TWI409424B - Heat pipe and its manufacturing method - Google Patents

Abstract

It is an object of the invention to provide a heat pipe which can ensure the sealing effect under a high temperature condition, and has a further long life in comparison with the conventional ones, and a method for manufacturing the same. Another object of the invention is to provide a heat pipe which has an improved productivity and reduces the cost, and, has a further long life in comparison with the conventional ones. According to a heat pipe 1 of the invention, an upper plate reinforcement member 50, an intermediate plate reinforcement member 52, a slit-provided reinforcement member 55 and a lower plate reinforcement member 60 adhere tightly to one another to form a support structure in vapor diffusion flow paths 44 facing the peripheral regions of a refrigerant charging hole 4 and an air outlet port 5. Therefore, the heat pipe 1 can receive external force from a press 75 by the support structure constituted by the upper plate reinforcement member 50, the intermediate reinforcement member 52, the slit-provided reinforcement member 55, and the lower plate reinforcement member 60, thus preventing an upper plate 2 or a lower plate 3 from being damaged by that external force and an interior space 10a from being crushed.

Description

Heat pipe and manufacturing method thereof

The present invention relates to a heat pipe and a method of manufacturing the same, and more particularly to a heat pipe suitable for use in a thin type and a flat plate shape.

The heat exchangers are described in Japanese Laid-Open Patent Publication No. 2002-039693 and Japanese Patent Application Laid-Open No. 2004-077120. In such a heat pipe, a separator or the like which is formed of a thin plate having a hole for circulating a refrigerant is stacked in a plurality of layers, and a cooling unit body (container) having a refrigerant circulation space therein is superposed on the overlapped upper and lower members, and the like. The refrigerant circulation space in the body is sealed with a refrigerant such as water.

Here, the refrigerant in the cooling unit body is sealed, for example, by providing a hole on the side surface or the upper surface or the lower surface of the heat pipe, and injecting a refrigerant into the inside through the hole, and after the injection, the method is closed by caulking or the like.

In such a heat pipe, since the heat pipe is formed of a thin plate member, there is an advantage that a thin flat heat pipe can be provided, and a portion of each of the refrigerant circulation holes is overlapped with each other to form a flow path through which the refrigerant passes, and the capillary phenomenon is caused by the capillary phenomenon. There are several advantages of the offset portion of the refrigerant circulation hole being moved, and the thermal conductivity is good.

Such a heat pipe is more suitable for heat dissipation such as a CPU (Central Processing Unit) or an LED (Light Emitting Diode) than a metal body having the same metal, shape, and volume, which has a heat dissipation effect several times to several tens of times. The importance of high heat dissipation of the device.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-039693, Patent Document 2: JP-A-2004-077120

However, in the past, after the water is injected into the cooling unit body, for example, as a refrigerant, the refrigerant injection hole is closed by the sealing member. Then, as the material of such a sealing member, solder is known, but in this case, the material of the cooling unit main body (for example, copper, copper-based material, or aluminum or aluminum-based material) and the material of the sealing member are different. Then, the refrigerant enclosed in the internal space of the cooling unit body contacts the cooling unit body and the sealing member, and may have a local battery function.

That is, in the refrigerant, even if the pure water containing no ions (charged impurities) is sufficiently used, it is difficult to avoid containing a small amount of ions. Therefore, in the body of the cooling unit, a local battery is inevitably formed to cause a local battery action, and corrosion is caused thereby. Therefore, in such a heat pipe, it has been planned to be long-lived in the past, and it is desired to prevent corrosion due to local battery action and to achieve a longer life than before.

Further, when solder is used as the sealing member, since the melting point of the solder is low, for example, it is possible to reduce or even eliminate the sealing effect at a high temperature of about 180 to 220 ° C. Therefore, it is desirable to continue to exhibit the sealing effect reliably even at a high temperature.

However, as described above, the heat pipes and the like described in Japanese Laid-Open Patent Publication No. 2002-039693 and JP-A-2004-077120 have become weaker in mechanical strength as they are reduced in size and thickness. When the member closes the refrigerant injection hole, the cooling portion body is damaged by the refrigerant injection hole portion.

In other words, in the cooling unit body, the refrigerant injection hole is disposed at the position of the cooling circulation hole of the corresponding partition plate, and the sealing member is pressed into the refrigerant injection hole to be closed, and the refrigerant is injected around the hole by the force applied to the sealing member. When there is damage such as crushing, there is a problem that it is difficult to improve productivity. Further, in the use process, there is a possibility that the portion of the refrigerant injection hole is broken.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat pipe and a method of manufacturing the same that can continue to be more durable than before, even if the sealing effect can be surely exhibited even at a high temperature. In addition, we aim to provide a heat pipe that can improve productivity and to reduce costs and longevity.

A heat pipe according to the present invention includes: a cooling unit body formed of a metal that forms a circulation path of a refrigerant in an internal space; a refrigerant injection hole formed in the cooling unit body, injecting the refrigerant into the internal space; and sealing The member is configured such that the refrigerant is sealed in the internal space to close the refrigerant injection hole, and the sealing member is made of a plastic metal which is homogenous or similar to the cooling unit body.

The heat pipe of the present invention is characterized in that it comprises: a cooling portion body which is formed by a circulation path of a refrigerant in an internal space by one or a plurality of intermediate plates disposed between the upper plate and the lower plate; and a refrigerant injection hole, which is formed In the cooling unit body, the refrigerant is injected into the internal space of the cooling unit body by a sealing member, and the intermediate plate includes a reinforcing portion formed in a portion corresponding to a peripheral region of the refrigerant injection hole. a predetermined thickness; and a hole for a refrigerant, which is formed in a portion corresponding to the refrigerant injection hole.

A heat pipe according to the present invention includes: a cooling unit body formed of a metal that forms a circulation path of a refrigerant in an internal space; and a refrigerant injection hole formed in the cooling unit body to inject the refrigerant into the internal space When the sealing member is closed, the refrigerant is injected into the internal space by the refrigerant injection hole in the form of fine particles.

The heat pipe of the present invention comprises: a cooling portion body which is formed by one or a plurality of intermediate plates disposed between the upper plate and the lower plate, and forms a metal in a circulation path of the refrigerant in the internal space; the refrigerant injection hole is formed The cooling unit body is injected into the internal space of the cooling unit body; and the sealing member is configured such that the refrigerant is sealed in the internal space to close the refrigerant injection hole, and the sealing member is configured by the cooling unit body a medium or similar plasticity metal, the intermediate plate comprising: a reinforcing portion formed in a portion corresponding to a peripheral region of the refrigerant injection hole and having a predetermined thickness; and a refrigerant hole formed in the corresponding portion The refrigerant injection hole is injected into the internal space by the refrigerant injection hole in the form of fine particles in the form of fine refrigerant.

In the heat pipe of the present invention, the sealing member that closes the refrigerant injection hole is not protruded from the surface of the cooling portion body.

In the heat pipe of the present invention, a gas release groove is formed in an inner circumferential surface of the refrigerant injection hole, and the state in which the external space is communicated with the internal space is maintained until the refrigerant injection hole is completely closed by the sealing member. When the refrigerant injection hole is completely closed, it is closed by the above sealing member.

In the heat pipe of the present invention, the circulation path includes a vapor diffusion flow path in which the refrigerant is vapor-diffused, and a portion corresponding to the refrigerant injection hole is disposed in the vapor diffusion flow path, and the refrigerant is in the vapor diffusion flow along the refrigerant. The inside of the road is formed with a slit in the diffusion direction of vapor diffusion.

A method of manufacturing a heat pipe according to the present invention includes: a step of injecting the refrigerant into an internal space of the cooling unit body in which a refrigerant is formed in a circulation path of a cooling medium formed by a metal; a sealing member made of a plastic metal which is homogenous or similar to the cooling unit body is placed in the loading step of the refrigerant injection hole; and the sealing member is closed by pressurizing the sealing member under vacuum to seal the refrigerant injection hole The closing step.

A method of manufacturing a heat pipe according to the present invention includes: a step of injecting the refrigerant into an internal space of the cooling unit body in which a refrigerant circulation path is formed by a refrigerant injection hole formed in a cooling unit body; and sealing the refrigerant injection hole a step of placing a member; and a step of closing the refrigerant injection hole by pressurizing the sealing member under vacuum, wherein the refrigerant is made into a fine particle shape in the injection step by the refrigerant The injection hole is injected into the above internal space.

