WO2020188758A1 - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
WO2020188758A1
WO2020188758A1 PCT/JP2019/011511 JP2019011511W WO2020188758A1 WO 2020188758 A1 WO2020188758 A1 WO 2020188758A1 JP 2019011511 W JP2019011511 W JP 2019011511W WO 2020188758 A1 WO2020188758 A1 WO 2020188758A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
ceramic capacitor
chip ceramic
board
printed wiring
Prior art date
Application number
PCT/JP2019/011511
Other languages
French (fr)
Japanese (ja)
Inventor
中村　太郎
鈴木　洋平
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2019/011511 priority Critical patent/WO2020188758A1/en
Priority to JP2021506901A priority patent/JP7123236B2/en
Publication of WO2020188758A1 publication Critical patent/WO2020188758A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to a circuit board on which a chip ceramic capacitor is mounted.
  • a ceramic capacitor is a capacitor constructed by using a ceramic material as a dielectric, and is generally used for noise suppression, voltage stabilization, signal frequency filter, and the like.
  • the chip ceramic capacitor is a ceramic capacitor configured in the shape of a rectangular parallelepiped chip. Chip ceramic capacitors are used with electrodes on both ends, the electrodes connected by soldering to lands on the circuit board.
  • chip ceramic capacitors are electronic components that are prone to cracks when distorted, and when cracks occur, they fail in a short state or an open state. If the circuit board is distorted when dividing a multi-sheet circuit board, attaching the circuit board to the product, or inserting or removing the housing from the connector mounted on the circuit board, the chip mounted on the circuit board The ceramic capacitor may also be distorted and the chip ceramic capacitor may crack.
  • a dedicated dividing jig may be used to reduce the distortion that occurs in the circuit board when dividing a circuit board with multiple sheets.
  • a dedicated dividing jig it may not be possible to mount a component having a height relatively higher than that of other components near the end face of the circuit board due to structural restrictions of the jig.
  • Patent Document 1 discloses a circuit board in which an electronic component is mounted on a substrate, and the circuit board is provided with a band-shaped adhesive layer on the substrate along at least a part of a peripheral portion of the electronic component. There is.
  • the strip-shaped adhesive layer cannot function as a part of the circuit board. For this reason, the strip-shaped adhesive layer becomes a constraint on the board design of the circuit board, and the design of the circuit board becomes more difficult due to restrictions such as noise countermeasures and insulation distance.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a circuit board capable of relaxing the restriction of the arrangement area of the chip ceramic capacitor and improving the degree of freedom in board design.
  • the circuit board according to the present invention includes a printed wiring board and a chip ceramic capacitor mounted on the printed wiring board.
  • reinforcing parts having a relatively higher rigidity than the printed wiring board are mounted in the plane of the circuit board.
  • the reinforcing component is arranged within a predetermined distance from the peripheral edge of the chip ceramic capacitor on the side facing the reinforcing component in the plane of the circuit board.
  • the circuit board according to the present invention has the effect that it is possible to relax the restrictions on the arrangement area of the chip ceramic capacitor and improve the degree of freedom in board design.
  • Cross-sectional view of a main part showing a main configuration of another circuit board according to the first embodiment of the present invention A perspective view showing a main configuration of another circuit board according to the first embodiment of the present invention.
  • FIG. 1 is a plan view showing a main configuration of the circuit board 1 according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a main part of the circuit board 1 shown in FIG. 1, and is a cross-sectional view of the main part of the circuit board 1 along the chip ceramic capacitor 2.
  • FIG. 2 shows a cross section of the outer shape of the chip ceramic capacitor 2 in the plane of the circuit board 1 along the longitudinal direction.
  • FIG. 3 is a cross-sectional view of a main part of the circuit board 1 shown in FIG. 1, and is a cross-sectional view of the main part along the metal plate 6.
  • the circuit board 1 is built in an electric / electronic device and operates by receiving electric power from a commercial power source or a power source such as a battery.
  • the circuit board 1 drives various devices by supplying electric power to various devices such as various actuators and various sensors connected to the circuit board 1 and transmitting and receiving electric signals to and from the various devices. That is, the circuit board 1 is a control board provided for realizing the functions of electrical and electronic equipment, and is a component generally having a plate shape.
  • the circuit board 1 is a circuit board in which electronic components are soldered to a printed wiring board 11 to form an electronic circuit.
  • the printed wiring board 11 has a known structure, and has a wiring pattern 13 on one side and the other side facing back in the insulating substrate 12, a solder resist layer 14 which is an insulating layer laminated on the surface of the insulating substrate 12, and terminals of electronic components. It is equipped with a land 5 or the like to which is connected.
  • the circuit board 1 is formed between the surface of the insulating substrate 12 made of a resin plate made of glass epoxy or a resin plate made of paper phenol, and the solder resist layer 14 and the solder resist layer 14 laminated on the surface of the insulating substrate 12.
  • the wiring pattern 13 is formed on the surface.
  • the wiring pattern 13 is made of a metal foil having a relatively low electrical resistivity among metals such as copper and aluminum.
  • a circuit board called a flexible substrate that can be bent by using a thin film-like resin.
  • circuit board 1 components such as a chip ceramic capacitor 2, an integrated circuit 3, and a substrate mounting connector 4 are mounted on one side 11a of the printed wiring board 11 as electronic components.
  • the electronic component is fixed to the land 5 made of the metal foil of the wiring pattern 13 exposed on the surface without the solder resist layer 14 being laminated by using a method such as soldering.
  • the circuit board 1 includes electronic components such as transistors, connectors, and fuses, but these are omitted here.
  • a plurality of chip ceramic capacitors 2 are mounted on the circuit board 1 along the peripheral edge portion 1a of the circuit board in the in-plane direction of the circuit board 1. That is, as shown in FIG. 1, three chip ceramic capacitors 2 are mounted on the circuit board 1 along the peripheral edge of the printed wiring board 11.
  • the chip ceramic capacitor 2 is mounted in a state in which the longitudinal direction of the outer shape in the plane of the circuit board 1 is parallel to the extending direction of the peripheral edge portion 1a of the circuit board.
  • the chip ceramic capacitor 2 is mounted by being electrically connected to the two lands 5 in a state of straddling the two electrically insulated lands 5.
  • the chip ceramic capacitor 2 is soldered and connected to the land 5 by the solder 7.
  • Solder 7 is an alloy containing tin as a main component, which is used for joining an electronic component and a printed wiring board 11 by utilizing its low melting point.
  • the chip ceramic capacitor 2 is a chip-shaped ceramic capacitor, which is a type of capacitor that uses a ceramic material as a dielectric, and plays a role in voltage stabilization, noise reduction, signal frequency filter, etc. in the circuit board 1. Is responsible for.
  • the circuit board 1 is a metal plate on the surface of the region between the chip ceramic capacitor 2 and the peripheral portion 1a of the circuit board along the longitudinal direction of the outer shape of the chip ceramic capacitor 2 in the plane of the circuit board 1.
  • 6 is arranged.
  • the peripheral edge portion 1a of the circuit board is the circuit board 1 having a square outer shape in the plane of the circuit board 1, and is closer to the chip ceramic capacitor 2 among the two sides facing each other with the chip ceramic capacitor 2 sandwiched. It is the peripheral edge of the circuit board located on the side.
  • the metal plate 6 is arranged in the plane of the circuit board 1 in a state in which the longitudinal direction is along the plane of the circuit board 1 within a range of a predetermined distance from the peripheral edge of the chip ceramic capacitor 2. ..
  • the peripheral edge of the chip ceramic capacitor 2 here is the peripheral edge of the chip ceramic capacitor 2 on the side facing the metal plate 6 in the plane of the circuit board 1.
  • the metal plate 6 is a plate-shaped reinforcing component that reinforces the rigidity of the circuit board 1 and is made of a material having a rigidity relatively higher than that of the printed wiring board 11.
  • a metal plate 6 made of a material having conductivity, a relatively small electrical resistivity among metals, and a relatively higher rigidity than the printed wiring board 11 is used as a reinforcing component.
  • the metal plate 6 is made of, for example, copper.
  • the regions on both ends in the longitudinal direction are connected to the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge 1a of the circuit board by soldering.
