TWI452386B - Touch display device, touch panel and manufacturing method thereof - Google Patents
Touch display device, touch panel and manufacturing method thereof Download PDFInfo
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Description
本發明係關於一種觸控顯示裝置、觸控面板以及其製作方法,尤指一種使用單片玻璃觸控方案(one glass solution,OGS)之外掛式觸控顯示裝置、觸控面板以及其製作方法。The present invention relates to a touch display device, a touch panel, and a method of fabricating the same, and more particularly to a touch panel display device using a single glass solution (OGS), a touch panel, and a manufacturing method thereof .
在現今各類型消費性電子產品中,平板電腦、個人數位助理(PDA)、行動電話(mobile phone)、衛星導航系統(GPS)與影音播放器等可攜式電子產品已廣泛地使用觸控面板(touch panel),作為人機資料的溝通介面,藉此節省電子產品的體積。In today's various types of consumer electronics, touch panels are widely used in portable electronic products such as tablets, personal digital assistants (PDAs), mobile phones, satellite navigation systems (GPS) and video players. (touch panel), as a communication interface for human-machine data, thereby saving the volume of electronic products.
在外掛式觸控顯示裝置的架構中,觸控面板與顯示面板係分開獨立製作,且觸控面板係貼附在顯示面板之表面。於傳統外掛式觸控面板中,觸控電極層先製作於一透明基板上,以形成一觸控感測基板,然後再將具有一遮光層之一保護基板貼附於觸控感測基板上,以保護觸控電極。In the structure of the external touch display device, the touch panel and the display panel are separately manufactured separately, and the touch panel is attached to the surface of the display panel. In a conventional external touch panel, the touch electrode layer is first formed on a transparent substrate to form a touch sensing substrate, and then a protective substrate having a light shielding layer is attached to the touch sensing substrate. To protect the touch electrodes.
請參考第1圖,第1圖為習知觸控感測基板之剖面示意圖。如第1圖所示,習知觸控感測基板10包括一透明基板12、一觸控電極層14、一驅動電路晶片16以及一軟性電路板18。其中,透明基板12具有一顯示區12a以及一週邊區12b,且保護基板之遮光層係對應於週邊區12b,以用於遮蔽週邊區12b之電路元件。觸控電極層14設於透明基板12上,且驅動電路晶片16與軟性電路板18設於觸控電極層14上,以將觸控電極層14所感應之訊號傳送至顯示面板。於習知觸控感測基板10中,位於週邊區12b之觸控電極層14係設有一第一對位圖案20,以定位出銲墊之位置,且驅動電路晶片16之下表面亦具有一第二對位圖案。藉此,在將驅動電路晶片16固晶於觸控電極層14上之製程中,位於透明基板12下方之圖像感測裝置22可依序藉由第一對位圖案20辨識出銲墊之位置以及藉由第二對位圖案辨識出驅動電路晶片16之位置,然後將驅動電路晶片16固定於銲墊上。Please refer to FIG. 1 . FIG. 1 is a schematic cross-sectional view of a conventional touch sensing substrate. As shown in FIG. 1 , the conventional touch sensing substrate 10 includes a transparent substrate 12 , a touch electrode layer 14 , a driving circuit chip 16 , and a flexible circuit board 18 . The transparent substrate 12 has a display area 12a and a peripheral area 12b, and the light shielding layer of the protection substrate corresponds to the peripheral area 12b for shielding the circuit elements of the peripheral area 12b. The touch electrode layer 14 is disposed on the transparent substrate 12, and the driving circuit chip 16 and the flexible circuit board 18 are disposed on the touch electrode layer 14 to transmit the signal sensed by the touch electrode layer 14 to the display panel. In the conventional touch sensing substrate 10, the touch electrode layer 14 in the peripheral region 12b is provided with a first alignment pattern 20 for positioning the pad, and the lower surface of the driving circuit wafer 16 also has a The second alignment pattern. Therefore, in the process of solidifying the driving circuit chip 16 on the touch electrode layer 14 , the image sensing device 22 located under the transparent substrate 12 can sequentially identify the bonding pad by the first alignment pattern 20 . The location and the location of the driver circuit wafer 16 are identified by the second alignment pattern, and then the driver circuit wafer 16 is affixed to the pad.
