TWI381922B - Cutting apparatus - Google Patents

Cutting apparatus Download PDF

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TWI381922B
TWI381922B TW98109848A TW98109848A TWI381922B TW I381922 B TWI381922 B TW I381922B TW 98109848 A TW98109848 A TW 98109848A TW 98109848 A TW98109848 A TW 98109848A TW I381922 B TWI381922 B TW I381922B
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Taiwan
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cutting
stage
ceramic laminate
edge
target
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TW98109848A
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Chinese (zh)
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TW201008739A (en
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Dong Joo Shin
Jeong Min Cho
Young Woo Lee
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Samsung Electro Mech
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Priority claimed from KR1020080085463A external-priority patent/KR20100026449A/en
Priority claimed from KR1020080100774A external-priority patent/KR101004884B1/en
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201008739A publication Critical patent/TW201008739A/en
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Publication of TWI381922B publication Critical patent/TWI381922B/en

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Description

切割裝置Cutting device [優先權之主張][Priority claim]

本申請案主張於2008年8月29日向韓國智慧財產局所提出之韓國專利申讀案第2008-85463號,和2008年10月14日提出之韓國專利申請案第2008-10074號之優先權,該等案揭示之內容加入本案作為參考。The present application claims priority to Korean Patent Application No. 2008-85463, filed on Jan. 29, 2008 to the Korean Intellectual Property Office, and Korean Patent Application No. 2008-10074, filed on Oct. 14, 2008. The contents disclosed in these cases are added to the case for reference.

本發明係關於切割裝置,尤係關於藉由切割陶瓷層壓板而製造晶片組件之切割裝置。This invention relates to cutting devices, and more particularly to cutting devices for fabricating wafer assemblies by cutting ceramic laminates.

藉由堆疊複數個各包含內部電極之陶瓷片而製成陶瓷層壓板。陶瓷層壓板被切割成預定尺寸之晶片組件。最近,應付電子組件之小型化和多重功能,晶片組件已透過薄化和高度層壓而實現高容量和高性能。A ceramic laminate is produced by stacking a plurality of ceramic sheets each containing internal electrodes. The ceramic laminate is cut into wafer components of a predetermined size. Recently, in response to the miniaturization and multi-function of electronic components, wafer components have achieved high capacity and high performance through thinning and high lamination.

相關技術切割裝置藉由施加垂直於陶瓷層壓板之力沿著預定的切割路徑切割陶瓷層壓板。A related art cutting device cuts a ceramic laminate along a predetermined cutting path by applying a force perpendicular to the ceramic laminate.

然而,若配置陶瓷層壓板實現高容量和高性能,則相關技術切割裝置切割陶瓷層壓板需要較切割其他裝置為大的力。此情況造成諸多限制,可以例示如下。However, if a ceramic laminate is configured to achieve high capacity and high performance, the related art cutting device requires a large force to cut the ceramic laminate than to cut other devices. This situation creates a number of limitations and can be exemplified below.

現有的用來製造陶瓷層壓板之絲網印法(screen printing method)於施行相同尺寸之晶片組件高容量方面具有限制。對於此原因,使用一種技術,藉由使用真空裝備於薄膜而薄化內部電極。於此技術,透過具有電極圖案之遮罩而於真空室中形成Ni薄膜電極。然而,相關技術切割裝置不提供足夠的力以適當地切割由上述技術製造之陶瓷層壓板。Existing screen printing methods for fabricating ceramic laminates have limitations in performing high capacity of wafer assemblies of the same size. For this reason, a technique is used to thin the internal electrodes by using a vacuum to mount the film. In this technique, a Ni thin film electrode is formed in a vacuum chamber through a mask having an electrode pattern. However, the related art cutting device does not provide sufficient force to properly cut the ceramic laminate manufactured by the above technique.

因此,使用相關技術切割裝置切割陶瓷層壓板也許對於陶瓷層壓板造成切割缺陷,或者造成由切割陶瓷層壓板所形成之晶片組件破碎。Thus, cutting a ceramic laminate using a related art cutting device may cause cutting defects to the ceramic laminate or cause breakage of the wafer assembly formed by cutting the ceramic laminate.

而且,因為亦施加很大的力於正在切割陶瓷層壓板之切割裝置,因此切割裝置之切割刀刃容易受損並且因此需要經常的替換。結果,產生顯著的經濟上之損失,因此需要一種用來解決這些限制之技術。Moreover, since a large force is also applied to the cutting device that is cutting the ceramic laminate, the cutting edge of the cutting device is easily damaged and thus requires frequent replacement. As a result, significant economic losses are incurred, and a technique for addressing these limitations is needed.

本發明之態樣提供切割裝置,用來從陶瓷層壓板之一邊漸漸沿著直線路徑切割該陶瓷層壓板。Aspects of the invention provide a cutting device for progressively cutting a ceramic laminate from one side of a ceramic laminate along a linear path.

依照本發明之態樣,提供切割裝置包含:移動部可以移動朝向待被切割之目標物;切割部安裝於該移動部連同該移動部一起操作;以及傾斜部可使該切割部與該目標物之間逐漸地產生接觸,而使得該目標物逐漸地從一個邊緣朝向另一個邊緣被切割。According to an aspect of the invention, there is provided a cutting apparatus comprising: a moving portion movable toward a target to be cut; a cutting portion mounted on the moving portion to operate together with the moving portion; and a tilting portion enabling the cutting portion and the target The contact is gradually generated between the objects such that the object is gradually cut from one edge toward the other.

傾斜部可以包含具有二端分別固定於該移動部和該切割部之連接部,該連接部提供該切割部切割該目標物之力。The inclined portion may include a connecting portion having two ends fixed to the moving portion and the cutting portion, the connecting portion providing a force for the cutting portion to cut the target.

切割部可以包含:刀刃保持器,具有一側可以旋轉地固定於該移動部,而另一側可以與該移動部分離;以及刀刃,固定於該刀刃保持器以切割該目標物。The cutting portion may include a blade holder having one side rotatably fixed to the moving portion and the other side separable from the moving portion, and a blade fixed to the blade holder to cut the target.

