TWI401007B - Method of fabricating circuit board structure having embedded semiconductor component - Google Patents

Description

Method for manufacturing circuit board structure with embedded passive components

The invention relates to a method for manufacturing a circuit board structure, in particular to a method for manufacturing a circuit board structure in which a passive component is embedded.

With the rapid development of the electronics industry, electronic products have gradually entered the direction of multi-functional, high-performance research and development. In order to meet the packaging requirements of semiconductor package high integration and miniaturization, it has gradually evolved from a single-layer board to a multi-layer board, which is used in a limited space by inter-layer connection technology. (Interlayer Connection) to expand the available circuit area on the carrier board to meet the needs of the use of integrated circuits with high electron density. At the same time, passive components such as resistors, capacitors, and inductors are integrated into the semiconductor package to relatively enhance or stabilize the electrical function of the electronic product.

In the prior art, the passive components are disposed on the remaining circuit layout area of the carrier board that is not used by the semiconductor wafer; as shown in FIG. 1, the carrier is mounted on a printed circuit board or a package substrate of the semiconductor component. The surface of the board 1 is provided with a plurality of passive components 12. However, in order to prevent the passive components 12 from blocking the electrical connection between the semiconductor components 11 and the plurality of solder pads, the passive components 12 are usually placed at the edge of the carrier board 1. The area of the unused area. However, the passive component 12 is disposed on the surface of the carrier board 1 to limit the flexibility of the circuit layout. At the same time, the position of the soldering pad must be disposed, which limits the number of the passive components 12 to be disposed, and the semiconductor device is highly concentrated. In other words, the number of passive components 12 is relatively increased with the high performance requirements of the semiconductor package. As is known, the surface of the carrier 1 must accommodate a plurality of semiconductor components 11 and a large number of passive components 12 at the same time. Forcing the package to increase in volume and not conforming to the trend of thin and thin semiconductor packages.

Moreover, the passive components are respectively connected to the carrier board, which not only increases the complexity of the circuit layout and the process, but also makes the overall packaging process more complicated and uneconomical.

In order to avoid the problem of the layout limitation of the surface of the carrier board and to further meet the requirements for reducing the space of the carrier board, a film-like passive component is also disposed between the layers of the multi-layer carrier board, as disclosed in U.S. Patent Nos. 5,683,928 and 6,055,151. Before forming a new laminate, the resistive passive component is formed by printing and/or photoresisting (Photoresist-etching) on the surface of an organic insulating layer.

The film-shaped passive component formed between the multi-layer carrier plates is used to avoid the problem of the passive components disposed on the surface of the carrier board. However, this method is cumbersome and complicated, and the passive component embedded in the carrier board needs to be targeted. Different circuit designs and requirements are changed, resulting in a significant increase in manufacturing costs. The integration of such passive components will make the overall structure of the substrate and its required process more complex and not cost effective.

Referring to Figure 2, the industry has developed a technology for embedding passive components in a carrier board, which is made of a resin material such as epoxy resin, polyimide resin, BT ( The carrier plate 21 made of Bismaleimide Trazine resin, FR4 resin or the like is formed with an opening 210, and a passive component 22 is received in the opening 210. The passive component 22 has a first surface 22a and a second surface 22b. A surface 22a has a plurality of electrode pads 221, and an adhesive material 23 is formed in the gap between the passive component 22 and the opening to fix the passive component 22 in the opening 210; and in the passive component 22 A surface build-up structure 23 is formed on a surface of the surface 22a and the carrier plate 21. The circuit build-up structure 23 includes a dielectric layer 231, a circuit layer 232 stacked on the dielectric layer 231, and a dielectric layer formed thereon. The conductive structure 233 in the layer 231, and the conductive structure 233 is electrically connected to the electrode pad 221 of the passive component 22, and the outer surface of the circuit build-up structure 23 forms a plurality of electrical connection pads 234, and the circuit is added to the circuit. 23 an outer surface forming a solder resist layer 24, The solder resist layer 24 is formed a plurality of openings 240 to expose the conductive pads 234 of these.

However, in the subsequent process, the carrier element 21 has a large difference in coefficient of thermal expansion (CTE) between the circuit layer of the metal material and the dielectric layer and the solder resist layer, and the passive component embedded in the opening is easy. Peeling occurs due to the difference in thermal expansion coefficient.