A method of manufacturing a heat pipe according to the present invention includes: preparing a circulation path for forming a refrigerant in an internal space by one or a plurality of intermediate plates provided between the upper plate and the lower plate, wherein the intermediate plate is formed correspondingly to the above a portion of the peripheral region of the upper plate or the lower plate into which the refrigerant injection hole has a reinforcing portion having a predetermined thickness, and a step of preparing a cooling portion body for forming a refrigerant hole in a portion corresponding to the refrigerant injection hole; and the refrigerant injection hole a step of injecting the refrigerant into the internal space of the cooling unit body; a step of placing the sealing member on the refrigerant injection hole; and sealing the sealing member by vacuuming the sealing member to close the refrigerant injection hole Sealing step.

The method for manufacturing a heat pipe according to the present invention includes: preparing a circulation path for forming a refrigerant in an internal space by one or a plurality of intermediate plates provided between the upper plate and the lower plate, and forming the corresponding upper plate on the intermediate plate Or a portion of a peripheral portion of the refrigerant injection hole of the lower plate to form a reinforcing portion having a predetermined thickness, and a step of preparing a cooling portion main body formed by a metal having a hole for a refrigerant corresponding to the refrigerant injection hole; and the refrigerant a step of injecting the refrigerant into the inner space of the cooling unit body; and a sealing member formed of a plasticity metal similar to or similar to the cooling unit body, placed on the refrigerant injection hole; and by vacuum The sealing step of pressing the sealing member to close the refrigerant injection hole by the sealing member is characterized in that the refrigerant is injected into the internal space by the refrigerant injection hole in the injection step.

In the method of manufacturing a heat pipe according to the present invention, the sealing step is performed until the sealing member completely closes the refrigerant injection hole, and the outside of the air venting groove formed on the inner circumferential surface of the refrigerant injection hole is connected to the internal space. status.

In the method of manufacturing a heat pipe according to the present invention, the sealing step is performed by pressurizing the sealing member by vacuuming the sealing member to pre-seal the refrigerant injection hole. The above refrigerant injection hole is completely sealed.

According to the heat pipe of the first aspect of the patent application and the method of manufacturing the heat pipe of the sixth aspect, it is possible to provide a heat pipe which can continue to exhibit a sealing effect even at a high temperature and which can be expected to be longer than the previous one.

In addition, according to the heat pipe of the fourth item of the patent application, it is possible to provide a heat pipe that is more productive than the previous one, and which can be cheaper and more long-lived.

According to the present invention, after the refrigerant is injected into the internal space of the cooling unit body having the refrigerant injection hole, a sealing member made of a plastic metal which is homogenous or similar to the cooling unit body is placed on the refrigerant injection hole, and is pressurized by vacuum. The sealing member seals the refrigerant injection hole. Further, in order to obtain a reliable sealing effect by the sealing member, the sealing member is pressure-bonded by the pressurization heating, thereby completely sealing the cooling injection hole to manufacture the heat pipe.

In the heat pipe, the cooling system is made of metal, and the sealing member is made of a plastic metal which is homogenous or similar to the body of the cooling portion. Even if the cooling unit body and the sealing member are in contact with the refrigerant or exposed, the cooling portion is not generated. The body and the partial battery function of the sealing member can prevent corrosion due to the action of the local battery, and can be designed to be longer and longer than before.

In addition, when a metal such as gold, silver, copper, a copper-based material, or aluminum or aluminum is used as the material of the cooling unit body and the sealing member, the melting point is high, and the solder is heated at a temperature of about 200 to 300 ° C. The sealing effect can still be maintained, and the sealing effect can be surely continued even at a high temperature.

Further, in the embodiment to be described later, as the heat pipe, a cooling portion main body formed by sandwiching one or a plurality of flat plate-like plates between the upper plate and the lower plate is used. The cooling unit body has a circulation path formed therein by one or a plurality of intermediate plates, and includes a flow path for diffusing the vapor toward the peripheral portion side of the cooling unit body (hereinafter, this is referred to as a vapor diffusion flow path). And a flow path (hereinafter, referred to as a capillary flow path) in which the refrigerant flows in the vertical direction or the oblique direction by the capillary phenomenon when viewed between the upper plate and the lower plate. Incidentally, a concave groove portion formed in a lattice shape or the like is formed on the inner surface of the upper plate, and a concave portion formed in the inner surface below the upper plate (hereinafter referred to as an upper inner groove portion) is formed. And a concave portion (hereinafter, referred to as a lower inner groove portion) formed on the inner surface of the lower plate communicates with the vapor diffusion flow path and the capillary flow path.

Further, each of the regions partitioned by the upper inner groove portion and the lower inner groove portion is formed with a convex column whose front end portion is planar. Here, since the front end of the boss column is planar, it can be adhered to the middle plate. Here, in the following embodiments, the upper inner groove portion and the lower inner surface groove portion are formed in a lattice shape, but may be formed into other shapes such as a mesh. At this time, the raised columns will be correspondingly formed into a square, a circle, an ellipse, a polygon, and a star.

In addition, the heat pipe can be formed into a radial shape by, for example, a full-angle corner portion including four corners, and the whole of the cooling unit body can be used comprehensively to efficiently heat the device to be cooled. diffusion. The heat dissipation can make the heat transfer efficiency high, and it can be said that it is most suitable as a heat pipe. Here, the shape of the vapor diffusion channel may be a strip shape or a trapezoidal shape, or may be widened or narrowed from the central portion toward the peripheral portion in accordance with the width dimension, or may be in various other shapes.

When the intermediate plates are plural, the overlapping holes for the vapor diffusion channels can be completely overlapped, and the holes for the vapor diffusion channels can be shifted in the width direction. When the middle plate is one piece, the hole for the vapor diffusion flow path itself becomes a vapor diffusion flow path.

Further, when the intermediate plates are plural, the capillary flow paths that communicate with the vapor diffusion flow paths are formed by overlapping the plurality of intermediate plates and overlapping the through holes. Furthermore, each of the intermediate plate through holes has a case where each of the intermediate plates is formed in a different pattern, or all of the intermediate plates are formed in the same pattern. Further, when the intermediate plate is one piece, the through hole itself becomes a capillary flow path.

In other words, the positions, shapes, and sizes of the respective through holes of the intermediate plates can be completely matched, and the intermediate plates are placed on the capillary channels corresponding to the same position, the same shape, and the same size as the through holes of the intermediate plates. The aspect between the board and the lower board. In the through hole at this time, the shape of the capillary flow path may be, for example, a rectangle (for example, a square or a rectangle), or may have a curvature R at an angle. Further, the substrate has a rectangular shape, and a surface of a part or all of the surface (the inner circumferential surface of the capillary flow path) may be wavy or wrinkled, and the surface area may be widened. Because the surface area of the inner peripheral surface of the capillary flow path is wider, the cooling effect is stronger. Further, the shape of the capillary channel may be hexagonal, circular, or elliptical.

However, when the upper and lower plates are viewed from above and below, the cross-sectional area of the capillary flow path in the plane direction orthogonal to the vertical direction is formed smaller, and the plurality of intermediate plates are completely matched by the through holes. The position is suitably offset, and only one overlap allows the substantial cross-sectional area of the capillary flow path to be smaller than the cross-sectional area of the parallel direction of each of the through holes of the intermediate plate.

Specifically, for example, when two intermediate plates are used, the size, shape, and positional pitch of the through holes of the two intermediate plates are the same, and the arrangement position is in a predetermined direction (for example, in the lateral direction (the through hole is quadrangular) When one of the directions is shifted by one-half of the arrangement pitch, the substantial cross-sectional area of the capillary flow path can be reduced to about one-half of the sectional area of the through-hole of each intermediate plate. Further, the arrangement position of the through holes of the two intermediate plates is shifted in the direction intersecting the one direction (for example, the longitudinal direction (the direction orthogonal to the direction of one side of the through hole)), so that the capillary flow path can be obtained. The substantial sectional area is reduced to about one-fourth of the sectional area of each of the through holes of the middle plate. Further, in the case where the intermediate plates are arranged to be displaced from the through holes, the refrigerant is formed not only in the vertical direction but also as a capillary flow path that flows in the upward direction in the oblique direction.

The cooling unit body or the material of the sealing member constituting the upper plate, the lower plate and the intermediate plate of the cooling unit body, and the refrigerant injection hole is closed, and is made of copper such as copper or copper alloy, such as heat conductivity and mechanical strength. The metal is preferably, but is not limited thereto, and may be, for example, aluminum or an aluminum alloy having advantages such as a low material cost, an aluminum-containing metal containing aluminum, or an iron-based metal such as iron, iron alloy or stainless steel, or gold. silver.

