1280845 九、發明說明： 【發明所屬之技術領域】 . 本發明侧於一種電路板，特別是-種能夠抑制電磁波輕射 ^ 干擾之電路板。 【先前技術】 齡的電子產品都以符合小型化、高性能、高精度'雜賴度、 及高反應度等為目標’使得電路元件的分佈密度過高、電路的體 _ 積大大的縮小，細當f路㈣愈精巧，财有更多的元件擠在 很小的空間當中，增加大幅增加彼此干擾的機會，其中以電磁干 擾（Electromagnetic interference，EMI)及雜訊為最嚴重。 一般而言，電磁干擾EMI為一重疊之高週波信號所形成，頻率 範圍自ΙΟΚΗζ至數GHz，其中又可分為輻射性（Radiated)與傳 導性（Conducted)電磁干擾；輻射性EMI主要是經由開放空間傳 遞，且不須要經由任何傳導介質。而傳導性腿丨，它是經由電源 _ 導線來傳遞雜訊的，會使得連接在同一個電力系統的電氣裝置， 經由電源線而被電磁干擾EMI彼此相互干擾。無論是哪總電磁干 擾對電子元件都是具有不可忽視的傷害，不僅會降低電子元件的 安定性，甚至會破壞其結構。 舉例來說，藉由電纜傳導（傳導式EMI)之干擾信號主要頻率 在ΙΟΚΗζ至30MHz之間。當此傳導式EMI產生時，會導致電腦、 可程式邏輯控制器（PLC)及數位控制設備等電子設備之異常，容 易因電磁干擾而發送或是接收到誤訊號，進而產生不正常的執行 1280845 結果。特別是需要使用精密電子儀器或測試設備的場戶斤，像是曰 '圓廠、醫院、播音室等等深怕電磁干擾之場所，更是無法容許^ 生因為電磁干擾所產生的損害。再舉例來說，在高階的規格中， \ 社(Digital Visual lnterface)介面主要用於與具有數位顯示 輸出功能的電腦顯卡相連接，可以直接顯示電腦的rgb信號。謂 (Digital Visual Interface)數位顯示介面，是由 1998 年^ 月， 在InteW發者論壇上成立的數位顯示工作小組（咖加 —Play Working G卿簡稱DDWG)，所制定的數位顯示介面標 準’而且數位介面並保證了全部内容採用數位格式傳輸，使得^ 機到監視器的傳輸過程中無干擾信號產生，也劇呆其資料的完整 性’可以制更清晰的影像。WI的主要目的是軸示卡的晝= 訊號透過數位的方式傳送到電腦螢幕，不同於類比，聰的所傳 輸的訊號是屬於高速訊號，-般而言，包括主機板在設計輸入輪 • 出埠的地方，都會將每個輸入輸出埠之接地作切割，把不同屬性 • 的輸人輸出埠分別單獨切割出來一塊輸人輸出埠之接地區，這種 方法可以避免不同屬性信號之間的電磁波相互干擾，達到電磁波 抑制的效果，但是當信號走線的下一層接過電源層時，尤其是當 造成一些高速訊號線（如DVi等）跨層（plane)的問題時，更 容易發生電磁波輻射干擾問題。 因此，如何避免電磁干擾的發生，一直是各個電子裝備及系統 廠商大重點，主要是因為電磁干擾所章涉的因素繁多，面對科 技產業的尚度競爭，新產品的生命週期越來越短，也因此抗電磁 1280845 干擾一直是主要訴求之一。 目鈾習知技術大都是使用遮蔽或外加抗電磁波元件等方法，但 此習知技術並無法有效地解決電磁干擾的問題，在考量減輕成本 的支出與龟路貫現的難易上，正是習知技術所急須改進的。 【發明内容】 有鑑於此，本發明所提出一種電磁波干擾抑制結構，對高頻訊 號線路&供一咼頻接地區，藉以提供一最近接地面，解決電磁波 干擾。 因此，本發明所揭露之電磁波干擾抑制結構，應用於一電路 板’係為一種印刷電路板（Printed Circuit Board簡稱PCB)， 對電路板之高頻訊號線路提供一最近接地面，此抑制電磁波干擾 之結構包含有電路層、接地層、高頻元件以及高頻接地區。 電路層具有複數條之訊號線以及複數條之高頻訊號線。搂地層 …不Π之輸入輸出痒的接地切割為獨立的接地區，可避免不同 屬性信號之間的電磁波相互干擾。高頻元件，設置於電路層，此 咼邊元件之鬲頻訊號線依據實際需求佈線於電路層。高頻接地 區，设置於接地層，且其面積延伸至此高頻訊號線路，對此高頻 吼號線路提供一最近接地面，此外，此高頻接地區與此高頻元件 之接地相輕接，以避免與其它屬性信號相互干擾。 练合上述，本發明所揭露之電磁波干擾抑制結構，將高頻接 地區之面積延伸至此高賴號線路，對此高親號線路提供一最 近接地面，可抑制其高頻訊號線之電磁波干擾，此外，藉由本發 1280845 1高頻訊齡_下—層是電源树，亦可避免因電磁波干擾 而導致仏號傳輸失敗’於此，藉由獨立的接地，更可隔絕不同屬 1·生兀件的輸出輸人埠之間的相互干擾，錢計人員於運用上更可 不須外加抗電魏元件之下，即可達成抗電魏之功效。1280845 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is directed to a circuit board, particularly a circuit board capable of suppressing electromagnetic wave light interference. [Prior Art] The age-appropriate electronic products are designed to meet the requirements of miniaturization, high performance, high precision, high hygienicity, and high reactivity, so that the distribution density of circuit components is too high, and the body volume of the circuit is greatly reduced. Finer f road (four) is more sophisticated, and more components are crowded into a small space, increasing the chance of greatly increasing mutual interference, among which electromagnetic interference (EMI) and noise are the most serious. In general, electromagnetic interference EMI is formed by an overlapping high-cycle signal, the frequency range is from ΙΟΚΗζ to several GHz, which can be divided into Radicated and Conducted electromagnetic interference; Radiation EMI is mainly via Open space is delivered without the need to pass any conductive medium. The conductive leg loop, which transmits noise via the power supply _ wire, causes the electrical devices connected to the same power system to be interfered with each other by the electromagnetic interference EMI via the power line. No matter which electromagnetic interference is harmful to electronic components, it will not only reduce the stability of electronic components, but even destroy its structure. For example, the dominant frequency of an