201008739 六、發明說明： [優先權之主張] 本申ΐΐ主張於2_年8月29日向韓國智慧財產眉所 提出之韓：專利申請案第2008-85463號’和2008年1〇; 14 :提出之韓；專利申請案第2_掘號之優先權，f等4 案揭示之内容加入本案 權該等 【發明所屬之技術領域】”、、"考 e ❹ 4 t發：，關於切割裴置’尤係關於藉由切割陶瓷層壓 板而製造晶片組件之切㈣置。 免層壓 【先前技術】 藉由堆疊複數個各包含内部電極之陶^而製成陶免 ，板。陶究層壓板被切割成預定尺寸之晶片組件。最近， ，付電子、讀之小型化和多重功能，晶片組件 和向度層㈣實現Μ量和高雜。 “相關技術切副|置藉由施加垂直於陶曼層壓 者預定的切割路徑切割陶究層壓板。 力，。 然而’若配置陶瓷層壓板實現高容量和高性能 術切割裝置切割陶曼層壓板需要較切割其他裝置為 的力。此情況造成諸多限制，可以例示如下。為大 現有的用來製造”層壓板之絲網料（吻咖 ΡΓ1 nt 1 ng method)於施行相同尺寸之晶片組件高容量 具有限制。對於此原因，使用一種技術，藉由使用真办面 備於薄膜而薄化内部電極。於此技術，透過具有電極裝 之遮罩而於真空室中形成Mi薄膜電極。然而，相關 案 割裝置不提供足夠的力以適當地切割由上述技術製生刀 201008739 瓷層壓板。 因此，使用相關技術切割裝置切割陶瓷層壓板也許對 於陶瓷層壓板造成切割缺陷，或者造成由切割陶瓷層壓板 所形成之晶片組件破碎。 而且，因為亦施加很大的力於正在切割陶瓷層壓板之 切割裝置，因此切割裝置之切割刀刃容易受損並且因此需 要經常的替換。結果，產生顯著的經濟上之損失，因此需 要一種用來解決這些限制之技術。 【發明内容】 本發明之態樣提供切割裝置，用來從陶瓷層壓板之一 邊漸漸沿著直線路徑切割該陶瓷層壓板。 依照本發明之態樣，提供切割裝置包含：移動部可以 移動朝向待被切割之目標物；切割部安裝於該移動部連同 該移動部一起操作；以及傾斜部可使該切割部與該目標物 之間逐漸地產生接觸，而使得該目標物逐漸地從一個邊緣 朝向另一個邊緣被切割。 傾斜部可以包含具有二端分別固定於該移動部和該切 割部之連接部，該連接部提供該切割部切割該目標物之力。 切割部可以包含：刀刃保持器，具有一側可以旋轉地 固定於該移動部，而另一側可以與該移動部分離；以及刀 刃，固定於該刀刃保持器以切割該目標物。 刀刃可以具有一個邊緣，用作為切割邊緣，並且具有 矩型的形狀，而該刀刃保持器可以包含：固定部，固定面 對該切割邊緣之邊緣，並且具有一側固定於該移動部；以 4 94647 201008739 及支撐部，固定於該刀刃之二侧。 切割部可以包含旋轉樞紐以可旋轉方式固定於刀刃保 . 持器和移動部。 切割部可以包含彈性構件提供彈力於該切割部。 移動部於一侧可以包含停止器限制切割部之旋轉角 度。 傾斜部可以包含：裝配以安置目標物之台級；支撐該 φ 台級之台級支撐物；以及設於該台級與該台級支禮物之間 並且傾斜該台級以使該切割部逐漸地從一個邊緣至另一個 邊緣切割該目標物之彈性構件。 ‘ 台級支撐物可以在側部具有安裝槽，該安裝槽收容該 彈性構件之一端。 該台級可以包含真空部在台級接觸目標物之表面形成 真空以固定該目標物。 該台級可以包含位置固定夾接觸該目標物之一側以固 ❿ 定該目標物。 切割裝置可以復包含設於該目標物與該台級之間之泡 棉雙面勝帶（foaming tape)，以防止該目標物當被切割 時移動。 切割裝置之切割部可以包含安裝於該移動部與該移動 部操作，並且於一個邊緣具有切割邊緣之刀刃。 【實施方式】 現在將參照所附圖式詳細說明本發明之範例實施例。 第1圖為依照本發明之範例實施例切割裝置之透視圖。 5 94647 201008739 移動圖’依照本發明之範例實施例之切割震置包含 移動部110、切割部120、和連接部130。 移動部110設計成可相關於陶曼層壓板100放置於里上 之台座垂直移動。於第！圖中，撞桿112安裝在移動部u〇 . 上移動該移動部110向上和向下，但是可以設計其他的裝置 來移動該移動部110。 移動部110包含設在一側之停止器114。 停止器114突出於移動部ι10之侧表面，並且緊密附接 於切割部120之刀刃保持器124。當切割部12〇切割該陶瓷層❹ 壓板100時，停止器H4防止切割部12〇被推向高於預定高度 之位置。 义 當移動部110下降時，停止器114送出移動部110之下降 力至切割部12〇，使得刀刃122能夠切割陶瓷層壓板1〇〇。 移動部110包含收容槽116用來收容連接部130。此處， 連接部130用來防止切割部120之自由旋轉部較離開移動部 110之預定的距離更間隔開。 ㉓ 雖然被切割之目標物說明為陶瓷層壓板100，但是本發 明並不限於此陶瓷層壓板1〇〇。藉由依照本發明之切割裝置 可以切割各種的目標物。 切割部12 0以可旋轉之方式安裝於移動部11 〇以切割陶 瓷層壓板100’並且包舍刀刃122、刀刃保持器124、和旋轉 極紐128。 刀刃122透過刀刃保持器124安裝於移動部110，並且具 有底部邊緣用作為切割邊緣123。 6 94647 201008739 刀刃122具有矩型形狀，而除了底部邊緣外之所有的邊 緣由刀刃保持器124所環繞。 . 刀刃保持器124保持刀刃122於其下方表面，並且具有 一個侧表面藉由旋轉樞紐128以可旋轉之方式安裝於該移 動部110之側表面。於是，刀刃122亦能夠繞著相同的旋轉 軸旋轉，因為其連同刀刃保持器124—起旋轉。 刀刃保持器124包含固定部125和支撐部126。固定部 ^ 125固定面對該刀刃122之切割邊緣123之刀刃122之一個邊 緣，而支撐部126固定刀刃122之二個邊緣。 支撐部126可以長於切割邊緣123以先於該切割邊緣 ' 123接觸台座。於此情況載送膜放置在陶瓷層壓板100之下 方，刀刃122藉由製造支撐部126長於切割邊緣123載送膜之 高度而僅切割陶瓷層壓板100。 旋轉樞紐128通過固定部125之側表面，並且安裝於移 動部110。於是，旋轉樞紐128繞著該旋轉軸旋轉該固定部 ❿ 125。然而，本發明並不限於旋轉樞紐，以及可以使用可使 固定部125旋轉之各種方法。 整個連接部130收容於移動部110之收容槽116内。連接 部130具有一端連接至移動部110而另一端固定至切割部 120。 如此一來，當切割部120放置高於台座位置時，切割部 120藉由地心引力而繞著旋轉軸旋轉。於此情況，沒有連接 部130，切割部120與移動部110間隔開，並且變成垂直於該 移動部110。 7 94647 201008739 j而，因為連接部130連接至該移動部11〇和切割部 120因此其防止切割部12 0間隔開多於預定的距離。 連接部130包含彈性構件132,該彈性構件132提供彈力 至切割部120而使得能夠切割陶瓷層壓板100之一部分。 當切割部120之傾斜側較靠近於移動部11〇時，彈性構 件132被壓縮，並因此提供彈力向下作用於該切割部1如之 傾斜側。 藉由此力量，從陶瓷層壓板1〇〇之邊緣部開始切割並 以直線方式漸漸繼續著。 β然而，連接部130不限於彈性構件132。能夠設計可以 提供此種力之各種機制使用為連接部13〇。201008739 VI. Invention Description: [Proposal of Priority] This application claims to be filed on the Korean Intellectual Property Eyebrow on August 29, 2: Patent Application No. 2008-85463' and 2008 1; 14: Proposed Han; Patent Application No. 2_Digging No. Priority, f et al. 4 The content disclosed in the case is added to the right of the case [the technical field of the invention],, " test e ❹ 4 t hair:, about cutting The device is particularly concerned with the manufacture of a wafer assembly by cutting a ceramic laminate. The laminate is not laminated. [Prior Art] By stacking a plurality of ceramics each containing internal electrodes, the ceramics are made. The laminate is cut into wafer components of a predetermined size. Recently, the electronic components, the miniaturization and multi-function of reading, the wafer assembly and the dioptric layer (4) achieve volume and high complexity. "Related technology cuts the pair | by applying vertical The ceramic cutting laminate is cut by a predetermined cutting path of the Taman laminater. force,. However, the use of ceramic laminates to achieve high capacity and high performance cutting devices for cutting Tauman laminates requires more force than cutting other devices. This situation creates a number of limitations and can be exemplified below. There is a limit to the high capacity of large existing wafer assemblies for the manufacture of "lamella" 1 nt 1 ng method. For this reason, a technique is used, Thinning the internal electrode on the film. In this technique, the Mi film electrode is formed in the vacuum chamber through the mask with the electrode. However, the related cutting device does not provide sufficient force to properly cut the blade made by the above technique. 