KR100728748B1 - Manufacturing method for embedded printed circuit board - Google Patents

Abstract

A method for manufacturing an embedded printed circuit board is provided to reduce manufacturing cost by using an insulation tape as a layer of the embedded printed circuit board. A method for manufacturing an embedded printed circuit board includes the steps of: forming a circuit pattern on a surface of a copper clad laminate plate, and forming a reception hole by punching a part(S10); attaching an insulation tape on the surface of the copper clad laminate plate to cover the reception hole(S20); mounting a chip on the insulation tape inside the reception hole(S30); filling an insulation material in the reception hole(S40); laminating the insulation layer to cover the other surface of the copper clad laminate plate(S60); and forming a via-hole and an outer layer circuit which are electrically connected to an electrode of the chip, on the insulation tape(S80).

Description

Manufacturing Method for Embedded Printed Circuit Board

1 is a flowchart illustrating a method for manufacturing an embedded printed circuit board according to an exemplary embodiment of the present invention.

Figure 2 is a cross-sectional view showing a copper foil laminated plate formed with a copper layer on both sides according to a preferred embodiment of the present invention.

3 is a cross-sectional view illustrating a state in which a polyimide tape is positioned to attach to another surface after forming a circuit pattern on one surface and a receiving hole for inserting a chip according to an exemplary embodiment of the present invention.

4 is a cross-sectional view showing a state in which a polyimide tape is attached to the other surface according to an embodiment of the present invention and a chip is inserted into and attached to a receiving hole.

5 is a cross-sectional view showing a state in which a plugging ink is filled in a portion without a circuit pattern on the inside of the receiving hole and the other surface of the copper-clad laminate according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a state where a polyimide tape is attached to the other surface of the copper clad laminate of FIG. 5. FIG.

7 is a cross-sectional view showing a state in which a via hole is drilled to be connected to an electrode of a chip according to an exemplary embodiment of the present invention.

8 is a cross-sectional view showing a state in which a copper layer is plated on the upper and lower surfaces of a via hole and a circuit pattern is formed on an outer layer according to an exemplary embodiment of the present invention.

Figure 9 is a cross-sectional view showing a state in which the plugging ink is applied to fill the inside of the receiving hole according to another embodiment of the present invention to cover the other surface.

<Description of the symbols for the main parts of the drawings>

10 copper clad laminate 13 circuit pattern

15: accommodation hole 20, 20 ': polyimide tape

25: Beer Hall 30: Chip

33: electrode 40, 40 ': plugging ink

50, 50 ': outer circuit pattern 60: through hole

The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing an embedded printed circuit board.

Recently, according to the miniaturization, thinness, and lightening of electronic devices, printed circuit boards (PCBs) used therein are also required to be compact and lightweight. In a conventional packaged printed circuit board, an electronic device (hereinafter referred to as a chip) including an active device such as an IC and a passive device such as a capacitor and a resistor is mounted on the surface of the circuit board. However, in electronic devices that are becoming smaller and higher in density, not only the surface area of the printed circuit board itself decreases, but also the number of chips mounted on the surface increases, which causes many difficulties in surface mounting of the chip. Embedding (embedding) method embedded in a printed circuit board has been developed and widely used.

In the conventional method of manufacturing an embedded printed circuit board, in particular, a method using a tape typically forms a hole in which a chip is mounted on a substrate, attaches the tape to one surface of the substrate, and then inserts the chip into the hole to insert the chip on the tape. A method is used in which the chip is completely fixed in the substrate by gluing and filling the filler with holes.

However, in the conventional method of manufacturing an embedded printed circuit board using a tape, when the filler is cured and the chip is fixed in the substrate, the circuit pattern is formed after removing the tape and forming an insulating layer and a copper layer. It is difficult to remove the tape at a constant pressure at the time of removal, causing breakage of the ink used as the filler, generation of air voids, and the like, which causes various circuit defects.

That is, problems such as cracking of the ink may occur and reliability may be deteriorated. In the process of plating the copper (Cu) layer and etching with acid in the subsequent circuit formation, the etching solution may penetrate the circuit, resulting in a defect in the circuit itself. A defect may occur.

Therefore, there is a need for an additional process of removing the tape and the development of additional techniques for removing the tape at the same pressure. In addition, since the tape serves to temporarily fix the chip in the hole and is removed, the tape is wasted in terms of raw materials, thereby increasing the manufacturing cost.