刀刃可以具有一個邊緣,用作為切割邊緣,並且具有矩型的形狀,而該刀刃保持器可以包含:固定部,固定面對該切割邊緣之邊緣,並且具有一側固定於該移動部;以及支撐部,固定於該刀刃之二側。The blade may have an edge for use as a cutting edge and has a rectangular shape, and the blade holder may include: a fixing portion fixed to an edge of the cutting edge, and having one side fixed to the moving portion; and a support The part is fixed to the two sides of the blade.

切割部可以包含旋轉樞紐以可旋轉方式固定於刀刃保持器和移動部。The cutting portion may include a rotary hinge rotatably secured to the blade holder and the moving portion.

切割部可以包含彈性構件提供彈力於該切割部。The cutting portion may include an elastic member to provide an elastic force to the cutting portion.

移動部於一側可以包含停止器限制切割部之旋轉角度。The moving portion may include a stopper on one side to limit the rotation angle of the cutting portion.

傾斜部可以包含:裝配以安置目標物之台級;支撐該台級之台級支撐物;以及設於該台級與該台級支撐物之間並且傾斜該台級以使該切割部逐漸地從一個邊緣至另一個邊緣切割該目標物之彈性構件。The inclined portion may include: a stage that is assembled to position the target; a stage support that supports the stage; and is disposed between the stage and the stage support and tilts the stage to gradually gradually cut the part The elastic member of the target is cut from one edge to the other.

台級支撐物可以在側部具有安裝槽,該安裝槽收容該彈性構件之一端。The stage support may have a mounting groove at a side that receives one end of the elastic member.

該台級可以包含真空部在台級接觸目標物之表面形成真空以固定該目標物。The stage may include a vacuum portion to form a vacuum at a surface of the stage contacting the target to fix the target.

該台級可以包含位置固定夾接觸該目標物之一側以固定該目標物。The stage may include a position fixing clip contacting one side of the target to fix the target.

切割裝置可以復包含設於該目標物與該台級之間之泡棉雙面膠帶(foaming tape),以防止該目標物當被切割時移動。The cutting device may further comprise a foaming tape disposed between the target and the stage to prevent the target from moving when being cut.

切割裝置之切割部可以包含安裝於該移動部與該移動部操作,並且於一個邊緣具有切割邊緣之刀刃。The cutting portion of the cutting device may include a blade that is mounted to the moving portion and operates with the cutting portion and has a cutting edge at one edge.

現在將參照所附圖式詳細說明本發明之範例實施例。Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

第1圖為依照本發明之範例實施例切割裝置之透視圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a cutting apparatus in accordance with an exemplary embodiment of the present invention.

參照第1圖,依照本發明之範例實施例之切割裝置包含移動部110、切割部120、和連接部130。Referring to FIG. 1, a cutting apparatus according to an exemplary embodiment of the present invention includes a moving portion 110, a cutting portion 120, and a connecting portion 130.

移動部110設計成可相關於陶瓷層壓板100放置於其上之台座垂直移動。於第1圖中,撞桿112安裝在移動部110上移動該移動部110向上和向下,但是可以設計其他的裝置來移動該移動部110。The moving portion 110 is designed to be vertically movable with respect to the pedestal on which the ceramic laminate 100 is placed. In FIG. 1, the striker 112 is mounted on the moving portion 110 to move the moving portion 110 upward and downward, but other means may be designed to move the moving portion 110.

移動部110包含設在一側之停止器114。The moving unit 110 includes a stopper 114 provided on one side.

停止器114突出於移動部110之側表面,並且緊密附接於切割部120之刀刃保持器124。當切割部120切割該陶瓷層壓板100時,停止器114防止切割部120被推向高於預定高度之位置。The stopper 114 protrudes from the side surface of the moving portion 110 and is closely attached to the blade holder 124 of the cutting portion 120. When the cutting portion 120 cuts the ceramic laminate 100, the stopper 114 prevents the cutting portion 120 from being pushed to a position higher than a predetermined height.

當移動部110下降時,停止器114送出移動部110之下降力至切割部120,使得刀刃122能夠切割陶瓷層壓板100。When the moving portion 110 is lowered, the stopper 114 sends the downward force of the moving portion 110 to the cutting portion 120, so that the blade 122 can cut the ceramic laminate 100.

移動部110包含收容槽116用來收容連接部130。此處,連接部130用來防止切割部120之自由旋轉部較離開移動部110之預定的距離更間隔開。The moving portion 110 includes a receiving groove 116 for receiving the connecting portion 130. Here, the connecting portion 130 serves to prevent the free rotating portion of the cutting portion 120 from being spaced apart from the predetermined distance from the moving portion 110.

雖然被切割之目標物說明為陶瓷層壓板100,但是本發明並不限於此陶瓷層壓板100。藉由依照本發明之切割裝置可以切割各種的目標物。Although the object to be cut is illustrated as the ceramic laminate 100, the present invention is not limited to this ceramic laminate 100. Various objects can be cut by the cutting device according to the present invention.

切割部120以可旋轉之方式安裝於移動部110以切割陶瓷層壓板100,並且包含刀刃122、刀刃保持器124、和旋轉樞紐128。The cutting portion 120 is rotatably mounted to the moving portion 110 to cut the ceramic laminate 100, and includes a cutting edge 122, a blade holder 124, and a rotating hinge 128.

刀刃122透過刀刃保持器124安裝於移動部110,並且具有底部邊緣用作為切割邊緣123。The blade 122 is mounted to the moving portion 110 through the blade holder 124 and has a bottom edge as the cutting edge 123.

刀刃122具有矩型形狀,而除了底部邊緣外之所有的邊緣由刀刃保持器124所環繞。The blade 122 has a rectangular shape, and all edges except the bottom edge are surrounded by the blade holder 124.

