KR100900254B1 - Printed board and method thereof - Google Patents

Abstract

The present invention relates to a micro-pattern substrate and a method of manufacturing the same, wherein the conductive pattern is printed on the flexible insulating substrate by a piezoelectric inkjet method in a non-continuous (DOD, Drop On Demand) to form a conductive pattern and the conductive pattern After the complete drying of the conductive ink is printed, characterized in that it comprises the step of connecting the positive terminal and the negative terminal of the SMD type light emitting device to each adjacent conductive pattern by a conductive adhesive and connected in series.

According to the present invention, unlike the prior art, the fine pattern substrate used for the backlight of the advertising board is made of a flexible material, and the conductive pattern is printed on the flexible pattern of the flexible material with the conductive ink, thereby reducing the manufacturing time of the micro pattern substrate and the manufacturing cost. Can reduce the cost.

Billboard, backlight, fine pattern substrate, conductive pattern, conductive ink, printing

Description

Fine Pattern Substrate and Manufacturing Method Thereof {PRINTED BOARD AND METHOD THEREOF}

The present invention relates to a fine pattern substrate and a method of manufacturing the same, and more particularly, to a fine pattern substrate of printed electronics used for backlighting of an advertising board as a flexible material, the conductive pattern is applied to the fine pattern substrate of the flexible material The present invention relates to a micropattern substrate and a method for manufacturing the same, which are intended to reduce manufacturing time and reduce manufacturing cost by printing a micropattern substrate.

Traffic signs, various information boards, advertising boards, etc. are displayed through means of printing or painting, and lighting is provided so that the contents can be easily seen at night.

As a specific means of installing the lighting, there is a method of installing a light bulb such as a fluorescent lamp inside a signboard such as a general advertising signboard so that the contents of the light pass through a cloth or thin plate (acrylic, etc.) on the front surface of which the light is displayed, or It is also possible to install the lighting device outside of the light source so that the light is directed toward the display panel so that the contents can be identified.

By the way, there are a number of disadvantages in such a conventional lighting device, when the installation of a light bulb type lighting device such as a fluorescent lamp is very large in size and thickness is difficult to manufacture and install, short lifespan bulb There was a problem of manpower and costly according to maintenance, such as the need to replace from time to time. In addition, even when lighting is installed on the outside of the display panel, there is a lot of waste due to maintenance. Especially, in the case of traffic safety signs that must be legally standardized, the shape change is caused by external lighting. There is a serious problem that can lead to chaos.

Due to the above-mentioned problem, an alternative has been proposed to obtain power by using solar cells and to emit light by installing a light emitting diode (LED) on a display panel.

Conventional billboards using LEDs (LEDs) take a long time in the soldering process because they are connected by soldering the LEDs to the rigid printed circuit boards themselves, and several times such as etching and etching are needed to form circuit patterns on the printed circuit boards. There is a problem that can not reduce the manufacturing cost according to the process. Therefore, there is a need for improvement.

The present invention has been made in order to improve the above problems, and by using a soft insulating substrate compared to the conventional rigid printed circuit board, it is possible to roll the insulating substrate, and easy to store the fine pattern substrate and its manufacture The purpose is to provide a method. In addition, the present invention improves productivity by reducing the number of steps for forming a conductive pattern, as the conductive pattern can be formed by printing a conductive ink on an insulating substrate, compared to processes for forming a conductive pattern on a conventional printed circuit board. An object of the present invention is to provide a micropattern substrate and a method of manufacturing the same. In addition, the present invention is to provide a micro-pattern substrate and a method of manufacturing the same that can be used as a billboard backlight as it emits light when power is applied by connecting a conductive pattern printed in an insulating substrate with LED (LED). have.

A method of manufacturing a micropattern substrate according to the present invention comprises the steps of: forming a conductive pattern by discontinuously printing a conductive ink on a flexible insulating substrate by a piezoelectric inkjet method, and forming a conductive pattern on the conductive ink on which the conductive pattern is printed. And connecting the positive terminal and the negative terminal to each of the adjacent conductive patterns in series.

Before the conductive pattern forming step, a step of forming a coating layer on the surface of the insulating substrate is further added.

Prior to the series connection of the light emitting devices, a step of forming a conductive layer for thermal drying by applying a conductive adhesive to the positive electrode terminal, the negative electrode terminal, and the conductive pattern corresponding to each of the conductive terminals is further added.

