TWI411140B - Led package structure using two-count package and method of manufacturing the same - Google Patents

Abstract

An LED package structure using two-count package includes a light-emitting chip unit, an insulative unit, a first conductive unit, a substrate unit and a package unit. The light-emitting chip unit has a positive conductive layer and a negative conductive layer. The insulative unit is formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a positive pad formed on the positive conductive layer and a negative pad formed on the negative conductive layer. The light-emitting chip unit is electrically disposed on the substrate unit. The light-emitting chip unit and one part of the top surface of the substrate unit are covered with the package unit.

Description

Light-emitting diode package structure using secondary package and manufacturing method thereof

The invention relates to a light emitting diode package structure and a manufacturing method thereof, in particular to a light emitting diode package structure using a secondary package and a manufacturing method thereof.

Referring to the first figure, the conventional LED package structure is completed in a single package. The conventional LED package structure has a light-emitting diode unit 1a, a substrate unit 5a, a conductive unit 3a and a package unit 7a.

The upper surface of the illuminating die unit 1a has a positive conductive layer Pa and a negative conductive layer Na, and the illuminating die unit 1a is electrically disposed on the substrate through the two wires 30a of the conductive unit 3a. On the unit 5a, the package unit 7a is finally used to cover the above-mentioned light-emitting bare cell unit 1a, the conductive unit 3a and part of the substrate unit 5a to complete the conventional light-emitting diode package structure.

However, the fabrication of the above-described illuminating die unit 1a and the packaging of the conventional illuminating diode package structure may be separately undertaken by two manufacturers. For the manufacturer of the illuminating die unit 1a, if the illuminating die unit 1a is used, When the protection is not well protected, the yield of the illuminating die unit 1a will be greatly affected, that is, the illuminating may be caused by factors such as a bump during the transportation of the illuminating die unit 1a. The bare crystal unit 1a forms a defective product.

The reason is that the inventors have felt that the above-mentioned defects can be improved, and based on the relevant experience in this field for many years, carefully observed and studied, and in conjunction with the application of the theory, a present invention which is reasonable in design and effective in improving the above-mentioned defects is proposed. .

The technical problem to be solved by the present invention is to provide a light-emitting diode package structure using a secondary package and a manufacturing method thereof, which are capable of illuminating in the process of transporting the light-emitting bare crystal unit by means of secondary packaging. The bare crystal unit is protected.

In addition, the present invention passes through the first package to fabricate the positive electrode conductive pad and the negative electrode conductive pad of the light emitting bare cell, so the present invention does not need to go through any wire bonding process; The packaged illuminating die unit is electrically disposed on a substrate unit to electrically connect the illuminating die unit to the substrate unit; and finally, the second package is performed to complete the fabrication of the present invention.

In order to solve the above technical problem, according to one aspect of the present invention, a light emitting diode package structure using a secondary package is provided, comprising: a light emitting bare cell, an insulating unit, a first conductive unit, and a substrate unit. And a package unit. The illuminating die unit has a positive conductive layer and a negative conductive layer. The insulating unit is formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a positive conductive pad formed on the positive conductive layer and a negative conductive pad formed on the negative conductive layer. The upper surface of the substrate unit has at least one positive conductive region and one negative conductive region, wherein the positive conductive pad is electrically contacted with the positive conductive region and the negative conductive pad is electrically contacted with the negative conductive region to The illuminating die unit is electrically disposed on the substrate unit. The package unit covers the light emitting bare cell and a portion of the upper surface of the substrate unit.

In order to solve the above technical problem, according to one aspect of the present invention, a method for fabricating a light emitting diode package structure using a secondary package is provided, comprising the steps of: firstly, providing a light emitting bare crystal unit having a positive electrode conductive a layer and a negative electrode conductive layer; then, forming an insulating unit between the positive electrode conductive layer and the negative electrode conductive layer; and then forming a positive electrode conductive pad and a negative electrode conductive pad on the positive electrode conductive layer and the negative electrode, respectively On the conductive layer, the first package is completed. Next, the light-emitting die unit is electrically disposed on a substrate unit, wherein the upper surface of the substrate unit has at least one positive conductive region and one negative conductive region. The positive electrode conductive pad is electrically connected to the positive electrode conductive region, and the negative electrode conductive pad is electrically connected to the negative electrode conductive region; finally, a package unit is used to cover the light emitting bare cell and a part of the upper surface of the substrate unit .

Therefore, the beneficial effects of the present invention are that the illuminating bare crystal unit can be perfectly protected during the transportation process by means of the secondary encapsulation, and thus the yield of the illuminating bare crystal unit is greatly improved.

In order to further understand the technology, the means and the effect of the present invention in order to achieve the intended purpose, refer to the following detailed description of the invention and the accompanying drawings. The detailed description is to be understood as illustrative and not restrictive.

