TWI653435B - Optical sensing module with multi-directional optical sensing function - Google Patents

Abstract

A light detecting module having multi-sensing direction versatility, which can be fixed on a circuit board through a bridge medium. The light detecting module comprises a carrier, a photosensitive element and a connecting member. The carrier has a bottom and a plurality of sides. The plurality of side portions are connected to the periphery of the bottom portion in a folded manner, and the plurality of side portions form an accommodating area. The photosensitive element is disposed in the accommodating area for receiving an optical signal entering from an opening of the accommodating area. The connector is disposed on the carrier. The connector includes a conductive terminal, and the carrier is coupled to the bridge medium by the conductive terminal, and the circuit board can be connected from one of a plurality of sensing directions.

Description

Light detection module with multi-sensing direction versatility

The invention provides a light detecting module, in particular to a light detecting module with multi-sensing direction versatility.

Please refer to FIG. 14. FIG. 14 is a cross-sectional view showing the structure of the detecting module 50 of the prior art. The detection module 50 includes a carrier 52, a sensing component 54, and a pin 56. The sensing element 54 is disposed in the accommodating space of the carrier 52. The pin 56 protrudes from the bottom surface of the carrier 52 and is electrically connected to the sensing element 54. To mount the detection module 50 on the circuit board (not shown), the detection module 50 is placed on the circuit board through the bottom surface, and the pin 56 is inserted into the corresponding interface of the circuit board. To establish the signal transmission channel of the sensing component 54 and the circuit board. When the detecting module 50 is placed on the circuit board, the detecting direction of the sensing component 54 is approximately parallel to the plane direction of the circuit board; therefore, the detecting direction of the conventional detecting module 50 is limited to the upper side of the circuit board. It is difficult to provide a wider range of application changes in line with user needs.

The invention provides a light detecting module with multi-sensing direction versatility to solve the above problems.

The patent application scope of the present invention discloses a light detecting module having multi-sensing direction versatility, which can be fixed on a circuit board through a bridge medium. The light detecting module comprises a carrier, a photosensitive element and a connecting member. The carrier has a bottom and a plurality of sides. The plurality of side portions are connected to the periphery of the bottom portion in a folded manner, and the plurality of side portions form an accommodating area. The photosensitive element is disposed in the accommodating area for receiving an optical signal entering from an opening of the accommodating area. The connector is disposed on the carrier. The connector includes a conductive terminal, and the carrier is coupled to the bridge medium by the conductive terminal, and the circuit board can be connected from one of a plurality of sensing directions.

The invention further discloses that the connecting member selectively includes at least one through hole structure formed on at least one of the corresponding side portions of the plurality of side portions, wherein the conductive terminal is fixed in the through hole structure; or the connecting member Optionally, at least one extension is attached to the side of the bottom, and the conductive terminal is disposed on a surface of the extension. The carrier stands on the circuit board and the opening is oriented in a direction different from a planar normal vector of the circuit board.

One embodiment of the present invention forms a through-hole structure in a side portion of the carrier, and a conductive terminal is disposed in the through-hole structure to be connected to the circuit board through the bridge medium; wherein the interior of the circuit board can be designed according to the light detecting module The demand selectively sets the active circuit or the passive circuit. The number of via structures may be one or more, and the type of via structures is not limited to a half-hole structure or a quarter-hole structure, and the positions of the hole structures are not limited to the embodiment described in the present invention. The aforementioned side portions may be only the side of the substrate, or only the side of the shield, or all or part of the side of the substrate and the shield. The via structure may be formed on all sides of the carrier or selectively formed on a portion of the side.

In another embodiment of the present invention, an extension portion is disposed on a side of the carrier, and the extension portion has a conductive terminal connected to the circuit board by a bridge medium; the circuit board of this embodiment may also selectively implement an active circuit or a passive circuit. Circuit. When the carrier is standing on the circuit board by using the through hole structure or the extension of the connecting member, the bearing seat can be arbitrarily selected and fixed on the circuit board, that is, the signal receiving/projecting direction of the light detecting module can be followed by the user. Adjusted for demand. Compared with the prior art, the present invention is provided with a connecting member having a through hole structure or an extension portion beside the carrier. The carrier can be placed on the circuit board from the bottom or side options, and the light detecting module is disposed. Multi-sensing direction versatility.