Therefore, how to provide a method for embedding a passive component to avoid the combination of embedded passive components in the prior art, thereby improving the reliability of the carrier board and the line build-up structure, has become an urgent problem to be overcome in the industry.

In view of the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a method for fabricating a circuit board structure in which a passive component is embedded, and to provide a bond between the carrier board and the passive component embedded therein.

For the purpose of achieving the above and other objects, the method for manufacturing a circuit board structure embedding a passive component of the present invention comprises: providing a carrier board having at least one through opening formed therein; and accommodating the opening of the carrier board a passive component having a first surface and a second surface, wherein the first surface has a plurality of electrode pads, and the surface of the passive component is subjected to a roughening process by a first etching solution and a second etching solution to form a roughened surface; and a dielectric layer formed on the first surface of the carrier and the passive component.

The carrier board is an insulating board, a ceramic board or a circuit board having a line; the dielectric layer is formed in a gap between the passive component and the opening, or is formed by an adhesive material between the passive component and the opening. In the gap, the passive element is fixed in the opening.

The surface of the passive component is first etched and roughened by the first etchant, and the electrode pad of the first surface is roughened by the second etchant; or the passive component is preceded by the second etchant The electrode pad of the first surface is roughened, and the surface of the passive component is roughened by the first etching solution; wherein the first etching liquid is sodium hydroxide (NaOH) or calcium hydroxide (Ca(OH) 2) an alkaline solution of potassium permanganate (KMnO4) or potassium hydroxide (KOH), and the second etching solution is hydrochloric acid (HCl), nitric acid (HNO3), perchloric acid ( Acid solution of HClO4), acetic acid (CH3COOH), oxalic acid (H3PO4) or sulfuric acid (H2SO4).

According to the above method, another dielectric layer is formed on the surface of the carrier and the second surface of the passive component, and a circuit layer is formed on the surface of the dielectric layer on the first surface of the passive component, and the circuit layer is The electrode pad of the passive component is electrically connected through the conductive structure formed in the opening of the dielectric layer; and the circuit build-up structure is formed on the surface of the dielectric layer and the circuit layer, the circuit build-up structure includes a dielectric a layer, a circuit layer stacked on the dielectric layer, and a conductive structure formed in the dielectric layer, and the outer surface of the line build-up structure forms a plurality of electrical connection pads, and the outer surface of the line build-up structure is covered A solder mask is formed, and a plurality of openings are formed in the solder resist layer to expose the electrical connection pads.

Therefore, the circuit board structure of the embedded passive component of the present invention can be completely surface-etched with the first and second etching liquids on the surface of the passive component and the surface of the electrode pad before the passive component is embedded in the opening of the carrier plate. The roughening process, in the subsequent embedding of the passive component in the circuit board structure, has a better combination between the roughened surface of the passive component and the dielectric layer to avoid the passive component being embedded in the carrier In the plate opening, delamination occurs in the subsequent thermal cycle process due to the difference in thermal expansion coefficient.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention.

Please refer to FIGS. 3A to 3D, which are cross-sectional views showing a first embodiment of a method for manufacturing a circuit board structure embedding a passive component according to the present invention.

As shown in FIG. 3A, a carrier plate 31 is provided, and at least one opening 310 is formed in the carrier plate 31; the carrier plate 31 is an insulating plate, a ceramic plate or a circuit board having a line.

As shown in FIG. 3B, the passive component 32 is received in the opening 310 of the carrier plate 31. The passive component 32 has an opposite first surface 32a and a second surface 32b. The first surface 32a has a plurality of electrodes. Pad 321 , and the surface of the passive component 32 is roughened by a first etching solution such as an alkaline solution (Alkaline solution) to the non-metal surface of the passive component 32, and then etched by a second solution such as an acidic solution. Liquid roughening the metal surface of the passive component 32, such as the electrode pad 321; or the surface of the passive component 32 first roughens the metal surface of the passive component 32 with a second etchant, and then roughens the passive component with the first etchant a non-metallic surface of 32; wherein the alkaline solution is such as sodium hydroxide (NaOH), calcium hydroxide (Ca(OH)2), potassium permanganate (KMnO4) or potassium hydroxide (KOH), and the acidic solution It is hydrochloric acid (HCl), nitric acid (HNO3), perchloric acid (HClO4), acetic acid (CH3COOH), oxalic acid (H3PO4) or sulfuric acid (H2SO4).

