TWI412618B - Hollow columnar target and its components - Google Patents
Hollow columnar target and its components Download PDFInfo
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- TWI412618B TWI412618B TW98127792A TW98127792A TWI412618B TW I412618 B TWI412618 B TW I412618B TW 98127792 A TW98127792 A TW 98127792A TW 98127792 A TW98127792 A TW 98127792A TW I412618 B TWI412618 B TW I412618B
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- tube
- target
- outer tube
- inner tube
- hollow cylindrical
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- 239000013077 target material Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 238000000034 method Methods 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- 239000010935 stainless steel Substances 0.000 description 12
- 229910001220 stainless steel Inorganic materials 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005304 joining Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010023230 Joint stiffness Diseases 0.000 description 1
- 241000357293 Leptobrama muelleri Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
Description
本發明係一種中空柱狀靶材,尤其是一種能夠使得靶材材料和背襯管緊密結合且製程簡單的中空柱狀靶材。The invention relates to a hollow columnar target, in particular to a hollow columnar target capable of tightly combining a target material and a backing tube and having a simple process.
在典型使用平面靶材的磁控濺射製程中,濺射行為會集中在切線磁場最強的靶材表面區域,形成跑道式的侵蝕痕跡,因而降低靶材的使用率。一般而言,平面靶材的使用率僅為35%到50%。In a magnetron sputtering process typically using a planar target, the sputtering behavior is concentrated on the surface area of the target with the strongest tangential magnetic field, forming a runway-type erosion trace, thereby reducing the target utilization rate. In general, the use of planar targets is only 35% to 50%.
透過使用旋轉靶材可得到均勻的蝕刻表面,除了將使用率提升至70%到80%之外,對薄膜品質的改善也有幫助。提高靶材使用壽命和利用率可以降低製造成本、提高製程產量、降低靶材購買費用,並能夠延長有效生產時間。A uniform etched surface can be obtained by using a rotating target, which improves the quality of the film in addition to increasing the usage rate to 70% to 80%. Increasing target life and utilization can reduce manufacturing costs, increase process throughput, reduce target purchase costs, and extend effective production time.
但是旋轉靶材的靶材材料與背襯管的接合技術比一般平面靶材與背板的接合技術複雜許多。一般的做法是利用低熔點金屬作為焊料填入旋轉靶材與背襯管之間的間隙,以達到接合的目的。使用低融點金屬作為焊料具有熱應力較小的優點,然而,由於中空柱狀的靶材不易在焊合時施加壓力,接合力較差,容易在一定溫度的沉積製程進行中發生靶材材料與背襯管脫落的危險。其他常見的方式還包括:However, the bonding technique of the target material of the rotating target and the backing tube is much more complicated than the bonding technique of the general planar target and the backing plate. It is common practice to use a low melting point metal as a solder to fill the gap between the rotating target and the backing tube for bonding purposes. The use of a low-melting point metal as a solder has the advantage of less thermal stress. However, since the hollow columnar target is not easy to apply pressure during soldering, the bonding force is poor, and it is easy to occur in a deposition process at a certain temperature. The risk of the backing tube falling off. Other common ways include:
a.噴鍍技術:將靶材的材料以電漿或高壓噴鍍的方式鍍在背襯管的外管壁,以形成靶材。然而,噴鍍法容易在靶材中產生氣孔,導致靶材密度的降低。a. Spraying technology: the material of the target is plated on the outer tube wall of the backing tube by plasma or high pressure spraying to form a target. However, the sputtering method easily generates pores in the target, resulting in a decrease in the density of the target.
b.鑄造技術:將一管狀模具套在背襯管之外,將熔融的靶材材料注入管狀模具與背襯管之間,以形成靶材。而鑄造法的限制則是僅能用於低熔點材料的靶材製造。b. Casting technique: A tubular mold is placed outside the backing tube, and the molten target material is injected between the tubular mold and the backing tube to form a target. The limitation of the casting method is that it can only be used for the manufacture of targets with low melting point materials.
c.電鍍:將背襯管置於電鍍液中,利用電鍍的方式將靶材材料鍍在背襯管的外管壁,以形成靶材。雖有良好的附著性,但電鍍法的沉積速度慢,且沉積的厚度有限制。c. Electroplating: The backing tube is placed in a plating solution, and the target material is plated on the outer tube wall of the backing tube by electroplating to form a target. Although it has good adhesion, the deposition rate of the electroplating method is slow, and the thickness of the deposition is limited.
