TWI379751B - - Google Patents
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- TWI379751B TWI379751B TW096105422A TW96105422A TWI379751B TW I379751 B TWI379751 B TW I379751B TW 096105422 A TW096105422 A TW 096105422A TW 96105422 A TW96105422 A TW 96105422A TW I379751 B TWI379751 B TW I379751B
- Authority
- TW
- Taiwan
- Prior art keywords
- axis
- spindle
- printed circuit
- circuit board
- guiding
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B39/00—General-purpose boring or drilling machines or devices; Sets of boring and/or drilling machines
- B23B39/16—Drilling machines with a plurality of working-spindles; Drilling automatons
- B23B39/161—Drilling machines with a plurality of working-spindles; Drilling automatons with parallel work spindles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B39/00—General-purpose boring or drilling machines or devices; Sets of boring and/or drilling machines
- B23B39/16—Drilling machines with a plurality of working-spindles; Drilling automatons
- B23B39/18—Setting work or tool carrier along a straight index line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
九、發明說明： 【發明所屬之技術領域】 明彳έί / 货、有關一種印刷基板加工機及其開孔加工方 法0 【先前技術】 2為印刷基板加工機，例如有一種設有：形成有複數 工作〇載置區域之單一機床、以跨過前述工作台載置區域 正體之方式固定於前述機床且與前述工作台載置區域對應 而形成有複數橫滑座之支㈣域之柱、於前述機床被支樓 成可個別$ X方向移動之至少—工作台、於前述柱被支樓 成可個別帛Y :¾•向移動之至少一橫滑座、以及於此橫滑座 被支撲成可個別朝z方向移動之心軸單元的印刷基板加工 機。由於此種印刷基板加工機，係作成在單一機床上配置 複數台印刷基板加工機之構成，因此，即使面對安裝時或 隨著時間變化之地板變動，亦無需進行單一機床内加工模 組間之調整，安裝'保養調整容易。此種裝置不僅可應用 於多種類少量生產情形，亦可應用於少種類多量生產情形 (專利文獻1)。 於使用鑽頭對印刷基板等進行孔加工之印刷基板加工 機情況下’在加工時，分別移動X工作台及橫滑座，將鑽 頭之軸心與加工部之中心對齊，然後，降下心軸單元，藉 由於心軸單元保持成旋轉自如之鑽頭對印刷基板進行開 孔。 當移動X工作台時，於印刷基板加工機將會於水平方 1379751 向產生加速度乘以X工作台及載置於X工作台之零件之質 量大小之激振力。由於此激振力之作用點在較地板更高 處’因此’以此激振力及作用點之高度所決定之力矩，於 印刷基板加工機產生由地板之剛性及印刷基板加工機之旋 轉慣性所決定之固有振動數之旋轉振動（搖動振動）。接著， 從隔著印刷基板加工機之重心配置於印刷基板加工機兩側 之準平螺栓之一方傳來之激振力，朝下壓地板之方向作 用’從另一方傳來之激振力於地板隆升之方向作用。其結 果，於地板產生上下方向之振動。因此，若欲提高加工效 率而高速移動X工作台，地板之振動即變大。 因此，有一種印刷基板加工機，係於機床上設置由於 水平方向移動自如地支撐錘之支撐裝置及驅動此錘之錘驅 動裝置所構成之慣性力產生機構，以及振動感測器，載置 振動感測器於加工裝置，錘驅動裝置根據振動感測器之輸 出讯號移動錘，減小振動感測器之輸出訊號。藉由此技術， 可優化加工後孔之位置精度（專利文獻2)。 又有一種加工機，雖非印刷基板加工機，卻係例如將 裝載加工工具之二滑座配置於同軸上，彼此朝相反方向往 復運動，將各自產生之反作用力相互抵銷，防止噪音、振 動之發生，提咼加工精度（專利文獻3)。 [專利文獻1]曰本特開平7—314395號公報 [專利文獻2]日本特開2003 — 181739號公報 [專利文獻3]曰本特開2〇〇2_ 16〇1〇4號公報 於專利文獻1中並未揭示例如在對相同加工内容之印 刷基板加工時，應如何進行始能提高加工精度。 又由於在移動橫滑座情況下，亦如同移tfx工作台時， 於地板發生上下方向之振動，因此，若使專利文獻2之技 術因應X工作台及橫滑座之移動，鑽頭開孔加工機整體即 增大》 〜正祖,IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a printed substrate processing machine and a method for processing the same thereof. [Prior Art] 2 is a printed circuit processing machine, for example, one is provided with: a single machine tool of the plurality of working 〇 mounting areas is fixed to the machine tool so as to straddle the normal body of the table mounting area, and forms a column of the branch (four) domain of the plurality of cross slides corresponding to the table mounting area The aforementioned machine tool is divided into at least a worktable that can be moved in an individual $X direction, a workbench in the column, and an at least one cross slide that can be moved to the left side, and the cross slide is supported by the cross slide. A printed circuit processing machine that is a mandrel unit that can move in the z direction individually. Since such a printed circuit board processing machine is configured to arrange a plurality of printed circuit board processing machines on a single machine tool, it is not necessary to perform processing in a single machine tool even in the case of a floor change during installation or with time. Adjustment, installation 'maintenance adjustment is easy. Such a device can be applied not only to a small number of types of production cases but also to a small number of production cases (Patent Document 1). In the case of a printed circuit processing machine that performs hole processing on a printed circuit board or the like using a drill bit, 'moving the X table and the cross slide separately during machining, aligning the axis of the drill with the center of the processed portion, and then lowering the spindle unit The printed circuit board is opened by the drill which is held in a rotatable manner by the spindle unit. When moving the