  • the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board is partially divided.
  • the pattern end region 13a and the pattern end region 13b, which are regions on the divided end side, are exposed from the solder resist layer 14.
  • the metal plate 6 is fixed to the pattern end region 13a and the pattern end region 13b by soldering. That is, the metal plate 6 is arranged by electrically connecting the two divided ends of the wiring pattern 13 exposed from the solder resist layer 14.
  • the metal plate 6 arranged in this way has a function as a substitute for the wiring pattern 13 in the region divided in the wiring pattern 13. That is, since the metal plate 6, which is a reinforcing component having conductivity, has a function as a part of the wiring pattern 13 and can be used as the wiring pattern 13, the degree of freedom in the board design of the circuit board 1 is improved. Can be made to.
  • the metal plate 6 having a relatively higher rigidity than the printed wiring board 11 is arranged in the plane of the circuit board 1 within a range of a predetermined separation distance from the peripheral edge portion of the chip ceramic capacitor 2. It is possible to increase the rigidity of the region around the metal plate 6 in the plane of the circuit board 1 and improve the bending strength of the region around the metal plate 6 and the bending strength of the entire circuit board 1. That is, the region around the metal plate 6 on the circuit board 1 is less likely to be distorted.
  • the circuit board 1 when manufacturing the circuit board 1, when dividing a plurality of circuit boards, attaching the circuit board to the product, inserting and removing the housing from the connector mounted on the circuit board, etc., the circuit board 1 It is possible to suppress the occurrence of cracks in the chip ceramic capacitor 2 even when the chip ceramic capacitor 2 is distorted. That is, when the metal plate 6 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, it occurs on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
  • the separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 and the rigidity of the metal plate 6 so as to prevent cracks from occurring in the chip ceramic capacitor 2. Further, the material of the metal plate 6 and the thickness and width of the metal plate 6 may be appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as the rigidity of the printed wiring board 11.
  • the metal plate 6 is preferably arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board.
  • the rigidity of the region around the peripheral portion 1a of the circuit board where bending is likely to occur is increased, and the circuit board It is possible to improve the bending strength of the region around the peripheral edge portion 1a of the circuit board 1 and the bending strength of the entire circuit board 1. As a result, it is possible to more reliably suppress the occurrence of cracks in the chip ceramic capacitor 2 arranged on the inner side of the metal plate 6 in the plane of the circuit board 1 at the time of manufacturing the circuit board 1 described above.
  • one long metal plate 6 is arranged along the longitudinal direction of the outer shape of the plurality of chip ceramic capacitors 2 in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board. ing. However, the metal plate 6 may be divided between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board as long as the cracks in the chip ceramic capacitor 2 can be suppressed.
  • FIG. 4 is a cross-sectional view of a main part showing a main configuration of another circuit board 21 according to the first embodiment of the present invention.
  • the other circuit board 21 shown in FIG. 4 is different from the circuit board 1 described above in that the metal plate 6 is mounted on the surface of the other surface 11b of the printed wiring board 11.
  • the metal plate 6 is arranged on the other surface 11b of the printed wiring board 11 in the area corresponding to the chip ceramic capacitor 2 in the surface of the circuit board 1. That is, the chip ceramic capacitor 2 is arranged on the other surface 11b of the printed wiring board 11 within the surface of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2. Then, the metal plate 6 is fixed to the pattern end region 13c and the pattern end region 13d, which are regions on the divided end side of the wiring pattern 13 arranged on the other surface 11b of the printed wiring board 11, by soldering. Has been done.
  • the other circuit board 21 configured in this way can obtain the same effect as the circuit board 1 described above.
  • the metal plate 6 is arranged in the area corresponding to the chip ceramic capacitor 2 in the surface of the circuit board 1 on the surface of the other surface 11b of the printed wiring board 11 . If the metal plate 6 is arranged on the other surface 11b of the printed wiring board 11 within the plane of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2, the circuit board described above is described. The same effect as in 1 can be obtained.
  • the metal plate 6 divides the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board in the plane of the circuit board 1 on the other surface 11b of the printed wiring board 11. It may be fixed by soldering to the two end regions. Also in this case, the same effect as that of the circuit board 1 described above can be obtained by arranging the metal plate 6 within the range of the predetermined distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1. Be done.
  • FIG. 5 is a perspective view showing a main configuration of another circuit board 31 according to the first embodiment of the present invention.
  • the other circuit board 31 basically has the same configuration as the circuit board 1 described above.
  • the heat sink 8 is used as a reinforcing component for reinforcing the rigidity of the circuit board 1.
  • a heat sink 8 which is a fin-shaped reinforcing component is mounted in a region adjacent to the chip ceramic capacitor 2 mounted on one surface 11a of the printed wiring board 11.
  • the heat sink 8 is arranged on the surface of one side 11a of the printed wiring board 11 so as to surround the semiconductor element 9 which is an electronic component mounted on the one side 11a of the printed wiring board 11, and the heat generated by the semiconductor element 9 is generated.
  • the heat sink 8 is arranged in the plane of the circuit board 1 within a range of a predetermined distance from the peripheral edge of the chip ceramic capacitor 2.
  • the separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 and the rigidity of the heat sink 8 so as to prevent cracks from occurring in the chip ceramic capacitor 2. Further, the material of the heat sink 8 and the dimensions and shape of the heat sink 8 are appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as heat generation characteristics of the semiconductor element 9 and rigidity of the printed wiring board 11. Just do it.
  • the heat sink 8 having a rigidity relatively higher than that of the printed wiring board 11 has a predetermined distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1.
  • the rigidity of the region around the heat sink 8 in the plane of the circuit board 1 is increased, and the bending strength of the region around the heat sink 8 and the bending strength of the entire circuit board 1 are improved. Is possible.
  • the heat sink 8 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, so that the heat sink 8 is generated on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
  • the heat sink 8 may be mounted on the surface of the other surface 11b of the printed wiring board 11 as in the case of the other circuit board 21 shown in FIG. Also in this case, by arranging the heat sink 8 within the range of the predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, the same effect as that of the other circuit board 31 described above can be obtained. can get.
  • FIG. 6 is a perspective view showing a main configuration of another circuit board 41 according to the first embodiment of the present invention.
  • the other circuit board 41 basically has the same configuration as the circuit board 1 described above.
  • solder 42 which is a conductive metal material, is used as a reinforcing component for reinforcing the rigidity of the circuit board 1.
  • the wiring pattern 13 located around the chip ceramic capacitor 2 covers the solder resist layer 14. It is exposed from the solder resist layer 14 without being damaged. Then, the solder 42 is piled up on the wiring pattern 13 exposed from the solder resist layer 14.
  • the wiring pattern 13 exposed from the solder resist layer 14 is arranged within the plane of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2.
  • the separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 so as to be a distance capable of suppressing the occurrence of cracks in the chip ceramic capacitor 2. Further, the material of the solder 42, the amount of the solder 42, and the shape of the solder 42 may be appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as the rigidity of the printed wiring board 11. ..
  • the solder 42 having a relatively higher rigidity than the printed wiring board 11 is separated from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1 by a predetermined distance.
  • the rigidity of the region around the solder 42 in the plane of the circuit board 1 is increased, and the bending strength of the region around the solder 42 and the bending strength of the entire circuit board 1 are improved. Is possible.
  • the solder 42 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, so that the solder 42 is generated on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
  • the solder 42 is arranged on the wiring pattern 13 arranged around the chip ceramic capacitor 2 in the plane of the circuit board 1, the solder 42 is arranged on the wiring pattern 13 arranged around the chip ceramic capacitor 2 without disturbing the arrangement of the other circuit board. , The solder 42 can be easily arranged, and the reinforcing component does not become a restriction on the board design of the other circuit board 41.
  • solder 42 since the solder 42 has conductivity, the function of the wiring pattern 13 is not impaired even if it is arranged on the wiring pattern 13 exposed from the solder resist layer 14.
  • the solder 42 which is a reinforcing component having conductivity, has a function as a part of the wiring pattern 13 and can be used as the wiring pattern 13.
  • solder 42 may be mounted on the other surface 11b of the printed wiring board 11 as in the case of the other circuit board 21 shown in FIG. Also in this case, the solder 42 is arranged on the wiring pattern 13 arranged within the range of the predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, whereby the other described above is performed. The same effect as that of the circuit board 41 can be obtained.