隨著觸控顯示裝置之輕薄化,已有發展出單片玻璃觸控方案之觸控面板,其主要是將觸控電極層直接製作於保護基板上,以省略透明基板之重量,進而減輕觸控面板之重量,並可避免因基板過多而降低觸控顯示裝置之顯示亮度。然而,保護基板上之遮光層係對應於觸控電極層上之驅動電路晶片與軟性電路板,以用於遮蔽驅動電路晶片與軟性電路板,並且遮光層亦會遮蔽觸控電極層之第一對位圖案,因此於將驅動電路晶片固晶於銲墊上時,位於保護基板下方之圖像感測裝置無法辨識出觸控電極層之第一對位圖案,造成驅動電路晶片無法精確固定於銲墊上。With the thin and light touch display device, a touch panel with a single-chip glass touch solution has been developed, which mainly uses the touch electrode layer directly on the protective substrate to omit the weight of the transparent substrate, thereby reducing the touch. The weight of the control panel can avoid reducing the display brightness of the touch display device due to too much substrate. However, the light shielding layer on the protective substrate corresponds to the driving circuit chip and the flexible circuit board on the touch electrode layer for shielding the driving circuit chip and the flexible circuit board, and the light shielding layer also shields the first layer of the touch electrode layer. The alignment pattern, so when the driver circuit wafer is crystallized on the pad, the image sensing device under the protection substrate cannot recognize the first alignment pattern of the touch electrode layer, and the driver circuit chip cannot be accurately fixed to the solder. On the mat.
本發明之主要目的之一在於提供一種觸控顯示裝置、觸控面板以及其製作方法,以解決驅動電路晶片無法精確固定於銲墊上之問題。One of the main purposes of the present invention is to provide a touch display device, a touch panel, and a method of fabricating the same, to solve the problem that the driver circuit wafer cannot be accurately fixed on the pad.
為達上述之目的,本發明提供一種觸控面板。觸控面板包括一透明基板、一遮光層以及一電路模組。透明基板具有一顯示區以及圍繞顯示區之一週邊區。遮光層位於週邊區,且遮光層具有一遮光部以及至少二對位部,其中各對位部係與遮光部相連接,並朝顯示區突出。電路模組設於遮光層之一側。To achieve the above object, the present invention provides a touch panel. The touch panel includes a transparent substrate, a light shielding layer, and a circuit module. The transparent substrate has a display area and a peripheral area surrounding one of the display areas. The light shielding layer is located in the peripheral area, and the light shielding layer has a light shielding portion and at least two alignment portions, wherein each of the alignment portions is connected to the light shielding portion and protrudes toward the display region. The circuit module is disposed on one side of the light shielding layer.
為達上述之目的,本發明提供一種觸控顯示裝置。觸控顯示裝置包括一顯示面板以及一觸控面板。顯示面板具有一顯示區以及圍繞顯示區之一週邊區。觸控面板設於顯示面板之一側,且對應顯示面板設置。觸控面板包括一透明基板、一遮光層以及一電路模組。遮光層位於週邊區,且遮光層具有一遮光部以及至少二對位部,其中各對位部係與遮光部相連接,並朝顯示區突出。電路模組設於透明基板與顯示面板之間。To achieve the above object, the present invention provides a touch display device. The touch display device includes a display panel and a touch panel. The display panel has a display area and a peripheral area surrounding one of the display areas. The touch panel is disposed on one side of the display panel and corresponding to the display panel. The touch panel includes a transparent substrate, a light shielding layer, and a circuit module. The light shielding layer is located in the peripheral area, and the light shielding layer has a light shielding portion and at least two alignment portions, wherein each of the alignment portions is connected to the light shielding portion and protrudes toward the display region. The circuit module is disposed between the transparent substrate and the display panel.
為達上述之目的,本發明提供一種觸控面板之製作方法。首先,提供一電路模組,然後移動電路模組至至少二圖像感測裝置之上方,並利用等圖像感測裝置定位電路模組。接著,提供一觸控基板,觸控基板包括一透明基板以及一遮光層,且透明基板具有一顯示區以及圍繞顯示區之一週邊區,其中遮光層位於週邊區,並具有一遮光部以及至少二對位部,且各對位部係與遮光部相連接,並朝顯示區突出。隨後,移動觸控基板至該電路模組與該等圖像感測裝置之間,並利用該等圖像感測裝置定位該觸控基板。To achieve the above object, the present invention provides a method of fabricating a touch panel. First, a circuit module is provided, and then the circuit module is moved to above the at least two image sensing devices, and the circuit module is positioned by using an image sensing device. Then, the touch substrate includes a transparent substrate and a light shielding layer, and the transparent substrate has a display area and a peripheral area surrounding the display area, wherein the light shielding layer is located in the peripheral area, and has a light shielding portion and at least The two alignment portions are connected to the light shielding portion and protrude toward the display area. Then, the touch substrate is moved between the circuit module and the image sensing devices, and the touch sensing substrate is positioned by the image sensing devices.
本發明於觸控面板之遮光層設置至少二對位部,使對位部在定位觸控基板時可分別被圖像感測裝置辨識,以定位出位於觸控基板,進而可將電路模組精確地銲接於觸控基板上。The invention provides at least two alignment portions on the light shielding layer of the touch panel, so that the alignment portion can be respectively recognized by the image sensing device when positioning the touch substrate, so as to locate the touch substrate, and then the circuit module can be Precisely soldered to the touch substrate.
