TWI405511B - Printed circuit board having electro component and manufacturing method thereof - Google Patents

Abstract

An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.

Description

Printed circuit board with electronic components and method of manufacturing same

The present application claims the priority of Korean Patent Application No. 10-2009-0062095, which was filed on July 8, 2009 with the Korean Intellectual Property Office, the entire contents of which is incorporated herein by reference.

The present invention relates to a printed circuit board in which an electronic component is embedded and a method of manufacturing the printed circuit board.

With the development of the electronics industry, the demand for smaller and more functional electronic components has gradually increased. In particular, market trends based on lighter, thinner, and shorter personal mobile devices have resulted in thinner printed circuit boards. The way in which fixed parts differ from conventional methods has arisen. An embedded printed circuit board is an example in which an active component such as an IC or a passive component such as an MLCC capacitor is fixed inside the printed circuit board, and through such systematic integration, higher density components and the package itself are improved. Reliability and performance.

The present invention is intended to address problems such as those caused by embedding thick electronic components during the manufacture of components embedded in a printed circuit board.

In the related art, when an electronic component (for example, a multilayer ceramic capacitor, MLCC) having a thickness of 200 μm to 1000 μm or less is embedded in a core board, as shown in FIG. 1, a core board 10 is formed (in which a cavity is formed) The electronic component 30 is embedded in the adhesion layer 20 in 14 and the circuit 12), and then the insulator 40 made of the resin 42 filled with the glass fiber 44 is stacked to improve the bending of the circuit board. However, as shown in Fig. 2, in this example, the electronic component 30 becomes thicker, and the space surrounding the electronic component and the through hole are not completely filled with the resin 42 of the insulator. This creates voids 50 in the board and results in poor reliability and therefore needs improvement.

In order to solve the above problem, as shown in FIG. 3, it proposes a method of using an insulator 40' including a thick resin 42', but this method may increase the printed circuit board as desired, as shown in FIG. Overall thickness.

The present invention provides a printed circuit board embedded in an electronic component and a method of manufacturing the printed circuit board; even in a lamination process performed by using a thin insulator, the method prevents resin from occurring around the electronic component and between the circuit patterns The voids caused by the degradation of the contents, and the problem of deformation of the electronic components caused by the backing material filled with the insulator during the lamination process of the electronic component.

Aspects of the present invention provide a method of manufacturing a printed circuit board embedded in an electronic component, comprising: providing a core board having a circuit pattern formed on one surface thereof, a cavity penetrating the core board; a layer attached to the lower surface of the core plate so as to cover the cavity; an electronic component disposed on an upper surface of the adhesion layer, the upper surface corresponding to the cavity; by stacking a first insulator on the core plate An upper surface such that the cavity is filled to cover the circuit pattern, the first insulator does not have a backing material filled therein; and a second insulator is stacked on both the upper side and the lower side of the core board Wherein the second insulator has a backing material filled therein.

Another aspect of the present invention provides a printed circuit board embedded in an electronic component, comprising: a core board having an inner layer circuit formed on a surface thereof, and a cavity penetrating the core board; an electronic component Embedded in the cavity; a first insulator stacked on an upper surface of the core plate to fill the cavity and covering the inner layer circuit, and the first insulator does not have a backing material filled therein a second insulator stacked on both the upper side and the lower side of the core board, and the second insulator has a backing material filled therein; and a circuit pattern formed on the second insulator on.

Here, the resin of the first insulator and the second insulator is made of the same material.

Additional aspects and advantages of the present invention will be set forth in the description which follows.

The present invention is susceptible to various modifications and alternative embodiments, which are illustrated in the drawings and described in the written description. However, it is to be understood that the invention is not limited to the specific mode of operation of the invention.

A method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention can be described in more detail later by referring to the accompanying drawings. Here, the same or corresponding components are given the same component symbols (which are not schematic figures), and redundant descriptions are omitted.

5 is a flow chart showing a method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention, and FIGS. 6 to 10 are views showing the manufacture of an embedded electronic component according to an embodiment of the present invention. The method of printed circuit boards.