Please refer to FIG. 1 to FIG. 3 . FIG. 1 is a schematic diagram of a light detecting module 10 having multi-sensing direction versatility according to a first embodiment of the present invention, and FIG. 2 is a light diagram of the first embodiment of the present invention. The upper view of the detection module 10, and FIG. 3 is a cross-sectional view of the photodetection module 10 shown in FIG. 1 along the section line AA. The light detecting module 10 includes a carrier 12, a photosensitive element 14 and a connecting member 17. The carrier 12 has a bottom 20 and a plurality of sides 22. The plurality of side portions 22 are respectively connected to the periphery of the bottom portion 20 in a folded manner to form the accommodating portion 24 for the photosensitive member 14 to be disposed; thereby, the side portions 22 can block the light-receiving member 14 and the photosensitive member 14 The light signal entering from the opening 26 of the accommodating area 24 is received. The light-emitting element (not shown in the figure) is an optional accessory, which can be disposed adjacent to the photosensitive element 14 in the accommodating area 24, or is an external component relative to the light detecting module 10, and the actual application end view design It depends on the demand and therefore will not be explained in detail.

The carrier 12 is mainly composed of a substrate 28 and a shield 30. The photosensitive member 14 is disposed on the substrate 28. The shield member 30 is disposed on the substrate 28 around the photosensitive member 14, that is, the aforementioned accommodating region 24 is formed. In general, the bottom portion 20 can be defined as the bottom surface of the substrate 28, and the side portions 22 are differently defined depending on the structural design of the different embodiments; in the first embodiment, the side portions 22 are defined as the sides of the substrate 28. In the embodiment of the present invention, the thickness T1 of the substrate 28 is preferably 0.8 times to 1.5 times the thickness T2 of the shielding member 30, and the thickness T1 is preferably greater than 0.4 mm; the width W of the substrate 28 is preferably the substrate 28 and The total thickness T of the shield member 30 is within 8 times, but is not limited thereto.

The connector 17 can include a via structure 16 and a conductive terminal 18. The via structure 16 is formed on at least one of the plurality of side portions 22 by mechanical drilling techniques. The conductive terminal 18 is fixed in the via structure 16 by thin film, plating or the like, and may be made of a copper material having a conductive property or a nickel material or a gold material having an oxidation preventing property. The light detecting module 10 is a modular wafer that is coupled to the circuit board 32 via a bridging medium 34 such as solder paste. Therefore, the carrier 12 can be connected to the circuit board 32 by the conductive terminal 18 and the bridge medium 34, so that the carrier 12 stands on the circuit with a specific side portion 22 (having a certain side portion 22 of the conductive terminal 18 connected to the bridge medium 34). On the board 32, the opening 26 of the carrier 12 can be arbitrarily oriented in a direction different from the plane normal vector V of the circuit board 32, that is, the light detecting module 10 can be selected from a plurality of sensing directions. A desired direction is provided on the circuit board 32.

As shown in Figures 1 and 2, the via structure 16 can be a half-hole structure 16A or a quarter-hole structure 16B. The semi-via structure 16A is primarily located in the non-end region of the side portion 22 to increase the bonding strength by increasing the contact area of the conductive terminals 18 with the bridging medium 34. The quarter-hole structure 16B is mainly located at the end region of the side portion 22, except that the contact area of the conductive terminal 18 with the bridge medium 34 is increased, and the surface tension after the solder paste (bridge medium 34) is melted can further improve the connection stability. degree. In particular, in this embodiment, only the half-hole structure 16A may be disposed on the side portion 22, or only the quarter-hole structure 16B may be disposed on the side portion 22, or the two through-hole structures 16A and 16B may be provided. They are all disposed on the side portion 22; the changing state depends on the design requirements.

