TWI381792B - Printing circuit board of stacking structure - Google Patents
Printing circuit board of stacking structure Download PDFInfo
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- TWI381792B TWI381792B TW96132544A TW96132544A TWI381792B TW I381792 B TWI381792 B TW I381792B TW 96132544 A TW96132544 A TW 96132544A TW 96132544 A TW96132544 A TW 96132544A TW I381792 B TWI381792 B TW I381792B
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- circuit board
- printed circuit
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- stack structure
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Description
本發明係關於一種印刷電路板堆疊結構，尤其係關於一種用於攜帶式電子裝置之印刷電路板堆疊結構。 The present invention relates to a printed circuit board stack structure, and more particularly to a printed circuit board stack structure for a portable electronic device.
攜帶式電子裝置內部一般都具有一主印刷電路板，該主印刷電路板用以設置各電子元件。然該主印刷電路板安裝電子元件時，常會因為擺放電子元件之面積不足或元件擺放位置上之需求，需要增加一輔助印刷電路板，該輔助印刷電路板與所述主印刷電路板呈堆疊結構設置，即輔助印刷電路板距所述主印刷電路板一定高度且平行主印刷電路板設置，該輔助印刷電路板用以設置多餘之電子元件或出於位置考慮而設置之電子元件。印刷電路板上之電子元件，尤其係設置於主印刷電路板上之電子元件，由於電磁波干擾問題以及元件保護之考慮，常需要採用防護設計，其具體方法係在該電子元件之週邊設置一防護罩接地。 The interior of the portable electronic device generally has a main printed circuit board for setting the electronic components. When the main printed circuit board is mounted with electronic components, it is often necessary to add an auxiliary printed circuit board because the area of the electronic components is insufficient or the position of the components is placed. The auxiliary printed circuit board and the main printed circuit board are The stacking structure is arranged such that the auxiliary printed circuit board is disposed at a certain height from the main printed circuit board and is arranged in parallel with the main printed circuit board for arranging redundant electronic components or electronic components disposed for positional consideration. The electronic components on the printed circuit board, especially the electronic components disposed on the main printed circuit board, often need to adopt a protective design due to electromagnetic wave interference problems and component protection considerations, and the specific method is to provide a protection around the electronic components. The cover is grounded.
請參閱圖1，印刷電路板堆疊結構10包括一主印刷電路板12、一輔助印刷電路板14及一防護罩結構16。該主印刷電路板12上設置有電子元件122及連接器124，該電子元件122有必要進行電磁波干擾防護，該連接器124分別連接該主印刷電路板12與輔助印刷電路板14以達成主印刷電路板12與輔助印刷電路板14之訊號傳輸。所述防護罩結構16包括一防護框162及一防護蓋164，該防護框162圍繞該電子元件122設置，且焊接於主印刷電路板12上， 該防護蓋164封閉該防護框162且與防護框162焊接一體。如此，對電子元件122形成封閉，使電子元件122避免電磁波等干擾且電子元件122亦受到保護。安裝後，該輔助印刷電路板14與該防護蓋164鄰近或具有一定之間隙。該種印刷電路板堆疊結構具有一定之缺點，由於該防護蓋164具有一定之厚度，使得所述防護罩結構16整體厚度較高，增大了該印刷電路板堆疊結構10之整體堆疊高度，不利於製造輕薄之攜帶式電子裝置，且防護罩結構16之材料耗費較多。 Referring to FIG. 1, the printed circuit board stack structure 10 includes a main printed circuit board 12, an auxiliary printed circuit board 14, and a shield structure 16. The main printed circuit board 12 is provided with an electronic component 122 and a connector 124. The electronic component 122 is required to perform electromagnetic wave interference protection. The connector 124 is connected to the main printed circuit board 12 and the auxiliary printed circuit board 14 respectively to achieve main printing. The signal transmission of the circuit board 12 and the auxiliary printed circuit board 14. The protective cover structure 16 includes a protective frame 162 and a protective cover 164 disposed around the electronic component 122 and soldered to the main printed circuit board 12 . The protective cover 164 closes the shield frame 162 and is welded integrally with the shield frame 162. Thus, the electronic component 122 is closed, the electronic component 122 is protected from electromagnetic waves and the like, and the electronic component 122 is also protected. After installation, the auxiliary printed circuit board 14 is adjacent to or has a certain gap with the protective cover 164. The printed circuit board stack structure has certain disadvantages. Since the protective cover 164 has a certain thickness, the overall thickness of the shield structure 16 is relatively high, which increases the overall stack height of the printed circuit board stack structure 10, which is disadvantageous. In the manufacture of lightweight portable electronic devices, the material of the shield structure 16 is more expensive.
鑒於上述內容，有必要提供一種能降低高度，節省材料之印刷電路板堆疊結構。 In view of the above, it is necessary to provide a printed circuit board stack structure that can reduce the height and save material.