X table, the printed substrate processing machine will multiply the acceleration by the X table and the mass of the part placed on the X table at the level 1379751. Since the action of the exciting force is higher than the floor, the torque determined by the height of the exciting force and the point of action is generated by the rigidity of the floor and the rotational inertia of the printed substrate processing machine in the printed circuit processing machine. Rotational vibration (shake vibration) of the number of natural vibrations determined. Next, the exciting force transmitted from one of the quasi-flat bolts disposed on both sides of the printed circuit board processing machine across the center of gravity of the printed circuit board processing machine acts to push the floor from the other side to generate an exciting force from the other side to the floor. The direction of the uplift. As a result, the floor is vibrated in the up and down direction. Therefore, if the X table is moved at a high speed to improve the processing efficiency, the vibration of the floor becomes large. Therefore, there is a printed circuit processing machine which is provided with a support device for movably supporting a hammer in a horizontal direction and an inertial force generating mechanism for driving the hammer drive device, and a vibration sensor for mounting the vibration on the machine tool. The sensor is in the processing device, and the hammer driving device moves the hammer according to the output signal of the vibration sensor to reduce the output signal of the vibration sensor. With this technique, the positional accuracy of the processed hole can be optimized (Patent Document 2). There is another processing machine. Although it is not a printed substrate processing machine, for example, the two sliders of the loading processing tool are disposed on the coaxial axis, and reciprocate in opposite directions, and the respective reaction forces generated by each other are offset to prevent noise and vibration. This occurs, and the processing accuracy is improved (Patent Document 3). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-181739 (Patent Document 3) Japanese Patent Application Laid-Open No. Hei 2 No. Hei. 1 does not disclose how to improve the processing accuracy, for example, when processing a printed substrate of the same processing content. Further, in the case of moving the cross slide, as in the case of moving the tfx table, vibration in the up and down direction occurs on the floor. Therefore, if the technique of Patent Document 2 is adapted to the movement of the X table and the cross slide, the drill hole is machined. The whole machine is enlarged" ~ Zhengzu,
又’於專利文獻3情況下，雖然一對滑座之移動方向 目，惟對支撐工作物之主軸工作么之X 無任何揭示。 作口之X方向的移動控制 【發明内容】 本發明之目的在於解決上述 問74，提供·'種印刷基板 機及:、開孔加工方法，不會使鑽頭開孔加工機整體增 ’且可提兩加工精度。 為解决上述問題，本發明夕笛,地A 加工機，具備：用U 之第1機構為-種印刷基板 1 1载置印刷基板之複數個工作台、嗖於Further, in the case of Patent Document 3, although the moving direction of the pair of sliders is the same, there is no disclosure about the X which supports the work of the spindle. BACKGROUND OF THE INVENTION The object of the present invention is to solve the above problem, and to provide a 'printing substrate machine and a method for drilling a hole, which does not increase the overall length of the drill hole processing machine. Two processing precisions are mentioned. In order to solve the above problems, the present invention has a first processing unit using U, a first printing unit, and a plurality of working tables on which a printed circuit board is placed.
