KR100733251B1 - Double electronic components embedded PCB and manufacturing method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board incorporating a dual electronic component. More specifically, by manufacturing a dual electronic component in a vertically and symmetrical structure, warpage of the printed circuit board around the through hole can be prevented. The present invention relates to a printed circuit board having a dual electronic component embedded therein. For this purpose, two electronic components are bonded to each other in an up-down symmetry and embedded in a center of a through hole, thereby preventing the printed circuit board from bending and highly integrated. Can be.

Dual Electronic Components, Embedded Type, Printed Circuit Board, Highly Integrated Embedded Board, Via Hole

Description

Double electronic components embedded PCB and manufacturing method

1A to 1H are process diagrams illustrating a method of manufacturing a printed circuit board incorporating a conventional electronic component.

2 is a cross-sectional view showing a printed circuit board having a dual electronic component according to the present invention;

3 is a flowchart illustrating a manufacturing process of a printed circuit board having a double electronic component according to the present invention; And

4A to 4J are process diagrams illustrating a method of manufacturing a printed circuit board having electronic components according to an exemplary embodiment of the present invention;

5A through 5E are process diagrams illustrating a manufacturing process of the dual electronic component of FIG. 4.

<Description of Symbols for Major Parts of Drawings>

110, 310: insulating layer 112, 312: circuit pattern

120, 320: dual electronic component 322: first electronic component

324: adhesive 326: second electronic component

130, 330: filler 314: through hole

316: adhesive layer 318: reinforcing material

340: mold 350, 352: resin layer

354 and 356: Via hole 358 and 360: Plating layer

362, 364: etching resist 366, 368: outer circuit pattern

400: printed circuit board

The present invention relates to a printed circuit board incorporating a dual electronic component, and more particularly, by manufacturing a dual electronic component in a vertically symmetrical structure, a dual electronic component capable of preventing the printed circuit board from bending around a through hole. It relates to an embedded printed circuit board.

In order to meet the demand of miniaturization and high functionalization of electronic products according to the development of the electronic industry, the technology of the electronic industry has been developed in the direction of inserting resistors, capacitors, integrated circuits (ICs), and the like into a substrate.

To date, most PCBs have a typical discrete chip resistor or a discrete discrete capacitor, or an IC, but recently a resistor or a capacitor or an IC Printed circuit boards incorporating chip-like components have been developed.These techniques use chip materials such as resistors or capacitors or ICs inserted into the inner layer of the substrate by using new materials and processes. The technology replaces the role of passive and active components such as chip capacitors and ICs.

1A to 1H are process diagrams illustrating a method of manufacturing a printed circuit board incorporating a conventional electronic component.

As shown in FIG. 1A, an insulating layer 10 having a through hole 12 is provided.

As shown in FIG. 1B, the first copper foil layer 14 is formed under the insulating layer 10, and the electronic component 16 is mounted in the through hole formed in the insulating layer 10.

As shown in FIG. 1C, the inside of the through hole 12 is filled with the filler 18.

If heat and pressure are applied to the insulating layer 10 here, the filler 18 will harden | cure.

As shown in FIG. 1D, the second copper foil layer 20 is formed on the insulating layer 10, and as shown in FIG. 1E, the via hole 22 is formed by using laser or mechanical drilling.

Thereafter, as shown in FIG. 1F, the via hole 22 is plated to form the plating layer 24, and then the etching resist pattern 26 is formed as shown in FIG. 1G.

Finally, as shown in FIG. 1H, the printed circuit board 100 in which the electronic component having the circuit pattern is formed is completed.

However, a conventional printed circuit board incorporating electronic components forms a through hole in the resin layer to fix a small volume of the electronic component on the bottom surface of the through hole, and the volume of the electronic component is smaller than that of the through hole. Since the thermal expansion coefficient and the elastic modulus are different, there is a problem that the through-holes are bent.

In addition, since the volume of the electronic component is smaller than the volume of the through-holes, there is a problem in that a lot of fillers filling the through-holes enter the cost of the fillers.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. The present invention is to fabricate a double electronic component in a top and bottom symmetrical structure and embed it in the center of a through hole, thereby bending the printed circuit board around the through hole where the filler is cured. To provide a printed circuit board with a double electronic component that can prevent the warpage ().