interfering signal by cable conduction (conducting EMI) is between ΙΟΚΗζ and 30 MHz. When this conductive EMI is generated, it will cause abnormalities in electronic devices such as computers, programmable logic controllers (PLCs), and digital control devices. It is easy to send or receive false signals due to electromagnetic interference, resulting in abnormal execution 1280845. result. In particular, it is necessary to use sophisticated electronic instruments or test equipment, such as 曰 'round factory, hospital, studio, and so on, where electromagnetic interference is deeply feared, and it is impossible to allow damage caused by electromagnetic interference. For example, in the high-end specification, the Digital Visual Interface device is mainly used to connect to a computer graphics card with digital display output function, and can directly display the rgb signal of the computer. The digital display interface (Digital Visual Interface) is a digital display interface standard established by the Digital Display Working Group (CGA-Play Working G), which was established in the InteW Developer Forum in 1998. The digital interface ensures that all content is transmitted in digital format, so that no interference signal is generated during the transmission from the machine to the monitor, and the integrity of the data can be made to make a clearer image. The main purpose of the WI is to transmit the 昼= signal of the axis display card to the computer screen through digital means. Unlike the analogy, the transmitted signal of Cong is a high-speed signal, and generally includes the motherboard in the design input wheel. In the embarrassing place, the grounding of each input and output 都会 will be cut, and the input and output 不同 of different attributes will be separately cut out to the area where the input and output are connected. This method can avoid electromagnetic waves between different attribute signals. Mutual interference, to achieve the effect of electromagnetic wave suppression, but when the next layer of the signal trace is connected to the power layer, especially when causing some high-speed signal lines (such as DVi, etc.) across the plane, it is more prone to electromagnetic radiation. Interference problem. Therefore, how to avoid the occurrence of electromagnetic interference has always been the focus of various electronic equipment and system manufacturers, mainly because of the many factors involved in electromagnetic interference. In the face of the competition of the technology industry, the life cycle of new products is getting shorter and shorter. Therefore, anti-electromagnetic 1280845 interference has always been one of the main demands. Most of the uranium-preferred technologies use methods such as shielding or adding anti-electromagnetic wave elements. However, this conventional technique cannot effectively solve the problem of electromagnetic interference. It is precisely the consideration of the cost-reducing expenditure and the difficulty of the turtles. Knowing that technology is urgently needed to be improved. SUMMARY OF THE INVENTION In view of the above, the present invention provides an electromagnetic wave interference suppression structure for providing a near-ground plane for a high-frequency signal line & for addressing electromagnetic interference. Therefore, the electromagnetic interference suppression structure disclosed in the present invention is applied to a circuit board as a printed circuit board (PCB), which provides a nearest ground plane to the high frequency signal line of the circuit board, thereby suppressing electromagnetic interference. The structure includes a circuit layer, a ground layer, a high frequency component, and a high frequency connection region. The circuit layer has a plurality of signal lines and a plurality of high frequency signal lines.