  • all the reinforcing parts have the function of any one of the components of the circuit board in addition to the function of reinforcing the rigidity of the circuit board. That is, in the circuit board 1, the other circuit board 21, the other circuit board 31, and the other circuit board 41 described above, the reinforcing components are all within a predetermined distance range from the peripheral edge of the chip ceramic capacitor 2. It constitutes a part of a component of a circuit board such as a wiring pattern 13 or a semiconductor element 9 arranged inside, or uses the component itself of the circuit board.
  • the reinforcing component does not impose restrictions on the board design of the circuit board and does not limit the position of the chip ceramic capacitor 2 on the circuit board, and the chip ceramic capacitor 2 is caused by the distortion generated in the circuit board. The occurrence of cracks can be suppressed.
  • the end face of the circuit board is not subject to the structural restrictions of the jig. It is possible to mount relatively high parts in the vicinity.
  • the first embodiment it is possible to relax the restriction on the arrangement area of the chip ceramic capacitor 2 on the circuit board and improve the degree of freedom in the board design of the circuit board.
  • 1 Circuit board 1a Peripheral part of circuit board, 2 Chip ceramic capacitor, 3 Integrated circuit, 4 Board mounting connector, 5 Land, 6 Metal plate, 7,42 Solder, 8 Heat shield, 9 Semiconductor element, 11 Printed wiring board, 11a One side, 11b other side, 12 insulating substrate, 13 wiring pattern, 13a, 13b, 13c, 13d pattern end region, 14 solder resist layer, 21, 31, 41 other circuit boards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

This circuit board (1) is provided with a printed wiring board (11) and chip ceramic capacitors (2) mounted on the printed wiring board (11). The circuit board (1) has a reinforcement component mounted in the plane of the circuit board (1), the stiffness of the reinforcement component being relatively higher than the printed circuit board (11). The reinforcement component is disposed within a range of a predetermined separation distance from a peripheral part of the chip ceramic capacitors (2) on the side facing the reinforcement component within the plane of the circuit board (1). The circuit board (1) enables constraints of the disposition region of the chip ceramic capacitors to be loosened and enables freedom of board design to be improved.

Description

回路基板Circuit board
　本発明は、チップセラミックコンデンサが搭載された回路基板に関する。 The present invention relates to a circuit board on which a chip ceramic capacitor is mounted.
　従来、チップセラミックコンデンサが搭載された回路基板が広く用いられている。セラミックコンデンサは、セラミック材料を誘電体に用いて構成されたコンデンサであり、一般的にはノイズの抑制、電圧の安定化、信号周波数のフィルタなどの用途に使用される。チップセラミックコンデンサは、セラミックコンデンサが直方体のチップ形状に構成されたものである。チップセラミックコンデンサは、両端に電極を備え、電極が回路基板上のランドにはんだ付けによって接続されて使用される。 Conventionally, circuit boards equipped with chip ceramic capacitors have been widely used. A ceramic capacitor is a capacitor constructed by using a ceramic material as a dielectric, and is generally used for noise suppression, voltage stabilization, signal frequency filter, and the like. The chip ceramic capacitor is a ceramic capacitor configured in the shape of a rectangular parallelepiped chip. Chip ceramic capacitors are used with electrodes on both ends, the electrodes connected by soldering to lands on the circuit board.
　一般的にチップセラミックコンデンサは、歪むとクラックが生じやすい電子部品であり、クラックが生じるとショート状態またはオープン状態で故障する。複数枚取りの回路基板を分割する時、回路基板を製品に取り付ける時、および回路基板に実装されたコネクタにハウジングを挿抜する時などに回路基板に歪みが生じると、回路基板に実装されたチップセラミックコンデンサにも歪みが生じてチップセラミックコンデンサにクラックが生じることがある。 In general, chip ceramic capacitors are electronic components that are prone to cracks when distorted, and when cracks occur, they fail in a short state or an open state. If the circuit board is distorted when dividing a multi-sheet circuit board, attaching the circuit board to the product, or inserting or removing the housing from the connector mounted on the circuit board, the chip mounted on the circuit board The ceramic capacitor may also be distorted and the chip ceramic capacitor may crack.
　このため、チップセラミックコンデンサにクラックを発生させないためには、チップセラミックコンデンサを回路基板の端面付近に実装することは避けることが好ましい。したがって、チップセラミックコンデンサを回路基板に実装する際には、チップセラミックコンデンサをできるだけ回路基板の面内における内部側に実装することが一般的である。すなわち、回路基板におけるチップセラミックコンデンサの配置領域には、実質的に制限が存在する。 Therefore, in order to prevent cracks from occurring in the chip ceramic capacitor, it is preferable to avoid mounting the chip ceramic capacitor near the end face of the circuit board. Therefore, when mounting the chip ceramic capacitor on the circuit board, it is common to mount the chip ceramic capacitor on the inner side in the plane of the circuit board as much as possible. That is, there is a substantial limitation on the arrangement region of the chip ceramic capacitor on the circuit board.
　また、複数枚取りの回路基板を分割する時に回路基板に発生する歪みを低減するために、専用の分割治具が使用されることがある。しかしながら、専用の分割治具を使用する場合には、治具の構造的な制約によって回路基板の端面付近に他の部品に比べて相対的に高さ高いの部品を実装できない場合がある。 In addition, a dedicated dividing jig may be used to reduce the distortion that occurs in the circuit board when dividing a circuit board with multiple sheets. However, when a dedicated dividing jig is used, it may not be possible to mount a component having a height relatively higher than that of other components near the end face of the circuit board due to structural restrictions of the jig.
　また、特許文献１には、電子部品を基板に実装した回路基板であって、電子部品の周縁部の少なくとも一部に沿って、基板上に帯状接着剤層を備えた回路基板が開示されている。 Further, Patent Document 1 discloses a circuit board in which an electronic component is mounted on a substrate, and the circuit board is provided with a band-shaped adhesive layer on the substrate along at least a part of a peripheral portion of the electronic component. There is.
特開２０１０－２１２５４２号公報JP-A-2010-212542
　しかしながら、上記特許文献１の回路基板によれば、帯状接着剤層は回路基板の一部として機能することができない。このため、帯状接着剤層は回路基板の基板設計上での制約となり、ノイズ対策および絶縁距離などの制約がある中で、回路基板の設計を更に困難にしている。 However, according to the circuit board of Patent Document 1, the strip-shaped adhesive layer cannot function as a part of the circuit board. For this reason, the strip-shaped adhesive layer becomes a constraint on the board design of the circuit board, and the design of the circuit board becomes more difficult due to restrictions such as noise countermeasures and insulation distance.
　本発明は、上記に鑑みてなされたものであって、チップセラミックコンデンサの配置領域の制約を緩和し、基板設計の自由度を向上させることが可能な回路基板を得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a circuit board capable of relaxing the restriction of the arrangement area of the chip ceramic capacitor and improving the degree of freedom in board design.
　上述した課題を解決し、目的を達成するために、本発明にかかる回路基板は、プリント配線板と、プリント配線板に実装されたチップセラミックコンデンサと、を備える。回路基板は、回路基板の面内に、剛性が相対的にプリント配線板よりも高い補強部品が実装される。補強部品は、回路基板の面内において補強部品に対向する側のチップセラミックコンデンサの周縁部から予め決められた離間距離の範囲内に配置されている。 In order to solve the above-mentioned problems and achieve the object, the circuit board according to the present invention includes a printed wiring board and a chip ceramic capacitor mounted on the printed wiring board. In the circuit board, reinforcing parts having a relatively higher rigidity than the printed wiring board are mounted in the plane of the circuit board. The reinforcing component is arranged within a predetermined distance from the peripheral edge of the chip ceramic capacitor on the side facing the reinforcing component in the plane of the circuit board.
　本発明にかかる回路基板は、チップセラミックコンデンサの配置領域の制約を緩和し、基板設計の自由度を向上させることが可能である、という効果を奏する。 The circuit board according to the present invention has the effect that it is possible to relax the restrictions on the arrangement area of the chip ceramic capacitor and improve the degree of freedom in board design.