刀刃保持器124保持刀刃122於其下方表面,並且具有一個側表面藉由旋轉樞紐128以可旋轉之方式安裝於該移動部110之側表面。於是,刀刃122亦能夠繞著相同的旋轉軸旋轉,因為其連同刀刃保持器124一起旋轉。The blade holder 124 holds the blade 122 on its lower surface and has a side surface rotatably mounted to the side surface of the moving portion 110 by the rotary hinge 128. Thus, the blade 122 can also rotate about the same axis of rotation as it rotates along with the blade holder 124.

刀刃保持器124包含固定部125和支撐部126。固定部125固定面對該刀刃122之切割邊緣123之刀刃122之一個邊緣,而支撐部126固定刀刃122之二個邊緣。The blade holder 124 includes a fixing portion 125 and a support portion 126. The fixing portion 125 is fixed to an edge of the cutting edge 122 facing the cutting edge 123 of the cutting edge 122, and the supporting portion 126 fixes the two edges of the cutting edge 122.

支撐部126可以長於切割邊緣123以先於該切割邊緣123接觸台座。於此情況載送膜放置在陶瓷層壓板100之下方,刀刃122藉由製造支撐部126長於切割邊緣123載送膜之高度而僅切割陶瓷層壓板100。The support portion 126 can be longer than the cutting edge 123 to contact the pedestal prior to the cutting edge 123. In this case, the carrier film is placed under the ceramic laminate 100, and the blade 122 cuts only the ceramic laminate 100 by manufacturing the support portion 126 longer than the height at which the cutting edge 123 carries the film.

旋轉樞紐128通過固定部125之側表面,並且安裝於移動部110。於是,旋轉樞紐128繞著該旋轉軸旋轉該固定部125。然而,本發明並不限於旋轉樞紐,以及可以使用可使固定部125旋轉之各種方法。The rotary joint 128 passes through the side surface of the fixing portion 125 and is attached to the moving portion 110. Thus, the rotary joint 128 rotates the fixed portion 125 about the rotation axis. However, the present invention is not limited to the rotary hinge, and various methods that can rotate the fixed portion 125 can be used.

整個連接部130收容於移動部110之收容槽116內。連接部130具有一端連接至移動部110而另一端固定至切割部120。The entire connecting portion 130 is received in the receiving groove 116 of the moving portion 110. The connecting portion 130 has one end connected to the moving portion 110 and the other end fixed to the cutting portion 120.

如此一來,當切割部120放置高於台座位置時,切割部120藉由地心引力而繞著旋轉軸旋轉。於此情況,沒有連接部130,切割部120與移動部110間隔開,並且變成垂直於該移動部110。In this way, when the cutting portion 120 is placed higher than the pedestal position, the cutting portion 120 is rotated about the rotation axis by gravity. In this case, there is no connecting portion 130, and the cutting portion 120 is spaced apart from the moving portion 110 and becomes perpendicular to the moving portion 110.

然而,因為連接部130連接至該移動部110和切割部120,因此其防止切割部120間隔開多於預定的距離。However, since the connecting portion 130 is connected to the moving portion 110 and the cutting portion 120, it prevents the cutting portions 120 from being spaced apart by more than a predetermined distance.

連接部130包含彈性構件132,該彈性構件132提供彈力至切割部120而使得能夠切割陶瓷層壓板100之一部分。The connecting portion 130 includes an elastic member 132 that provides an elastic force to the cutting portion 120 to enable cutting of a portion of the ceramic laminate 100.

當切割部120之傾斜側較靠近於移動部110時,彈性構件132被壓縮,並因此提供彈力向下作用於該切割部120之傾斜側。When the inclined side of the cutting portion 120 is closer to the moving portion 110, the elastic member 132 is compressed, and thus the elastic force is applied downward to the inclined side of the cutting portion 120.

藉由此力量,從陶瓷層壓板100之邊緣部開始切割,並以直線方式漸漸繼續著。With this force, cutting is started from the edge portion of the ceramic laminate 100, and gradually continues in a straight line.

然而,連接部130不限於彈性構件132。能夠設計可以提供此種力之各種機制使用為連接部130。However, the connecting portion 130 is not limited to the elastic member 132. Various mechanisms capable of providing such a force can be designed to be used as the connecting portion 130.

第2至6圖為依照本發明之範例實施例切割裝置之側視圖,用來說明切割方法。2 through 6 are side views of a cutting device in accordance with an exemplary embodiment of the present invention for illustrating a cutting method.

參照第2至6圖,當切割裝置放置於陶瓷層壓板100之上時,可以藉由地心引力用旋轉樞紐128作用為旋轉軸而旋轉切割部120之一側,而切割部120之另一側繞著該旋轉軸向下旋轉。Referring to FIGS. 2 to 6, when the cutting device is placed on the ceramic laminate 100, one side of the cutting portion 120 can be rotated by the gravity pivoting hub 128 acting as a rotating shaft, and the other portion of the cutting portion 120 The side rotates downward about the axis of rotation.

於是,如第2圖所示,切割部120相關於移動部110放置,稍微傾斜。Then, as shown in Fig. 2, the cutting portion 120 is placed in relation to the moving portion 110, and is slightly inclined.

如第3圖所示,當移動部110藉由撞桿112向下移動時(參看第6圖中箭號),刀刃保持器124之旋轉側首先接觸該台座,然後陶瓷層壓板100之邊緣部(其靠近該旋轉側)接觸該刀刃122。As shown in Fig. 3, when the moving portion 110 is moved downward by the ram 112 (see the arrow in Fig. 6), the rotating side of the blade holder 124 first contacts the pedestal, and then the edge portion of the ceramic laminate 100 (which is close to the rotating side) contacts the cutting edge 122.

如第4圖所示,當移動部110進一步向下移動朝向陶瓷層壓板100時,用由彈性構件132所施加之彈力,刀刃122從陶瓷層壓板100與該刀刃122接觸之邊緣部開始切割。當移動部110進一步向下移動時,切割以直線方式逐漸進行著。As shown in Fig. 4, when the moving portion 110 is further moved downward toward the ceramic laminate 100, the blade 122 is cut from the edge portion where the ceramic laminate 100 contacts the blade 122 by the elastic force applied by the elastic member 132. When the moving portion 110 moves further downward, the cutting proceeds gradually in a straight line.

