TWI394501B - Etching system and method for regenerating etchant - Google Patents

Description

Etching system and etching solution regeneration method

The present invention relates to the field of printed circuit boards, and more particularly to a method for fabricating a circuit board for detecting a deviation of a board edge joint.

The conductive traces in the board are typically formed by image transfer-etching of the copper foil layer. Specifically, a photosensitive material layer is first formed on the surface of the copper foil layer, and then the photosensitive material layer is exposed and developed to form a photosensitive material pattern on the surface of the copper foil layer which is the same as the conductive line pattern to be formed, and finally the photosensitive material is formed. The pattern is etched so that a portion of the copper foil layer covered by the photosensitive material is not etched and a portion not covered by the photosensitive material is etched, thereby obtaining a conductive line.

The etching solution used for etching the copper foil layer is usually an acidic solution of divalent copper. After the etching solution is etched, it is usually necessary to regenerate it for reuse. In the prior art, the etching system generally includes a liquid discharging device, a carrying conveying device and a liquid collecting tank, and the carrying conveying device is located between the liquid discharging device and the liquid collecting tank, and the infusion pipe and the pump are connected between the liquid discharging device and the liquid collecting tank. And the liquid collecting tank is connected with the regenerant input pipe and the waste liquid tank, and the liquid discharging device sprays the etching liquid in the liquid collecting tank to the circuit substrate on the carrying conveying device by the liquid discharging device, and the etching liquid etches the circuit substrate and flows back. Into the sump, at the same time, the regenerated syrup is also injected into the sump, and the etchant after etching the circuit board is not uniformly reacted with the regenerant and is sent to the liquid ejecting device, so that the etchant component sprayed by the liquid ejecting device is unstable. . In addition, the etching liquid is recycled in such a manner that the sum of the concentration of the divalent ions of copper and the monovalent ions in the etching liquid in the liquid collecting tank, that is, the density of the etching liquid, is continuously increased. Therefore, the etching ability of the etching liquid cannot be ensured, so that the rate and quality of the etching circuit board cannot be ensured.

In view of the above, an etching system and an etching liquid regeneration method are provided, which are necessary to make the regenerated etching liquid composition uniform and stable.

An etching system and an etching solution regeneration method will be described below by way of examples.

An etching system for etching a circuit board, the etching system comprising a liquid discharging device, a liquid collecting tank and an etching liquid regenerating device disposed outside the liquid collecting tank, wherein the liquid discharging device is used for spraying the etching liquid onto the surface of the circuit board The sump is configured to receive an etchant after etching the circuit board, the etchant regeneration device includes a regeneration reaction tower and a regeneration liquid storage tower, and the regeneration reaction tower is used for etching a circuit for quantitatively injecting from the sump The etching liquid behind the plate is used for regeneration, and the regenerating liquid storage tower is for storing the etching liquid after the regeneration processing, and supplies the etching liquid after the regeneration processing to the liquid ejecting apparatus.

An etching liquid regeneration method comprising the steps of: providing the etching system; injecting an etching liquid after etching the circuit board in the quantitative liquid collecting tank into a regeneration reaction tower of the etching liquid regeneration device; and etching the etching circuit in the regeneration reaction tower The etching liquid after the plate is subjected to regeneration treatment to obtain an etching liquid after the regeneration treatment; and the etching liquid after the regeneration processing is injected into the regeneration liquid storage tower to supply the etching liquid after the regeneration processing to the liquid discharging device.

Compared with the prior art, the etching system provided by the technical solution can transfer the etching liquid after etching the circuit board from the liquid collecting tank to the regenerating device for batch regeneration processing, and then uniformly etch the liquid after the batch regeneration processing. Used for subsequent etching, thus avoiding direct in the sump The problem that the etching rate is unstable after the regeneration is directly applied and the etching liquid composition after the regeneration treatment is not uniform is unstable.

The etching system and the etching solution regeneration method provided by the technical solution are further described below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , an etching system 100 provided by an embodiment of the present technical solution includes a liquid discharging device 110 , a liquid collecting tank 120 , an etching liquid regeneration device 130 , and a first guide between the liquid collecting tank 120 and the etching liquid regeneration device 130 . The liquid pipe 140, the first pump 160a attached to the first liquid guiding tube 140, the second liquid guiding tube 150 connected between the liquid discharging device 110 and the etching liquid regenerating device 130, and the second liquid guiding tube 150 Two pumps 160b.