本発明の実施の形態１にかかる回路基板の主要な構成を示す平面図Top view showing the main structure of the circuit board which concerns on Embodiment 1 of this invention. 図１に示す回路基板の要部断面図であり、回路基板におけるチップセラミックコンデンサに沿った要部断面図It is sectional drawing of the main part of the circuit board shown in FIG. 1, and is the sectional view of the main part along the chip ceramic capacitor in the circuit board. 図１に示す回路基板の要部断面図であり、金属プレートに沿った要部断面図It is sectional drawing of the main part of the circuit board shown in FIG. 1, and is the sectional view of the main part along a metal plate. 本発明の実施の形態１にかかる他の回路基板の主要な構成を示す要部断面図Cross-sectional view of a main part showing a main configuration of another circuit board according to the first embodiment of the present invention. 本発明の実施の形態１にかかる他の回路基板の主要な構成を示す斜視図A perspective view showing a main configuration of another circuit board according to the first embodiment of the present invention. 本発明の実施の形態１にかかる他の回路基板の主要な構成を示す斜視図A perspective view showing a main configuration of another circuit board according to the first embodiment of the present invention.
　以下に、本発明の実施の形態にかかる回路基板を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 The circuit board according to the embodiment of the present invention will be described in detail below with reference to the drawings. The present invention is not limited to this embodiment.
実施の形態１．
　図１は、本発明の実施の形態１にかかる回路基板１の主要な構成を示す平面図である。図２は、図１に示す回路基板１の要部断面図であり、回路基板１におけるチップセラミックコンデンサ２に沿った要部断面図である。図２では、回路基板１の面内におけるチップセラミックコンデンサ２の外形形状の長手方向に沿った断面を示している。図３は、図１に示す回路基板１の要部断面図であり、金属プレート６に沿った要部断面図である。 Embodiment 1.
FIG. 1 is a plan view showing a main configuration of the circuit board 1 according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part of the circuit board 1 shown in FIG. 1, and is a cross-sectional view of the main part of the circuit board 1 along the chip ceramic capacitor 2. FIG. 2 shows a cross section of the outer shape of the chip ceramic capacitor 2 in the plane of the circuit board 1 along the longitudinal direction. FIG. 3 is a cross-sectional view of a main part of the circuit board 1 shown in FIG. 1, and is a cross-sectional view of the main part along the metal plate 6.
　本実施の形態１にかかる回路基板１は、電気電子機器に内蔵され、商用電源または電池などの電源から電力の供給を受けて動作する。回路基板１は、回路基板１に接続された各種アクチュエータおよび各種センサといった各種装置に電力を供給し、また各種装置との間で電気信号を送受信することにより、各種装置を駆動する。すなわち、回路基板１は、電気電子機器の機能を実現するために設けられた制御基板である、一般的に板形状を呈する部品である。 The circuit board 1 according to the first embodiment is built in an electric / electronic device and operates by receiving electric power from a commercial power source or a power source such as a battery. The circuit board 1 drives various devices by supplying electric power to various devices such as various actuators and various sensors connected to the circuit board 1 and transmitting and receiving electric signals to and from the various devices. That is, the circuit board 1 is a control board provided for realizing the functions of electrical and electronic equipment, and is a component generally having a plate shape.
　本実施の形態１にかかる回路基板１は、プリント配線板１１に電子部品がはんだ付けされて電子回路が形成された回路基板である。プリント配線板１１は、公知の構造を備え、絶縁基板１２において背向する一面および他面に配線パターン１３、絶縁基板１２の表面に積層された絶縁層であるソルダーレジスト層１４、電子部品の端子が接続されるランド５などを備えている。 The circuit board 1 according to the first embodiment is a circuit board in which electronic components are soldered to a printed wiring board 11 to form an electronic circuit. The printed wiring board 11 has a known structure, and has a wiring pattern 13 on one side and the other side facing back in the insulating substrate 12, a solder resist layer 14 which is an insulating layer laminated on the surface of the insulating substrate 12, and terminals of electronic components. It is equipped with a land 5 or the like to which is connected.
　すなわち、回路基板１は、ガラスエポキシ製の樹脂板または紙フェノール製の樹脂板からなる絶縁基板１２の表面、および絶縁基板１２の表面に積層されたソルダーレジスト層１４とソルダーレジスト層１４との間に、配線パターン１３が形成されている。配線パターン１３は、銅およびアルミニウムなどの、金属の中で相対的に電気抵抗率の低い金属の箔により構成されている。なお、板形状を有する回路基板以外にも、薄いフィルム状の樹脂を使用することで曲げることが可能とされたフレキシブル基板と呼ばれる回路基板もある。 That is, the circuit board 1 is formed between the surface of the insulating substrate 12 made of a resin plate made of glass epoxy or a resin plate made of paper phenol, and the solder resist layer 14 and the solder resist layer 14 laminated on the surface of the insulating substrate 12. The wiring pattern 13 is formed on the surface. The wiring pattern 13 is made of a metal foil having a relatively low electrical resistivity among metals such as copper and aluminum. In addition to the circuit board having a plate shape, there is also a circuit board called a flexible substrate that can be bent by using a thin film-like resin.
　回路基板１は、電子部品として、チップセラミックコンデンサ２、集積回路３および基板実装コネクタ４などの部品がプリント配線板１１の一面１１ａに実装されている。電子部品は、ソルダーレジスト層１４が積層されずに表面に露出した配線パターン１３の金属箔からなるランド５に、はんだ付けなどの方法を用いて固着されている。なお、回路基板１は、これらの他にもトランジスタ、コネクタ、ヒューズなどの電子部品を備えるがここでは省略する。 In the circuit board 1, components such as a chip ceramic capacitor 2, an integrated circuit 3, and a substrate mounting connector 4 are mounted on one side 11a of the printed wiring board 11 as electronic components. The electronic component is fixed to the land 5 made of the metal foil of the wiring pattern 13 exposed on the surface without the solder resist layer 14 being laminated by using a method such as soldering. In addition to these, the circuit board 1 includes electronic components such as transistors, connectors, and fuses, but these are omitted here.
　回路基板１は、図１に示すように、回路基板１の面内方向における回路基板の周縁部１ａに沿って複数のチップセラミックコンデンサ２が実装されている。すなわち、回路基板１は、図１に示すようにプリント配線板１１の周縁部に沿って、３つのチップセラミックコンデンサ２が実装されている。チップセラミックコンデンサ２は、回路基板１の面内における外形形状の長手方向が回路基板の周縁部１ａの延在方向と平行な状態で実装されている。 As shown in FIG. 1, a plurality of chip ceramic capacitors 2 are mounted on the circuit board 1 along the peripheral edge portion 1a of the circuit board in the in-plane direction of the circuit board 1. That is, as shown in FIG. 1, three chip ceramic capacitors 2 are mounted on the circuit board 1 along the peripheral edge of the printed wiring board 11. The chip ceramic capacitor 2 is mounted in a state in which the longitudinal direction of the outer shape in the plane of the circuit board 1 is parallel to the extending direction of the peripheral edge portion 1a of the circuit board.
　チップセラミックコンデンサ２は、図２に示すように、電気的に絶縁された２つのランド５に跨った状態で２つのランド５に電気的に接続して実装されている。チップセラミックコンデンサ２は、はんだ７によりランド５にはんだ付けされて接続されている。はんだ７は、融点の低さを利用して電子部品とプリント配線板１１とを接合するのに使用される、錫を主成分とした合金である。 As shown in FIG. 2, the chip ceramic capacitor 2 is mounted by being electrically connected to the two lands 5 in a state of straddling the two electrically insulated lands 5. The chip ceramic capacitor 2 is soldered and connected to the land 5 by the solder 7. Solder 7 is an alloy containing tin as a main component, which is used for joining an electronic component and a printed wiring board 11 by utilizing its low melting point.
　チップセラミックコンデンサ２は、セラミック材料を誘電体に用いたコンデンサの一種であるセラミックコンデンサがチップ形状に形成されたものであり、回路基板１において電圧の安定化、ノイズ低減および信号周波数フィルタなどの役割を担っている。 The chip ceramic capacitor 2 is a chip-shaped ceramic capacitor, which is a type of capacitor that uses a ceramic material as a dielectric, and plays a role in voltage stabilization, noise reduction, signal frequency filter, etc. in the circuit board 1. Is responsible for.
