TWI398360B - A cutting method for a vibrating unit of a piezoelectric inkjet print head - Google Patents

Description

Cutting method of inkjet head piezoelectric actuation unit

The present invention relates to a cutting method, and more particularly to a cutting method of a piezoelectric actuator unit of an ink jet head.

With the advancement of inkjet technology, inkjet technology is no longer only used in the traditional printing market. In recent years, it has been applied to the process technology of flat panel display and semiconductor industry. However, in order to reduce costs and save process time, new ones are sought. Inkjet technology, the most widely used of these, is piezoelectric inkjet technology.

Please refer to FIG. 1A , which is a schematic plan view of a multilayer structure of a conventional ink jet head before cutting. As shown in the figure, the multilayer structure 1 of the conventional ink jet head is mainly composed of a multi-layer stainless steel plate with high temperature diffusion bonding technology. Stacked to form a microstructure of the ink jet head multilayer structure 1, wherein the ink jet head multilayer structure 1 has a plurality of ink jet units 100, and each of the ink jet units 100 corresponds to an inflow stream having an ink supply flow Channel (not shown), a reservoir for storing ink (not shown), a pressure chamber (not shown), a liquid flow path (not shown), and a nozzle hole for ejecting ink (not shown) a micro-structure, such as a micro-structure, and a common vibrating plate 10 is disposed above the micro-structures such as the liquid inlet channel, the liquid storage chamber, the pressure chamber, the liquid outlet channel, and the nozzle hole of the plurality of ink-jet units 100, and A common piezoelectric actuator 14 is disposed above the vibrating plate 10 and corresponding to the position of the pressure chamber. Thus, when the multi-layer structure 1 of the ink jet head is stacked, only the uppermost layer is required. The movable piece 14 is cut corresponding to the shape of the pressure chamber, and the complex as shown in the first figure B can be completed. The inkjet ink jet head unit 100 of a multilayer structure.

Referring to FIG. A again, as shown in the figure, the conventional inkjet head multilayer structure 1 divides the plurality of inkjet units 100 into the first inkjet unit group 11 when the piezoelectric actuator 14 is cut. a second inkjet unit group 12, wherein the first inkjet unit group 11 and the second inkjet unit group 12 are disposed corresponding to each other, and the inkjet unit 100 in the first inkjet unit group 11 And another inkjet unit 100 in the second inkjet unit group 12 is disposed in a misalignment setting (as shown in the enlarged view of FIG. A), and in addition, on the piezoelectric actuator 14 The positions of the pressure chambers of the ink jet unit 100 each have a rectangular edge 13. When the multilayer structure 1 of the conventional ink jet head is to perform the cutting operation on the piezoelectric actuator sheet 14, the laser cutting method is adopted, and in the laser cutting, it is necessary to accurately correspond to the first ink jet unit group one by one. The rectangular edges 13 of each of the ink jet units 100 in the group 11 and the second ink jet unit group 12 are used to perform a cutting operation of the piezoelectric actuator sheet 14 to cut the piezoelectric actuator sheet 14 as shown in the first figure. A plurality of actuation units 141 are shown in FIG. B, and the position of each of the actuation units 141 corresponds to the pressure chamber of each ink ejection unit 100.

However, in the conventional laser cutting process of the piezoelectric actuator piece 14, it is necessary to precisely control the position of the cutting and the uniform power to align the rectangular edge 13 of each ink-jet unit 100, and also accurately The depth and width of the cutting are controlled so as not to damage the vibrating plate 10 under the piezoelectric actuator 14 due to the deep cutting, or affect the adjacent inkjet unit 100 due to poor width control, and therefore, before cutting It is necessary to set parameters such as the wavelength of the laser, the energy, and the time for performing the laser to ensure that the size of the cut after the laser can reach the size requirement of the predetermined actuating unit 141, so that it takes a lot before performing the laser cutting. Time setting related cutting parameters, Not only is the program complicated, it is also more time consuming.