Referring to the second figure, and the second A to the second H, the present invention provides a method for fabricating a light emitting diode package structure using a secondary package, which includes the following steps:

Step S100 is: as shown in FIG. 2 and FIG. 2A, firstly, a light-emitting bare crystal unit 1 having a positive conductive layer P and a negative conductive layer N, wherein the light-emitting bare crystal unit 1 is provided The light-emitting body 10 and a light-emitting area A formed in the light-emitting body 10 are formed on the light-emitting body 10, and the negative conductive layer N is formed on the light-emitting body 10. In addition, the illuminating body 10 has an alumina substrate 100, a gallium nitride negative electrode layer 101 formed on the alumina substrate 100, and a gallium nitride formed on the GaN negative electrode layer 101. The electrode layer 102 is further formed on the gallium nitride positive electrode layer 102, and the negative electrode conductive layer N is formed on the gallium nitride negative electrode layer 101.

In step S102, an insulating material R is formed on the light-emitting bare crystal unit 1 as shown in the second figure and the second figure B.

Step S104 is: please remove part of the insulating material R as shown in the second figure and the second C, so as to expose only the positive conductive layer P and the negative conductive layer N and located on the positive conductive layer P and One of the insulating units 2 between the negative electrode conductive layers N. Therefore, the steps of "forming an insulating unit 2 between the positive conductive layer P and the negative conductive layer N" are completed through the above steps S102 and S104.

Step S106 is to form a conductive material C on the insulating unit 2, the positive conductive layer P and the negative conductive layer N as shown in the second figure and the second figure D.

Step S108 is: as shown in FIG. 2 and FIG. 26E, a portion of the conductive material C is removed to form insulation with each other and electrically connected to the positive conductive layer P and one of the negative conductive layers N, respectively. The conductive pad 30 and a negative conductive pad 31 are used to complete the first package of the present invention. Therefore, the steps of "forming a positive electrode conductive pad 30 and a negative electrode conductive pad 31 on the positive electrode conductive layer P and the negative electrode conductive layer N, respectively" are completed through the above steps S106 and S108.

In step S100, the illuminating die unit 1 is electrically disposed on a substrate unit 5, wherein the upper surface of the substrate unit 5 has at least one positive conductive region. And a negative conductive region 51, the positive conductive pad 30 is electrically connected to the positive conductive region 50 through a conductive body 60, and the negative conductive pad 31 is electrically connected to the conductive member 61. Negative electrode conductive region 51. In addition, according to different design requirements, the upper surface area of each of the electrical conductors (60, 61) occupies 30% to 100% of the upper surface area of the positive conductive pad 30 or the negative conductive pad 31, and The upper surface area of the positive electrode conductive pad 30 is larger than the upper surface area of the negative electrode conductive pad 31.

Step S112 is to cover the upper surface of the light-emitting bare crystal unit 1 and the substrate unit 5 with a package unit 7 as shown in the second figure and the second G picture, and the package is required according to different design requirements. The unit 7 can be a transparent package or a fluorescent package.

Therefore, the second G diagram of the present invention provides a light emitting diode package structure using a secondary package, comprising: a light emitting die unit 1, an insulating unit 2, a first conductive unit 3, and a light emitting diode package. The substrate unit 5, a second conductive unit 6, and a package unit 7.

The illuminating die unit 1 has a positive conductive layer P and a negative conductive layer N. The insulating unit 2 is formed between the positive electrode conductive layer P and the negative electrode conductive layer N. The first conductive unit 3 has a positive conductive pad 30 formed on the positive conductive layer P and a negative conductive pad 31 formed on the negative conductive layer N. The above structure forms the first package unit.

In addition, the upper surface of the substrate unit 5 has at least a positive conductive region 50 and a negative conductive region 51, wherein the positive conductive pad 30 is electrically connected to the positive conductive region 50 and the negative conductive pad 31. The negative conductive region 51 is contacted such that the light emitting bare cell 1 is electrically disposed on the substrate unit 5. Furthermore, the second conductive unit 6 has two conductors (60, 61), such as solder or solder paste, and the like. The two conductors (60, 61) are respectively disposed between "the positive conductive pad 30 and the positive conductive region 50" and "between the negative conductive pad 31 and the negative conductive region 51", and each The upper surface area of the electric conductor (60, 61) occupies 30% to 100% of the area of the upper surface of the positive electrode conductive pad 30 or the negative electrode conductive pad 31, and the upper surface area of the positive electrode conductive pad 30 is larger than The upper surface area of the negative electrode conductive pad 31.

The package unit 7 is a transparent package or a fluorescent package. In addition, according to different design requirements, the fluorescent package system can be "a fluorescent colloid formed by mixing a silicone rubber and a fluorescent powder" or a fluorescent colloid formed by mixing an epoxy resin and a fluorescent powder.