一種印刷電路板堆疊結構，包括一主印刷電路板、一防護框及一輔助印刷電路板，所述主印刷電路板上設置有電子元件，所述防護框設置於主電路板上包圍該電子元件，該防護框頂部為一開口結構，該防護框頂部連接所述輔助印刷電路板，該防護框包括框體、延伸部及連接部，該延伸部由該框體一端向框體內部垂直延伸形成，該連接部位於該框體一端之中間且連接該延伸部二相對側。 A printed circuit board stack structure comprising a main printed circuit board, a protective frame and an auxiliary printed circuit board, the main printed circuit board is provided with electronic components, and the protective frame is disposed on the main circuit board to surround the electronic component The top of the protective frame is an open structure, and the top of the protective frame is connected to the auxiliary printed circuit board. The protective frame includes a frame body, an extending portion and a connecting portion. The extending portion is vertically extended from one end of the frame body toward the inside of the frame body. The connecting portion is located in the middle of one end of the frame and is connected to the opposite side of the extending portion.
相較習知技術，本發明印刷電路板堆疊結構中防護框直接連接輔助印刷電路板，輔助印刷電路板取代了傳統印刷電路板堆疊結構中防護框頂部還需設計之防護蓋。通過減少防護蓋，輔助印刷電路板與防護框之間不存有間隙且亦較少了防護蓋之厚度，可大大降低印刷電板堆疊 結構之高度；通過減少防護蓋，亦節省了印刷電路板堆疊結構之使用材料。 Compared with the prior art, in the printed circuit board stack structure of the present invention, the protective frame is directly connected to the auxiliary printed circuit board, and the auxiliary printed circuit board replaces the protective cover which needs to be designed on the top of the protective frame in the conventional printed circuit board stack structure. By reducing the protective cover, there is no gap between the auxiliary printed circuit board and the protective frame, and the thickness of the protective cover is also reduced, which can greatly reduce the printed circuit board stack. The height of the structure; by reducing the protective cover, the material used for the printed circuit board stack structure is also saved.
請參閱圖2，本發明較佳實施例之一印刷電路板堆疊結構20包括一主印刷電路板22、一輔助印刷電路板24、一防護框26及若干螺釘28。所述主印刷電路板22上設置有若干第一電子元件222、一連接器224及若干螺柱226。所述第一電子元件222為需有電磁防護之電子元件。所述連接器224一端電性連接所述主印刷電路板22上之電路。所述輔助印刷電路板24之上表面上設置有第二電子元件241，該第二電子元件241為主印刷電路板22安置面積不足或因特殊需求而設置於該輔助印刷電路板24上之電子元件。所述防護框26呈方形框結構，該防護框26底部焊接於所述主印刷電路板22上且將所述第一電子元件222環繞於框內。 Referring to FIG. 2, a printed circuit board stack structure 20 of a preferred embodiment of the present invention includes a main printed circuit board 22, an auxiliary printed circuit board 24, a shield frame 26, and a plurality of screws 28. The main printed circuit board 22 is provided with a plurality of first electronic components 222, a connector 224 and a plurality of studs 226. The first electronic component 222 is an electronic component that requires electromagnetic protection. One end of the connector 224 is electrically connected to the circuit on the main printed circuit board 22. The second electronic component 241 is disposed on the upper surface of the auxiliary printed circuit board 24, and the second electronic component 241 is disposed on the auxiliary printed circuit board 24 with insufficient area or special requirements for the main printed circuit board 22. element. The shield frame 26 has a square frame structure, and the bottom of the shield frame 26 is soldered to the main printed circuit board 22 and surrounds the first electronic component 222 in the frame.
請參閱圖3，所述防護框26為一中空之框體結構，為金屬材質製成，該防護框26包括一環形框體262、一環形延伸部264及一連接部266。該環形框體262為一兩端開口之封閉環形框體，該環形延伸部264由框體262一端向框體262內部垂直延伸一定距離形成，該環形延伸部264上衝壓有若干間隔設置之凹口2642，該凹口2642中央亦衝壓形成有彈片2644，該彈片2644彎曲且具有向上彈起之趨勢。所述連接部266位於該環形框體262一端之中間位置且連接所述連接部264二相對側，該連接部266以更好地穩定該防護框26。所述環形框體262之另一端焊接至主印 刷電路板22上。 Referring to FIG. 3 , the shield frame 26 is a hollow frame structure made of a metal material. The shield frame 26 includes an annular frame 262 , an annular extending portion 264 , and a connecting portion 266 . The annular frame 262 is a closed annular frame that is open at both ends. The annular extension 264 is formed by an end of the frame 262 extending perpendicularly to the inside of the frame 262. The annular extension 264 is stamped with a plurality of recesses. The mouth 2642 is also stamped with a spring piece 2644 formed in the center of the notch 2642. The elastic piece 2644 is curved and has a tendency to bounce upward. The connecting portion 266 is located at an intermediate position of one end of the annular frame 262 and connects the opposite sides of the connecting portion 264 to better stabilize the protective frame 26. The other end of the annular frame 262 is soldered to the main print Brush the circuit board 22.