As shown in FIG. 3, the carrier 12 can have a plurality of plug terminals 36 electrically connected to the photosensitive member 14 and protruding from the bottom surface of the bottom portion 20 or the substrate 28. When the photo detecting module 10 is placed on the circuit board 32 (for example, the carrier 12 is flatly attached to the circuit board 32 with the bottom 20), the plug terminal 36 is plugged into the circuit board 32 to establish the photosensitive element 14 and the circuit board 32. The signal transmission channel between. Alternatively, the plug terminal 36 can be selectively electrically connected to the conductive terminal 18; when the light detecting module 10 stands on the circuit board 32 with the side portion 22, the plug terminal 36 can be connected to the bridge medium 34 via the conductive terminal 18. A signal transmission channel with the circuit board 32 is established. In addition, the conductive terminal 18 can be selectively electrically connected directly to the photosensitive element 14 and connected to the external electronic component 40 through the connecting wire 38. The conductive terminal 18 electrically connected to the photosensitive element 14 can serve as a test end point of the light detecting module 10, the connecting wire 38 can be a common flexible cable, the external electronic component 40 is a test device, and the test end is connected by a cable. External test equipment provides easy signal and functional testing.

Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a schematic diagram of a photodetection module 10 ′ according to a second embodiment of the present invention, and FIG. 5 is a photodetection module 10 ′ along FIG. 4 . A cross-sectional view of the section line BB. The components of the light detecting module 10' are substantially the same as the components of the light detecting module 10, except that the through hole structure 16' of the light detecting module 10' is formed on the side of the substrate 28 and the shielding member. Portions of the respective sides of the 30, that is, the side portions 22 of the second embodiment are defined as two adjacent sides of the substrate 28 and the shield member 30. As shown in Fig. 5, the through-hole structure 16' has a radial dimension D1 in the region of the substrate 28, and the radial dimension in the region of the shield 30 can be selectively divided into two values, D2 and D3. The hollow structure formed by the through hole structure 16' in the region of the shielding member 30 (where the radial dimensions are D2 and D3) can increase the contact area of the conductive terminal 18 with the bridging medium 34 to improve the joint strength/stability, and The radial dimensions of the empty structures are the same or different from the radial dimensions of the via structure 16' in the region of the substrate 28. Regardless of whether the through-hole structure 16' has a radial dimension D2 or D3 (which is the same and different from the radial dimension D1) in the shield member 30, the surface tension after melting by the solder paste (bridge medium 34) can be improved. The connection strength/stability with the circuit board is the design range of the second embodiment of the present invention.

In particular, when the through-hole structure 16' of the second embodiment is formed on a portion of the side surface of the shield member 30, the through-hole structure 16' is tied to the side of the shield member 30 adjacent to the substrate 28, and the protruding shield member 30 is not provided. The other side of the opposite substrate 28 is as shown in Fig. 5. In the second embodiment, the bridging medium 34 (e.g., solder paste) is preferably applied to a portion of the via structure 16' that is within the range of the substrate 28. The coating amount of the bridging medium 34 may be slightly larger than the space capacity of the through-hole structure 16', and the right bridging medium 34 may partially overflow the right side of the substrate 28, and the surface tension can be generated by the bridging medium 34; because the through-hole structure 16' Extending into the range of the shielding member 30 (that is, forming the aforementioned hollow structure), the left bridging medium 34 also partially overflows the left side of the substrate 28, so that the left and right sides of the substrate 28 can lift the carrier 12 by the corresponding surface tension. The connection strength and stability of the circuit board 32.

Please refer to FIG. 6 and FIG. 7 , FIG. 6 is a schematic diagram of a photodetection module 10 ′′ according to a third embodiment of the present invention, and FIG. 7 is a photodetection module 10′′ shown in FIG. A cross-sectional view of the section line CC. The components of the third embodiment are substantially the same as the components of the foregoing embodiment, except that the through-hole structure 16" of the photodetecting module 10" is formed on the side of the substrate 28 and all the corresponding sides of the shielding member 30. That is, the side portion 22 of the third embodiment is defined as two adjacent sides of the substrate 28 and the shield 30, and the through-hole structure 16" completely opens the substrate 28 and the shield 30 to penetrate the opposite sides of the shield 30 Compared with the foregoing first and second embodiments, the through-hole structure 16" of the present embodiment can further increase the contact area of the conductive terminal 18 and the bridge medium 34, thereby further enhancing the strength of the connection board 12 connecting the circuit board 32. stability.