前述各工作么廿你&°又A σ ’則述工作台分別移動於前後X方向之Χ 軸驅動部、分別配置於前 1 i h 卜σ上方之橫滑座、分別 座移動於左右γ方向之¥轴驅動部、支㈣ 之㈣座之心軸、以及分別使心軸上下移動於ζ方向 將於前：動藉由前述χ軸驅動部及前述¥軸驅動部， 置，^ '保持成旋轉自如之鑽頭的軸線定位於加工位 職Γ二藉由前“轴驅動部，使前述鑽頭切入前述印 冲J基板而進行關多丨Λη Τ ，其特徵在於：控制前述X軸驅動 錢4 Υ㈣動部，以及Υ方向之至少1相J 朝相同方向移動之另^ ± 軸相對於 動之另一軸，朝相反方向移動，以進行開孔 1379751 加工。於此情況下，第2機構可使χ&γ方向 分別朝相反方向移動。 ％❹ 、 1王1 公低刀σ工機之開孔 加工方法，該印刷基板加工機具備：用以載置印刷基 複數個工作台、設於前述各1作台並使前述卫作台 動於前後X方向之又軸驅動部、分別配置於前述 二 上方之橫滑座、分別使前述各橫滑座移動於左力 :In the above-mentioned work, you & ° and A σ 'the table is moved to the front and rear X direction of the 驱动 axis drive unit, respectively arranged in the front 1 ih σ σ above the slide, the seat moves in the left and right γ direction The spindle drive unit, the spindle of the (four) seat of the branch (4), and the mandrel are moved up and down in the ζ direction, respectively: the yaw drive unit and the yoke drive unit are held, The axis of the rotary drill bit is positioned at the machining position. The front shaft is driven by the front shaft to cut the aforementioned drill bit into the printed substrate, and the characteristic is: controlling the X-axis drive money 4 Υ (4) The moving part and the other axis of the at least one phase J in the Υ direction move in the same direction, and the other axis moves in the opposite direction to perform the processing of the opening 1379751. In this case, the second mechanism can make the 机构& The gamma direction is moved in the opposite direction. The ❹ 、 , 1 wang 1 public low knife σ machine drilling method, the printed circuit processing machine includes: a plurality of working tables for placing the printing base, and each of the above Make the stage and make the aforementioned guards move X axis direction and the rear drive unit, are arranged in two cross-over of the slide, respectively the movement of each carriage to the left lateral force:
γ軸驅動部、支撐於前述各橫滑座之心軸、以及使前:· ::別ί下移動於Ζ方…轴驅動部，藉由前：::: 鑽頭2Υ軸驅動部’將於前述心軸保持成旋轉自如之 :=線定位於加工位置，然後，藉由前述…動部 鑽頭切入前述印刷基板而進行開孔加工；苴特徵在 一軸，朝^^ 相對於朝相同方向移動之另 4機構了^ ，進行開孔加卫。於此情況下，第 又太…方向之相鄰各軸分別朝相反方向移動。 加工方法構為一種印刷基板加工機之開孔 個工作台一於〜 機具備：冑置印刷基板之複數 前後X方向之動/ ^ “分別移動於 之橫滑座、分別： 分別配置於前述各工作台上方 •驅動部、支樓2别述各橫滑座移動於左右Y方向之Y軸 軸上下移動於牙^述各橫滑座之ϋ及分別使前述心 及前述〜動部向Γ二驅動部’藉由前述χ轴驅動部 的軸線定位於力 :保持成旋轉自如之鑽頭 ;加工位置，然後’藉由前述2袖驅動部，將 1379751 前述鑽頭切入前述印刷基板而進行開孔加工；其特徵在 於：使載置於前述工作台之該印刷基板之方向相同並使 鄰接之前述印刷基板之加工順序相反，進行開孔加工。 可減低印刷基板加工機之搖動㈣，i可防止地板振 動，實現南精度加工。 又由於無需用於振動減低之特別制振裝置，因此，可 低廉地實現尚精度印刷基板加工機。 【實施方式】 以下例示具體實施例，對本發明之實施形態加以說明。 《實施例1》 第1圖係應用本發明之印刷基板加工機之外觀圖，第 2圖係本發日月NCS制裝4 21對χ轴驅動部之處理方塊圖。The γ-axis drive unit, the mandrel supported by each of the above-mentioned cross slides, and the front:·::::::::::::::::: 2: The mandrel is kept freely rotatable: the = line is positioned at the processing position, and then the hole is cut by cutting the aforementioned printing substrate by the moving part bit; the 苴 feature is moved on the same axis with respect to the same direction Another 4 institutions have ^, to open the hole to strengthen. In this case, the adjacent axes of the second direction are moved in opposite directions. The processing method is configured as a working table for a hole in a printed circuit processing machine. The machine is provided with: a plurality of movements of the printed circuit board in the X direction before and after the movement / ^ "moving separately in the horizontal slide, respectively: respectively arranged in the foregoing The upper part of the table, the drive unit, and the branch 2, each of the horizontal slides is moved up and down in the Y-axis of the left and right Y-directions, and is moved up and down to the respective sliders, and the heart and the moving parts are respectively oriented. The driving portion 'is positioned by a force of the shaft of the first shaft driving portion: a drill that is rotatably held; a machining position, and then 'the two-sleeve driving portion is used to cut a hole of the 1379751 into the printed circuit board to perform a drilling process; The method is characterized in that the printing substrate placed on the table is in the same direction and the processing order of the adjacent printed substrates is reversed, and the drilling process is performed. The shaking of the printed substrate processing machine can be reduced (4), and the floor vibration can be prevented. The South Precision machining is realized. Since the special vibration damping device for reducing the vibration is not required, the precision printed circuit processing machine can be realized inexpensively. Embodiments of the present invention will be described with reference to specific embodiments. <<Embodiment 1>> Fig. 1 is an external view of a printed circuit board processing machine to which the present invention is applied, and Fig. 2 is a front view of the NCS assembly. A block diagram of the processing of the drive unit.
