M398310 五、新型說明： 【新型所屬之技術領域】 本實用新型涉及一種印刷電路板，尤其涉及一種可 有效遮罩EM I的印刷電路板。 【先前技術】 ~ 當前，在很多印刷電路板上都設計有週邊介面區 •域，當相應的連接器焊接於這些週邊介面區域，就可以 將印刷電路板連接至外部設備，從而實現相應的功能。 舉例來說’在舰器系統的主機板上，均設有輸入輸出 介面，通過諸如VGA連接器、C0M連接器或者NIC連接 器，則主機板可分別用來實現視頻顯示、串列資料傳輸 或者網路連接等功能。 然而，與上述連接器耦接的外部設備往往會引入外 鲁，部雜訊，尤其以其高頻介面部分的雜訊或干擾更為明 顯。在現有技術中，為了有效地遮罩EMI，生產廠商通 常都會在連接器的外面附加一金屬外殼，然後將金屬外 殼與連接器的接地皡-起連接至印刷電路板的接地 層’以便外部雜訊直接回流至大地從而避免該雜訊對板 内的高頻信號產生干擾。但是，有些連接器並沒有接地 端子，對於此類連接器來說，前述遮罩方案並不會遮罩 雜訊，還會干擾板上的高頻信號並降低產品的品質。 有鑒於此’如何設計一種可適應多種不同類型連接 3 M398310 器的印刷電路板，從而有效地遮罩該電路板因 所帶來的腿，是業内技術人員歪需解決的—項課^備 【新型内容】 針對現有技術中的印刷電路板在ΕΜΙ方面所存在 的上述缺陷’本實用新型提供了一種新型的印刷電路 板’既可以有效遮罩EMI ’而且操作簡單方便。M398310 V. New description: [New technical field] The present invention relates to a printed circuit board, and more particularly to a printed circuit board capable of effectively covering EM I. [Prior Art] ~ Currently, peripheral interface areas are designed on many printed circuit boards. When the corresponding connectors are soldered to these peripheral interface areas, the printed circuit board can be connected to external devices to achieve the corresponding functions. . For example, 'on the motherboard of the ship system, there are input and output interfaces, such as VGA connector, C0M connector or NIC connector, the motherboard can be used for video display, serial data transmission or Internet connection and other functions. However, external devices coupled to the above connectors tend to introduce external noise and noise, especially with noise or interference in the high-frequency interface portion. In the prior art, in order to effectively cover EMI, manufacturers usually attach a metal casing to the outside of the connector, and then connect the metal casing and the grounding of the connector to the grounding layer of the printed circuit board for external miscellaneous The signal is directly reflowed to the ground to prevent the noise from interfering with high frequency signals in the board. However, some connectors do not have a grounding terminal. For this type of connector, the above masking scheme does not mask noise, and it also interferes with high frequency signals on the board and degrades the quality of the product. In view of this, 'how to design a printed circuit board that can be connected to a variety of different types of 3 M398310 devices, so as to effectively cover the legs caused by the circuit board, is an urgent need for the technical staff in the industry. [New Content] In view of the above-mentioned defects in the prior art printed circuit board, the present invention provides a novel printed circuit board that can effectively cover EMI' and is simple and convenient to operate.
根據本實用新型的-個方面’提供了 一種印刷電路 板，至少包括： 一週邊設備介面部’藉由焊接其上的一連接器將印 刷電路板電性連接至一外部設備； 一遮罩部’佈設於週邊設備介面部的外緣四周且 呈環帶形狀；以及 多個導通孔，均勻分佈於該遮罩部的環帶内， 其中，遮罩部通過多個導通孔電性連接至該印刷電 路板的接地層。 較佳地，焊接於週邊設備介面部的連接器為Vga 連接器、COM連接器和NIC連接器中的任意一種。 較佳地，遮罩部由金屬材料形成。優選地，該金屬 材料是銅。 較佳地，連接器外還包裹一鐵殼，並且鐵殼也電性 連接至接地層。 較佳地’印刷電路板是伺服器系統的主機板。此 4 M398310 外，該週邊設備介面部對應於主機板的高頻信號介面。 :用本實用新型的印刷電路板，在週邊設備介面區 =其是南頻信號介面區域的外緣四周佈設一環形遮 罩帶’並將該環形遮罩帶通過均勾分佈其中的多個導通 孔電!·生連接至板上的接地層，可以有效地遮罩因外部雜 訊而產生的腿’而且也不會額外增加製作成本。 ' 【實施方式】 下面參照附圖，對本實用新型的具體實施方式作進 一步的詳細描述。 第1圖繪示依據本實用新型的_實施例，用於遮罩 EMI的印刷電路板的示意性結構框圖。參照第i圖印 刷電路板1G包括週邊設備介面區域12、遮罩區域14 和接地層18。一般地，印刷電路板1〇是多層線路板， 2中的電源層和接地層都設計為單獨的一層，以此可顯 #著地降低信號走線引起的干擾以及外部引入的雜訊。在 有些情形下’印刷電路板10上的供電電壓有多種級 另J如1. 1V、3. 3V、5. 0V等，這樣也可以將這些供電 電壓各自叹置成單獨一層。容易理解，本新型的接地層 18即為印刷電路板1 〇的系統接地端，該層的電平電壓 為0V (也稱為GND層）。 在第1圖中，週邊設備介面區域12上對應焊接有 連接器，通過該連接器將印刷電路板1〇電性連接到外 部设備，從而實現印刷電路板10相應的控制功能。遮 ^區域14佈设於週邊設備介面區域的外緣四周，呈 :帶狀如此來，遮罩區域14完全包圍住週邊設備 "面區域12。此外，在遮罩區域ι4中還均勻分佈有多 個導通孔丨6 (也稱為Via孔）。#遮罩區域14通過多 個導通孔16電性連接至印刷電路板10的接地層18 時，所有的導通孔16以及整個遮罩區域14的電性電壓 _都與接地電壓相同。