Further, when the cooling portion body is formed of a copper-based metal such as copper or a copper alloy, the surface of the outer surface of the cooling portion main body including copper or a copper-based metal sealing member is usually plated with nickel.

Then, the refrigerant can be said to have the best latent heat (pure water, distilled water, etc.), but is not limited to water, and is preferably ethanol, methanol, acetone or the like.

The refrigerant injection hole is formed by an opening that is closed by the sealing member placed and an exhaust groove formed on the inner circumferential surface thereof, and when the sealing member is closed, the exhaust portion is exhausted through the exhaust groove. .

In other words, when the refrigerant injection hole is sealed by the sealing member in the heat pipe, vacuum degassing can be performed through the exhaust groove, and even if the harmful component of the corrosion cooling unit body exists in the internal space, the air in the internal space is discharged through the exhaust groove. Together with this air, the harmful components are surely removed from the internal space. Further, by removing the impurities adhering to the inner surface of the main body of the cooling unit in advance, it is possible to provide a heat pipe which can suppress the degassing of the inner surface after sealing and prevent the life from being deteriorated due to internal corrosion.

Then, in the heat pipe, by heating. The sealing member made of a plastic metal is pressurized, and the sealing member is plastically deformed and pressure-bonded to form a sealing plug. Therefore, in the heat pipe, the exhaust groove can be reliably closed by the sealing member, whereby the refrigerant injection hole can be completely shielded, so that the refrigerant is sealed in the internal space of the cooling unit body, and the refrigerant can be surely prevented from leaking out.

Further, the refrigerant injection hole may be injected into the internal space by the nozzle, and the air discharge hole of the same size may be provided in the cooling unit body. When the refrigerant is injected through the refrigerant injection hole, the air in the internal space passes through the air. The discharge hole is released, and the injection of the refrigerant can be performed smoothly.

A normal nozzle may be used for the supply of the refrigerant, and the refrigerant may be injected into the cooling unit body in a mist form by using an ink jet nozzle or the like as a fine refrigerant particle.

Thereby, it is possible to prevent a large water droplet from adhering to the periphery of the refrigerant injection hole, and the refrigerant injection hole is covered with the water droplet by the surface tension of the refrigerant, and the decompression operation for preventing the water droplet from being generated and decompressing the internal space can be omitted. At this time, it is preferable to supply the nozzle in a non-contact manner with the cooling unit body.

Further, even if the air discharge hole is not provided in the cooling unit main body, the refrigerant can be injected from the refrigerant injection hole, and it is preferable that the air discharge hole is provided so that the refrigerant injection can be performed more smoothly. Further, when the air discharge hole is provided in the cooling unit body outside the refrigerant injection hole, the sealing member is closed, and not only the refrigerant injection hole but also the air discharge hole.

Incidentally, as a nozzle for supplying a refrigerant in a mist form, there is an ink jet nozzle or a micro-dispenser in which the refrigerant can be made into a small fine particle shape, and a nephel-level dispenser which can further make the refrigerant into ultrafine particles can be used. .

However, the heat pipe is required to be smaller and thinner than the cooling device, and the cooling unit itself is required to be smaller and thinner. Therefore, since the strength is weakened, it is easy to inject the refrigerant of the cooling unit body. The hole is closed by a metal such as copper, or the process is broken.

In this case, the heat pipe of the present invention is provided in the inner space of the cooling unit body, and the reinforcing portion having a predetermined thickness is provided in a portion corresponding to the peripheral region of the refrigerant injection hole, and is raised in the peripheral region of the refrigerant injection hole. The mechanical strength can prevent breakage in the production process or the use process, and can be plotted at a lower price than before, and can be designed to be long-lived.

When a plurality of intermediate plates are provided, the reinforcing portions are laminated and adhered to all of the intermediate plates, and the reinforcing portions form a pillar structure, whereby the mechanical strength of the peripheral region of the refrigerant injection holes can be further enhanced. Furthermore, it is also possible to provide a reinforcing portion only for a part of the middle plate.

Further, when the reinforcing portion is provided in a portion corresponding to the peripheral region of the refrigerant injection hole, it is preferable that the refrigerant hole that communicates with the refrigerant injection hole is formed in the reinforcing portion in correspondence with the portion of the refrigerant injection hole. When the refrigerant is injected into the internal space through the refrigerant injection hole, the refrigerant can be completely filled with the intermediate plate or the lower plate by the refrigerant hole and the slit.

Further, when the portion corresponding to the refrigerant injection hole is disposed on the vapor diffusion flow path of the hollow structure formed by the intermediate plate, the slit may be formed along the direction in which the refrigerant passes through the vapor diffusion flow path. Thereby, the refrigerant which is a vapor which diffuses in the vapor diffusion flow path is diffused to the peripheral portion without being hindered by the reinforcing portion, and the heat radiation effect can be maintained. Further, the slit may be formed in all the reinforcing portions of the intermediate plate, or may be formed only in a part of the intermediate plate reinforcing portion.

Example

Hereinafter, the present invention will be described in detail in accordance with the illustrated embodiments.

Fig. 1 is a view showing the appearance of the outer surface of the heat pipe 1 of the embodiment. The heat pipe 1 includes a copper-based metal upper plate 2 and a lower plate 3 which are made of a high thermal conductivity material such as copper or a copper alloy. The outer surface 2a of the upper plate 2 is connected to the refrigerant injection hole 4 and the air discharge hole. 5. In the case of this embodiment, the refrigerant injection hole 4 is provided in the vicinity of the corner portion of one of the pair of opposite corner portions, and the air discharge hole 5 is provided on the diagonal line with the corner portion of the one side. Near the corner of the other side.

The refrigerant injection hole 4 and the air discharge hole 5 are connected to the outside by the internal air space (described later) in the air discharge hole 5, and the refrigerant is injected into the internal space by the refrigerant injection hole 4, and then the upper and lower sides are filled with the refrigerant. The sealing member 8 made of a copper-based metal of the same shape of the plate 2 and the lower plate 3 is plastically deformed and sealed.

FIG. 2A showing the cross-sectional structure of the A-A' portion of the heat pipe 1 of FIG. 1 and FIG. 2B showing the cross-sectional structure of the B-B' portion of the heat pipe 1 of FIG. 1 on the lower plate 3 A cooling device HE such as an IC (semiconductor integrated circuit), an LSI (large integrated circuit), or a heating element such as a CPU is mounted on the lower central portion.

Actually, the heat pipe 1 is formed by sequentially laminating the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, and the first intermediate plate 6b on the lower plate 3, and further to the first intermediate plate. The upper plate 2 is laminated on the 6b, and the cooling unit body 10 is formed by direct joint integration based on the positioning holes not shown in the drawing.

Incidentally, the term "direct bonding" as used herein refers to pressurizing the first and second faces to be joined, and applying heat treatment to cause atoms to interact with each other by acting on the interatomic force between the first and second faces. The first and second face-integrators can be integrated without the use of an adhesive.

In the internal space 10a of the cooling unit body 10, the first intermediate plates 6a, 6b and the second intermediate plates 7a, 7b are alternately laminated in this order to form a portion as shown in Fig. 2A, which is provided with the cooled device HE. The vapor diffusion channel 44 radially extending toward the peripheral portion 12 and the capillary channel 42 as shown in FIG. 2B are opposed to the region and its peripheral region (hereinafter referred to as the peripheral region of the cooling device) 33a. 2A is a cross-sectional view of a portion of the cooling portion main body 10 divided into a capillary flow path 42 and a vapor diffusion flow path 44, and FIG. 2B is a cross-sectional view of a portion of the cooling portion main body 10 filled with the capillary flow path 42. .

In the internal space 10a of the cooling unit body 10, a refrigerant W composed of a predetermined amount of water is sealed under reduced pressure, whereby the boiling point of the refrigerant W is lowered, and the refrigerant W is vaporized by the slight heat of the cooling device HE. The gas is circulated through the vapor diffusion channel 44 and the capillary channel 42.

