201042857 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種連接器，更明確地說，係有關於一種連接光 感測器與基板之連接器。 【先前技術】 0 光學式觸控系統包含一顯示幕、一透明基板、一光感測器，以及 一位置計算電路。一般而言，透明基板係為一玻璃基板，更明確地 說’透明基板係為一銦錫氧化物(Tin_d〇ped Indium Oxide，ITO)玻 璃。顯示幕透過透明基板以顯示影像。光感測器係為一晶片模組(chip module)，光感測器需設置於透明基板之上，且光感測器之收光方向 必須平行於該透明基板。如此，光感測器才可偵測該透明基板上是 否有指示物(如手指、觸控筆）’並據以產生光感測訊號。舉例而言， 光感測訊號可為一範圍涵蓋指示物之感測影像，或是指示物相對於 〇 光感測器之距離與角度。此外，光感測器具有一傳輸埠，用來傳送 光感測訊號給位置計算電路。如此，位置計算電路可根據光感測訊 號以計算出指示物於顯示幕之上之位置。 在先前技術中，當使用者欲設置一晶片模組於玻璃基板上時，使 用者大部份會以捲帶式晶片載體封裝(Tape Carrier Package, TCp)或 晶粒軟模接合(Chip on Film，C0F)的封裝方式，將該晶片模組先設置 於一軟板(Flex Printed Circuit，FPC)上，接著再將該軟板耦接(或壓焊） 201042857 至玻璃基板。然而，當使用者利用上述之方式以將光感測器設置於 玻璃基板上時，光感測器之收光方向會受到限制。更明確地說，若 以上述之封裝方式(TCP或C0F)將光感測器封裝於軟板上時，則光 感測器之收光方向會垂直於該軟板(如第丨圖所示）。當該軟板耦接 至玻璃基板上時，光感測器之收光方向會垂直於玻璃基板。換句話 說，在光學觸控系統中，若使用者欲利用既有之封裝方式(如TCp 或COF)將光感測器設置於玻璃基板上，則光感測器之收光方向垂直 於玻璃基板，而造成光感測器無法偵測到指示物(如手指、觸控筆） 接觸到該顯示ϋ。軸在先前技術巾，制者可將軟板凹折一角度 並再將軟板固定，以轉置规測器之收光方向，細該製程僅能以 人工方式處理，且該製程既耗時且良率不易控制，因此會造成光學 式觸控系統之成本上升，帶給使时很大的不便。 【發明内容】 1 本發月提供-種連接—光感測賴—基板之連接器。該連接器用 來使該光❹ill之—收光方向無基板平行。縣板係為銦锡氧化 物(Tm-d〇pedIndium〇xide，IT〇)玻璃。該光感測器用來收光以產生 該光感㈣具有—傳輪埠，絲傳送縣感測訊號。 二於-鱗式觸控线。該光學式觸控魏具有一顯 :置;置計算電路。該顯示幕透過該基板以顯示影像。該 -域峨組所產生之-域職號，以計算出 連二：:::示幕ΐ上之一位置。該連接器包含-本體，以及-^用來容峨光制H，轉置該光❹j|f以使該光 201042857 感、〗器之。亥收光方向與該基板平行。該連接埠收容於該本體内。該 連接槔輕接至該光感測器之該傳輸璋，以使該光感測器可透過該傳 輸埠與該連接埠耦接至該基板。 本發明另提供一種光學式觸控系統。該光學式觸控系統包含一基 板、-顯示幕、-域賴組，以及—位置計算電路。該基板係為 一鋼錫氧化物(Tin-doped Indium Oxide，ΙΤΟ)玻璃。該顯示幕用來透 〇 過忒基板以顯示影像。該光感測模組用來收光以偵測一指示物，並 據以產生一光感測訊號。該光感測模組包含一光感測器 ，以及一連 接器。該光感測器用來收光以產生該光感測訊號。該光感測器具有 一傳輸埠，用來傳送該光感測訊號。該連接器包含一本體、一連接 埠，以及一軟板。該本體用來容納該光感測器，且轉置該光感測器 以使该光感測器之一收光方向與該基板平行。該連接埠收容於該本 體内，耦接至該光感測器之該傳輸埠。該軟板具有一軟板連接埠， Q 用來將該連接器之該連接埠耦接至該基板。該位置計算電路用來根 據該光感測訊號，以計算出該指示物於該顯示幕之上之一位置。 本發明另提供一種光感測器之製作方法。該光感測器具有一感測 單元，以及一鏡頭。該感測單元用來收光以產生一光感測訊號。該 感測單元具有一傳輸端，用來傳送該光感測訊號。該鏡頭用來將光 匯聚於該感測單元。該光感測器應用於一光學式觸控系統。該光學 式觸控系統具有一基板、一顯示幕，以及一位置計算電路。該基板 係為銦錫氧化物(Tin-doped Indium Oxide, IT0)玻璃。該顯示幕透過 5 201042857 。基板以顯示影像。該位置計算電路根據該光感測訊號，以計算出 -指不物於該顯示幕之上之—位置。該絲測器可置人—連接器。 «亥連接器可轉置該光感㈣之—收光方向，以使該光感測器之該收 光方向平行於該基板且可使光感測器避免高溫製程。該製作方法包 含於邊感測單元與—承載元件之職人—底部充轉關定該感測 單元於該承載元件、黏貼該鏡頭於該感測單元之上，以及在該感測 單兀與該鏡頭之周圍填入一固定元件以封裝該感測單元與該鏡頭。 【實施方式】 有鑑於此’本發明提供一種可連接光感測器與基板之連接器。本 發明所提#之連接n可概域卿，以使減顚之收光方向與 基板平订。如此一來，利用本發明所提供之連接器，即可將光感測 器設置於基板上’且可維持光感測器之收光方向平行於基板。 請參考第2圖。第2嶋為制根據本發明ϋ施例之連接 益200之不意圖。在第2圖中，連接器2〇〇設置於基板2〇2上。其 中基板202係為一透明基板(如玻璃基板或ΙΤ〇玻璃)連接器2〇〇包 含一本體210、一連接埠22〇、一上蓋23〇、一收光口 24〇。在本體 210内具有足夠的空間用來容納一光感測器2m ’且轉置光感測器 201以使光感測器201之收光方向與基板2〇2平行。連接埠22〇收 容於本體210内。連接埠22〇用來耦接至光感測器2〇1之傳輸埠， 以使光感測器201可透過該傳輸埠與連接埠22〇耦接至基板2〇2。 如第2圖所示，連接埠22〇可以複數個l型金手指221實施(如第3 201042857 圖與第4圖所示）。每個金手指221包含區段L々L2。其中區段L 係用來耦接至光感測器201之傳輸埠，且區段k係垂直於基板202。 區丰又L2係用來耦接至基板202，且區段L2係平行於基板202。上蓋 230於光感測器201置入本體21〇内後可關上，以避免光感測器2〇1 脫落與避免光感測器201直接受到壓迫。收光口 24〇用來提供給光 感測器201收光。如此一來，將本發明之連接器2〇〇耦接至基板 2〇2 ’再將光感測器2〇1置入本體21〇内，即可使光感測器2〇1之收 〇 方向與基板202平行’且光感測器201可透過其傳輸埠與連接器200 之連接埠220以傳送光感測訊號sLy 請參考第5圖。第5圖係為說明根據本發明之第二實施例之連接 器500之示意圖。連接器500、光感測器501及基板502之結構以 及工作原理分別與連接器200、光感測器201及基板202類似。相 較於連接器200 ’連接器500另包含一軟板550。軟板550具有一軟 & 板連接埠551。軟板550之軟板連接埠551耦接於連接器300之連 接埠520與基板502之間。由於在目前的平面顯示器的製程中’顯 示器之驅動電路皆是以透過軟板耦接至玻璃基板，因此藉由軟板 550 ’連接器500係可利用一般既有之平面顯示器之生產設備，以耦 接至基板502。 5青參考弟6圖。第6圖係為說明根據本發明之第一實施例之光感 測模組600之示意圖。光感測模組600包含一光感測器61〇以及連 接器620。其中光感測器610係設置於連接器620内。光感測器610 7 201042857 及連接器620之結構及工作原理分別與光感測器2〇1及連接器2〇〇 類似，故不再贅述。當光感測模組6〇〇耦接於基板6〇1時，光感測 模組600之收光方向係平行於基板6〇1。因此若光感測模組6〇〇設 置於-光學式觸控系統之-基板之上，光感繼組_可侧該基 板之上之指示物，並據以產生光感測訊號Sls。 "月參考第7圖。苐7圖係為說明根據本發明之第二實施例之光感 測模組700之示意圖。光感測模組7〇〇包含一光感測器71〇以及連 接器720。其中光感測器710係設置於連接器72〇内。光感測器71〇 及連接器720之結構及工作原理與光感測器5〇1及連接器5〇〇類 似，故不再贅述。同理，當光感測模組7〇〇耦接於基板7〇1時，光 感測模組700之收光方向係平行於基板7〇1。因此若光感測模組7〇〇 §受置於一光學式觸控系統之一基板之上，光感測模組7〇〇可偵測該 基板之上之指示物，並據以產生光感測訊號 請參考第8圖。