在一實施例中，焊接於週邊設備介 面區域12的連接器為VGA連接器，在另一實施例中， 焊接於週邊設備介面區域12的連接器為COM連接器或 者NIC連接器。 為了保持優良的電學特性，例如，將遮罩區域14 設為使用一薄層的金屬材料而形成。優選地，遮罩區域 14為銅皮層。此外，在對應於週邊設備介面區域I〗 的連接器外面還包裹一鐵殼，當鐵殼與連接器一起安放 •于該區域時，鐵殼也電性連接至接地層18，從而可以 、對連接器所傳送的資料信號進行遮罩保護。 本領域的普通技術人員應當理解，第1圖僅僅示意 性地描述了印刷電路板10中與遮罩EMI密切相關的若 干區域和/或結構，但印刷電路板1〇還可以包括其他的 控制電路和多種電子元件，本實用新型為了突出說明遮 罩區域14對於週邊設備介面區域12的E[遮罩效果， 才將這些控制電路和電子元件予以省略。 作為本實用新型的印刷電路板的典型應用，例如， 6 M398310 該印刷電路板10可以是伺服器系統的主機板。特別 是，當主機板的高頻信號介面對應於週邊設備介面區域 12時，設置一環帶狀的遮罩區域14於高頻信號介面的 四周，並通過均勻分佈其上的導通孔將遮罩區域14電 性連接至印刷電路板10的接地層18，就可以有效地遮 罩EM I對於高頻信號的干擾。 有鑒於此，採用上述印刷電路板，在週邊設備介面 區域尤其是高頻信號介面區域的外緣四周佈設一環形 遮罩帶，並將該環形遮罩帶通過均勻分佈其中的多個導 通孔電性連接至板上的接地層，可以有效地遮罩因外部 雜訊而產生的ΕΜΙ ’而且也不會額外增加製作成本。 雖然本新型已以實施方式揭露如上，然其並非用以 限定本新型’任何熟習此技藝者，在不脫離本新型之精 神和範圍内，當可作各種之更動與潤飾，因此本新型之 保護範圍當視後附之巾請專利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依據本實用新型的一實施例，用於遮罩 ΕΜΙ的印刷電路板的示意性結構框圖。 【主要元件符號說明】 10 印刷電路板 12 週邊設備介面區域 7 M398310 14 遮罩區域 16 導通孔 18 接地層According to an aspect of the present invention, a printed circuit board is provided, comprising at least: a peripheral device interface portion [electrically connecting a printed circuit board to an external device by soldering a connector thereon; a mask portion 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The ground plane of the printed circuit board. Preferably, the connector soldered to the peripheral surface of the peripheral device is any one of a Vga connector, a COM connector, and a NIC connector. Preferably, the mask portion is formed of a metal material. Preferably, the metallic material is copper. Preferably, an iron shell is wrapped around the connector, and the iron shell is also electrically connected to the ground layer. Preferably, the printed circuit board is the motherboard of the server system. In addition to the 4 M398310, the peripheral device interface corresponds to the high frequency signal interface of the motherboard. By using the printed circuit board of the present invention, an annular mask strip is disposed around the outer edge of the peripheral device interface area of the peripheral device interface area, and the annular mask strip is distributed through the plurality of conductive strips Hole power! · Raw connection to the ground plane on the board, can effectively cover the legs caused by external noise 'and does not increase the production cost. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in further detail with reference to the accompanying drawings. 1 is a schematic block diagram of a printed circuit board for masking EMI according to an embodiment of the present invention. Referring to Fig. i, the printed circuit board 1G includes a peripheral device interface region 12, a mask region 14, and a ground layer 18. Generally, the printed circuit board 1 is a multi-layer circuit board, and the power supply layer and the ground layer in 2 are designed as a single layer, so that the interference caused by the signal wiring and the externally introduced noise can be significantly reduced. In some cases, the supply voltage on the printed circuit board 10 has various levels, such as 1.1V, 3.3V, 5.0V, etc., so that these supply voltages can also be sinned into a single layer. It is easy to understand that the grounding layer 18 of the present invention is the system ground of the printed circuit board 1 ,, and the level voltage of this layer is 0V (also referred to as the GND layer). In Fig. 1, a connector is soldered to the peripheral device interface area 12, and the printed circuit board 1 is electrically connected to the external device through the connector, thereby realizing the corresponding control function