TWI385880B - Connector of connecting photonic sensor and substrate and method for fabricating photonic sensor - Google Patents
Connector of connecting photonic sensor and substrate and method for fabricating photonic sensor Download PDFInfo
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Description
本發明係有關於一種連接器,更明確地說,係有關於一種連接光感測器與基板之連接器。The present invention relates to a connector, and more particularly to a connector for connecting a photosensor to a substrate.
光學式觸控系統包含一顯示幕、一透明基板、一光感測器,以及一位置計算電路。一般而言,透明基板係為一玻璃基板,更明確地說,透明基板係為一銦錫氧化物(Tin-doped Indium Oxide,ITO)玻璃。顯示幕透過透明基板以顯示影像。光感測器係為一晶片模組(chip module),光感測器需設置於透明基板之上,且光感測器之收光方向必須平行於該透明基板。如此,光感測器才可偵測該透明基板上是否有指示物(如手指、觸控筆),並據以產生光感測訊號。舉例而言,光感測訊號可為一範圍涵蓋指示物之感測影像,或是指示物相對於光感測器之距離與角度。此外,光感測器具有一傳輸埠,用來傳送光感測訊號給位置計算電路。如此,位置計算電路可根據光感測訊號以計算出指示物於顯示幕之上之位置。The optical touch system includes a display screen, a transparent substrate, a light sensor, and a position calculation circuit. In general, the transparent substrate is a glass substrate, and more specifically, the transparent substrate is a Tin-doped Indium Oxide (ITO) glass. The display screen is displayed through a transparent substrate. The photo sensor is a chip module, and the photo sensor needs to be disposed on the transparent substrate, and the light receiving direction of the photo sensor must be parallel to the transparent substrate. In this way, the photo sensor can detect whether there is an indicator (such as a finger or a stylus) on the transparent substrate, and accordingly generate a light sensing signal. For example, the light sensing signal can be a range of sensing images covering the indicator or the distance and angle of the indicator relative to the light sensor. In addition, the photo sensor has a transmission port for transmitting the photo sensing signal to the position calculation circuit. In this way, the position calculation circuit can calculate the position of the indicator above the display screen based on the light sensing signal.
在先前技術中,當使用者欲設置一晶片模組於玻璃基板上時,使用者大部份會以捲帶式晶片載體封裝(Tape Carrier Package,TCP)或晶粒軟模接合(Chip on Film,COF)的封裝方式,將該晶片模組先設置於一軟板(Flex Printed Circuit,FPC)上,接著再將該軟板耦接(或壓焊)至玻璃基板。然而,當使用者利用上述之方式以將光感測器設置於玻璃基板上時,光感測器之收光方向會受到限制。更明確地說,若以上述之封裝方式(TCP或COF)將光感測器封裝於軟板上時,則光感測器之收光方向會垂直於該軟板(如第1圖所示)。當該軟板耦接至玻璃基板上時,光感測器之收光方向會垂直於玻璃基板。換句話說,在光學觸控系統中,若使用者欲利用既有之封裝方式(如TCP或COF)將光感測器設置於玻璃基板上,則光感測器之收光方向垂直於玻璃基板,而造成光感測器無法偵測到指示物(如手指、觸控筆)接觸到該顯示器。雖然在先前技術中,使用者可將軟板凹折一角度並再將軟板固定,以轉置光感測器之收光方向,然而該製程僅能以人工方式處理,且該製程既耗時且良率不易控制,因此會造成光學式觸控系統之成本上升,帶給使用者很大的不便。In the prior art, when a user wants to install a wafer module on a glass substrate, most of the user will be taped with a Tape Carrier Package (TCP) or a die bonded die (Chip on Film). , COF), the chip module is first placed on a Flex Printed Circuit (FPC), and then the flexible board is coupled (or pressure bonded) to the glass substrate. However, when the user uses the above method to dispose the photo sensor on the glass substrate, the light receiving direction of the photo sensor is limited. More specifically, if the photo sensor is packaged on a flexible board in the above-described package mode (TCP or COF), the light receiving direction of the photo sensor will be perpendicular to the soft board (as shown in FIG. 1). ). When the flexible board is coupled to the glass substrate, the light receiving direction of the light sensor is perpendicular to the glass substrate. In other words, in an optical touch system, if the user wants to set the photo sensor on the glass substrate by using an existing packaging method (such as TCP or COF), the light receiving direction of the photo sensor is perpendicular to the glass. The substrate causes the light sensor to detect that an indicator (such as a finger or a stylus) is in contact with the display. Although in the prior art, the user can fold the flexible board by an angle and fix the soft board to turn the light receiving direction of the light sensor, the process can only be processed manually, and the process consumes When the yield is not easy to control, the cost of the optical touch system is increased, which brings great inconvenience to the user.
