CN101115346A - Electromagnetic wave interference inhibiting structure and circuit board - Google Patents

Electromagnetic wave interference inhibiting structure and circuit board Download PDF

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Publication number
CN101115346A
CN101115346A CNA2006100367779A CN200610036777A CN101115346A CN 101115346 A CN101115346 A CN 101115346A CN A2006100367779 A CNA2006100367779 A CN A2006100367779A CN 200610036777 A CN200610036777 A CN 200610036777A CN 101115346 A CN101115346 A CN 101115346A
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CN
China
Prior art keywords
circuit board
high frequency
circuit
ground connection
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100367779A
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Chinese (zh)
Inventor
刘昌信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac Computer Shunde Ltd
Shunda Computer Factory Co Ltd
Mitac International Corp
Original Assignee
Mitac Computer Shunde Ltd
Mitac International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Computer Shunde Ltd, Mitac International Corp filed Critical Mitac Computer Shunde Ltd
Priority to CNA2006100367779A priority Critical patent/CN101115346A/en
Publication of CN101115346A publication Critical patent/CN101115346A/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses an electromagnetic wave interference suppression structure and the circuit board, a high frequency grounding area is extended to the corresponding position of the high frequency signal circuit to provide a nearest grounding surface, and the high frequency grounding area is connected with the high frequency grounding, the effect of electromagnetic wave interference suppression can be achieved.