　また、回路基板１は、回路基板１の面内におけるチップセラミックコンデンサ２の外形形状の長手方向に沿って、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域の表面に、金属プレート６が配置されている。ここでの、回路基板の周縁部１ａは、回路基板１の面内における外形形状が四角形状を有する回路基板１において、チップセラミックコンデンサ２を挟んで対向する２辺のうちチップセラミックコンデンサ２に近い側に位置する回路基板の周縁部である。金属プレート６は、回路基板１の面内において、チップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に、長手方向が回路基板１の面内に沿った状態で配置されている。ここでのチップセラミックコンデンサ２の周縁部は、回路基板１の面内において金属プレート６に対向する側のチップセラミックコンデンサ２の周縁部である。 Further, the circuit board 1 is a metal plate on the surface of the region between the chip ceramic capacitor 2 and the peripheral portion 1a of the circuit board along the longitudinal direction of the outer shape of the chip ceramic capacitor 2 in the plane of the circuit board 1. 6 is arranged. Here, the peripheral edge portion 1a of the circuit board is the circuit board 1 having a square outer shape in the plane of the circuit board 1, and is closer to the chip ceramic capacitor 2 among the two sides facing each other with the chip ceramic capacitor 2 sandwiched. It is the peripheral edge of the circuit board located on the side. The metal plate 6 is arranged in the plane of the circuit board 1 in a state in which the longitudinal direction is along the plane of the circuit board 1 within a range of a predetermined distance from the peripheral edge of the chip ceramic capacitor 2. .. The peripheral edge of the chip ceramic capacitor 2 here is the peripheral edge of the chip ceramic capacitor 2 on the side facing the metal plate 6 in the plane of the circuit board 1.
　金属プレート６は、剛性が相対的にプリント配線板１１よりも高い材料により構成された、回路基板１の剛性を補強するプレート状の補強部品である。回路基板１では、導電性を有し、電気抵抗率が金属の中で相対的に小さく且つ剛性が相対的にプリント配線板１１よりも高い材料により構成された金属プレート６を、補強部品として用いている。金属プレート６は、たとえば銅により構成される。金属プレート６は、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に配置された配線パターン１３に、長手方向における両端部側の領域がはんだ付けによって接続されている。 The metal plate 6 is a plate-shaped reinforcing component that reinforces the rigidity of the circuit board 1 and is made of a material having a rigidity relatively higher than that of the printed wiring board 11. In the circuit board 1, a metal plate 6 made of a material having conductivity, a relatively small electrical resistivity among metals, and a relatively higher rigidity than the printed wiring board 11 is used as a reinforcing component. ing. The metal plate 6 is made of, for example, copper. In the metal plate 6, the regions on both ends in the longitudinal direction are connected to the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge 1a of the circuit board by soldering.
　図３に示すように、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に配置された配線パターン１３は、一部が分断されている。配線パターン１３は、分断された分断端部側の領域であるパターン端部領域１３ａとパターン端部領域１３ｂとがソルダーレジスト層１４から露出している。 As shown in FIG. 3, the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board is partially divided. In the wiring pattern 13, the pattern end region 13a and the pattern end region 13b, which are regions on the divided end side, are exposed from the solder resist layer 14.
　そして、金属プレート６は、パターン端部領域１３ａとパターン端部領域１３ｂとにはんだ付けによって固定されている。すなわち、金属プレート６は、ソルダーレジスト層１４から露出している配線パターン１３の２つの分断端部を電気的に接続して配置されている。このように配置された金属プレート６は、配線パターン１３において分断されている領域において配線パターン１３の代わりとしての機能を有する。すなわち、導電性を有する補強部品である金属プレート６は、配線パターン１３の一部としての機能を有し、配線パターン１３として利用することができるため、回路基板１の基板設計の自由度を向上させることができる。 Then, the metal plate 6 is fixed to the pattern end region 13a and the pattern end region 13b by soldering. That is, the metal plate 6 is arranged by electrically connecting the two divided ends of the wiring pattern 13 exposed from the solder resist layer 14. The metal plate 6 arranged in this way has a function as a substitute for the wiring pattern 13 in the region divided in the wiring pattern 13. That is, since the metal plate 6, which is a reinforcing component having conductivity, has a function as a part of the wiring pattern 13 and can be used as the wiring pattern 13, the degree of freedom in the board design of the circuit board 1 is improved. Can be made to.
　また、相対的にプリント配線板１１よりも高い剛性を有する金属プレート６が、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されることにより、回路基板１の面内における金属プレート６の周辺の領域の剛性を高め、金属プレート６の周辺の領域の曲げ強度および回路基板１全体の曲げ強度向上させることが可能となる。すなわち、回路基板１における金属プレート６の周辺の領域が歪みづらくなる。 Further, the metal plate 6 having a relatively higher rigidity than the printed wiring board 11 is arranged in the plane of the circuit board 1 within a range of a predetermined separation distance from the peripheral edge portion of the chip ceramic capacitor 2. It is possible to increase the rigidity of the region around the metal plate 6 in the plane of the circuit board 1 and improve the bending strength of the region around the metal plate 6 and the bending strength of the entire circuit board 1. That is, the region around the metal plate 6 on the circuit board 1 is less likely to be distorted.
　これにより、回路基板１の製造時などにおいて、複数枚取りの回路基板を分割する時、回路基板を製品に取り付ける時、および回路基板に実装されたコネクタにハウジングを挿抜する時などに回路基板１に歪みが生じた場合においても、チップセラミックコンデンサ２にクラックが生じることを抑制できる。すなわち、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に金属プレート６が配置されることにより、回路基板１の製造時などにおいて回路基板１に生じた歪みに起因してチップセラミックコンデンサ２にも歪みが生じてチップセラミックコンデンサ２にクラックが生じることを抑制できる。 As a result, when manufacturing the circuit board 1, when dividing a plurality of circuit boards, attaching the circuit board to the product, inserting and removing the housing from the connector mounted on the circuit board, etc., the circuit board 1 It is possible to suppress the occurrence of cracks in the chip ceramic capacitor 2 even when the chip ceramic capacitor 2 is distorted. That is, when the metal plate 6 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, it occurs on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
　離間距離は、プリント配線板１１の剛性および金属プレート６の剛性を考慮して、チップセラミックコンデンサ２にクラックが生じることを抑制できる距離に適宜決められればよい。また、金属プレート６の材料、金属プレート６の厚みおよび幅は、プリント配線板１１の剛性などの条件によって、チップセラミックコンデンサ２にクラックが生じることを抑制できるように適宜決められればよい。 The separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 and the rigidity of the metal plate 6 so as to prevent cracks from occurring in the chip ceramic capacitor 2. Further, the material of the metal plate 6 and the thickness and width of the metal plate 6 may be appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as the rigidity of the printed wiring board 11.
　また、金属プレート６は、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に配置されることが好ましい。金属プレート６は、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に配置されることにより、曲げが発生しやすい回路基板の周縁部１ａの周辺の領域の剛性を高め、回路基板の周縁部１ａの周辺の領域の曲げ強度および回路基板１全体の曲げ強度を向上させることが可能となる。これにより、回路基板１の面内において金属プレート６よりも内部側に配置されたチップセラミックコンデンサ２における、上記した回路基板１の製造時などにおけるクラックの発生をより確実に抑制できる。 Further, the metal plate 6 is preferably arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board. By arranging the metal plate 6 in the region between the chip ceramic capacitor 2 and the peripheral portion 1a of the circuit board, the rigidity of the region around the peripheral portion 1a of the circuit board where bending is likely to occur is increased, and the circuit board It is possible to improve the bending strength of the region around the peripheral edge portion 1a of the circuit board 1 and the bending strength of the entire circuit board 1. As a result, it is possible to more reliably suppress the occurrence of cracks in the chip ceramic capacitor 2 arranged on the inner side of the metal plate 6 in the plane of the circuit board 1 at the time of manufacturing the circuit board 1 described above.