在美國第5,435,965號專利案中揭露利用注漿技術在管狀模具以及背襯管之間注入靶材材料後,再藉由熱均壓製程提升靶材的密度;然而,熱均壓製程設備昂貴,更增加靶材製造的成本。In U.S. Patent No. 5,435,965, the use of a grouting technique to inject a target material between a tubular mold and a backing tube, and then to increase the density of the target by a heat-averaged press; however, the hot press process is expensive. Increase the cost of target manufacturing.
在日本特開平11-71667號專利案中則揭露利用熱脹冷縮的原理將背襯管直接插入銅製靶材材料中,以機械的力量完成接合;然而,其咬合量設定在0.01mm~0.5mm,並未考量靶材尺寸與咬合量之間的關聯。但由George M. Wityak的研究論文(Performance Comparison of Silver Sleeved Rotary Targets with Planar Targets,George M. Wityak,Society of Vacuum Coaters,49th Annual Technical Conference Proceedings(2005))中可以看出,靶材尺寸以及咬合量若無經過適當設計,靶材與背襯管雖不至於鬆脫,但由濺鍍製程中的靶材溫度變化以及電弧發生的次數可以觀察出其導熱性以及導電性不佳。In Japanese Patent Laid-Open No. Hei 11-71667, it is disclosed that the backing tube is directly inserted into the copper target material by the principle of thermal expansion and contraction, and the joint is completed by mechanical force; however, the bite amount is set at 0.01 mm to 0.5. Mm, does not consider the relationship between target size and bite. However, as shown by George M. Wityak's research paper (Performance Comparison of Silver Sleeved Rotary Targets with Planar Targets, George M. Wityak, Society of Vacuum Coaters, 49th Annual Technical Conference Proceedings (2005)), target size and occlusion If the amount is not properly designed, the target and the backing tube are not loosened, but the thermal conductivity and the poor electrical conductivity can be observed by the temperature change of the target in the sputtering process and the number of arc occurrences.
另外,在美國公開第2004/0074770號專利案中,揭露一種將靶材材料加熱而使之膨脹,再將其罩套於背襯管外,之後再降溫而完成接合。然而其並未考慮到靶材材料與背襯管之間各種參數的關係,故此方法仍然無法讓背襯管和靶材材料之間有緊密的結合。In addition, in U.S. Patent Application Publication No. 2004/0074770, it is disclosed that a target material is heated and expanded, and then placed over the backing tube, and then cooled to complete the joining. However, it does not take into account the various parameters between the target material and the backing tube, so the method still does not allow a tight bond between the backing tube and the target material.
本發明人有鑑於既有靶材材料與背襯管的接合技術無法使靶材材料與背襯管緊密結合,而其他具有背襯管之靶材的製作方法皆有其缺點存在,因此經過不斷的嘗試與努力,終於發明出此中空柱狀靶材。The present inventors have in view of the fact that the bonding technology of the existing target material and the backing tube cannot make the target material and the backing tube tightly combined, and the other methods for manufacturing the target having the backing tube have their shortcomings, so Attempts and efforts have finally invented this hollow cylindrical target.
本發明之目的在於提供一種能夠使得靶材材料和背襯管緊密結合且製程簡單的中空柱狀靶材。It is an object of the present invention to provide a hollow cylindrical target which is capable of tightly bonding a target material and a backing tube and having a simple process.
為達上述目的,本發明提供一種中空柱狀靶材組件,其係包括一背襯管與一靶材材料,其中該靶材材料為外管,該背襯管為內管,該內管係用以接合於該外管內,在外管與內管分離的狀態下,內管之外徑大於外管之內徑,且該內管之外徑和外管之內徑之差值需等於靶材材料之降伏應變乘以外管之內徑再乘以一係數N,N值介於1至10之間。To achieve the above object, the present invention provides a hollow cylindrical target assembly comprising a backing tube and a target material, wherein the target material is an outer tube, the backing tube is an inner tube, and the inner tube is For engaging in the outer tube, in the state where the outer tube is separated from the inner tube, the outer diameter of the inner tube is larger than the inner diameter of the outer tube, and the difference between the outer diameter of the inner tube and the inner diameter of the outer tube is equal to the target The strain of the material is multiplied by the inner diameter of the outer tube and multiplied by a factor N, which is between 1 and 10.
