TWI389633B - Base film for flexible printed circuit board, substrate and flexible printed circuit board - Google Patents

Base film for flexible printed circuit board, substrate and flexible printed circuit board Download PDF

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TWI389633B
TWI389633B TW96132530A TW96132530A TWI389633B TW I389633 B TWI389633 B TW I389633B TW 96132530 A TW96132530 A TW 96132530A TW 96132530 A TW96132530 A TW 96132530A TW I389633 B TWI389633 B TW I389633B
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circuit board
flexible circuit
base film
flexible
substrate
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TW96132530A
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TW200911103A (en
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Tso Hung Yeh
Hung Yi Chang
Shing Tza Liou
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Zhen Ding Technology Co Ltd
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Description

柔性電路板基膜、柔性電路板基板及柔性電路板 Flexible circuit board base film, flexible circuit board substrate and flexible circuit board

本發明涉及一種柔性電路板基膜、包括該柔性電路板基膜之柔性電路板基板及採用該柔性電路板基板製作之柔性電路板。 The invention relates to a flexible circuit board base film, a flexible circuit board substrate including the flexible circuit board base film, and a flexible circuit board manufactured using the flexible circuit board substrate.

柔性電路板(Flexible Printed Circuit Board,FPCB)以其優異之抗撓曲性能廣泛應用於各種工作時部件之間存於相對運動之電子產品例如折疊式手機,列印頭,硬碟讀取頭中以提供電力/訊號傳輸。 Flexible Printed Circuit Board (FPCB) is widely used in electronic products such as folding mobile phones, print heads and hard disk read heads for relative motion between various working parts. To provide power / signal transmission.

目前柔性電路板逐漸由單層板轉向多層板,線路層中之線路密度也越來越高。參見文獻Takahashi,A.Ooki,N.Naai,A.Akahoshi,H.Mukoh,A.Wajima,M.Res.Lab.,High density multilayer printed circuit board for HITAC M-880,IEEE Trans.On Components,Packaging,and Manufacturing Technology,1992,15(4):418-425。但同時由於高密度柔性電路板之導電線路線寬越來越細,線路之電阻越來越大,產生之熱量亦越來越多。而封裝於電路板上之元件如集成晶片、電阻等均會產生大量熱量。為保證電路板及電子元件之穩定工作,需要將電路板上產生之熱量及時散發出去。 At present, the flexible circuit board gradually turns from a single-layer board to a multi-layer board, and the line density in the circuit layer is also getting higher and higher. See also Takahashi, A. Ooki, N. Naai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880, IEEE Trans. On Components, Packaging , and Manufacturing Technology, 1992, 15(4): 418-425. At the same time, as the line width of the conductive lines of the high-density flexible circuit board becomes thinner and thinner, the resistance of the line becomes larger and larger, and the amount of heat generated is also increased. Components packaged on the board, such as integrated chips, resistors, etc., generate a lot of heat. In order to ensure the stable operation of the circuit board and electronic components, it is necessary to dissipate the heat generated on the circuit board in time.

目前製作柔性電路板之基板以柔性覆銅層壓板最為常見,柔性覆銅層壓板包括柔性絕緣基膜及形成於柔性絕緣基膜上之導電銅層。柔性基膜一般為聚醯亞胺,其具有 很好撓曲性能,然其導熱係數較低。因此採用一般柔性覆銅層壓板製作之柔性電路板中熱量並不能快速從柔性電路板內散發出來。 At present, a substrate for a flexible circuit board is most commonly used as a flexible copper clad laminate, and the flexible copper clad laminate includes a flexible insulating base film and a conductive copper layer formed on the flexible insulating base film. The flexible base film is generally a polyimine, which has Very good flexural performance, but its thermal conductivity is low. Therefore, the heat in a flexible circuit board made of a general flexible copper clad laminate cannot be quickly dissipated from the flexible circuit board.

因此,有必要提供一種可快速將電路板中熱量散發出去之柔性電路板基膜、包括該柔性電路板基膜之柔性電路板基板及採用該柔性電路板基板製作之柔性電路板。 Therefore, it is necessary to provide a flexible circuit board base film that can quickly dissipate heat in a circuit board, a flexible circuit board substrate including the flexible circuit board base film, and a flexible circuit board fabricated using the flexible circuit board substrate.

以下將以實施例說明一種柔性電路板基膜,包括該柔性電路板基膜之柔性電路板基板及採用該柔性電路板基板製作之柔性電路板。 Hereinafter, a flexible circuit board base film, a flexible circuit board substrate including the flexible circuit board base film, and a flexible circuit board fabricated using the flexible circuit board substrate will be described by way of embodiments.