The liquid discharge device 110 includes at least one nozzle 111. The nozzle 111 is provided with a plurality of nozzles 112 for spraying an etchant onto the surface of the circuit board to be etched. The nozzle 111 is in communication with the second liquid conduit 150 and the second pump 160b. Of course, the nozzle 111 can be a plurality of roots, and the plurality of nozzles 111 can be disposed in parallel with each other, so that the etching liquid sprayed from the nozzle 112 covers a large area, and the etching rate can be increased.

The liquid collection tank 120 is disposed below the liquid discharge device 110 for accommodating the etching liquid after etching the circuit board. The liquid collection tank 120 and the etching liquid regeneration device 130 inject the etching liquid after etching the circuit board into the etching liquid regeneration device 130 by the first liquid guiding tube 140 and the first pump 160a attached to the first liquid guiding tube 140.

Of course, a transport carrier (not shown) may be disposed between the liquid ejecting apparatus 110 and the sump 120 for carrying and transporting the circuit board for etching. The conveying carrier device can be a plurality of conveying rollers arranged in parallel, so that The board moves in a direction perpendicular to the direction in which the roller extends.

The etching solution regenerating device 130 includes an etching liquid storage tower 131, a regeneration reaction tower 132, and a regenerating liquid storage tower 133 which are sequentially disposed, a third liquid guiding tube 134 which is connected between the etching liquid storage tower 131 and the regeneration reaction tower 132, and is attached to The third pump 160c of the third catheter 134, the fourth catheter 135 connected between the regeneration reaction tower 132 and the regenerant storage tower 133, and the fourth pump 160d attached to the fourth catheter 135. The etching liquid storage tower 131 and the liquid collecting tank 120 communicate with each other, and the etching liquid for etching the circuit board in the liquid collecting tank 120 is injected into the etching liquid storage tower 131 by the first pump 160a and the first liquid guiding tube 140, And the old liquid stored in the etching liquid storage tower 131 reaches a predetermined volume.

The regeneration reaction tower 132 and the bottom of the etching liquid storage tower 131 are connected to each other by the third liquid guiding tube 134 and the third pump 160c. When the etching liquid after etching the circuit board in the etching liquid storage tower 131 reaches a predetermined volume, the control unit The three pump 160c causes the etching liquid after etching the circuit board to be injected into the regeneration reaction tower 132 through the third liquid guiding tube 134, and detects and regenerates the etching liquid after etching the circuit board in the regeneration reaction tower 132. The regeneration reaction column 132 has an opposite top end 1321 and a bottom end 1322. In the present embodiment, a water inlet pipe 1323 and a regenerant inlet pipe 1324 are provided at the tip end 1321, and a stirrer 1325 and a detecting element 1326 are attached to the regeneration reaction column 132 from the tip end 1321. A drain tube 1327 is disposed at the bottom end 1322 for discharging the etching liquid partially etched from the circuit board to prevent an increase in the volume of the etching liquid in the entire etching system 100. The water inlet pipe 1323 is in communication with a water storage device (not shown) for injecting water into the regeneration reaction column 132. The regenerant input tube 1324 is in communication with the regenerant storage device for regeneration reaction A regenerant is injected into the column 132. The detecting element 1326 is configured to detect the density of the etching liquid after the etching of the etching circuit board in the regeneration reaction tower 132 and to display the concentration of the component to be detected of the solution in the regeneration reaction tower 132, such as hydrogen peroxide or hydrogen ions. The volume of the old liquid discharged from the liquid discharge pipe 1327 and the volume of the water injected into the water input pipe 1323 are determined by analytical calculation based on the etched liquid density after the etched circuit board is detected, so that the solution density in the regeneration reaction column 132 is required. The range of densities. The amount of the regenerant added is calculated based on the concentration of the detected component in the solution after the density is adjusted. The agitator 1325 is used to stir the etching liquid to which the regenerant is added, so that the etching liquid and the regenerant are sufficiently mixed and reacted, so that the etching liquid is completely regenerated, and the etching liquid after the regeneration treatment of the uniform composition is obtained.

The fourth liquid conduit 135 and the fourth pump 160d are used to send the etching liquid after the regeneration reaction tower 132 is regenerated to the regeneration liquid storage tower 133.

The regenerating liquid storage tower 133 is in communication with the regeneration reaction tower 132 and the nozzle 111, and is configured to store the etching liquid after the regenerative reaction tower 132 is regenerated, and the etching liquid after the regeneration treatment is installed on the second liquid guiding tube 150 and The second pump 160b of the second catheter 150 is supplied to the nozzle 111 for etching the circuit board.