如第5圖所示,當刀刃122完全切割陶瓷層壓板100時,停止器114和刀刃保持器124彼此接觸以停止該移動部110。As shown in FIG. 5, when the blade 122 completely cuts the ceramic laminate 100, the stopper 114 and the blade holder 124 come into contact with each other to stop the moving portion 110.

其後,如第6圖所示,移動部110向上移動,完成切割操作,以及刀刃122返回至其初始位置。Thereafter, as shown in Fig. 6, the moving portion 110 moves upward, the cutting operation is completed, and the blade 122 returns to its original position.

若藉由使用現有的切割裝置切割陶瓷層壓板,則於陶瓷層壓板中也許發生切割缺陷,或者由切割陶瓷層壓板所獲得的晶片組件之表面也許破碎。而且,因為相當大的衝擊施加於切割裝置,因此切割裝置之刀刃也許損壞,以及也許由例如經常的替換刀刃而造成顯著的經濟損失。If the ceramic laminate is cut by using an existing cutting device, cutting defects may occur in the ceramic laminate, or the surface of the wafer assembly obtained by cutting the ceramic laminate may be broken. Moreover, because a relatively large impact is applied to the cutting device, the cutting edge of the cutting device may be damaged and may cause significant economic losses, for example, by frequent replacement of the cutting edge.

反之,依照現用之範例實施例之切割裝置,藉由使用以旋轉方式連接至移動部110之切割部120從陶瓷層壓板100之一個邊緣逐漸地切割該陶瓷層壓板100。此逐漸地切割較用單一切割動作切割陶瓷層壓板100需要較少之力。因此,依照本發明,陶瓷層壓板100能夠更容易被切割。On the contrary, according to the cutting device of the present exemplary embodiment, the ceramic laminate 100 is gradually cut from one edge of the ceramic laminate 100 by using the cutting portion 120 that is rotationally coupled to the moving portion 110. This progressive cutting requires less force than cutting the ceramic laminate 100 with a single cutting action. Therefore, according to the present invention, the ceramic laminate 100 can be cut more easily.

結果,能夠防止切割缺陷。因為較少衝擊施加於切割裝置之刀刃122,因此不需要經常替換受損之刀刃。於是,依照本發明之現用範例實施例之切割裝置被認為具有經濟效益。As a result, cutting defects can be prevented. Since less impact is applied to the cutting edge 122 of the cutting device, it is not necessary to replace the damaged cutting edge frequently. Thus, the cutting apparatus according to the present exemplary embodiment of the present invention is considered to be economical.

現將參照第7至12圖更詳細說明本發明之範例實施例。Exemplary embodiments of the present invention will now be described in more detail with reference to Figures 7 through 12.

第7圖為用來解釋依照本發明之另一範例實施例切割裝置之剖面圖。Figure 7 is a cross-sectional view for explaining a cutting device in accordance with another exemplary embodiment of the present invention.

第7圖之切割裝置包含移動部310、切割部320、和傾斜部325。The cutting device of Fig. 7 includes a moving portion 310, a cutting portion 320, and an inclined portion 325.

移動部310可以相關於陶瓷層壓板300放置於其上之台級330、和台級支撐部340垂直移動。於第7圖中,撞桿312安裝在移動部310上以向上和向下移動該移動部310。可以使用另一種裝置取代撞桿312以移動該移動部310。The moving portion 310 can be vertically moved in relation to the stage 330 on which the ceramic laminate 300 is placed, and the stage support portion 340. In FIG. 7, the striker 312 is mounted on the moving portion 310 to move the moving portion 310 upward and downward. The ram 312 can be replaced with another device to move the moving portion 310.

切割部320可移動朝向陶瓷層壓板300,並且用來切割陶瓷層壓板300。The cutting portion 320 can be moved toward the ceramic laminate 300 and used to cut the ceramic laminate 300.

切割部320包含刀刃322和刀刃保持器324。The cutting portion 320 includes a blade 322 and a blade holder 324.

刀刃322設置於移動部310,使得其切割邊緣323面對陶瓷層壓板300。刀刃322沿著切割路徑切割陶瓷層壓板。刀刃322可以具有六面體形狀,並且於其底部邊緣具有切割邊緣323。The blade 322 is disposed on the moving portion 310 such that its cutting edge 323 faces the ceramic laminate 300. The blade 322 cuts the ceramic laminate along the cutting path. The blade 322 may have a hexahedral shape and have a cutting edge 323 at its bottom edge.

刀刃保持器324覆蓋除了刀刃322之切割邊緣323外之每一個角落,並且直接接觸移動部310。The blade holder 324 covers each corner except the cutting edge 323 of the blade 322 and directly contacts the moving portion 310.

收容垂直於刀刃322之切割邊緣323之二個側邊緣之刀刃保持器324與切割邊緣323齊平,並且亦接觸泡棉雙面膠帶360。於是,刀刃322於切割陶瓷層壓板300後被防止進一步向下移動,並亦防止切割陶瓷層壓板300下方之泡棉雙面膠帶360。The blade holder 324, which receives the two side edges of the cutting edge 323 perpendicular to the cutting edge 322, is flush with the cutting edge 323 and also contacts the foam double-sided tape 360. Thus, the blade 322 is prevented from moving further downward after cutting the ceramic laminate 300, and also prevents the foamed double-sided tape 360 under the ceramic laminate 300 from being cut.

當傾斜部325傾斜台級330時,切割部320與陶瓷層壓板300之間能夠逐漸地產生接觸,而使得能夠逐漸地從一個邊緣至另一個邊緣切割陶瓷層壓板300。這裡的接觸可指當刀刃322來與陶瓷層壓板300接觸時被切割之部分。When the inclined portion 325 is inclined to the stage 330, the cutting portion 320 and the ceramic laminate 300 can be gradually brought into contact, so that the ceramic laminate 300 can be gradually cut from one edge to the other. Contact herein may refer to the portion that is cut when the blade 322 comes into contact with the ceramic laminate 300.