一種柔性電路板基膜,其包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端埋於該柔性聚合物基體內。 A flexible circuit board base film comprising a flexible polymer substrate and a plurality of carbon nanotubes embedded in the flexible polymer matrix, the carbon nanotubes comprising a first end and a second end, the first end being buried in the Flexible polymer matrix.

一種柔性電路板基板,其包括柔性電路板基膜以及至少一層形成於該柔性電路板基膜上之導電層。該柔性電路板基膜包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端埋於該柔性聚合物基體內。 A flexible circuit board substrate comprising a flexible circuit board base film and at least one conductive layer formed on the base film of the flexible circuit board. The flexible circuit board base film comprises a flexible polymer substrate and a plurality of carbon nanotubes embedded in the flexible polymer matrix, the carbon nanotubes comprising a first end and a second end, the first end being buried in the flexible polymerization In the body of the substance.

一種柔性電路板,其包括柔性電路板基膜以及至少一層形成於該柔性電路板基膜上之導電線路。該柔性電路板基膜包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端埋於該柔性聚合物基體內。 A flexible circuit board comprising a flexible circuit board base film and at least one conductive line formed on the base film of the flexible circuit board. The flexible circuit board base film comprises a flexible polymer substrate and a plurality of carbon nanotubes embedded in the flexible polymer matrix, the carbon nanotubes comprising a first end and a second end, the first end being buried in the flexible polymerization In the body of the substance.

該柔性電路板基膜中,奈米碳管可將柔性電路板基膜一 表面上之熱量快速轉移到另一表面上,從而採用該柔性電路板基膜製作出來之柔性電路板中產生之熱量可快速之散發出去。 In the flexible circuit board base film, the carbon nanotube can be used as a base film of the flexible circuit board The heat on the surface is quickly transferred to the other surface, so that the heat generated in the flexible circuit board fabricated using the flexible circuit board base film can be quickly dissipated.

參閱圖1,其為本技術方案提供之柔性電路板基膜第一實施例之結構示意圖。柔性電路板基膜100包括奈米碳管陣列10及柔性聚合物基體12。柔性聚合物基體12具有第一表面122及與第一表面122相對之第二表面124。奈米碳管陣列10包括複數基本相互平行之奈米碳管102。每根奈米碳管102從第一表面122向第二表面124延伸但未露出第二表面124。每根奈米碳管102包括第一端103及第二端104。第一端103與第一表面122齊平,第二端104埋設於柔性聚合物基體12內。奈米碳管102之長度小於第一表面122與第二表面124之間之距離,因此當奈米碳管102之第一端103與第一表面122齊平時,第二端104無法到達第二表面124,亦即埋設於柔性聚合物基體12內。奈米碳管102之含量於1%到50%之間。 Referring to FIG. 1 , it is a schematic structural view of a first embodiment of a flexible circuit board base film provided by the present technical solution. The flexible circuit board base film 100 includes a carbon nanotube array 10 and a flexible polymer matrix 12. The flexible polymer matrix 12 has a first surface 122 and a second surface 124 opposite the first surface 122. The carbon nanotube array 10 includes a plurality of carbon nanotubes 102 that are substantially parallel to each other. Each of the carbon nanotubes 102 extends from the first surface 122 to the second surface 124 but does not expose the second surface 124. Each of the carbon nanotubes 102 includes a first end 103 and a second end 104. The first end 103 is flush with the first surface 122 and the second end 104 is embedded within the flexible polymer matrix 12. The length of the carbon nanotubes 102 is less than the distance between the first surface 122 and the second surface 124, so that when the first end 103 of the carbon nanotube 102 is flush with the first surface 122, the second end 104 cannot reach the second The surface 124, that is, is embedded in the flexible polymer matrix 12. The content of the carbon nanotubes 102 is between 1% and 50%.

奈米碳管102可為單壁奈米碳管也可為多壁奈米碳管。其長度可為1微米到30微米。柔性聚合物基體12為適於作為柔性電路板絕緣基膜之材料,例如聚醯亞胺(Polyimide,PI)、聚乙烯對苯二甲酸乙二醇酯(Polyethylene Terephtalate,PET)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚硫胺(Polyamide)、聚甲基丙烯酸甲酯(Polymethylmethacrylate)、聚碳酸酯 (Polycarbonate)或聚醯亞胺-聚乙烯-對苯二甲酯共聚物(Polyamide polyethylene-terephthalate copolymer)。 The carbon nanotubes 102 can be single-walled carbon nanotubes or multi-walled carbon nanotubes. It can be from 1 micron to 30 microns in length. The flexible polymer matrix 12 is a material suitable for use as a flexible circuit board insulating base film, such as Polyimide (PI), polyethylene terephthalate (PET), and polytetrafluoroethylene. (Polytetrafluoroethylene, PTFE), Polyamide, Polymethylmethacrylate, Polycarbonate (Polycarbonate) or Polyamide polyethylene-terephthalate copolymer.