In addition, when a plurality of actuation units 141 are generated using laser cutting, a single rectangular edge 13 must be used as a cutting unit, and the inkjet unit 100 and the second inkjet unit group in the first inkjet unit group 11 The other ink-jet units 100 in the group 12 are disposed in a misaligned position with each other. Therefore, after cutting a rectangular edge 13, the laser cutting must be stopped first, and the next rectangular edge 13 is to be aligned, and then the next cutting operation is continued. It can be seen that during the operation of cutting the piezoelectric actuator 14 conventionally, it takes a lot of work time to repeatedly align the cutting starting point of each of the actuating units 141, thereby making the working time extended except that the cutting rate is stopped at the beginning. Or the turning is different, so that the power unevenness causes the non-uniformity of the cutting depth to be uneven, and the cost is wasted. In addition, the price of the laser machine is more expensive than other cutting tools, and the use of laser cutting is prone to high temperatures due to unstable laser power, which may cause damage during cutting operations. The magnetic strength and physical strength of the moving unit 141.

In view of this, how to develop a cutting method for an actuating unit that is easy to cut and saves cutting time and cost to solve the lack of the prior art is an urgent problem to be solved by the related art.

The purpose of the present invention is to provide a method for cutting a piezoelectric actuator unit of an inkjet head, which is formed by symmetrical formation of a plurality of inkjet units, and then uses a wafer dicing blade to cut a pair of two straight lines to form a piezoelectric The actuating piece is cut into a plurality of actuating units. In order to solve the conventional laser cutting, many parameters are set before the operation, and the cutting method takes a lot of working time, resulting in missing work hours and wasted costs. This case can be provided by using a cutting knife Water-cooled or air-cooled mode, maintained in the cutting process, maintained at a temperature below 100 degrees, can fully avoid the traditional Thunder cut power concentration in the cutting process, occasional high temperature damage the actuator magnetic strength and physical strength.

In order to achieve the above object, a broader aspect of the present invention provides a method for cutting an actuating unit, the method comprising the steps of: (a) providing a multi-layer structure of an ink jet head comprising a vibrating plate and a plurality of plates The stacking unit is configured to have a plurality of ink jet units, wherein the plurality of ink jet units are symmetrically disposed with each other, and each of the plurality of ink jet units respectively has a cavity; (b) The at least one piezoelectric actuator is disposed above the vibrating plate of the cavity of the plurality of inkjet units, wherein the cavity has a first side, a second side, a third side and a fourth side respectively And the first side of each of the cavities is respectively aligned with the third side of the other cavity; and (c) the wafer is cut along the corresponding one of the cavities And axially cutting the at least one piezoelectric actuator on one side and the third side of the cavity, so that the at least one piezoelectric actuator corresponds to the cavity respectively to generate a plurality of symmetry Set the actuation unit.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and drawings are intended to be illustrative and not limiting.

Please refer to FIG. 2A, FIG. 2B and FIG. 2C. FIG. 2 is a schematic structural view of the multi-layer structure of the inkjet head according to the first preferred embodiment of the present invention, and FIG. A section along the a-a' structure, second Figure C is a flow chart of a method for cutting a piezoelectric actuator unit of an ink jet head according to a first preferred embodiment of the present invention. As shown in Figure 2A, the multi-layer structure 2 of the ink jet head of the present invention is a multi-layer structure, mainly The sounding plate 20 and the plurality of plate members 21 (shown as shown in FIG. 24B) are stacked, and the ink jet head multilayer structure 2 has a plurality of ink jet units 22, wherein the plurality of ink jet units 22 are They are symmetrically disposed to each other, and each of the ink ejection units 22 has a cavity 223 (as shown in the second FIG. B). Further, the piezoelectric actuator 24 can be, but is not limited to, lead zirconate Titanate. , PZT) formed by piezoelectric materials.