本發明提供一種連接一光感測器與一基板之連接器。該連接器用來使該光感測器之一收光方向與該基板平行。該基板係為銦錫氧化物(Tin-doped Indium Oxide,ITO)玻璃。該光感測器用來收光以產生一光感測訊號。該光感測器具有一傳輸埠,用來傳送該光感測訊號。該光感測器應用於一光學式觸控系統。該光學式觸控系統具有一顯示幕,以及一位置計算電路。該顯示幕透過該基板以顯示影像。該位置計算電路根據該光感測模組所產生之一光感測訊號,以計算出一指示物於該顯示幕之上之一位置。該連接器包含一本體,以及一連接埠。該本體用來容納該光感測器,且轉置該光感測器以使該光感測器之該收光方向與該基板平行。該連接埠收容於該本體內。該連接埠耦接至該光感測器之該傳輸埠,以使該光感測器可透過該傳輸埠與該連接埠耦接至該基板。The invention provides a connector for connecting a photo sensor and a substrate. The connector is configured to make a light receiving direction of one of the light sensors parallel to the substrate. The substrate is Tin-doped Indium Oxide (ITO) glass. The light sensor is used to receive light to generate a light sensing signal. The light sensor has a transmission port for transmitting the light sensing signal. The light sensor is applied to an optical touch system. The optical touch system has a display screen and a position calculation circuit. The display screen passes through the substrate to display an image. The position calculation circuit calculates a position of the indicator on the display screen according to a light sensing signal generated by the light sensing module. The connector includes a body and a port. The body is configured to receive the photo sensor, and the photo sensor is transposed such that the light receiving direction of the photo sensor is parallel to the substrate. The port is contained in the body. The port is coupled to the transmission port of the photo sensor such that the photo sensor is coupled to the substrate via the port and the port.
本發明另提供一種光學式觸控系統。該光學式觸控系統包含一基板、一顯示幕、一光感測模組,以及一位置計算電路。該基板係為一銦錫氧化物(Tin-doped Indium Oxide,ITO)玻璃。該顯示幕用來透過該基板以顯示影像。該光感測模組用來收光以偵測一指示物,並據以產生一光感測訊號。該光感測模組包含一光感測器,以及一連接器。該光感測器用來收光以產生該光感測訊號。該光感測器具有一傳輸埠,用來傳送該光感測訊號。該連接器包含一本體、一連接埠,以及一軟板。該本體用來容納該光感測器,且轉置該光感測器以使該光感測器之一收光方向與該基板平行。該連接埠收容於該本體內,耦接至該光感測器之該傳輸埠。該軟板具有一軟板連接埠,用來將該連接器之該連接埠耦接至該基板。該位置計算電路用來根據該光感測訊號,以計算出該指示物於該顯示幕之上之一位置。The invention further provides an optical touch system. The optical touch system includes a substrate, a display screen, a light sensing module, and a position calculation circuit. The substrate is a Tin-doped Indium Oxide (ITO) glass. The display is used to display images through the substrate. The light sensing module is configured to receive light to detect an indicator and generate a light sensing signal accordingly. The light sensing module includes a light sensor and a connector. The light sensor is configured to receive light to generate the light sensing signal. The light sensor has a transmission port for transmitting the light sensing signal. The connector includes a body, a connector, and a flexible board. The body is configured to receive the photo sensor, and the photo sensor is transposed such that a light receiving direction of the photo sensor is parallel to the substrate. The port is received in the body and coupled to the transmission port of the photo sensor. The flexible board has a flexible board connector for coupling the connector of the connector to the substrate. The position calculation circuit is configured to calculate a position of the indicator on the display screen according to the light sensing signal.