　なお、金属プレート６は、回路基板１の面内の表面においてチップセラミックコンデンサ２を挟んで回路基板の周縁部１ａと反対側に配置されても上述したチップセラミックコンデンサ２にクラックが生じることを抑制する効果が得られる。 Even if the metal plate 6 is arranged on the in-plane surface of the circuit board 1 on the opposite side of the peripheral portion 1a of the circuit board with the chip ceramic capacitor 2 interposed therebetween, it suppresses the occurrence of cracks in the chip ceramic capacitor 2 described above. The effect of
　図１においては、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に、複数のチップセラミックコンデンサ２の外形形状の長手方向に沿って１本の長尺の金属プレート６が配置されている。しかしながら、金属プレート６は、チップセラミックコンデンサ２にクラックが生じることを抑制できれば、チップセラミックコンデンサ２と回路基板の周縁部１ａとの間において分割されていてもよい。 In FIG. 1, one long metal plate 6 is arranged along the longitudinal direction of the outer shape of the plurality of chip ceramic capacitors 2 in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board. ing. However, the metal plate 6 may be divided between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board as long as the cracks in the chip ceramic capacitor 2 can be suppressed.
　図４は、本発明の実施の形態１にかかる他の回路基板２１の主要な構成を示す要部断面図である。図４に示す他の回路基板２１は、プリント配線板１１の他面１１ｂの表面に金属プレート６が実装されている点が上述した回路基板１と異なる。 FIG. 4 is a cross-sectional view of a main part showing a main configuration of another circuit board 21 according to the first embodiment of the present invention. The other circuit board 21 shown in FIG. 4 is different from the circuit board 1 described above in that the metal plate 6 is mounted on the surface of the other surface 11b of the printed wiring board 11.
　金属プレート６は、プリント配線板１１の他面１１ｂにおいて、回路基板１の面内においてチップセラミックコンデンサ２に対応する領域に配置されている。すなわち、チップセラミックコンデンサ２は、プリント配線板１１の他面１１ｂにおいて、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されている。そして、金属プレート６は、プリント配線板１１の他面１１ｂに配置されている配線パターン１３の分断端部側の領域であるパターン端部領域１３ｃとパターン端部領域１３ｄとにはんだ付けによって固定されている。 The metal plate 6 is arranged on the other surface 11b of the printed wiring board 11 in the area corresponding to the chip ceramic capacitor 2 in the surface of the circuit board 1. That is, the chip ceramic capacitor 2 is arranged on the other surface 11b of the printed wiring board 11 within the surface of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2. Then, the metal plate 6 is fixed to the pattern end region 13c and the pattern end region 13d, which are regions on the divided end side of the wiring pattern 13 arranged on the other surface 11b of the printed wiring board 11, by soldering. Has been done.
　このように構成された他の回路基板２１は、上述した回路基板１と同様の効果が得られる。 The other circuit board 21 configured in this way can obtain the same effect as the circuit board 1 described above.
　なお、上記においては、金属プレート６は、プリント配線板１１の他面１１ｂの表面において、回路基板１の面内においてチップセラミックコンデンサ２に対応する領域に配置されている場合について説明した。金属プレート６が、プリント配線板１１の他面１１ｂにおいて、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されていれば、上述した回路基板１と同様の効果が得られる。 In the above description, the case where the metal plate 6 is arranged in the area corresponding to the chip ceramic capacitor 2 in the surface of the circuit board 1 on the surface of the other surface 11b of the printed wiring board 11 has been described. If the metal plate 6 is arranged on the other surface 11b of the printed wiring board 11 within the plane of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2, the circuit board described above is described. The same effect as in 1 can be obtained.
　たとえば、金属プレート６は、プリント配線板１１の他面１１ｂにおいて、回路基板１の面内におけるチップセラミックコンデンサ２と回路基板の周縁部１ａとの間の領域に配置されている配線パターン１３の分断された２つの端部領域にはんだ付けによって固定されてもよい。この場合も、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に金属プレート６が配置されることにより、上述した回路基板１と同様の効果が得られる。 For example, the metal plate 6 divides the wiring pattern 13 arranged in the region between the chip ceramic capacitor 2 and the peripheral edge portion 1a of the circuit board in the plane of the circuit board 1 on the other surface 11b of the printed wiring board 11. It may be fixed by soldering to the two end regions. Also in this case, the same effect as that of the circuit board 1 described above can be obtained by arranging the metal plate 6 within the range of the predetermined distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1. Be done.
　図５は、本発明の実施の形態１にかかる他の回路基板３１の主要な構成を示す斜視図である。他の回路基板３１は、基本的に上述した回路基板１と同様の構成を有する。他の回路基板３１では、回路基板１の剛性を補強する補強部品として、ヒートシンク８が用いられている。 FIG. 5 is a perspective view showing a main configuration of another circuit board 31 according to the first embodiment of the present invention. The other circuit board 31 basically has the same configuration as the circuit board 1 described above. In the other circuit board 31, the heat sink 8 is used as a reinforcing component for reinforcing the rigidity of the circuit board 1.
　図５に示すように他の回路基板３１では、プリント配線板１１の一面１１ａに実装されたチップセラミックコンデンサ２に隣り合う領域に、フィン状の補強部品であるヒートシンク８が実装されている。ヒートシンク８は、プリント配線板１１の一面１１ａに実装された電子部品である半導体素子９の周囲を囲んでプリント配線板１１の一面１１ａの表面に配置されており、半導体素子９で発熱された熱を効率的に放熱して半導体素子９を冷やす機能を有する。 As shown in FIG. 5, in another circuit board 31, a heat sink 8 which is a fin-shaped reinforcing component is mounted in a region adjacent to the chip ceramic capacitor 2 mounted on one surface 11a of the printed wiring board 11. The heat sink 8 is arranged on the surface of one side 11a of the printed wiring board 11 so as to surround the semiconductor element 9 which is an electronic component mounted on the one side 11a of the printed wiring board 11, and the heat generated by the semiconductor element 9 is generated. Has a function of efficiently dissipating heat to cool the semiconductor element 9.
　そして、ヒートシンク８は、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置される。 Then, the heat sink 8 is arranged in the plane of the circuit board 1 within a range of a predetermined distance from the peripheral edge of the chip ceramic capacitor 2.
　離間距離は、プリント配線板１１の剛性およびヒートシンク８の剛性を考慮して、チップセラミックコンデンサ２にクラックが生じることを抑制できる距離に適宜決められればよい。また、ヒートシンク８の材料、ヒートシンク８の寸法および形状は、半導体素子９の発熱特性およびプリント配線板１１の剛性などの条件によって、チップセラミックコンデンサ２にクラックが生じることを抑制できるように適宜決められればよい。 The separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 and the rigidity of the heat sink 8 so as to prevent cracks from occurring in the chip ceramic capacitor 2. Further, the material of the heat sink 8 and the dimensions and shape of the heat sink 8 are appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as heat generation characteristics of the semiconductor element 9 and rigidity of the printed wiring board 11. Just do it.
　このように構成された他の回路基板３１は、相対的にプリント配線板１１よりも高い剛性を有するヒートシンク８が、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されることにより、回路基板１の面内におけるヒートシンク８の周辺の領域の剛性を高め、ヒートシンク８の周辺の領域の曲げ強度および回路基板１全体の曲げ強度を向上させることが可能となる。 In the other circuit board 31 configured in this way, the heat sink 8 having a rigidity relatively higher than that of the printed wiring board 11 has a predetermined distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1. By arranging within the range of the distance, the rigidity of the region around the heat sink 8 in the plane of the circuit board 1 is increased, and the bending strength of the region around the heat sink 8 and the bending strength of the entire circuit board 1 are improved. Is possible.
