TWI393182B - 化學機械拋光（ｃｍｐ）設備以及用於在基底上進行化學機械拋光（ｃｍｐ）的方法 - Google Patents

化學機械拋光（ｃｍｐ）設備以及用於在基底上進行化學機械拋光（ｃｍｐ）的方法 Download PDF

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Publication number
TWI393182B
TWI393182B TW098143610A TW98143610A TWI393182B TW I393182 B TWI393182 B TW I393182B TW 098143610 A TW098143610 A TW 098143610A TW 98143610 A TW98143610 A TW 98143610A TW I393182 B TWI393182 B TW I393182B
Authority
TW
Taiwan
Prior art keywords
polishing pad
conditioning
cmp
polishing
chemical mechanical
Prior art date
Application number
TW098143610A
Other languages
English (en)
Chinese (zh)
Other versions
TW201041023A (en
Inventor
Soon-Kang Huang
Kun Ku Hung
Zin Chang Wei
Chyi Shyuan Chern
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of TW201041023A publication Critical patent/TW201041023A/zh
Application granted granted Critical
Publication of TWI393182B publication Critical patent/TWI393182B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/003—Devices or means for dressing or conditioning abrasive surfaces using at least two conditioning tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW098143610A 2009-05-12 2009-12-18 化學機械拋光（ｃｍｐ）設備以及用於在基底上進行化學機械拋光（ｃｍｐ）的方法 TWI393182B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/464,223 US20100291840A1 (en) 2009-05-12 2009-05-12 System and method for conditioning chemical mechanical polishing apparatus using multiple conditioning disks

Publications (2)

Publication Number Publication Date
TW201041023A TW201041023A (en) 2010-11-16
TWI393182B true TWI393182B (zh) 2013-04-11

Family

ID=43068890

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098143610A TWI393182B (zh) 2009-05-12 2009-12-18 化學機械拋光（ｃｍｐ）設備以及用於在基底上進行化學機械拋光（ｃｍｐ）的方法

Country Status (3)

Country Link
US (1) US20100291840A1 (un)
CN (1) CN101898327B (un)
TW (1) TWI393182B (un)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12337439B2 (en) 2022-08-15 2025-06-24 Applied Materials, Inc. Multiple disk pad conditioner

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8920214B2 (en) * 2011-07-12 2014-12-30 Chien-Min Sung Dual dressing system for CMP pads and associated methods
US9149906B2 (en) * 2011-09-07 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for CMP pad conditioning
CN106323152B (zh) * 2016-09-05 2018-10-02 清华大学 Cmp金属膜厚测量数据的离线分段处理方法和处理系统
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
CN113263436B (zh) 2020-05-29 2022-08-30 台湾积体电路制造股份有限公司 化学机械抛光系统及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080242199A1 (en) * 2007-03-30 2008-10-02 Elpida Memory, Inc. Polishing apparatus and method of reconditioning polishing pad
TWM365218U (en) * 2009-04-08 2009-09-21 Qing-Chang Chen A semiconductor device for cleaning a surface of a wafer
TW200948942A (en) * 2008-04-16 2009-12-01 Hitachi Chemical Co Ltd Polishing agent for CMP and polishing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111892B2 (ja) * 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
US5834377A (en) * 1997-04-07 1998-11-10 Industrial Technology Research Institute In situ method for CMP endpoint detection
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
AU4044400A (en) * 1999-04-01 2000-10-23 Koninklijke Philips Electronics N.V. Dual cmp pad conditioner
US6390902B1 (en) * 2001-06-06 2002-05-21 United Microelectronics Corp. Multi-conditioner arrangement of a CMP system
DE10261465B4 (de) * 2002-12-31 2013-03-21 Advanced Micro Devices, Inc. Anordnung zum chemisch-mechanischen Polieren mit einem verbesserten Konditionierwerkzeug
US6976907B2 (en) * 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
US6935938B1 (en) * 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US7404757B2 (en) * 2004-06-22 2008-07-29 Samsung Austin Semiconductor, L.P. Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080242199A1 (en) * 2007-03-30 2008-10-02 Elpida Memory, Inc. Polishing apparatus and method of reconditioning polishing pad
TW200948942A (en) * 2008-04-16 2009-12-01 Hitachi Chemical Co Ltd Polishing agent for CMP and polishing method
TWM365218U (en) * 2009-04-08 2009-09-21 Qing-Chang Chen A semiconductor device for cleaning a surface of a wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12337439B2 (en) 2022-08-15 2025-06-24 Applied Materials, Inc. Multiple disk pad conditioner

Also Published As

Publication number Publication date
TW201041023A (en) 2010-11-16
CN101898327B (zh) 2013-05-29
CN101898327A (zh) 2010-12-01
US20100291840A1 (en) 2010-11-18

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