其中該靶材材料及背襯管材料皆係選自於由金屬、金屬合金、陶瓷材料、氮化物、氧化物及其組合所組成之群組。Wherein the target material and the backing tube material are selected from the group consisting of metals, metal alloys, ceramic materials, nitrides, oxides, and combinations thereof.
其中,該外管之內管壁具有凹槽。Wherein, the inner tube wall of the outer tube has a groove.
其中,該內管之外管壁具有凹槽。Wherein, the outer tube wall of the inner tube has a groove.
其中,該外管之內管壁和該內管之外管壁皆具有凹槽。Wherein, the inner tube wall of the outer tube and the outer tube wall of the inner tube have grooves.
其中,該中空柱狀靶材組件尚包括一介質,該介質為導電材料,其係設置於該外管和內管之間;或者係設置於該外管和內管間之凹槽內。Wherein, the hollow cylindrical target assembly further comprises a medium which is a conductive material disposed between the outer tube and the inner tube; or is disposed in a groove between the outer tube and the inner tube.
本發明又關於一種中空柱狀靶材,其係包括上述中空柱狀靶材組件,且該內管係接合於該外管內。The invention further relates to a hollow cylindrical target comprising the hollow cylindrical target assembly described above, and the inner tube is joined within the outer tube.
本發明藉由靶材材料和背襯管之材質的不同性質,而調整內管之外徑和外管之內徑,使其差值等於靶材材料之降伏應變乘以外管之內徑再乘以一係數N,並控制N值在1至10之間,才能使得作為外管和內管得以緊密接合。The invention adjusts the outer diameter of the inner tube and the inner diameter of the outer tube by the different properties of the material of the target material and the backing tube, so that the difference is equal to the drop strain of the target material multiplied by the inner diameter of the outer tube and multiplied With a factor of N and controlling the value of N between 1 and 10, the outer tube and the inner tube can be tightly joined.
為了降低中空柱狀靶材製造成本以及改善靶材材料與背襯管間的接合強度,本發明提出一種中空柱狀靶材以及其製作方式。在本發明中,靶材材料為外管而背襯管為內管,而該內管之外徑和外管之內徑之差值需等於靶材材料之降伏應變乘以外管之內徑再乘以一係數N,N值介於1至10之間;在接合前,令外管之內徑略小於內管的外徑;接合時在內外管施予適當之溫度差,令外管溫度高於內管,利用熱脹冷縮的原理使外管的內徑大於內管之外徑,在此溫度差下將內管插入外管中進行接合,當內外管恢復原始溫度後即完成接合。In order to reduce the manufacturing cost of the hollow cylindrical target and improve the joint strength between the target material and the backing tube, the present invention proposes a hollow cylindrical target and a manufacturing method thereof. In the present invention, the target material is the outer tube and the backing tube is the inner tube, and the difference between the outer diameter of the inner tube and the inner diameter of the outer tube is equal to the gradient strain of the target material multiplied by the inner diameter of the tube. Multiply by a factor N, the value of N is between 1 and 10; before the joint, the inner diameter of the outer tube is slightly smaller than the outer diameter of the inner tube; when the joint is applied, the appropriate temperature difference is applied to the inner and outer tubes to make the outer tube temperature Higher than the inner tube, the inner diameter of the outer tube is larger than the outer diameter of the inner tube by the principle of thermal expansion and contraction. Under this temperature difference, the inner tube is inserted into the outer tube for jointing, and the inner and outer tubes are joined after the original temperature is restored. .