印刷基板加工機Μ之機床10透過準平螺栓u及墊塊 構件12支撐於地板。載置印刷基板u之工作台。，可藉 由省略圖示之直線導引裝置及χ轴驅動裝置J於前後^曰 方向移動自如。載置印刷基板^之工作台孔，可藉 略圖示之直線導引裝置及X軸驅動裝置3b於前後（X)方向 移動自如。又，印刷基板u與印刷基板lb之加工内容雖 然相同，惟，印刷基板lb在相對於印刷基板u旋轉18『 狀態下固定於工作台2b。 柱9固定於機床1〇。橫滑座8a，可藉由省略圖一之 線導引裝置及Y軸驅動褒置7a於左右⑺方向移動自、如 =座外’可藉由省略圖示之直線導引裝置及γ轴事 置7b於左右（Υ)方向移動自如。 裝 於& β座8a，保持有：保持鑽頭4a之心軸5a，以及 使。轴5&移動於上下（Z)方向之Z軸驅動裝置6a。於橫滑 8t>保持有：保持鑽頭4b之心軸5b，以及使心軸5b 於上下（Z)方向移動之Z轴驅動裝置6b。 NC控制裝置21控制印刷基板加工機Μ之各部。 第2圖係本發明NC控制裝置2 1對X軸驅動部之處理 方塊圖。 NC控制裝置21讀入加工程式，解析其内容製成X軸 之動作位置指令’將其結果送至座標轉換裝置26。座標轉 換裝置26從送來之動作位置指令製成位置指令a及位置 指令B ’將位置指令a送至驅動控制部22a，並將位置指 令B送至驅動控制部22b。驅動控制部22a從位置指令A 及從位置檢測器24a送來之位置響應25a作成速度指令， 輸出至伺服放大器23a。伺服放大器23a根據此速度指令 作成扭矩指令，驅動馬達3 a使工作台2 a動作。同樣地， 驅動控制部22b由位置指令B及從位置檢測器24b送來之 位置響應25b作成速度指令，輸出至伺服放大器23b。伺 服放大器23b根據此速度指令作成扭矩指令，驅動馬達3b 使工作台2b動作。又，位置指令B與位置指令A之目標 位置座標符號相反，加工順序相同。 NC控制裝置21針對橫滑座8a、8b及Z軸驅動裝置6a、 6b亦作成相同位置指令，透過各轴之驅動裝置控制移動動 作，以上動作亦與習知情形相同。 其次，說明此實施形態之動作。 10 1379751 第3圖係表不對作為加 4c ih ^ r ^ T, A, T象之印刷基板la及印刷基 板lb加工之礼中心位置u〜 m 〇 v , ^ A ^ H和bl〜b4以及加工順序之 圖式。又，第4圖係表示實 -v 41, ^ ^ A 弟3圖所示加工動作情形之 從X轴驅動控制部22a、22b ^ mt ^ 〗出之速度指令之時程圖表。 又第5圖係表示實施第3The machine tool 10 of the printed circuit processing machine is supported on the floor by the quasi-flat bolt u and the spacer member 12. A table on which the printed substrate u is placed. The linear guide device and the cymbal drive device J, which are omitted from the illustration, can be moved in the front and rear directions. The table hole on which the printed circuit board is placed can be moved freely in the front and rear (X) directions by the linear guide device and the X-axis driving device 3b. Further, although the printed substrate u and the printed substrate lb are processed in the same manner, the printed substrate lb is fixed to the table 2b while being rotated 18" with respect to the printed substrate u. The column 9 is fixed to the machine tool 1〇. The horizontal slide 8a can be moved in the left and right (7) direction by omitting the line guide device of FIG. 1 and the Y-axis drive unit 7a, and the linear guide device and the γ-axis can be omitted by the illustration. Set 7b to move freely in the left and right (Υ) direction. Mounted in the & beta seat 8a, it holds: the spindle 5a holding the drill 4a, and the like. The shaft 5 & moves to the Z-axis driving device 6a in the up and down (Z) direction. The horizontal slide 8t> holds: a spindle 5b that holds the drill 4b, and a Z-axis drive unit 6b that moves the spindle 5b in the up and down (Z) direction. The NC control device 21 controls the respective portions of the printed substrate processing machine. Fig. 2 is a block diagram showing the processing of the X-axis driving unit by the NC control device 21 of the present invention. The NC control unit 21 reads the machining program, analyzes the contents, and creates an X-axis operation position command. The result is sent to the coordinate conversion device 26. The coordinate conversion device 26 sends the position command a and the position command B' from the sent operation position command to the drive control unit 22a, and sends the position command B to the drive control unit 22b. The drive control unit 22a creates a speed command from the position command A and the position response 25a sent from the position detector 24a, and outputs it to the servo amplifier 23a. The servo amplifier 23a generates a torque command based on the speed command, and drives the motor 3a to operate the table 2a. Similarly, the drive control unit 22b generates a speed command from the position command B and the position response 25b sent from the position detector 24b, and outputs it to the servo amplifier 23b. The servo amplifier 23b generates a torque command based on the speed command, and drives the motor 3b to operate the table 2b. Further, the position command B is opposite to the target position coordinate symbol of the position command A, and the machining order is the same. The NC control unit 21 also makes the same position command for the slides 8a and 8b and the Z-axis drive units 6a and 6b, and controls the movement operation by the drive unit of each axis. The above operation is also the same as in the conventional case. Next, the operation of this embodiment will be described. 10 1379751 Fig. 3 is a table showing the center positions u~ m 〇v , ^ A ^ H and bl 〜 b4 of the printed substrate la and the printed substrate lb which are added as 4c ih ^ r ^ T, A, T images and processed. The pattern of the order. Further, Fig. 4 is a time chart showing the speed command from the X-axis drive control units 22a and 22b ^ mt ^ in the case of the machining operation shown in the actual -v 41, ^ ^ A 3 diagram. Figure 5 shows the implementation of the third