本發明另提供一種光感測器之製作方法。該光感測器具有一感測單元,以及一鏡頭。該感測單元用來收光以產生一光感測訊號。該感測單元具有一傳輸端,用來傳送該光感測訊號。該鏡頭用來將光匯聚於該感測單元。該光感測器應用於一光學式觸控系統。該光學式觸控系統具有一基板、一顯示幕,以及一位置計算電路。該基板係為銦錫氧化物(Tin-doped Indium Oxide,ITO)玻璃。該顯示幕透過該基板以顯示影像。該位置計算電路根據該光感測訊號,以計算出一指示物於該顯示幕之上之一位置。該光感測器可置入一連接器。該連接器可轉置該光感測器之一收光方向,以使該光感測器之該收光方向平行於該基板且可使光感測器避免高溫製程。該製作方法包含於該感測單元與一承載元件之間填入一底部充填膠以固定該感測單元於該承載元件、黏貼該鏡頭於該感測單元之上,以及在該感測單元與該鏡頭之周圍填入一固定元件以封裝該感測單元與該鏡頭。The invention further provides a method for fabricating a photo sensor. The light sensor has a sensing unit and a lens. The sensing unit is configured to receive light to generate a light sensing signal. The sensing unit has a transmitting end for transmitting the light sensing signal. The lens is used to concentrate light on the sensing unit. The light sensor is applied to an optical touch system. The optical touch system has a substrate, a display screen, and a position calculation circuit. The substrate is Tin-doped Indium Oxide (ITO) glass. The display screen passes through the substrate to display an image. The position calculation circuit calculates a position of an indicator above the display screen based on the light sensing signal. The light sensor can be placed in a connector. The connector can transpose a light receiving direction of the light sensor such that the light receiving direction of the light sensor is parallel to the substrate and the light sensor can avoid the high temperature process. The manufacturing method comprises: filling a bottom filling glue between the sensing unit and a bearing component to fix the sensing unit to the bearing component, pasting the lens on the sensing unit, and in the sensing unit A fixing element is filled around the lens to encapsulate the sensing unit and the lens.
有鑑於此,本發明提供一種可連接光感測器與基板之連接器。本發明所提供之連接器可轉置光感測器,以使光感測器之收光方向與基板平行。如此一來,利用本發明所提供之連接器,即可將光感測器設置於基板上,且可維持光感測器之收光方向平行於基板。In view of this, the present invention provides a connector that can connect a photo sensor to a substrate. The connector provided by the present invention can transpose the photo sensor such that the light receiving direction of the photo sensor is parallel to the substrate. In this way, by using the connector provided by the present invention, the photo sensor can be disposed on the substrate, and the light receiving direction of the photo sensor can be maintained parallel to the substrate.
請參考第2圖。第2圖係為說明根據本發明之第一實施例之連接器200之示意圖。在第2圖中,連接器200設置於基板202上。其中基板202係為一透明基板(如玻璃基板或ITO玻璃)連接器200包含一本體210、一連接埠220、一上蓋230、一收光口240。在本體210內具有足夠的空間用來容納一光感測器201,且轉置光感測器201以使光感測器201之收光方向與基板202平行。連接埠220收容於本體210內。連接埠220用來耦接至光感測器201之傳輸埠,以使光感測器201可透過該傳輸埠與連接埠220耦接至基板202。如第2圖所示,連接埠220可以複數個L型金手指221實施(如第3圖與第4圖所示)。每個金手指221包含區段L1 與L2 。其中區段L1 係用來耦接至光感測器201之傳輸埠,且區段L1 係垂直於基板202。區段L2 係用來耦接至基板202,且區段L2 係平行於基板202。上蓋230於光感測器201置入本體210內後可關上,以避免光感測器201脫落與避免光感測器201直接受到壓迫。收光口240用來提供給光感測器201收光。如此一來,將本發明之連接器200耦接至基板202,再將光感測器201置入本體210內,即可使光感測器201之收方向與基板202平行,且光感測器201可透過其傳輸埠與連接器200之連接埠220以傳送光感測訊號SLS 。Please refer to Figure 2. Fig. 2 is a schematic view showing the connector 200 according to the first embodiment of the present invention. In FIG. 2, the connector 200 is disposed on the substrate 202. The substrate 202 is a transparent substrate (such as a glass substrate or an ITO glass). The connector 200 includes a body 210, a connecting port 220, an upper cover 230, and a light receiving port 240. There is sufficient space in the body 210 for accommodating a photo sensor 201, and the photo sensor 201 is transposed to make the light receiving direction of the photo sensor 201 parallel to the substrate 202. The port 220 is received in the body 210. The port 220 is coupled to the transmission port of the photo sensor 201 so that the photo sensor 201 can be coupled to the substrate 202 through the port and the port 202. As shown in Fig. 2, the port 220 can be implemented by a plurality of L-shaped gold fingers 221 (as shown in Figs. 3 and 4). Each gold finger 221 includes sections L 1 and L 2 . The segment L 1 is used to couple to the transmission port of the photo sensor 201 , and the segment L 1 is perpendicular to the substrate 202 . Section L 2 is used to couple to substrate 202 and section L 2 is parallel to substrate 202. The upper cover 230 can be closed after the photo sensor 201 is placed in the body 210 to prevent the photo sensor 201 from falling off and to prevent the photo sensor 201 from being directly pressed. The light collection port 240 is used to provide light to the photo sensor 201. In this way, the connector 200 of the present invention is coupled to the substrate 202, and the photo sensor 201 is placed in the body 210, so that the receiving direction of the photo sensor 201 is parallel to the substrate 202, and the light is sensed. The device 201 can transmit the optical sensing signal S LS through the connection port 220 of the connector 200 to the connector 200.