第8圖係為說明本發明之光學式觸控系統8〇〇 之示思圖。光學式觸控系統8〇〇包含一基板81〇、一顯示幕820、一 光感測模組830，以及一位置計算電路840。一般而言，基板81〇 係為一透明基板，更明確地說，基板810係為一玻璃基板或ιτο玻 璃。顯示幕820透過基板810以顯示影像。光感測模組83〇係可以 光感測模組600或700實施。光感測模組830設置於基板81〇之上， 且光感測模組830之收光方向平行於基板81〇。光感測模組83〇收 光以彳貞測於基板810之上之指示物〇<如手指），並據以產生光感測 201042857 訊號SLS。如此，位置計算電路840根據光感測訊號SLS，可計算出 指示物0!於顯示幕820之上之位置，而實現觸控之功能。 此外，值得注意的是，在先前技術中，光感測器係直接以TCP 或COP之封裝方式設置於軟板上，因此光感測器需通過高溫製程， 舉例而言，如回流焊接(reflow)。由於光感測器之鏡頭(LENS)不耐 熱’因此光感測器之鏡頭需在光感測器通過高溫製程之後，才可組 裝至光感測器。如此會造成額外的成本。然而，利用本發明之連接 〇 器’光感測器即可不需通過高溫製程，而可直接置入於連接器中。 因此在製造光感測器時，可將光感測器之其他元件以及光感測器之 鏡頭同時封裝成一晶片模組，如此可減少成本。以下將對上述之光 感測器之製作方法作更進一步地說明。 請參考第9圖與第10圖。第9圖與第10圖係為說明本發明之光 感測器900之製作方法之示意圖。光感測器9〇〇包含一感測單元 〇 910、一鏡頭920 ’以及一遮光元件930。感測單元910用來收光以 產生光感測訊號SLS，感測單元910具有傳輸端，用來作為光感測 器900之傳輸埠。感測單元910通常為一晶片級封裝(Chip Scale Package，CSP)之晶片。鏡頭920用來將光匯聚於感測單元9i〇。遮 光元件930用來遮蔽非垂直入射光感測器9⑻之表面之光線，以使 光感測器900之收光方向幾乎都來自於垂直於鏡頭92〇與感測單元 910之表面之方向，而較不會受到其他方向之光線之干擾。此外， 若光感/則器900之感测單元910主要為接收紅外光以產生光感測訊 201042857 號SLS時，則遮光元件930可遮蔽紅外光。 在第9圖中所示之光感測器900之製作方法為：（丨)將感測單元 910之傳輸端以表面黏著技術(Surface Mount Technology，SMT)搞接 於承載元件901上，（2)於感測單元910與承載元件9〇1之間填入 底部充填膠(underfill)以固定該感測單元於承載元件％ 1，（3)以黏貼 之方式將鏡頭920設置於感測單元910之上，（4)在感測單元91〇與 鏡頭920之周圍填入固定元件902以封襞感測單元91〇與鏡頭92〇, (5)設置遮光元件930於鏡頭920之周圍，以遮蔽非垂直入射光感測 器900之表面之光線。 在第10圖所示之光感測器900之製作方法為:(1)於感測單元91〇 與承載元件901之間填入底部充填膠以固定該感測單元於承載元件 901 ’（2)以黏貼之方式將鏡頭920設置於感測單元91〇之上，（3)利 用金屬線連結之方式將感測單元91G之傳輸端耦接至承載元件 9〇卜⑷在感測單元·與鏡頭920之周圍填入蚊元件9〇2以封 裝感測單元910與鏡頭920，⑶設置遮光元件93〇於鏡頭92〇之周 圍，以遮蔽非垂直入射光感測器900之表面之光線。 綜上所述’本發明所提供之連接器，可連接光感測器與基板，來 轉置光感測H，以使光躺||之收衫向與基板平行。如此一來， 利用本發騎提供之連接H ,即可將設置於基板上，且同 時使光感測H之收光方向平行於基板。彻本發明之連接^，本發 10 201042857 明另提供-種域峨組，當本發明之光制模組耦接於一基板 時’本發明之域嘯組之找方向平行於絲板。本發明另提供 -種光學式觸控系統’在本發明之光學式觸㈣統中，光感測模組 之收光方向係平行於基板。此外，湘本發明之連接器，本發明另 提供光感測器之製作方法，可將光感測器之鏡頭與感測單元同時封 裝成-晶片模組，如此可減少成本，帶給使用者更大的方便。 Ο ❹ 、上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所 做之均等變化與修飾，皆觸本發明之涵蓋範圍。 【圖式簡單說明】 第1圖係為說贱前技術之光學式難系統中光感聰之收光方向 垂直於玻璃基板之示意圖。 第2圖係為說明根據本發明之第—實施例之連接器之示意圖。 第3圖與第4圖係魏明本發明之連懸之連糾之示意圖。 第5圖係為制根據本發明之第二實施例之連接器之示:圖。 =圖係為制根據本發狀第三實補之域聰組之示意圖。 =係為說明根據本發明之第四實施例之光感嗔組之示意圖。 第8圖麵制本發明之絲式馳祕之示意圖。 第9圖與第1G圖係為朗本發明之光感測器之製作方法之示意圖。 【主要元件符號說明】 200、500、620、720 連接器 11 201042857 201 ' 501 ' 610'710 202、502、601、701、 810 光感測器 基板 210、510 本體 220 > 520 連接埠 221 金手指 230、530 上蓋 240、540 收光口 550 軟板 551 軟板連接埠 600、700、830 光感測模組 800 光學式觸控系統 820 顯示幕 840 位置計算電路 〇1 指示物 901 承載元件 910 感測單元 920 鏡頭 930 遮光元件 12201042857 VI. Description of the Invention: [Technical Field] The present invention relates to a connector, and more particularly to a connector for connecting a photo sensor to a substrate. [Prior Art] 0 The optical touch system includes a display screen, a transparent substrate, a photo sensor, and a position calculation circuit. In general, the transparent substrate is a glass substrate, and more specifically, the transparent substrate is a Tin-doped Indium Oxide (ITO) glass. The display screen is displayed through a transparent substrate. The photo sensor is a chip module, and the photo sensor needs to be disposed on the transparent substrate, and the light receiving direction of the photo sensor must be parallel to the transparent substrate. In this way, the photo sensor can detect whether there is an indicator (such as a finger or a stylus) on the transparent substrate and generate a light sensing signal accordingly. For example, the light sensing signal can be a range of sensing images covering the indicator or the distance and angle of the indicator relative to the fluorescent sensor. In addition, the photo sensor has a transmission port for transmitting the photo sensing signal to the position calculation circuit. In this way, the position calculation circuit