^ w 所不加工動作情形之從各Y 軸驅動裝置輸出之速度指令 命p ^蚀、 得程圖表’均以縱軸表示速 度才曰々值，以橫轴表示時間。 如第3圖箭頭所標示，相 个日对於印刷基板1 a，依a丨—a2 —a3— a4之順序移動鑽頭4a <軸線，於 al、a2、a3、a4 之各位置進行孔加工。另一方而 ^ L 万面，相對於印刷基板lb，依 ⑽之順序移動鑽頭仆之軸線，於bl、b2、 b3、b4之各位置進行孔加工。 由於印刷純lb之各開孔位置係與印刷基板u之各 開孔位置相對旋轉⑽度之位置，因此，於印刷基板。與 印刷基板lb之加工内容相同情況下，工作台&與工作台 2b以及橫滑座8a與橫滑座朴分別朝相反方向移動。° 亦即，、如第4圖所示’工作台2a藉由圖中實線所示速 ^曰7模式’又’工作台2b藉由圖中虛線所示速度指令 核式’反覆移動與停止。又’如第5圖所示，橫滑座^藉 由圖中實線所示速度指令模式，x，橫滑座8b藉由圖中 ^線所示速度指令模式，反覆移動與停止。接著，於停止 ^ %軸5a、5b上下作動，藉鑽頭4a、4b對基板la、lb 進行孔加工。 如以上所述，由於在工作台2a移動時，工作台2b必 1379751 定朝相反方向作相同動作，在橫滑座8a移動時橫滑座扑 必定朝相反方向作相同動作，因此，因各自動作而產生的 水平方向之振動力量相抵銷（或減低）β由於在印刷基板加 工機不會發生搖動振動，亦不會發生地板振動因此，可 實現高精度加工。 又，於上述印刷基板加工機中，在僅藉由一方之工作 台對加工印刷基板加工情況下，亦可使另一方以虛擬 (dummy)(亦即不載置印刷基板之狀態）方式於相反方向作 動’以防止搖動振動，實現高精度加工。 又，雖然於工作台為2個情況下，每次工作台移動即 會產生水平方向之旋轉力矩，而成為水平方向搖動產生之 主要原因’惟於工作台例如為4個情況下’如第6圖所示， 使兩端之工作台及内側之2工作台各成一組，並選擇使其 進行相反動作，即可預防每次工作台移動產生之水平方向 之旋轉力矩。 又，於工作台為奇數n，清況下，雖無法期待如上述實 施形態之效果’惟由於可使n個工作台同時作動時產生之 習知激振力之1/n，因此，與工作台為偶數之㈣㈣I 可提高加工精度。 《實施例2》 於上述實施例1中，將二印刷基板之-方相對於另-方旋轉刚。配置於工作台，惟若加工位置係例如相對印刷 基板之XY方向中心成點對稱或接近點對稱之情況下，可 如第7圖所示，使載置於工作a 戰直、作Q 2a、2b之印刷基板la、lb 12 1379751 使鄰接之前述印刷基板 〇 複數橫滑座8 a、8 b配 情形做了說明，惟亦可 之方向相同，如該圖中箭頭所示， 之加工順序彼此相反，來進行加工 上述實施例1、2 ’雖係針對將 置於柱9之一側（第丨圖中前側）之 採以下方式。 《實施例3》 第8圖係表示應用本發明 β疋另一印刷基板加工機的構^ w In the case of no machining operation, the speed command output from each Y-axis drive device, p ^ eclipse, and the gain map ‘ both indicate the speed 曰々 value on the vertical axis and the time on the horizontal axis. As indicated by the arrow in Fig. 3, for the printed substrate 1 a, the drill bit 4a < axis is moved in the order of a丨-a2 - a3 - a4, and hole processing is performed at each position of a1, a2, a3, a4 . On the other hand, with respect to the printed substrate lb, the axis of the drill bit is moved in the order of (10), and hole processing is performed at each position of bl, b2, b3, and b4. Since each of the opening positions of the printed pure lb is rotated at a position (10) degrees from the respective opening positions of the printed substrate u, the substrate is printed. In the same manner as the processing contents of the printed substrate lb, the table & and the table 2b, the cross slide 8a, and the cross slide are respectively moved in opposite directions. °, that is, as shown in Fig. 4, 'the table 2a is shown by the solid line in the figure, and the table 2b is moved and stopped by the speed command nucleus shown by the broken line in the figure. . Further, as shown in Fig. 5, the horizontal slider is rotated by the speed command mode indicated by the solid line in the figure, and the horizontal slider 8b is repeatedly moved and stopped by the speed command mode indicated by the line in the figure. Next, the stop % axis 5a, 5b is actuated up and down, and the substrates 1a, 1b are bored by the drills 4a, 4b. As described above, since the table 2b is set to move in the opposite direction in the opposite direction when the table 2a is moved, the horizontal sliding seat 8a must move in the opposite direction when the horizontal sliding seat 8a moves, and therefore, the respective actions are performed. The generated vibration force in the horizontal direction cancels (or reduces) β. Since the vibration of the printed circuit board processing machine does not occur, and the floor vibration does not occur, high-precision machining can be realized. Further, in the above-described printed circuit board processing machine, when the processed printed circuit board is processed by only one of the stages, the other may be dummy (that is, a state in which the printed circuit board is not placed). The direction is actuated 'to prevent shaking vibration and achieve high precision machining. In addition, in the case where there are two tables, the horizontal rotation torque is generated every time the table moves, and the main cause of the horizontal swing is 'only if the table is four, for example, the sixth. As shown in the figure, the two working tables at the two ends and the two working tables on the inner side are grouped together, and the opposite direction is selected to prevent the horizontal rotational torque generated by each table movement. In addition, in the case where the table is an odd number n, the effect of the above-described embodiment cannot be expected in the case of the case. However, since the conventional exciting force generated when the n stages can be simultaneously operated is 1/n, The table is even (4) (four) I can improve the machining accuracy. <<Embodiment 2>> In the above-described first embodiment, the square of the two printed substrates was rotated relative to the other side. It is disposed on the workbench, but if the processing position is, for example, point-symmetric or close to point symmetry with respect to the center of the XY direction of the printed substrate, as shown in FIG. 7, the load is placed in the work a, and Q 2a is placed. 2b of the printed substrate la, lb 12 1379751, the adjacent printed substrate 〇 a plurality of horizontal slides 8 a, 8 b are described, but the same direction, as shown by the arrows in the figure, the processing order of each other On the other hand, the above-described first and second embodiments are applied to one side of the column 9 (the front side in the figure). <<Embodiment 3>> Fig. 8 shows the structure of another printing substrate processing machine to which the present invention is applied.