In addition, since the electronic component is built in a double, to provide a through-hole using a small amount of filler, to provide a printed circuit board with a built-in dual electronic component that can reduce the cost of the filler.

In addition, to provide a printed circuit board with a built-in dual electronic component that can be increased in density by embedding two electronic components in the through-hole together.

In order to achieve this object, the present invention provides a dual electronic component in which two electronic components are bonded to each other up and down; And an insulating layer having a predetermined thickness having a double electronic component disposed at the center and having a circuit pattern formed on a surface thereof. It provides a printed circuit board with a dual electronic component, characterized in that it comprises a.

In the present invention, the dual electronic component is characterized by being symmetrical up and down.

Further, in the present invention, the dual electronic parts are stacked up and down so that the surface on which the electrode of each electronic part is formed is exposed.

In addition, in the present invention, the height of the dual electronic component is characterized in that it is substantially the same as the thickness of the insulating layer.

In the present invention, the two electronic components are characterized by interposing a tape having excellent thermal conductivity.

In addition, in the present invention, the two electronic components are characterized by interposing an epoxy molding resin (EMC) group having excellent thermal conductivity.

The present invention provides a method comprising the steps of: (A) providing a dual electronic component bonded to each other, the two electronic components are up-down symmetric; (B) providing an insulating layer having a through-hole in which the double electronic component is to be formed and having a circuit pattern formed on the surface thereof; (C) disposing the insulating layer on the adhesive layer formed on the reinforcing material; (D) disposing the dual electronic component in the center of the through hole formed in the insulating layer using an adhesive layer; (E) filling the inside of the through hole with a filler; (F) separating the reinforcing material and the adhesive layer from the insulating layer; And (G) forming an outer circuit pattern connecting the electrodes of the dual electronic component; It provides a method for manufacturing a printed circuit board with a built-in dual electronic component comprising a.

In the present invention, the dual electronic component of (A) step (A-1) providing a mold; (A-2) placing the surface of the first electronic component on which the electrode is formed on the lower surface of the mold; (A-3) applying an adhesive to a surface opposite to the surface on which the electrode is formed; (A-4) laminating and bonding the second electronic component so that the surface on which the electrode is formed on the first electronic component faces upward through the adhesive; (A-5) removing the mold; Characterized in that provided through.

In the present invention, after the step (G), the step of laminating a resin layer on the upper and lower surfaces of the (G-1) insulating layer; (G-2) forming a via hole connecting the upper and lower surfaces of the resin layer and the electrode of the dual electronic component; (G-3) performing plating on the via holes; And (G-4) forming an outer circuit pattern on the plated layer; It characterized in that it further comprises.

In addition, in the present invention, the filler of step (E) uses an epoxy molding resin (EMC) having a good thermal conductivity, characterized in that the filler is filled into the inside of the through hole by a dispenser and a printing technique.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

2 is a cross-sectional view illustrating a printed circuit board having a dual electronic component according to the present invention.

In the printed circuit board of the present invention, a circuit pattern 112 of copper foil is formed on the upper and lower portions of the insulating layer 110 having a predetermined thickness, and the via hole 114 connecting the upper and lower portions of the insulating layer 110 is formed. Form using laser or mechanical drilling.

In addition, the insulating layer 110 is formed with a through hole corresponding to the size of the dual electronic component 120 to be arranged, the dual electronic component 120 is disposed in the center of the through hole, the height of the dual electronic component 120 It is preferable that the thickness of the insulating layer 110 be substantially the same.

In addition, the filler 130 is filled in the through hole due to a dispenser and a printing technique, and the filler 130 is cured when subjected to heat and pressure, and protects the dual electronic component 120 from corrosion, external shock and contact. .

3 is a flowchart illustrating a manufacturing process of a printed circuit board having a double electronic component according to the present invention.

The method of manufacturing a printed circuit board incorporating an electronic component according to the present invention may be performed through the following steps. First, a dual electronic component in which two electronic components are symmetrically bonded to each other is provided (210), a through hole in which the dual electronic components are disposed is formed, and an insulating layer having a circuit pattern formed on a surface thereof is provided (220).