　これにより、上述した回路基板１と同様に、回路基板１の製造時などにおいて、複数枚取りの回路基板を分割する時、回路基板を製品に取り付ける時、および回路基板に実装されたコネクタにハウジングを挿抜する時などに回路基板１に歪みが生じた場合においても、チップセラミックコンデンサ２にクラックが生じることを抑制できる。すなわち、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内にヒートシンク８が配置されることにより、回路基板１の製造時などにおいて回路基板１に生じた歪みに起因してチップセラミックコンデンサ２にも歪みが生じてチップセラミックコンデンサ２にクラックが生じることを抑制できる。 As a result, similarly to the circuit board 1 described above, when the circuit board 1 is manufactured, when a plurality of circuit boards are divided, when the circuit board is attached to a product, and when the connector mounted on the circuit board is housed. Even when the circuit board 1 is distorted when the circuit board is inserted or removed, it is possible to prevent the chip ceramic capacitor 2 from being cracked. That is, the heat sink 8 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, so that the heat sink 8 is generated on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
　すなわち、他の回路基板３１においても、上述した回路基板１と同様に、回路基板１に生じた歪みに起因したチップセラミックコンデンサ２のクラックの発生を抑制できる。 That is, in the other circuit board 31, the generation of cracks in the chip ceramic capacitor 2 due to the distortion generated in the circuit board 1 can be suppressed in the same manner as in the circuit board 1 described above.
　また、ヒートシンク８は、図４に示した他の回路基板２１の場合と同様に、プリント配線板１１の他面１１ｂの表面に実装されてもよい。この場合も、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内にヒートシンク８が配置されることにより、上述した他の回路基板３１と同様の効果が得られる。 Further, the heat sink 8 may be mounted on the surface of the other surface 11b of the printed wiring board 11 as in the case of the other circuit board 21 shown in FIG. Also in this case, by arranging the heat sink 8 within the range of the predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, the same effect as that of the other circuit board 31 described above can be obtained. can get.
　図６は、本発明の実施の形態１にかかる他の回路基板４１の主要な構成を示す斜視図である。他の回路基板４１は、基本的に上述した回路基板１と同様の構成を有する。他の回路基板４１では、回路基板１の剛性を補強する補強部品として、導電性を有する金属材料であるはんだ４２が用いられている。 FIG. 6 is a perspective view showing a main configuration of another circuit board 41 according to the first embodiment of the present invention. The other circuit board 41 basically has the same configuration as the circuit board 1 described above. In the other circuit board 41, solder 42, which is a conductive metal material, is used as a reinforcing component for reinforcing the rigidity of the circuit board 1.
　図６に示すように他の回路基板４１では、プリント配線板１１の一面１１ａに形成された配線パターン１３のうち、チップセラミックコンデンサ２の周辺に位置する配線パターン１３が、ソルダーレジスト層１４に覆われずにソルダーレジスト層１４から露出している。そして、ソルダーレジスト層１４から露出した配線パターン１３上には、はんだ４２が盛られている。 As shown in FIG. 6, in the other circuit board 41, among the wiring patterns 13 formed on one surface 11a of the printed wiring board 11, the wiring pattern 13 located around the chip ceramic capacitor 2 covers the solder resist layer 14. It is exposed from the solder resist layer 14 without being damaged. Then, the solder 42 is piled up on the wiring pattern 13 exposed from the solder resist layer 14.
　ソルダーレジスト層１４から露出した配線パターン１３は、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されている。 The wiring pattern 13 exposed from the solder resist layer 14 is arranged within the plane of the circuit board 1 within a predetermined distance from the peripheral edge of the chip ceramic capacitor 2.
　離間距離は、プリント配線板１１の剛性を考慮して、チップセラミックコンデンサ２にクラックが生じることを抑制できる距離に適宜決められればよい。また、はんだ４２の材料、はんだ４２の盛り量およびはんだ４２の盛り形状は、プリント配線板１１の剛性などの条件によって、チップセラミックコンデンサ２にクラックが生じることを抑制できるように適宜決められればよい。 The separation distance may be appropriately determined in consideration of the rigidity of the printed wiring board 11 so as to be a distance capable of suppressing the occurrence of cracks in the chip ceramic capacitor 2. Further, the material of the solder 42, the amount of the solder 42, and the shape of the solder 42 may be appropriately determined so as to prevent cracks from occurring in the chip ceramic capacitor 2 depending on conditions such as the rigidity of the printed wiring board 11. ..
　このように構成された他の回路基板４１は、相対的にプリント配線板１１よりも高い剛性を有するはんだ４２が、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置されることにより、回路基板１の面内におけるはんだ４２の周辺の領域の剛性を高め、はんだ４２の周辺の領域の曲げ強度および回路基板１全体の曲げ強度を向上させることが可能となる。 In the other circuit board 41 configured in this way, the solder 42 having a relatively higher rigidity than the printed wiring board 11 is separated from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1 by a predetermined distance. By being arranged within the range of the distance, the rigidity of the region around the solder 42 in the plane of the circuit board 1 is increased, and the bending strength of the region around the solder 42 and the bending strength of the entire circuit board 1 are improved. Is possible.
　これにより、上述した回路基板１と同様に、回路基板１の製造時などにおいて、複数枚取りの回路基板を分割する時、回路基板を製品に取り付ける時、および回路基板に実装されたコネクタにハウジングを挿抜する時などに回路基板１に歪みが生じた場合においても、チップセラミックコンデンサ２にクラックが生じることを抑制できる。すなわち、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内にはんだ４２が配置されることにより、回路基板１の製造時などにおいて回路基板１に生じた歪みに起因してチップセラミックコンデンサ２にも歪みが生じてチップセラミックコンデンサ２にクラックが生じることを抑制できる。 As a result, similarly to the circuit board 1 described above, when the circuit board 1 is manufactured, when a plurality of circuit boards are divided, when the circuit board is attached to a product, and when the connector mounted on the circuit board is housed. Even when the circuit board 1 is distorted when the circuit board is inserted or removed, it is possible to prevent the chip ceramic capacitor 2 from being cracked. That is, the solder 42 is arranged within the range of a predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, so that the solder 42 is generated on the circuit board 1 at the time of manufacturing the circuit board 1. It is possible to prevent the chip ceramic capacitor 2 from being distorted due to the distortion and cracking in the chip ceramic capacitor 2.
　すなわち、他の回路基板４１においても、上述した回路基板１と同様に、回路基板１に生じた歪みに起因したチップセラミックコンデンサ２のクラックの発生を抑制できる。 That is, in the other circuit board 41 as well, the occurrence of cracks in the chip ceramic capacitor 2 due to the distortion generated in the circuit board 1 can be suppressed as in the circuit board 1 described above.
　そして、他の回路基板４１では、回路基板１の面内においてチップセラミックコンデンサ２の周辺に配置された配線パターン１３上にはんだ４２が配置されるため、他の回路構成の配置を邪魔することなく、容易にはんだ４２を配置することが可能であり、補強部品が他の回路基板４１の基板設計上での制約となることがない。 Then, in the other circuit board 41, since the solder 42 is arranged on the wiring pattern 13 arranged around the chip ceramic capacitor 2 in the plane of the circuit board 1, the solder 42 is arranged on the wiring pattern 13 arranged around the chip ceramic capacitor 2 without disturbing the arrangement of the other circuit board. , The solder 42 can be easily arranged, and the reinforcing component does not become a restriction on the board design of the other circuit board 41.
　また、はんだ４２は導電性を有するため、ソルダーレジスト層１４から露出した配線パターン１３上に配置されても配線パターン１３の機能を阻害することがない。そして、導電性を有する補強部品であるはんだ４２は、配線パターン１３の一部としての機能を有し、配線パターン１３として利用することができる。 Further, since the solder 42 has conductivity, the function of the wiring pattern 13 is not impaired even if it is arranged on the wiring pattern 13 exposed from the solder resist layer 14. The solder 42, which is a reinforcing component having conductivity, has a function as a part of the wiring pattern 13 and can be used as the wiring pattern 13.
　また、はんだ４２は、図４に示した他の回路基板２１の場合と同様に、プリント配線板１１の他面１１ｂに実装されてもよい。この場合も、回路基板１の面内においてチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置された配線パターン１３上にはんだ４２が配置されることにより、上述した他の回路基板４１と同様の効果が得られる。 Further, the solder 42 may be mounted on the other surface 11b of the printed wiring board 11 as in the case of the other circuit board 21 shown in FIG. Also in this case, the solder 42 is arranged on the wiring pattern 13 arranged within the range of the predetermined separation distance from the peripheral edge of the chip ceramic capacitor 2 in the plane of the circuit board 1, whereby the other described above is performed. The same effect as that of the circuit board 41 can be obtained.