Of course, when the volume of the sump 120 is large, the etchant regeneration device 130 may not have the etchant storage tower 131, but directly connect the regeneration reaction tower 132 and the sump 120 to each other, and the first pump 160a and The first liquid guiding tube 140 injects the etching liquid after the liquid collecting tank 120 etches the circuit board into the regeneration reaction tower 132 by a predetermined volume. In addition, the regenerant liquid storage tower 133 may also be two communicating with each other, so that more etched liquid after the regeneration treatment can be stored to meet the needs of the liquid ejecting apparatus 110 when the etching liquid is consumed faster.

The regeneration of the time liquid by using the etching system provided by the technical solution includes the following steps: First, the first liquid guiding tube 140 and the first pump 160a are used to inject the etching liquid after etching the circuit board in the liquid collecting tank 120 to the etching. The liquid regeneration device 130 is inside the regeneration reaction column 132.

In this embodiment, the first liquid guiding tube 140 and the first pump 160a are used to inject a predetermined volume of the etching liquid in the sump 120 into the etching liquid storage tower 131, and then pass through the third liquid guiding tube. The 134 and the third pump 160c inject a predetermined volume of the etching liquid after the etching of the circuit board into the regeneration reaction column 132. When the etching liquid regeneration device 130 does not have the etching liquid storage tower 131, the etching liquid after etching the circuit board can be injected into the regeneration reaction column 132.

In the second step, the etching liquid after etching the circuit board in the regeneration reaction column 132 is subjected to regeneration treatment.

First, the detecting element 1326 is used to detect the etching liquid after the etching circuit board in the regeneration reaction tower 132, and the partially etched old liquid is discharged according to the density of the etching liquid after the etching of the detected circuit board, and is input by water. The tube 1323 is injected with water to adjust the density of the etching liquid in the regeneration reaction column 132. The etching liquid after etching the circuit board has a density of the etching liquid after etching the circuit board because the copper of the copper layer of the circuit board is dissolved therein, and the density of the etching liquid before the etching is not performed. It can be understood that the greater the density of the old liquid after etching, the greater the total concentration of the one-valent copper ion and the divalent copper ion. In order to ensure that the content of the divalent copper ions in the etched liquid after regeneration is within a predetermined range, it is necessary to control the density of the etching liquid within a predetermined range. In this embodiment, the water is added by discharging the partially etched old liquid to adjust The density of the etching solution in the reaction column 132 is generated.

Then, according to the detection component 1326 detecting the concentration of the specific component detected in the etching liquid in the regeneration reaction tower 132 after the adjustment density is adjusted, the regenerant is added into the etching regeneration reaction tower 132 to etch the regenerant and the regeneration reaction tower 132. The liquid reacts to form a regenerating etchant. The regenerant is added to the regeneration reaction column 132 via the regenerant input pipe 1324. In this embodiment, the regenerant added is an aqueous hydrogen chloride solution and hydrogen peroxide, so that one of the copper ions in the etching solution after etching the circuit board is oxidized to form divalent copper ions, thereby ensuring the inclusion of the etched liquid after regeneration. The divalent copper ion concentration of the copper foil used to etch the circuit board satisfies the requirements. The regenerant and the etching liquid in the regeneration reaction column 132 are stirred by the agitator 1325, and the regenerant is sufficiently reacted with the etching liquid in the regenerating reaction column 132 to obtain a post-regeneration etching liquid having a concentration of each component satisfying the requirements.

In the third step, the etchant after the regeneration treatment is transferred from the regeneration reaction column 132 to the regeneration liquid storage column 133 for supply to the liquid discharge device 110.

The etching system provided by the technical solution can transfer the etching liquid after etching the circuit board from the liquid collecting tank to the recycling device for batch regeneration processing, and then use the etching liquid with uniform composition after the batch regeneration processing for subsequent etching. Therefore, it is possible to avoid the problem that the etching rate is unstable due to the uneven application of the etching liquid component after the regeneration treatment is directly applied directly to the inside of the sump.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Familiar with this Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧ etching system

110‧‧‧Liquid device

111‧‧‧ nozzle

112‧‧‧ spout

120‧‧ ‧ sump

130‧‧‧etching fluid regeneration device

131‧‧‧etching liquid storage tower

132‧‧‧Regeneration Tower

1321‧‧‧Top

1322‧‧‧ bottom

1323‧‧‧Water input pipe

1324‧‧‧Regenerant input tube

1325‧‧‧Agitator

1326‧‧‧Detection components

1327‧‧‧Draining tube

133‧‧‧Regeneration liquid storage tower

134‧‧‧The third catheter

135‧‧‧four catheter

140‧‧‧First catheter

150‧‧‧Second catheter

160a‧‧‧First pump

160b‧‧‧second pump

160c‧‧‧ third pump

160d‧‧‧fourth pump

FIG. 1 is a schematic diagram of an etching system provided by an embodiment of the present technical solution.