201008739 Porcelain laminate. Therefore, cutting a ceramic laminate using a related art cutting device may cause cutting defects to the ceramic laminate or cause breakage of the wafer assembly formed by cutting the ceramic laminate. Moreover, because a large force is also applied The cutting device of the ceramic laminate is cut, so that the cutting blade of the cutting device is easily damaged and thus requires frequent replacement. As a result, a significant economic loss occurs, and thus a technique for solving these limitations is required. Aspects of the invention provide a cutting device for gradually moving from one side of a ceramic laminate The wire path cuts the ceramic laminate. According to an aspect of the invention, the cutting device includes: the moving portion can move toward the target to be cut; the cutting portion is mounted to the moving portion to operate together with the moving portion; and the inclined portion can be The contact portion is gradually brought into contact with the target object, so that the target object is gradually cut from one edge toward the other edge. The inclined portion may include two ends fixed to the moving portion and the cutting portion respectively. a connecting portion that provides a force for the cutting portion to cut the target. The cutting portion may include: a blade holder having one side rotatably fixed to the moving portion and the other side separable from the moving portion; a blade edge fixed to the blade holder to cut the target. The blade edge may have an edge for use as a cutting edge and has a rectangular shape, and the blade holder may include: a fixing portion fixedly facing the cutting edge An edge, and having one side fixed to the moving portion; fixed to the blade with 4 94647 201008739 and a support portion The cutting portion may include a rotary hinge rotatably fixed to the blade retaining device and the moving portion. The cutting portion may include an elastic member to provide elastic force to the cutting portion. The moving portion may include a stopper limiting cutting portion on one side. The angle of rotation may include: a stage that is assembled to position the object; a stage support that supports the stage of the φ stage; and is disposed between the stage and the gift of the stage and tilts the stage to The cutting portion gradually cuts the elastic member of the target from one edge to the other. The stage support may have a mounting groove at the side, the mounting groove receiving one end of the elastic member. The stage may include a vacuum portion at The stage contacts the surface of the target to form a vacuum to fix the target. The stage may include a position fixing clip contacting one side of the target to fix the target. The cutting device may include a foaming double-sided foaming tape disposed between the target and the stage to prevent the target from moving when being cut. The cutting portion of the cutting device may include a blade that is mounted to the moving portion and operates with the moving portion and has a cutting edge at one edge. [Embodiment] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a cutting apparatus in accordance with an exemplary embodiment of the present invention. 5 94647 201008739 Moving diagram The cutting arrangement according to an exemplary embodiment of the present invention includes a moving portion 110, a cutting portion 120, and a connecting portion 130. The moving portion 110 is designed to be vertically movable in relation to the pedestal on which the Tauman laminate 100 is placed. In the first! In the figure, the striker 112 is mounted on the moving portion u. The moving portion 110 is moved up and down, but other means can be designed to move the moving portion 110. The moving unit 110 includes a stopper 114 provided on one side. The stopper 114 protrudes from the side surface of the moving portion ι 10 and is closely attached to the blade holder 124 of the cutting portion 120. When the cutting portion 12 〇 cuts the ceramic layer nip plate 