Description

Electromagnetic wave interference inhibiting structure and circuit board thereof
Technical field
The present invention is about a kind of circuit board, particularly a kind ofly can suppress the circuit board that electromagenetic wave radiation disturbs.
Background technology
Electronic product now all with meet miniaturization, high-performance, high accuracy, high reliability, and high degree of reaction etc. be target, make the distribution density of circuit unit too high, the volume of circuit dwindles greatly, yet when circuit becomes more exquisite, then having more assembly squeezes in very little space, significantly increase chance interfering with each other, wherein with electromagnetic interference (Electromagnetic interference, EMI) and noise for the most serious.
Generally speaking, electromagnetic interference EMI is formed by a cycle signal that overlaps, and frequency range to number GHz, wherein can be divided into radiativity (Radiated) and conductibility (Conducted) electromagnetic interference from 10KHz again; Radiativity EMI mainly is via the open space transmission, and need be via any transmitting medium.And conductibility EMI, it transmits noise via power lead, can make the electric device that is connected same electric power system to be disturbed each other by electromagnetic interference EMI via power line.Be which kind of electromagnetic interference all has very important injury to electronic building brick, not only can reduce the stability of electronic building brick, even can destroy its structure.
For instance, by the interference signal main frequency of cable conduction (conduction-type EMI) between the 10KHz to 30MHz.When this conduction-type EMI produces, can cause the unusual of electronic equipments such as computer, programmable logic controller (PLC) (PLC) and numerical control device, send or receive error signal easily because of electromagnetic interference, and then produce abnormal execution result.Particularly need to use the place of precision electronic device or testing equipment,, can't allow especially and take place because the infringement that electromagnetic interference produced such as the place that hospital, broadcasting studio or the like are afraid of electromagnetic interference.Again for instance, in the specification of high-order, DVI (Digital Visual Interface) interface is mainly used in the computer display card with numeral demonstration output function and is connected, and can directly show the rgb signal of computer.DVI (Digital Visual Interface) digital display interface, be by in September, 1998, the numeral of setting up on the Intel Developers Forum shows work group's (Digital DisplayWorking Group is called for short DDWG), the digital display interface standard of being formulated, and digital interface and guaranteed that full content adopts the number format transmission, make main frame state no interference signal in the transmission course of monitor produce, also guarantee the integrality of its data, can obtain image more clearly.The main purpose of DVI is to allow the picture signal of display card be sent to computer screen through digital mode, be different from simulation, the signal that is transmitted of DVI is to belong to high speed signal, generally speaking, comprise the place of mainboard at the design input/output port, the ground connection of each input/output port is cut in the capital, the input/output port of different attribute is cut out the access area of an input/output port respectively separately, this method can be avoided the electromagnetic wave phase mutual interference between the different attribute signal, reach the effect that electromagnetic wave suppresses, but when following one deck of signal lead is taken over bus plane, especially when causing some HW High Way (as DVI etc.) when striding the problem of layer (plane), easier generation electromagenetic wave radiation interference problem.
Therefore, how to avoid the generation of electromagnetic interference, be each electronics and system manufacturer one big emphasis always, mainly be because the factor that electromagnetic interference involved is various, high competition in the face of scientific and technological industry, the life cycle of new product is shorter and shorter, and also therefore anti-electromagnetic interference is one of main demand always.
Prior art mostly is to use covers or adds method such as anti-electromagnetic wave assembly, but this prior art can't solve the problem of electromagnetic interference effectively, and in the expenditure of considering to alleviate cost, on the difficulty or ease that realize with circuit, prior art is badly in need of improved just.
Summary of the invention
In view of this, a kind of electromagnetic wave interference inhibiting structure proposed by the invention provides a high frequency earthing district to the high-frequency signal circuit, so that a nearest ground plane to be provided, solves Electromagnetic Interference.
For achieving the above object, the disclosed electromagnetic wave interference inhibiting structure of the present invention, be applied to a circuit board, be a kind of printed circuit board (PCB) (Printed Circuit Board is called for short PCB), high-frequency signal circuit to circuit board provides a nearest ground plane, and this structure that suppresses Electromagnetic Interference includes circuit layer, ground plane, high frequency assembly and high frequency earthing district.
Circuit layer has some holding wire and some high-frequency signal line.Ground plane is cut into independently access area according to the ground connection of different input/output ports, can avoid the electromagnetic wave phase mutual interference between the different attribute signal.High frequency assembly is arranged at circuit layer, and the high-frequency signal line of this high frequency assembly is routed at circuit layer according to actual demand.The high frequency earthing district is arranged at ground plane, and its area extends high-frequency signal circuit so far, provides a nearest ground plane to this high-frequency signal circuit, and in addition, this high frequency earthing district ground connection of high frequency assembly therewith couples mutually, to avoid and the mutual interference mutually of other attribute signal.
Comprehensively above-mentioned, the disclosed electromagnetic wave interference inhibiting structure of the present invention, the area in high frequency earthing district is extended high-frequency signal circuit so far, provide a nearest ground plane to this high-frequency signal circuit, the Electromagnetic Interference that can suppress its high-frequency signal line, in addition, by the present invention when following one deck of high-frequency signal cabling is bus plane, also can avoid causing the signal bust this because of Electromagnetic Interference, in this, because ground connection independently, more can completely cut off the phase mutual interference between the I/O mouth of different attribute assembly, and the designer more can not must add under the anti-electromagnetic wave assembly in utilization, can reach anti-electromagnetic wave.
For making purpose of the present invention, structural feature and function thereof there are further understanding, cooperate diagram to be described in detail as follows now.
Description of drawings
Fig. 1 is the electromagnetic wave interference inhibiting structure schematic diagram that the present invention carried
Fig. 2 is the ground plane of the electromagnetic wave interference inhibiting structure that the present invention carried
Embodiment
Please refer to shown in Figure 1ly, be the electromagnetic wave interference inhibiting structure that the present invention carried, be applied to circuit board, this circuit board includes circuit layer 530, ground plane 520, part layer 600 and bus plane 510.In this, electromagnetic wave interference inhibiting structure of the present invention utilizes the high frequency earthing district 630 of ground plane, the area of high frequency earthing face is extended to high-frequency signal circuit 640, the high-frequency signal circuit 640 in the circuit board is provided a nearest ground plane.
Circuit layer 530 is attached to circuit board, and this icon is with simple expression, but still has some leads and some s' high-frequency signal circuit 640.
Ground plane 520 is attached to circuit board; In the board design wiring, the ground connection of general integrated circuit all can be arranged on ground plane 520, and the ground connection of the integrated circuit of various different attributes is cut into an independent grounding respectively, for instance, can be divided into the first assembly access area 610, second assembly access area 620 or the like, in this, can avoid the different attribute signal between electromagnetic wave disturb mutually.High frequency assembly 500 is arranged at part layer 600 with several integrated circuits, wherein high frequency assembly 500 can be digital screen interface (Digital VisualInterface, DVI), screen image interface (Video Graphics Interface, VGA) or other have the assembly of high speed signal, can be with reference to functional requirement to carry out the distribution layout, be simplicity of illustration, originally be illustrated as schematic diagram, the high-frequency signal circuit 640 of this high frequency assembly 500 is routed at circuit layer 530 according to actual demand.
Printed circuit board (PCB) more can be divided into soft printed circuit board or rigid printed circuit board (PCB); According to research staff's circuit design, the electric wiring of connecting circuit part is depicted as wiring figure, and then, on insulator, makes electric conductor reappear the circuit board that is constituted in modes such as the machining of designing institute appointment, surface treatments; In addition, the manufacture process of circuit board is that technology such as application of printed, photograph, etching and plating are made accurate distribution, as supporting the assembling base that circuit continues mutually between electronic component and part.
Please refer to shown in Figure 2ly, high frequency earthing district 630 is positioned at ground plane 520, and its area extends high-frequency signal circuit 640 so far.Provide a nearest ground plane to this high-frequency signal circuit 640, in addition, this high frequency earthing district 630 is an independent grounding, and the ground connection of high frequency assembly 500 couples mutually therewith, with the ground connection and the mutual interference mutually of other attribute signal of avoiding this high frequency assembly 500, in this, the ground connection of this high frequency assembly 500 and the ground connection of integrated circuit are independent grounding.For instance, ground plane 520 has more than one high frequency earthing district 630 (the first high frequency earthing district, second high frequency earthing district or the like) and the first assembly access area 610, the second assembly access area 620 or the like several access areas, and the ground connection (the first assembly access area 610, second assembly access area 620 or the like) of the input and output external-connected port of the high frequency earthing district of high frequency assembly (the first high frequency earthing district, second high frequency earthing district or the like) and general assembly is arranged at ground plane 520 independently to cut apart.Wherein, with high frequency earthing district 630 therewith the ground connection of high frequency assembly 500 couple (promptly the first high frequency earthing district couples mutually with the ground connection of first high frequency assembly, the ground connection of the second high frequency earthing district and second high frequency assembly couples or the like mutually) mutually, see through the mode of this independent grounding, can avoid the mutual interference mutually between high-frequency signal and other signal.
In addition, the structure of disclosed inhibition Electromagnetic Interference according to the present invention, the setting of designer's EMI assembly capable of reducing using, in addition, stride rank (when following one deck of signal line cabling is bus plane 510) when high-frequency signal circuit 640, also do not have the situation that causes the signal bust this because of Electromagnetic Interference.Therefore, the present invention can be applicable to as in the electronic equipments such as personal computer, notebook, utilizes the effect that suppresses electromagnetic interference, improves the stability of electronic equipment.
Though the present invention discloses as above with aforesaid embodiment, so it is not in order to limit the present invention.Without departing from the spirit and scope of the present invention, change of doing and retouching all belong to scope of patent protection of the present invention.Please refer to appended claim about the protection range that the present invention defined.