Thereafter, an insulating layer is disposed on the adhesive layer formed on the reinforcing material (230), a double electronic component is mounted at the center of the through hole formed in the insulating layer (240), and the inside of the through hole is filled with a filler (250). As a result, the reinforcing material and the adhesive layer are removed from the insulating layer (260).

The description thereof will be described in detail with reference to the following embodiments.

4A to 4J are process diagrams illustrating a method of manufacturing a printed circuit board having electronic components according to an exemplary embodiment of the present invention.

As shown in FIG. 4A, an insulating layer 310 having a circuit pattern 312 formed on a surface thereof and a through hole 314 in which a double electronic component 320 is to be disposed is provided.

As shown in FIG. 4B, the insulating layer 310 is disposed on the adhesive layer 316 formed on the reinforcing material 318.

Here, the adhesive layer 316 may use an adhesive tape which loses adhesive strength when heat and pressure are applied, and the adhesive tape has an advantage of being able to be removed after use.

As illustrated in FIG. 4C, the electronic component 320 is inserted into the center of the through hole 314 formed in the insulating layer 310.

Here, the thickness of the insulating layer 310 and the height of the dual electronic component 320 may be manufactured to be substantially the same, and a manufacturing method of the dual electronic component 320 is described with reference to FIG. 3.

As shown in FIG. 4D, the inside of the through hole 314 is filled with the filler 330.

Here, the filler 330 is preferably a material that can protect the electronic components from corrosion, external impact and contact. In the present invention, an epoxy molding resin (EMC) is used, and a dispenser and a printing technique are used. The inside of the through hole 314 is filled.

In addition, epoxy molding resin (EMC) is a material in which a liquid epoxy and SiO ₂ are mixed, and has an elongation property when heat is applied.

As shown in FIG. 4E, when heat and pressure are applied to the upper portion of the insulating layer 310 and the lower portion of the reinforcing material 318, the filler 330 is cured, and the adhesive layer 316 and the reinforcing material 318 are insulated by heat and pressure. Remove from layer 310.

As shown in FIG. 4F, resin layers 350 and 352 are stacked on and under the insulating layer 310, and as shown in FIG. 4G, the resin layers 350 and 352 and the circuit pattern 312 are stacked. Via holes 354 and 356 are formed to connect.

The via holes 354 and 356 are formed using a laser or a machine, and after forming the via holes 354 and 356, burrs of copper foil generated during drilling, dust on the side walls of the via holes, dust on the surface of the copper foil, and the like are formed. It is desirable to perform a deburring process to remove.

As shown in FIG. 4H, plating layers are performed on the via holes 354 and 356 to form the plating layers 358 and 360.

Since the inner walls of the via holes 354 and 356 are insulators, electrolytic copper plating cannot be carried out by electrolysis, and electrolytic plating is performed after electroless copper plating by the precipitation reaction.

Thereafter, as shown in FIG. 4I, etching resist patterns 362 and 364 are formed.

Here, in order to form the etching resist patterns 362 and 364, the circuit pattern printed on the artwork film is transferred to the printed circuit board, and the transferring method is a circuit printed on the artwork film by ultraviolet light using a photosensitive dry film. The pattern is transferred to a dry film.

When the insulating layer 310 is immersed in the etching solution, the plating layers 358 and 360 in the regions where the etching resist patterns 362 and 364 are not formed are removed, and the predetermined outer circuit patterns 366 and 368 are illustrated in FIG. 4J. The formed chip embedded printed circuit board 400 is completed.

The dual electronic component 320 disposed in the through hole in FIG. 4 may be manufactured through the process illustrated in FIG. 5.

First, as shown in FIG. 5A, a mold frame 340 corresponding to the size of an electronic component is provided, and as shown in FIG. 5B, an electrode formed on one surface of the first electronic component 322 is downward. It arrange | positions on the lower surface of the metal mold | die 340 as it is.

Subsequently, as illustrated in FIG. 5C, an adhesive 324 is applied to the opposite surface of the first electronic component 322 on which the electrode is formed, and the adhesive 324 applied here is a tape or an epoxy molding resin having excellent thermal conductivity ( EMC) can be used.