Please refer to FIG. 8. FIG. 8 is a flowchart of a method for fabricating a photodetection module having multi-sensing direction versatility according to any embodiment of the present invention. The manufacturing method described in Fig. 8 can be applied to the above three embodiments. First, step S800 is performed to form via structures 16, 16', 16" in one or more side portions 22 of the carrier 12 by mechanical drilling techniques. In the first embodiment, the manufacturing method of the present invention uses mechanical The drilling technique forms the via structures 16 at locations on the motherboard (uncut circuit board) where the cut lines are known, and then along the via structures 16 (meaning along the known cut line) The motherboard is used to fabricate a plurality of substrates 28 having a smaller area, and the via structures 16 are formed on the corresponding side portions 22 of the substrate 28. The initial via structures 16 on the uncut motherboard are generally circular, the mother board After one cut, the initial circular through-hole structure 16 is converted into a semi-porous structure 16A, or the circular through-hole structure 16 is converted into a quarter-hole structure 16B by secondary cutting, as shown in FIG. The method for fabricating the above-described half-hole structure 16A can also be applied to the second and third embodiments.

After the via structure 16 is completed, step S802 is performed to fix the conductive terminal 18 in the via structure 16. Finally, step S804 is performed to connect the conductive terminal 18 to the circuit board 32 by using the bridge medium 34. The conductive terminal 18 serves as a rear interface, and the carrier 12 can be smoothly fixed on the circuit board 32 by the bridge medium 34. In various embodiments of the present invention, the via structures 16, 16', 16" may be formed on respective sides of the substrate 28 and/or the shield 30. Thus, the method of fabricating the photodetecting module may be selective to the substrate 28. Forming respective through-hole structures 16, 16', 16" with the shielding member 30, and then bonding the shielding member 30 to the substrate 28 to join the through-hole structures 16, 16', 16"; the through-hole structure 16 made by this method 16', 16" may have a slight step, as shown in Fig. 5, the lower via structure 16' of the photodetection module 10'. Another manufacturing method is to first combine the substrate 28 and the shielding member 30, and then directly form the through-hole structure 16, 16', 16" based on the combination of the substrate 28 and the shielding member 30; the through-hole structure 16 and 16 produced by the method ', 16' is relatively flat, as shown in Fig. 5, the upper through hole structure 16' of the light detecting module 10', and the through hole structure 16" of the light detecting module 10" shown in Fig. 6.

Please refer to FIG. 9. FIG. 9 is a schematic diagram of a light detecting module according to another possible embodiment of the present invention. The light detecting module of the embodiment can be applied to any one of the light detecting modules 10, 10', 10". Taking the light detecting module 10' as an example, both sides of the bearing 12 are selected. The positioning member 68 is disposed. The positioning member 68 can be connected only to the bottom portion 20, only to the side portion 22, or simultaneously to the bottom portion 20 and the side portion 22. The bottom end of the positioning member 68 (facing one end of the circuit board 32) protrudes. At the edge of the carrier 12, the circuit board 32 has a corresponding positioning hole structure 70. When the carrier 12 and the circuit board 32 are connected, the positioning member 68 is partially inserted into the positioning hole structure 70, and can be engaged or adhered. Therefore, the present invention can utilize the combination of the positioning member 68 and the positioning hole structure 70 to strengthen the joint strength and stability of the bearing base 12 and the circuit board 32, and avoid the occurrence of the bearing seat 12 due to uneven tension when the bridging medium 34 is melted. Tilt or rotate the offset.

