JP2013233620A - Device and method of sheet forming - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet forming device capable of forming an adhesive sheet roughly equal in shape to a plate-like member from a raw adhesive sheet of a size stuck to the plate-like member and protruding from the outer edge of the plate-like member while suppressing the loss of the plate-like member.SOLUTION: A sheet forming device 1 includes a support table 14 for supporting a wafer WF to which a raw adhesive sheet AS1 of a size protruding from at least a partial outer edge in a rear surface WF2 is stuck from the raw adhesive sheet AS1, and a removing means 20 for removing the protruded part AS3 of the raw adhesive sheet AS1 protruded from the outer edge of the wafer WF. The removing means 20 forms an adhesive sheet AS2 by pulling and removing the protruded part AS3 from the front surface WF1 side of the wafer WF.

Description

  The present invention relates to a sheet forming apparatus and a sheet forming method.

2. Description of the Related Art Conventionally, there has been known a pasting apparatus that attaches an adhesive sheet to a plate-like member and cuts the adhesive sheet along the shape of the plate-like member (see, for example, Patent Document 1).
In the configuration of Patent Document 1, a cutter blade is brought into contact with the outer edge of the wafer to cut the adhesive sheet.

JP 2006-55935 A

  However, in the configuration as in Patent Document 1, since the plate-like member and the cutter blade are brought into direct contact with each other, the outer edge of the plate-like member and the cutter blade may be lost.

  An object of the present invention is to form an adhesive sheet having a shape substantially equal to that of a plate-like member from an original adhesive sheet having a size protruding from the outer edge of the plate-like member attached to the plate-like member while suppressing the loss of the plate-like member. An object of the present invention is to provide a sheet forming apparatus and a sheet forming method.

  In order to achieve the above object, the sheet forming apparatus of the present invention is attached to one surface of a plate-like member, and from the original adhesive sheet having a size protruding from at least a part of the outer edge of the plate-like member, A sheet forming apparatus for forming an adhesive sheet that does not protrude from one surface of the member, wherein the plate-like member to which the original adhesive sheet of a size protruding from at least a part of the outer edge of the one surface is attached A supporting means for supporting from the original adhesive sheet side; and a removing means for removing the protruding portion of the original adhesive sheet protruding from the outer edge of the plate-like member, wherein the removing means is the other surface side of the plate-like member. The adhesive sheet is formed by pulling and removing the protruding portion.

At this time, it is preferable that the sheet forming apparatus of the present invention further includes a collecting unit that collects the protruding portion removed by the removing unit.
In the sheet forming apparatus according to the aspect of the invention, the removing unit may include a holding unit that holds a part of the protruding portion, and a first moving unit that relatively moves the holding unit and the support unit in a direction in which they are separated from each other. And second moving means for relatively moving the holding means and the supporting means along the outer edge of the plate-like member.

  On the other hand, the sheet forming method of the present invention is applied to one surface of the plate-like member, from an original adhesive sheet having a size protruding from at least a part of the outer edge of the plate-like member, from one surface of the plate-like member. A sheet forming method for forming an adhesive sheet that does not protrude, and supports the plate-like member to which the original adhesive sheet of a size protruding from at least a part of the outer edge of the one surface is attached from the original adhesive sheet side And a step of forming the adhesive sheet by pulling and removing the protruding portion protruding from the outer edge of the plate-like member from the other surface side of the plate-like member. .

  According to the present invention as described above, the protruding portion of the original adhesive sheet affixed to one surface of the plate-like member is pulled from the other surface side of the plate-like member, so that the protruding portion is the outer edge of the plate-like member. Can be cut along and removed. For this reason, a protrusion part can be removed without making components contact | abut directly to a plate-shaped member, and the defect | deletion of a plate-shaped member can be suppressed. In addition, since the adhesive sheet does not flow to the subsequent process in a state where the adhesive sheet protrudes beyond the outer edge of the plate-like member, unintended peeling of the adhesive sheet and generation of thread-like foreign matters can be suppressed.