由於奈米碳管102之第二端104埋於柔性聚合物基體12之內,因此當第二表面124上設置導電層時,奈米碳管102與導電層之間是電絕緣之。由於第二表面124與奈米碳管102之第二端104之間之柔性聚合物較薄,於柔性聚合物基體12第二表面124處產生之熱量可迅速傳遞到奈米碳管102之第二端104,而奈米碳管102於其徑向上具有很高之導熱性能,因此熱量可很快之從奈米碳管102之第二端104傳遞至奈米碳管102之第一端103,亦即熱量可很快從柔性聚合物基體12之第二表面124轉移到第一表面122,當第二表面124上封裝有電子元件時,電子元件發出之熱量可得到及時散發。並且由於奈米碳管102之方向與第一表面122及第二表面124基本垂直,奈米碳管102之含量於1%到5%之間,因此奈米碳管陣列10並不影響柔性電路板基膜12之撓曲性能。 Since the second end 104 of the carbon nanotube 102 is buried within the flexible polymer matrix 12, when the conductive layer is disposed on the second surface 124, the carbon nanotube 102 is electrically insulated from the conductive layer. Since the flexible polymer between the second surface 124 and the second end 104 of the carbon nanotube 102 is relatively thin, heat generated at the second surface 124 of the flexible polymer substrate 12 can be rapidly transferred to the carbon nanotube 102. The two ends 104, while the carbon nanotubes 102 have a very high thermal conductivity in the radial direction, so heat can be quickly transferred from the second end 104 of the carbon nanotubes 102 to the first end 103 of the carbon nanotubes 102. That is, heat can be quickly transferred from the second surface 124 of the flexible polymer substrate 12 to the first surface 122. When the second surface 124 is packaged with electronic components, the heat emitted by the electronic components can be dissipated in time. And since the direction of the carbon nanotubes 102 is substantially perpendicular to the first surface 122 and the second surface 124, and the content of the carbon nanotubes 102 is between 1% and 5%, the carbon nanotube array 10 does not affect the flexible circuit. The flexural properties of the base film 12 of the board.

本實施例當中,奈米碳管102排列成陣列,然而可以理解,複數奈米碳管102於一定角度範圍內可隨意分佈,例如每根奈米碳管102與第一表面122或第二表面124之間成1到10度之間之夾角。 In the present embodiment, the carbon nanotubes 102 are arranged in an array, however, it is understood that the plurality of carbon nanotubes 102 are randomly distributed over a range of angles, such as each of the carbon nanotubes 102 and the first surface 122 or the second surface. The angle between 124 is between 1 and 10 degrees.

參閱圖2,第二實施例之柔性電路板基膜200包括奈米碳管陣列20及柔性聚合物基體22。柔性聚合物基體22具有第一表面222及與第一表面222相對之第二表面224。奈米碳管陣列20包括複數基本相互平行之奈米碳管202。每 根奈米碳管202均兩端埋設於柔性聚合物基體22,並基本垂直於第一表面222或第二表面224。奈米碳管202之兩端都埋於柔性聚合物基體22內,於第一表面222及第二表面224上設置導電層時,奈米碳管陣列20均與導電層電絕緣。 Referring to FIG. 2, the flexible circuit board base film 200 of the second embodiment includes a carbon nanotube array 20 and a flexible polymer substrate 22. The flexible polymer matrix 22 has a first surface 222 and a second surface 224 opposite the first surface 222. The carbon nanotube array 20 includes a plurality of carbon nanotubes 202 that are substantially parallel to each other. each The root carbon nanotubes 202 are both embedded at both ends of the flexible polymer matrix 22 and are substantially perpendicular to the first surface 222 or the second surface 224. Both ends of the carbon nanotube 202 are buried in the flexible polymer substrate 22. When the conductive layer is disposed on the first surface 222 and the second surface 224, the carbon nanotube array 20 is electrically insulated from the conductive layer.

請參閱圖3,以下以實施例說明第一實施例之柔性電路板基膜100之製作方法,該方法包括以下步驟: Referring to FIG. 3, a method for fabricating the flexible circuit board base film 100 of the first embodiment will be described below by way of an embodiment, the method comprising the following steps:

第一步,參閱圖4,提供一犧牲層30。犧牲層30可為金屬層如銅層、鋁層或鎳層。犧牲層30厚度可為2微米到200微米。 In the first step, referring to FIG. 4, a sacrificial layer 30 is provided. The sacrificial layer 30 may be a metal layer such as a copper layer, an aluminum layer or a nickel layer. The sacrificial layer 30 may have a thickness of from 2 micrometers to 200 micrometers.