請參考第5圖。第5圖係為說明根據本發明之第二實施例之連接器500之示意圖。連接器500、光感測器501及基板502之結構以及工作原理分別與連接器200、光感測器201及基板202類似。相較於連接器200,連接器500另包含一軟板550。軟板550具有一軟板連接埠551。軟板550之軟板連接埠551耦接於連接器300之連接埠520與基板502之間。由於在目前的平面顯示器的製程中,顯示器之驅動電路皆是以透過軟板耦接至玻璃基板,因此藉由軟板550,連接器500係可利用一般既有之平面顯示器之生產設備,以耦接至基板502。Please refer to Figure 5. Fig. 5 is a schematic view showing a connector 500 according to a second embodiment of the present invention. The structure and working principle of the connector 500, the photo sensor 501, and the substrate 502 are similar to those of the connector 200, the photo sensor 201, and the substrate 202, respectively. The connector 500 further includes a flexible board 550 as compared to the connector 200. The flexible board 550 has a flexible board connection 551. The soft board connection 551 of the flexible board 550 is coupled between the connection port 520 of the connector 300 and the substrate 502. In the current process of the flat panel display, the driving circuit of the display is coupled to the glass substrate through the flexible board. Therefore, the connector 500 can utilize the production equipment of the general flat display by the soft board 550. It is coupled to the substrate 502.
請參考第6圖。第6圖係為說明根據本發明之第一實施例之光感測模組600之示意圖。光感測模組600包含一光感測器610以及連接器620。其中光感測器610係設置於連接器620內。光感測器610及連接器620之結構及工作原理分別與光感測器201及連接器200類似,故不再贅述。當光感測模組600耦接於基板601時,光感測模組600之收光方向係平行於基板601。因此若光感測模組600設置於一光學式觸控系統之一基板之上,光感測模組600可偵測該基板之上之指示物,並據以產生光感測訊號SLS 。Please refer to Figure 6. Figure 6 is a schematic diagram showing a light sensing module 600 in accordance with a first embodiment of the present invention. The light sensing module 600 includes a light sensor 610 and a connector 620. The photo sensor 610 is disposed in the connector 620. The structure and working principle of the photo sensor 610 and the connector 620 are similar to those of the photo sensor 201 and the connector 200, respectively, and therefore will not be described again. When the light sensing module 600 is coupled to the substrate 601 , the light receiving direction of the light sensing module 600 is parallel to the substrate 601 . Therefore, if the light sensing module 600 is disposed on a substrate of an optical touch system, the light sensing module 600 can detect the indicator on the substrate and generate the light sensing signal S LS .
請參考第7圖。第7圖係為說明根據本發明之第二實施例之光感測模組700之示意圖。光感測模組700包含一光感測器710以及連接器720。其中光感測器710係設置於連接器720內。光感測器710及連接器720之結構及工作原理與光感測器501及連接器500類似,故不再贅述。同理,當光感測模組700耦接於基板701時,光感測模組700之收光方向係平行於基板701。因此若光感測模組700設置於一光學式觸控系統之一基板之上,光感測模組700可偵測該基板之上之指示物,並據以產生光感測訊號SLS 。Please refer to Figure 7. Figure 7 is a schematic diagram showing a light sensing module 700 in accordance with a second embodiment of the present invention. The light sensing module 700 includes a light sensor 710 and a connector 720. The photo sensor 710 is disposed in the connector 720. The structure and working principle of the photo sensor 710 and the connector 720 are similar to those of the photo sensor 501 and the connector 500, and therefore will not be described again. Similarly, when the light sensing module 700 is coupled to the substrate 701 , the light receiving direction of the light sensing module 700 is parallel to the substrate 701 . Therefore, if the light sensing module 700 is disposed on a substrate of an optical touch system, the light sensing module 700 can detect the indicator on the substrate and generate the light sensing signal S LS .