傾斜部325包含台級330、台級支撐部340和彈性構件350。The inclined portion 325 includes a stage 330, a stage support 340, and an elastic member 350.

陶瓷層壓板300設置於台級330上。於是,當切割部320向下移動和刀刃322接觸陶瓷層壓板300時開始切割。The ceramic laminate 300 is disposed on the stage 330. Thus, the cutting is started when the cutting portion 320 moves downward and the blade 322 contacts the ceramic laminate 300.

台級330放置在台級支撐部340上。台級330之一側固定於台級支撐部340以使得台級330將傾斜於該台級支撐部340之上。The stage 330 is placed on the stage support 340. One side of the stage 330 is fixed to the stage support 340 such that the stage 330 will be inclined above the stage support 340.

泡棉雙面膠帶360可以進一步設於台級330與陶瓷層壓板300之間。The foam double-sided tape 360 may be further disposed between the stage 330 and the ceramic laminate 300.

泡棉雙面膠帶360結合陶瓷層壓板300之底部以固定陶瓷層壓板300之位置。於是,若陶瓷層壓板300被縱長和交叉地切割,則泡棉雙面膠帶360防止陶瓷層壓板300之分離部分於台級330之表面上移位。A foam double sided tape 360 is bonded to the bottom of the ceramic laminate 300 to secure the position of the ceramic laminate 300. Thus, if the ceramic laminate 300 is longitudinally and cross-cut, the foam double-sided tape 360 prevents the separated portions of the ceramic laminate 300 from being displaced on the surface of the stage 330.

台級330可以包含真空部332。該真空部332於台級330表面接觸陶瓷層壓板300和泡棉雙面膠帶360處形成真空,藉此固定陶瓷層壓板300和泡棉雙面膠帶360於位置處。真空部332可以形成在台級330內部。Stage stage 330 can include a vacuum section 332. The vacuum portion 332 forms a vacuum at the surface of the stage 330 contacting the ceramic laminate 300 and the foam double-sided tape 360, thereby fixing the ceramic laminate 300 and the foam double-sided tape 360 at a position. The vacuum portion 332 may be formed inside the stage 330.

真空部332具有真空泵吸取於台級330之表面處之空氣,並且將該空氣排放至外部。藉由此種配置,吸入空氣之吸取力用來固定陶瓷層壓板300和泡棉雙面膠帶360於台級330之表面。The vacuum portion 332 has a vacuum pump that sucks air at the surface of the stage 330 and discharges the air to the outside. With this configuration, the suction force of the intake air is used to fix the ceramic laminate 300 and the foam double-sided tape 360 on the surface of the stage 330.

台級支撐部340支撐台級330於其上。台級330安裝在台級支撐部340之一側,使得台級330能被旋轉和傾斜。台級330和台級支撐部340可以藉由設置於一側之旋轉樞紐連接在一起。本發明不限於旋轉樞紐,可以使用各種的安裝結構。The stage support 340 supports the stage 330 thereon. The stage 330 is mounted on one side of the stage support 340 such that the stage 330 can be rotated and tilted. The stage 330 and the stage support 340 may be coupled together by a rotary hub disposed on one side. The invention is not limited to a rotary hub, and various mounting structures can be used.

台級支撐部340具有安裝槽342,彈性構件350之一端安裝於此安裝槽342中。藉由插入彈性構件350之一端於安裝槽342中而固定該彈性構件350。The stage support portion 340 has a mounting groove 342 into which one end of the elastic member 350 is mounted. The elastic member 350 is fixed by inserting one end of the elastic member 350 into the mounting groove 342.

安裝槽342具有足夠的深度,當彈性構件350藉由切割部320而被完全壓入於安裝槽342中時將該台級330水平定位。The mounting groove 342 has a sufficient depth to horizontally position the stage 330 when the elastic member 350 is fully pressed into the mounting groove 342 by the cutting portion 320.

彈性構件350之另一端固定以接觸台級330之底表面,並且被放置於台級330之側部。彈性構件350之一端插入於台級支撐部340之安裝槽342中。於是,當彈性構件350推台級330之側部向上時,台級330則傾斜。The other end of the resilient member 350 is fixed to contact the bottom surface of the stage 330 and is placed on the side of the stage 330. One end of the elastic member 350 is inserted into the mounting groove 342 of the stage support portion 340. Thus, when the side of the pusher stage 330 of the resilient member 350 is upward, the stage 330 is tilted.

具有彈力之彈簧可以使用為彈性構件350,但是可以使用能夠提供彈力之各種構件。可以根據彈性構件350之長度而設定台級330傾斜之角度,並且按照設計者之意思而改變。A spring having a spring force can be used as the elastic member 350, but various members capable of providing an elastic force can be used. The angle at which the stage 330 is tilted can be set according to the length of the elastic member 350, and varies according to the designer's intention.

第8和9圖為用來解釋第7圖之範例實施例之切割程序之剖面圖。Figures 8 and 9 are cross-sectional views for explaining the cutting procedure of the exemplary embodiment of Figure 7.

參照第8和9圖,如第7圖中所示之移動部310向下朝向陶瓷層壓板300移動,該陶瓷層壓板300由傾斜部325而傾斜預定之角度。Referring to Figures 8 and 9, the moving portion 310 as shown in Fig. 7 is moved downward toward the ceramic laminate 300, which is inclined by the inclined portion 325 by a predetermined angle.

當移動部310進一步向下移動時,陶瓷層壓板300之一個邊緣部分進入與待因此切割之刀刃322接觸。然後,陶瓷層壓板300沿著其切割路徑逐漸朝向另一個邊緣部分切割。When the moving portion 310 is further moved downward, one edge portion of the ceramic laminate 300 comes into contact with the blade 322 to be cut. Then, the ceramic laminate 300 is gradually cut along its cutting path toward the other edge portion.

當切割進行時,藉由移動部310之移動力壓縮該彈性構件350,以及台級330之傾斜角減少,而使得台級330漸漸變成水平。When the cutting is performed, the elastic member 350 is compressed by the moving force of the moving portion 310, and the inclination angle of the stage 330 is reduced, so that the stage 330 is gradually leveled.