請參考第一圖,R、r分別為外管(10)之初始內徑以及內管(20)之初始外徑,且r>R;在內、外管(10,20)施予溫度差時,根據熱脹冷縮的公式,R’約等於R×(1+Ka Ta ),r’約等於r×(1+Kb Tb ),其中R’、r’為熱脹或冷縮之後的外管(10)內徑以及內管(20)外徑,Ka 與Kb 分別為外管(10)及內管(20)之熱膨脹係數,Ta 與Tb 則分別為外管(10)提升的溫度差以及內管(20)提升的溫度差。在外管(10)溫度足夠高於內管(20),使R’>r’時,即可進行接合製程。Please refer to the first figure. R and r are the initial inner diameter of the outer tube (10) and the initial outer diameter of the inner tube (20), respectively, and r>R; the inner and outer tubes (10, 20) are given a temperature difference. According to the formula of thermal expansion and contraction, R' is approximately equal to R × (1 + K a T a ), and r' is approximately equal to r × (1 + K b T b ), where R', r' are thermal expansion or coefficient of thermal expansion of the outer tube (10) and the inner diameter of the inner tube (20) after the shrink outside diameter, K a and K b are the outer tube (10) and the inner tube (20) of, T a and T b are respectively The difference in temperature between the outer tube (10) and the temperature difference in the inner tube (20). When the temperature of the outer tube (10) is sufficiently higher than the inner tube (20) to make R'>r', the bonding process can be performed.
初始外管內徑R與內管外徑r之差異(r-R)稱為咬合量,即該內管之外徑減去外管之內徑的差值,該內管之外徑和外管之內徑之差值範圍(咬合量)的大小會影響接合的強度以及內外管承受之機械應力。The difference (rR) between the initial outer tube inner diameter R and the inner tube outer diameter r is called the bite amount, that is, the difference between the outer diameter of the inner tube and the inner diameter of the outer tube, the outer diameter of the inner tube and the outer tube The difference in the range of the inner diameter (the amount of nip) affects the strength of the joint and the mechanical stress experienced by the inner and outer tubes.
咬合量的設計與材料的機械性質以及靶材的尺寸有密切的關係,較佳的情況下會將應變量設定在令材料發生降伏應變之後,若靶材材料的應變量小於該材料的降伏應變會因接合的緊密性不足造成的導熱以及導電性不佳的問題,而在製程中引發靶材溫度上升以及多次異常放電;但應變量若大於材料的破壞應變,則會因為過高的機械應力造成靶材的變形或破壞而無法使用。因此經過實驗研究,將應變量設定在靶材材料發生降伏應變以上,並且在降伏應變之10倍以下會有較佳的接合效果;則咬合量即等於靶材材料之降伏應變乘以外管之內徑再乘以一係數N,此N值介於1至10之間。The design of the bite amount is closely related to the mechanical properties of the material and the size of the target. In the preferred case, the strain should be set after the material is subjected to the strain, if the strain of the target material is less than the strain of the material. The problem of heat conduction and poor conductivity due to insufficient tightness of the joint may cause the target temperature to rise and multiple abnormal discharges during the process; however, if the strain is greater than the strain of the material, the machine will be too high. Stress causes deformation or damage of the target and cannot be used. Therefore, after experimental research, the strain should be set above the deflection strain of the target material, and there will be better joint effect below 10 times of the strain. The bite amount is equal to the drop strain of the target material. The path is multiplied by a factor N, which is between 1 and 10.
此外,本發明中外管與內管之間由於應力造成的塑性變形可使內、外管緊密接合,因此並不必要存在焊料作為媒介,但仍能夠在接合進行前在內外管間增加介質輔助內外管間電、熱的傳導或著增加附著的能力。In addition, in the present invention, the plastic deformation caused by the stress between the outer tube and the inner tube allows the inner and outer tubes to be tightly joined, so that solder is not required as a medium, but the medium can be added between the inner and outer tubes before the joint is performed. The conduction between electricity and heat between tubes or the ability to increase adhesion.
請參看第二及三圖所示,為了達到製程的方便以及節省焊料的目的,更可以在外管(10)之內管壁(11)或內管(20)之外管壁(21)或上述之二者設置凹槽(12,22),再將焊料填於凹槽(12,22)中,此填充焊料的步驟除了可在接合前進行外,亦可在接合後進行。Please refer to the second and third figures. In order to achieve the convenience of the process and the purpose of saving solder, the wall (11) or the tube wall (21) or the above may be outside the inner wall (11) or the inner tube (20). The recesses (12, 22) are provided in the recesses (12, 22), and the solder is filled in the recesses (12, 22). This step of filling the solder can be performed after the bonding, but also after the bonding.