第二步,於犧牲層30上形成觸媒層32。參閱圖5,首先,於犧牲層30上形成觸媒薄膜31。觸媒薄膜31可為鐵、鈷、鎳或及合金。形成觸媒薄膜31時可採用電鍍、蒸鍍、濺鍍或者氣相沉積法。參閱圖6,然後氧化觸媒薄膜31,形成包括大量觸媒顆粒之觸媒層32。 In the second step, a catalyst layer 32 is formed on the sacrificial layer 30. Referring to FIG. 5, first, a catalyst film 31 is formed on the sacrificial layer 30. The catalyst film 31 may be iron, cobalt, nickel or an alloy. When the catalyst film 31 is formed, plating, vapor deposition, sputtering, or vapor deposition may be employed. Referring to Figure 6, the catalyst film 31 is then oxidized to form a catalyst layer 32 comprising a plurality of catalyst particles.

第三步,參閱圖7,於觸媒層32上生長奈米碳管陣列10。將形成有觸媒層32之犧牲層30放入反應爐中,於700~1000攝氏度下,通入碳源氣,生長出奈米碳管陣列10,其中碳源氣可為乙炔、乙烯等氣體,奈米碳管陣列10之高度可通過控制生長時間來控制,一般之生長高度為1~30微米。有關奈米碳管陣列10生長之方法已較為成熟,具體可參閱文獻Science,1999,283,512-414和文獻J.Am.Chem.Soc,2001,123,11502-11503,此外美國專利第6,350,488號也公開了一種生長大面積 奈米碳管陣列之方法。 In the third step, referring to FIG. 7, the carbon nanotube array 10 is grown on the catalyst layer 32. The sacrificial layer 30 formed with the catalyst layer 32 is placed in a reaction furnace, and a carbon source gas is introduced at 700 to 1000 degrees Celsius to grow a carbon nanotube array 10, wherein the carbon source gas may be a gas such as acetylene or ethylene. The height of the carbon nanotube array 10 can be controlled by controlling the growth time, and the growth height is generally 1 to 30 μm. The method for growing the carbon nanotube array 10 is relatively mature. For details, see Science, 1999, 283, 512-414 and J. Am. Chem. Soc, 2001, 123, 11502-11503, and US Patent No. 6,350, 488. Disclosed a large area for growth The method of carbon nanotube arrays.

第四步,參閱圖8,形成柔性聚合物基體12。首先以浸塗、塗布、壓合或鑄造等方式將柔性聚合物前體或柔性聚合物前體之溶液施加於奈米碳管陣列10中並使柔性聚合物前體充分填充奈米碳管陣列10中奈米碳管102之間之空隙,同時使柔性聚合物前體包覆奈米碳管陣列10。該柔性聚合物前體可為聚醯亞胺(Polyimide,PI),聚乙烯對苯二甲酸乙二醇酯(Polyethylene Terephtalate,PET)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚硫胺(Polyamide)、聚甲基丙烯酸甲酯(Polymethylmethacrylate)、聚碳酸酯(Polycarbonate)、聚乙烯對苯二甲酸乙二醇酯(Polyethylene Terephtalate,PET)或聚醯亞胺-聚乙烯-對苯二甲酯共聚物(Polyamide polyethylene terephthalate copolymer)之預聚物或溶液。其次固化該柔性聚合物前體形成柔性聚合物基體12。柔性聚合物基體12形成之後,奈米碳管102之第二端104埋於柔性聚合物基體12內。固化時可採用烘烤之方法,烘烤可去除柔性聚合物前體中之溶劑並使柔性聚合物前體發生交聯反應,從而得到奈米碳管與柔性聚合物複合之柔性電路板基膜100。 In a fourth step, referring to Figure 8, a flexible polymer matrix 12 is formed. First, a solution of a flexible polymer precursor or a flexible polymer precursor is applied to the carbon nanotube array 10 by dip coating, coating, pressing or casting, and the flexible polymer precursor is sufficiently filled with a carbon nanotube array. The gap between the 10 carbon nanotubes 102 is such that the flexible polymer precursor coats the carbon nanotube array 10. The flexible polymer precursor may be Polyimide (PI), Polyethylene Terephtalate (PET), Polytetrafluoroethylene (PTFE), Polyamide (Polyamide). ), Polymethylmethacrylate, Polycarbonate, Polyethylene Terephtalate (PET) or Polyimide-Polyethylene-terephthalate copolymerization Prepolymer or solution of Polyamide polyethylene terephthalate copolymer. The flexible polymer precursor is then cured to form a flexible polymer matrix 12. After the flexible polymer matrix 12 is formed, the second end 104 of the carbon nanotube 102 is embedded within the flexible polymer matrix 12. The curing method may be a baking method, the solvent in the flexible polymer precursor is removed, and the flexible polymer precursor is cross-linked, thereby obtaining a flexible circuit board base film composited with the carbon nanotube and the flexible polymer. 100.