At this time, if a collecting means is provided, the removing means can be used repeatedly without replacement.
Further, a part of the protruding portion is held by the holding means, and the first moving means and the second moving means are moved relative to each other along the direction in which the holding means and the supporting means are brought into contact with each other and along the outer edge of the plate-like member. Compared with the configuration in which all the protruding portions along the outer edge of the plate-like member are removed at once, the protruding portion can be removed smoothly, and the stress applied to the plate-like member can be reduced.

1 is a cross-sectional view of a sheet forming apparatus according to an embodiment of the present invention. FIG. 3 is a plan view illustrating a part of the sheet forming apparatus. Sectional drawing showing a part of sheet forming apparatus which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up, down, left, right, front, and back are indicated, all of FIG. Based on the case of viewing from an appropriate direction), the upper, lower, left, and right directions are directions parallel to the paper surface, and the front and back directions are directions orthogonal to the paper surface.

  In FIG. 1, a sheet forming apparatus 1 is attached to a back surface WF2 (lower surface) as one surface of a wafer WF serving as a plate-like member, and has a size that protrudes from at least a part of the outer edge of the wafer WF. The sheet forming apparatus for forming the adhesive sheet AS2 that does not protrude from the back surface WF2 of the wafer WF, and is composed of only an adhesive layer, and has a size that protrudes from at least a part of the outer edge of the back surface WF2. The supporting means 10 for supporting the wafer WF with the adhesive attached from the side of the original adhesive sheet AS1, the removing means 20 for removing the protruding portion AS3 protruding from the outer edge of the back surface WF2 of the wafer WF in the original adhesive sheet AS1, and the removing means 20 And a recovery means 40 for recovering the removed protruding portion AS3.

  The support means 10 has a top surface as a holding surface 12, a suction table 11 formed of a porous body or the like having substantially the same shape as the back surface WF 2 of the wafer WF, and a chamber table 13 formed therein. 14 and a suction means 16 such as a vacuum pump or a vacuum ejector that communicates with the chamber portion 13 via the pipe 15 and applies a suction force to the suction portion 11. The holding surface 12 is subjected to non-adhesion processing such as surface roughening or fluororesin coating.

  As shown in FIG. 2, the removing means 20 is formed in a substantially fan shape by a straight line 21C and a straight line 21D connecting the ends of the circular arc 21A, the circular arc 21B and the circular arcs 21A and 21B, and a part of the protruding portion AS3. A pressure-sensitive adhesive plate 21 as a holding means in which a pressure-sensitive adhesive layer is formed on a surface holding a protruding piece AS4, and an output shaft 22 that supports the pressure-sensitive adhesive plate 21. A linear motion motor 23 as a drive device, a linear motor 25 as a drive device for moving the slider 24 supporting the linear motion motor left and right, and the tip of the rotary shaft 26. And a second moving means for moving the adhesive plate 21 and the supporting means relative to each other along the outer edge of the wafer WF. And a rotation motor 27. The arc 21A is formed with the same curvature as that of the outer edge of the wafer WF.

  The collecting means 40 includes a squeegee portion 41 that peels off the protruding piece AS4 collected by the adhesive plate 21 from the adhesive plate 21, and a box portion 42 that accommodates the protruding piece AS4 peeled off by the squeegee portion 41. Yes.

  In the sheet forming apparatus 1 described above, as a procedure for forming the adhesive sheet AS2 having a shape substantially equal to the wafer WF from the original adhesive sheet AS1 attached to the wafer WF, first, the sheet is protruded from at least a part of the outer edge by a conveying unit (not shown). When the wafer WF having the size of the original adhesive sheet AS1 attached to the back surface WF2 is placed on the holding surface 12 of the support table 14 so that the original adhesive sheet AS1 is located below, the support means 10 is provided with the suction means 16. To hold the wafer WF by suction. At this time, the wafer WF is placed so that the back surface WF2 and the suction unit 11 coincide. Next, the removing means 20 drives the linear motor 23 to lower the adhesive plate 21 to bring the adhesive layer of the adhesive plate 21 into contact with the protruding portion AS3, and then raise the adhesive plate 21. At this time, since the holding surface 12 has been subjected to non-adhesion processing, as shown in FIG. 2, part of the protruding portion AS3 is the outer edge of the wafer WF as the adhesive plate 21 rises, and the wafer WF Are cut along the corner WF3 at the boundary between the back surface WF2 and the front surface WF1, and the corresponding portions of the straight lines 21C and 21D of the adhesive plate 21 are peeled off and removed as protruding pieces AS4.

