TWI393198B - Evaluation method and straightness evaluation device of fine metal wire - Google Patents

Evaluation method and straightness evaluation device of fine metal wire Download PDF

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Publication number
TWI393198B
TWI393198B TW094116777A TW94116777A TWI393198B TW I393198 B TWI393198 B TW I393198B TW 094116777 A TW094116777 A TW 094116777A TW 94116777 A TW94116777 A TW 94116777A TW I393198 B TWI393198 B TW I393198B
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Taiwan
Prior art keywords
straightness
wire
metal thin
liquid
metal
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TW094116777A
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English (en)
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TW200610083A (en
Inventor
Kazunari Maki
Yuji Nakata
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Tanaka Electronics Ind
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Publication of TW200610083A publication Critical patent/TW200610083A/zh
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Publication of TWI393198B publication Critical patent/TWI393198B/zh

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Description

金屬細線之直行性評估方法及直行性評估裝置
本發明是涉及一種用於接合線的金線等金屬細線的直行性評估方法及直行性評估裝置。
在半導體製品，例如LSI等大型積體電路的接線上使用接合線。最近，隨著該等半導體製品的小型化、薄壁化、狹窄間距化在作為接合線使用的金屬細線時要求其直行性的提高。因此，有必要對金屬細線的直行性進行評估。
以上金屬細線的直行性評估方法實際進行利用金屬細線的成環而進行其直行性的評估，或將捲線筒鬆開的金屬細線放置在平面上，由其形狀進行直行性的評估，或者將捲線筒鬆開的金屬細線垂下到防風用容器內，由其形狀進行直行性的評估(例如，參照專利文獻1)。
[日本專利文獻1]特開2002-124534號公報(第1圖)
但是，上述傳統的金屬細線之直行性評估方法仍存在有以下的問題。即，上述傳統的金屬細線之直行性評估方法中，利用金屬細線實際進行成環時，會受到接合條件等的影響，使得金屬細線進行其本身直行性的評估困難。又，一旦將金屬細線放置在平面上時，會因為金屬細線和平 面之間產生的摩擦力而有變形成金屬細線所具備蛇行形狀的困難，同時會有因金屬細線的放置方法而在金屬細線形狀上造成不均一，而有不能進行正確直行性評估的問題。另外，一旦使得金屬細線垂下時，會因金屬細線本身的重量，和上述同樣地，變形成金屬細線所具備蛇行形狀困難而有不能正確觀察彎曲或彎曲的震幅等。
本發明是有鑑於上述的課題所研創而成，提供一種可以正確評估金屬細線的直行性的金屬細線之直行性評估方法及直行性評估裝置為目的。
本發明為了解決上述課題而採用以下的構成。即，本發明的金屬細線之直行性評估方法，其特徵為：使具有預定長度的金屬細線，以該金屬細線的至少一端為自由端的狀態懸浮在液體上面，藉攝影裝置進行該液體液面上的上述金屬細線形狀的攝影以獲得影像，從所獲得的影像測定規則性的彎曲數、平均震幅、平均曲率半徑及不規則性的彎曲數，並以上述規則性的彎曲數、平均震幅、平均曲率半徑及不規則性的彎曲數為基礎，評估該金屬細線的直行性。
根據本發明，由於使金屬細線懸浮在液體上，可以如相對於金屬細線的摩擦等，除去抑制金屬細線變形的抑止力的影響。其中，以金屬細線的至少一端為自由端，可以使金屬細線變化為原來所具備的蛇行形狀。因此，可以正 確地評估金屬細線的直行性。
並且，本發明金屬細線之直行性評估方法，以攝取懸浮在上述液體上面的上述金屬細線，從其靜止影像來評估金屬細線之直行性為佳。
根據本發明，雖然通過攝影裝置的觀察影像來評估金屬細線的直行性，但是所獲得的觀察影像為靜止影像，因此較以目測評估更能正確地評估金屬細線的直行性。
又，本發明金屬細線之直行性評估方法，上述金屬細線是以金線為佳。
根據本發明可相對於作為接合線所使用的金線進行直行性評估。
另外，本發明金屬細線之直行性評估裝置，其特徵為，具備：液面上懸浮金屬細線的液體；貯存該液體的液體保存容器；及攝影懸浮在上述液體上之金屬細線的攝影裝置。
根據本發明，和上述同樣地，將金屬細線懸浮在液體上，可以正確地評估金屬細線的直行性。
又，本發明金屬細線之直行性評估裝置以具備防止對於上述液體的液面震動的防震手段為佳。
根據本發明，通過液面震動的防止，可以穩定液面上的金屬細線的形狀，更正確地進行金屬細線之直行性的評估。
另外，本發明金屬細線之直行性評估裝置以具備照射 懸浮在上述液體上的上述金屬細線的照明裝置為佳。
根據本發明，對金屬細線照射照明光可以明顯地觀察金屬細線。
根據本發明金屬細線之直行性評估方法，使金屬細線懸浮在液體上，可以使金屬細線變形為原來所具備的蛇行形狀。因此，可以正確地進行金屬細線的直行性評估。