can calculate the position of the indicator above the display screen based on the light sensing signal. In the prior art, when a user wants to install a wafer module on a glass substrate, most of the user will be taped with a Tape Carrier Package (TCp) or a die bonded die (Chip on Film). , C0F) packaging method, the wafer module is first placed on a Flex Printed Circuit (FPC), and then the flexible board is coupled (or pressure welded) 201042857 to the glass substrate. However, when the user uses the above method to dispose the photo sensor on the glass substrate, the light receiving direction of the photo sensor is limited. More specifically, if the photo sensor is packaged on a flexible board in the above-described package mode (TCP or C0F), the light receiving direction of the photo sensor will be perpendicular to the soft board (as shown in the figure). ). When the flexible board is coupled to the glass substrate, the light receiving direction of the light sensor is perpendicular to the glass substrate. In other words, in an optical touch system, if the user wants to set the photo sensor on the glass substrate by using an existing packaging method (such as TCp or COF), the light receiving direction of the photo sensor is perpendicular to the glass. The substrate causes the light sensor to fail to detect that an indicator (such as a finger or a stylus) is in contact with the display. In the prior art towel, the manufacturer can fold the flexible plate at an angle and fix the soft plate to displace the light receiving direction of the gauge. The process can only be processed manually, and the process is time consuming. And the yield is not easy to control, so the cost of the optical touch system is increased, which brings great inconvenience. SUMMARY OF THE INVENTION 1 This month provides a connector for a type of connection-photosensing-substrate. The connector is used to make the aperture ill - the light-receiving direction parallel to the substrate. The plate of the county is a glass of indium tin oxide (Tm-d〇ped Indium〇xide, IT〇). The light sensor is used to receive light to generate the light sense. (4) has a pass rim, and the wire transmits a county sense signal. Two-scale touch lines. The optical touch has a display: a setting circuit. The display screen passes through the substrate to display an image. The domain name generated by the -domain group to calculate one of the locations on the screen::::. The connector includes a body, and -^ is used to accommodate the light H, and the light j_f is transposed to make the light 201042857 feel. The light collecting direction is parallel to the substrate. The port is contained in the body. The port is lightly connected to the transmission port of the photo sensor so that the photo sensor can be coupled to the substrate through the port and the port. The invention further provides an optical touch system. The optical touch system includes a substrate, a display screen, a domain group, and a position calculation circuit. The substrate is a tin-doped Indium Oxide (ITO) glass. The display is used to display images through the substrate. The light sensing module is configured to receive light to detect an indicator and generate a light sensing signal. The light sensing module includes a light sensor and a connector. The light sensor is configured to receive light to generate the light sensing signal. The light sensor has a transmission port for transmitting the light sensing signal. The connector includes a body, a connecting port, and a flexible board. The body is configured to