As shown in FIG. 5D, the surface of the second electronic component 326 on which the electrode is not formed is adhered to the adhesive 324. Finally, as shown in FIG. 5E, the mold frame 340 is removed. When removed, the dual electronic component 320 is completed.

As described above, the height of a double electronic component in which two electronic components are bonded to each other in up and down symmetry is manufactured to be substantially the same as the thickness of the insulating layer, and the double electronic components thus manufactured are built in the center of the through hole. As compared with the case where one conventional electronic component is inserted into the through hole, the phenomenon in which the through hole in which the electronic component is embedded is bent can be prevented.

In addition, since the electronic component is embedded in the through-hole twice, and the through-hole can be filled with a small amount of filler, the cost of the filler can be reduced and the density can be increased.

As described above, in the present invention, since the height of the double electronic component is manufactured to be substantially the same as the thickness of the insulating layer, and the double electronic component is embedded in the center of the through hole, the printed circuit board around the through hole can be manufactured so as not to bend. There is this.

According to the printed circuit board in which the double electronic component of the present invention is embedded, the height of the double electronic component in which the two electronic components are bonded to each other in up and down symmetry is made to be substantially the same as the thickness of the insulating layer. Since the electronic component is embedded in the center of the through hole, the bending of the printed circuit board around the through hole can be prevented.

In addition, since the electronic component is embedded in the through-hole twice, and the through-hole can be filled with a small amount of filler, the cost of the filler can be reduced and the density can be increased.

Claims (10)

A dual electronic component in which two electronic components are bonded to each other up and down; And An insulating layer having a predetermined thickness with the dual electronic component disposed at the center and having a circuit pattern formed on a surface thereof; Printed circuit board with a dual electronic component, characterized in that it comprises a. The printed circuit board of claim 1, wherein the dual electronic component is vertically symmetrical. The printed circuit board of claim 1, wherein the dual electronic parts are stacked up and down so that the surface on which the electrode of each electronic part is formed is exposed. The printed circuit board of claim 1, wherein a height of the dual electronic component is substantially the same as a thickness of the insulating layer. The printed circuit board of claim 1, wherein the two electronic components are interposed with a tape having excellent thermal conductivity. The printed circuit board of claim 1, wherein the two electronic components are interposed with an epoxy molding resin (EMC) having excellent thermal conductivity. (A) providing a dual electronic component bonded to each other, the two electronic components are up-down symmetric; (B) providing an insulating layer having a through-hole in which the dual electronic component is to be formed and having a circuit pattern formed on a surface thereof; (C) disposing the insulating layer on an adhesive layer formed on the reinforcing material; (D) disposing the dual electronic component at the center of the through hole formed in the insulating layer using the adhesive layer; (E) filling the inside of the through hole with a filler; (F) separating the reinforcing material and the adhesive layer from the insulating layer; And (G) forming an outer circuit pattern connecting the electrodes of the dual electronic component; manufacturing method of a printed circuit board having a dual electronic component embedded therein. The method of claim 7, wherein the dual electronic component of step (A) (A-1) providing a mold; (A-2) placing the surface of the first electronic component on the lower surface of the mold with the electrode formed downward; (A-3) applying an adhesive to a surface opposite to the surface on which the electrode is formed; (A-4) laminating and bonding the second electronic component so that the surface on which the electrode is formed on the first electronic component faces upward through the adhesive; And (A-5) removing the mold; Method of manufacturing a printed circuit board with a built-in dual electronic component, characterized in that provided through. 8. The method of claim 7, wherein step (G) (G-1) laminating a resin layer on the upper and lower surfaces of the insulating layer; (G-2) forming via holes connecting upper and lower surfaces of the resin layer and electrodes of the dual electronic component; (G-3) performing plating on the via hole; And (G-4) forming an outer circuit pattern on the plated layer; Method of manufacturing a printed circuit board containing a double electronic component further comprising a. 8. The double electron of claim 7, wherein the filler of step (E) uses an epoxy molding resin (EMC) having good thermal conductivity, and the filler is filled into the inside of the through hole by a dispenser. Method for manufacturing printed circuit boards with embedded parts.

Images