並且，根據本發明金屬細線之直行性評估裝置，和上述同樣地，可以正確地進行金屬細線的評估。
以下，根據圖示說明本發明的金屬細線之直行性評估裝置的一實施型態。
根據本實施型態之直行性評估裝置1，是評估例如連接IC晶片電極和外部的引線端子的作為接合線的金線2的直行性之用。並且，該直行性評估裝置1是如第1圖表示，具備：遮光、防風用框體(防震手段)3；使金線2懸浮於內部的甕槽(液體保存容器)4；上面放置甕槽4的除震台(防震手段)5；將照光照射在金線2上的照明裝置6；及攝取金線2的攝影裝置7。
金線2是由純度99.99%的Au所形成，其線徑為18μm，每2000m捲繞在捲線筒上。
框體3是為了防止因外部的光或風等造成觀察結果不 均一所設置。並且，在框體3的內壁上塗有黑色的塗料，以方便明顯觀察來自照明裝置(6)的照明光被金線2反射時的反射光。
甕槽4在其內部裝有液體的純水，從捲線筒鬆開以預定長度切斷的金線(2)被懸浮在該純水的液面上。另外，甕槽4是為了防止來自外部震動的傳達使液面震動在觀察結果上產生不均一現象而放置在除震台5的上面。並且，在甕槽4的內面和框體3同樣地塗有黑色的塗料。
照明裝置6是例如由螢光燈所構成，配置在框體3頂棚面上。並且，照明裝置6是構成將照明光均勻地照射於懸浮裝在甕槽4內純水液面上的金線2。
攝影裝置7是例如由數位相機所構成，構成以金線2反射來自照明裝置6的照明光，攝取其反射光。
其次，針對利用該直行性評估裝置1的金線2的直行性評估方法說明如下。
首先，送出捲繞在捲線筒上的金線2，切斷適當的長度使其懸浮於裝在甕槽4內的純水的液面上。此時，對於懸浮在液面的金線2，例如不產生如摩擦力之抑制金線2變形的抑止力作用，因此使金線2變形為金線2原來具備的蛇行形狀。並且，照明裝置6一旦照明光照射在懸浮的金線2上，待變形的金線2的形狀穩定後，以攝影裝置7攝取金線2。將此時所獲得的金線2的形狀的一例顯示在第2圖上。
其次，從所獲得的影像來測定規則性的彎曲數、規則性彎曲的平均震幅、規則性彎曲的平均曲率半徑和不規則 性的彎曲數。
其中，規則性彎曲是如第2a圖表示，為某程度規則性的蛇行形狀，其曲率半徑大，表示從第2a圖所示蛇行形狀的中心線L1突出的部分。因此，規則性的彎曲數是表示蛇行形狀之曲率半徑大的山形狀的數。又，規則性彎曲的震幅是表示蛇行形狀之中心線和規則性彎曲的頂點之間的距離。並且，規則性彎曲的曲率半徑是表示內接於規則性彎曲的圓半徑。
另外，不規則性彎曲是如第2b圖所示，呈不規則性蛇行形狀，其曲率半徑小，表示從第2b圖所示蛇行形狀之近似曲線L2突出的部分。因此，不規則性彎曲的數是表示蛇行形狀之曲率半徑小的山形狀的數。
如上述進行金線2的直行性評估。再者，在直行性的評估時，將捲繞在同一捲線筒的金線2切斷成複數條，對該等分別進行評估，以進行更正確的直行性的評估。
根據以上的直行性評估方法，使金線2懸浮在純水的液面上，防止對於金線2之摩擦力等抑止力的作用。因此，可以使金線2變形為原來具備的蛇行形狀，可以正確地評估金線2的直行性。
另外，根據上述構成的直行性評估裝置1，和上述同樣地，可以更正確地評估金線2的直行性。
而且，透過攝影裝置7獲得觀察影像，和以目測進行評估更可以正確地進行直行性評估。並且，藉框體3及除震台5以穩定金線2的形狀，並通過利用照明裝置6可以 明顯地觀察金線2，並可進行正確地直行性的評估。
(實施例1)
其次，根據實施例具體說明本發明的直行性評估方法如下。
首先，使純度99.99%的金線延伸到線徑為18μm，並施以退火(annealing)處理形成4%的延伸。並且，在金線的表面塗上潤滑劑，將2000m捲繞在半徑25mm捲線筒上。製造8組捲繞有以上所製造金線的捲線筒。在此，將捲繞在所準備8組捲線筒的金線依序設定在實施例1到實施例8。
相對於實施例1至實施例8，分別準備20個各切斷成長度350mm的金線。然後，根據上述的直行性評估方法，分別測定每根不規則性的彎曲數、每根規則性的彎曲數、規則性彎曲的平均震幅、規則性彎曲的平均曲率半徑。另外，利用各金線實際設置在Kulicke&Soffa公司製的引線接合器(wire bonder)(裝置名8028)，座間距(pad pitch)為45μm間隔、線圈長度為5mm、線圈高度為220μm的條件下，製作10000個線圈，測定鄰接線圈彼此間接觸部分的數，即短路數。將此結果表示於表1。
從表1上可得知，不規則性的彎曲數少(表1所示的○)，並且規則性彎曲的曲率半径大(表1所示的○)時，則短路數變少(表1所示的○)，不規則性的彎曲數多(表1所示的△或×)，或者規則性彎曲的曲率半径小(表1所示的△或×)，則短路數變多(表1所示的×)。
以上，通過使金線2懸浮在純水的液面上可確認出金線2原來所具備的蛇行形狀，並可確認可以確實評估金線的直行性。而且也可以確認金線2的直行性是有賴於規則性彎曲的曲率半徑和不規則性的彎曲數。
另外，短路數的絕對值，可以隨著其他引線接合器的使用而有所變化，但是從實施例1到實施例8的相對的短路數並沒有多少的變化。又，雖然使用上述習知的直行性評估方法同樣進行金線的直行性評估，但是由於平面的摩擦力和金線本身的重量等相對於金線2的長度方向的抑止力，不能確認金線原來所具備的蛇行形狀。
此外，本發明不僅限於上述實施型態，在不脫離本發明主旨的範圍內，可施以種種的變更。
例如，上述實施型態是通過框體及除震台來抑制液面的震動，並藉著攝影裝置獲得靜止影像，但是可不設置該等裝置，只需在裝有純水的甕槽內使金線懸浮其上，即可進行金線的直行性評估。
另外，上述實施型態中，雖是使用金線作為金屬細線，但是也可以使用鐵絲、鎢絲、鋁線、銅線、鉻線、鎳線，或者貴金屬線(銀線、白金線、鈀線)，或者合金線( 例如，金-鈀線、金-銀線、金-白金線、18金線、硬鋼線、鋼琴線、不銹鋼線)，或者在該等金屬線上包覆其他物質(金屬、無機物、有機物等)的細線等。
又，雖然以金線的兩端作為自由端進行直行性的評估，但是也可以至少其一端為自由端。
並且，雖然是將金線懸浮在純水的液面上，但是不僅限於純水，只要可以使金屬細線懸浮在液面上的液體即可。
6‧‧‧照明裝置
7‧‧‧攝影裝置
第1圖是表示本發明一實施型態的直行性評估裝置的透視圖。
第2圖是表示本發明的直行性評估方法中，懸浮在純水液面上的金線的圖，(a)為金線整體的平面圖，(b)為規則性彎曲的的擴大圖。
1‧‧‧直行性評估裝置
2‧‧‧金線(金屬細線)
3‧‧‧框體(防震手段)
4‧‧‧甕槽(液體保存容器)
5‧‧‧除震台(防震手段)
6‧‧‧照明裝置