第五步,參閱圖9,去除犧牲層30以及觸媒層32得到柔性電路板基膜100,奈米碳管102之第一端103與柔性電路板基膜100之第一表面122齊平。去除犧牲層30及觸媒層 32可採用蝕刻法。例如當採用銅作為犧牲層時,三氧化二鐵作為觸媒層32時,可採用目前電路板中採用之濕法蝕刻來蝕刻銅,即用三氯化鐵溶液蝕刻銅與三氧化二鐵。當然採用其他之犧牲層及觸媒層時採用相應之蝕刻劑即可。 In the fifth step, referring to FIG. 9, the sacrificial layer 30 and the catalyst layer 32 are removed to obtain the flexible circuit board base film 100. The first end 103 of the carbon nanotube 102 is flush with the first surface 122 of the flexible circuit board base film 100. Removing the sacrificial layer 30 and the catalyst layer 32 can be etched. For example, when copper is used as the sacrificial layer, and ferric oxide is used as the catalyst layer 32, the wet etching used in the current circuit board can be used to etch copper, that is, copper and ferric oxide are etched with a ferric chloride solution. Of course, when using other sacrificial layers and catalyst layers, the corresponding etchant can be used.

柔性電路板基膜200之製作方法與上述方法類似,不同之處在於進一步於柔性電路板基膜100之第一表面122上施加一層柔性聚合物前體並固化,如此則可得到柔性電路板基膜200。柔性基膜200中每根奈米碳管202均嵌設於柔性基膜22內,並基本垂直於第一表面222或第二表面224。 The flexible circuit board base film 200 is fabricated in a similar manner to the above method, except that a flexible polymer precursor is further applied to the first surface 122 of the flexible circuit board base film 100 and cured, so that a flexible circuit board base can be obtained. Film 200. Each of the carbon nanotubes 202 in the flexible base film 200 is embedded in the flexible base film 22 and is substantially perpendicular to the first surface 222 or the second surface 224.

以下以實施例說明包括上述之柔性電路板基膜之柔性電路板基板。 Hereinafter, a flexible circuit board substrate including the above-described flexible circuit board base film will be described by way of embodiments.

請參閱圖10,柔性電路板基板400包括柔性電路板基膜100以及形成於柔性電路板基膜100上之導電層42。具體之,導電層42形成於柔性電路板基膜100之第二表面124。導電層42優選為銅,但其他導電率高之金屬如銀、鋁等也可。導電層42可採用電鍍或壓合之方式形成於柔性電路板基膜100上。導電層42之厚度可為1微米到50微米。 Referring to FIG. 10, the flexible circuit board substrate 400 includes a flexible circuit board base film 100 and a conductive layer 42 formed on the flexible circuit board base film 100. Specifically, the conductive layer 42 is formed on the second surface 124 of the flexible circuit board base film 100. The conductive layer 42 is preferably copper, but other metals having high conductivity such as silver, aluminum, or the like may be used. The conductive layer 42 may be formed on the flexible circuit board base film 100 by plating or press bonding. Conductive layer 42 can have a thickness from 1 micron to 50 microns.

參閱圖11,柔性電路板基板500包括柔性電路板基膜200以及分別形成於柔性電路板基膜200兩個相對表面上之導電層52。由於柔性電路板基膜200中,奈米碳管陣列20之兩端均埋於柔性聚合物基體22內,因此可於柔性電路板 基膜200之兩個表面上都形成導電層52。 Referring to FIG. 11, the flexible circuit board substrate 500 includes a flexible circuit board base film 200 and conductive layers 52 respectively formed on opposite surfaces of the flexible circuit board base film 200. Since the two ends of the carbon nanotube array 20 are buried in the flexible polymer substrate 22 in the flexible circuit board base film 200, the flexible circuit board can be used. A conductive layer 52 is formed on both surfaces of the base film 200.

參閱圖12,柔性電路板600包括柔性電路板基膜100以及形成於柔性電路板基膜100上之導電線路44。 Referring to FIG. 12, the flexible circuit board 600 includes a flexible circuit board base film 100 and conductive traces 44 formed on the flexible circuit board base film 100.

柔性電路板600可由以下方法製作: The flexible circuit board 600 can be fabricated by the following methods:

首先,提供一柔性電路板基板400。柔性電路板基板400包括柔性電路板基膜100以及形成於柔性電路板基膜100之導電層42。 First, a flexible circuit board substrate 400 is provided. The flexible circuit board substrate 400 includes a flexible circuit board base film 100 and a conductive layer 42 formed on the flexible circuit board base film 100.

其次,採用通常之蝕刻工藝蝕刻導電層42形成導電線路44,則可得到柔性電路板600。 Next, the conductive layer 44 is etched by a usual etching process to form the conductive wiring 44, and the flexible circuit board 600 can be obtained.