Please refer to FIG. 10 to FIG. 12 , FIG. 10 is a schematic diagram of a light detecting module 60 according to a fourth embodiment of the present invention, and FIG. 11 is a cross-sectional view of the light detecting module 60 shown in FIG. 10 . FIG. 12 is a cross-sectional view showing the structure of the photodetecting module 60 shown in FIG. 10 in another variation. The light detecting module 60 includes a carrier 12, a photosensitive member 14, and a connector 17'. The photosensitive member 14 is disposed in the accommodating region 24 formed by the bottom portion 20 of the carrier 12 and the side portion 22. The connecting member 17' is disposed on the side of the carrier 12 and mainly includes an extending portion 62 and a conductive terminal 64. The extension portion 62 connects at least one side of the bottom portion 20, and the conductive terminal 64 is disposed on the surface of the extension portion 62. Depending on the process, the relative positional relationship between the conductive terminals 64 and the extensions 62 may vary slightly, but does not affect the plane of the carrier 12 standing on the circuit board 32 through the connector 17', with its opening 26 facing the plane of the circuit board 32. The role of the normal vector V. For example, the conductive terminal 64 can be aligned with the outer edge 621 of the extending portion 62 opposite to the bottom portion 20, as shown in FIG. 11; or the conductive terminal 64 is partially protruded or partially recessed relative to the outer edge 621. The extension 62 is as shown in Fig. 12.

In the fourth embodiment, the thickness T3 of the bottom portion 20 is preferably 0.8 times or more the thickness T4 of the side portion 22, and the thickness T3 of the bottom portion 20 is preferably greater than 0.4 mm, ensuring that the carrier 12 can pass through the bottom portion 20 and the extending portion 62. Standing on the circuit board 32; the total length L1 of the bottom portion 20 and the extending portion 62 is preferably less than 10 times the sum of the thickness T3 and the thickness T4, so that the carrier 12 is prevented from being easily dumped due to the unstable center of gravity. The number of conductive terminals 64 depends on the design requirements of the light detecting module 60. The plurality of conductive terminals 64 may be provided on the opposite surfaces of the extending portion 62 or at different positions on the same surface of the extending portion 62. In addition, the length of each of the conductive terminals 64 is preferably between 0.2 mm and 2.0 mm, and the width is preferably between 0.2 mm and 3.0 mm, and the distance between the edges of the two adjacent conductive terminals 64 is at least greater than 0.2 mm. At least one of the conductive terminals 64 is selectively electrically connectable to the plug terminal 36 of the protruding bottom portion 20.

As shown in Figures 11 and 12, the circuit board 32 has one or more conductive objects 66. The areas of the conductive objects 66 can be used to define a specific range, and the carrier 12 is extended by the bridge medium 34. The conductive terminals 64 on the portion 62 are joined to a specific range formed by the conductive member 66. In other words, the specific range can be interpreted as the corresponding slot of the circuit board 32, and the conductive object 66 is considered to be the contact in the slot. In an embodiment where the conductive terminal 64 is aligned with the outer edge 621 of the extension 62, the conductive terminal 64 can directly contact the conductive article 66 and apply the bridging medium 34 therebetween for bonding with its surface tension; at the conductive terminal 64 In a partially protruding and/or partially retracted embodiment of the outer edge 621, a portion of the protruding conductive terminal 64 is in direct contact with the conductive member 66, and a portion of the tapered conductive terminal 64 is indirectly utilized by the bridge dielectric 34. Contact with the conductive member 66 can achieve the purpose of high joint strength / stability of the conductive joint.

Please refer to FIG. 13 , which is a schematic diagram of a light detecting module according to another possible embodiment of the present invention. When the light detecting module 60 is applied, the positioning member 68 is selectively disposed on both sides of the carrier 12, and the positioning member 68 is preferably disposed beside the bottom portion 20. The bottom end of the positioning member 68 (facing one end of the circuit board 32) protrudes from the edge of the bottom portion 20, and the circuit board 32 further has a corresponding positioning hole structure 70. When the light detecting module 60 is coupled to the circuit board 32 through the connecting member 17', the positioning member 68 is partially inserted into the positioning hole structure 70, and is selectively fixed in a fitting manner or an adhesive manner. With the aid of the positioning member 68 and the positioning hole structure 70, the light detecting module 60 can overcome the inclination or rotational deviation of the carrier 12 caused by the uneven tension when the bridging medium 34 is melted, and can stand vertically on the surface of the circuit board 32. . Wherein, the protruding portion at the bottom end of the positioning member 68 preferably forms a diagonal guiding structure for facilitating smooth insertion into the positioning hole structure 70.