Next, the detailed structures of the upper plate 2, the first intermediate plates 6a and 6b, the second intermediate plates 7a and 7b, and the lower plate 3 of the present embodiment are shown. First, the vapor diffusion flow path 44 and the capillary flow path 42 will be briefly described. as follows. 3A shows the structure of the outer surface 2a above the upper plate 2, and FIG. 3B shows the structure of the lower surface 2b of the upper plate 2. 4A shows the structure of the lower surface 3a of the lower plate 3, and FIG. 4B shows the structure of the inner surface 3b of the lower plate 3. 5 is a view showing a structure in which the first intermediate plates 6a and 6b of the upper plate 2 and the lower plate 3 are sandwiched, and FIG. 6 is the same as the first intermediate plates 6a and 6b, showing the first plate 2 and the lower plate 3 sandwiched therebetween. 2 The structure of the intermediate plates 7a, 7b.

The upper plate 2 has a main body portion 21 which is formed of a substantially square shape having a thickness of, for example, about 500 μm as shown in Fig. 3B. In addition to the frame-shaped peripheral portion 12, the inner surface 2b of the main body portion 21 is formed with an upper inner surface groove portion 23 recessed in a lattice shape. The upper plate 2 is a region in which the upper inner groove portion 23 is partitioned into a lattice shape, and each of the upper plates 2 is provided with a convex column 24 whose front end portion is planar.

The lower plate 3 has a main body portion 11 which is formed of a substantially square shape having a thickness of, for example, about 500 μm as shown in Fig. 4B. On the inner surface 3b of the main body portion 11, in addition to the frame-shaped peripheral portion 12, an upper inner surface groove portion 14 recessed in a lattice shape is formed. The lower plate 3 is a region in which the upper inner groove portion 14 is partitioned into a lattice shape, and each of the lower plates 3 is provided with a convex column 15 whose front end portion is planar.

Further, the main body portion 31 of the first intermediate plates 6a, 6b and the main body portion 32 of the second intermediate plates 7a, 7b as shown in Fig. 5 are the same as the upper plate 2 and the lower plate 3, respectively. The copper-based metal is formed to have a thickness of, for example, about 70 to 200 μm, and is formed in a substantially square shape similar to the main body portion 11 of the lower plate 3.

Here, the first intermediate plates 6a and 6b are the same size and the same shape. Hereinafter, only the first intermediate plate 6a among the first intermediate plates 6a and 6b will be described. As shown in FIG. 5, a vapor diffusion channel hole 34 and a capillary formation region 36 are formed in the main body portion 31 of the first intermediate plate 6a. The capillary formation region 36 is a region between the cooling device peripheral region 33a and the adjacent vapor diffusion channel hole 34, and is constituted by a region 33b other than the cooling device peripheral region 33a. Further, the peripheral portion 33a to be cooled is a region facing the cooling device HE provided on the lower plate 3 when the main body portion 31 is laminated on the main body portion 11 of the lower plate 3. The vapor diffusion channel hole 34 is formed in a strip shape, and is radially extended by the peripheral portion 33a of the cooling device including the four corners.

In the capillary forming region 36, a plurality of through holes 37 forming the capillary flow path 42 (FIGS. 2A and 2B) are bored in a first pattern (described later). Actually, the capillary forming region 36 has a lattice-shaped partition wall 38, and each of the regions partitioned by the partition wall 38 serves as a through hole 37.

As shown in FIG. 7, the through-holes 37 are formed in a quadrangular shape, and are arranged in a predetermined pattern as a first pattern, and each of the four sides is arranged in parallel with the four sides of the peripheral portion 12 of the outer periphery of the main body portion 32 (Fig. 5). Incidentally, in the case of this embodiment, the width of the through hole 37 can be selected to be, for example, about 280 μm, and the width of the partition wall 38 can be selected to be, for example, about 70 μm.

On the other hand, the second intermediate plates 7a and 7b shown in Fig. 6 are formed in the same size as the first intermediate plates 6a and 6b. Here, the following description will be focused on only the second intermediate plate 7a among the second intermediate plates 7a and 7b. As shown in FIG. 6, the second intermediate plate 7a is provided with a capillary forming region 36 and a vapor diffusion channel hole 34 in the same manner as the first intermediate plates 6a and 6b, but a plurality of through holes penetrating the capillary forming region 36. 40. The second pattern (described later) different from the first pattern is pierced. In the capillary forming region 36 of the second intermediate plate 7a, a lattice-shaped partition wall 41 is formed, and each of the regions partitioned by the partition wall 41 serves as a through hole 40. As shown in FIG. 7, the through-holes 40 are formed in a quadrangular shape, and are arranged in a regular pattern at a predetermined interval as in the first pattern, and each of the four sides is adjacent to the peripheral portion 12 of the main body portion 32. The four sides are arranged in parallel, and are disposed only at a predetermined distance from each of the through holes 37 of the first intermediate plate 6a.

In this embodiment, for example, when the first intermediate plate 6a and the second intermediate plate 7a are positioned and laminated, the through hole 37 of the first intermediate plate 6a is directed to the X direction of the side of one of the through holes 40 of the second intermediate plate 7a. One-half of the offset side, and is placed in the Y direction of the other side orthogonal to the X direction of the one side by one-half of the offset side. Thereby, one through hole 37 of the first intermediate plate 6a overlaps with the four through holes 40 adjacent to the second intermediate plate 7a, and four capillary flow paths 42 can be obtained. Thereby, a capillary flow path 42 which is much smaller than each of the through holes 37 and 40 and which has a small surface area can be formed in the through hole 37.

However, in the heat pipe 1, the second intermediate plates 7a, 7b and the first intermediate plates 6a, 6b are alternately laminated, and as shown in Fig. 8, the through holes 37, 40 are offset to form the capillary flow path 42, and the vapor The diffusion channel holes 34 overlap each other to form a vapor diffusion channel 44. Further, the vapor diffusion flow path 44 and the capillary flow path 42 are connected via the upper plate inner surface groove portion 23 and the lower plate inner surface groove portion 14 (FIGS. 2A and 2B).

Thereby, as shown in FIG. 9A of the side view of the heat pipe 1, which is a side view of the A-A' of FIG. 1 where the vapor diffusion flow path 44 and the capillary flow path 42 are provided, since it is in the peripheral region 33a of the device to be cooled Since the refrigerant W is always present in each of the capillary channel 42, the refrigerant W in each capillary channel 42 rapidly and surely absorbs heat from the convex portion of the peripheral portion 33a of the cooling device to evaporate, and is extended to The vapor diffusion channel 44 of the peripheral portion 12, the upper plate inner surface groove portion 23, and the lower plate inner surface groove portion 14 diffuse the refrigerant W.

In other words, as shown in FIG. 10 showing the front structure of the first intermediate plate 6a, the refrigerant W is located along the vapor diffusion flow path 44 and the inner surface groove portion of the lower plate 3 as the center of the cooling device HE. 23 and the lower inner groove portion 14 are uniformly diffused radially to diffuse the peripheral portion 12.

Then, in the heat pipe 1, as shown in FIG. 9B of the side cross-sectional structure of FIG. 1B-B' where the capillary flow path 42 is filled, the upper plate inner surface groove portion 23 and the lower plate inner surface groove portion 14 are formed. The refrigerant W that has been condensed and condensed by the peripheral portion 12 enters the capillary channel 42 from the upper plate inner surface groove portion 23 and the lower plate inner surface groove portion 14, and is returned to the cooling device peripheral region 33a by the capillary flow path 42 or the like. As a result, as shown in FIG. 11 showing the front structure of the first intermediate plate 6a, the refrigerant W can be uniformly cooled by the periphery of the cooled device HE by the capillary flow path 42 of the radially disposed region 33b. .

Next, the structure of the peripheral region of the refrigerant injection hole 4 and the air discharge hole 5 of the cooling unit main body 10 of the present invention will be described below. In addition, since the refrigerant injection hole 4 and the air discharge hole 5 have the same structure, it is convenient to explain, and only the refrigerant injection hole 4 will be described below.

Fig. 12A is a front elevational view showing a detailed configuration of a portion of the vicinity of the refrigerant injection hole 4 formed on the lower surface 2b of the upper plate 2, and a cross-sectional view taken along the line C-C' of the front view. The lower surface 2b of the upper plate 2 is provided with a circular upper plate reinforcing portion 50 formed in a peripheral region of the refrigerant injection hole 4 so as to surround the refrigerant injection hole 4. The upper plate reinforcing portion 50 has a thickness larger than the upper plate inner surface groove portion 23, and is selected to have the same thickness as the thickness of the boss column 24 and the peripheral portion 12 provided in the upper plate inner surface groove portion 23.