100, the stopper H4 prevents the cutting portion 12 〇 from being pushed to a position higher than a predetermined height. When the moving portion 110 is lowered, the stopper 114 sends the lowering force of the moving portion 110 to the cutting portion 12A, so that the blade 122 can cut the ceramic laminate 1〇〇. The moving portion 110 includes a receiving groove 116 for receiving the connecting portion 130. Here, the connecting portion 130 serves to prevent the freely rotating portion of the cutting portion 120 from being spaced apart from the predetermined distance from the moving portion 110. Although the object to be cut is illustrated as the ceramic laminate 100, the present invention is not limited to this ceramic laminate. Various objects can be cut by the cutting device according to the present invention. The cutting portion 120 is rotatably attached to the moving portion 11'' to cut the ceramic laminate 100' and wraps the blade 122, the blade holder 124, and the rotating core 128. The blade 122 is attached to the moving portion 110 through the blade holder 124, and has a bottom edge as the cutting edge 123. 6 94647 201008739 The blade 122 has a rectangular shape, with all edges except the bottom edge being surrounded by the blade holder 124. The blade holder 124 holds the blade 122 on its lower surface and has a side surface rotatably attached to the side surface of the moving portion 110 by a rotary hinge 128. Thus, the blade 122 is also rotatable about the same axis of rotation as it rotates in conjunction with the blade holder 124. The blade holder 124 includes a fixing portion 125 and a support portion 126. The fixing portion ^ 125 is fixed to face one edge of the cutting edge 122 of the cutting edge 123 of the cutting edge 122, and the supporting portion 126 fixes the two edges of the cutting edge 122. The support portion 126 can be longer than the cutting edge 123 to contact the pedestal prior to the cutting edge '123. In this case, the carrier film is placed below the ceramic laminate 100, and the blade 122 cuts only the ceramic laminate 100 by manufacturing the support portion 126 longer than the height at which the cutting edge 123 carries the film. The rotary joint 128 passes through the side surface of the fixing portion 125 and is attached to the moving portion 110. Thus, the rotary joint 128 rotates the fixed portion 绕 125 about the rotary shaft. However, the present invention is not limited to the rotary joint, and various methods of rotating the fixed portion 125 can be used. The entire connecting portion 130 is received in the receiving groove 116 of the moving portion 110. The connecting portion 130 has one end connected to the moving portion 110 and the other end fixed to the cutting portion 120. As a result, when the cutting portion 120 is placed higher than the pedestal position, the cutting portion 120 is rotated about the rotation axis by gravity. In this case, there is no connecting portion 130, and the cutting portion 120 is spaced apart from the moving portion 110 and becomes perpendicular to the moving portion 110. 7 94647 201008739 j, because the connecting portion 130 is connected to the moving portion 11 and the cutting portion 120, it prevents the cutting portion 120 from being spaced apart by more than a predetermined distance. The connecting portion 130 includes an elastic member 132 that provides an elastic force to the cutting portion 120 to enable cutting of a portion of the ceramic laminate 100. When the inclined side of the cutting portion 120 is closer to the moving portion 11 ,, the elastic member 132 is compressed, and thus the elastic force is applied downward to the cutting portion 1 such as the inclined side. With this force, cutting starts from the edge of the ceramic laminate 1 and continues in a straight line. β However, the connecting portion 130 is not limited to the elastic member 132. Various mechanisms capable of providing such a force can be designed to be used as the connecting portion 13A.