請參考第8圖。第8圖係為說明本發明之光學式觸控系統800之示意圖。光學式觸控系統800包含一基板810、一顯示幕820、一光感測模組830,以及一位置計算電路840。一般而言,基板810係為一透明基板,更明確地說,基板810係為一玻璃基板或ITO玻璃。顯示幕820透過基板810以顯示影像。光感測模組830係可以光感測模組600或700實施。光感測模組830設置於基板810之上,且光感測模組830之收光方向平行於基板810。光感測模組830收光以偵測於基板810之上之指示物O1 (如手指),並據以產生光感測訊號SLS 。如此,位置計算電路840根據光感測訊號SLS ,可計算出指示物O1 於顯示幕820之上之位置,而實現觸控之功能。Please refer to Figure 8. Figure 8 is a schematic illustration of an optical touch system 800 of the present invention. The optical touch system 800 includes a substrate 810, a display screen 820, a light sensing module 830, and a position calculation circuit 840. In general, the substrate 810 is a transparent substrate, and more specifically, the substrate 810 is a glass substrate or ITO glass. The display screen 820 is transmitted through the substrate 810 to display an image. The light sensing module 830 can be implemented by the light sensing module 600 or 700. The light sensing module 830 is disposed on the substrate 810 , and the light receiving direction of the light sensing module 830 is parallel to the substrate 810 . The light sensing module 830 receives light to detect the indicator O 1 (such as a finger) on the substrate 810, and accordingly generates the light sensing signal S LS . In this way, the position calculation circuit 840 can calculate the position of the pointer O 1 above the display screen 820 according to the light sensing signal S LS , and realize the function of the touch.
此外,值得注意的是,在先前技術中,光感測器係直接以TCP或COP之封裝方式設置於軟板上,因此光感測器需通過高溫製程,舉例而言,如回流焊接(reflow)。由於光感測器之鏡頭(LENS)不耐熱,因此光感測器之鏡頭需在光感測器通過高溫製程之後,才可組裝至光感測器。如此會造成額外的成本。然而,利用本發明之連接器,光感測器即可不需通過高溫製程,而可直接置入於連接器中。因此在製造光感測器時,可將光感測器之其他元件以及光感測器之鏡頭同時封裝成一晶片模組,如此可減少成本。以下將對上述之光感測器之製作方法作更進一步地說明。In addition, it is worth noting that in the prior art, the photo sensor is directly disposed on the flexible board in a TCP or COP package, so the photo sensor needs to pass a high temperature process, for example, such as reflow soldering (reflow) ). Since the lens of the light sensor (LENS) is not heat-resistant, the lens of the light sensor needs to be assembled to the light sensor after the light sensor passes the high temperature process. This will incur additional costs. However, with the connector of the present invention, the photosensor can be placed directly into the connector without going through a high temperature process. Therefore, when manufacturing the photo sensor, the other components of the photo sensor and the lens of the photo sensor can be simultaneously packaged into one wafer module, thereby reducing the cost. The method of fabricating the photosensor described above will be further described below.
