the protective tape T inside the notch n.

  Further, the rotation plate 31c biased and held in a fixed rotation posture with respect to the support plate 35 is cuttered about the axis Y with respect to the support plate 35 that is controlled and fixed to a predetermined angle posture. Since relative rotation is possible in the same direction as the turning direction, when a large tape cutting resistance acts during tape cutting operation and the progress of the cutter blade 12 is delayed, the rotating plate 31c is rotated relative to the spring 42. As a result, the cutting angle α with respect to the traveling direction of the cutter blade 12 is increased, and the tape cutting is continued. Thus, when a large tape cutting resistance is applied during the tape cutting operation, the cutter blade 12 bites into the periphery of the wafer W by being displaced in a direction in which the cutting angle α with respect to the traveling direction of the cutter blade 12 increases. Since it is displaced, the protective tape can be cut without rattling.

  (7) When the tape cutting along the outer periphery of the wafer W is completed, as shown in FIG. 10, the cutter blade 12 is raised to the original standby position, and then the peeling unit 10 moves forward on the wafer W. Unnecessary tape T ′ that has been cut and cut is wound up and peeled off.

  (8) When the peeling unit 10 reaches the end position of the peeling work, the peeling unit 10 and the pasting unit 8 move in the opposite directions and return to the initial position. At this time, the unnecessary tape T ′ is wound around the recovery bobbin 20 and a certain amount of the protective tape T is fed out from the tape supply unit 6.

  (9) When the tape sticking operation is finished, after the suction on the chuck table 5 is released, the wafer W that has been stuck is transferred to the wafer holding part 2a of the robot arm 2 and the cassette of the wafer supply / recovery part 1 It is inserted into C and collected.

  Thus, one tape attaching process is completed, and thereafter, the above operations are sequentially repeated.

  In the above embodiment, the case where an air cylinder, a pulse motor, or the like is used as an actuator for adjusting and controlling the posture and position of the cutter blade 12 is exemplified. However, an electric cylinder, an electromagnetic solenoid, or the like can also be used for adjustment control. What is necessary is just to select these suitably according to a required stroke, operation force, response speed, etc.

It is a perspective view which shows the whole protective tape sticking apparatus which concerns on one Example of this invention. It is a front view of a tape cutting mechanism. It is a side view of the principal part of a tape cutting mechanism. It is a front view of the principal part of a tape cutting mechanism. It is a front view of the principal part of a tape cutting mechanism. It is explanatory drawing of the crossing angle of a cutter blade. It is operation | movement explanatory drawing of an Example apparatus. It is operation | movement explanatory drawing of an Example apparatus. It is operation | movement explanatory drawing of an Example apparatus. It is operation | movement explanatory drawing of an Example apparatus. It is explanatory drawing of the tape cutting process procedure of the semiconductor wafer with an orientation flat. It is explanatory drawing of the tape cutting process procedure of the semiconductor wafer with a notch. It is a schematic plan view explaining the cutting angle automatic adjustment operation.

Explanation of symbols

5 Chuck Table 8 Adhesion Unit 9 Tape Cutting Mechanism 12 Cutter Blade 17 Adhesion Roller 29 Actuator (Air Cylinder)
37 Actuator (pulse motor)
50 Actuator (pulse motor)
58 Actuator (Air cylinder)
C Cutting point F Cutter turning direction T Protective tape W Semiconductor wafer X Axis Z Z Axis α Cutting angle β Crossing angle

Claims (6)

A protective tape supply means for supplying a protective tape to the surface of the semiconductor wafer placed and held on the chuck table, a sticking unit for rolling and moving the sticking roller and pressing the protective tape against the wafer surface, In a protective tape attaching apparatus provided with a protective tape cutting mechanism that cuts out the protective tape attached by running the cutter blade along the outer periphery of the wafer with the cutter blade being pierced into the protective tape,
The protective tape cutting mechanism includes a cutter lifting / lowering means for moving the cutter blade up and down between an upper standby position and a lower cutting action position, and the cutter blade at the cutting action position around a longitudinal axis passing through the approximate center of the chuck table. A cutter turning means for turning, and a plurality of adjusting means for changing the posture and position of the cutter blade;
The protective tape attaching apparatus, wherein the plurality of adjusting means are configured to be independently controllable by actuators. In the protective tape affixing device according to claim 1,
One of the plurality of adjusting means is an adjusting means for changing the direction of the cutter blade around a predetermined axis, and the adjusting means is a cutter blade centered on an axis along the cutting edge of the cutter blade. The protective tape attaching device is configured to change the cutting angle with respect to the traveling direction of the cutter blade by changing the rotation of the blade with an actuator. In the protective tape affixing device according to claim 2,
The adjusting means supports the cutter blade with respect to a member forcedly rotated by an actuator so that the cutter blade can be relatively rotated within a set range around the axis along the back edge of the blade tip. A protective tape affixing device that is biased to rotate in the direction opposite to the turning direction. In the protective tape affixing device according to claim 1,
One of the plurality of adjusting means is an adjusting means for changing the posture of the cutter blade around a predetermined axis, and this adjusting means forcibly causes the cutter blade to be forced by an actuator around the tape cutting portion of the cutter blade. A protective tape affixing device configured to change the crossing angle of the cutter blade with respect to the surface of the semiconductor wafer by tilting. In the protective tape affixing device according to claim 1,
One of the plurality of adjusting means is an adjusting means for changing the position of the cutter blade in a predetermined axial direction, and the adjusting means has the cutter blade at a plurality of positions at different distances from the turning center of the cutter blade. A protective tape affixing device configured to be forcibly moved by an actuator. In the protective tape affixing device according to claim 1,
One of the plurality of adjusting means is an adjusting means for changing the position of the cutter blade in a predetermined axial direction. The adjusting means supports the cutter blade so as to be movable in the turning radius direction, and A protective tape affixing device configured to urge the blade in a direction approaching the turning center and forcibly move the urged cutter blade in a direction opposite to the urging direction by an actuator.

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