As shown in FIG. 3C, a dielectric layer 33 is formed on the surface of the carrier 31 and the first surface 32a of the passive component 32, and another dielectric is formed on the surface of the carrier 31 and the second surface 32b of the passive component 32. The layer 33 ′, the dielectric layer 33 , 33 ′ is filled in the gap between the passive component 32 and the opening 310 to fix the passive component 32 in the opening 310 and formed in the dielectric layer 33 . A plurality of openings 330 are provided to expose the electrode pads 321 of the passive component 32.

As shown in FIG. 3D, a wiring layer 34, 34' is formed on the surface of the dielectric layer 33, 33', and the wiring layer 34 is electrically conductive through the conductive structure 341 formed in the dielectric layer opening 330. The electrode pads 321 of the passive component 32 are connected.

As shown in FIG. 3E, a line build-up structure 35, 35' is formed on the surface of the dielectric layers 33, 33' and the circuit layers 34, 34'. The line build-up structure 35, 35' includes a dielectric layer 351, 351'. a circuit layer 352, 352' stacked on the dielectric layer, and conductive structures 353, 353' formed in the dielectric layer 351, 351', and the conductive structures 353, 353' are electrically connected to the circuit layer 352, 352' to the line The layers 34, 34', and the outer surface of the line build-up structure 35, 35' form a plurality of electrical connection pads 354, 354', and the outer surface of the line build-up structure 35, 35' is covered with a solder resist layer 36, 36', A plurality of openings 360, 360' are formed in the solder resist layers 36, 36' to expose the electrically connected pads 354, 354'.

4A and 4B are cross-sectional views showing a second embodiment of the method for manufacturing a circuit board structure embedding a passive component according to the present invention. The difference from the previous embodiment is that the passive component is fixed by an adhesive material. In the opening of the carrier.

As shown in FIG. 4A, the carrier board 31 and the passive component 32 of the previous embodiment are provided, and the surface of the passive component 32 and the electrode pad 321 thereof are completely roughened by the first and second etching liquids, and the passive component is The 32 series is received in the opening 310 of the carrier plate 31, and is filled into the gap between the passive component 32 and the carrier opening 310 by an adhesive material 37 to fix the passive component 32 to the carrier opening. 310.

As shown in FIG. 4B, a dielectric layer 33 is formed on the surface of the carrier 31 and the first surface 32a of the passive component 32, and another dielectric is formed on the surface of the carrier 31 and the second surface 32b of the passive component 32. a layer 33'; a circuit layer 34, 34' is formed on the surface of the dielectric layer 33, 33', and the circuit layer 34 is electrically connected to the passive component 32 through the conductive structure 341 formed in the dielectric layer. An electrode pad 321; a line build-up structure 35, 35' is formed on the dielectric layers 33, 33' and the circuit layers 34, 34', and a solder resist layer is covered on the outer surface of the line build-up structure 35, 35' 36, 36', wherein the solder resist layers 36, 36' are formed with a plurality of openings 360, 360' to expose electrical connection pads 354, 354' formed on the outer surface of the line build-up structure 35, 35'.

Therefore, in the method for manufacturing the circuit board structure of the embedded passive component of the present invention, the surface of the passive component is roughened by the first etching solution, and the surface of the electrode pad is roughened by the second etching solution, or the electrode pad is first used. The surface is first roughened by the second etching solution, and the surface of the passive component is roughened by the first etching solution, so that the passive component is completely formed with a roughened surface, and the passive component is embedded in the opening of the carrier plate. The preferred combination of the roughened surface of the passive component and the dielectric layer is to avoid delamination of the circuit board structure from the passive components embedded in the opening of the carrier.