第2至6圖為依照本發明之範例實施例切縣置之侧視 用來說明切割方法。 參照第2至6圖，當切割裝置放置於陶竟層壓板⑽之上 :夺^以藉由地心引力用旋轉樞紐128作用為旋轉軸而旋轉 ::120之一侧’而切割部120之另一側繞著該旋轉轴向 >疑轉。 t是’如第2圖所示，切割部12〇相關於移動部靡 置，稍微傾斜。 2第3圖所示，當移動部11〇藉由撞桿112向 =第：箭號)’刀刀保持器m之旋如^ 該口座，然後陶曼層壓板100之邊緣部（其 接觸該刀77122。 旋轉側 如第4圖所示，當移動部11〇進—步向下移動朝向& 201008739 層壓板100時，用由彈性構件132所施加之彈力，刀刃122 從陶瓷層壓板100與該刀刃122接觸之邊緣部開始切割。當 . 移動部110進一步向下移動時，切割以直線方式逐漸進行 • 著。 如第5圖所示，當刀刃122完全切割陶瓷層壓板100時， 停止器114和刀刃保持器12 4彼此接觸以停止該移動部110。 其後，如第6圖所示，移動部110向上移動，完成切割 ^ 操作，以及刀刃122返回至其初始位置。 若藉由使用現有的切割裝置切割陶瓷層壓板，則於陶 瓷層壓板中也許發生切割缺陷，或者由切割陶瓷層壓板所 獲得的晶片組件之表面也許破碎。而且’因為相當大的衝 擊施加於切割裝置，因此切割裝置之刀刃也許損壞，以及 也許由例如經常的替換刀刃而造成顯著的經濟損失。 反之，依照現用之範例實施例之切割裝置，藉由使用 以旋轉方式連接至移動部110之切割部120從陶瓷層壓板 ® 100之一個邊緣逐漸地切割該陶瓷層壓板100。此逐漸地切 割較用單一切割動作切割陶瓷層壓板10 0需要較少之力。因 此，依照本發明，陶瓷層壓板100能夠更容易被切割。 結果，能夠防止切割缺陷。因為較少衝擊施加於切割 裝置之刀刃122,因此不需要經常替換受損之刀刃。於是， 依照本發明之現用範例實施例之切割裝置被認為具有經濟 效益。 現將參照第7至12圖更詳細說明本發明之範例實施例。 第7圖為用來解釋依照本發明之另一範例實施例切割 9 94647 201008739 裝置之剖面圖。 第7圖之切割農置包含移動部310、切割部320、和傾斜 部 325 〇 移動部310可以相關於陶曼層壓板3〇〇放置於其上之台 級330和σ級支樓部MQ垂直移動。於第7圖中，撞桿gig 女裝在移動部310上以向上和向下移動該移動部31〇。可以 使用另一種裝置取代撞桿312以移動該移動部31〇。 切割部320可移動朝向陶瓷層壓板300，並且用來切割 陶瓷層壓板300。 ❿ 切割部320包含刀刃322和刀刃保持器324。 刀刃322設置於移動部31〇,使得其切割邊緣323面對陶 瓷層壓板300。刀刃322沿著切割路徑切割陶瓷層壓板。刀 刃322可以具有六面體形狀，並且於其底部邊緣具有切割邊 緣323。 刀刃保持器324覆蓋除了刀刃322之切割邊緣323外之 每一個角落，並且直接接觸移動部310。 ❺ 收容垂直於刀刃322之切割邊緣323之二個侧邊緣之刀 刃保持器324與切割邊緣323齊平，並且亦接觸泡棉雙面勝 帶36(^於是’刀刃322於切割陶瓷層壓板300後被防止進一 步向下移動，並亦防止切割陶瓷層壓板300下方之泡棉雙面 膠帶360。 當傾斜部325傾斜台級330時，切割部320與陶瓷層壓板 300之間能夠逐漸地產生接觸，而使得能夠逐漸地從一個邊 緣至另一個邊緣切割陶瓷層壓板3〇〇。這裡的接觸可指當刀 94647 10 201008739 刃322來與陶瓷層壓板300接觸時被切割之部分。 傾斜部325包含台級330、台級支樓部340和彈性構件 . 350。 .陶究層壓板300設置於台級330上。於是，當切割部32〇 向下移動和刀刃322接觸陶瓷層壓板300時開始切割。 台級330放置在台級支撐部340上。台級330之一侧固定 於台級支撐部340以使得台級330將傾斜於該台級支推部 鲁 340之上。 泡棉雙面膠帶360可以進一步設於台級330與陶竟層壓 板300之間。 泡棉雙面膠帶360結合陶瓷層壓板300之底部以固定陶 瓷層壓板300之位置。於是，若陶瓷層壓板300被縱長和交 又地切割’則泡棉雙面膠帶360防止陶瓷層壓板3〇〇之分離 部分於台級330之表面上移位。 ^ 台級330可以包含真空部332。該真空部332於台級330 表面接觸陶瓷層壓板300和泡棉雙面膠帶360處形成真空， 藉此固定陶瓷層壓板300和泡棉雙面膠帶360於位置處。真 空部332可以形成在台級330内部。 真空部332具有真空泵吸取於台級330之表面處之空 氣，並且將該空氣排放至外部。藉由此種配置，吸入空氣 之吸取力用來固定陶瓷層壓板300和泡棉雙面膠帶360於台 級330之表面。 台級支撐部340支撐台級330於其上。台級330安裝在台 級支撐部340之一側，使得台級330能被旋轉和傾斜。台級 11 94647 201008739 330和台級支撐部340可以藉由設置於一側之旋轉樞紐連接 在一起。本發明不限於旋轉樞紐，可以使用各種的安裝結 構。 台級支撐部340具有安裝槽342,彈性構件35〇之一端安 裝於此安裳槽342中。藉由插入彈性構件350之-端於安裝 槽342中而固定該彈性構件35〇。 安裝槽342具有足约的深度，當彈性構件350藉由切割2 to 6 are side views of a cut-off county according to an exemplary embodiment of the present invention for explaining a cutting method. Referring to Figures 2 to 6, when the cutting device is placed on the ceramic laminate (10), it is rotated by the gravity pivot 128 acting as a rotating shaft by gravity: one side of the 120: and the cutting portion 120 The other side is around the axis of rotation > t is ' As shown in Fig. 2, the cutting portion 12 is slightly inclined with respect to the moving portion. 2, as shown in FIG. 3, when the moving portion 11 is rotated by the striker 112 toward the =: arrow "tool holder m", the edge portion of the Tauman laminate 100 is contacted. Knife 77122. Rotating side As shown in Fig. 4, when the moving portion 11 is moved forwardly toward the & 201008739 laminate 100, the blade 122 is rotated from the ceramic laminate 100 with the elastic force applied by the elastic member 132. The edge portion of the blade 122 contacts the cutting. When the moving portion 110 moves further downward, the cutting is gradually performed in a straight line. As shown in Fig. 5, when the blade 122 completely cuts the ceramic laminate 100, the stopper 114 and the blade holder 12 4 are in contact with each other to stop the moving portion 110. Thereafter, as shown in Fig. 6, the moving portion 110 is moved upward to complete the cutting operation, and the blade 122 returns to its original position. Existing cutting devices cut ceramic laminates, and cutting defects may occur in the ceramic laminate, or the surface of the wafer assembly obtained by cutting the ceramic laminate may be broken. And 'because a considerable impact is applied to the cutting device Thus, the cutting edge of the cutting device may be damaged and may cause significant economic loss by, for example, frequent replacement of the cutting edge. Conversely, in accordance with the cutting device of the present exemplary embodiment, by using a cutting portion that is rotationally coupled to the moving portion 110 120 progressively cuts the ceramic laminate 100 from one edge of the ceramic laminate® 100. This progressive cutting requires less force than cutting the ceramic laminate 100 with a single cutting action. Thus, in accordance with the present invention, the ceramic laminate 100 It is possible to cut more easily. As a result, it is possible to prevent the cutting defect. Since less impact is applied to the cutting edge 122 of the cutting device, it is not necessary to frequently replace the damaged blade. Thus, the cutting device according to the present exemplary embodiment