蝕刻工藝一般包括施加光阻、曝光、顯影、蝕刻、去膜三個步驟。施加光阻係指於導電層42上施加一層光阻劑,曝光係指利用光罩對施加於導電層42上之光阻劑進行選擇性之曝光,以使曝光部分之光阻固化或者分解;顯影係指將曝光後之柔性電路板基板400浸於顯影液中,使未固化之光阻或者分解之光阻溶解於顯影液中,從而於導電層42上形成圖案化之保護層;蝕刻係指採用蝕刻液對導電層42進行蝕刻以形成導電線路44,導電層42上未被光阻保護之地方均被蝕刻掉;去膜係指將導電線路44上之光阻去掉以露出導電線路44。 The etching process generally includes three steps of applying photoresist, exposing, developing, etching, and removing the film. Applying a photoresist means applying a layer of photoresist on the conductive layer 42. Exposure refers to selectively exposing the photoresist applied to the conductive layer 42 by a photomask to cure or decompose the photoresist of the exposed portion; The development means that the exposed flexible circuit board substrate 400 is immersed in the developing solution, and the uncured photoresist or the decomposed photoresist is dissolved in the developing solution to form a patterned protective layer on the conductive layer 42; The conductive layer 42 is etched by an etchant to form a conductive line 44, and the conductive layer 42 is not etched away from the photoresist; the film removal means that the photoresist on the conductive line 44 is removed to expose the conductive line 44. .

本實施例中得到之柔性電路板600是單層電路板,即具有一層導電線路,可理解,採用柔性電路板基板500,可通過一次蝕刻形成雙層電路板,即柔性電路板基膜兩個表面上均形成有導電線路。當然還可採用上述之柔性電路板基膜及柔性電路板基板製作多層柔性電路板。 The flexible circuit board 600 obtained in this embodiment is a single-layer circuit board, that is, has a conductive circuit. It can be understood that the flexible circuit board substrate 500 can be used to form a double-layer circuit board by one etching, that is, two flexible circuit board base films. Conductive lines are formed on the surface. Of course, the flexible circuit board base film and the flexible circuit board substrate can be used to fabricate the multilayer flexible circuit board.

首先,參閱圖13,提供兩層柔性電路板基板400及一層柔性電路板基膜200。其次,參閱圖14,將兩層柔性電路板基板400分別壓合於柔性電路板基膜200相對之兩表面,使柔性電路板基膜200之相對兩表面分別與兩層柔性電路板基板400之柔性電路板基膜100貼合。最後,參閱圖15,於兩層柔性電路板基板400之導電層42上形成導電線路701,從而得到柔性電路板700。本實施例當中採用單面形成有導電層之柔性電路板基板400形成了具有兩層線路之多層柔性電路板700。當然還可增層法形成更多層數之柔性電路板。 First, referring to FIG. 13, a two-layer flexible circuit board substrate 400 and a flexible circuit board base film 200 are provided. Next, referring to FIG. 14, the two flexible circuit board substrates 400 are respectively pressed onto the opposite surfaces of the flexible circuit board base film 200, so that the opposite surfaces of the flexible circuit board base film 200 and the two flexible circuit board substrates 400 are respectively The flexible circuit board base film 100 is attached. Finally, referring to FIG. 15, a conductive line 701 is formed on the conductive layer 42 of the two-layer flexible circuit board substrate 400, thereby obtaining a flexible circuit board 700. In the present embodiment, a flexible circuit board substrate 400 having a conductive layer formed on one side thereof is used to form a multilayer flexible circuit board 700 having two layers of wiring. Of course, it is also possible to form a layer of flexible circuit boards by layering.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100,200‧‧‧柔性電路板基膜 100,200‧‧‧Flexible circuit board base film

10,20‧‧‧奈米碳管陣列 10,20‧‧‧Nano Carbon Tube Array

102,202‧‧‧奈米碳管 102,202‧‧‧Nano carbon tube

103‧‧‧第一端 103‧‧‧ first end

104‧‧‧第二端 104‧‧‧ second end

12,22‧‧‧柔性聚合物基體 12,22‧‧‧Flexible polymer matrix

122,222‧‧‧第一表面 122, 222‧‧‧ first surface

102,224‧‧‧第二表面 102,224‧‧‧second surface

30‧‧‧犧牲層 30‧‧‧sacrificial layer

31‧‧‧觸媒薄膜 31‧‧‧ Catalyst film

32‧‧‧觸媒層 32‧‧‧catalyst layer

400,500‧‧‧柔電路板基板 400,500‧‧‧Flexible circuit board substrate

42,52‧‧‧導電層 42,52‧‧‧ Conductive layer

44‧‧‧導電線路 44‧‧‧Electrical circuit

600,700‧‧‧柔性電路板 600,700‧‧‧Flexible circuit board

圖1係本技術方案提供之柔性電路板基膜第一實施例剖面示意圖。 1 is a cross-sectional view showing a first embodiment of a flexible circuit board base film provided by the present technical solution.