請參考第2圖至第4圖,第2圖至第4圖為本發明一較佳實施例之觸控面板之製作方法示意圖,其中第4圖為本發明第一較佳實施例之觸控面板之剖面示意圖。第2圖至第4圖僅為示意以更容易了解本發明,其詳細的比例可依照設計的需求進行調整。如第2圖所示,提供電路模組102,且電路模組102具有至少二對位圖案102a,位於電路模組102之下表面。並且,對位圖案102a具有第一中心點102b。接著,移動電路模組102至至少二圖像感測裝置104之上方,使對位圖案102a面對圖像感測裝置104,並且利用各圖像感測裝置104分別偵測各對位圖案102a,以定位出對位圖案102a之第一中心點102b,藉此定位出電路模組102之位置。於本實施例中,電路模組102係為驅動電路晶片,但不限於此。本發明之電路模組亦可為電路板。Please refer to FIG. 2 to FIG. 4 , FIG. 2 to FIG. 4 are schematic diagrams showing a method for fabricating a touch panel according to a preferred embodiment of the present invention, wherein FIG. 4 is a touch diagram of the first preferred embodiment of the present invention. Schematic diagram of the panel. 2 to 4 are merely schematic for easier understanding of the present invention, and the detailed ratios thereof can be adjusted according to the needs of the design. As shown in FIG. 2, the circuit module 102 is provided, and the circuit module 102 has at least two alignment patterns 102a on the lower surface of the circuit module 102. Also, the alignment pattern 102a has a first center point 102b. Next, the circuit module 102 is moved over the at least two image sensing devices 104 to face the image sensing device 104, and each of the image sensing devices 104 is used to detect each of the alignment patterns 102a. To locate the first center point 102b of the alignment pattern 102a, thereby positioning the position of the circuit module 102. In the embodiment, the circuit module 102 is a driving circuit chip, but is not limited thereto. The circuit module of the present invention can also be a circuit board.
如第3圖所示,然後,提供觸控基板106,其中觸控基板106包括透明基板108、遮光層110以及電極層112,且透明基板108具有顯示區108a以及圍繞顯示區108a之週邊區108b。於本實施例中,遮光層110設於週邊區108b之透明基板108上,且具有遮光部110a以及至少二對位部110b。各對位部110b係與遮光部110a相連接,並朝顯示區108a突出,且對位部110b具有第二中心點110c。另外,電極層112設於遮光層110上,且電極層112包括複數個銲墊。接著,移動觸控基板106至電路模組102與圖像感測裝置104之間,使遮光層110位於圖像感測裝置104與電極層112之間,然後利用各圖像感測裝置104分別偵測各對位部110b,以定位出對位部110b之第二中心點110c,藉此定位出觸控基板106之位置。此時,對位部110b之第二中心點110c係位於對位圖案102a之第一中心點102b與圖像感測裝置104之間。並且,由於各銲墊係已固定於遮光層110上,因此對位部110b之第二中心點110c與各銲墊之間距係為固定。藉此,當定位出對位部110b之第二中心點110c時,可藉由計算出對位部110b之第二中心點110c與各銲墊之間距來定位出各銲墊之位置,以助於將電路模組102精確地銲接在各銲墊上。此外,本發明之遮光層110並不限於設於電極層112與透明基板108之間,且本發明之透明基板108亦可設於電極層112與遮光層110之間。As shown in FIG. 3, a touch substrate 106 is further provided. The touch substrate 106 includes a transparent substrate 108, a light shielding layer 110 and an electrode layer 112, and the transparent substrate 108 has a display area 108a and a peripheral area 108b surrounding the display area 108a. . In this embodiment, the light shielding layer 110 is disposed on the transparent substrate 108 of the peripheral region 108b, and has a light shielding portion 110a and at least two alignment portions 110b. Each of the alignment portions 110b is connected to the light shielding portion 110a and protrudes toward the display region 108a, and the alignment portion 110b has a second center point 110c. In addition, the electrode layer 112 is disposed on the light shielding layer 110, and the electrode layer 112 includes a plurality of pads. Then, the touch substrate 106 is moved between the circuit module 102 and the image sensing device 104, so that the light shielding layer 110 is located between the image sensing device 104 and the electrode layer 112, and then the image sensing devices 104 are respectively used by the image sensing devices 104. Each of the alignment portions 110b is detected to locate the second center point 110c of the alignment portion 110b, thereby positioning the position of the touch substrate 106. At this time, the second center point 110c of the alignment portion 110b is located between the first center point 102b of the alignment pattern 102a and the image sensing device 104. Further, since each of the pads is fixed to the light shielding layer 110, the distance between the second center point 110c of the alignment portion 110b and each of the pads is fixed. Therefore, when the second center point 110c of the alignment portion 110b is located, the position of each pad can be located by calculating the distance between the second center point 110c of the alignment portion 110b and each pad. The circuit module 102 is precisely soldered to each of the pads. In addition, the light shielding layer 110 of the present invention is not limited to be disposed between the electrode layer 112 and the transparent substrate 108, and the transparent substrate 108 of the present invention may be disposed between the electrode layer 112 and the light shielding layer 110.