搂Ground layer...The grounding and cutting of the input and output itch is an independent connection area, which can avoid electromagnetic waves from interfering with each other between different attribute signals. The high frequency component is disposed on the circuit layer, and the frequency signal line of the edge component is wired on the circuit layer according to actual requirements. The high-frequency connection area is disposed on the grounding layer, and the area thereof extends to the high-frequency signal line, and the high-frequency singular line provides a nearest grounding surface, and the high-frequency connection area is lightly connected to the grounding of the high-frequency component To avoid interference with other attribute signals. In view of the above, the electromagnetic interference suppression structure disclosed in the present invention extends the area of the high frequency connection region to the high-lying line, and provides a nearest ground plane for the high-number line, which can suppress electromagnetic wave interference of the high-frequency signal line. In addition, with the 1280845 1 high-frequency age_lower layer is the power tree, it can also avoid the transmission failure of the nickname due to electromagnetic interference. In this case, the independent grounding can isolate the different genus. The mutual interference between the output of the components and the input and output personnel can be achieved by using the anti-electricity components without the need of additional anti-electrical components.
*以下在實施方式巾詳細敘述本發明之詳細湘^及優點，其内 谷足以使任何熟習相關技藝者了解本發明之技術内容並據以實 f，且根據本綱書所揭露之内容、申請專利顧及圖式，任何 熟習相關技藝者可輕易地理解本發_關之目的及優點。 為使對本發明的目的、構造特徵及其功能有進一步的了解，兹 配合圖示詳細說明如下。 【實施方式】 ”為使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解、’舰合實_詳細·如τ。以上之關於本發_容之說明 ^以下之實施方式之說日雜肋示範與解釋本剌之顧，並且 ❿提供本發日狀專辦賴财進—步之轉。 处請參照「第1圖」所示，係為本發明所提之電磁波干擾抑制 、⑺構’係應用於電路板，此電路板包含有電路層530、接地層520、 •零件層_以及電源層510。於此，本發明之電磁波干擾抑制結 ，’利用接地面之高頻接地區63〇，將高頻接地面之面積延伸至 阿頻讯唬線路640，以對電路板中之高頻訊號線路64〇提供一最 近接地面。 電路層530，係附著於電路板，本圖示係以簡單表示，但仍 8 1280845 具有複數條導線以及複數條之高頻訊號線路64〇。 接地層520，係附著於電路板；在電路板設計佈線中，一般 .積體電路之接地都會設置在接地層520，並把各種關屬性的積 \ 體電路之接地分別切割為一塊獨立接地，舉例來說，可劃分為第 、一兀件接地區610、第二元件接地區620等等，於此，可避免不 同屬性訊號之間的電磁波相干擾。高頻元件5〇〇與數複個積體電 路設置於零件層6GG，其巾錢元件可為數純齡面(呢制 • ViSUalInterface，DVI)、視訊圖像介面（VideoGrapto^ VGA)或其他具有高速喊之元件，可參照魏需細進行配線 佈局，為簡化圖式，本圖示係為示意圖，此高頻元件5〇〇之高頻 訊號線640依據實際需求佈線於電路層53〇。 印刷電路板，更可分為軟式印刷電路板或是硬式印刷電路 板，依照研發人員的電路設計，將連接電路零件的電氣佈線繪製 成佈線圖形，然後再以設計所指定的機械加工、表面處理等方式， _ 在、絕、緣體上使電氣導體重現所構成的電路板而言；此外，電路板 的製造過程是應用印刷：照相、侧及電鍍等技術來製造精密的 • 配線，縣切電子料及零制電路相互接續的組裝基地。 . 請參照「第2圖」所示，高頻接地區630，位於接地層52〇， —且其面積延伸至此高頻訊號線路640。對此高頻訊號線路64〇提 供一最近接地面，此外，此高頻接地區630係為獨立接盏；並與 此咼頰元件500之接地相耦接，以避免此高頻元件5〇〇之接地與 其它屬性信號相互干擾，於此，此高頻元件5〇〇之接地與積體電 9 1280845 路之接地係為獨立接地。舉例來說，接地層52〇具有一個以上的 同頻接地區63〇 (第一高頻接地區、第三高頻接地區等等）與第 -元件接地區61G、第二元件接地區㈣等等複數個接地區，且 高頻元件之高頻接地區（第一高頻接地區、第二高頻接地區等等） 與-般兀件之輸入輸出外接埠的接地（第一元件接地區⑽、第 二元件接地區620等等）係以獨立分割設置於接地層S2()。其中， 將高頻接地區㈣與此高頻元件之接地她接（即第一高頻 接舰係與第-高頻元件之接地她接、第二高雜地區係與第 二高頻元件之接地她接等等）’透過此獨立接地的方式，可避免 高頻訊號與其他信號之間的相互干擾。 除此之外’根據本發明所揭露之抑制電磁波干擾之結構，設叶 人員可減少使用腿元件之設置，此外，當高頻訊號線路64〇發 生跨階（訊號線路走線的下一層是電源層51〇時)，也不會有因電 磁波干擾而導致峨簡失敗的情形。