of the present invention is considered The present invention will now be described in more detail with reference to Figures 7 through 12. Figure 7 is a cross-sectional view for explaining a device for cutting 9 94647 201008739 in accordance with another exemplary embodiment of the present invention. The cutting farm includes a moving portion 310, a cutting portion 320, and an inclined portion 325. The moving portion 310 may be related The stage 330 and the σ-level branch portion MQ on which the Tauman laminate 3 is placed are vertically moved. In Fig. 7, the lance gig is moved up and down on the moving portion 310 to move the moving portion upward and downward. 31. Another device may be used in place of the striker 312 to move the moving portion 31. The cutting portion 320 is movable toward the ceramic laminate 300 and is used to cut the ceramic laminate 300. 切割 The cutting portion 320 includes a cutting edge 322 and a blade holder The blade 322 is disposed on the moving portion 31A such that its cutting edge 323 faces the ceramic laminate 300. The blade 322 cuts the ceramic laminate along the cutting path. The blade 322 may have a hexahedral shape and have a cutting edge 323 at its bottom edge. The blade holder 324 covers each corner except the cutting edge 323 of the blade 322 and directly contacts the moving portion 310.刀 A blade holder 324 that receives the two side edges of the cutting edge 323 perpendicular to the cutting edge 322 is flush with the cutting edge 323 and also contacts the foam double-sided belt 36 (ie, the 'blade 322' is after cutting the ceramic laminate 300 It is prevented from moving further downward, and also prevents the foamed double-sided tape 360 from being cut under the ceramic laminate 300. When the inclined portion 325 is inclined to the stage 330, the cutting portion 320 and the ceramic laminate 300 can gradually come into contact with each other. It is thereby possible to gradually cut the ceramic laminate 3 from one edge to the other. The contact here may refer to the portion that is cut when the blade 94647 10 201008739 is brought into contact with the ceramic laminate 300. The inclined portion 325 includes a table. The stage 330, the stage branch portion 340, and the elastic member. 350. The ceramic laminate 300 is disposed on the stage 330. Then, the cutting is started when the cutting portion 32 is moved downward and the blade 322 contacts the ceramic laminate 300. The stage 330 is placed on the stage support 340. One side of the stage 330 is fixed to the stage support 340 such that the stage 330 will be inclined above the stage support 340. Foam double-sided tape 360 can One step is provided between the stage 330 and the ceramic laminate 300. The foam double-sided tape 360 is combined with the bottom of the ceramic laminate 300 to fix the position of the ceramic laminate 300. Thus, if the ceramic laminate 300 is lengthwise and intersected The ground cut 'bubble double-sided tape 360 prevents the separated portion of the ceramic laminate 3 from shifting over the surface of the stage 330. ^ The stage 330 may include a vacuum portion 332. The vacuum portion 332 is in surface contact with the stage 330 A vacuum is formed at the ceramic laminate 300 and the foam double-sided tape 360, thereby fixing the ceramic laminate 300 and the foam double-sided tape 360 at a position. The vacuum portion 332 may be formed inside the stage 330. The vacuum portion 332 has a vacuum pump suction The air at the surface of the stage 330 is discharged to the outside. With this configuration, the suction force of the suction air is used to fix the ceramic laminate 300 and the foam double-sided tape 360 on the surface of the stage 330. The stage support portion 340 supports the stage 330 thereon. The stage 330 is mounted on one side of the stage support 340 such that the stage 330 can be rotated and tilted. The stage 11 94647 201008739 330 and the stage support 340 can By setting The rotary joints of one side are connected together. The present invention is not limited to the rotary joint, and various mounting structures can be used. The stage support portion 340 has a mounting groove 342 into which one end of the elastic member 35 is mounted. The elastic member 35 is inserted into the mounting groove 342 to fix the elastic member 35. The mounting groove 342 has a depth of about 100, when the elastic member 350 is cut by