First, as shown in Fig. 6, a core board 110 is prepared which is penetrated by the cavity 114 and has an inner layer circuit 112 formed thereon (S10). Then, the adhesion layer 120 is attached to the lower surface of the core board 110 so as to cover the cavity 114 (S20). For example, a copper-clad laminate (CCL) can be used as the core plate 110, and an epoxy resin filled with glass fibers can also be used to enhance rigidity. The inner layer circuit 112 is formed on the surface of the core board 110.

In the case where a copper-clad laminate is used as the core plate 110, a seed layer may be formed on both surfaces of the copper-clad laminate by electroless plating to form the inner layer circuit 112 on the two surfaces, and then The circuit pattern can be selectively formed by electroplating. In another example, the inner layer circuit 112 can be formed by etching a portion of the copper film formed on both surfaces of the copper-clad laminate.

The cavity 114 is formed in a portion of the core panel 110 (eg, a central portion). The cavity 114 is a space in which the electronic component 140 is embedded, and can be formed by using a mechanical drill or a laser drill. The underside of the treated cavity 114 may be sealed by an adhesive layer 120.

Then, the electronic component 140 is disposed on the upper surface of the corresponding cavity 114 of the adhesion layer 120 (S30, refer to FIG. 6). By configuring the electronic component 140 in this manner, the electronic component 140 can be attached and fixed to the upper surface of the adhesion layer 120 exposed through the cavity 114.

Next, the first insulator 130 not backed by the backing material is stacked on the upper surface of the core board 110 to fill the cavity 114, and thus the inner layer pattern is covered (S40, refer to FIGS. 6 and 7).

Therefore, if the flat surface is formed in the upper region of the core board 110, the first insulator 130 (ie, the primer resin) not backed by the backing material is stacked on the upper surface of the core board 110 (the inner layer circuit 112 is formed). On the core board, not only can the remaining space of the cavity 114 be filled by the first insulator 130 to fix the electronic component 140, but also the inner side of the through hole can be filled by the first insulator 130.

The inner layer circuit 112 formed on the upper surface of the core board 110 is also covered by the first insulator 130. Furthermore, if the electrodes (not shown) of the electronic component 140 are disposed face up (ie, if the electronic component 140 is embedded in a face-up manner), the electrodes of the electronic component 140 (not shown) may also be used. Covered with resin.

Therefore, if the first insulator 130 not backed with the additional backing material is stacked on the core board 110 before the lamination process using the second insulator 150 backed by the backing material to increase the structural rigidity is performed, then all The remaining space inside the cavity 114, the space inside the through hole, the space between the circuit patterns 112, and the space between the circuit pattern and the electrodes of the electronic component 140 can be filled. Therefore, even in the example of stacking the thin second insulator 150 having a low resin content in a subsequent process, it allows the cavity 114, the via hole, the space between the circuit patterns 112, and the circuit pattern 112 and the electrode of the electronic component 140 ( No voids are formed in the space between the figures (not shown).

Next, the adhesion layer 120 is removed (S50, refer to FIG. 8), and then the second insulator 150 backed by the backing material 154 is stacked on both the upper side and the lower side of the core board 110 (S60, refer to FIG. ). Here, the resin of the second insulator 150 may be made of the same material as the first insulator 130. That is, a second insulator 150 can be used that includes the same material as the first insulator 130 to fill the cavity 114 and the via. By using such an insulator of the same material, there is less chance of bending caused by the difference in thermal expansion coefficient between the surfaces of the first insulator 130 and the second insulator 150, thus providing suitable between the first insulator 130 and the second insulator 150. Attached. This solves the problem caused by layering between layers.

Further, since all the cavities 114, the inside of the through holes, and the holes between the circuit patterns 112 are filled by the first insulator 130, a thin film having a low resin content can be used in the case where voids are unlikely to occur. A second insulator that results in a thinner printed circuit board. Moreover, the first insulator 130 can perform a buffering function between the backing material 154 filled in the second insulator 150 and the electrode and/or circuit pattern 112 of the electronic component 140. The problem of deformation of the electronic component 140 and/or the circuit pattern 112 when the backing material 154 inside the second insulator 150 contacts the electrodes (not shown) of the electronic component 140 and/or the circuit pattern 112 can be solved.