　上述したように補強部品は、いずれも回路基板の剛性を補強する機能以外に、回路基板の構成部品のうちのいずれかの部品の機能を兼ねている。すなわち、上述した回路基板１、他の回路基板２１、他の回路基板３１および他の回路基板４１においては、補強部品は、いずれもチップセラミックコンデンサ２の周縁部から予め決められた離間距離の範囲内に配置された配線パターン１３または半導体素子９といった、回路基板の構成部品の一部を構成し、または回路基板の構成部品そのものを利用している。これにより、補強部品は、回路基板の基板設計上での制約となることなく、また回路基板におけるチップセラミックコンデンサ２の位置を限定することなく、回路基板に生じた歪みに起因したチップセラミックコンデンサ２のクラックの発生を抑制できる。 As described above, all the reinforcing parts have the function of any one of the components of the circuit board in addition to the function of reinforcing the rigidity of the circuit board. That is, in the circuit board 1, the other circuit board 21, the other circuit board 31, and the other circuit board 41 described above, the reinforcing components are all within a predetermined distance range from the peripheral edge of the chip ceramic capacitor 2. It constitutes a part of a component of a circuit board such as a wiring pattern 13 or a semiconductor element 9 arranged inside, or uses the component itself of the circuit board. As a result, the reinforcing component does not impose restrictions on the board design of the circuit board and does not limit the position of the chip ceramic capacitor 2 on the circuit board, and the chip ceramic capacitor 2 is caused by the distortion generated in the circuit board. The occurrence of cracks can be suppressed.
　また、上述した補強部品によりチップセラミックコンデンサ２のクラックの発生防止の対策が可能となるため、回路基板に実装されるチップセラミックコンデンサ２、不図示のチョークコイルおよびトランスなどの背の高い部品を回路基板の端面から離すことが必須ではなくなり、チップセラミックコンデンサ２のクラックの発生防止の対策の選択肢が増える。そして、チップセラミックコンデンサ２のクラックの発生防止の対策の選択肢が多いことから、回路基板の基板設計の自由度が増す。 Further, since the above-mentioned reinforcing parts can prevent the occurrence of cracks in the chip ceramic capacitor 2, tall parts such as the chip ceramic capacitor 2 mounted on the circuit board, a choke coil and a transformer (not shown) are circuited. It is no longer essential to separate it from the end face of the substrate, and there are more options for measures to prevent cracks in the chip ceramic capacitor 2. Further, since there are many options for measures for preventing the occurrence of cracks in the chip ceramic capacitor 2, the degree of freedom in board design of the circuit board is increased.
　すなわち、たとえば複数枚取りの回路基板を分割する時に回路基板に発生する歪みを低減するために専用の分割治具を使用する場合でも、治具の構造的な制約を受けることなく回路基板の端面付近に相対的に高さの部品を実装可能となる。 That is, for example, even when a dedicated dividing jig is used to reduce the distortion generated in the circuit board when dividing a multi-sheet circuit board, the end face of the circuit board is not subject to the structural restrictions of the jig. It is possible to mount relatively high parts in the vicinity.
　したがって、本実施の形態１によれば、回路基板におけるチップセラミックコンデンサ２の配置領域の制約を緩和し、回路基板の基板設計の自由度を向上させることが可能である。 Therefore, according to the first embodiment, it is possible to relax the restriction on the arrangement area of the chip ceramic capacitor 2 on the circuit board and improve the degree of freedom in the board design of the circuit board.
　以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、実施の形態の技術同士を組み合わせることも可能であるし、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。 The configuration shown in the above-described embodiment shows an example of the contents of the present invention, and the technologies of the embodiments can be combined with each other, or can be combined with another known technology. However, it is also possible to omit or change a part of the configuration without departing from the gist of the present invention.
　１　回路基板、１ａ　回路基板の周縁部、２　チップセラミックコンデンサ、３　集積回路、４　基板実装コネクタ、５　ランド、６　金属プレート、７，４２　はんだ、８　ヒートシンク、９　半導体素子、１１　プリント配線板、１１ａ　一面、１１ｂ　他面、１２　絶縁基板、１３　配線パターン、１３ａ，１３ｂ，１３ｃ，１３ｄ　パターン端部領域、１４　ソルダーレジスト層、２１，３１，４１　他の回路基板。 1 Circuit board, 1a Peripheral part of circuit board, 2 Chip ceramic capacitor, 3 Integrated circuit, 4 Board mounting connector, 5 Land, 6 Metal plate, 7,42 Solder, 8 Heat shield, 9 Semiconductor element, 11 Printed wiring board, 11a One side, 11b other side, 12 insulating substrate, 13 wiring pattern, 13a, 13b, 13c, 13d pattern end region, 14 solder resist layer, 21, 31, 41 other circuit boards.

Claims (5)

  1. 　プリント配線板と、
    　前記プリント配線板に実装されたチップセラミックコンデンサと、
    　を備える回路基板であって、
    　前記回路基板の面内に、剛性が相対的に前記プリント配線板よりも高い補強部品が実装され、
    　前記補強部品は、前記回路基板の面内において前記補強部品に対向する側の前記チップセラミックコンデンサの周縁部から予め決められた離間距離の範囲内に配置されている回路基板。     Printed wiring board and
    The chip ceramic capacitor mounted on the printed wiring board and
    Is a circuit board equipped with
    A reinforcing component having a rigidity relatively higher than that of the printed wiring board is mounted in the plane of the circuit board.
    The reinforcing component is a circuit board arranged within a predetermined distance from the peripheral edge of the chip ceramic capacitor on the side facing the reinforcing component in the plane of the circuit board.
  2. 　前記補強部品が、前記プリント配線板に形成された配線パターンの一部としての機能を有する金属プレートである請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the reinforcing component is a metal plate having a function as a part of a wiring pattern formed on the printed wiring board.
  3. 　前記金属プレートが、前記チップセラミックコンデンサと前記回路基板の周縁部との間の領域に配置されている請求項２に記載の回路基板。 The circuit board according to claim 2, wherein the metal plate is arranged in a region between the chip ceramic capacitor and the peripheral edge of the circuit board.
  4. 　前記補強部品が、前記プリント配線板に実装されたヒートシンクである請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the reinforcing component is a heat sink mounted on the printed wiring board.
  5. 　前記補強部品が、前記プリント配線板において前記チップセラミックコンデンサの周縁部から予め決められた離間距離の範囲内に配置された配線パターン上に盛られたはんだである請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the reinforcing component is solder piled up on a wiring pattern arranged in a range of a predetermined distance from the peripheral edge of the chip ceramic capacitor in the printed wiring board.
PCT/JP2019/011511 2019-03-19 2019-03-19 Circuit board WO2020188758A1 (en)

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PCT/JP2019/011511 WO2020188758A1 (en) 2019-03-19 2019-03-19 Circuit board
JP2021506901A JP7123236B2 (en) 2019-03-19 2019-03-19 circuit board

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PCT/JP2019/011511 WO2020188758A1 (en) 2019-03-19 2019-03-19 Circuit board

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035330A (en) * 2009-08-05 2011-02-17 Nec Lighting Ltd Electronic circuit board and method of manufacturing the same
JP2011243878A (en) * 2010-05-20 2011-12-01 Panasonic Electric Works Co Ltd Aggregate substrate
JP2014165441A (en) * 2013-02-27 2014-09-08 Fujikura Ltd Component mounting flexible printed circuit board, and manufacturing method thereof
JP2014229761A (en) * 2013-05-23 2014-12-08 株式会社東芝 Electronic apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010212542A (en) 2009-03-12 2010-09-24 Panasonic Corp Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035330A (en) * 2009-08-05 2011-02-17 Nec Lighting Ltd Electronic circuit board and method of manufacturing the same
JP2011243878A (en) * 2010-05-20 2011-12-01 Panasonic Electric Works Co Ltd Aggregate substrate
JP2014165441A (en) * 2013-02-27 2014-09-08 Fujikura Ltd Component mounting flexible printed circuit board, and manufacturing method thereof
JP2014229761A (en) * 2013-05-23 2014-12-08 株式会社東芝 Electronic apparatus

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JP7123236B2 (en) 2022-08-22
JPWO2020188758A1 (en) 2021-11-18

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