As shown in the second embodiment, in the embodiment, the two piezoelectric actuators 24 are respectively disposed on the plurality of inkjet units 22, and the cavity 223 is a rectangle and has a first a side 223a, a second side 223b, a third side 223c and a fourth side 223d, and the first side 223a is aligned with the third side 223c of the other cavity 223 (refer to the second figure A) As shown in the enlarged view, when the piezoelectric actuator 24 is disposed on the vibrating plate 20, the first side 223a, the second side 223b, the third side 223c, and the fourth side 223d of each cavity 223 are A virtual frame is formed, and the plurality of virtual frame systems are arranged in a symmetrical manner. The first side 240 of the piezoelectric actuator 24 is respectively disposed on the second side 223b of the cavity 223 of the plurality of inkjet units 22, but the number and arrangement of the piezoelectric actuators 24 are not To this end, when the number and arrangement of the piezoelectric actuators 24 are changed, the linear cutting manner can also be changed accordingly, but at least four of the four sides of each cavity 223 are still cut in a straight line manner. Cutting is performed to generate a plurality of symmetrically arranged actuation units 241, such that even if the number and arrangement of the piezoelectric actuators 24 are different. It can also save a lot of working time through the straight-line cutting method of this case.

As shown in the second drawing B, the ink jet head multilayer structure 2 is formed by stacking a plurality of stainless steel plate members by a high temperature diffusion bonding technique, thereby forming a microstructure of the ink jet head multilayer structure 2, wherein the ink jet head multilayer structure 2 has a substrate 23 having an ink ejection orifice 231 and disposed relative to the ink ejection unit 22, and a plurality of panels 21 stacked on the substrate 23 and having a plurality of ink ejection units 22 having a liquid storage chamber 221, a liquid inlet 222, a cavity 223 and a liquid flow channel 224 and other microstructures. And the liquid storage chamber 221, the liquid inlet flow path 222, the cavity 223, the liquid discharge flow path 224, and the ink ejection hole 231 are configured to communicate with each other such that a fluid (not shown) can pass through the liquid storage chamber 221, The liquid inlet flow path 222, the cavity 223, the liquid discharge flow path 224, and the ink ejection hole 231 flow out to achieve the purpose of ink ejection.

Please refer to FIG. 2C, which is a flow chart of a method for cutting a piezoelectric actuator unit of an inkjet head according to a first preferred embodiment of the present invention, as shown in the drawing, a cutting method of a piezoelectric actuator unit of the inkjet head of the present invention. First, an ink jet head multilayer structure 2 is provided, which is formed by stacking a vibrating plate 20 and a plurality of plate members 21, and the ink jet head multilayer structure 2 has a plurality of ink jet units 22, wherein a plurality of ink jet units 22 are symmetrically arranged with each other. And when the plurality of boards 21 are stacked, the plurality of ink ejection units 22 respectively have a cavity 223 (as shown in step S20), and then the piezoelectric actuators 24 are correspondingly disposed in the cavity of the ink ejection unit 22. Above the vibrating plate 20 of the 223, the cavity 223b is a rectangle and has a first side 223a, a second side 223b, a third side 223c and a fourth side 223d, respectively, and the first side 223a of the cavity 223 is respectively Aligned with the third side 223c of the other cavity 223, and the first side 240 of the piezoelectric actuator 24 is respectively aligned with the second side 223b of the cavity 223 of the inkjet unit 22. (As shown in step S21), after the piezoelectric actuator 24 is set, the wafer dicing blade first follows the first side 223a corresponding to the cavity 223 and the third side 223c of the other cavity 223. After the piezoelectric actuator 25 is linearly cut, the plurality of inkjet units 22 are repeatedly cut along the path (as shown in step S22), and then the wafer cutters are respectively disposed along the two symmetrical chambers. The fourth side 223d of the body 223 is cut in a straight line. Since the first side 240 of the piezoelectric actuator 24 is aligned with the second side 223b of the cavity 223, the piezoelectric actuator 24 forms a plurality corresponding to the cavity 223. Actuating unit 241 (as shown in step S23). In some embodiments, the wafer dicing blade can be cut in a water-cooled or air-cooled manner to maintain the cutting process at a uniform temperature below 100 degrees, thereby avoiding the power concentration of the conventional ray cutting during the cutting process, and occasionally high temperature. This leads to the destruction of the magnetic strength and physical strength of the actuator.