如第4圖所示,接著,移動電路模組102至銲墊上方,並將電路模組102銲接於觸控基板106之銲墊上。隨後,將電路板114接合於觸控基板106之電極層112上,使電路板114電性連接至電路模組102以及電極層114。至此已完成本實施例之觸控面板100。值得注意的是,由於遮光層110具有至少二對位部110b,可分別被圖像感測裝置104辨識,因此觸控基板106可藉由定位出遮光層110之對位部110b後而被定位出。藉此,在定位觸控基板106之步驟時,遮光層110會位於電極層112與圖像感測裝置104之間,使圖像感測裝置104可避免因將對位標記設置在電極層112而無法偵測到對位標記之情況。As shown in FIG. 4, the circuit module 102 is then moved over the pad and the circuit module 102 is soldered to the pad of the touch substrate 106. Then, the circuit board 114 is bonded to the electrode layer 112 of the touch substrate 106 to electrically connect the circuit board 114 to the circuit module 102 and the electrode layer 114. The touch panel 100 of the present embodiment has been completed so far. It is to be noted that, since the light shielding layer 110 has at least two alignment portions 110b, which can be respectively recognized by the image sensing device 104, the touch substrate 106 can be positioned by positioning the alignment portion 110b of the light shielding layer 110. Out. Therefore, when the step of positioning the touch substrate 106 is performed, the light shielding layer 110 is located between the electrode layer 112 and the image sensing device 104, so that the image sensing device 104 can avoid the placement of the alignment mark on the electrode layer 112. The situation of the alignment mark cannot be detected.
為了清楚說明本實施例之觸控面板結構,請參考第5圖,且一併參考第4圖。第5圖為本發明第一較佳實施例之觸控面板之上視示意圖。如第4圖與第5圖所示,觸控面板100包括透明基板108、遮光層110、電極層112、電路模組102以及電路板114,其中透明基板108具有顯示區108a以及圍繞顯示區108a之週邊區108b。透明基板108係作為製作觸控面板100之電路元件之基板,且為了具有良好的透光效果,透明基板108可由例如玻璃或塑膠等透明材料所構成,但不限於此。於本實施例中,遮光層110設於週邊區108b之透明基板108之一側,且電路模組102設於週邊區108b之遮光層110相對於透明基板108之另一側。電極層112設於週邊區108b之遮光層110與電路模組102之間,且可延伸至顯示區108a之透明基板108上,以用於感測一物體碰觸顯示區108b之觸控面板100,而產生一觸碰訊號。並且,電路模組102電性連接電極層112,且電路板114設於電極層112上,並電性連接至電路模組102,以用於將電極層112所感測到之觸控訊號傳遞至顯示面板或一控制單元。In order to clearly explain the structure of the touch panel of this embodiment, please refer to FIG. 5 and refer to FIG. 4 together. FIG. 5 is a top plan view of a touch panel according to a first preferred embodiment of the present invention. As shown in FIG. 4 and FIG. 5 , the touch panel 100 includes a transparent substrate 108 , a light shielding layer 110 , an electrode layer 112 , a circuit module 102 , and a circuit board 114 . The transparent substrate 108 has a display area 108 a and a surrounding display area 108 a . The peripheral area 108b. The transparent substrate 108 is used as a substrate for fabricating the circuit elements of the touch panel 100, and the transparent substrate 108 may be formed of a transparent material such as glass or plastic in order to have a good light transmission effect, but is not limited thereto. In this embodiment, the light shielding layer 110 is disposed on one side of the transparent substrate 108 of the peripheral region 108b, and the circuit module 102 is disposed on the other side of the light shielding layer 110 of the peripheral region 108b with respect to the transparent substrate 108. The electrode layer 112 is disposed between the light shielding layer 110 of the peripheral region 108b and the circuit module 102, and extends to the transparent substrate 108 of the display area 108a for sensing the touch panel 100 of an object touching the display area 108b. , and generate a touch signal. The circuit module 102 is electrically connected to the electrode layer 112, and the circuit board 114 is disposed on the electrode layer 112 and electrically connected to the circuit module 102 for transmitting the touch signal sensed by the electrode layer 112 to Display panel or a control unit.