如第9圖所示,當完成切割陶瓷層壓板300時,移動部310停止,而壓縮彈性構件350完全插入於台級支撐部340之安裝槽342中。於是,台級330緊密地附接於台級支撐部340並因此水平地放置。As shown in FIG. 9, when the cutting of the ceramic laminate 300 is completed, the moving portion 310 is stopped, and the compression elastic member 350 is completely inserted into the mounting groove 342 of the stage support portion 340. Thus, the stage 330 is closely attached to the stage support 340 and thus placed horizontally.

如此一來,陶瓷層壓板300由切割部320從一個邊緣被逐漸地切割。As a result, the ceramic laminate 300 is gradually cut from one edge by the cutting portion 320.

當移動部310沿著次一個切割路徑向上移動切割陶瓷層壓板300時,台級330藉由壓縮彈性構件350而回到初始傾斜位置,並且連續地執行次一個切割。When the moving portion 310 moves up the cutting ceramic laminate 300 along the next cutting path, the stage 330 returns to the initial inclined position by compressing the elastic member 350, and the next cutting is continuously performed.

依照現用之範例實施例之切割裝置因為彈性構件350支撐台級330之一側,因此從陶瓷層壓板300之一個邊緣逐漸地切割陶瓷層壓板300。因此,切割能夠較用單一切割動作切割陶瓷層壓板300需要較少之力,而因此能夠更容易切割陶瓷層壓板300。The cutting device according to the present exemplary embodiment gradually cuts the ceramic laminate 300 from one edge of the ceramic laminate 300 because the elastic member 350 supports one side of the stage 330. Therefore, the cutting can require less force than cutting the ceramic laminate 300 with a single cutting action, and thus the ceramic laminate 300 can be more easily cut.

依照現用之範例實施例之切割裝置能夠防止陶瓷層壓板之切割缺陷,譬如於陶瓷層壓板300上之切割缺陷或者破碎由切割陶瓷層壓板300所獲得之晶片組件,此情況也許在切割陶瓷層壓板300時立即發生。The cutting device according to the present exemplary embodiment can prevent cutting defects of the ceramic laminate, such as cutting defects on the ceramic laminate 300 or breaking the wafer assembly obtained by cutting the ceramic laminate 300, which may be in the case of cutting the ceramic laminate. 300 hours immediately occurred.

因為較少衝擊施加於切割裝置之刀刃322,因此不需要經常替換受損之刀刃。於是,依照本發明之現用實施範例之切割裝置被認為具有經濟效益。Since less impact is applied to the cutting edge 322 of the cutting device, it is not necessary to replace the damaged cutting edge frequently. Thus, the cutting apparatus according to the present embodiment of the present invention is considered to be economical.

第10圖為用來解釋依照本發明之又另一範例實施例切割裝置之圖示。第11和12圖為用來解釋第10圖之切割裝置之切割程序之圖示。Figure 10 is a diagram for explaining a cutting device in accordance with still another exemplary embodiment of the present invention. Figures 11 and 12 are diagrams for explaining the cutting procedure of the cutting device of Figure 10.

參照第10至12圖,切割裝置包含移動部410、切割部420、和傾斜部425。Referring to FIGS. 10 to 12, the cutting device includes a moving portion 410, a cutting portion 420, and a slope portion 425.

傾斜部425包含台級430、台級支撐部440和彈性構件450。The inclined portion 425 includes a stage 430, a stage support portion 440, and an elastic member 450.

陶瓷層壓板400設置於台級430上。當切割部420下降時台級430可使陶瓷層壓板400遇到刀刃422。台級430放置於台級支撐部440上,並且可傾斜地固定於台級支撐部440上。The ceramic laminate 400 is disposed on the stage 430. The stage 430 can cause the ceramic laminate 400 to encounter the cutting edge 422 as the cutting portion 420 descends. The stage 430 is placed on the stage support 440 and is tiltably fixed to the stage support 440.

泡棉雙面膠帶460可以進一步設於台級430與陶瓷層壓板400之間。The foam double-sided tape 460 may be further disposed between the stage 430 and the ceramic laminate 400.

泡棉雙面膠帶460結合陶瓷層壓板400之底部。若陶瓷層壓板400被縱長和交叉地切割,則泡棉雙面膠帶460防止陶瓷層壓板400之分離部分於台級430之表面上移位。The foam double sided tape 460 is bonded to the bottom of the ceramic laminate 400. If the ceramic laminate 400 is cut longitudinally and crosswise, the foam double-sided tape 460 prevents the separated portions of the ceramic laminate 400 from being displaced on the surface of the stage 430.

台級430可以包含位置固定夾432。Stage stage 430 can include position retaining clips 432.

位置固定夾432從台級430之頂部突出穿過泡棉雙面膠帶460,並且接觸陶瓷層壓板400之一側。The position fixing clip 432 protrudes from the top of the stage 430 through the foam double-sided tape 460 and contacts one side of the ceramic laminate 400.

當台級430藉由彈性構件450而傾斜時,陶瓷層壓板400可以沿著台級430向下滑動。於此情況,位置固定夾432接觸陶瓷層壓板400以防止陶瓷層壓板400向下滑動。When the stage 430 is tilted by the resilient member 450, the ceramic laminate 400 can slide down the stage 430. In this case, the position fixing clip 432 contacts the ceramic laminate 400 to prevent the ceramic laminate 400 from sliding downward.

彈性構件450之一端安裝於其中之安裝槽442設置於台級支撐部440中。彈性構件450插入並且固定於安裝槽442中。當彈性構件450藉由切割部420而被壓入時,彈性構件450完全壓入於安裝槽442內,而使得該台級430被水平放置。A mounting groove 442 in which one end of the elastic member 450 is mounted is disposed in the stage support portion 440. The elastic member 450 is inserted and fixed in the mounting groove 442. When the elastic member 450 is pressed in by the cutting portion 420, the elastic member 450 is completely pressed into the mounting groove 442, so that the stage 430 is placed horizontally.