Please also refer to the third figure A and the third figure B together with the second figure A, wherein the third figure A is a plan view of the second figure A after cutting, and the third figure B is the third figure A along the b A schematic view of the cross-sectional structure of the -b', as shown in the third figure A. In the present embodiment, the cutting operation of the piezoelectric actuator 24 of the multi-layer structure 2 of the ink jet head is performed by a wafer cutting blade (not shown). Cutting), wherein the thickness of the wafer dicing blade corresponds to the thickness of the piezoelectric actuator sheet, and preferably does not exceed the thickness of the piezoelectric actuator sheet 24, and in some embodiments, the crystal The thickness of the circular cutter is preferably 50 μm, but not limited thereto. And, as shown in FIG. 3A, when the piezoelectric actuator 24 is subjected to the above-mentioned four-time linear cutting, corresponding to each cavity 223, correspondingly, a plurality of symmetrically arranged actuation units 241 are respectively generated. And as shown in the third figure B, after the cutting operation is completed, each of the actuating units 241 is correspondingly disposed in each Above a cavity 223.

In some embodiments, the piezoelectric actuators 24 corresponding to the first side 223a and the third side 223c are not completely cut off when the wafer cutter is cut (as shown in FIG. 3C), such that Each of the actuating units 241 of the piezoelectric actuator 24 can be deformed to push the vibrating plate 20 under the action of an electric field (not shown) to cause a volume change of the cavity 223 when stored in the liquid storage chamber 221 When the fluid is squeezed by the cavity 223 to generate a flow, the fluid of the liquid storage chamber 221 is finally ejected from the ink discharge hole 231 through the liquid inlet flow path 222, the cavity 223, and the liquid discharge flow path 224 to reach the ink jet multilayer. The purpose of the structure 2 inkjet, of course, the inkjet unit 22 is symmetrically disposed to perform inkjet through the same path, and will not be described again.

Please refer to FIG. 4A, which is a schematic structural view of a multi-layer structure of an ink jet head according to a second preferred embodiment of the present invention. As shown in the figure, in the embodiment, the multi-layer structure 3 of the ink jet head and the spray of the foregoing embodiment are sprayed. The multi-layer structure 2 of the ink head is the same structure, so it will not be described again, but the difference mainly lies in the arrangement of the piezoelectric actuator 30, wherein the piezoelectric actuator 30 is preferably two pieces and has the first side respectively. The side 301 and the second side 302, the first side 301 is aligned with the second side 223b of the inkjet unit 22, and the second side 302 is aligned with the fourth side 223d, so that when the piezoelectricity is to be When the actuation piece 30 is cut into a plurality of actuation units 241, only a linear cut along the first side 223a and the third side 223c of the cavity 223 is required to generate a plurality of symmetrically arranged actuation units 241.