100‧‧‧ etching system

110‧‧‧Liquid device

111‧‧‧ nozzle

112‧‧‧ spout

120‧‧ ‧ sump

130‧‧‧etching fluid regeneration device

131‧‧‧etching liquid storage tower

132‧‧‧Regeneration Tower

1321‧‧‧Top

1322‧‧‧ bottom

1323‧‧‧Water input pipe

1324‧‧‧Regenerant input tube

1325‧‧‧Agitator

1326‧‧‧Detection components

1327‧‧‧Draining tube

133‧‧‧Regeneration liquid storage tower

134‧‧‧The third catheter

135‧‧‧four catheter

140‧‧‧First catheter

150‧‧‧Second catheter

160a‧‧‧First pump

160b‧‧‧second pump

160c‧‧‧ third pump

160d‧‧‧fourth pump

Claims (8)

An etching system for etching a circuit board, the etching system comprising a liquid discharging device, a liquid collecting tank and an etching liquid regenerating device disposed outside the liquid collecting tank, wherein the liquid discharging device is used for spraying the etching liquid onto the surface of the circuit board The sump is configured to receive an etchant after etching the circuit board, the etchant regeneration device includes a regeneration reaction tower and a regeneration liquid storage tower, and the regeneration reaction tower is used for etching a circuit for quantitatively injecting from the sump The etchant after the plate is subjected to regeneration treatment, and the regeneration reaction tower is provided with a regenerant input pipe for injecting a regenerant into the regeneration reaction tower, and the regenerative reaction tower is provided with a detection element. The detecting component is configured to detect the density of the etchant injected in the regeneration reaction tower and test the content of a specific component in the etching liquid, and the regenerating liquid storage tower is connected to the liquid discharging device for storing the etching after the regeneration treatment. The liquid is supplied to the liquid ejecting apparatus. The etching system of claim 1, wherein a first liquid guiding tube and a first pump are disposed between the liquid collecting tank and the regeneration reaction tower, and the first pump is installed on the first liquid guiding tube. And the etchant liquid after the etched circuit board in the sump is quantitatively extracted by the first liquid guiding tube to inject into the regenerative reaction tower, and the etching system further includes a first portion disposed between the liquid ejecting device and the etchant regenerating device. a second liquid guiding tube for connecting the liquid discharging device and the etching liquid regenerating device, and a second liquid guiding tube for extracting by the second liquid guiding tube The etched liquid after regeneration in the etching liquid regenerating device is injected into the liquid ejecting apparatus. The etching system of claim 2, wherein the etching liquid regeneration device further comprises an etching liquid storage tower, a third liquid guiding tube, and a third pump, wherein the etching liquid storage tower is disposed at the first liquid guiding layer Between the tube and the third catheter The first liquid guiding tube is connected to the liquid collecting tank and the etching liquid storage tower, the third liquid guiding tube is connected to the etching liquid storage tower and the etching liquid regeneration tower, and the third pump is disposed on the third liquid guiding tube, The etching solution after the etching of the circuit board in the etching liquid storage tower is quantitatively extracted by the third liquid guiding tube is injected into the regeneration reaction tower. The etching system of claim 1, wherein the regeneration reaction column is provided with a water input pipe for injecting water into the regeneration reaction column. The etching system according to claim 1, wherein the regeneration reaction tower is provided with a liquid discharge pipe for removing an etching liquid which is partially etched from the sump. The etching system according to claim 1, wherein a stirrer is installed in the regeneration reaction tower for stirring the etching liquid in the regeneration reaction tower. An etching liquid regeneration method comprising the steps of: providing an etching system as described in claim 1; injecting an etching liquid after etching the circuit board in the quantitative liquid collecting tank into a regeneration reaction tower of the etching liquid regeneration device; The detecting component detects the density of the etching liquid after etching the circuit board in the regeneration reaction tower, excludes the etching liquid after partially etching the circuit board according to the detected density, and injects water into the regeneration reaction tower to adjust the etching in the regeneration reaction tower. The density of the liquid; the detecting component detects the content of the specific component in the etching liquid, and injects a regenerant into the regeneration reaction tower according to the content of the specific component detected to regenerate the etching liquid in the regeneration reaction tower, thereby obtaining the regeneration treatment The etching solution; and the etching liquid after the regeneration treatment is injected into the regenerating liquid storage tower to supply the etching liquid after the regeneration processing to the liquid ejecting apparatus. The etching solution regeneration method according to claim 7, wherein after the injecting the regenerant, the step of stirring the etching liquid and the regenerant in the reaction column to sufficiently react the etching liquid with the regenerant is further included.