In the case of the embodiment, the refrigerant injection hole 4 has a diameter of, for example, 500 to 1000 μm in the center of the cylindrical opening 4a, and an exhaust groove 4b is formed on the inner circumferential surface. The recessed portion 4c is formed by stably placing the sealing member 8 on the opening portion 4a and the exhaust groove 4b.

In the case of this embodiment, the exhaust groove 4b is formed in a semicircular shape having a diameter smaller than the diameter of the opening portion 4a as shown in Fig. 15A showing the front surface structure of the refrigerant injection hole 4, and is formed in the inner circumference of the opening portion 4a. The surface has four structures arranged at equal intervals.

12B and 12D are front views showing a detailed structure of a portion in the vicinity of the plate reinforcing portion 52 formed in the first intermediate plates 6a and 6b. The plate reinforcing portion 52 of the first intermediate plate 6a is formed in the same shape as the upper plate reinforcing portion 50 in the original shape, and is formed at a position facing the upper plate reinforcing portion 50. In the case of this embodiment, the intermediate plate reinforcing portion 52 is integrally formed in the partition wall 38 by the vapor diffusion passage hole 34, and the corner portion of the vapor diffusion channel hole 34 is partitioned. Further, the intermediate plate reinforcing portion 52 is selected to have the same thickness as that of the partition wall 38 and the peripheral portion 12, and the refrigerant hole 53 is bored at a position facing the opening portion 4a of the refrigerant injection hole 4 of the upper plate 2.

12C and FIG. 12E are front views showing a part of the vicinity of the reinforcing portion 55 having slits formed in the second intermediate plates 7a and 7b. The reinforcing portion 55 having slits in the second intermediate plates 7a and 7b is integrally formed with the partition wall 41, and is formed with a slit 56 that communicates with the vapor diffusion passage hole 34 and a plate among the first intermediate plates 6a and 6b. The reinforcing portions 52 have the same configuration. The refrigerant hole 57 is formed to penetrate the opening 4a of the refrigerant injection hole 4 of the upper plate 2, and has a structure in which the slit 56 is communicated.

Actually, the reinforcing portion 55 having the slit is in the diffusion direction in which the vapor is diffused in the vapor diffusion channel hole 34 (in this case, the direction from the center point of the second intermediate plates 7a and 7b toward the corner portion) D forms a slit 56 which communicates with the vapor diffusion channel hole 34 to diffuse the vapor to the corners. Further, the slit 56 is formed, for example, in a linear shape, and the width thereof is selected to be about 0.3 mm.

Fig. 12F is a front elevational view showing a detailed configuration of a portion of the vicinity of the plate reinforcing portion 60 formed on the lower surface 3b of the lower plate 3. The inner surface 3b of the lower plate 3 is provided in a region facing the intermediate plate reinforcing portion 52 and the reinforcing portion 55 having the slit, and is formed in a circular lower plate reinforcing portion 60. The lower plate reinforcing portion 60 has a thickness smaller than that of the lower plate inner surface groove portion 14 and is selected to have the same thickness as the thickness of the boss column 15 and the peripheral portion 12 provided between the lower plate inner surface groove portion 14. The lower plate reinforcing portion 60 is formed with a slit opposing groove 61 and a central concave portion 62 that communicate with the lower plate inner surface groove portion 14. The slit opposing groove 61 has a width of, for example, about 300 μm, and is formed linearly with respect to the slit 56 in the lower plate reinforcing portion 60. The central recessed portion 62 is formed in a circular shape in a portion opposed to the opening portion 4a of the refrigerant injection hole 4 of the upper plate 2.

13 is a view showing that the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, and the first intermediate plate 6b are sequentially stacked on the lower plate 3, and then laminated on the first intermediate plate 6b. A cross-sectional view showing the detailed structure of the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion 60 in the upper plate 2.

Below the peripheral region of the refrigerant injection hole 4 of the upper plate 2, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion 60 are closely formed to form a pillar structure, thereby lifting the machine. strength.

Further, the refrigerant injection hole 4 is continuously dropped from the refrigerant injection hole 4 by the nozzle 70, and the refrigerant particles W1 continuously dropped at a high speed (for example, 1000 drops per second) pass through the opening 4a of the upper plate 2 and the refrigerant hole 53 of the first intermediate plate 6b. The refrigerant hole 57 and the like of the second intermediate plate 7b reach the slit opposing groove 61 and the central recess 62 of the lower plate 3, and reach the internal space 10a (Fig. 2A) of the cooling unit body 10 via the respective slits 56. Composition.

Next, a description will be given of a method of manufacturing the heat pipe 1 as follows. 14A to FIG. 14E, FIG. 16A and FIG. 16B show an example of a method of manufacturing the heat pipe 1. As shown in FIG. 14A, first, the second intermediate plate 7a and the first intermediate layer are sequentially stacked on the lower plate 3. The plate 6a, the second intermediate plate 7b, the first intermediate plate 6b, and the upper plate 2.

In the first intermediate plates 6a and 6b and the second intermediate plates 7a and 7b, the projection projections 72 having the upper projections are formed in a frame shape along the peripheral portion 12. Further, in the lower plate 3, the engaging projections 73 projecting from the upper surface 3b of the main body portion 11 are formed in a frame shape along the peripheral portion 12.

Next, the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, the first intermediate plate 6b, and the upper plate 2 are superposed on the lower plate 3 at an optimum position, and the upper plate 2 and the upper plate 2 are The lower plate 3, the first intermediate plates 6a and 6b, and the second intermediate plates 7a and 7b are heated at a temperature equal to or lower than the melting point, and are pressurized, and are directly joined via the joining projections 72 and 73.

As shown in FIG. 14B, the upper plate 2, the lower plate 3, the first intermediate plates 6a and 6b, and the second intermediate plates 7a and 7b are integrally joined to each other to obtain an integrated cooling portion main body 10. At this time, the cooling unit main body 10 is in a state in which the internal space 10a is communicated with the outside only via the refrigerant injection hole 4 and the air discharge hole 5 formed in the upper plate 2.

Incidentally, the first intermediate plates 6a and 6b, the second intermediate plates 7a and 7b, and the lower plate 3 are respectively provided with projections 74 at the outer peripheral positions of the central portions of the central portion opposed to the cooling device HE, not only the peripheral portions. 12, the position around the peripheral portion 33a of the device to be cooled, and the like are also directly joined by the projections 74 to be integrated. In the cooling unit main body 10, the pillar structure is also provided in the peripheral portion 33a of the cooling device to increase the mechanical strength, and the heat generated by the self-contained cooling device HE is prevented from being thermally expanded and expanded outward from the substantially central portion (hereinafter, This is called a popcorn phenomenon), and the cooling unit body 10 itself is destroyed.

Then, the vapor diffusion channel 44 is formed by overlapping the vapor diffusion channel holes 34 of the first intermediate plates 6a and 6b and the second intermediate plates 7a and 7b in the internal space 10a of the cooling unit body 10, and by The overlapping of the capillary forming regions 36 also forms a plurality of capillary channels 42 to obtain a circulation path composed of the vapor diffusion channel 44 and the capillary channel 42 (Figs. 9A and 9B).

At this time, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion 60 are adhered to each other under the peripheral regions of the refrigerant injection hole 4 and the air discharge hole 5 to form a pillar. structure.

Next, as shown in Fig. 14C showing the method of manufacturing the heat pipe 1, the refrigerant W1 (for example, water) is injected into the internal space 10a of the cooling unit body 10 by the nozzle 70 from the refrigerant injection hole 4 at atmospheric pressure. At this time, the air discharge hole 5 serves as an air discharge port at the time of supply of the refrigerant, and the injection of the refrigerant into the internal space 10a can be made smooth. Further, in the case where the refrigerant is, for example, water, the amount of sealing is preferably equal to the total volume of the equivalent through holes 37 and 40, and in order to increase the life of the heat pipe 1, particularly, ultrapure water having no ion contamination is preferable. Further, at this time, when the air is discharged into the air discharge hole 5, the injection of the refrigerant can be made smoother.

Next, for example, the sealing member 8 formed of a spherical body is prepared in advance in a predetermined number, and FIG. 14D which sequentially shows the manufacturing method of the heat pipe 1, and the sealing member 8 is placed in the refrigerant injection hole 4 and the air discharge hole 5. Here, as shown in FIG. 15A, the refrigerant injection hole 4 and the air discharge hole 5 are formed with a plurality of exhaust grooves 4b on the inner circumferential surface of the opening 4a. Therefore, even if the sealing member 8 of the spherical body is placed, as shown in the figure As shown in FIG. 15B, the exhaust space 4b maintains the internal space 10a of the cooling unit main body 10 in an open state, and the exhaust in the internal space 10a of the cooling unit main body 10 can be performed.