彈性構件450之一端固定於台級430之側部,並且接觸台級430之底部。彈性構件450之另一端插入於台級支撐部440之安裝槽442中。One end of the elastic member 450 is fixed to the side of the stage 430 and contacts the bottom of the stage 430. The other end of the elastic member 450 is inserted into the mounting groove 442 of the stage support portion 440.

現用之實施例之移動部410和切割部420之詳細說明可予省略,因為他們與第7圖之實施例者實質上相同。Detailed descriptions of the moving portion 410 and the cutting portion 420 of the presently-used embodiment may be omitted since they are substantially the same as those of the embodiment of FIG.

如第10圖中所示,移動部410向下朝向由傾斜部425而傾斜預定角度之陶瓷層壓板400。As shown in FIG. 10, the moving portion 410 faces downward toward the ceramic laminate 400 which is inclined by a predetermined angle by the inclined portion 425.

當移動部410進一步向下移動時,刀刃422初始接觸並且切割陶瓷層壓板400之邊緣部分,並且沿著切割路徑繼續逐漸切割陶瓷層壓板400。When the moving portion 410 moves further downward, the blade 422 initially contacts and cuts the edge portion of the ceramic laminate 400, and continues to gradually cut the ceramic laminate 400 along the cutting path.

當切割進行時,藉由移動部410之移動力壓縮該彈性構件450,以及減少台級430之傾斜角,而使得台級430漸漸變成水平。When the cutting is performed, the elastic member 450 is compressed by the moving force of the moving portion 410, and the inclination angle of the stage 430 is reduced, so that the stage 430 is gradually leveled.

如第11和12圖所示,當完成切割陶瓷層壓板400時,移動部410停止移動,而壓縮彈性構件450被完全插入於台級支撐部440之安裝槽442中,使得台級430水平地接觸台級支撐部440。As shown in FIGS. 11 and 12, when the cutting of the ceramic laminate 400 is completed, the moving portion 410 stops moving, and the compression elastic member 450 is completely inserted into the mounting groove 442 of the stage support portion 440, so that the stage 430 is horizontally The stage level support portion 440 is contacted.

如此一來,依照現用之範例實施例之切割裝置藉由使用彈性構件450支撐台級430之一側,因此從陶瓷層壓板400之一個邊緣沿著切割路徑逐漸地切割陶瓷層壓板400。因此,此逐漸地切割較用單一切割動作切割該陶瓷層壓板400需要較少之力,而因此能夠更容易切割陶瓷層壓板。As such, the cutting device according to the present exemplary embodiment supports the one side of the stage 430 by using the elastic member 450, thereby gradually cutting the ceramic laminate 400 from one edge of the ceramic laminate 400 along the cutting path. Therefore, this progressive cutting requires less force than cutting the ceramic laminate 400 with a single cutting action, and thus it is easier to cut the ceramic laminate.

因為較少衝擊施加於切割裝置之刀刃422,因此不需要經常替換刀刃422。於是,依照本發明之現用實施範例之切割裝置被認為具有經濟效益。Since less impact is applied to the cutting edge 422 of the cutting device, it is not necessary to replace the cutting edge 422 frequently. Thus, the cutting apparatus according to the present embodiment of the present invention is considered to be economical.

依照本發明之切割裝置藉由使用以可旋轉方方式連接至移動部之切割部,從一側沿著直線路徑逐漸切割陶瓷層壓板。因此,依照本發明之切割裝置相較於使用單一切割動作切割陶瓷層壓板之相關技術之切割裝置需要較少之力。於是,使得切割操作容易,並且能夠避免切割缺陷。因為較少衝擊施加於切割裝置之刀刃,因此能夠達成經濟和有效的刀刃保護。The cutting device according to the present invention gradually cuts the ceramic laminate from one side along a linear path by using a cutting portion that is rotatably connected to the moving portion. Therefore, the cutting device according to the present invention requires less force than the cutting device of the related art for cutting a ceramic laminate using a single cutting action. Thus, the cutting operation is made easy, and the cutting defects can be avoided. Economical and effective blade protection can be achieved because less impact is applied to the cutting edge of the cutting device.

依照本發明之切割裝置從一個邊緣朝向另一個邊緣漸漸切割陶瓷層壓板。因為較切割陶瓷層壓板時會立即發生缺陷之力為小之力作用在瓷層壓板上,因此本切割裝置能夠防止陶瓷層壓板之切割缺陷發生。The cutting device according to the invention progressively cuts the ceramic laminate from one edge towards the other. Since the force which immediately occurs when the ceramic laminate is cut is a small force acting on the porcelain laminate, the cutting device can prevent the cutting defects of the ceramic laminate from occurring.

雖然本發明已相關於較佳實施例作了顯示和詳細說明,但是很顯然的對於熟悉此項技術者可以作各種修飾和改變而不會偏離由所附申請專利範圍所定義之本發明之範圍。Although the present invention has been shown and described with respect to the preferred embodiments of the present invention, it is to be understood that various modifications and changes may be made without departing from the scope of the invention as defined by the appended claims. .

100...陶瓷層壓板100. . . Ceramic laminate

110...移動部110. . . Mobile department

112...撞桿112. . . Bat

114...停止器114. . . Stopper

116...收容槽116. . . Storage slot

120...切割部120. . . Cutting department

122...刀刃122. . . Blade

123...切割邊緣123. . . Cutting edge

124...刀刃保持器124. . . Blade holder

125...固定部125. . . Fixed part

126...支撐部126. . . Support

128...旋轉樞紐128. . . Rotating hub

130...連接部130. . . Connection

132...彈性構件132. . . Elastic member

300...陶瓷層壓板300. . . Ceramic laminate

310...移動部310. . . Mobile department

312...撞桿312. . . Bat

320...切割部320. . . Cutting department

322...刀刃322. . . Blade

323...切割邊緣323. . . Cutting edge

324...刀刃保持器324. . . Blade holder

325...傾斜部325. . . Inclined portion

330...台級330. . . Class

332...真空部332. . . Vacuum department

340...台級支撐部340. . . Station level support

342...安裝槽342. . . Mounting slot

350...彈性構件350. . . Elastic member

360...泡棉雙面膠帶360. . . Foam double-sided tape

400...陶瓷層壓板400. . . Ceramic laminate

410...移動部410. . . Mobile department

420...切割部420. . . Cutting department

422...刀刃422. . . Blade

425...傾斜部425. . . Inclined portion

430...台級430. . . Class

432...位置固定夾432. . . Position fixing clip

440...台級支撐部440. . . Station level support

442...安裝槽442. . . Mounting slot

450...彈性構件450. . . Elastic member

460...泡棉雙面膠帶460. . . Foam double-sided tape

由以上之詳細說明,配合所附圖式,本發明之上述和其他態樣、特徵和其他優點將更清楚了解,其中:The above and other aspects, features, and other advantages of the present invention will become more apparent from the aspects of the appended claims.