此外,遮光層110之遮光部110a係圍繞顯示區108a,以用於遮蔽位於週邊區108b之電路模組102,且遮光部110a具有一內側邊116以及一外側邊118。為了使遮光部110b有效地遮蔽週邊區108b之顯示面板與觸控面板100的電路元件,遮光部100b之外側邊118較佳與透明基板108之側邊相切齊。此外,各對位部110b係與遮光部110之內側邊116相連接,以用於定位遮光層110之位置。換句話說,各對位部110b係從遮光部110a之內側邊116朝顯示區108a突出,使對位部110b可分別被圖像感測裝置104偵測到,並透過偵測出對位部110b之位置,來定位出設於遮光層110上之電極層112的位置。於本實施例中,此二對位部110b沿著第一方向120排列,並具有第二中心點110c,且第一中心點102與第二中心點110c位於垂直第一方向120之第二方向122上。但本發明對位部110b之數量並不限為兩個,亦可為複數個,且兩兩為一組,各組對位部110b係對應於各銲墊112a。另外,遮光層110可由例如黑色光阻等不透明材料所構成,但不限於此,且各對位部110b之形狀可為例如長方形、三角形、圓形或波浪形等幾何形狀,以利於圖像感測裝置104辨識。In addition, the light shielding portion 110a of the light shielding layer 110 surrounds the display area 108a for shielding the circuit module 102 located in the peripheral area 108b, and the light shielding portion 110a has an inner side 116 and an outer side 118. In order for the light shielding portion 110b to effectively shield the display panel of the peripheral region 108b from the circuit components of the touch panel 100, the outer side 118 of the light shielding portion 100b is preferably aligned with the side of the transparent substrate 108. In addition, each of the alignment portions 110b is connected to the inner side 116 of the light shielding portion 110 for positioning the position of the light shielding layer 110. In other words, each of the alignment portions 110b protrudes from the inner side 116 of the light shielding portion 110a toward the display region 108a, so that the alignment portion 110b can be detected by the image sensing device 104, respectively, and the alignment is detected. The position of the portion 110b positions the position of the electrode layer 112 provided on the light shielding layer 110. In this embodiment, the two alignment portions 110b are arranged along the first direction 120 and have a second center point 110c, and the first center point 102 and the second center point 110c are located in the second direction perpendicular to the first direction 120. 122. However, the number of the alignment portions 110b of the present invention is not limited to two, and may be plural, and two or two are a group, and each of the alignment portions 110b corresponds to each of the pads 112a. In addition, the light shielding layer 110 may be formed of an opaque material such as a black photoresist, but is not limited thereto, and the shape of each of the alignment portions 110b may be a geometric shape such as a rectangle, a triangle, a circle, or a wave to facilitate an image sense. The measuring device 104 recognizes.
於本實施例中,電極層112之銲墊112a係沿著第一方向120排列,且各銲墊112a具有二長邊124與二短邊126,並具有第三中心點128。其中,短邊126係平行於第一方向120,且長邊124平行於第二方向122,使各銲墊112a之長邊124垂直於第一方向120。但本發明之第二方向122並不限於垂直於第一方向120,且本發明之短邊126亦不限於平行於第一方向120,亦即各銲墊112a之短邊126不限於平行於對位部110b之排列方向。值得注意的是,本實施例之第二中心點110c係與第三中心點128沿著第二方向122排列,使電路模組102於定位對位圖案102a之第一中心點102b與對位部110b之第二中心點110c之後僅需移動第二方向122上之距離即可銲接於銲墊112a上,藉此可降低移動電路模組102之誤差,進而更精確地將電路模組102銲接於銲墊112a上。並且,由於平行於第二方向122之長邊124大於平行於第一方向120之短邊126,因此各銲墊112a於第二方向122上之寬度可容許電路模組102具有較大之位移誤差,藉此可降低將電路模組102銲接於銲墊112a上之不良率。此外,本實施例之電極層112可由例如氧化銦鋅或氧化銦錫等透明導電材料所構成,但不以此為限。本實施例之電路模組102係為驅動電路晶片,且對位圖案102a係位於電路模組102面對遮光層110之表面,亦即電路模組102之下表面,使圖像感測裝置104可藉由偵測對位圖案102a之位置來定位出電路模組102之位置。本發明之電路模組102並不限為驅動電路晶片,亦可為電路板,用於將電極層112所感測到之訊號傳遞至外界。另外,遮光部110a之內側邊116可區分為平行於第一方向120之長內側邊116a與平行於第二方向122之短內側邊116b。並且,對位部110b係連接於遮光部110a之長內側邊116a,且但本發明之對位部110b並不限於連接於長內側邊116a,亦可連接於短內側邊116b,而沿著第二方向122排列,或者設於遮光部110a之內側邊116之任一處。本發明之長內側邊116a與短內側邊116b並不限於分別平行於第一方向120與第二方向122,反之亦可。In the present embodiment, the pads 112a of the electrode layer 112 are arranged along the first direction 120, and each pad 112a has two long sides 124 and two short sides 126 and has a third center point 128. The short side 126 is parallel to the first direction 120, and the long side 124 is parallel to the second direction 122 such that the long side 124 of each pad 112a is perpendicular to the first direction 120. However, the second direction 122 of the present invention is not limited to being perpendicular to the first direction 120, and the short side 126 of the present invention is not limited to being parallel to the first direction 120, that is, the short side 126 of each pad 112a is not limited to being parallel to the pair. The arrangement direction of the bit portions 110b. It should be noted that the second center point 110c of the embodiment is aligned with the third center point 128 along the second direction 122, so that the circuit module 102 is