請參看第四圖所示,其中以內管(20)為例,所形成之凹槽可為複數分別形成於該內管(20)之兩端部(23)的凹槽(22)。Referring to the fourth figure, wherein the inner tube (20) is taken as an example, the groove formed may be a plurality of grooves (22) respectively formed at both end portions (23) of the inner tube (20).
亦可為單一環繞於該內管(20)之外管壁(21)之兩端或單一環繞於該外管(10)之內管壁(11)之兩端的凹槽,在加工上更為簡便。Alternatively, it may be a single groove that surrounds both ends of the inner wall (21) of the inner tube (20) or a single groove that surrounds the inner tube wall (11) of the outer tube (10). Simple.
再請參看第五圖所示,所形成之凹槽可為複數自該內管(20)之一端部(23)貫穿至另一端部(23)的凹槽(22'),以填充更多的焊料,使得內管與外管之間接合得更為緊密。其凹槽貫穿的方式不限於直線,亦可能以螺旋的方式自該內管之一端部貫穿至另一端部。Referring again to the fifth figure, the groove formed may be a plurality of grooves (22') extending from one end (23) of the inner tube (20) to the other end (23) to fill more The solder is such that the inner tube and the outer tube are more closely joined. The manner in which the groove is penetrated is not limited to a straight line, and may also spirally penetrate from one end of the inner tube to the other end.
實施例Example
實施例一:Embodiment 1:
提供長度為1000.0mm,內徑為132.5mm的管狀銀靶材,與長度為1400.0mm,外徑為133.0mm的管狀不鏽鋼背襯管進行接合。因銀的熱膨脹係數約為19.5×10-6 /K,將銀靶材由室溫25℃加熱至500℃後,銀靶材內徑變為133.7mm,此時將維持室溫25℃之不鏽鋼背襯管插入銀靶材內,待銀靶材冷卻至室溫即完成接合,內管之外徑和外管之內徑之差值(咬合量)為0.5mm。接合後之管狀銀靶材其偏轉度以及垂直度均小於0.05mm,同心度可小於1.0mm。銀的降伏應變約為0.25%,該咬合量設定對於內徑132.5mm的應變量約為0.38%,約為降伏應變之1.5倍(N=1.5)。A tubular silver target having a length of 1000.0 mm and an inner diameter of 132.5 mm was provided and joined to a tubular stainless steel backing tube having a length of 1400.0 mm and an outer diameter of 133.0 mm. Since the thermal expansion coefficient of silver is about 19.5×10 -6 /K, after the silver target is heated from room temperature to 25 ° C to 500 ° C, the inner diameter of the silver target becomes 133.7 mm, and the stainless steel at room temperature of 25 ° C is maintained. The backing tube was inserted into the silver target, and the silver target was cooled to room temperature to complete the joining, and the difference between the outer diameter of the inner tube and the inner diameter of the outer tube (biting amount) was 0.5 mm. The tubular silver target after joining has a degree of deflection and a perpendicularity of less than 0.05 mm, and the concentricity may be less than 1.0 mm. The downward strain of silver is about 0.25%, and the amount of the bite setting is about 0.38% for the inner diameter of 132.5 mm, which is about 1.5 times the assumed strain (N=1.5).