receive the photo sensor, and the photo sensor is transposed such that a light receiving direction of the photo sensor is parallel to the substrate. The port is received in the body and coupled to the transmission port of the photo sensor. The flexible board has a flexible board connection, and Q is used to couple the connection port of the connector to the substrate. The position calculation circuit is configured to calculate a position of the indicator on the display screen based on the light sensing signal. The invention further provides a method for fabricating a photo sensor. The photo sensor has a sensing unit and a lens. The sensing unit is configured to receive light to generate a light sensing signal. The sensing unit has a transmitting end for transmitting the light sensing signal. This lens is used to concentrate light on the sensing unit. The light sensor is applied to an optical touch system. The optical touch system has a substrate, a display screen, and a position calculation circuit. The substrate is Tin-doped Indium Oxide (IT0) glass. The display is transmitted through 5 201042857. The substrate is used to display an image. The position calculation circuit calculates a position based on the light sensing signal to indicate that the object is not above the display screen. The wire detector can be placed in a connector. The «Hai connector can transpose the light perception (4) - the light-receiving direction so that the light-receiving direction of the light sensor is parallel to the substrate and the light sensor can be prevented from high-temperature processing. The manufacturing method is included in the side sensing unit and the person in charge of the bearing element—the bottom charging is performed on the carrying unit, the lens is pasted on the sensing unit, and the sensing unit is A fixing component is filled around the lens to encapsulate the sensing unit and the lens. [Embodiment] In view of the above, the present invention provides a connector that can connect a photo sensor to a substrate. The connection n of the present invention can be used to make the light-receiving direction of the subtraction flat with the substrate. In this way, by using the connector provided by the present invention, the photosensor can be disposed on the substrate ′ and the light receiving direction of the photo sensor can be maintained parallel to the substrate. Please refer to Figure 2. The second aspect is not intended to be a connection to the benefit 200 according to the embodiment of the present invention. In Fig. 2, the connector 2 is placed on the substrate 2〇2. The substrate 202 is a transparent substrate (such as a glass substrate or a glass substrate). The connector 2 includes a body 210, a connecting port 22, an upper cover 23, and a light receiving port 24'. There is sufficient space in the body 210 for accommodating a photo sensor 2m' and transposing the photo sensor 201 so that the light receiving direction of the photo sensor 201 is parallel to the substrate 2〇2. The port 22 is received in the body 210. The port 22 is coupled to the transmission port of the photo sensor 2〇1 so that the photo sensor 201 can be coupled to the substrate 2〇2 through the port and the port 22〇. As shown in Fig. 2, the connection 埠22〇 can be implemented by a plurality of l-type gold fingers 221 (as shown in Figs. 3 201042857 and Fig. 4). Each gold finger 221 includes a segment L々L2. The segment L is used to be coupled to the transmission port of the photo sensor 201, and the segment k is perpendicular to the substrate 202. The area and