Claims (6)

  1. 一種金屬細線之直行性評估方法，其特徵為：具有預定長度的金屬細線，使該金屬細線的至少一端為自由端的狀態懸浮在液體上，藉攝影裝置進行該液體液面上的上述金屬細線形狀的攝影以獲得影像，從所獲得的影像測定規則性的彎曲數、平均震幅、平均曲率半徑及不規則性的彎曲數，並以上述規則性的彎曲數、平均震幅、平均曲率半徑及不規則性的彎曲數為基礎，評估該金屬細線的直行性。
  2. 如申請專利範圍第1項記載的金屬細線之直行性評估方法，其中，攝取懸浮在上述液體上的上述金屬細線，從其靜止影像評估該金屬細線的直行性。
  3. 如申請專利範圍第1項或第2項記載的金屬細線之直行性評估方法，其中，上述金屬細線為金線。
  4. 一種金屬細線之直行性評估裝置，其特徵為，具備：液面上懸浮金屬細線的液體；貯存該液體的液體保存容器；及攝取懸浮在上述液體上的金屬細線的攝影裝置。
  5. 如申請專利範圍第4項記載的金屬細線之直行性評估裝置，其中，具備防止朝著上述液體液面震動的防震手段。
  6. 如申請專利範圍第4項或第5項記載的金屬細線之直行性評估裝置，其中，具備照射懸浮在上述液體上的上述金屬細線的照明裝置。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11190604A (ja) * 1997-12-26 1999-07-13 Tanaka Electron Ind Co Ltd 金属細線の直線性測定装置および測定方法
JP2001028464A (ja) * 1999-07-15 2001-01-30 Agency Of Ind Science & Technol フリップチップ接続アライメント精度評価方法
JP2002124534A (ja) * 2000-10-13 2002-04-26 Tanaka Electronics Ind Co Ltd 金属細線の直進性評価装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11190604A (ja) * 1997-12-26 1999-07-13 Tanaka Electron Ind Co Ltd 金属細線の直線性測定装置および測定方法
JP2001028464A (ja) * 1999-07-15 2001-01-30 Agency Of Ind Science & Technol フリップチップ接続アライメント精度評価方法
JP2002124534A (ja) * 2000-10-13 2002-04-26 Tanaka Electronics Ind Co Ltd 金属細線の直進性評価装置及び方法

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