After the light-emitting device serial connection step, a step of forming an insulating layer by printing an insulating ink on the conductive pattern is further added.

After the insulating layer forming step, a step of forming a waterproof layer on the upper side of the light emitting device and the insulating layer is further added.

Between the insulating layer forming step and the waterproof layer forming step, a step of forming a protective layer along the circumference of the light emitting device to maintain the state connected to the conductive pattern is further added.

The light emitting device is an LED (LED), and the insulating base material is preferably made of a polymer material.

As described above, the micropatterned substrate and the manufacturing method thereof according to the present invention are easy to store as the insulating substrate can be rolled and stored by using a flexible insulating substrate as compared to the conventional rigid printed circuit board. In addition, the present invention improves productivity by reducing the number of steps for forming a conductive pattern, as the conductive pattern can be formed by printing a conductive ink on an insulating substrate, compared to processes for forming a conductive pattern on a conventional printed circuit board. You can. In addition, the present invention can be used as a billboard backlight as it emits light when the power is applied by connecting the conductive pattern printed non-continuously in the insulating substrate with an LED.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of a fine pattern substrate and a method for manufacturing the same. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or convention of a user or an operator. Therefore, the definitions of these terms should be made based on the contents throughout the specification.

1 is a flowchart illustrating a method of manufacturing a micro patterned substrate according to an embodiment of the present invention, and FIG. 2 is a perspective view of the micro patterned substrate according to an embodiment of the present invention.

1 and 2, the method of manufacturing the micro patterned substrate 10 according to the exemplary embodiment includes a conductive pattern forming step S20 and a light emitting device serial connection step S30.

First, the conductive pattern forming step S20 is a process of forming the conductive pattern 40 by discontinuously printing the conductive ink on the flexible insulating substrate 20. At this time, the conductive ink is printed on the insulating base 20 by the piezoelectric inkjet method. In particular, the piezoelectric inkjet method is assumed to be an inkjet method generally used.

Here, the insulating base 20 is preferably made of a polymer material, which is a material of general printing paper, because the conductive pattern 40 is formed by printing conductive ink. This is to improve productivity by using the insulating substrate 20 which is a conventional printing paper. In addition, since the insulating material is ductile, it can be rolled up and stored, and it is not easily broken by external impact, so it is excellent in durability.

In other words, the insulating base 20 has an insulating property and can be applied to a curved shape as long as inkjet is possible in a planar shape such as a film, sheet or plate. The conductive pattern 40 means a circuit pattern.

In particular, the conductive ink injected into the insulating base 20 is preferably automatically injected by a piezoelectric ink jet head (not shown).

In addition, the conductive pattern 40 is printed discontinuously on the insulating base 20. It is preferable that the conductive pattern 40 is printed on the insulating base 20 discontinuously and automatically controlled by external control.

Meanwhile, after the conductive pattern forming step S20, the conductive layer forming step S30 is further added. In the conductive layer forming step (S30), the anode terminal 52 is formed so as to firmly contact the anode terminal 52 and the cathode terminal 54 of the light emitting device 50 that connect the different conductive patterns 40 in series. And the conductive adhesive 56 is applied to any one of the conductive patterns 40, and the conductive adhesive 56 is applied to the negative electrode terminal 54 and the other conductive pattern 40 adjacent to any one. At this time, the conductive layer adhesive 56 forms a conductive layer.

The conductive adhesive 56 serves to maintain a contact state between the positive electrode terminal 52, the conductive pattern 40 corresponding thereto, and the negative electrode terminal 54, and the conductive pattern 40 corresponding thereto. In this case, the conductive adhesive 56 is a transparent material, and the metallic fluid such as silver or copper having conductivity is included in the fluid of a general silicon material. In particular, the conductive adhesive 56 is in contact with the light emitting device 50 as the conductive pattern 40 is completely dried and then applied to the corresponding position and then heat dried. Since the conductive adhesive 56 is conductive, the conductive layer does not interfere with the flow of current.

At this time, the conductive adhesive 56 is applied to the positive electrode terminal 52 and the negative electrode terminal 54 which are placed on the different conductive pattern 40 to form a conductive layer, but after being previously applied to the different conductive pattern 40 The positive electrode terminal 52 and the negative electrode terminal 54 may be partially immersed.