The present invention provides an embedded printed circuit board manufacturing method which improves reliability by using the insulating layer covering the outer surface of the copper clad laminate without fixing the tape after fixing the chip.

In addition, to provide an economical embedded printed circuit board manufacturing method that does not require a tape removal process.

According to one aspect of the invention, (a) forming a circuit pattern on the surface of the copper-clad laminate, and forming a receiving hole by drilling a portion, (b) a first insulating layer on one surface of the copper-clad laminate to cover the receiving hole (C) mounting a chip on the first insulating layer inside the accommodating hole, and (d) filling the insulating material in a portion in which the circuit pattern on the other surface of the accommodating hole and the copper clad laminate is not formed. (e) laminating a second insulating layer to cover the other surface of the copper-clad laminate, and (f) forming a via hole electrically connected to the electrode of the chip in the first insulating layer or the second insulating layer. An embedded printed circuit board manufacturing method is provided.

The first insulating layer is an insulating tape, and step (b) may include attaching the insulating tape to one surface of the copper clad laminate. The second insulating layer is an insulating tape, and step (e) may include attaching the insulating tape to the other surface of the copper clad laminate. The insulating tape is preferably a polyimide tape coated with an adhesive material on the polyimide film.

The second insulating layer may include a liquid insulating material, and step (e) may include applying a second insulating layer to the other surface of the copper clad laminate. The insulating material is preferably a liquid plugging ink or resin.

Step (d) may further comprise curing the insulating material. After step (d), the method may further include polishing the surface of the cured insulating material. After step (f) may further comprise the step of forming an outer layer circuit on the surface of the printed circuit board.

Hereinafter, with reference to the accompanying drawings to describe a preferred embodiment of the embedded printed circuit board manufacturing method according to the present invention in more detail, in the description with reference to the accompanying drawings in the same or corresponding configuration regardless of reference numerals Elements are given the same reference numerals and redundant description thereof will be omitted.

1 is a flowchart illustrating a method of manufacturing an embedded printed circuit board according to the present invention. As shown in FIG. 1, the method of manufacturing an embedded printed circuit board according to an exemplary embodiment of the present disclosure includes forming a circuit pattern on the surface of the copper-clad laminate, and forming a receiving hole by drilling a portion (S10). Attaching an insulating tape to one surface of the copper-clad laminate to cover the hole (S20), mounting a chip on the insulating tape inside the accommodation hole (S30), and a circuit pattern of the inside of the accommodation hole and the other surface of the copper-clad laminate After filling the insulating material in the unformed portion (S40), polishing the surface of the cured insulating material (S50), and attaching an insulating tape to cover the other surface of the copper-clad laminate, or applying an insulating material And a step S70 of forming a via hole electrically connected to the electrode of the chip on the insulating tape, and a step S80 of forming an outer layer circuit on the surface.

Hereinafter, the steps S10 to S80 will be described in detail with reference to FIGS. 2 to 7.

2 is a cross-sectional view showing a copper clad laminate having copper layers formed on both surfaces thereof according to an exemplary embodiment of the present invention.

Copper Clad Laminate (CCL) 10 means a thin laminate coated with Cu. Resin is mainly used as the base material of the copper-clad laminate 10. However, the resin has excellent insulation properties, but the mechanical strength is insufficient, and the dimensional change (CTE) due to temperature is about 10 times larger than that of the glass fiber, Resin combined with a reinforcing base such as glass nonwoven fabric is mainly used.

3 is a cross-sectional view illustrating a state in which a polyimide tape is positioned to attach to another surface after forming a circuit pattern on one surface and a receiving hole for chip insertion according to an exemplary embodiment of the present invention.

The receiving hole 15 is formed at a predetermined position of the copper foil laminated plate 10, and the receiving hole 15 is formed by a known method such as drilling and punching. As a drilling method, a carbon dioxide laser, an UV-based excimer laser, a UV-YAG laser, or the like may be used. In addition, the circuit pattern 13 is formed on the copper-clad laminate 10, and the method of forming the circuit pattern 13 corresponds to a known technique and a detailed description thereof will be omitted.