圖2係本技術方案提供之柔性電路板基膜第二實施例剖面示意圖。 2 is a cross-sectional view showing a second embodiment of a flexible circuit board base film provided by the present technical solution.

圖3係本技術方案提供之柔性電路板基膜第一實施例製作方法流程圖。 3 is a flow chart of a method for fabricating a first embodiment of a flexible circuit board base film provided by the present technical solution.

圖4-9係本技術方案提供之柔性電路板基膜第一實施例製作方法示意圖。 4-9 is a schematic view showing a manufacturing method of a first embodiment of a flexible circuit board base film provided by the technical solution.

圖10係本技術方案提供之柔性電路板基板第一實施例剖面示意圖。 FIG. 10 is a cross-sectional view showing a first embodiment of a flexible circuit board substrate provided by the present technical solution.

圖11係本技術方案提供之柔性電路板基板第二實施例剖面示意圖。 11 is a cross-sectional view showing a second embodiment of a flexible circuit board substrate provided by the present technical solution.

圖12係本技術方案提供之柔性電路板第一實施例剖面示意圖。 12 is a cross-sectional view showing a first embodiment of a flexible circuit board provided by the present technical solution.

圖13-15係本技術方案提供之柔性電路板第二實施例製作方法示意圖。 13-15 are schematic diagrams showing a manufacturing method of a second embodiment of a flexible circuit board provided by the technical solution.

100‧‧‧柔性電路板基膜 100‧‧‧Flexible circuit board base film

10‧‧‧奈米碳管陣列 10‧‧‧Nano Carbon Tube Array

102‧‧‧奈米碳管 102‧‧‧Nano Carbon Tube

103‧‧‧第一端 103‧‧‧ first end

104‧‧‧第二端 104‧‧‧ second end

12‧‧‧柔性聚合物基體 12‧‧‧Flexible polymer matrix

122‧‧‧第一表面 122‧‧‧ first surface

102‧‧‧第二表面 102‧‧‧ second surface

Claims (20)