The conductive ink is sprayed with ink droplets by a DOD piezoelectric inkjet method to form a fine conductive print pattern, which is dried by a heat drying apparatus, and then connected to the SMD chip type light emitting device 50, that is, an LED with a conductive adhesive 56. It is. After that, by heating and drying, a pattern circuit configuration capable of flowing electricity to the light emitting device 50 is completed.

In addition, after the conductive layer forming step (S30), the light emitting device series connection step (S40) is performed. The light emitting device serial connection step S40 is to apply the anode terminal 52 and the cathode terminal 54 of the light emitting device 50 on the adjacent conductive pattern 40 to the conductive ink on which the conductive pattern 40 is printed in a discontinuous manner. It is a process of connecting to each conductive adhesive 56, and connecting in series. This is to connect adjacent conductive patterns 40 in series with the light emitting device 50. The light emitting element 50 is preferably made of LED (LED) having high brightness and excellent durability.

At this time, the insulating substrate 20 is a fine pattern substrate 10 forming a power connection portion electrically connected to one side of a certain conductive pattern 40. Thus, when an external power source is applied to the power supply unit 80, the applied current is supplied to the light emitting device 50 through the conductive pattern 40 and the conductive adhesive 56, thereby, the light emitting device 50 It will emit light.

In addition, the insulating base 20 includes a plurality of power supply units 80, and each power supply unit 80 indirectly connects the light emitting devices 50 by a set number. Therefore, the fine pattern substrate 10 can be used for the backlight of the billboard as it emits only the light emitting device 50 connected to the power applying unit 80 is applied. Here, the power supply unit 80, like the light emitting device 50, is electrically connected to different conductive patterns 40.

Meanwhile, before the conductive pattern forming step S20, the coating layer forming step S10 may be further added to the surface of the insulating substrate 20. That is, the coating layer 30 is formed on the upper surface of the insulating substrate 20, and the conductive pattern 40 is printed on the upper surface of the coating layer 30. This is because bleeding may occur when the conductive ink is applied directly to the insulating base 20. In this case, the coating layer 30 serves to maintain the shape of the conductive pattern 40 formed by applying the conductive ink. That is, the coating layer 30 serves to aggregate the conductive ink. At this time, the coating layer 30 is coated with a coating liquid on the upper surface of the insulating substrate (20). In addition, after the coating layer 30 is completely dried in the coating layer forming step S10, the conductive pattern forming step S20 is performed.

In addition, an insulating layer forming step (S50) is performed after the light emitting device series connection step (S40). The insulating layer forming step (S50) is a process of forming the insulating layer 60 by printing an insulating ink on the conductive pattern 40. The insulating ink is sprayed through another piezoelectric inkjet print head (not shown), and is not sprayed or sprayed on the conductive pattern 40 in contact with the anode terminal 52 or the cathode terminal 54 of the light emitting device 50. You may not. In particular, the insulating ink is automatically spray controlled from the head to form the insulating layer 60 in the insulating base 20, which is made possible by UV curing.

In this case, the insulating layer 60 has a role of having high wettability and adhesiveness at the time of bonding with the conductive pattern 40, and protects the conductive pattern 40. In particular, it is preferable that the insulating ink forming the insulating layer 60 is formed of an ink liquid having high dimensional stability due to less deformation of the shape during curing.

Therefore, the insulating layer 60 means a portion formed by being applied on the upper side of the conductive pattern 40.

In addition, after the insulating layer forming step S50, a waterproof layer forming step S70 of forming the waterproof layer 90 on the light emitting device 50 and the insulating layer 60 is performed. The waterproof layer 90 forms the uppermost layer of the fine pattern substrate 10 and is coated with film paper or coated with a transparent silicone resin and then dried to protect foreign substances such as water from entering the fine pattern substrate 10 from the outside. It plays a role.

On the other hand, between the insulating layer forming step (S50) and the waterproof layer forming step (S70) of the protective layer forming step of applying a transparent waterproof adhesive 70 to the upper side of the light emitting device 50 to maintain the state connected to the conductive pattern 40 S60 is further added. That is, the waterproof adhesive 70 is coated on the insulating base 20 corresponding to the light emitting device 50. Thus, the waterproof adhesive 70 serves to protect the positive electrode terminal 52 and the negative electrode terminal 54 of the light emitting device 50 to be in contact with the conductive pattern 40. The waterproof adhesive 70 is dried to form a waterproof layer. In this case, the waterproof adhesive 70 may be made of various materials having adhesive strength such as silicon. Of course, after the waterproof adhesive 70 is completely cured in the protective layer forming step (S60), the waterproof layer forming step (S70) is performed. In addition, after the insulating layer 60 is completely cured in the insulating layer forming step S50, the protective layer forming step S60 is performed.