第1圖為依照本發明之範例實施例切割裝置之透視圖;1 is a perspective view of a cutting device in accordance with an exemplary embodiment of the present invention;

第2至6圖為依照本發明之範例實施例切割裝置之側視圖,用來說明切割方法;2 to 6 are side views of a cutting device according to an exemplary embodiment of the present invention for explaining a cutting method;

第7圖為用來解釋依照本發明之另一範例實施例切割裝置之剖面圖;Figure 7 is a cross-sectional view for explaining a cutting device in accordance with another exemplary embodiment of the present invention;

第8和9圖為用來解釋第7圖之切割裝置之切割程序之剖面圖;Figures 8 and 9 are cross-sectional views for explaining the cutting procedure of the cutting device of Figure 7;

第10圖為用來解釋依照本發明之又另一範例實施例切割裝置之圖示;以及Figure 10 is a diagram for explaining a cutting device according to still another exemplary embodiment of the present invention;

第11和12圖為用來解釋第10圖之切割裝置之切割程序之圖示。Figures 11 and 12 are diagrams for explaining the cutting procedure of the cutting device of Figure 10.

110...移動部110. . . Mobile department

112...撞桿112. . . Bat

114...停止器114. . . Stopper

116...收容槽116. . . Storage slot

120...切割部120. . . Cutting department

122...刀刃122. . . Blade

123...切割邊緣123. . . Cutting edge

124...刀刃保持器124. . . Blade holder

125...固定部125. . . Fixed part

126...支撐部126. . . Support

128...旋轉樞紐128. . . Rotating hub

130...連接部130. . . Connection

132...彈性構件132. . . Elastic member

Claims (8)

一種切割裝置,包括:移動部,可以移動朝向待被切割之目標物;切割部,安裝於該移動部連同該移動部一起操作;以及傾斜部,可使該切割部與該目標物之間逐漸地產生接觸,而使得該目標物逐漸地從一個邊緣朝向另一個邊緣被切割,其中,該傾斜部包括:台級,裝配以安置該目標物;台級支撐物,支撐該台級;以及彈性構件,設於該台級與該台級支撐物之間並且傾斜該台級以使該切割部逐漸地從一個邊緣至另一個邊緣切割該目標物。 A cutting device comprising: a moving portion movable toward a target to be cut; a cutting portion mounted to the moving portion to operate together with the moving portion; and an inclined portion for gradually forming the cutting portion and the target Contacting the ground such that the target is gradually cut from one edge toward the other edge, wherein the inclined portion includes: a stage, assembled to position the target; a stage support, supporting the stage; and elasticity A member is disposed between the stage and the stage support and tilts the stage to cause the cutting portion to gradually cut the object from one edge to the other edge. 如申請專利範圍第1項之切割裝置,其中,該台級支撐物在側部具有安裝槽,該安裝槽收容該彈性構件之一端。 The cutting device of claim 1, wherein the stage support has a mounting groove at a side portion, the mounting groove receiving one end of the elastic member. 如申請專利範圍第1項之切割裝置,其中,該台級包含真空部,在該台級接觸該目標物之表面形成真空以固定該目標物。 The cutting device of claim 1, wherein the stage comprises a vacuum portion, and a vacuum is formed at a surface of the stage contacting the target to fix the target. 如申請專利範圍第1項之切割裝置,其中,該台級包含位置固定夾,接觸該目標物之一側以固定該目標物。 The cutting device of claim 1, wherein the stage includes a position fixing clip that contacts one side of the target to fix the target. 如申請專利範圍第1項之切割裝置,復包括設於該目標物與該台級之間之泡棉雙面膠帶,以防止該目標物當被切割時移動。 The cutting device of claim 1, further comprising a foam double-sided tape disposed between the target and the stage to prevent the target from moving when being cut. 如申請專利範圍第1項之切割裝置,其中,該切割部包 括具有作為切割邊緣的一個邊緣的刀刃。 The cutting device of claim 1, wherein the cutting portion is A blade having an edge as a cutting edge is included. 如申請專利範圍第1項之切割裝置,其中,該切割部包括直接接觸移動部的刀刃保持器和設置於刀刃保持器且具有作為切割邊緣的一個邊緣的刀刃。 A cutting device according to claim 1, wherein the cutting portion includes a blade holder that directly contacts the moving portion and a blade that is provided to the blade holder and has an edge as a cutting edge. 如申請專利範圍第7項之切割裝置,其中,該刀刃保持器覆蓋其切割邊緣之外的刀刃的每一個角落。 The cutting device of claim 7, wherein the blade holder covers each corner of the blade other than the cutting edge thereof.
TW98109848A 2008-08-29 2009-03-26 Cutting apparatus TWI381922B (en)

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KR1020080085463A KR20100026449A (en) 2008-08-29 2008-08-29 Cutting apparatus
KR1020080100774A KR101004884B1 (en) 2008-10-14 2008-10-14 Cutting apparatus

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CN108621232B (en) * 2018-03-30 2019-12-13 林华 Cooked food automatic slicing device
CN113232067B (en) * 2021-05-11 2022-07-08 黄山学院 Dicing device of smelly mandarin fish processing equipment
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