  Thereafter, the removing means 20 drives the linear motor 25 to move the adhesive plate 21 to the right, and the removed protruding piece AS4 is peeled off by the squeegee portion 41 and accommodated in the box portion 42. Thereby, the adhesive plate 21 can be used repeatedly without exchanging.

Then, the removing means 20 drives the linear motor 25 to move the adhesive plate 21 to the position indicated by the solid line in FIG. 1, drives the rotation motor 27, and moves the support table 14 to the substantially fan-shaped central angle of the adhesive plate 21. Rotate by approximately equal angles. When the detection means such as a sensor (not shown) detects that the support table 14 has been rotated, the removal means 20 performs the above operation again, and sequentially removes the protruding portion AS3 from the original adhesive sheet AS1 as a protruding piece AS4. Finally, the adhesive sheet AS2 from which all the protruding portions AS3 are removed is formed. When the adhesive sheet AS2 is formed, the support unit 10 stops the suction unit 16, and a transfer unit (not shown) transfers the wafer WF to the next step. Thereafter, the same operation as described above is repeated.
In this way, by sequentially removing a part of the protruding portion AS3 as the protruding piece AS4, it is possible to reduce the force applied to the wafer WF at the time of removal as compared with the configuration in which all of the protruding portion AS3 is removed at once. And damage to the wafer WF can be suppressed.

  According to the embodiment as described above, by pulling the protruding portion AS3 of the original adhesive sheet AS1 attached to the back surface WF2 of the wafer WF from the front surface WF1 side, the protruding portion AS3 is cut along the outer edge of the wafer WF. By removing, the adhesive sheet AS2 can be formed. For this reason, the protruding portion AS3 can be removed without causing the component to directly contact the wafer WF, and the loss of the wafer WF can be suppressed.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, as shown by reference numeral AA in FIG. 1, a belt-like adhesive sheet 41A that collects the protruding piece AS4 by an adhesive layer (not shown) provided on the surface instead of the collecting means 40, and this adhesive sheet 41A is wound and supported The support sheet 42A and the adhesive sheet 41A are folded back and sandwiched between the adhesive plate 21 and the receiving plate 43A. The adhesive sheet 41A is driven by the rotation motor 44A as a driving device and the protruding piece AS4 is adhered thereto. A collecting means 40A including a winding roller 45A that winds and collects the toner may be applied.
Then, the removing means 20 drives the linear motion motor 23 to lower the adhesive plate 21 so that the protruding piece AS4 is sandwiched between the adhesive plate 21 and the receiving plate 43A and transferred to the adhesive sheet 41A.