Then, as shown in Fig. 14E showing the method of manufacturing the heat pipe 1, in this state, the exhaust gas is blown through the exhaust groove 4b at a normal temperature for, for example, 10 minutes, and degassed by vacuum under reduced pressure. At this step, the air in the internal space 10a is discharged through the exhaust groove 4b by vacuum degassing through the exhaust groove 4b, and the harmful components are removed from the internal space 10a together with the air, thereby reducing degassing. Further, the arrow in Fig. 14E indicates the direction of degassing (exhaust).

Thereafter, as shown in Fig. 16A showing the manufacturing method of the heat pipe 1, the sealing member 8 is pressed by the press machine 75 for a few minutes to be subjected to low temperature pressurization deformation in a normal temperature state. The refrigerant injection hole 4 and the air discharge hole 5 are pre-sealed by the sealing member 8 by such a low-temperature vacuum pressure treatment. At this time, the refrigerant injection hole 4 and the air discharge hole 5 are closed by the sealing member 8.

Here, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion 60 are adhered to each other in the portion opposed to the peripheral portion of the refrigerant injection hole 4 and the air discharge hole 5. When the sealing member 8 is pressed by the press 75, the force from the press machine 75 is received by the pillar structure, and the internal space 10a is not crushed, and the press machine 75 is surely opposed by the necessary external force. The sealing member 8 is pressurized.

Incidentally, when the sealing member 8 is pressed at a temperature higher than a normal temperature, it is not preferable that the vapor of the refrigerant, for example, water vapor, leaks to the outside easily. Therefore, it is preferable that the temperature at which vacuum degassing is performed at a normal temperature of about 25 °C.

Next, when the low-temperature vacuum pressurization treatment is completed, for example, about 10 minutes, after the degree of vacuum is made 0.55 Pa at a high temperature, the sealing member 8 is further pressurized by the press 75. Thereby, the sealing member 8 is deformed at a high temperature and is intruded into the refrigerant injection hole 4 and the air discharge hole 5 to be in a closed state in which the sealing member 8 is further firmly pressed.

That is, the sealing member 8 is mainly plastically deformed by pressurization, and by auxiliary thermoplastic deformation, the refrigerant injection hole 4 including the exhaust groove 4b and the air discharge hole 5 can be closed. Further, as shown in FIG. 15C and FIG. 16B, the sealing member 8 of the spherical body is formed into a shape of the refrigerant injection hole 4 and the air discharge hole 5 by plastic deformation, and is substantially pressed against the refrigerant injection hole 4 and the air discharge hole 5 . Sealing the plug, the internal space of the cooling body 10 10a sealed. When the sealing member 8 closes the refrigerant injection hole 4 and the air discharge hole 5, the heating is stopped, the vacuuming is stopped, and the pressurization is released, and the pressurization, heating, and vacuuming are completed.

Further, at this time, it is preferable that the outer surface of the sealing member 8 is formed on substantially the same plane as the outer surface of the cooling portion main body 10. Since the flatness of the outer surface of the heat pipe 1 is maintained, the heat pipe itself is well adhered to a cooler such as a fan attached thereto, and the thermal conductivity between the heat pipe is improved without hindrance.

Thereafter, the outer surface of the cooling unit body 10 is rust-proof or the like, and is plated with nickel. Here, it is assumed that when the refrigerant injection hole 4 and the air discharge hole 5 are closed by a sealing member made of solder, it is difficult to provide good nickel plating to the solder, so that the refrigerant injection hole 4 and the air discharge hole cannot be closed. Part 5 is subject to good nickel plating discomfort.

According to the present invention, since the sealing member 8 made of the same copper-based metal as the cooling unit body 10 is used to close the refrigerant injection hole 4 and the air discharge hole 5, such discomfort does not occur, and the refrigerant injection hole 4 is closed. Portions of the air discharge holes 5 can also be well plated with nickel.

Incidentally, according to the manufacturing method of the heat pipe 1 (refrigerant sealing method), the plurality of heat pipes 1 are arranged under vacuum, and the sealing member 8 is placed on the refrigerant injection holes 4 and the air discharge holes 5 of the heat pipes 1 for the plurality of heat pipes. 1 Exhaust together, or pressurization and heating of the sealing member 8, so that all the sealing members 8 are plastically deformed to seal the refrigerant together. Moreover, the mass production of the heat pipe 1 can be improved, and the mass productivity can be improved, compared to the previous sealing operation for each of the refrigerant injection holes 4 or the sealing operation of the welding, and the like. The cost of the heat pipe 1 is reduced.

Further, in the heat pipe 1, when the internal space 10a is in a reduced pressure state (for example, when the refrigerant is water, for example, about 0.5 KPa), the boiling point of the refrigerant is lowered, for example, a temperature slightly higher than a normal temperature of 50 ° C or lower (for example, The refrigerant solution is steamed at a temperature of 30 ° C to 35 ° C. Thereby, the heat pipe 1 is formed such that the circulation of the refrigerant can be continuously and easily repeated even with a slight heat from the device HE to be cooled.

In the above structure, the heat pipe 1 is formed by using the cooling unit body 10 made of a copper-based metal and a sealing member 8 made of a homogenous plastic metal, and the refrigerant injection hole 4 and the air card exit hole 5 are closed, even if the cooling unit body 10 is used. The sealing member 8 is in contact with or exposed to the refrigerant, and the cooling portion body 10 and the sealing member 8 do not cause local battery action. As a result, since the corrosion due to the local battery action can be prevented, the portion can be made longer and longer than before.

Further, when a plastic metal is used as the material of the cooling unit main body 10 and the sealing member 8, since the melting point is high, the sealing effect can be surely maintained even at a high temperature of about 200 to 300 °C.

In addition, when the solder is used as the sealing member 8 , the solder contains a lead of a harmful substance, so that the required management and the like are sealed by lead. However, in the present invention, since the copper-based metal is used as the material of the sealing member 8 , the lead is not required. The cost of management, this part can be plotted to reduce costs.

In addition, since the copper-based metal has high thermal conductivity and high thermal diffusibility, it can be said that the cooling unit main body 10 is preferably made of a copper-based metal. However, when the cooling unit main body 10 is formed of a copper-based metal, it is usually rust-proof or the like. Nickel is plated on the outer surface of the cooling portion body 10. When the refrigerant injection hole 4 of the cooling unit body 10 is sealed with solder, the pre-treated solder which is plated with nickel is eroded, and a plating film having a weak adhesion is formed on the surface of the solder, and a nickel plating film which is formed later is formed. The problem of weakening with the underlying layer.

On the other hand, in the heat pipe 1 of the present invention, since the cooling unit main body 10 is formed of a copper-based metal and the sealing member 8 that closes the refrigerant injection hole 4 is formed of a copper-based metal, it is possible to reliably perform the good plating on the entire periphery. nickel.

Further, in the heat pipe 1, the sealing member 8 of the spherical body is shaped to match the shape of the refrigerant injection hole 4 and the air discharge hole 5 to form a sealing plug, so that the sealing member 8 is not easily protruded from the upper surface of the heat pipe 1, It prevents the flatness of the outer surface of the heat pipe 1 from being damaged by the seal, and can improve the freedom of the configuration of the mobile phone or the small machine.

In other words, in the heat pipe 1, for example, an electronic component that needs to be radiated, such as a CPU and an LED (light emitting diode), is attached to one side, and when a fan or another cooler (heat sink) is attached to the other side, the sealing member 8 is used. Since the outer surface does not protrude from the outer surface of the cooling unit body 10, the adhesion to the electronic component or the cooler can be improved, and the thermal conductivity between the electrodes can be improved, and the electronic component can be efficiently produced. The heat is effectively dissipated.

Further, in the heat pipe 1, an exhaust groove 4b is provided in the inner peripheral surface of the opening 4a of the refrigerant injection hole 4 and the air discharge hole 5. When the sealing member 8 serving as the sealing plug is placed on the refrigerant injection hole 4 and the air discharge hole 5, the refrigerant injection hole 4 and the air discharge hole 5 are not formed even when the sealing member 8 starts to melt and is slightly sealed. The sealing member 8 is closed, and the exhaust of the internal space 10a of the heat pipe 1 can be surely performed.