成之俯視圖，以相同符號標 /、弟1圖相同或功能相同 者’省略重複說明。 工機除了第1圖所示工作 具備工作台2 c、2 d及橫滑 如該圖所示’此印刷基板加 台2a、2b及橫滑座8a、gb外， 座 8c 、 8d 。 工作台2C與工作台工作台2d與工作台2b係以 ^自重心之移動方向同軸之方式配置於機床ι〇上。工竹 台2c、2d’可藉由省略圖示之直線導引裝置及X軸驅動裝 置3c、3d於前後（X)方向移動自如。於工作台2c、2d分別 ★置P W基板lc、’印刷基板lc在相對於印刷基 旋轉⑽。狀態下（與印刷基板lb同方向），印刷基柄 在相對於印刷基板lb旋轉18〇。狀態下（與印刷基板1; H方向）’分別固定於工作台2c、2d。 橫滑座8c、8d之省略圖示之直線導引裝置以與橫滑座 二扑之省略圖示之直線導引裝置平行，亦即移動方向途 =月座8a、8b平行之方式配置於柱9之裏面側（第9圖^ 側’第1圖之後側）。橫滑座8c、8d，可藉由省略圖示 13 1379751 之Y軸驅動裝置於左右（γ)方向移動自如。將保持省略圖 不之鑽頭之心軸以及於上下（ζ)方向移動之省略圖示之ζ軸 驅動裝置保持於橫滑座8c。將省略圖示之鑽頭之心軸以及 上下移動於⑺方向之省略圖示之ζ轴驅㈣置保持 座8d。 '沉 狀控制裝置21讀入加工程式，除了工作台m =座8a、8b之位置指令外’作成工作台Η及橫 β座8c、8d之位置指令。 、 其次，說明此實施形態之動作。 第9圖係表示對作為加工對象之印刷基feia〜id進行 σ工之孔中心位置a 1〜a4、b 1〜ι 乃士 4、Cl〜c4與dl〜d4以In the top view, the same reference numerals /, the same as the brother 1 or the same function are omitted. In addition to the work shown in Fig. 1, the machine has a table 2c, 2d and a horizontal slide. As shown in the figure, the printed circuit board mounting bases 2a and 2b and the horizontal slides 8a and gb are seats 8c and 8d. The table 2C, the table table 2d, and the table 2b are disposed on the machine tool so as to be coaxial with the moving direction of the center of gravity. The bamboo bases 2c and 2d' can be moved in the front-rear (X) direction by the linear guides and the X-axis driving devices 3c and 3d (not shown). In the stages 2c and 2d, respectively, the P W substrate lc and the printed substrate lc are rotated (10) with respect to the printing substrate. In the state (in the same direction as the printed substrate lb), the printing shank is rotated by 18 Å with respect to the printed substrate lb. The state (with the printed circuit board 1; H direction)' is fixed to the stages 2c and 2d, respectively. The linear guides (not shown) of the horizontal slides 8c and 8d are arranged in parallel with the linear guides (not shown) of the cross slides, that is, the moving directions: the lugs 8a and 8b are parallel to each other. The inner side of 9 (the 9th side ^ side 'the back side of the 1st figure). The horizontal slides 8c and 8d can be moved in the left and right (γ) directions by a Y-axis drive device (13 1379751). The spindle shaft of the drill which is omitted from the drawing and the shaft drive device (not shown) which is moved in the up and down (ζ) direction is held by the cross slide 8c. The mandrel of the drill bit (not shown) and the x-axis drive (four) (not shown) which are moved up and down in the direction of (7) are placed on the holder 8d. The sinking control device 21 reads the machining program and creates a position command for the table 横 and the horizontal β seats 8c and 8d except for the position of the table m = the seats 8a and 8b. Next, the operation of this embodiment will be described. Fig. 9 is a view showing the center positions a 1 to a4, b 1 to ι, 4, Cl to c4 and dl to d4 of the printing bases Feia to id as the processing targets.