實施例二:Embodiment 2:
提供長度為850.0mm,內徑為70.0mm的管狀氧化銦錫靶,與長度為1000.0mm,外徑為70.15mm的管狀不鏽鋼背襯管進行接合。因氧化銦錫的熱膨脹係數約為7.5×10-6 /K,不鏽鋼管熱膨脹係數約為10.5×10-6 /K,將氧化銦錫靶由室溫25℃加熱至525℃後,氧化銦錫靶內徑變為70.26mm;將不鏽鋼管由室溫25℃冷凍至-75℃後,不鏽鋼管內徑變為70.08mm;此時將不鏽鋼背襯管插入氧化銦錫靶內,待氧化銦錫靶以及不鏽鋼管恢復至室溫即完成接合,咬合量為0.15mm。接合後之管狀氧化銦錫靶其偏轉度以及垂直度均小於0.05mm,同心度可小於1.0mm。氧化銦錫的降伏應變約為0.21%,該咬合量設定對於內徑70.0mm的應變量約為0.21%,約為降伏應變之1倍(N=1.0)。A tubular indium tin oxide target having a length of 850.0 mm and an inner diameter of 70.0 mm was provided, and joined to a tubular stainless steel backing tube having a length of 1000.0 mm and an outer diameter of 70.15 mm. Since the thermal expansion coefficient of indium tin oxide is about 7.5×10 -6 /K, the thermal expansion coefficient of the stainless steel tube is about 10.5×10 -6 /K, and the indium tin oxide target is heated from room temperature 25 ° C to 525 ° C, indium tin oxide. The inner diameter of the target is changed to 70.26 mm; after the stainless steel tube is frozen from room temperature to 25 ° C to -75 ° C, the inner diameter of the stainless steel tube is changed to 70.08 mm; at this time, the stainless steel backing tube is inserted into the indium tin oxide target to be indium tin oxide. The target and the stainless steel tube were brought back to room temperature to complete the joint, and the bite amount was 0.15 mm. The tubular indium tin oxide target after bonding has a degree of deflection and a perpendicularity of less than 0.05 mm, and the concentricity may be less than 1.0 mm. The indium tin oxide has a drop strain of about 0.21%, and the bite amount is set to be about 0.21% for the inner diameter of 70.0 mm, which is about 1 times the drop strain (N = 1.0).
實施例三:Embodiment 3:
提供長度為1000.0mm,內徑為100.0mm的管狀鋁靶材,與長度為1400.0mm,外徑為101.0mm的管狀不鏽鋼背襯管進行接合。因鋁的熱膨脹係數約為23.2×10-6 /K,將鋁靶材由室溫25℃加熱至525℃後,鋁靶材內徑變為101.2mm,此時將維持室溫25℃之不鏽鋼背襯管插入鋁靶材內,待鋁靶材冷卻至室溫即完成接合,內管之外徑和外管之內徑之差值(咬合量)為1.0mm。接合後之管狀鋁靶材其偏轉度以及垂直度均小於0.05mm,同心度可小於1.0mm。鋁的降伏應變約為0.25%,該咬合量設定對於內徑100.0mm的應變量約為1%,約為降伏應變之4倍(N=4)。A tubular aluminum target having a length of 1000.0 mm and an inner diameter of 100.0 mm was provided and joined to a tubular stainless steel backing tube having a length of 1400.0 mm and an outer diameter of 101.0 mm. Since the thermal expansion coefficient of aluminum is about 23.2×10 -6 /K, after the aluminum target is heated from room temperature to 25 ° C to 525 ° C, the inner diameter of the aluminum target becomes 101.2 mm, and the stainless steel at room temperature of 25 ° C is maintained. The backing tube was inserted into the aluminum target, and the joint was completed when the aluminum target was cooled to room temperature, and the difference (biting amount) between the outer diameter of the inner tube and the inner diameter of the outer tube was 1.0 mm. The tubular aluminum target after joining has a degree of deflection and a perpendicularity of less than 0.05 mm, and the concentricity may be less than 1.0 mm. The drop strain of aluminum is about 0.25%, and the amount of bite is set to about 1% for the inner diameter of 100.0 mm, which is about 4 times the strain (N=4).
對照例一:Comparative example 1:
提供長度為1000.0mm,內徑為132.6mm的管狀銀靶材,與長度為1400.0mm,外徑為132.8mm的管狀不鏽鋼背襯管進行接合。因銀的熱膨脹係數為19.5×10-6 /K,將銀靶材由室溫25℃加熱至500℃後,銀靶材內徑變為133.8mm,此時將維持室溫25℃之不鏽鋼背襯管插入銀靶材內,待銀靶材冷卻至室溫即完成接合,咬合量為0.2mm。接合後之管狀銀靶材其偏轉度以及垂直度均小於0.05mm,同心度可小於1.0mm。該咬合量設定對於內徑132.6mm的應變量約為0.15%,約為降伏應變之0.6倍(N=0.6)。A tubular silver target having a length of 1000.0 mm and an inner diameter of 132.6 mm was provided and joined to a tubular stainless steel backing tube having a length of 1400.0 mm and an outer diameter of 132.8 mm. Since the thermal expansion coefficient of silver is 19.5×10 -6 /K, after the silver target is heated from room temperature to 25 ° C to 500 ° C, the inner diameter of the silver target becomes 133.8 mm, and the stainless steel back at room temperature of 25 ° C is maintained. The liner was inserted into the silver target, and the silver target was cooled to room temperature to complete the bonding, and the bite amount was 0.2 mm. The tubular silver target after joining has a degree of deflection and a perpendicularity of less than 0.05 mm, and the concentricity may be less than 1.0 mm. The amount of the bite setting was about 0.15% for the inner diameter of 132.6 mm, and about 0.6 times the drop strain (N=0.6).