positioned at the first center point 102b and the alignment portion of the alignment pattern 102a. The second center point 110c of 110b can be soldered to the pad 112a only after moving the distance in the second direction 122, thereby reducing the error of the mobile circuit module 102, thereby more accurately soldering the circuit module 102 to the circuit module 102. On the pad 112a. Moreover, since the long side 124 parallel to the second direction 122 is larger than the short side 126 parallel to the first direction 120, the width of each of the pads 112a in the second direction 122 allows the circuit module 102 to have a large displacement error. Thereby, the defect rate of soldering the circuit module 102 to the pad 112a can be reduced. In addition, the electrode layer 112 of the present embodiment may be formed of a transparent conductive material such as indium zinc oxide or indium tin oxide, but is not limited thereto. The circuit module 102 of the present embodiment is a driving circuit chip, and the alignment pattern 102a is located on the surface of the circuit module 102 facing the light shielding layer 110, that is, the lower surface of the circuit module 102, so that the image sensing device 104 The position of the circuit module 102 can be located by detecting the position of the alignment pattern 102a. The circuit module 102 of the present invention is not limited to a driving circuit chip, and may also be a circuit board for transmitting signals sensed by the electrode layer 112 to the outside. In addition, the inner side 116 of the light shielding portion 110a can be divided into a long inner side 116a parallel to the first direction 120 and a short inner side 116b parallel to the second direction 122. Further, the alignment portion 110b is connected to the long inner side 116a of the light shielding portion 110a, but the alignment portion 110b of the present invention is not limited to being connected to the long inner side 116a, but may be connected to the short inner side 116b. Arranged along the second direction 122 or at any of the inner sides 116 of the light shielding portion 110a. The long inner side 116a and the short inner side 116b of the present invention are not limited to being parallel to the first direction 120 and the second direction 122, respectively, or vice versa.
由上述可知,由於在定位觸控基板106之步驟時,遮光層110會位於電極層112與圖像感測裝置104之間,使圖像感測裝置104無法偵測到設置在電極層112之對位標記,因此本實施例觸控面板100之遮光層110因具有至少二對位部110b突出於遮光部110a,使對位部110b可分別被圖像感測裝置104辨識。藉此,各銲墊112a可藉由定位出遮光層110之對位部110b後而被定位出,以進一步將電路模組102銲接於銲墊112a上。As can be seen from the above, the light shielding layer 110 is located between the electrode layer 112 and the image sensing device 104 during the step of positioning the touch substrate 106, so that the image sensing device 104 cannot detect the electrode layer 112. Therefore, the light shielding layer 110 of the touch panel 100 of the present embodiment has the at least two alignment portions 110b protruding from the light shielding portion 110a, so that the alignment portion 110b can be recognized by the image sensing device 104, respectively. Thereby, each of the pads 112a can be positioned by positioning the alignment portion 110b of the light shielding layer 110 to further solder the circuit module 102 to the pad 112a.
本發明之觸控面板並不以上述實施例為限。下文將繼續揭示本發明之其它實施例或變化形,然為了簡化說明並突顯各實施例或變化形之間的差異,下文中使用相同標號標注相同元件,並不再對重覆部分作贅述。The touch panel of the present invention is not limited to the above embodiment. The other embodiments and variations of the present invention are described in the following, and the same reference numerals will be used to refer to the same elements, and the repeated parts will not be described again.
請參考第6圖,第6圖為本發明第二較佳實施例之觸控面板之剖面示意圖。如第6圖所示,相較於第一實施例,本實施例之觸控面板200之遮光層202係設於週邊區108b之透明基板108相對於電路模組102之另一側,使透明基板108位於遮光層202與電路模組102之間,且電極層112係直接與透明基板108相接觸。Please refer to FIG. 6. FIG. 6 is a cross-sectional view of a touch panel according to a second preferred embodiment of the present invention. As shown in FIG. 6 , the light-shielding layer 202 of the touch panel 200 of the present embodiment is disposed on the other side of the transparent substrate 108 of the peripheral region 108 b relative to the circuit module 102 to be transparent. The substrate 108 is located between the light shielding layer 202 and the circuit module 102, and the electrode layer 112 is directly in contact with the transparent substrate 108.