the L2 are used to couple to the substrate 202, and the section L2 is parallel to the substrate 202. The upper cover 230 can be closed after the photo sensor 201 is placed in the body 21〇 to prevent the photo sensor 2〇1 from falling off and the light sensor 201 from being directly pressed. The light collection port 24 is used to provide light to the light sensor 201. In this way, the connector 2〇〇 of the present invention is coupled to the substrate 2〇2′ and the photo sensor 2〇1 is placed in the body 21〇, so that the photosensor 2〇1 can be received. The direction is parallel to the substrate 202' and the photo sensor 201 can transmit the photo-sensing signal sLy through the connection port 220 of the connector 200 to the connector 200. Please refer to FIG. Fig. 5 is a schematic view showing a connector 500 according to a second embodiment of the present invention. The structure and working principle of the connector 500, the photo sensor 501, and the substrate 502 are similar to those of the connector 200, the photo sensor 201, and the substrate 202, respectively. The connector 500 further includes a flexible board 550 as compared to the connector 200'. The flexible board 550 has a soft & board connection port 551. The soft board connection 551 of the flexible board 550 is coupled between the connection port 520 of the connector 300 and the substrate 502. Since the driving circuit of the display is coupled to the glass substrate through the flexible board in the current process of the flat panel display, the connector 500 of the flexible board 550 can utilize the production equipment of the general flat display. It is coupled to the substrate 502. 5 green reference brother 6 map. Figure 6 is a schematic view showing a light sensing module 600 in accordance with a first embodiment of the present invention. The light sensing module 600 includes a light sensor 61A and a connector 620. The photo sensor 610 is disposed in the connector 620. The structure and working principle of the photo sensor 610 7 201042857 and the connector 620 are similar to those of the photo sensor 2〇1 and the connector 2, respectively, and therefore will not be described again. When the light sensing module 6 is coupled to the substrate 6〇1, the light receiving direction of the light sensing module 600 is parallel to the substrate 6〇1. Therefore, if the light sensing module 6 is disposed on the substrate of the optical touch system, the light sensor group _ can be side of the indicator on the substrate, and accordingly, the light sensing signal Sls is generated. "month reference to Figure 7. Figure 7 is a schematic view showing a light sensing module 700 in accordance with a second embodiment of the present invention. The light sensing module 7A includes a light sensor 71A and a connector 720. The photo sensor 710 is disposed in the connector 72A. The structure and working principle of the photo sensor 71 and the connector 720 are similar to those of the photo sensor 5〇1 and the connector 5, and therefore will not be described again. Similarly, when the light sensing module 7 is coupled to the substrate 7〇1, the light sensing direction of the light sensing module 700 is parallel to the substrate 7〇1. Therefore, if the light sensing module 7 is placed on a substrate of an optical touch system, the light sensing module 7 can detect the indicator on the substrate and generate light accordingly. Please refer to Figure 8 for the sensing signal. Figure 8 is a diagram illustrating the optical touch system 8 of the present invention. The optical touch system 8A includes