請參閱圖4，所述輔助印刷電路板24連接所述防護框26以遮蔽該防護框26未連接於主印刷電路板22之一端開口。該輔助印刷電路板24之內表面上形成有遮蔽區242及電連接區244，該遮蔽區242為多層材質形成，其內層為金屬材質。該遮蔽區242之周圍裸露若干金屬接觸點2422，輔助印刷電路板24遮蔽防護框26後，該金屬接觸點2422分別對應接觸所述防護框26之彈片2644。所述電連接區244位於該遮蔽區242之一側，其連通所述輔助印刷電路板24之電路，用以與所述主印刷電路板22上之連接器224連接，以達成所述主印刷電路板22與該輔助印刷電路板24之訊號傳輸。該輔助印刷電路板24上還形成有與所述螺柱226數量對應之若干螺孔246，螺釘28穿過所述螺孔246螺接至所述螺柱226，使該輔助印刷電路板24遮蔽所述防護框26。 Referring to FIG. 4, the auxiliary printed circuit board 24 is connected to the shield frame 26 to shield the shield frame 26 from being connected to one end opening of the main printed circuit board 22. A shielding area 242 and an electrical connection area 244 are formed on the inner surface of the auxiliary printed circuit board 24. The shielding area 242 is formed of a plurality of layers of materials, and the inner layer is made of a metal material. A plurality of metal contact points 2422 are exposed around the shielding area 242. After the auxiliary printed circuit board 24 shields the protective frame 26, the metal contact points 2422 respectively contact the elastic piece 2644 of the protective frame 26. The electrical connection region 244 is located on one side of the shielding region 242, and communicates with the circuit of the auxiliary printed circuit board 24 for connecting with the connector 224 on the main printed circuit board 22 to achieve the main printing. The signal transmission between the circuit board 22 and the auxiliary printed circuit board 24. The auxiliary printed circuit board 24 is further formed with a plurality of screw holes 246 corresponding to the number of the studs 226. The screws 28 are screwed through the screw holes 246 to the studs 226 to shield the auxiliary printed circuit board 24. The protective frame 26.
請參閱圖5，本發明印刷電路板堆疊結構20組裝後，所述輔助印刷電路板24內表面遮蔽所述防護框26，該輔助印刷電路板24上之金屬接觸點2422與所述防護框26之彈片2644接觸，所述電連接區244電性連接所述連接器224。該主印刷電路板22與該輔助電路板24及所述防護框26彼此間能電性導通，為所述第一電子元件222形成一防護罩，該主印刷電路板22通過接地端以導出電荷，有效防止輻射至該防護罩之電磁波之輻射，為第一電子元件222很好地提供了防護作用。另外，該第一電子元件222亦受到保護不易受外界損壞。 Referring to FIG. 5, after the printed circuit board stack structure 20 of the present invention is assembled, the inner surface of the auxiliary printed circuit board 24 shields the shield frame 26, and the metal contact points 2422 and the shield frame 26 on the auxiliary printed circuit board 24. The elastic piece 2644 is in contact, and the electrical connection area 244 is electrically connected to the connector 224. The main printed circuit board 22 and the auxiliary circuit board 24 and the shield frame 26 are electrically connected to each other to form a shield for the first electronic component 222. The main printed circuit board 22 is grounded to derive a charge. The radiation of the electromagnetic wave radiated to the shield is effectively prevented, and the first electronic component 222 is well protected. In addition, the first electronic component 222 is also protected from external damage.
本發明印刷電路板堆疊結構20中防護框26直接連接輔助印刷電路板24，輔助印刷電路板24取代了傳統印刷電路板堆疊結構中防護框26頂部還需設計之防護蓋。通過減少防護蓋，輔助印刷電路板24與防護框26之間不存有間隙且亦減去了防護蓋之厚度，可大大降低印刷電板堆疊結構20之高度；通過減少防護蓋，亦節省了印刷電路板堆疊結構20之使用材料。 In the printed circuit board stack structure 20 of the present invention, the shield frame 26 is directly connected to the auxiliary printed circuit board 24, and the auxiliary printed circuit board 24 replaces the protective cover which is also required to be designed on the top of the shield frame 26 in the conventional printed circuit board stack structure. By reducing the protective cover, there is no gap between the auxiliary printed circuit board 24 and the shield frame 26, and the thickness of the protective cover is also reduced, the height of the printed circuit board stack structure 20 can be greatly reduced; and the protective cover is also saved by saving The materials used for the printed circuit board stack structure 20.