請參考第9圖與第10圖。第9圖與第10圖係為說明本發明之光感測器900之製作方法之示意圖。光感測器900包含一感測單元910、一鏡頭920,以及一遮光元件930。感測單元910用來收光以產生光感測訊號SLS ,感測單元910具有傳輸端,用來作為光感測器900之傳輸埠。感測單元910通常為一晶片級封裝(Chip Scale Package,CSP)之晶片。鏡頭920用來將光匯聚於感測單元910。遮光元件930用來遮蔽非垂直入射光感測器900之表面之光線,以使光感測器900之收光方向幾乎都來自於垂直於鏡頭920與感測單元910之表面之方向,而較不會受到其他方向之光線之干擾。此外,若光感測器900之感測單元910主要為接收紅外光以產生光感測訊號SLS 時,則遮光元件930可遮蔽紅外光。Please refer to Figure 9 and Figure 10. 9 and 10 are schematic views illustrating a method of fabricating the photo sensor 900 of the present invention. The photo sensor 900 includes a sensing unit 910, a lens 920, and a shading element 930. The sensing unit 910 is configured to receive light to generate a light sensing signal S LS , and the sensing unit 910 has a transmitting end for use as a transmission port of the light sensor 900 . The sensing unit 910 is typically a chip of a Chip Scale Package (CSP). The lens 920 is used to converge light to the sensing unit 910. The light shielding member 930 is configured to shield the light of the surface of the non-normally incident light sensor 900 so that the light receiving direction of the light sensor 900 is almost from the direction perpendicular to the surface of the lens 920 and the sensing unit 910. It will not be disturbed by light from other directions. In addition, if the sensing unit 910 of the photo sensor 900 is mainly for receiving infrared light to generate the photo sensing signal S LS , the shading element 930 can block the infrared light.
在第9圖中所示之光感測器900之製作方法為:(1)將感測單元910之傳輸端以表面黏著技術(Surface Mount Technology,SMT)耦接於承載元件901上,(2)於感測單元910與承載元件901之間填入底部充填膠(underfill)以固定該感測單元於承載元件901,(3)以黏貼之方式將鏡頭920設置於感測單元910之上,(4)在感測單元910與鏡頭920之周圍填入固定元件902以封裝感測單元910與鏡頭920,(5)設置遮光元件930於鏡頭920之周圍,以遮蔽非垂直入射光感測器900之表面之光線。The photo sensor 900 shown in FIG. 9 is: (1) the transmission end of the sensing unit 910 is coupled to the carrier element 901 by a surface mount technology (SMT), (2) A bottom filling is filled between the sensing unit 910 and the carrying member 901 to fix the sensing unit to the carrying member 901, and (3) the lens 920 is disposed on the sensing unit 910 in an adhesive manner. (4) The fixing unit 902 is filled around the sensing unit 910 and the lens 920 to encapsulate the sensing unit 910 and the lens 920, and (5) the light shielding element 930 is disposed around the lens 920 to shield the non-normally incident light sensor. The light of the surface of 900.
在第10圖所示之光感測器900之製作方法為:(1)於感測單元910與承載元件901之間填入底部充填膠以固定該感測單元於承載元件901,(2)以黏貼之方式將鏡頭920設置於感測單元910之上,(3)利用金屬線連結之方式將感測單元910之傳輸端耦接至承載元件901,(4)在感測單元910與鏡頭920之周圍填入固定元件902以封裝感測單元910與鏡頭920,(5)設置遮光元件930於鏡頭920之周圍,以遮蔽非垂直入射光感測器900之表面之光線。The photo sensor 900 shown in FIG. 10 is manufactured by: (1) filling a bottom filling filler between the sensing unit 910 and the carrier member 901 to fix the sensing unit to the carrier member 901, (2) The lens 920 is disposed on the sensing unit 910 in a pasting manner, (3) the transmission end of the sensing unit 910 is coupled to the carrier element 901 by means of a metal wire connection, and (4) the sensing unit 910 and the lens are The fixing member 902 is filled around the 920 to encapsulate the sensing unit 910 and the lens 920, and (5) the light shielding member 930 is disposed around the lens 920 to shield the light of the surface of the non-normally incident light sensor 900.