In summary, the present invention is used to fabricate the positive conductive pad 30 and the negative conductive pad 31 of the illuminating die unit 1 through the first package. Therefore, the present invention does not need to pass any wire bonding process; The above-mentioned once-encapsulated illuminating die unit 1 is electrically disposed on a substrate unit 5 to electrically connect the illuminating die unit 1 and the substrate unit 5; finally, the second package is performed. (The package unit 7 is employed) to complete the fabrication of the present invention.

All the scope of the present invention is intended to be included in the scope of the present invention, and all those skilled in the art should be included in the scope of the present invention. Variations or modifications that can be readily conceived within the scope of the invention are encompassed by the scope of the patents herein below.

[知知]

1a. . . Illuminated bare cell

Pa. . . Positive conductive layer

Na. . . Negative electrode conductive layer

3a. . . Conductive unit

30a. . . wire

5a. . . Substrate unit

7a. . . Package unit

[this invention]

1. . . Illuminated bare cell

P. . . Positive conductive layer

N. . . Negative electrode conductive layer

10. . . Illuminated body

100. . . Alumina substrate

101. . . Gallium nitride negative electrode layer

102. . . Gallium nitride positive electrode layer

A. . . Luminous area

R. . . Insulation Materials

2. . . Insulation unit

C. . . Conductive material

3. . . First conductive unit

30. . . Positive conductive pad

31. . . Negative electrode conductive pad

5. . . Substrate unit

50. . . Positive conductive area

51. . . Negative electrode conductive region

6. . . Second conductive unit

60. . . Electrical conductor

61. . . Electrical conductor

7. . . Package unit

The first figure is a schematic structural view of a conventional light-emitting diode package structure using a single package;

The second figure is a flow chart of a method for fabricating a light emitting diode package structure using a secondary package according to the present invention;

2A to 2G are respectively schematic diagrams showing a manufacturing process of a method for fabricating a light emitting diode package structure using a secondary package according to the present invention.

1. . . Illuminated bare cell

P. . . Positive conductive layer

N. . . Negative electrode conductive layer

2. . . Insulation unit

3. . . First conductive unit

30. . . Positive conductive pad

31. . . Negative electrode conductive pad

5. . . Substrate unit

50. . . Positive conductive area

51. . . Negative electrode conductive region

6. . . Second conductive unit

60. . . Electrical conductor

61. . . Electrical conductor

7. . . Package unit

Claims (8)

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a light emitting bare crystal unit having a positive conductive layer and a negative conductive layer; forming an insulating unit between the positive conductive layer and the negative conductive layer Forming a positive electrode conductive pad and a negative electrode conductive pad on the positive electrode conductive layer and the negative electrode conductive layer to complete the first package; the light emitting die unit is electrically disposed on a substrate unit The upper surface of the substrate unit has at least one positive conductive region and a negative conductive region, the positive conductive pad electrically contacts the positive conductive region, and the negative conductive pad is electrically contacted to the negative conductive region; And using a package unit to cover the light emitting bare cell and a portion of the upper surface of the substrate unit. The method for fabricating a light-emitting diode package structure according to claim 1, wherein the step of forming the insulating unit between the positive electrode conductive layer and the negative electrode conductive layer further comprises: forming an insulating material And a portion of the insulating material is removed to form an insulating unit that exposes only the positive conductive layer and the negative conductive layer and is located between the positive conductive layer and the negative conductive layer. The method for fabricating a light emitting diode package structure according to claim 1, wherein the step of forming the positive electrode conductive pad and the negative electrode conductive pad on the positive conductive layer and the negative conductive layer respectively , and further includes: Forming a conductive material on the insulating unit and a portion of the light emitting bare cell; and removing a portion of the conductive material to form the positive conductive pads electrically insulated from each other and electrically connected to the positive conductive layer and the negative conductive layer, respectively And negative conductive pads. The method of fabricating a light emitting diode package structure according to claim 1, wherein the package unit is a transparent package or a fluorescent package. The method for fabricating a light emitting diode package structure according to claim 4, wherein the fluorescent package system comprises a phosphor colloid formed by mixing a silicone rubber and a phosphor powder. The method for fabricating a light emitting diode package structure according to claim 4, wherein the fluorescent package system is a phosphor colloid formed by mixing an epoxy resin and a phosphor powder. The method for fabricating a light-emitting diode package according to claim 1, wherein the light-emitting diode unit has a light-emitting body and a light-emitting region formed in the light-emitting body, and the positive conductive layer and the light-emitting layer The negative conductive layers are all formed on the light emitting body. The method for fabricating a light emitting diode package structure according to claim 7, wherein the light emitting system has an aluminum oxide substrate, a gallium nitride negative electrode layer formed on the aluminum oxide substrate, and a forming a gallium nitride positive electrode layer on the gallium nitride negative electrode layer, and the positive electrode conductive layer is formed on the gallium nitride positive electrode layer, and the negative electrode conductive layer is formed on the gallium nitride negative electrode layer.