一種柔性電路板基膜,其包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端埋於該柔性聚合物基體內。 A flexible circuit board base film comprising a flexible polymer substrate and a plurality of carbon nanotubes embedded in the flexible polymer matrix, the carbon nanotubes comprising a first end and a second end, the first end being buried in the Flexible polymer matrix. 如申請專利範圍第1項所述之柔性電路板基膜,其中,該複數奈米碳管形成一奈米碳管陣列。 The flexible circuit board base film of claim 1, wherein the plurality of carbon nanotubes form an array of carbon nanotubes. 如申請專利範圍第2項所述之柔性電路板基膜,其中,該柔性聚合物基體包括第一表面及與第一表面相對之第二表面,該複數奈米碳管與該第一表面或第二表面基本垂直。 The flexible circuit board base film of claim 2, wherein the flexible polymer substrate comprises a first surface and a second surface opposite to the first surface, the plurality of carbon nanotubes and the first surface or The second surface is substantially vertical. 如申請專利範圍第3項所述之柔性電路板基膜,其中,該第二端與該第一表面齊平或該第二端亦埋於該柔性聚合物基體內。 The flexible circuit board base film of claim 3, wherein the second end is flush with the first surface or the second end is also buried in the flexible polymer matrix. 如申請專利範圍第3項所述之柔性電路板基膜,其中,該奈米碳管長度小於該第一表面與第二表面之間之距離。 The flexible circuit board base film of claim 3, wherein the carbon nanotube length is less than a distance between the first surface and the second surface. 如申請專利範圍第1項所述之柔性電路板基膜,其中,該奈米碳管長度為1微米到30微米。 The flexible circuit board base film of claim 1, wherein the carbon nanotube has a length of from 1 micrometer to 30 micrometers. 如申請專利範圍第1項所述之柔性電路板基膜,其中,該柔性電路板基體為聚醯亞胺、聚乙烯對苯二甲酸乙二醇酯、聚四氟乙烯、聚硫胺、聚甲基丙烯酸甲酯、聚碳酸酯、聚乙烯對苯二甲酸乙二醇酯或聚醯亞胺-聚乙烯-對苯二甲酯共聚物。 The flexible circuit board base film according to claim 1, wherein the flexible circuit board substrate is polyimide, polyethylene terephthalate, polytetrafluoroethylene, polythioamide, poly Methyl methacrylate, polycarbonate, polyethylene terephthalate or polyamidene-polyethylene-p-xylylene ester copolymer. 一種柔性電路板基板,其包括一柔性電路板基膜及至少一層形成於該柔性電路板基膜上之導電層,該柔性電路板基膜包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端 埋於該柔性聚合物基體內。 A flexible circuit board substrate comprising a flexible circuit board base film and at least one conductive layer formed on the base film of the flexible circuit board, the flexible circuit board base film comprising a flexible polymer substrate and embedded in the flexible polymer matrix a plurality of carbon nanotubes, the carbon nanotube comprising a first end and a second end, the first end Buried in the flexible polymer matrix. 如申請專利範圍第8項所述之柔性電路板基板,其中,該複數奈米碳管形成一奈米碳管陣列。 The flexible circuit board substrate of claim 8, wherein the plurality of carbon nanotubes form an array of carbon nanotubes. 如申請專利範圍第9項所述之柔性電路板基板,其中,該柔性聚合物基體包括第一表面及與第一表面相對之第二表面,該複數奈米碳管與該第一表面或第二表面基本垂直。 The flexible circuit board substrate of claim 9, wherein the flexible polymer substrate comprises a first surface and a second surface opposite to the first surface, the plurality of carbon nanotubes and the first surface or The two surfaces are substantially vertical. 如申請專利範圍第10項所述之柔性電路板基板,其中,該第二端與該第一表面齊平或該第二端亦埋於該柔性聚合物基體內。 The flexible circuit board substrate of claim 10, wherein the second end is flush with the first surface or the second end is also buried in the flexible polymer matrix. 如申請專利範圍第10項所述之柔性電路板基板,其中,該奈米碳管長度小於該第一表面與第二表面之間之距離。 The flexible circuit board substrate of claim 10, wherein the carbon nanotube length is less than a distance between the first surface and the second surface. 如申請專利範圍第8項所述之柔性電路板基板,其中,該奈米碳管長度為1微米到30微米。 The flexible circuit board substrate of claim 8, wherein the carbon nanotube has a length of from 1 micrometer to 30 micrometers. 一種柔性電路板,其包括柔性電路板基膜以及至少一層形成於該柔性電路板基膜上之導電線路,該柔性電路板基膜包括柔性聚合物基體及埋設於該柔性聚合物基體內之複數奈米碳管,該奈米碳管包括第一端與第二端,該第一端埋於該柔性聚合物基體內。 A flexible circuit board comprising a flexible circuit board base film and at least one conductive circuit formed on the base film of the flexible circuit board, the flexible circuit board base film comprising a flexible polymer substrate and a plurality of embedded in the flexible polymer matrix The carbon nanotube includes a first end and a second end, the first end being buried in the flexible polymer matrix. 如申請專利範圍第14項所述之柔性電路板,其中,該複數奈米碳管形成一奈米碳管陣列。 The flexible circuit board of claim 14, wherein the plurality of carbon nanotubes form an array of carbon nanotubes. 如申請專利範圍第15項所述之柔性電路板,其中,該柔性聚合物基體包括第一表面及與第一表面相對之第二表面,該複數奈米碳管與該第一表面或第二表面基本垂直。 The flexible circuit board of claim 15, wherein the flexible polymer substrate comprises a first surface and a second surface opposite to the first surface, the plurality of carbon nanotubes and the first surface or the second The surface is basically vertical. 如申請專利範圍第16項所述之柔性電路板,其中,該第二端與該第一表面齊平或該第二端亦埋於該柔性聚合物基體內。 The flexible circuit board of claim 16, wherein the second end is flush with the first surface or the second end is also buried in the flexible polymer matrix. 如申請專利範圍第16項所述之柔性電路板,其中,該奈米碳管長度小於該第一表面與第二表面之間之距離。 The flexible circuit board of claim 16, wherein the carbon nanotube length is less than a distance between the first surface and the second surface. 如申請專利範圍第14項所述之柔性電路板,其中,該奈米碳管長度為1微米到30微米。 The flexible circuit board of claim 14, wherein the carbon nanotube has a length of from 1 micrometer to 30 micrometers. 如申請專利範圍第14項所述之柔性電路板,其中,該柔性電路板基體為聚醯亞胺、聚乙烯對苯二甲酸乙二醇酯、聚四氟乙烯、聚硫胺、聚甲基丙烯酸甲酯、聚碳酸酯、聚乙烯對苯二甲酸乙二醇酯或聚醯亞胺-聚乙烯-對苯二甲酯共聚物。 The flexible circuit board of claim 14, wherein the flexible circuit board substrate is polyimide, polyethylene terephthalate, polytetrafluoroethylene, polysulfide, polymethyl Methyl acrylate, polycarbonate, polyethylene terephthalate or polyamidene-polyethylene-p-xylylene ester copolymer.
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