Please refer to FIG. 4B, which is a flow chart of a cutting method of the actuating unit according to the second preferred embodiment of the present invention. As shown in the figure, the cutting method of the piezoelectric actuator unit of the inkjet head of the present invention first provides inkjet. Head multilayer structure 2, by vibrating plate 20 and a plurality of boards 21 are stacked, and the ink jet head multilayer structure 2 has a plurality of ink jet units 22, wherein a plurality of ink jet units 22 are symmetrically arranged with each other, and when a plurality of boards 21 are stacked, a plurality of sheets are stacked The inkjet units 22 respectively have a cavity 223 (as shown in step S40), and then the piezoelectric actuators 30 are correspondingly disposed on the vibration plate 20 of the cavity 223 of the inkjet unit 22, wherein the cavity 223 is a rectangle having a first side 223a, a second side 223b, a third side 223c, and a fourth side 223d, wherein the first side 223a of the cavity 223 is respectively aligned with the third of the other cavity 223 The side 223c is disposed, and the first side 301 and the second side 302 of the piezoelectric actuator 24 are respectively aligned with the second side 223b and the fourth side 223c of the cavity 223 of the inkjet unit 22 (as in step S41). The wafer dicing blade only needs to have the piezoelectric actuator 30 along the first side 223a of the inkjet unit 22 and the third side 223c of the inkjet unit 22, which are symmetrical. By performing a straight cut, the piezoelectric actuator 30 can be correspondingly generated in a plurality of cavities 223, respectively. Set of said actuating means (e.g., step S42 shown). In this way, the cutting time of the wafer dicing blade and the cutting path thereof can be shortened, and the working time can be greatly reduced.

Therefore, the use of the wafer dicing blade only requires cutting the piezoelectric actuators 24 and 30 in a straight line. Compared with the conventional technique, it is necessary to repeatedly align the rectangular edge 13 and then perform the cutting operation and the laser cutting requires setting many cutting parameters. In this case, the procedure can be eliminated to save labor and cost.

In summary, the cutting method of the actuating unit of the present invention mainly uses the cavities of a plurality of ink jet units to be symmetrically arranged with each other, and then the wafer cutting knife is used. In the line cutting operation, the wafer cutting blade first linearly cuts the piezoelectric actuator along a third side corresponding to the first side of the cavity and the other cavity symmetrical thereto, and then sequentially cuts The piezoelectric actuators on the plurality of ink-jet units enable the piezoelectric actuators to respectively generate a plurality of symmetrically arranged actuation units after linear cutting, so that the wafer cutting blade is used instead of Knowing that using laser cutting, the wafer cutting knives do not need to set a lot of relevant cutting parameters before cutting, which saves a lot of working time. However, in addition to saving working time, it can also control the cutting process more accurately. In addition, the symmetrical arrangement of the plurality of ink jetting units enables the wafer dicing blade to produce the actuating unit in a straight line, without repeatedly aligning the next rectangular edge in units of rectangular edges of the prior art to speed up The time required for the cutting operation, in addition, the wafer cutting knife machine is cheaper than the laser cutting machine, and the equipment cost can be saved. Since the above advantages are not in the prior art, the cutting method of the actuating unit of the present case is of great industrial value, and the application is made according to law.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

1‧‧‧Multilayer structure of a conventional inkjet head

100, 22‧‧‧ inkjet unit

10, 20‧‧‧ vibrating plate

11‧‧‧First Inkjet Unit Group

12‧‧‧Second inkjet unit group

13‧‧‧Rectangle edge

14, 24, 30‧‧‧ Piezo Actuator

141, 241‧‧‧ actuation unit

2‧‧‧Inkjet head multilayer structure

21‧‧‧ boards

221‧‧‧Liquid chamber

222‧‧‧Into the flow channel

223‧‧‧ cavity

223a‧‧‧ first side

223b‧‧‧ second side

223c‧‧‧ third side

223d‧‧‧ fourth side

224‧‧‧Drain flow channel

23‧‧‧Substrate

231‧‧‧ inkjet holes

240, 301‧‧‧ first side

302‧‧‧Second side

Cutting steps of S20~S23, S40~42‧‧‧ actuation unit

First Figure A: It is a schematic plan view of a multilayer structure of a conventional ink jet head before cutting.

First Figure B: This is a schematic plan view of the first Figure A after cutting.

Second Figure A is a schematic structural view of a multi-layer structure of an ink jet head according to a first preferred embodiment of the present invention.