The fine pattern substrate 10 manufactured through the steps S10 to S70 is adopted for the advertisement board backlight. Thus, the plurality of light emitting devices 50 mounted on the fine pattern substrate 10 can produce an advertisement effect and an interior effect by individually controlling light emission. In particular, the structure in which the fine pattern substrate 10 is mounted on the advertisement board for the backlight is general.

Hereinafter, the insulating ink, the conductive ink, and the coating liquid will be described as an example in the method for manufacturing a micropattern substrate of the present invention.

First, the conductive ink is one in which metal particles are uniformly dissociated into an organic solvent. In order to form micro wiring, it is preferable that this metal particle is nano size. The method of forming a wiring using such a conductive ink can be used without limitation. For example, the kind of such metal particles is not particularly limited, but generally, gold, silver, copper, platinum, chromium, nickel, aluminum, titanium, palladium, tin, vanadium, zinc, manganese, cobalt, zirconium, iron and the like Metals can be suitably used. These metals can be used independently and can also be used with the alloy which suitably mixed 2 or more types. Among the above-mentioned metals, gold (Ag), silver (Au), copper (Cu), nickel (Ni), etc. which are excellent in electroconductivity are mentioned preferably. Moreover, these preferable 2 or more types can also be used by the alloy which mixed suitably. Particularly preferred is silver, which is more advantageous in economic terms. In order for these metal particles to form fine wirings of several tens of micrometers or less, it is preferable to use metal nanoparticles having a size of 1 to 100 nm, preferably 5 to 50 nm.

In addition, in order to dissociate the metal particles uniformly and stably in the solvent, capping molecules are required to surround the metal particles. Such capping molecules can be used without limitation. For example, the compound may include a chemical group having electrons of lone pairs of nitrogen, oxygen, or sulfur atom pairs that may form coordination bonds with metal particles. More specifically, amino group (-NH2) containing a nitrogen atom, sulfanyl group (-SH) including a sulfur atom, thiol group (-S-), hydroxyl group (-OH) containing an oxygen atom, ether type oxy group ( -O-) and the like. The solvent used to form the conductive ink may use an aqueous or non-aqueous solvent depending on the nature of the metal particles, which is not particularly limited. For example, toluene and tetradecane or a mixed solution thereof may be used as the non-aqueous solvent, and water or diethylene glycol butyl ether acetate and an ethanol aqueous solution or a mixture thereof may be used as the aqueous solvent. The conductive particles may be prepared by dispersing the metal particles in the solution as described above using a sonicator. The preferred viscosity of the conductive ink suitable for printing microwiring may be influenced by the conditions of the nozzles used, the printing conditions, the size of the nanoparticles, and the like, but is 1 to 50 cps and preferably 5 to 20 cps.

On the other hand, electroconductive ink is used by disperse | distributing an electroconductive material to an aqueous or oil-based solvent, and mixing additives, such as a dispersing agent. The conductive ink of the metal nanoparticles can form a fine wiring pattern with high line width accuracy, and can easily form the conductive pattern 40 by baking the metal nanoparticle coating layer.

In addition, the printing by the piezoelectric inkjet method may adopt an appropriate injection method in consideration of a pattern, a kind of ink, and the like. The injection method includes piezoelectric element type, bubble jet type, electrostatic induction type, continuous injection type and the like.

Further, the coating liquid was 8% by weight of vinyl resin, 9% by weight of urethane resin, 1% by weight of polyethylene wax, 5% by weight of matting agent, 3% by weight of dispersant, 8% by weight of toluene, 12% by weight of IPA (Iso-propyl Alcohol), MEK (Methyl Ethyl Ketone) 54 wt% is mixed. Of course, the coating liquid can be variously applied. In particular, such coatings are dip coating, rod coating, blade coating, air knife coating, gravure coating, and reverse roll coating. ), Extrusion coating, slide coating, curtain coating and the like can be applied by any of a number of well known techniques. In addition, the insulating base 20 may form the coating layer 30 through irradiation of light by a UV lamp or the like.