Then, in the heat pipe 1, by pressurizing the sealing member under vacuum, the refrigerant injection hole 4 is pre-sealed by the sealing member 8, and further, the sealing member 8 is further pressurized and heated, and the sealing member 8 made of a plastic metal is molded. Since the deformation of the shape is deformed in accordance with the shape of the exhaust groove 4b, the exhaust groove 4b can be reliably closed by the sealing member 8, and the leakage of the refrigerant W enclosed in the internal space 10a can be prevented.

Further, in the heat pipe 1, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion are provided in portions corresponding to the peripheral regions of the refrigerant injection hole 4 and the air discharge hole 5. 60 is formed to form a pillar structure, and the mechanical strength of the peripheral region of the refrigerant injection hole 4 and the air outlet hole 5 is increased, and the internal space 10a is prevented from being crushed by the force of the press 75 applied to the sealing member 8 by the force of the upper plate 2 Damage to the manufacturing process improves productivity and results in lower production costs. Further, in the use process after the manufacture, the internal space 10a can be prevented from being crushed by various external forces applied from the upper plate 2 or the lower plate 3, and the long life of the heat pipe 1 can be reduced.

In particular, in the case of this embodiment, in order to reduce the size and thickness of the heat pipe 1, an efficient heat dissipation effect is obtained, and the vapor diffusion channel 44 and the capillary channel 42 are formed in the internal space 10 as a circulation path. Then, the vapor diffusion channel 44 is configured to diffuse heat to the peripheral portion 12 of the cooling portion body 10 to effectively dissipate heat, and is disposed to extend from the center portion to the corner portions of the four sides farthest.

On the other hand, the refrigerant injection hole 4 and the air discharge hole 5 are easily formed by making the supply of the refrigerant to the entire inside of the heat pipe 1 smooth, and the refrigerant injection hole 4 is disposed at a corner portion of one side of the heat pipe 1, and the air discharge hole 5 is provided. Configured on The corner portion of the other side opposite to the diagonal line on the other side. Further, the refrigerant injection hole 4 and the air discharge hole 5 are disposed in the vapor diffusion flow path 44 which is a hollow structure. Therefore, when the hollow structure is maintained in the region facing the refrigerant injection hole 4 and the air discharge hole 5, the sealing member 8 is placed on the refrigerant injection hole 4 and the air discharge hole 5, and the external force from the press machine 75 is increased. Since the plate 2 is received, there is a possibility that the upper plate 2 is broken.

On the other hand, in the heat pipe 1 of the present invention, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, and the slit are provided in the vapor diffusion flow path 44 opposed to the peripheral region of the refrigerant injection hole 4 and the air discharge hole 5. The reinforcing portion 55 and the lower plate reinforcing portion 60 are formed in close contact with each other to receive a force from the press machine 75, and the upper plate 2 or the lower plate 3 can be prevented from being broken by the external force to crush the internal space 10a.

Further, the upper plate reinforcing portion 50, the intermediate plate reinforcing portion 52, the slit reinforcing portion 55, and the lower plate reinforcing portion 60 are formed to communicate with the refrigerant injection hole in the portion corresponding to the refrigerant injection hole 4 of the upper plate 2, respectively. When the refrigerant holes W are injected into the internal space 10a via the refrigerant injection holes 4, the refrigerant holes 53 and 57 pass the refrigerant to the corners of the entire cooling unit body 10 via the slits 56 and the like. .

Further, at this time, the slit reinforcing portion 55 forms the slit 56 in the diffusion direction D in the refrigerant diffusion diffusion channel 44, and the slit 56 can guide the refrigerant W to the cooling portion body. The corners of the 10 are diffused into each corner of the internal space 10a to effectively dissipate heat.

The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments, and various modifications may be implemented, and a sealing member composed of a plastic metal similar to the cooling portion body 10 may be used. The same effect as above.

Further, as shown in FIG. 17, for example, when the refrigerant is supplied into the cooling unit main body 10 by using the ink jet head 80, the cooling unit main body 10 can be used without the air discharge hole. In the embodiment, the description of the shape and structure of the circulation path of the internal space 10a is omitted.

Specifically, the ink (for example, pure water) is made into a fine refrigerant particle (water particle) W2 having a diameter of 50 μm to 300 μm by the ink jet head 80, and about 1000 drops per drop of 1 drop per hour. Continuously entered. In this manner, the fine particulate refrigerant particles W2 are regularly arranged and supplied to the internal space 10a of the cooling unit body 10 in a straight line. At this time, even if one drop of one drop is very small, for example, it is continuously driven at a high speed of about 1000 drops per second, so that the refrigerant supply efficiency is extremely high.

When the inkjet nozzle 80 is used, the refrigerant can be supplied as a very fine refrigerant particle W2 at a high speed by one drop, so that the vacuum extraction operation by the air discharge hole can be omitted, and the refrigerant can be omitted. The reduction in manufacturing cost of the operation is omitted. Further, in this case, for example, the control of the amount of the refrigerant filled in a very small amount of 1 to 5 mg can be easily and quickly filled with a precision of one drop by a mechanism for controlling the number of discharges of the ink jet nozzle by a digital number. .

Figs. 18 and 19 are plan views showing the reinforcing portions 81 and 85 having slits according to another embodiment, and the slit portion 56 is different from the shape of the slit 56 in the above embodiment. As shown in FIG. 18, the reinforcing portion 81 having the slit is formed by gradually increasing the width dimension of the slit 83 from the center of the refrigerant hole 82 having a circular shape to the outer periphery of the reinforcing portion 81 having the slit. Further, as shown in FIG. 19, the reinforcing portion 85 having the slit is formed such that the width of the slit 87 is gradually narrowed toward the outer periphery of the reinforcing portion 85 having the slit by the center of the refrigerant hole 86 having a circular shape. form. The same effect as the reinforcing portion 55 having the slit of the above-described embodiment can be obtained by the slit-reinforcing portions 81 and 85. Furthermore, the width of the slits 56, 81, 85 may also be uneven for each of the intermediate plates.

Further, in the above-described embodiment, the refrigerant injection hole 4 and the air discharge hole 5 in which four semicircular exhaust grooves 4a are formed on the inner circumferential surface of the cylindrical opening 4a are described. FIG. 20A showing the front structure of the refrigerant injection hole or the air discharge hole, and FIG. 20B showing the side cross-sectional structure, the diameter of the upper end is large, and the lower end gradually becomes smaller, and the lower end diameter is used. The smallest reverse trapezoidal conical refrigerant injection hole 90a and the air discharge hole 90b. As shown in Fig. 20C, which is sealed by the sealing member 8, in this case, the sealing member 8 of the spherical body can be deformed into a flat shape by the shape of the refrigerant injection hole 90a and the air discharge hole 90b, and the inside is surely Space seal.

Further, as the refrigerant injection hole and the air discharge hole of the other embodiments, FIG. 21A showing the front structure of the refrigerant injection hole or the air discharge hole, and FIG. 21B showing the side cross-sectional structure may be used. The short cylindrical shape of the diameter constitutes the upper portion 92, and the lower portion 93 is formed by a short cylindrical shape having a small diameter, and the upper portion 92 and the lower portion 93 are integrally formed with the refrigerant injection hole 91a and the air discharge hole 91b via the segment portion 94.

In this case, as shown in Fig. 21C showing the state sealed with the sealing member 8, when the plastic deformation of the sealing member 8 is completely buried in the lower portion 93, the remaining portion of the sealing member 8 is received in the upper portion 92 of the large diameter, whereby the sealing member 8 can be prevented. It is flat from the upper surface of the heat pipe 1. Further, in Figs. 20A and 20B, and any of the examples shown in Figs. 21A and 21B, the same effects as those of the above embodiment can be obtained.