The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

1,21,31. . . Carrier board

11. . . Semiconductor component

12,22,32. . . Passive component

210,310. . . Opening

221,321. . . Electrode pad

22a, 32a. . . First surface

22b, 32b. . . Second surface

23,35,35’. . . Line buildup structure

23,37. . . Adhesive material

231, 33, 33', 351, 351'. . . Dielectric layer

232, 34, 34', 352, 352'. . . Circuit layer

233,341,353,353’. . . Conductive structure

234,354,354’. . . Electrical connection pad

24,36,36’. . . Solder mask

240,330,360,360’. . . Opening

1 is a schematic view showing the addition of a passive component in a semiconductor package; FIG. 2 is a schematic cross-sectional view of a carrier structure of a conventional embedded passive component; and FIGS. 3A to 3E are embedded passive components of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4A and FIG. 4B are cross-sectional views showing a second embodiment of a method for fabricating a circuit board structure embedding a passive component according to the present invention.

31. . . Carrier board

310. . . Opening

32. . . Passive component

321. . . Electrode pad

32a. . . First surface

32b. . . Second surface

33,33’. . . Dielectric layer

330. . . Opening

34,34’. . . Circuit layer

341. . . Conductive structure

Claims (15)

A method for manufacturing a circuit board structure embedding a passive component, comprising: providing a carrier board having at least one through opening formed therein; receiving a passive component in the opening of the carrier board, the passive component having a first a surface and a second surface, wherein the first surface has a plurality of electrode pads, and the non-metal surface and the electrode pad surface of the passive component are respectively subjected to a roughening process by the first etching solution and the second etching solution to form a roughened surface, The first etching liquid is an alkaline solution (Alkaline solution), and the second etching liquid is an acidic solution; and a dielectric layer is formed on the first surface of the carrier plate and the passive component. The method for fabricating a circuit board structure of an embedded passive component according to claim 1, wherein the dielectric layer is formed with a plurality of openings to expose the electrode pads of the passive component. The method of manufacturing a circuit board structure for embedding a passive component according to claim 1, wherein the carrier board is one of an insulating board, a ceramic board, and a circuit board having a line. The method of fabricating a circuit board structure for embedding a passive component according to claim 1, wherein the dielectric layer is filled in a gap between the passive component and the opening of the carrier plate to fix the passive component to the The carrier plate is in the opening. Such as the circuit board structure of the embedded passive component of claim 1 The method of claim, wherein a gap between the passive component and the opening of the carrier plate is filled with an adhesive material to fix the passive component in the opening. The method for manufacturing a circuit board structure embedding a passive component according to claim 4 or 5, further comprising forming another dielectric layer on the second surface of the carrier plate and the passive component. The method for manufacturing a circuit board structure of an embedded passive component according to claim 6 is characterized in that the circuit layer is formed on the dielectric layer, and a conductive structure is formed in the dielectric layer for electrical connection of the circuit layer. Connected to the electrode pads of the passive component. For example, the method for manufacturing a circuit board structure embedded in a passive component of claim 7 includes forming a line build-up structure on the surface of the dielectric layer and the circuit layer. The method for manufacturing a circuit board structure for embedding a passive component according to claim 8 is characterized in that the outer surface of the circuit build-up structure is formed with a plurality of electrical connection pads. The method for manufacturing a circuit board structure for embedding a passive component according to claim 9, wherein a surface of the circuit build-up structure is formed with a solder resist layer, and a plurality of openings are formed in the solder resist layer to expose the electrical connection. pad. The method for fabricating a circuit board structure of an embedded passive component according to claim 8 , wherein the circuit build-up structure comprises a dielectric layer, a circuit layer stacked on the dielectric layer, and a dielectric layer formed on the dielectric layer. Conductive structure in the electrical layer. Such as the circuit board structure of the embedded passive component of claim 1 The method of the method, wherein the surface of the passive component is first etched and roughened by the first etching solution, and the electrode pad of the first surface is roughened by the second etching solution. The method for manufacturing a circuit board structure of an embedded passive component according to claim 1, wherein the passive component is roughened by the electrode pad of the first surface, and then the first The etchant etches the surface of the passive component. The method for manufacturing a circuit board structure of an embedded passive component according to claim 1, wherein the first etching liquid is sodium hydroxide (NaOH), calcium hydroxide (Ca(OH)2), potassium permanganate. One of (KMnO4) and potassium hydroxide (KOH). The method for manufacturing a circuit board structure of an embedded passive component according to claim 1, wherein the second etching liquid is hydrochloric acid (HCl), nitric acid (HNO3), perchloric acid (HClO4), acetic acid (CH3COOH). ), one of oxalic acid (H3PO4) and sulfuric acid (H2SO4).