Then, another circuit pattern 162 is formed on the upper surface of the second insulator 150 (refer to FIG. 10). The circuit pattern 162 formed on the upper surface of the second insulator 150 can be protected by the solder resist 160 as shown in FIG. Of course, if a printed circuit board having more layers is to be fabricated, an additional lamination process can be performed without forming a solder resist 160.

Illustrated in Fig. 10 is a printed circuit board manufactured by the above-described processes. In the printed circuit board according to the embodiment of the present invention, the electronic component 140 is fixed to the inside of the cavity 114 formed in the core board 110, and then the cavity 114 is formed by stacking the first insulator 130 on the upper surface thereof (not back) Lining material backing) and being filled. The first insulator 130 also covers the inner layer circuit 112. Subsequently, the second insulator 150 (backed by the backing material 154) is stacked on both the upper side and the lower side of the core board 110 (on which the first insulator 130 is stacked), and then the circuit pattern 162 is formed on the second insulator 150 on.

As described above, since the resin 152 of the first insulator 130 and the second insulator 150 are both made of the same material, there is less chance of bending caused by the difference in thermal expansion coefficient between the surfaces of the first insulator 130 and the second insulator 150. Appropriate adhesion between the first insulator 130 and the second insulator 150 is provided.

The spirit of the present invention has been described in detail with reference to the specific embodiments, which are intended to be illustrative only and not to limit the invention. It will be appreciated that those skilled in the art can change or modify the invention without departing from the scope and spirit of the invention.

Thus, many embodiments other than the above are possible in the scope of the appended claims.

10. . . Core board

12. . . Circuit

14. . . Cavity

20. . . Adhesion layer

30. . . Electronic components

40. . . Insulator

42, 42’. . . Resin

44, 44’. . . glass fiber

50. . . Empty hole

110. . . Core board

112. . . Circuit

114. . . Cavity

120. . . Adhesion layer

130. . . Electronic components

140. . . First insulator

150. . . Second insulator

152. . . Resin

154. . . Backing material

160. . . Solder mask

162. . . Circuit pattern

S10-S50. . . step

1 to 4 show a method of manufacturing a printed circuit board embedded in an electronic component according to the related art.

Figure 5 is a flow chart illustrating a method of fabricating a printed circuit board embedded in an electronic component in accordance with an embodiment of the present invention.

6 to 10 show a method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention.

S10-S50. . . step

Claims (4)

A method of manufacturing a printed circuit board embedded in an electronic component, the method comprising the steps of: providing a core board having a circuit pattern formed on one surface thereof, a cavity penetrating the core board; and an adhesion layer Attaching to a lower surface of the core plate so as to cover the cavity; disposing an electronic component on an upper surface of the adhesion layer, the upper surface corresponding to the cavity; by stacking a first insulator on the core plate An upper surface such that the cavity is filled to cover the circuit pattern, the first insulator does not have a backing material filled therein, wherein a remaining space between the cavity and the electronic component is used by the first insulator Filling, and the electronic component is fixed in the cavity by the first insulator; removing the adhesion layer from the lower surface of the core plate; and stacking a second insulator on the upper side and the lower side of the core plate The second insulator has a backing material filled therein. The method of claim 1, wherein the first insulator and the resin of the second insulator are made of the same material. A printed circuit board embedded in an electronic component, comprising: a core board having an inner layer circuit formed on one surface thereof, and a cavity penetrating the core board; an electronic component embedded in the cavity; a first insulator stacked on the core board An upper surface to fill the cavity and cover the inner layer circuit, and the first insulator does not have a backing material filled therein, wherein a remaining space between the cavity and the electronic component is a first insulator is filled, and the electronic component is fixed in the cavity by the first insulator; a second insulator is stacked on both the upper side and the lower side of the core board, and the second insulator has a filling body a backing material; and a circuit pattern formed on the second insulator. A printed circuit board embedded in an electronic component according to claim 3, wherein the resin of the first insulator and the second insulator is made of the same material.