TWI411064B - Microelectromechanical system - Google Patents

Microelectromechanical system Download PDF

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Publication number
TWI411064B
TWI411064B TW99107653A TW99107653A TWI411064B TW I411064 B TWI411064 B TW I411064B TW 99107653 A TW99107653 A TW 99107653A TW 99107653 A TW99107653 A TW 99107653A TW I411064 B TWI411064 B TW I411064B
Authority
TW
Taiwan
Prior art keywords
wafer
cover
layer
movable plate
movable
Prior art date
Application number
TW99107653A
Other languages
English (en)
Chinese (zh)
Other versions
TW201110274A (en
Inventor
Hiroaki Tachibana
Kiyohiko Kawano
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009062805A external-priority patent/JP2010220344A/ja
Priority claimed from JP2009062844A external-priority patent/JP2010217397A/ja
Priority claimed from JP2009275848A external-priority patent/JP5551923B2/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201110274A publication Critical patent/TW201110274A/zh
Application granted granted Critical
Publication of TWI411064B publication Critical patent/TWI411064B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW99107653A 2009-03-16 2010-03-16 Microelectromechanical system TWI411064B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009062805A JP2010220344A (ja) 2009-03-16 2009-03-16 可動構造体及びそれを用いたマイクロミラー素子
JP2009062844A JP2010217397A (ja) 2009-03-16 2009-03-16 マイクロミラー素子
JP2009275848A JP5551923B2 (ja) 2009-12-03 2009-12-03 Ｍｅｍｓデバイス

Publications (2)

Publication Number Publication Date
TW201110274A TW201110274A (en) 2011-03-16
TWI411064B true TWI411064B (zh) 2013-10-01

Family

ID=42739676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99107653A TWI411064B (zh) 2009-03-16 2010-03-16 Microelectromechanical system

Country Status (2)

Country Link
TW (1) TWI411064B (fr)
WO (1) WO2010107016A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745154B (zh) * 2019-11-07 2021-11-01 大陸商上海茗富半導體有限公司 製造光感測裝置和具有平面內及出平面運動的裝置的方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9276080B2 (en) 2012-03-09 2016-03-01 Mcube, Inc. Methods and structures of integrated MEMS-CMOS devices
US10036635B2 (en) 2013-01-25 2018-07-31 MCube Inc. Multi-axis MEMS rate sensor device
US10132630B2 (en) 2013-01-25 2018-11-20 MCube Inc. Multi-axis integrated MEMS inertial sensing device on single packaged chip
US9249012B2 (en) 2013-01-25 2016-02-02 Mcube, Inc. Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures
US10046964B2 (en) 2013-03-07 2018-08-14 MCube Inc. MEMS structure with improved shielding and method
KR101522670B1 (ko) * 2014-08-19 2015-05-26 주식회사 이노칩테크놀로지 압전 소자 및 이를 구비하는 전자기기
CN105607249B (zh) * 2015-12-21 2018-06-26 西安励德微系统科技有限公司 一种单侧不等高梳齿驱动的微扭转镜
EP3896838B8 (fr) * 2019-01-22 2023-08-30 The University of Tokyo Élément collecteur d'énergie stimulé par vibrations
JP7090249B2 (ja) * 2019-06-06 2022-06-24 国立大学法人 東京大学 静電型デバイスを製造する製造方法
WO2021140944A1 (fr) * 2020-01-10 2021-07-15 京セラ株式会社 Dispositif résonateur piézoélectrique
CN111965811A (zh) * 2020-09-10 2020-11-20 上海汽车集团股份有限公司 一种三维mems扫描镜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1062448A (ja) * 1996-08-14 1998-03-06 Murata Mfg Co Ltd 外力検出装置
JP2007283413A (ja) * 2006-04-13 2007-11-01 Nippon Signal Co Ltd:The アクチュエータ及びその製造方法
JP2008048388A (ja) * 2006-07-21 2008-02-28 Konica Minolta Opto Inc 撮像ユニットおよび撮像装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1062448A (ja) * 1996-08-14 1998-03-06 Murata Mfg Co Ltd 外力検出装置
JP2007283413A (ja) * 2006-04-13 2007-11-01 Nippon Signal Co Ltd:The アクチュエータ及びその製造方法
JP2008048388A (ja) * 2006-07-21 2008-02-28 Konica Minolta Opto Inc 撮像ユニットおよび撮像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745154B (zh) * 2019-11-07 2021-11-01 大陸商上海茗富半導體有限公司 製造光感測裝置和具有平面內及出平面運動的裝置的方法

Also Published As

Publication number Publication date
WO2010107016A1 (fr) 2010-09-23
TW201110274A (en) 2011-03-16

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