In summary, one embodiment of the present invention forms a through-hole structure in a side portion of the carrier, and a conductive terminal is disposed in the through-hole structure to be connected to the circuit board through the bridge medium; wherein the inside of the circuit board can be based on optical detection The design requirements of the test module selectively set the active circuit or the passive circuit. The number of via structures may be one or more, and the type of via structures is not limited to a half-hole structure or a quarter-hole structure, and the positions of the hole structures are not limited to the embodiment described in the present invention. The aforementioned side portions may be only the side of the substrate, or only the side of the shield, or all or part of the side of the substrate and the shield. The via structure may be formed on all sides of the carrier or selectively formed on a portion of the side.

In another embodiment of the present invention, an extension portion is disposed on a side of the carrier, and the extension portion has a conductive terminal connected to the circuit board by a bridge medium; the circuit board of this embodiment may also selectively implement an active circuit or a passive circuit. Circuit. When the carrier is standing on the circuit board by using the through hole structure or the extension of the connecting member, the bearing seat can be arbitrarily selected and fixed on the circuit board, that is, the signal receiving/projecting direction of the light detecting module can be followed by the user. Adjusted for demand. Compared with the prior art, the present invention is provided with a connecting member having a through hole structure or an extension portion beside the carrier. The carrier can be placed on the circuit board from the bottom or side options, and the light detecting module is disposed. Multi-sensing direction versatility. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10, 10', 10" ‧ ‧ light detection module

12‧‧‧Hosting

14‧‧‧Photosensitive elements

16, 16', 16" ‧ ‧ through hole structure

16A‧‧‧Half-hole structure

16B‧‧‧quarter hole structure

17, 17'‧‧‧Connecting parts

18‧‧‧Electrical terminals

20‧‧‧ bottom

22‧‧‧ side

24‧‧‧ accommodating area

26‧‧‧ openings

28‧‧‧Substrate

30‧‧‧Shield

32‧‧‧ boards

34‧‧‧Bridge media

36‧‧‧Terminal terminals

38‧‧‧Connecting wires

40‧‧‧External electronic components

50‧‧‧Detection module

52‧‧‧Hosting

54‧‧‧Sensor components

56‧‧‧ pins

60‧‧‧Light detection module

62‧‧‧Extension

621‧‧‧ outer edge

64‧‧‧Electrical terminals

66‧‧‧Electrical objects

68‧‧‧ Positioning parts

70‧‧‧Position hole structure

A-A, B-B, C-C, D-D‧‧‧ hatching

T1‧‧‧ substrate thickness

T2‧‧‧Shield thickness

T3‧‧‧ bottom thickness

T4‧‧‧ side thickness

Total thickness of T‧‧‧ substrate and shield

Plane normal vector of V‧‧‧ board

W‧‧‧ substrate width

L1‧‧‧ total length of the bottom and extension

D1‧‧‧through hole structure in the radial dimension of the substrate

D2, D3‧‧‧through hole structure in the radial dimension of the shield

S800, S802, S804‧‧‧ steps

FIG. 1 is a schematic diagram of a light detecting module having multi-sensing direction versatility according to a first embodiment of the present invention. FIG. 2 is a top view of the light detecting module according to the first embodiment of the present invention. Fig. 3 is a cross-sectional view showing the structure of the photodetecting module shown in Fig. 1. FIG. 4 is a schematic diagram of a light detecting module according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view showing the structure of the photodetecting module shown in Fig. 4. FIG. 6 is a schematic diagram of a light detecting module according to a third embodiment of the present invention. Fig. 7 is a cross-sectional view showing the structure of the photodetecting module shown in Fig. 6. FIG. 8 is a flow chart of a method for fabricating a photodetection module having multi-sensing direction versatility according to an embodiment of the present invention. FIG. 9 is a schematic diagram of a light detecting module according to another possible embodiment of the present invention. FIG. 10 is a schematic diagram of a light detecting module according to a fourth embodiment of the present invention. Figure 11 is a cross-sectional view showing the structure of the light detecting module shown in Figure 10. Figure 12 is a cross-sectional view showing the structure of the photodetecting module shown in Fig. 10 in other variations. FIG. 13 is a schematic diagram of a light detecting module according to another possible embodiment of the present invention. Figure 14 is a cross-sectional view showing the structure of a conventional detection module.