1. . . Heat pipe

2. . . On board

2a. . . On the outside

2b. . . Lower inner surface

3. . . Lower plate

3a. . . Under the outside

3b. . . Upper inner surface

4. . . Refrigerant injection hole

4a. . . Opening

4b. . . Exhaust ditch

5. . . Air exhaust hole

6a, 6b. . . First middle plate

7a, 7b. . . Second middle plate

8. . . Sealing member

10. . . Cooling unit body

10a. . . Internal space

11. . . Body part

12. . . Peripheral part

14. . . Upper inner groove

15. . . Raised column

twenty one. . . Body part

twenty three. . . Upper inner groove

twenty four. . . Raised column

32. . . Body part

33a. . . Cooling device peripheral area

33b. . . region

34. . . Vapor diffusion flow path hole

36. . . Capillary formation zone

37. . . Through hole

38. . . Partition wall

40. . . Through hole

41. . . Partition wall

42. . . Capillary flow path

44. . . Vapor diffusion flow path

50. . . Upper plate reinforcement

52. . . Medium plate reinforcement

55. . . Reinforcement with slit

56. . . Slit

57. . . Refrigerant hole

60. . . Plate reinforcement

61. . . Slot opposite groove

62. . . Central recess

70. . . nozzle

74. . . Bulge

75. . . Press

81, 85. . . Reinforcement department

82. . . Refrigerant hole

87. . . Slit

90a. . . Refrigerant injection hole

90b. . . Air exhaust hole

91a. . . Refrigerant injection hole

91b. . . Air exhaust hole

92. . . Upper

93. . . Lower part

94. . . Segment

HE. . . Cooled device

W. . . Refrigerant

W1, W2. . . Refrigerant particle

Fig. 1 is a perspective view showing the appearance of a heat pipe of the present invention.

Fig. 2A is a cross-sectional view showing the cross-sectional structure of the heat pipe of A-A' of Fig. 1.

Fig. 2B is a cross-sectional view showing the cross-sectional structure of the heat pipe of B-B' of Fig. 1.

Fig. 3A is a schematic view showing the front structure of the outer surface above the upper plate.

Fig. 3B is a schematic view showing the front structure of the inner surface below the upper plate.

Fig. 4A is a schematic view showing the front structure of the lower surface of the lower plate.

Fig. 4B is a schematic view showing the front structure of the inner surface on the lower plate.

Fig. 5 is a schematic view showing a front structure of a first intermediate plate.

Fig. 6 is a schematic view showing a front structure of a second intermediate plate.

Fig. 7 is a schematic view showing a state in which the through holes of the first intermediate plate and the through holes of the second intermediate plate are arranged.

Fig. 8 is a schematic view showing the structure of a vapor diffusion flow path and a capillary flow path formed by the first intermediate plate and the second intermediate plate.

Fig. 9A is a detailed side sectional view showing the state (1) of the circulation phenomenon of the refrigerant.

Fig. 9B is a detailed side sectional view showing the state (2) of the circulation phenomenon of the refrigerant.

Fig. 10 is a schematic view showing a state in which the refrigerant diffuses from the center portion to the peripheral portion.

Fig. 11 is a schematic view showing a state in which the refrigerant returns from the peripheral portion to the center portion.

Fig. 12A is a front elevational view showing a portion of a detailed structure of a region in the vicinity of a refrigerant injection hole formed on the inner surface of the upper plate, and a sectional view taken along the line C-C' of the front view.

Fig. 12B is a front elevational view showing a part of the detailed structure (1) formed in the vicinity of the plate reinforcing portion in the first intermediate plate.

Fig. 12C is a front elevational view showing a part of the detailed structure (1) formed in the vicinity of the reinforcing portion having the slit in the second intermediate plate.

Fig. 12D is a front elevational view showing a part of the detailed structure (2) formed in the vicinity of the plate reinforcing portion in the first intermediate plate.

Fig. 12E is a front elevational view showing a part of the detailed structure (2) formed in the vicinity of the reinforcing portion having the slit in the second intermediate plate.

Fig. 12F is a front elevational view showing a part of a detailed structure of a region in the vicinity of the inner surface of the lower plate.

Fig. 13 is a cross-sectional view showing a detailed structure of an upper plate reinforcing portion, a middle plate reinforcing portion, a slit reinforcing portion, and a lower plate reinforcing portion.

Fig. 14A is a cross-sectional view showing an example (1) of a method of manufacturing a heat pipe.

Fig. 14B is a cross-sectional view showing an example (2) of a method of manufacturing a heat pipe.

Fig. 14C is a cross-sectional view showing an example (3) of a method of manufacturing a heat pipe.

Fig. 14D is a cross-sectional view showing an example (4) of a method of manufacturing a heat pipe.

Fig. 14E is a cross-sectional view showing an example (5) of a method of manufacturing a heat pipe.

Fig. 15A is a schematic view showing a front structure of a refrigerant injection hole.

Fig. 15B is a schematic view showing a state in which a sealing member is placed on a refrigerant injection hole.

Fig. 15C is a schematic view showing a state in which the refrigerant injection hole is closed by a sealing member.

Fig. 16A is a cross-sectional view showing an example (6) of a method of manufacturing a heat pipe.

Fig. 16B is a cross-sectional view showing an example (7) of a method of manufacturing a heat pipe.

Fig. 17 is a schematic view showing a state in which a refrigerant is supplied to a cooling unit body by using an ink jet nozzle.

Fig. 18 is a schematic view showing a structure (1) having a slit reinforcing portion according to another embodiment.

Fig. 19 is a schematic view showing a structure (2) having a slit reinforcing portion according to another embodiment.

Fig. 20A is a schematic view showing a front structure (1) of a refrigerant injection hole and an air discharge hole of another embodiment.

Fig. 20B is a cross-sectional view showing a side cross-sectional structure (1) of a refrigerant injection hole and an air discharge hole of another embodiment.

Fig. 20C is a cross-sectional view showing a state in which the refrigerant injection hole and the air discharge hole of the other embodiment are closed by a sealing member.

Fig. 21A is a schematic view showing a front structure (2) of a refrigerant injection hole and an air discharge hole of another embodiment.

Fig. 21B is a cross-sectional view showing a side cross-sectional structure (2) of a refrigerant injection hole and an air discharge hole of another embodiment.

Fig. 21C is a cross-sectional view showing a state in which the refrigerant injection hole and the air discharge hole of the other embodiment are closed by a sealing member.

1. . . Heat pipe

2. . . On board

3. . . Lower plate

6a, 6b. . . First middle plate

7a, 7b. . . Second middle plate

8. . . Sealing member

10. . . Cooling unit body

10a. . . Internal space

12. . . Peripheral part

14. . . Upper inner groove

15. . . Raised column

twenty three. . . Upper inner groove

twenty four. . . Raised column

33a. . . Cooling device peripheral area

33b. . . region

42. . . Capillary flow path

44. . . Vapor diffusion flow path

50. . . Upper plate reinforcement

52. . . Medium plate reinforcement

55. . . Reinforcement with slit

60. . . Plate reinforcement

HE. . . Cooled device

W. . . Refrigerant

Claims (13)

A heat pipe includes: a cooling portion body having a circulation path formed in an inner space of the cooling portion body; a refrigerant injection hole formed in the cooling portion body; and a sealing member sealing the refrigerant injection hole to make a a refrigerant is sealed in the inner space; and a reinforcing portion is formed in a peripheral region of the refrigerant injection hole and has a predetermined thickness, wherein the circulation path includes a vapor diffusion flow path for evaporation and diffusion of the refrigerant, and A portion of the refrigerant injection hole is disposed in the evaporation diffusion flow path, and the reinforcement portion forms a slit along a direction in which the refrigerant diffuses in the vapor diffusion flow path. The heat pipe according to claim 1, wherein the cooling portion of the system forms a circulation path of the refrigerant in the inner space by being disposed between one of the upper plate and the lower plate or the plurality of intermediate plates. The heat pipe according to claim 2, wherein the refrigerant is injected into the internal space of the cooling unit body. The heat pipe according to claim 3, wherein the reinforcing portion is formed on the intermediate plate, and a refrigerant hole is formed in a portion corresponding to the refrigerant injection hole. The heat pipe of claim 4, wherein the sealing member is not protruded from a surface of the cooling portion body. The heat pipe according to claim 1, wherein the refrigerant is injected into the internal space into the fine space by the refrigerant injection hole. The heat pipe of claim 6, wherein the sealing member is not protruded from a surface of the cooling portion body. The heat pipe according to claim 1, wherein the cooling portion body is made of metal. The heat pipe of claim 8, wherein the sealing member is not protruded from a surface of the cooling portion body. The heat pipe of claim 1, wherein the sealing member is not protruded from a surface of the cooling portion body. The heat pipe according to the first aspect of the invention, wherein the inner peripheral surface of one of the refrigerant injection holes is formed with a venting groove. The heat pipe of claim 11, wherein the venting groove maintains the inner space in communication with an outer space until the sealing member completely closes the refrigerant injection hole. The heat pipe according to claim 12, wherein the sealing member closes the venting groove when the refrigerant injection hole is completely closed.