Here, the circuit pattern 13 is typically formed after the receiving hole 15 is drilled, but, of course, may be formed before the drilling of the receiving hole 15. In addition, although FIG. 3 illustrates that the circuit pattern 15 is formed only on the upper surface of the copper-clad laminate 10, a case in which the circuit pattern is formed may also be considered. As described above, a step (S10) of providing a copper clad laminate in which a circuit pattern and a through hole are formed is performed.

In addition, in FIG. 3, the polyimide tape 20 is shown below the copper-clad laminate 10 in which the circuit pattern 13 and the through hole 15 are formed to explain the next step S20. The polyimide tape 20 is a kind of insulating tape in which an adhesive component is adhered to the surface of a polyimide resin layer (or film), which is an insulator commonly used in a flexible substrate. The polyimide tape 20 used in this embodiment is an example of an insulating tape whose main material is an insulating material, of course, other types of insulating tapes may be used.

By attaching the polyimide tape 20 to the lower surface of the copper-clad laminate 10 by applying a predetermined pressure, a step (S20) of attaching the insulating tape to one surface of the copper-clad laminate is performed (a state in which the polyimide tape 20 is attached). Is shown in FIG. 4).

4 is a cross-sectional view illustrating a state in which a polyimide tape is attached to the other surface according to a preferred embodiment of the present invention and a chip is inserted into and attached to a receiving hole.

After the polyimide tape 20 is pressed onto the lower surface of the copper-clad laminate 10, the chip 30 is fixed inside the accommodating hole 15. The chip 30 is attached and fixed on the polyimide tape 20 inside the accommodation hole 15 due to the adhesive component on the surface thereof. As such, the step S30 of fixing the chip in the accommodation hole is performed.

FIG. 5 is a cross-sectional view illustrating a state in which a plugging ink is filled in a portion without a circuit pattern on the inside of the accommodating hole and the other surface of the copper clad laminate according to an exemplary embodiment of the present invention.

The chip 30 is encapsulated by filling an insulating material in the remaining space after the chip 30 is mounted in the accommodation hole 15. In this case, a liquid insulating material such as resin or plugging ink is generally used as the insulating material. In this embodiment, a plugging ink 40 is used. In addition, as shown, it is preferable to apply the plugging ink 40 to the inner space of the accommodating hole 15 as well as to the portion where the circuit pattern 13 of the copper clad laminate 10 is not present. As such, the step S40 of filling the insulating material into the accommodating hole and curing is performed.

It is sectional drawing which shows the state which attached the polyimide tape to the other surface of the copper foil laminated board of FIG. Next, a step (S60) of stacking a second insulating layer covering the other surface of the copper clad laminate is performed. As shown in FIG. 6, in the present embodiment, the second insulating layer stacked on the top surface of the copper clad laminate 10. Polyimide tape 20 'is used as the layer. The use of the polyimide tape 20 'having the same material and thickness as that of the polyimide tape 20 pressed onto the lower surface of the copper-clad laminate 10 is the upper and lower surfaces of the embedded printed circuit board (see FIG. 8). It is preferable when considering the bending property.

FIG. 7 is a cross-sectional view illustrating a state in which a via hole is punctured to be connected to an electrode of a chip according to an exemplary embodiment of the present invention, and FIG. 8 is a plated copper layer inside and upper and lower surfaces of the via hole according to an exemplary embodiment of the present invention. It is sectional drawing which shows the state which formed the circuit pattern in the outer layer.

7 and 8, steps S70 and S80 of forming a via hole and a circuit pattern will be described. As shown in FIG. 7, the via hole 25 is drilled to be connected to the electrode 33 of the chip 30. The via hole 25 may be perforated by a known method, but in this embodiment, carbon dioxide (CO ₂ ) laser drilling is used. In addition, as shown in FIG. 8, through-holes 60 penetrating through the upper and lower surfaces of the copper-clad laminate 10 are drilled, and the inner surfaces of the via holes 25 and the through holes 60 and the outer surfaces of the polyimide tapes 20 and 20 '. A metal layer such as a copper (Cu) layer is laminated on the surface by plating or the like. After lamination of the copper (Cu) layer, the outer circuit patterns 50 and 50 'are formed by a known method.