將實施例一、二、三以及對照例一中接合完成之靶材以相同之濺鍍參數進行濺鍍測試,實施例一、二、三之靶材在濺鍍功率由1kW調整至5kW時靶材溫度仍維持在50℃以下;但對照例一之靶材在濺鍍功率僅1kW時,靶材溫度已大於150℃,顯示其接合緊密度不足造成導熱效果不佳。The targets of the first, second, third and comparative examples were sputter-sputtered with the same sputtering parameters, and the targets of the first, second and third targets were adjusted from 1 kW to 5 kW. The temperature of the material is still below 50 °C; however, the target temperature of the target of Comparative Example 1 is greater than 150 ° C when the sputtering power is only 1 kW, indicating that the joint tightness is insufficient to cause poor thermal conductivity.
由上述實施例與對照例可知,實施例一中咬合量設計相對於靶材內徑的應變量約為降伏應變之1.5倍,實施例二中咬合量設計相對於靶材內徑的應變量約為降伏應變之1.0倍,實施例三中咬合量設計相對於靶材內徑的應變量約為降伏應變之4.0倍,而對照例約為降伏應變之0.6倍;實施例中接合完成的靶材導電性及散熱性良好,而對照例則有嚴重散熱不良的問題。因此本發明藉由控制內管和外管的材料以及咬合量,即能以熱漲冷縮的基本原理解決既有製作中空柱狀靶材的困難,且利用簡單的製程製作出具有緊密接合之靶材材料和背襯管的靶材,以供產業上利用。It can be seen from the above embodiment and the comparative example that the strain amount design in the first embodiment is about 1.5 times the strain of the target inner diameter, and the occlusion amount in the second embodiment is about the strain of the target inner diameter. For the 1.0 times of the strain, the amount of the bite design in Example 3 is about 4.0 times the strain of the target, and the control is about 0.6 times the strain; the bonded target in the example. The conductivity and heat dissipation were good, while the control example had a problem of severe heat dissipation. Therefore, the present invention solves the difficulty of fabricating a hollow cylindrical target by controlling the material of the inner tube and the outer tube and the amount of occlusion, that is, the basic principle of heat expansion and contraction, and the production of the tight joint by a simple process. Target materials and targets for backing tubes for industrial use.
(10)...外管(10). . . Outer tube
(11)...內管壁(11). . . Inner wall
(12)...凹槽(12). . . Groove
(20)...內管(20). . . Inner tube
(22)(22')...凹槽(22)(22'). . . Groove
(23)...端部(twenty three). . . Ends
第一圖係本發明之外管與內管組合前的端視示意圖。The first figure is a schematic end view of the outer tube and the inner tube of the present invention before being combined.
第二圖係本發明之內管的端視剖面圖。The second drawing is an end sectional view of the inner tube of the present invention.
第三圖係本發明之外管的端視剖面圖。The third drawing is an end sectional view of the outer tube of the present invention.
第四圖係本發明之內管一態樣的立體圖。The fourth figure is a perspective view of an inner tube of the present invention.
第五圖係本發明之內管另一態樣的立體圖。The fifth drawing is a perspective view of another aspect of the inner tube of the present invention.
(10)...外管(10). . . Outer tube
(20)...內管(20). . . Inner tube
Claims (11)
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Citations (2)
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US20040074770A1 (en) * | 2002-07-02 | 2004-04-22 | George Wityak | Rotary target |
TW200831687A (en) * | 2006-08-03 | 2008-08-01 | Samsung Corning Prec Glass Co | Rotatable target assembly |
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US20040074770A1 (en) * | 2002-07-02 | 2004-04-22 | George Wityak | Rotary target |
TW200831687A (en) * | 2006-08-03 | 2008-08-01 | Samsung Corning Prec Glass Co | Rotatable target assembly |
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