a substrate 81A, a display screen 820, a light sensing module 830, and a position calculation circuit 840. In general, the substrate 81 is a transparent substrate, and more specifically, the substrate 810 is a glass substrate or a glass substrate. The display screen 820 is transmitted through the substrate 810 to display an image. The light sensing module 83 can be implemented by the light sensing module 600 or 700. The light sensing module 830 is disposed on the substrate 81A, and the light receiving direction of the light sensing module 830 is parallel to the substrate 81A. The light sensing module 83 collects light to detect the object 〇 < such as a finger on the substrate 810, and accordingly generates a light sensing 201042857 signal SLS. In this manner, the position calculation circuit 840 can calculate the position of the pointer 0! above the display screen 820 according to the light sensing signal SLS, and implement the touch function. In addition, it is worth noting that in the prior art, the photo sensor is directly disposed on the flexible board in a TCP or COP package, so the photo sensor needs to pass a high temperature process, for example, such as reflow soldering (reflow) ). Since the Lens of the photo sensor is not resistant to heat, the lens of the photo sensor needs to be assembled to the photo sensor after the photo sensor has passed the high temperature process. This will incur additional costs. However, the use of the connector of the present invention can be placed directly into the connector without the need for a high temperature process. Therefore, when manufacturing the photo sensor, the other components of the photo sensor and the lens of the photo sensor can be simultaneously packaged into a wafer module, thereby reducing the cost. The method of fabricating the above-described photo sensor will be further described below. Please refer to Figure 9 and Figure 10. Fig. 9 and Fig. 10 are schematic views for explaining the manufacturing method of the photo sensor 900 of the present invention. The photo sensor 9A includes a sensing unit 910, a lens 920', and a shading element 930. The sensing unit 910 is configured to receive light to generate a light sensing signal SLS, and the sensing unit 910 has a transmitting end for use as a transmission port of the light sensor 900. The sensing unit 910 is typically a chip of a Chip Scale Package (CSP). The lens 920 is used to concentrate the light on the sensing unit 9i. The light shielding member 930 is configured to shield the light of the surface of the non-normally incident light sensor 9 (8) such that the light receiving direction of the light sensor 900 is almost from the direction perpendicular to the surface of the lens 92 and the sensing unit 910. Less susceptible to interference from light in other directions. In addition, if the sensing unit 910 of the light sensor/station 900 is mainly for receiving infrared light to generate the light sensing device No. 201042857 SLS, the light blocking member 930 can shield the infrared light. The photo sensor 900 shown in FIG. 9 is made by: (丨) the transmission end of the sensing unit 910 is attached to the carrier element 901 by Surface Mount Technology (SMT), (2) A bottom underfill is filled between the sensing unit 910 and the carrier element 9〇1 to fix the sensing unit to the carrier element %1, and the lens 920 is disposed on the sensing unit 910 by adhesion. Above, (4) a fixing member 902 is filled around the sensing unit 91A and the lens 920 to seal the sensing unit 91A and the lens 92A, and (5) a light shielding