Through such a process, an embedded printed circuit board manufacturing method according to an exemplary embodiment of the present invention is provided. As described above, by using the insulating layer to cover the outer surface of the copper-clad laminate without fixing the insulating tape after fixing the chip, there is an advantage that there is no problem of ink cracking generated when the insulating tape is removed, thereby improving reliability. In addition, it is not necessary to remove the insulating tape, thereby providing an economical embedded printed circuit board manufacturing method due to process reduction. In addition, there is an advantage that the manufacturing cost can be reduced by using the insulating tape itself as a component layer of the embedded printed circuit board.

9 is a cross-sectional view illustrating a state in which a plugging ink is applied to fill an inside of a receiving hole and cover the other surface according to another exemplary embodiment of the present invention.

Embedded printed circuit board manufacturing method according to another preferred embodiment of the present invention has the same configuration and operation as the above-described embodiment except for the step (S60) of laminating a second insulating layer covering the other surface of the copper-clad laminate. Since a detailed description thereof will be omitted.

According to the present embodiment, the step of stacking the second insulating layer covering the other surface of the copper clad laminate (S60) refers to the polyimide tape 20 ′ as illustrated in FIG. 6 as the second insulating layer laminated on the top surface of the copper clad laminate 10. Instead of using), a liquid insulating material can be used. In general, a liquid insulating material such as resin or plugging ink may be used, and in this embodiment, plugging ink 40 'is used. The second insulating layer is laminated on the upper surface of the copper-clad laminate 10 by curing after applying the plugging ink 40 '.

Liquid insulating material different from the plugging ink 40 (refer to FIG. 5) filled in the space where the chip 30 is mounted inside the accommodating hole 15 and the circuit pattern 13 of the copper clad laminate 10 is absent. Is used as the second insulating layer, after the plugging ink 40 is filled, the semi-curing process and the polishing process are performed, and then the second insulating layer is applied and the post-curing process and the polishing process are performed. Can be rough. However, in the case where the insulating material and the second insulating layer use the plugging inks 40 and 40 'of the same component as in the present embodiment, the insulation covering the inside of the accommodating hole 15 and the upper surface of the copper clad laminate 10 is used. The layers can be formed continuously at one time. That is, when the second insulating layer is formed by using the same liquid insulator filled in the accommodating hole 15, the accommodating hole 15 and the second insulating layer are filled and coated at a time, and are semi-dried and polished. It is desirable to proceed with the complete drying process afterwards.

Although the preferred embodiments of the present invention have been described above, those skilled in the art may variously modify and modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that it can be changed.

According to the present invention having the above-described configuration, by using the insulating layer covering the outer surface of the copper-clad laminate without fixing the insulating tape after fixing the chip, there is no problem such as ink cracking generated when the insulating tape is removed, thereby ensuring reliability. The improved embedded printed circuit board manufacturing method can be provided.

In addition, since the process of removing the insulating tape is not required, it is possible to provide an economical embedded printed circuit board manufacturing method due to process reduction.

In addition, by using the insulating tape itself as a component layer of the embedded printed circuit board it is possible to reduce the manufacturing cost.

Claims (9)

(a) forming a circuit pattern on the surface of the copper-clad laminate and perforating a portion to form a receiving hole; (b) attaching an insulating tape to one surface of the copper clad laminate to cover the accommodation hole; (c) mounting a chip on the insulating tape in the accommodation hole; (d) filling an insulating material in the accommodation hole; (e) stacking an insulating layer to cover the other surface of the copper-clad laminate; And (f) forming a via hole and an outer layer circuit electrically connected to the electrodes of the chip on the insulating tape. delete The method of claim 1, The insulating layer is an insulating tape, and the step (e) comprises the step of attaching the insulating layer to the other surface of the copper-clad laminate. The method of claim 1, The insulating tape is an embedded printed circuit board manufacturing method of a polyimide tape coated with an adhesive material on a polyimide film. The method of claim 1, The insulating layer includes a liquid insulating material, and the step (e) comprises the step of applying the insulating layer on the other surface of the copper-clad laminate. The method of claim 1, The insulating material is a liquid plugging (plugging) ink or resin (resin) embedded printed circuit board manufacturing method. The method of claim 1, The step (d) further comprises the step of curing the insulating material embedded printed circuit board manufacturing method. The method of claim 7, wherein And polishing the surface of the insulating material cured after the step (d). The method of claim 3, The step (f) comprises the step of forming a via hole and an outer layer circuit in the insulating layer.

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