Second Figure B: This is a schematic cross-sectional view of the second Figure A along a-a'.

Second Figure C is a flow chart of a method for cutting a piezoelectric actuator unit of an ink jet head according to a first preferred embodiment of the present invention.

Third figure A: It is a schematic plan view of the second figure A after cutting.

Third Figure B: This is a schematic cross-sectional view of the third Figure A along b-b'.

Third Figure C: is a schematic cross-sectional view of the third Figure A along c-c'.

Fourth FIG. A is a schematic structural view of an inkjet multilayer structure according to a second preferred embodiment of the present invention.

Fourth FIG. B is a flow chart showing a cutting method of the piezoelectric actuator unit of the ink jet head according to the second preferred embodiment of the present invention.

Cutting step of S40~S42‧‧‧ actuation unit

Claims (9)

A method for cutting a piezoelectric actuator unit of an inkjet head, the method comprising the steps of: (a) providing a multi-layer structure of an inkjet head, which is formed by stacking a vibrating plate and a plurality of plates, and the inkjet The head multilayer structure has a plurality of ink jet units, wherein the plurality of ink jet units are symmetrically disposed with each other, and each of the plurality of ink jet units respectively has a cavity; (b) the at least one piezoelectric actuator is correspondingly disposed on The plurality of ink jet units are above the vibrating plate of the cavity, wherein the cavity has a first side, a second side, a third side and a fourth side, respectively, and each of the cavities One side is respectively aligned with the third side of the other cavity that is symmetrical; and (c) is cut by a wafer along the first side corresponding to the cavity and symmetrical to the cavity The third side linearly cuts the at least one piezoelectric actuator, so that the at least one piezoelectric actuator corresponds to the cavity to respectively generate a plurality of symmetrically arranged actuation units. The method of cutting a piezoelectric actuator unit of an ink jet head according to claim 1, wherein the number of the at least one piezoelectric actuator is two, and the piezoelectric actuator has a first The side edge and the second side edge are disposed on the second side of the cavity and the second side edge is aligned with the fourth side of the cavity. The method of cutting a piezoelectric actuator unit of the inkjet head according to claim 1, wherein the number of the at least one piezoelectric actuator is two, wherein the piezoelectric actuator has a first a side edge, and the first side edge is disposed in alignment with the second side of the cavity of the plurality of ink ejection units. Cutting of the piezoelectric actuator unit of the ink jet head as described in claim 3 The method further includes the step (c1) in the step (c): linearly cutting the wafer cutting blade along the fourth side of the cavity corresponding to the two symmetrical positions, and then actuating the piezoelectric device The sheets are cut to form a plurality of symmetrically arranged actuation units. The method of cutting a piezoelectric actuator unit of an ink jet head according to claim 1, wherein the ink jet head multilayer structure has a substrate and has an ink ejection orifice. The cutting method of the piezoelectric actuator unit of the inkjet head according to the fifth aspect of the invention, wherein the plurality of panels are stacked on the substrate, and respectively forming a liquid storage chamber of the plurality of inkjet units, a microstructure of the liquid inlet channel, the cavity and a liquid outlet channel, wherein the liquid inlet channel is in communication with the cavity and the liquid storage chamber, and the liquid flow channel is the cavity and the spray The ink holes are connected. The method for cutting a piezoelectric actuator unit of an ink jet head according to claim 1, wherein the thickness of the wafer dicing blade corresponds to the thickness of the piezoelectric actuator, and the piezoelectricity is not exceeded. The thickness of the actuating sheet is preferred. The method of cutting a piezoelectric actuator unit of an ink jet head according to claim 7, wherein the thickness of the wafer dicing blade is preferably 50 μm. The method of cutting a piezoelectric actuator unit of an ink jet head according to claim 1, wherein the piezoelectric actuator is formed of a lead zirconate titanate piezoelectric material.