因此，本發明^用於二 個人電腦、筆紗電麟電子設備中，利用抑制電磁輕射干擾之 效果，提高電子設備之穩定度。 雖然本發明以前述之實施例揭露如上，然其並非用以限定本發 明。在不脫離本發明之精神和範圍内，所為之更動與潤飾，均屬 本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所 附之申請專利範圍。 【圖式簡單說明】 第1圖係為本發明所提之電磁波干擾抑制結構示意圖；以及 10 1280845 第2圖係為本發明所提之電磁波干擾抑制結構之接地層。 【主要元件符號說明】 500 南頻元件 510 電源層 520 接地層 530 電路層 600 零件層 610 第一元件接地區 620 第二元件接地區 630 南頻接地區 640 南頻訊號線 11* The details of the present invention are described in detail below in the embodiments, and the advantages thereof are sufficient for any skilled person to understand the technical contents of the present invention and to be based on the contents disclosed in the present application. The patents take into account the schema, and any person skilled in the art can easily understand the purpose and advantages of the present invention. In order to further understand the objects, structural features and functions of the present invention, the drawings are described in detail below. [Embodiment] In order to further understand the object, structure, features, and functions of the present invention, the ship's combination is as detailed as τ. The above description of the present invention is described below. The demonstration and interpretation of the Japanese ribs, and the provision of this day's special day Lai Caijin-step turn. Please refer to the "Figure 1" for the electromagnetic interference suppression proposed by the present invention. (7) The structure is applied to a circuit board including a circuit layer 530, a ground layer 520, a part layer _, and a power layer 510. Here, the electromagnetic wave interference suppression junction of the present invention, 'using the high frequency connection region 63〇 of the ground plane, extends the area of the high frequency ground plane to the A 唬 唬 line 640 to the high frequency signal line 64 in the circuit board. 〇 Provide a nearest ground plane. The circuit layer 530 is attached to the circuit board. This illustration is shown in a simple manner, but still has a plurality of wires and a plurality of high frequency signal lines 64 〇. The grounding layer 520 is attached to the circuit board; in the circuit board design and wiring, generally, the grounding of the integrated circuit is disposed on the grounding layer 520, and the grounding of the various properties of the integrated circuit is cut into an independent ground. For example, it can be divided into a first one-piece connection area 610, a second component connection area 620, and the like, thereby avoiding electromagnetic wave interference between different attribute signals. The high frequency component 5〇〇 and the plurality of integrated circuits are disposed on the component layer 6GG, and the money component can be a plurality of pure age faces (VSU•Interface, DVI), video image interface (VideoGrapto^ VGA) or other high speed. For the components to be shouted, the layout of the wiring can be finely referred to. In order to simplify the drawing, the illustration is a schematic diagram, and the high-frequency signal line 640 of the high-frequency component is wired to the circuit layer 53 according to actual requirements. The printed circuit board can be further divided into a flexible printed circuit board or a hard printed circuit board. According to the circuit design of the research and development personnel, the electrical wiring connecting the circuit parts is drawn into a wiring pattern, and then