TWI407900B - - Google Patents
Info
- Publication number
- TWI407900B TWI407900B TW099120810A TW99120810A TWI407900B TW I407900 B TWI407900 B TW I407900B TW 099120810 A TW099120810 A TW 099120810A TW 99120810 A TW99120810 A TW 99120810A TW I407900 B TWI407900 B TW I407900B
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- plastic workpiece
- fixture
- emi shield
- middle layer
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201044963A TW201044963A (en) | 2010-12-16 |
TWI407900B true TWI407900B (zh) | 2013-09-01 |
Family
ID=45001521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99120810A TW201044963A (en) | 2010-06-25 | 2010-06-25 | Method of forming EMI shield on plastic workpiece |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201044963A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI468538B (zh) * | 2011-10-14 | 2015-01-11 | Chenming Mold Ind Corp | 屏蔽層製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW374741B (en) * | 1997-09-08 | 1999-11-21 | Ind Tech Res Inst | Formation of a plasma-polymerized anti-fogging film and the manufacturing method |
TWM256683U (en) * | 2004-03-01 | 2005-02-01 | Uvat Technology Co Ltd | The device for the reduction of EMI induced by radio frequency source |
TWI263255B (en) * | 2004-04-29 | 2006-10-01 | Air Prod & Chem | Method for removing a substance from a substrate using electron attachment |
TW200638105A (en) * | 2006-06-05 | 2006-11-01 | Mikuni Denshi Kk | A forming apparatus for the plasma polymer film |
TWI276397B (en) * | 2003-03-21 | 2007-03-11 | Hon Hai Prec Ind Co Ltd | EMI-shielding assembly and method for the manufacture of same |
TWM340684U (en) * | 2008-05-15 | 2008-09-11 | Dixen Vacuum Technology Co Ltd | Electronic instrument housing with anti-EMI covering structure |
-
2010
- 2010-06-25 TW TW99120810A patent/TW201044963A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW374741B (en) * | 1997-09-08 | 1999-11-21 | Ind Tech Res Inst | Formation of a plasma-polymerized anti-fogging film and the manufacturing method |
TWI276397B (en) * | 2003-03-21 | 2007-03-11 | Hon Hai Prec Ind Co Ltd | EMI-shielding assembly and method for the manufacture of same |
TWM256683U (en) * | 2004-03-01 | 2005-02-01 | Uvat Technology Co Ltd | The device for the reduction of EMI induced by radio frequency source |
TWI263255B (en) * | 2004-04-29 | 2006-10-01 | Air Prod & Chem | Method for removing a substance from a substrate using electron attachment |
TW200638105A (en) * | 2006-06-05 | 2006-11-01 | Mikuni Denshi Kk | A forming apparatus for the plasma polymer film |
TWM340684U (en) * | 2008-05-15 | 2008-09-11 | Dixen Vacuum Technology Co Ltd | Electronic instrument housing with anti-EMI covering structure |
Also Published As
Publication number | Publication date |
---|---|
TW201044963A (en) | 2010-12-16 |
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