4 320而被元全壓人於安裝槽⑽中時將該台級挪水平定 位0 彈性構件350之另一端固定以接觸台級330之底表面， 並且被放置於台級33〇之侧部。彈性構件35〇之 一端插入於 口級樓#340之安裝槽342中。於是當彈性構件湖推台 級330之侧部向上時，台級3期傾斜。When the unit is fully pressed into the mounting groove (10), the stage is horizontally positioned. The other end of the elastic member 350 is fixed to contact the bottom surface of the stage 330, and is placed on the side of the stage 33. One end of the elastic member 35 is inserted into the mounting groove 342 of the mouth level #340. Thus, when the side of the elastic member lake pushing stage 330 is upward, the stage 3 is inclined.
-有彈力之彈簧可以使用為彈性構件湖，但是可以使 用提供彈力之各種構件。可以根據彈性構件350之長度 而"又疋σ、’及330傾斜之角度，並且按照設計者之意思而改 第8和9圖為用來解釋第7圖之範例實施例之切割程序 之剖面圖。 參照第8和9圖， 陶瓷層壓板300移動, 預定之角度。 如第7圖中所示之移動部31〇向下朝向 該陶瓷層壓板300由傾斜部325而傾斜 田移動#31〇進—步向下移動時，陶曼層壓板刪之一 個邊緣部分進入盘往 ”待因此切割之刀刃322接觸。然後，陶瓷 12 94647 201008739 .層驗沿著其切割轉逐漸朝向另-個邊緣部分切割。 w切割進行時，藉由移動部31Q之移動力壓縮該彈性構 .件350，以及台級330之傾斜角減少，而使得台級33〇漸漸變 . 成水平。 如第9圖所不，當完成切割陶瓷層壓板300時，移動部 310停止’而壓縮彈性構件35〇完全插入於台級支撐部34〇 之安裝槽342中。於是’台級33G緊密地附接於台級支撑部 ❹ 340並因此水平地放置。 如此一來，陶瓷層壓板300由切割部320從一個邊緣被 逐漸地切割。 當移動部310沿著次一個切割路徑向上移動切割陶瓷 層壓板300時，台級330藉由壓縮彈性構件35〇而回到初始傾 斜位置’並且連續地執行次一個切割。 依照現用之範例實施例之切割裝置因為彈性構件3 5 〇 _ 支撐台級330之一側，因此從陶瓷層壓板3〇〇之一個邊緣逐 漸地切割陶瓷層壓板3〇〇。因此，切割能夠較用單一切割動 作切割陶瓷層壓板3〇〇需要較少之力，而因此能夠更容易切 割陶瓷層壓板300。 依照現用之範例實施例之切割裝置能夠防止陶瓷層壓 板之切割缺陷，譬如於陶瓷層壓板300上之切割缺陷或者破 碎由切割陶瓷層壓板3〇〇所獲得之晶片組件，此情況也許在 切割陶瓷層壓板300時立即發生。 因為較少衝擊施加於切割裝置之刀刃322,因此不需要 經常替換受損之刀刃。於是，依照本發明之現用實施範例 94647 13 201008739 之切割裝置被5¾為具有經濟效益。 第10圖為用來解釋依照本發明之又另-範例實施仙 割裝置之圖示。第11和12圖為用來解釋第1〇圖之切割裝 之切割程序之圖示。 、 . 參照第10至12圖’切割裝置包含移動部41〇、切 · 420、和傾斜部425。 ° " 傾斜部425包含台級430、台級支偉部44〇和彈 450。 陶究層壓板400設置於台級430上。當切割部42〇下降時❹ 台級430可使陶瓷層壓板4〇〇遇到刀刃422。台級43〇 台級支撐部440上’並且可傾斜地固定於台級支撐部44〇上。 泡棉雙面膠帶460可以進一步設於台級43〇與陶兗層壓 板400之間。 泡棉雙面膠帶460結合陶瓷層壓板4〇〇之底部。若陶瓷 層壓板400被縱長和交又地切割，則泡棉雙面膠帶46〇防止 陶瓷層壓板400之分離部分於台級430之表面上移位。 ❹ 台級430可以包含位置固定夾432。 位置固定夾432從台級430之頂部突出穿過泡棉雙面膠 帶460，並且接觸陶瓷層壓板4〇〇之一侧。 當台級430藉由彈性構件450而傾斜時，陶瓷層壓板4〇〇 可以沿著台級430向下滑動。於此情況，位置固定夾432接 觸陶瓷層壓板400以防止陶瓷層壓板400向下滑動》 彈性構件450之一端安裝於其中之安裝槽442設置於台 級支撐部440中。彈性構件450插入並且固定於安裝槽442 14 94647 201008739 中。當彈性構件450藉由切割部420而被壓入時，彈性構件 450完全壓入於安裝槽442内，而使得該台級430被水平放 • 置。 彈性構件450之一端固定於台級430之側部，並且接觸 台級430之底部。彈性構件45〇之另一端插入於台級支撐部 440之安裝槽442中。 現用之實施例之移動部41 〇和切割部42 0之詳細說明可 φ 予省略’因為他們與第7圖之實施例者實質上相同。 如第10圖中所示，移動部41〇向下朝向由傾斜部425而 傾斜預定角度之陶瓷層壓板4〇〇。 當移動部410進一步向下移動時，刀刃422初始接觸並 且切割陶瓷層壓板400之邊緣部分，並且沿著切割路徑繼續 逐漸切割陶瓷層壓板400。 當切割進行時，藉由移動部41〇之移動力壓縮該彈性構 件450 ’以及減少台級430之傾斜角，而使得台級430漸漸·變 •成水平。 如第11和12圖所示’當完成切割陶瓷層壓板400時，移 動部410停止移動，而壓縮彈性構件450被完全插入於台級 支撐部440之安裝槽442中’使得台級430水平地接觸台級支 撐部440。 如此一來’依照現用之範例實施例之切割裝置藉由使 用彈性構件450支撐台級430之一側’因此從陶瓷層壓板4〇〇 之一個邊緣沿著切割路徑逐漸地切割陶瓷層壓板400。因 此，此逐漸地切割較用單一切割動作切割該陶瓷層壓板4〇〇 15 94647 201008739 需要較少之力，而因此能夠更容易切割陶瓷層壓板。 因為較少衝擊施加於切割裝置之刀刃422,因此不需要 經常替換刀刃422。於是，依照本發明之現用實施範例之切 割裝置被認為具有經濟效益。 依照本發明之切割裝置藉由使用以可旋轉方方式連接 至移動部之切割部，從一侧沿著直線路徑逐漸切割陶瓷層 壓板。因此，依照本發明之切割裝置相較於使用單一切割 動作切割陶瓷層壓板之相關技術之切割裝置需要較少之 _ 力。於是，使得切割操作容易，並且能夠避免切割缺陷。 因為較少衝擊施加於切割裝置之刀刃，因此能夠達成經濟 和有效的刀刃保護。 依照本發明之切割裝置從一個邊緣朝向另一個邊緣漸 漸切割陶瓷層壓板。因為較切割陶瓷層壓板時會立即發生 缺陷之力為小之力作用在瓷層壓板上，因此本切割裝置能 夠防止陶瓷層壓板之切割缺陷發生。 雖然本發明已相關於較佳實施例作了顯示和詳細說 〇 明，但是很顯然的對於熟悉此項技術者可以作各種修飾和 改變而不會偏離由所附申請專利範圍所定義之本發明之範 圍。 【圖式簡單說明】 由以上之詳細說明，配合所附圖式，本發明之上述和 其他態樣、特徵和其他優點將更清楚了解，其中： 第1圖為依照本發明之範例實施例切割裝置之透視圖； 第2至6圖為依照本發明之範例實施例切割裝置之側視 16 94647 201008739 圖，用來說明切割方法； 第7圖為用來解釋依照本發明之另一範例實施例切割 . 裝置之剖面圖； 第8和9圖為用來解釋第7圖之切割裝置之切割程序之 剖面圖； 第10圖為用來解釋依照本發明之又另一範例實施例切 割裝置之圖示；以及 p 第11和12圖為用來解釋第10圖之切割裝置之切割程序 之圖示。 【主要元件符號說明】 100 陶瓷層壓板 110 移動部 112 撞桿 114 停止器 116 收容槽 120 切割部 122 刀刃 123 切割邊緣 124 刀刃保持器 125 固定部 126 支撐部 128 旋轉樞紐 130 連接部 132 彈性構件 17 94647 201008739 300 陶瓷層壓板 310 移動部 312 撞桿 320 切割部 322 刀刃 323 切割邊緣 324 刀刃保持器 325 傾斜部 330 台級 332 真空部 340 台級支撐部 342 安裝槽 350 彈性構件 360 泡棉雙面膠帶 400 陶瓷層壓板 410 移動部 420 切割部 422 刀刃 425 傾斜部 430 台級 432 位置固定失 440 台級支撐部 442 安裝槽 450 彈性構件 460 泡棉雙面膠帶- Elastic springs can be used as elastic member lakes, but various components that provide elasticity can be used. According to the length of the elastic member 350, the angles of the sigma, ', and 330 are inclined, and the figures 8 and 9 are modified according to the designer's meaning to explain the profile of the cutting program of the exemplary embodiment of Fig. 7. Figure. Referring to Figures 8 and 9, the ceramic laminate 300 is moved at a predetermined angle. As shown in Fig. 7, the moving portion 31 is tilted downward toward the ceramic laminate 300 by the inclined portion 325, and when the step moves downward, the Tauman laminate cuts an edge portion into the tray. The blade 322 to be cut is contacted. Then, the ceramic 12 94647 201008739. The layer inspection is gradually cut along the cutting direction toward the other edge portion. When the cutting is performed, the elastic structure is compressed by the moving force of the moving portion 31Q. The member 350, and the inclination angle of the stage 330 are reduced, so that the stage 33 is gradually tapered. Leveling. As shown in Fig. 9, when the cutting of the ceramic laminate 300 is completed, the moving portion 310 stops 'and compresses the elastic member. 