可以理解，本發明可不採用該輔助印刷電路板24上之金屬接觸點2422與所述防護框26之彈片2644接觸之設計，即輔助印刷電路板24之內表面為金屬表面直接與防護框26接觸。 It can be understood that the present invention may not adopt the design that the metal contact point 2422 on the auxiliary printed circuit board 24 is in contact with the elastic piece 2644 of the shield frame 26, that is, the inner surface of the auxiliary printed circuit board 24 is a metal surface directly contacting the shield frame 26. .
10、20‧‧‧印刷電路板堆疊結構 10, 20‧‧‧ Printed circuit board stack structure
241‧‧‧第二電子元件 241‧‧‧Second electronic components
12、22‧‧‧主印刷電路板 12, 22‧‧‧ main printed circuit board
262‧‧‧環形框體 262‧‧‧ ring frame
14、24‧‧‧輔助印刷電路板 14, 24‧‧‧Auxiliary printed circuit boards
264‧‧‧環形延伸部 264‧‧‧Circular extension
16‧‧‧防護罩結構 16‧‧‧Shield structure
266‧‧‧連接部 266‧‧‧Connecting Department
122‧‧‧電子元件 122‧‧‧Electronic components
2642‧‧‧凹口 2642‧‧‧ Notch
124、224‧‧‧連接器 124, 224‧‧‧ connectors
2644‧‧‧彈片 2644‧‧‧Shrap
162、26‧‧‧防護框 162, 26‧‧ ‧ protective frame
242‧‧‧遮蔽區 242‧‧‧ shaded area
164‧‧‧防護蓋 164‧‧‧ protective cover
244‧‧‧電連接區 244‧‧‧Electrical connection area
28‧‧‧螺釘 28‧‧‧ screws
2422‧‧‧金屬接觸點 2422‧‧‧Metal contact points
222‧‧‧第一電子元件 222‧‧‧First electronic component
246‧‧‧螺孔 246‧‧‧ screw holes
226‧‧‧螺柱 226‧‧‧ Stud
圖1係傳統印刷電路板堆疊結構之分解示意圖；圖2係本發明印刷電路板堆疊結構之分解示意圖；圖3係本發明防護框之結構示意圖；圖4係本發明防護蓋一內表面示意圖；圖5係本發明印刷電路板堆疊結構之整體示意圖。 1 is an exploded perspective view of a conventional printed circuit board stack structure; FIG. 2 is an exploded perspective view of the printed circuit board stack structure of the present invention; FIG. 3 is a schematic structural view of the protective frame of the present invention; Figure 5 is a schematic overall view of the stacked structure of the printed circuit board of the present invention.
20‧‧‧印刷電路板堆疊結構 20‧‧‧Printed circuit board stack structure
222‧‧‧第一電子元件 222‧‧‧First electronic component
22‧‧‧主印刷電路板 22‧‧‧Main printed circuit board
224‧‧‧連接器 224‧‧‧Connector
24‧‧‧輔助印刷電路板 24‧‧‧Auxiliary printed circuit board
226‧‧‧螺柱 226‧‧‧ Stud
26‧‧‧防護框 26‧‧‧ protective frame
241‧‧‧第二電子元件 241‧‧‧Second electronic components
28‧‧‧螺釘 28‧‧‧ screws
246‧‧‧螺孔 246‧‧‧ screw holes
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132544A TWI381792B (en) | 2007-08-31 | 2007-08-31 | Printing circuit board of stacking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132544A TWI381792B (en) | 2007-08-31 | 2007-08-31 | Printing circuit board of stacking structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200911090A TW200911090A (en) | 2009-03-01 |
| TWI381792B true TWI381792B (en) | 2013-01-01 |
Family
ID=44724574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96132544A TWI381792B (en) | 2007-08-31 | 2007-08-31 | Printing circuit board of stacking structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI381792B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281090B1 (en) * | 1996-10-16 | 2001-08-28 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards with plated resistors |
| TWM298326U (en) * | 2006-01-27 | 2006-09-21 | Askey Computer Corp | Circuit board device suppressing electromagnetic interference |
| TWI280845B (en) * | 2006-03-15 | 2007-05-01 | Mitac Int Corp | Electromagnetic interference suppressing structure and printed circuit board thereof |
-
2007
- 2007-08-31 TW TW96132544A patent/TWI381792B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6281090B1 (en) * | 1996-10-16 | 2001-08-28 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards with plated resistors |
| TWM298326U (en) * | 2006-01-27 | 2006-09-21 | Askey Computer Corp | Circuit board device suppressing electromagnetic interference |
| TWI280845B (en) * | 2006-03-15 | 2007-05-01 | Mitac Int Corp | Electromagnetic interference suppressing structure and printed circuit board thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200911090A (en) | 2009-03-01 |
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