member 930 is disposed around the lens 920 to shield Light that is not incident on the surface of the light sensor 900. The photo sensor 900 shown in FIG. 10 is manufactured by: (1) filling a bottom filling filler between the sensing unit 91A and the carrier member 901 to fix the sensing unit to the carrier member 901' (2) The lens 920 is disposed on the sensing unit 91A in a pasting manner, and (3) the transmission end of the sensing unit 91G is coupled to the carrier member 9 by means of a metal wire connection (4) in the sensing unit and The lens 920 is filled with a mosquito element 9〇2 to encapsulate the sensing unit 910 and the lens 920, and (3) a light shielding element 93 is disposed around the lens 92〇 to shield the light of the surface of the non-normally incident light sensor 900. In summary, the connector provided by the present invention can connect the photo sensor and the substrate to transpose the light sensing H so that the shirt of the light lies parallel to the substrate. In this way, the connection H provided by the present rider can be placed on the substrate while the light-receiving direction of the light sensing H is parallel to the substrate. According to the present invention, the present invention provides a seed group which, when the light module of the present invention is coupled to a substrate, is oriented parallel to the wire plate of the domain group of the present invention. The present invention further provides an optical touch system. In the optical touch system of the present invention, the light receiving direction of the light sensing module is parallel to the substrate. In addition, in the connector of the invention of the present invention, the invention further provides a method for manufacturing the photo sensor, which can simultaneously package the lens and the sensing unit of the photo sensor into a chip module, thereby reducing the cost and bringing the user More convenient. The above description is only the preferred embodiment of the present invention, and all changes and modifications made to the scope of the present invention are within the scope of the present invention. [Simple description of the drawing] Fig. 1 is a schematic diagram showing the light-receiving direction of the light-sensing light in the optically difficult system of the prior art perpendicular to the glass substrate. Figure 2 is a schematic view showing a connector according to a first embodiment of the present invention. Fig. 3 and Fig. 4 are schematic diagrams of the connection between Wei Ming and the present invention. Fig. 5 is a view showing a connector according to a second embodiment of the present invention: Fig. = The figure is a schematic diagram of the domain Cong group according to the third form of the hair. = is a schematic view illustrating a light sensing group according to a fourth embodiment of the present invention. Fig. 8 is a schematic view showing the silk fidelity of the present invention. Fig. 9 and Fig. 1G are schematic views showing a method of fabricating the light sensor of the present invention. [Main component symbol description] 200, 500, 620, 720 connector 11 201042857 201 '501 ' 610 '710 202, 502, 601, 701, 810 optical sensor substrate 210, 510 body 220 > 520 connection 埠 221 gold Fingers 230, 530 Upper cover 240, 540 Light collection port 550 Soft board 551 Soft board connection 埠 600, 700, 830 Light sensing module 800 Optical touch system 820 Display screen 840 Position calculation circuit 〇 1 Indicator 901 Carrying element 910 Sensing unit 920 lens 930 shading element 12