35〇 is completely inserted into the mounting groove 342 of the stage support portion 34. Then, the stage 13G is closely attached to the stage support portion 340 and thus placed horizontally. Thus, the ceramic laminate 300 is cut by the cutting portion. 320 is gradually cut from one edge. When the moving portion 310 moves upwardly along the next cutting path to cut the ceramic laminate 300, the stage 330 is returned to the initial tilt position by compressing the elastic member 35' and continuously executed The cutting device according to the present exemplary embodiment gradually cuts the ceramic laminate 3 from one edge of the ceramic laminate 3 because the elastic member 3 5 〇 _ supports one side of the stage 330. The cutting can require less force than cutting the ceramic laminate 3 with a single cutting action, and thus the ceramic laminate 300 can be more easily cut. The cutting device according to the present exemplary embodiment can prevent the cutting defects of the ceramic laminate, For example, cutting defects on the ceramic laminate 300 or breaking the wafer assembly obtained by cutting the ceramic laminate 3, this may occur immediately when the ceramic laminate 300 is cut. Because less impact is applied to the cutting edge 322 of the cutting device. Therefore, it is not necessary to frequently replace the damaged blade. Thus, the cutting device according to the present embodiment of the present invention 94647 13 201008739 is economically advantageous. Fig. 10 is a view for explaining another embodiment of the invention in accordance with the present invention. Illustration of the cutting device. Figures 11 and 12 are diagrams for explaining the cutting procedure of the cutting device of Fig. 1. Referring to Figures 10 to 12, the cutting device includes a moving portion 41, a cut 420, and an inclined portion 425. ° " The inclined portion 425 includes a stage 430, a table-level branch 44, and a bomb 450. The platen 400 is disposed on the stage 430. The stage 430 allows the ceramic laminate 4 to encounter the cutting edge 422 when the cutting portion 42 is lowered. The stage 43 is mounted on the stage support portion 440' and is tiltably fixed to the table The foamed double-sided tape 460 can be further disposed between the stage 43 〇 and the ceramic 兖 laminate 400. The foam double-sided tape 460 is bonded to the bottom of the ceramic laminate 4 。. If the ceramic laminate 400 is longitudinally and cross-cut, the foam double-sided tape 46 prevents the separated portions of the ceramic laminate 400 from being displaced on the surface of the stage 430. Stage stage 430 can include position retaining clips 432. A position retaining clip 432 projects from the top of the stage 430 through the foam double sided tape 460 and contacts one side of the ceramic laminate 4. When the stage 430 is tilted by the elastic member 450, the ceramic laminate 4〇〇 can slide down the stage 430. In this case, the position fixing clip 432 contacts the ceramic laminate 400 to prevent the ceramic laminate 400 from sliding downward. The mounting groove 442 in which one end of the elastic member 450 is mounted is disposed in the stage support portion 440. The elastic member 450 is inserted and fixed in the mounting groove 442 14 94647 201008739. When the elastic member 450 is pressed in by the cutting portion 420, the elastic member 450 is completely pressed into the mounting groove 442, so that the stage 430 is horizontally placed. One end of the elastic member 450 is fixed to the side of the stage 430 and contacts the bottom of the stage 430. The other end of the elastic member 45 is inserted into the mounting groove 442 of the stage support portion 440. The detailed description of the moving portion 41 and the cutting portion 42 of the presently-used embodiment may be omitted because they are substantially the same as those of the embodiment of Fig. 7. As shown in Fig. 10, the moving portion 41 is turned