At this time, the insulating ink effectively insulates the conductive pattern 40 printed by the conductive ink and has adhesion to the circuit or the insulating substrate 20. Insulative ink refers to the dissociation of an insulating material uniformly into a solvent. As the insulating material used herein, a material generally used to form the insulating layer 60 may be used, and the ink may be printed by an inkjet method and may be cured at the firing temperature of the conductive pattern 40. It is not particularly limited. In consideration of this aspect, an acrylate resin, a phenol resin, an epoxy resin, a polyimide resin, or the like may be applied. The insulating ink may be blended with an inorganic filler in order to improve heat resistance and thermal expansion characteristics. When the insulating base 20 or the insulating layer 60 is semi-cured by UV irradiation, a photopolymerization initiator for causing a photopolymerization reaction is included. Examples of semi-curable resins include epoxy resins, acrylic resins, phenol resins, melamine resins, polyimide resins, and bismaleimide compounds.

In addition, the insulating ink may include a crosslinking agent as required for the insulating resin and the photopolymerization initiator. The insulating resin can use a polyimide or a precursor of polyimide. In the case of using a precursor of polyimide, the composition is composed of a polyamic acid, a photopolymerization initiator, and a crosslinking agent, and an example of the composition ratio is polyamic acid: 50 to 60% by weight, and crosslinking agent: 21 to 35% by weight. will be. The insulating ink may be a bicomponent system of a bismaleimide compound and a photopolymerization initiator. An example of the composition ratio is 85 to 95% by weight of the bismaleimide system, and is composed of the remaining photopolymerization initiator. In particular, onium salts, sulfate esters, sulfonyl compounds and the like may be applied as the photopolymerization initiator. Onium salts include diphenylideonium and triphenylsulfonium salts, and sulfate esters include o-nitrobenzyl ester and the like. Sulfonyl compounds include a, a'-bisacrylsulfonyl diazomethane and the like. Crosslinkers include melamine derivatives, for example N-methoxymethylated melamine. In the inkjet printing method, the insulating ink uses polyimide or its precursor polyamic acid (PAA). In this case, it is possible to provide a conductive ink containing more insulating material than when using a polyamic acid.

Therefore, the insulating ink and the conductive ink in the method of manufacturing the fine pattern substrate 10 according to the present invention are applied to the ink applied in the manufacturing field of the fine pattern substrate 10 by the piezoelectric inkjet method.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art to which the art belongs can make various modifications and other equivalent embodiments therefrom. Will understand.

Therefore, the true technical protection scope of the present invention will be defined by the claims below.

1 is a flowchart illustrating a method of manufacturing a fine pattern substrate according to an embodiment of the present invention.

2 is a perspective view of a fine pattern substrate according to an embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

10: fine pattern substrate 20: insulating substrate

30: coating layer 40: conductive pattern

50: light emitting element 60: insulating layer

70: waterproof adhesive 80: power supply

Claims (9)

delete delete delete Forming a conductive pattern by discontinuously printing the conductive ink on the flexible insulating substrate by a piezoelectric inkjet method; And Connecting the positive terminal and the negative terminal of the light emitting device to the conductive pattern adjacent to the conductive ink on which the conductive pattern has been printed, and connecting them in series; Before the conductive pattern forming step, the step of forming a coating layer on the surface of the insulating substrate is further added, Before the step of connecting the light emitting device in series, a step of forming a conductive layer for thermally drying by applying a conductive adhesive to the positive electrode terminal and the negative electrode terminal and the conductive pattern corresponding to each, is further added. After the step of connecting the light emitting device in series, the method of manufacturing a fine pattern substrate, further comprising the step of forming an insulating layer by printing an insulating ink on the conductive pattern. The method of claim 4, wherein After the insulating layer forming step, the step of forming a waterproof layer on the upper side of the light emitting device and the insulating layer further comprises the method of manufacturing a fine pattern substrate. The method of claim 5, And forming a protective layer along the circumference of the light emitting device so as to maintain a state of being connected to the conductive pattern between the insulating layer forming step and the waterproofing layer forming step. The method of claim 6, The light emitting device is a manufacturing method of a fine pattern substrate, characterized in that the LED (LED). The method of claim 7, wherein The insulating substrate is a method of manufacturing a fine pattern substrate, characterized in that the polymer material. A micro patterned substrate manufactured by the method according to any one of claims 4 to 8.

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