及加工順序之圖式。 M 如同圖中箭頭所標示，相對 〜 々耵於印刷基板la，依al〜a2 a4之順序移動鑽頭4a 之各位置進行孔加工。另_方面軸f “、a2、〜4 方面，相對於印刷基板lb，依 b2—b3—b4之順序移動镨 m b3、K“々 動鑽碩4b之軸線，於bl、b2、 b3、b4之各位置進行孔加工。又， 順序移動鑽頭4c之軸線，於cl、 c2 c3—C4之 行孔加工。進一步相對於印刷基板:d ::=::置進 進行孔加工。 於^亦…“之各位置 由於印刷基板lc之各開孔位 開孔位置相對旋轉18〇度 ” P刷基板la之各 iSL置，田仏 印刷基板lc之加工内容相 ’於印刷基板la與 J滑况下，工作台2a與工作台 14 1379751And the pattern of the processing sequence. M is as shown by the arrow in the figure, and the hole is processed by moving the respective positions of the drill 4a in the order of a1 to a2 a4 with respect to the printed substrate la. On the other hand, the axis f ", a2, ~4, relative to the printed substrate lb, in the order of b2 - b3 - b4 moves 镨 m b3, K "swing the axis of the drill 4b, in bl, b2, b3, b4 Hole machining is performed at each position. Further, the axis of the drill 4c is sequentially moved, and the holes are processed in cl, c2, c3 - C4. Further processing is performed with respect to the printed substrate: d ::=::. In each position of the "printing substrate lc, the opening position of each opening of the printed circuit board lc is relatively rotated by 18 degrees". The respective iSLs of the P-printing substrate la are placed, and the processed content of the substrate printed circuit board lc is printed on the printed substrate la and Under the slip condition, the workbench 2a and the workbench 14 1379751
2c以及橫滑座8a與橫滑座8c係分別朝相反方向移動。又， 由於印刷基板Id之各開孔位置係與印刷基板ib之各開孔 位置相對旋轉180度之位置，因此，於印刷基板lb與印 刷基板id之加工内容相同情況下，工作台2b與工作台2d 以及橫滑座8b與橫滑座8d係分別朝相反方向移動。如以 上所述，在工作台2a移動時工作台2c必定朝相反方向作 相同動作，在橫滑座8a移動時橫滑座8c必定朝相反方向 作相同動作。又，在工作台2b移動時工作台2d必定朝相 反方向作相同動作，在橫滑座8b移動時橫滑座8d必定朝 相反方向作相同動作。因此，因各自動作而產生的水平方 向之激振力相抵銷（或減低）。並且，因工作台2a與 2d移動（驅動反作用力）而施加於機床之旋轉力矩 工作台2c與工作台2b移動而施加於機床丨〇 〜％句旋轉力 矩而抵銷。因此’即使工作台2a〜2d移動 莉奴轉力亦不會 施加於機床10。同樣地，因橫滑座8a及橫滑座8c移 施加於機床1〇(柱9)之旋轉力矩被因橫滑座 而 久^滑座8 d 移動而施加於機床10之逆向旋轉力矩抵銷。因此，艮 橫滑座8a〜8d移動，旋轉力亦不會施加於機床1 〇 P使 結果’在印刷基板加工機不會發生搖動振動， 發生地板振動，可實現高精度加工。 亦不會 之加迷 2d及横 且由於驅動反作用力被開孔圖案決定的動作 度與可動部質量之積所決定，因此，以工時 〇 ^ 3, 滑座8a〜8d分別為大致相等之質量較佳。 又‘將工作台2a與工作台2c工作台以洛 ° 及工作台2 b 15 1379751 裏面側的工作台2c、2d 之載置及回收之際，作 與工作台2d之導引裝置作成共用， 可例如移動至前側時，於印刷基板 業即變得很容易。 又’此實施例雖係顯示工作a 邛〇及橫滑座分別為4個之 例，惟若工作台及橫滑座為4的 正借数，即有相同效果。 亦即，在工作台及橫滑座為8個以 上滑》兄時，只要將太眚 施例做成於Y方向並排的構成 、不貫2c and the cross slide 8a and the cross slide 8c are respectively moved in opposite directions. Further, since the respective opening positions of the printed substrate Id are rotated by 180 degrees with respect to the respective opening positions of the printed substrate ib, the table 2b and the work are performed under the same processing contents of the printed substrate lb and the printed substrate id. The table 2d and the cross slide 8b and the cross slide 8d are respectively moved in opposite directions. As described above, when the table 2a is moved, the table 2c must perform the same operation in the opposite direction, and when the carriage 10a is moved, the carriage 8c must perform the same operation in the opposite direction. Further, when the table 2b is moved, the table 2d must perform the same operation in the opposite direction, and when the carriage 10b is moved, the carriage 8d must perform the same operation in the opposite direction. Therefore, the exciting force in the horizontal direction due to the respective actions is offset (or reduced). Further, the rotation torque applied to the machine tool by the table 2a and 2d (driving reaction force) is moved by the table 2c and the table 2b, and is applied to the machine tool 〜 to the % sentence rotation torque to cancel. Therefore, even if the table 2a to 2d is moved, the linu turning force is not applied to the machine tool 10. Similarly, the rotation torque applied to the machine tool 1 (column 9) by the cross slide 8a and the cross slide 8c is offset by the reverse rotation torque applied to the machine tool 10 by the slide seat 8 d for a long time. . Therefore, the lateral slides 8a to 8d are moved, and the rotational force is not applied to the machine tool 1 〇 P. As a result, the floor substrate vibration does not occur in the printed circuit board processing machine, and the floor vibration occurs, so that high-precision machining can be realized. It is also determined that the driving force is determined by the product of the driving force determined by the opening pattern and the mass of the movable portion. Therefore, the working hours 3^3, the sliders 8a to 8d are substantially equal. The quality is better. Further, when the table 2a and the table 2c are placed and collected on the table 2c and 2d on the inside of the table 2 b 15 1379751, the table 2a and the table 2c are placed together with the table 2c and 2d. For example, when moving to the front side, it becomes easy in the printed circuit board industry. Further, although this embodiment shows that the work a 邛〇 and the cross slide are respectively four, the same effect can be obtained if the work table and the cross slide are the positive borrowing numbers of four. That is to say, when the workbench and the cross slide are 8 or more, the composition of the sun is arranged side by side in the Y direction.