Claims (10)

1. electromagnetic wave interference inhibiting structure, this structure applications is in a circuit board, this circuit board has circuit layer, ground plane, the high frequency assembly with at least one ground connection pin and at least one high-frequency signal circuit and at least one integrated circuit of one deck at least, it is characterized in that this has the structure that suppresses Electromagnetic Interference and includes:
One high frequency earthing district is positioned at this ground plane and its face and extends to and contain this high-frequency signal circuit.
2. electromagnetic wave interference inhibiting structure according to claim 1 is characterized in that, this circuit board is a soft printed circuit board or is a rigid printed circuit board (PCB).
3. electromagnetic wave interference inhibiting structure according to claim 1 is characterized in that, the ground connection of this high frequency assembly is independent grounding with the ground connection of this more than one integrated circuit.
4. electromagnetic wave interference inhibiting structure according to claim 1 is characterized in that, this high frequency earthing is an independent grounding.
5. electromagnetic wave interference inhibiting structure according to claim 1 is characterized in that, the ground connection of this more than one integrated circuit is independent grounding.
6. one kind has the circuit board that suppresses the Electromagnetic Interference structure, it is characterized in that this circuit board includes:
At least one circuit layer, it has at least one high-frequency signal circuit;
One ground plane is used as the ground connection of these circuit layers;
One high frequency assembly is arranged at the surface of this circuit board, has at least one ground connection pin and at least one high-frequency signal line pin; And
One high frequency earthing district is positioned at this ground plane, and its area extends to and contains this high-frequency signal circuit.
7. the circuit board with inhibition Electromagnetic Interference structure according to claim 6 is characterized in that this circuit board is a soft printed circuit board or is a rigid printed circuit board (PCB).
8. the circuit board with inhibition Electromagnetic Interference structure according to claim 6 is characterized in that the ground connection of this high frequency assembly and the ground connection of more than one integrated circuit are independent grounding.
9. the circuit board with inhibition Electromagnetic Interference structure according to claim 6 is characterized in that this high frequency earthing is an independent grounding.
10. the circuit board with inhibition Electromagnetic Interference structure according to claim 6 is characterized in that whenever the ground connection of this assembly is independent grounding.
CNA2006100367779A 2006-07-28 2006-07-28 Electromagnetic wave interference inhibiting structure and circuit board Pending CN101115346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2006100367779A CN101115346A (en) 2006-07-28 2006-07-28 Electromagnetic wave interference inhibiting structure and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2006100367779A CN101115346A (en) 2006-07-28 2006-07-28 Electromagnetic wave interference inhibiting structure and circuit board

Publications (1)

Publication Number Publication Date
CN101115346A true CN101115346A (en) 2008-01-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100367779A Pending CN101115346A (en) 2006-07-28 2006-07-28 Electromagnetic wave interference inhibiting structure and circuit board

Country Status (1)

Country Link
CN (1) CN101115346A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645825A (en) * 2017-09-18 2018-01-30 济南浪潮高新科技投资发展有限公司 Reduce printed circuit board and its design method that power supply is disturbed HW High Way

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645825A (en) * 2017-09-18 2018-01-30 济南浪潮高新科技投资发展有限公司 Reduce printed circuit board and its design method that power supply is disturbed HW High Way

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