Further, instead of the adhesive plate 21 that holds the protruding piece AS4 by adhesion, or the squeegee portion 41 and the box portion 42 that collect the protruding piece AS4, a holding means or a collecting means that holds the protruding piece AS4 by suction may be provided. Good.
In addition, pressure means such as a pressure pump and a turbine may be provided in parallel with the holding means, and the gas AS may be ejected to blow off the protruding piece AS4 to the box portion 42, or it may be transferred to the adhesive sheet 41A. You may let them.
Furthermore, as a 1st moving means of this invention, the structure which raises / lowers the support table 14 may be provided, and the support table 14 may be separated in the state which stopped the adhesion board 21, and the protrusion piece AS4 may be removed. Alternatively, both the adhesive plate 21 and the support table 14 may be separated from each other to remove the protruding piece AS4. Moreover, the 1st moving means should just be able to space apart the adhesion board 21 and the support table 14, for example, you may attach the linear motion motor 23 diagonally with respect to the central axis of the wafer WF. Further, after the adhesive plate 21 is brought into contact with the protruding portion AS3, the removing means 20 simultaneously drives the linear motor 23 and the linear motor 25 to raise the adhesive plate 21 and move it left or right, The protruding portion AS3 may be pulled and removed in the direction approaching the center of the wafer WF or in the direction away from the center of the wafer WF.
Further, as the second moving means of the present invention, there is provided a configuration for rotating the adhesive plate 21 along the outer edge of the wafer WF, and the adhesive plate 21 may be rotated while the support table 14 is stopped. You may rotate both the table 14 and the adhesive board 21 mutually. Furthermore, a plurality of holding means and collecting means may be provided.
Further, the shape of the adhesive plate 21 may be a substantially arc plate shape with a central angle of right angle or obtuse angle, a substantially annular plate shape, or a substantially polygonal plate shape.
Further, the corner portion WF3 may have a shape smaller than 90 °, a larger shape, or an R chamfer.
The angle at which the support table 14 rotates may be equal to or smaller than the substantially arcuate center angle of the adhesive plate 21.
Furthermore, as long as the wafer WF can hold | maintain, the suction part 11 can be comprised with another thing, For example, you may form several suction holes in the holding surface 12. FIG.
Further, as indicated by a two-dot chain line in FIG. 1, the wafer WF is pressed from the surface WF <b> 1 side constituted by a linear motion motor 51 as a driving device and a pressing plate 53 supported by the output shaft 52 of the linear motion motor. A presser means 50 may be provided. Thereby, it is possible to suppress the positional deviation of the wafer WF and to prevent the wafer WF from being pulled up and damaged together with the protruding portion AS3.
Further, as shown in FIG. 3, the wafer WF is supported by the support table 14 so that the back surface WF <b> 2 becomes the upper surface, and the removing unit 20 is disposed below the support table 14. The part AS3 may be removed.
Further, the holding means may be in contact with the entire protruding portion AS3, and in this case, the removing means may remove the protruding portion AS3 in a lump.
The raw adhesive sheet AS1 may have a width smaller than the outer shape of the wafer WF as long as it has a length that protrudes from the wafer WF.

  Further, the type and material of the original adhesive sheet AS1 in the present invention are not particularly limited. For example, the original adhesive sheet AS1 is configured by an adhesive layer and a base sheet, or provided between the base sheet and the adhesive layer. Three or more layers such as one having an intermediate layer or another layer may be used. Moreover, the semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, and a die attach film, but any other sheet, film, A sheet having an arbitrary use and shape such as a tape can be applied. Further, the plate member may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as a plate-like member, not only a glass plate, a steel plate, a resin plate, a substrate, and other members, but also other forms of members and articles can be targeted.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1,1A ... Sheet forming apparatus 14 ... Support table (support means)
20 ... removing means 21 ... adhesive plate (holding means)
23 ... Linear motion motor (first moving means)
27. Rotating motor (second moving means)
40, 40A ... Recovery means AS1 ... Original adhesive sheet AS2 ... Adhesive sheet AS3 ... Projecting part AS4 ... Projecting piece WF ... Wafer (plate-like member)
WF3 ... Corner

Claims (4)

A sheet that is attached to one surface of a plate-like member and forms an adhesive sheet that does not protrude from one surface of the plate-like member from an original adhesive sheet having a size that protrudes from at least a part of the outer edge of the plate-like member. A forming device,
A support means for supporting the plate-like member to which the raw adhesive sheet of a size protruding from at least a part of the outer edge of the one surface is attached from the raw adhesive sheet side;
Removing means for removing the protruding portion of the original adhesive sheet protruding from the outer edge of the plate-like member;
The removing unit forms the adhesive sheet by pulling and removing the protruding portion from the other surface side of the plate-like member.   The sheet forming apparatus according to claim 1, further comprising a collecting unit that collects the protruding portion removed by the removing unit.   The removing means includes a holding means for holding a part of the protruding portion, a first moving means for moving the holding means and the support means relative to each other in a direction of contacting and separating from each other, the holding means, and the support means. The sheet forming apparatus according to claim 1, further comprising: a second moving unit that relatively moves the plate along the outer edge of the plate-like member. A sheet that is attached to one surface of a plate-like member and forms an adhesive sheet that does not protrude from one surface of the plate-like member from an original adhesive sheet having a size that protrudes from at least a part of the outer edge of the plate-like member. A forming method comprising:
Supporting the plate-like member to which the raw adhesive sheet of a size protruding from at least a part of the outer edge of the one surface is attached from the raw adhesive sheet side;
Forming the adhesive sheet by pulling and removing the protruding portion protruding from the outer edge of the plate-like member from the other surface side of the plate-like member.

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