根據上述實施例之觸控面板,本發明提供一種觸控顯示裝置。請參考第7圖,第7圖為本發明一較佳實施例之觸控顯示裝置之剖面示意圖。如第7圖所示,觸控顯示裝置300包括顯示面板302、觸控面板100以及透明膠304。顯示面板302具有顯示區302a以及圍繞顯示區302a之週邊區302b,且顯示面板302之顯示區302a係對應於觸控面板100之顯示區108a,且顯示面板302之週邊區302b對應於觸控面板100之週邊區108b,使觸控面板100之遮光層110可遮蔽顯示面板302之周邊電路,並且顯示面板302所顯示之畫面不會受到觸控面板100的電路元件所遮蔽。其中顯示面板302包括彩色濾光片基板306、陣列基板308以及液晶層310,且彩色濾光片基板306係與陣列基板308相對設置,而液晶層310設於彩色濾光片基板306與陣列基板308之間。觸控面板100係設於顯示面板302之一側,且對應顯示面板302設置,其中觸控面板100之遮光層110、電極層112、電路模組102以及電路板114係設於透明基板108與顯示面板302之間,使透明基板108可作為保護觸控面板100之遮光層110、電極層112、電路模組102以及電路板114的基板。並且,透明膠304設於觸控面板100與顯示面板302之間,用以結合觸控面板100與顯示面板302。透明膠304可為光學透明膠(optical clear adhesive,OCA),以避免顯示面板302所顯示之畫面亮度受到影響,但不限於此。此外,本發明之觸控顯示裝置之觸控面板不限為上述第一實施例之觸控面板100,亦可為上述第二實施例之觸控面板200。According to the touch panel of the above embodiment, the present invention provides a touch display device. Please refer to FIG. 7. FIG. 7 is a cross-sectional view of a touch display device according to a preferred embodiment of the present invention. As shown in FIG. 7 , the touch display device 300 includes a display panel 302 , a touch panel 100 , and a transparent adhesive 304 . The display panel 302 has a display area 302a and a peripheral area 302b surrounding the display area 302a, and the display area 302a of the display panel 302 corresponds to the display area 108a of the touch panel 100, and the peripheral area 302b of the display panel 302 corresponds to the touch panel. In the peripheral area 108b of the 100, the light shielding layer 110 of the touch panel 100 can shield the peripheral circuit of the display panel 302, and the screen displayed by the display panel 302 is not blocked by the circuit components of the touch panel 100. The display panel 302 includes a color filter substrate 306, an array substrate 308, and a liquid crystal layer 310. The color filter substrate 306 is disposed opposite to the array substrate 308, and the liquid crystal layer 310 is disposed on the color filter substrate 306 and the array substrate. Between 308. The touch panel 100 is disposed on one side of the display panel 302 and is disposed on the display panel 302. The light shielding layer 110, the electrode layer 112, the circuit module 102, and the circuit board 114 of the touch panel 100 are disposed on the transparent substrate 108. Between the display panels 302, the transparent substrate 108 can serve as a substrate for protecting the light shielding layer 110, the electrode layer 112, the circuit module 102, and the circuit board 114 of the touch panel 100. The transparent adhesive 304 is disposed between the touch panel 100 and the display panel 302 for combining the touch panel 100 and the display panel 302. The transparent adhesive 304 may be an optical clear adhesive (OCA) to prevent the brightness of the screen displayed by the display panel 302 from being affected, but is not limited thereto. In addition, the touch panel of the touch display device of the present invention is not limited to the touch panel 100 of the first embodiment, and may be the touch panel 200 of the second embodiment.