Claims (21)

A light detecting module having a multi-sensing direction versatility is fixed on a circuit board through a bridge medium. The light detecting module includes: a carrier having a bottom and a plurality of sides, a plurality of side portions are connected to the periphery of the bottom portion to form a frame-like structure having a receiving area; a photosensitive element disposed in the receiving area for receiving the opening from one of the receiving areas An optical component; and a connecting member disposed on the carrier, the connector includes a conductive terminal, the carrier is coupled to the bridge medium by the conductive terminal, and the circuit can be connected from one of a plurality of sensing directions board. The light detecting module of claim 1, wherein the connecting member further comprises at least one through hole structure formed on at least one of the corresponding side portions of the plurality of side portions, the conductive terminal being fixed in the through hole structure. The photodetection module of claim 1, wherein the connector further comprises at least one extension connected to the side of the bottom, the conductive terminal being disposed on a surface of the extension. The photodetection module of claim 1, wherein the carrier stands on the circuit board, and the opening is oriented in a direction different from a planar normal vector of the circuit board. The photodetection module of claim 1, wherein the carrier further has at least one plug end And electrically connecting the photosensitive element and protruding from the bottom, the plug terminal is further selectively electrically connected to the conductive terminal. The photodetection module of claim 1, wherein the conductive terminal is electrically connected to the photosensitive element, and is further connected to an external electronic component through a connecting wire. The photodetection module of claim 2, wherein the carrier comprises a substrate and a shielding member, the photosensitive member is disposed on the substrate, and the shielding member is disposed around the photosensitive member to form the receiving region. The light detecting module of claim 7, wherein a thickness of one of the substrates is 0.8 times or more of a thickness of the shielding member, and a width of the substrate is 8 times of a total thickness of the substrate and the shielding member. the following. The photodetection module of claim 7, wherein the side portion is a side of the substrate, or the side of the substrate and a corresponding side of the shielding member, or the side of the substrate and the shielding The corresponding side of the part of the piece. The light detecting module of claim 9, wherein the through hole structure has the same radial dimension in one of the substrates or is different from the through hole structure in a radial dimension of one of the shielding members. The light detecting module of claim 9, wherein the through hole structure penetrates the opposite sides of the shielding member when the through hole structure is formed on the corresponding side of the shielding member. The light detecting module of claim 9, wherein the through hole structure is formed on the corresponding side of the portion of the shielding member, the through hole structure is located on a side of the shielding member adjacent to the substrate, and the protruding portion is not protruded The shield is opposite the other side of the substrate. The photodetection module of claim 3, wherein one of the bottom portions has a thickness greater than 0.8 times the thickness of one of the sides, and the bottom portion has a thickness greater than 0.4 mm. The photodetection module of claim 3, wherein the total length of the bottom portion and the extension portion is less than 10 times the total thickness of the bottom portion and the side portion. The photodetection module of claim 3, wherein one of the conductive terminals has a length between 0.2 mm and 2.0 mm, and one of the conductive terminals has a width between 0.2 mm and 3.0 mm. The photodetection module of claim 3, wherein the conductive terminal is aligned with the outer edge of the extension relative to the bottom, or is disposed at the extension relative to the outer edge portion. on. The light detecting module of claim 3, wherein the light detecting module further comprises a plurality of conductive terminals disposed on opposite surfaces of the extending portion or on the same surface of the extending portion, the plural The edge spacing of two adjacent conductive terminals of the two conductive terminals is greater than 0.2 mm. The photodetection module of claim 3, wherein the extension is coupled to a specific range on the circuit board. The photodetection module of claim 18, wherein the circuit board has at least one conductive object for defining the specific range, and the conductive terminal is coupled to the conductive object by the bridging medium. The photodetection module of claim 1, wherein the bottom portion is selectively provided with at least one active circuit or passive circuit. The light detecting module of claim 1, wherein the circuit board has a positioning hole structure, the light detecting module further comprises a positioning member disposed beside the carrier and partially inserted into the positioning Hole structure.