of the printed circuit board 10. The mask region 14 is disposed around the outer edge of the peripheral device interface region in a strip shape such that the mask region 14 completely surrounds the peripheral device & surface region 12. Further, a plurality of via holes 6 (also referred to as Via holes) are evenly distributed in the mask region ι4. When the mask region 14 is electrically connected to the ground layer 18 of the printed circuit board 10 through the plurality of via holes 16, the electrical voltages of all the via holes 16 and the entire mask region 14 are the same as the ground voltage. In one embodiment, the connector soldered to the peripheral device interface area 12 is a VGA connector, and in another embodiment, the connector soldered to the peripheral device interface region 12 is a COM connector or a NIC connector. In order to maintain excellent electrical characteristics, for example, the mask region 14 is formed using a thin layer of a metal material. Preferably, the mask region 14 is a copper skin layer. In addition, an iron shell is wrapped on the outside of the connector corresponding to the peripheral device interface area I. When the iron shell is placed together with the connector, the iron shell is also electrically connected to the ground layer 18, so that The data signal transmitted by the connector is mask protected. It will be understood by those skilled in the art that FIG. 1 only schematically describes several regions and/or structures in the printed circuit board 10 that are closely related to the mask EMI, but the printed circuit board 1〇 may also include other control circuits. With respect to various electronic components, the present invention omits these control circuits and electronic components in order to highlight the E-mask effect of the mask region 14 with respect to the peripheral device interface region 12. As a typical application of the printed circuit board of the present invention, for example, 6 M398310, the printed circuit board 10 may be a motherboard of a server system. In particular, when the high frequency signal interface of the motherboard corresponds to the peripheral device interface region 12, a ring-shaped mask region 14 is disposed around the high frequency signal interface, and the mask region is uniformly distributed through the via holes thereon. The electrical connection to the ground plane 18 of the printed circuit board 10 effectively shields the EM I from high frequency signals. In view of the above, with the above printed circuit board, an annular mask strip is disposed around the outer edge of the peripheral device interface area, especially the high frequency signal interface area, and the annular mask strip is electrically distributed through a plurality of through holes uniformly distributed therein. The connection to the ground plane on the board effectively masks the ΕΜΙ caused by external noise and does not add additional manufacturing costs. Although the present invention has been disclosed in the above-described embodiments, it is not intended to limit the present invention. Any modifications and refinements can be made without departing from the spirit and scope of the present invention. The scope of the attached towel shall be subject to the definition of patent scope. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic block diagram of a printed circuit board for masking a dome according to an embodiment of the present invention. [Main component symbol description] 10 Printed circuit board 12 Peripheral device interface area 7 M398310 14 Mask area 16 Via hole 18 Ground plane