綜上所述,本發明於觸控面板之遮光層設置至少二對位部,使對位部在定位觸控基板時可分別被圖像感測裝置辨識,進而定位出位於遮光層相對於圖像感測裝置之另一側的各銲墊,以進一步將電路模組精確地銲接於銲墊上。In summary, the present invention provides at least two alignment portions on the light shielding layer of the touch panel, so that the alignment portion can be separately recognized by the image sensing device when positioning the touch substrate, thereby positioning the light shielding layer relative to the image. The pads on the other side of the sensing device are used to further accurately solder the circuit module to the pad.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10...觸控感測基板10. . . Touch sensing substrate
12...透明基板12. . . Transparent substrate
12a...顯示區12a. . . Display area
12b...週邊區12b. . . Surrounding area
14...觸控電極層14. . . Touch electrode layer
16...驅動電路晶片16. . . Drive circuit chip
18...軟性電路板18. . . Flexible circuit board
20...第一對位圖案20. . . First alignment pattern
22...圖像感測裝置twenty two. . . Image sensing device
100...觸控面板100. . . Touch panel
102...電路模組102. . . Circuit module
102a...對位圖案102a. . . Alignment pattern
102b...第一中心點102b. . . First center point
104...圖像感測裝置104. . . Image sensing device
106...觸控基板106. . . Touch substrate
108...透明基板108. . . Transparent substrate
108a...顯示區108a. . . Display area
108b...週邊區108b. . . Surrounding area
110...遮光層110. . . Shading layer
110a...遮光部110a. . . Shading
110b...對位部110b. . . Counterpoint
110c...第二中心點110c. . . Second center point
112...電極層112. . . Electrode layer
112a...銲墊112a. . . Solder pad
114...電路板114. . . Circuit board
116...內側邊116. . . Medial side
116a...長內側邊116a. . . Long inside side
116b...短內側邊116b. . . Short inner side
118...外側邊118. . . Outer side
120...第一方向120. . . First direction
122...第二方向122. . . Second direction
124...長邊124. . . The long side
126...短邊126. . . Short side
128...第三中心點128. . . Third center point
200...觸控面板200. . . Touch panel
202...遮光層202. . . Shading layer
300...觸控顯示裝置300. . . Touch display device
302...顯示面板302. . . Display panel
302a...顯示區302a. . . Display area
302b...週邊區302b. . . Surrounding area
304...透明膠304. . . Transparent glue
306...彩色濾光片基板306. . . Color filter substrate
308...陣列基板308. . . Array substrate
310...液晶層310. . . Liquid crystal layer
第1圖為習知觸控感測基板之剖面示意圖。FIG. 1 is a schematic cross-sectional view of a conventional touch sensing substrate.
第2圖至第4圖為本發明一較佳實施例之觸控面板之製作方法示意圖。2 to 4 are schematic views showing a method of fabricating a touch panel according to a preferred embodiment of the present invention.
第5圖為本發明第一較佳實施例之觸控面板之上視示意圖。FIG. 5 is a top plan view of a touch panel according to a first preferred embodiment of the present invention.
第6圖為本發明第二較佳實施例之觸控面板之剖面示意圖。FIG. 6 is a cross-sectional view of a touch panel according to a second preferred embodiment of the present invention.
第7圖為本發明一較佳實施例之觸控顯示裝置之剖面示意圖。FIG. 7 is a cross-sectional view of a touch display device according to a preferred embodiment of the present invention.
100...觸控面板100. . . Touch panel
102...電路模組102. . . Circuit module
102a...對位圖案102a. . . Alignment pattern
102b...第一中心點102b. . . First center point
108a...顯示區108a. . . Display area
108b...週邊區108b. . . Surrounding area
110a...遮光部110a. . . Shading
110b...對位部110b. . . Counterpoint
110c...第二中心點110c. . . Second center point
112...電極層112. . . Electrode layer
112a...銲墊112a. . . Solder pad
114...電路板114. . . Circuit board
116...內側邊116. . . Medial side
116a...長內側邊116a. . . Long inside side
116b...短內側邊116b. . . Short inner side
118...外側邊118. . . Outer side
120...第一方向120. . . First direction
122...第二方向122. . . Second direction
124...長邊124. . . The long side
126...短邊126. . . Short side
128...第三中心點128. . . Third center point
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TW100109412A TWI452386B (en) | 2011-03-18 | 2011-03-18 | Touch display device, touch panel and manufacturing method thereof |
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TWI579745B (en) * | 2015-10-21 | 2017-04-21 | 宸鴻科技(廈門)有限公司 | Touch panel and method of manufacturing the same |
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TWI452554B (en) | 2012-02-29 | 2014-09-11 | Au Optronics Corp | Touch panel﹑touch display device and assembling method thereof |
TWI476459B (en) | 2012-05-03 | 2015-03-11 | Innocom Tech Shenzhen Co Ltd | A color filter substrate, and a touch screen display device |
CN103576951B (en) * | 2012-07-24 | 2016-12-28 | 宸鸿科技(厦门)有限公司 | Contact panel, its manufacture method and display device thereof |
US9542018B2 (en) | 2012-11-12 | 2017-01-10 | Htc Corporation | Touch panel and electronic apparatus |
CN103064572B (en) * | 2012-12-31 | 2016-07-06 | 深圳莱宝高科技股份有限公司 | Touching display screen and preparation method thereof |
TWI499951B (en) * | 2013-08-06 | 2015-09-11 | Innolux Corp | Touch display device and method of bonding alignment thereof |
CN104345946B (en) * | 2013-08-06 | 2017-08-29 | 群创光电股份有限公司 | Touch control display apparatus and its alignment methods |
CN104423666B (en) * | 2013-08-30 | 2017-09-12 | 宸鸿科技(厦门)有限公司 | Contact panel |
CN111489656B (en) * | 2020-04-26 | 2022-07-05 | 上海天马微电子有限公司 | Display device alignment method and display device |
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CN102221928B (en) | 2013-01-30 |
CN102221928A (en) | 2011-10-19 |
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