the machining and surface treatment specified by the design are performed. In other ways, _ on the board, the absolute and the body make the electrical conductors reproduce the circuit board; in addition, the circuit board manufacturing process is applied printing: photography, side and plating technology to make precision • wiring, county An assembly base for cutting electronic materials and zero-circuit circuits. Please refer to the "Fig. 2", the high frequency connection area 630, located at the ground plane 52, and its area extends to the high frequency signal line 640. The high frequency signal line 64 is provided with a nearest ground plane. In addition, the high frequency connection area 630 is an independent interface; and is coupled to the ground of the cheek element 500 to avoid the high frequency element 5〇〇. The grounding and other attribute signals interfere with each other. Here, the grounding of the high-frequency component 5〇〇 and the grounding of the integrated body 9 1280845 are independent grounding. For example, the ground layer 52 has more than one same frequency region 63〇 (first high frequency region, third high frequency region, etc.) and the first component region 61G, the second component region (four), etc. And a plurality of connected areas, and the high-frequency connection area of the high-frequency component (the first high-frequency connection area, the second high-frequency connection area, etc.) and the grounding of the input and output external connection of the general element (the first component connection area) (10), the second component connection region 620, etc.) are separately provided on the ground layer S2(). Wherein, the high-frequency connection area (4) is connected to the grounding of the high-frequency component (that is, the ground connection of the first high-frequency connection ship and the first-high frequency component, the second high-mix region and the second high-frequency component Grounding her, etc.) 'This independent grounding method can avoid mutual interference between high frequency signals and other signals. In addition, according to the structure for suppressing electromagnetic wave interference disclosed in the present invention, the blade personnel can reduce the setting of using the leg elements, and in addition, when the high frequency signal line 64 跨 occurs across the stage (the next layer of the signal line trace is the power source) When the layer is 51 ), there is no case where the simplification fails due to electromagnetic wave interference. Therefore, the present invention is applied to two personal computers, pens, and electric devices, and the effect of suppressing electromagnetic light radiation interference is utilized to improve the stability of the electronic device. Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the scope of the patent application attached for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of an electromagnetic wave interference suppression structure proposed by the present invention; and 10 1280845 FIG. 2 is a ground layer of the electromagnetic interference suppression structure proposed by the present invention. [Main component symbol description] 500 South frequency component 510 Power layer 520 Ground plane 530 Circuit layer 600 Part layer 610 First component connection area 620 Second component connection area 630 South frequency connection area 640 South frequency signal line 11