downward toward the ceramic laminate 4'' which is inclined by a predetermined angle by the inclined portion 425. When the moving portion 410 is further moved downward, the blade 422 initially contacts and cuts the edge portion of the ceramic laminate 400, and continues to gradually cut the ceramic laminate 400 along the cutting path. When the cutting is performed, the elastic member 450' is compressed by the moving force of the moving portion 41 and the inclination angle of the stage 430 is reduced, so that the stage 430 is gradually changed to a level. As shown in FIGS. 11 and 12, when the cutting of the ceramic laminate 400 is completed, the moving portion 410 stops moving, and the compression elastic member 450 is completely inserted into the mounting groove 442 of the stage support portion 440 'so that the stage 430 is horizontally The stage level support portion 440 is contacted. Thus, the cutting device according to the present exemplary embodiment supports the one side of the stage 430 by using the elastic member 450. Thus, the ceramic laminate 400 is gradually cut along the cutting path from one edge of the ceramic laminate 4'. Therefore, this progressive cutting requires less force than cutting the ceramic laminate 4 〇〇 15 94647 201008739 with a single cutting action, and thus it is easier to cut the ceramic laminate. Since less impact is applied to the cutting edge 422 of the cutting device, it is not necessary to replace the cutting edge 422 frequently. Thus, the cutting device according to the present embodiment of the present invention is considered to be economical. The cutting device according to the present invention gradually cuts the ceramic laminate plate from one side along a linear path by using a cutting portion that is rotatably connected to the moving portion. Therefore, the cutting device according to the present invention requires less force than the cutting device of the related art for cutting a ceramic laminate using a single cutting action. Thus, the cutting operation is made easy, and the cutting defects can be avoided. Economical and effective blade protection can be achieved because less impact is applied to the cutting edge of the cutting device. The cutting device according to the present invention progressively cuts the ceramic laminate from one edge toward the other. Since the force of the defect occurring immediately when the ceramic laminate is cut is a small force acting on the porcelain laminate, the cutting device can prevent the cutting defects of the ceramic laminate from occurring. Although the present invention has been shown and described with respect to the preferred embodiments, it will be apparent to those skilled in the The scope. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and other advantages of the present invention will become more apparent from the aspects of the appended claims. A perspective view of the device; FIGS. 2 through 6 are side views of a cutting device in accordance with an exemplary embodiment of the present invention, 16 94647 201008739, for illustrating a cutting method; and FIG. 7 is a view for explaining another exemplary embodiment in accordance with the present invention. Sectional view of the apparatus; Sections 8 and 9 are cross-sectional views for explaining the cutting procedure of the cutting apparatus of Fig. 7; and Fig. 10 is a diagram for explaining the cutting apparatus according to still another exemplary embodiment of the present invention. Fig. 11 and Fig. 12 are diagrams for explaining the cutting procedure of the cutting device of Fig. 10. [Main component symbol description] 100 Ceramic laminate 110 Moving portion 112 Impact rod 114 Stopper 116 Storage groove 120 Cutting portion 122 Cutting edge 123 Cutting edge 124 Blade holder 125 Fixing portion 126 Support portion 128 Rotating joint 130 Connecting portion 132 Elastic member 17 94647 201008739 300 Ceramic laminate 310 Moving portion 312 Impact rod 320 Cutting portion 322 Cutting edge 323 Cutting edge 324 Blade holder 325 Inclined portion 330 Stage 332 Vacuum portion 340 Station level support portion 342 Mounting groove 350 Elastic member 360 Foam double-sided tape 400 Ceramic laminate 410 Moving portion 420 Cutting portion 422 Cutting edge 425 Inclined portion 430 Stage level 432 Position fixing loss 440 Station level support portion 442 Mounting groove 450 Elastic member 460 Foam double-sided tape