綜上所述,本發明所提供之連接器,可連接光感測器與基板,來轉置光感測器,以使光感測器之收光方向與基板平行。如此一來,利用本發明所提供之連接器,即可將光感測器設置於基板上,且同時使光感測器之收光方向平行於基板。利用本發明之連接器,本發明另提供一種光感測模組,當本發明之光感測模組耦接於一基板時,本發明之光感測模組之收光方向平行於該基板。本發明另提供一種光學式觸控系統,在本發明之光學式觸控系統中,光感測模組之收光方向係平行於基板。此外,利用本發明之連接器,本發明另提供光感測器之製作方法,可將光感測器之鏡頭與感測單元同時封裝成一晶片模組,如此可減少成本,帶給使用者更大的方便。In summary, the connector provided by the present invention can connect the photo sensor and the substrate to transpose the photo sensor such that the light receiving direction of the photo sensor is parallel to the substrate. In this way, by using the connector provided by the present invention, the photo sensor can be disposed on the substrate while the light receiving direction of the photo sensor is parallel to the substrate. The present invention further provides a light sensing module. When the light sensing module of the present invention is coupled to a substrate, the light sensing direction of the light sensing module of the present invention is parallel to the substrate. . The invention further provides an optical touch control system. In the optical touch control system of the present invention, the light receiving direction of the light sensing module is parallel to the substrate. In addition, with the connector of the present invention, the present invention further provides a method for manufacturing a photo sensor, which can simultaneously package the lens and the sensing unit of the photo sensor into a wafer module, thereby reducing the cost and bringing the user more Great convenience.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
200、500、620、720‧‧‧連接器200, 500, 620, 720‧‧‧ connectors
201、501、610、710‧‧‧光感測器201, 501, 610, 710‧‧‧ optical sensors
202、502、601、701、810‧‧‧基板202, 502, 601, 701, 810‧‧‧ substrates
210、510‧‧‧本體210, 510‧‧‧ ontology
220、520‧‧‧連接埠220, 520‧‧‧ Connections
221‧‧‧金手指221‧‧‧ Gold Finger
230、530‧‧‧上蓋230, 530‧‧ ‧ upper cover
240、540‧‧‧收光口240, 540‧‧‧ light port
550‧‧‧軟板550‧‧‧soft board
551‧‧‧軟板連接埠551‧‧‧Soft board connection埠
600、700、830‧‧‧光感測模組600, 700, 830‧‧‧Light sensing module
800‧‧‧光學式觸控系統800‧‧‧Optical touch system
820‧‧‧顯示幕820‧‧‧ display screen
840‧‧‧位置計算電路840‧‧‧Location calculation circuit
O1 ‧‧‧指示物O 1 ‧‧‧ Indicators
901‧‧‧承載元件901‧‧‧Loading components
902‧‧‧固定元件902‧‧‧Fixed components
910‧‧‧感測單元910‧‧‧Sensor unit
920‧‧‧鏡頭920‧‧‧ lens
930‧‧‧遮光元件930‧‧‧ shading elements
第1圖係為說明先前技術之光學式觸控系統中光感測器之收光方向垂直於玻璃基板之示意圖。1 is a schematic view illustrating that a light receiving direction of a photo sensor in a prior art optical touch system is perpendicular to a glass substrate.
第2圖係為說明根據本發明之第一實施例之連接器之示意圖。Fig. 2 is a schematic view showing a connector according to a first embodiment of the present invention.
第3圖與第4圖係為說明本發明之連接器之連接埠之示意圖。3 and 4 are schematic views showing the connection of the connector of the present invention.
第5圖係為說明根據本發明之第二實施例之連接器之示意圖。Figure 5 is a schematic view showing a connector according to a second embodiment of the present invention.
第6圖係為說明根據本發明之第三實施例之光感測模組之示意圖。Figure 6 is a schematic view showing a light sensing module according to a third embodiment of the present invention.
第7圖係為說明根據本發明之第四實施例之光感測模組之示意圖。Figure 7 is a schematic view showing a light sensing module according to a fourth embodiment of the present invention.
第8圖係為說明本發明之光學式觸控系統之示意圖。Figure 8 is a schematic view showing the optical touch system of the present invention.
第9圖與第10圖係為說明本發明之光感測器之製作方法之示意圖。9 and 10 are schematic views for explaining a method of fabricating the photosensor of the present invention.
200...連接器200. . . Connector
201...光感測器201. . . Light sensor
202...基板202. . . Substrate
210...本體210. . . Ontology
220...連接埠220. . . Connection
230...上蓋230. . . Upper cover
240...收光口240. . . Light collection port
Claims (20)
Priority Applications (3)
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US12/717,927 US8913034B2 (en) | 2009-05-25 | 2010-03-04 | Connector of connecting light sensor and substrate and method of fabricating light sensor |
JP2010066114A JP2010272844A (en) | 2009-05-25 | 2010-03-23 | Connector for connecting light sensor to substrate, and method of fabricating light sensor |
US14/534,187 US9202942B2 (en) | 2009-05-25 | 2014-11-06 | Connector of connecting light sensor and substrate and method of fabricating light sensor |
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US18089009P | 2009-05-25 | 2009-05-25 |
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