TWI407900B - - Google Patents

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Publication number
TWI407900B
TWI407900B TW099120810A TW99120810A TWI407900B TW I407900 B TWI407900 B TW I407900B TW 099120810 A TW099120810 A TW 099120810A TW 99120810 A TW99120810 A TW 99120810A TW I407900 B TWI407900 B TW I407900B
Authority
TW
Taiwan
Prior art keywords
forming
plastic workpiece
fixture
emi shield
middle layer
Prior art date
Application number
TW099120810A
Other languages
English (en)
Chinese (zh)
Other versions
TW201044963A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99120810A priority Critical patent/TW201044963A/zh
Publication of TW201044963A publication Critical patent/TW201044963A/zh
Application granted granted Critical
Publication of TWI407900B publication Critical patent/TWI407900B/zh

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  • Physical Vapour Deposition (AREA)
TW99120810A 2010-06-25 2010-06-25 Method of forming EMI shield on plastic workpiece TW201044963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99120810A TW201044963A (en) 2010-06-25 2010-06-25 Method of forming EMI shield on plastic workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99120810A TW201044963A (en) 2010-06-25 2010-06-25 Method of forming EMI shield on plastic workpiece

Publications (2)

Publication Number Publication Date
TW201044963A TW201044963A (en) 2010-12-16
TWI407900B true TWI407900B (member.php) 2013-09-01

Family

ID=45001521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99120810A TW201044963A (en) 2010-06-25 2010-06-25 Method of forming EMI shield on plastic workpiece

Country Status (1)

Country Link
TW (1) TW201044963A (member.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468538B (zh) * 2011-10-14 2015-01-11 晟銘電子科技股份有限公司 屏蔽層製造方法
TWI898368B (zh) * 2023-12-25 2025-09-21 啟端光電股份有限公司 拼接膜和拼接顯示器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW374741B (en) * 1997-09-08 1999-11-21 Ind Tech Res Inst Formation of a plasma-polymerized anti-fogging film and the manufacturing method
TWM256683U (en) * 2004-03-01 2005-02-01 Uvat Technology Co Ltd The device for the reduction of EMI induced by radio frequency source
TWI263255B (en) * 2004-04-29 2006-10-01 Air Prod & Chem Method for removing a substance from a substrate using electron attachment
TW200638105A (en) * 2006-06-05 2006-11-01 Mikuni Denshi Kk A forming apparatus for the plasma polymer film
TWI276397B (en) * 2003-03-21 2007-03-11 Hon Hai Prec Ind Co Ltd EMI-shielding assembly and method for the manufacture of same
TWM340684U (en) * 2008-05-15 2008-09-11 Dixen Vacuum Technology Co Ltd Electronic instrument housing with anti-EMI covering structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW374741B (en) * 1997-09-08 1999-11-21 Ind Tech Res Inst Formation of a plasma-polymerized anti-fogging film and the manufacturing method
TWI276397B (en) * 2003-03-21 2007-03-11 Hon Hai Prec Ind Co Ltd EMI-shielding assembly and method for the manufacture of same
TWM256683U (en) * 2004-03-01 2005-02-01 Uvat Technology Co Ltd The device for the reduction of EMI induced by radio frequency source
TWI263255B (en) * 2004-04-29 2006-10-01 Air Prod & Chem Method for removing a substance from a substrate using electron attachment
TW200638105A (en) * 2006-06-05 2006-11-01 Mikuni Denshi Kk A forming apparatus for the plasma polymer film
TWM340684U (en) * 2008-05-15 2008-09-11 Dixen Vacuum Technology Co Ltd Electronic instrument housing with anti-EMI covering structure

Also Published As

Publication number Publication date
TW201044963A (en) 2010-12-16

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