'J特別是於作業員在同 一方向，例如從工作台2a、2b彻丨澈n 2b側载置及回收印刷基板時， /、排列於X方向而加長縱深方向 〇相較，可在不增大作業員 之縱深方向操作區域的狀態下，進行操作。 又，於上述任一 於各橫滑座8a〜8d， 台2a〜2d ° 實施例之情況下，皆可配置複數心轴 而載置對應心轴數之印刷基板於工作 進而±述實施例雖係⑨明以鑽頭於印刷基板開孔之 加工機之情形，惟亦可安裝路達（_機）鑽頭（_terbit) • 或端銑刀（end如⑴來替代鑽頭，亦可應用本發明之構成於 具有其他定位機構之一般工作母機、製造裝置。 【圖式簡單說明】 第1圖係應用本發明之印刷基板加工機之外觀圖。 第2圖係有關本發明之χ軸驅動控制裝置的處理之方 塊圖。 第3圖係表示待加工孔之中心位置及其順序之圖式（實 施例I)。 第4圖係表示實施第3圖所示加工動作時之速度指令 ^/^751 的時序之圖表。 第5圖係有關本發明之γ軸驅動控制裝置的處理之方 塊圖。 第6圖係具備4個工作台情形之工作台驅動方向例之 說明圖。 第7圖係表示進行加工之孔中心位置及其順序之圖式 (實施例2)。 第8圖係應用本發明之另一印刷基板加工機的構成之 俯視圖。 第9圖係表示進行加工之孔中心位置及其順序之圖式 (實施例3)。 【主要元件符號說明】 ς ·> la、 -Id 印刷基板 3 a、 -3d X軸驅動部 4a、 Md 鑽頭 5a、 ·" 5d 心轴 6a、 - 6d Z轴驅動部 7a、 -7d Y軸驅動部 M 印刷基板加工機 17In particular, when the operator mounts and collects the printed circuit board in the same direction, for example, from the table 2a and 2b, the /J is arranged in the X direction and lengthened in the depth direction. The operation is performed in the state in which the large operator operates in the depth direction. Further, in any of the above-described embodiments of the respective sliders 8a to 8d and the stages 2a to 2d, the plurality of spindles can be disposed and the printed circuit board having the number of spindles placed thereon can be operated. In the case of a machine that drills a hole in a printed circuit board, it is also possible to install a Luda (_ machine) drill bit (_terbit) or an end mill (end (1) instead of a drill bit, and the composition of the present invention can also be applied. The general working machine and manufacturing apparatus having other positioning mechanisms. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an external view of a printed circuit board processing machine to which the present invention is applied. Fig. 2 is a view showing processing of a spindle driving control device according to the present invention. Fig. 3 is a diagram showing the center position of the hole to be machined and its sequence (Embodiment I). Fig. 4 is a diagram showing the timing of the speed command ^/^751 when the machining operation shown in Fig. 3 is carried out. Fig. 5 is a block diagram showing the processing of the γ-axis drive control device of the present invention. Fig. 6 is an explanatory view showing an example of the table drive direction in the case of four work stations. Fig. 7 is a view showing the processing. Hole center position and its order Fig. 8 is a plan view showing a configuration of another printing substrate processing machine to which the present invention is applied. Fig. 9 is a view showing a center position of a hole to be processed and a sequence thereof (Example 3). [Description of main component symbols] ς ·> la, -Id printed circuit board 3 a, -3d X-axis drive unit 4a, Md drill 5a, ·" 5d spindle 6a, - 6d Z-axis drive unit 7a, -7d Y Shaft drive unit M Printed substrate processing machine 17
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006038165 | 2006-02-15 | ||
| JP2007032253A JP4787771B2 (en) | 2006-02-15 | 2007-02-13 | Printed circuit board processing machine and its drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200808506A TW200808506A (en) | 2008-02-16 |
| TWI379751B true TWI379751B (en) | 2012-12-21 |
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|---|---|---|---|
| TW096105422A TW200808506A (en) | 2006-02-15 | 2007-02-14 | Printed board machining device and drilling method therefor |
Country Status (5)
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| JP (1) | JP4787771B2 (en) |
| KR (1) | KR101273284B1 (en) |
| CN (1) | CN101022701B (en) |
| DE (1) | DE102007007482A1 (en) |
| TW (1) | TW200808506A (en) |
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2007
- 2007-02-13 JP JP2007032253A patent/JP4787771B2/en not_active Expired - Fee Related
- 2007-02-14 TW TW096105422A patent/TW200808506A/en not_active IP Right Cessation
- 2007-02-14 CN CN2007100791667A patent/CN101022701B/en not_active Expired - Fee Related
- 2007-02-15 KR KR1020070015959A patent/KR101273284B1/en active IP Right Grant
- 2007-02-15 DE DE102007007482A patent/DE102007007482A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN101022701A (en) | 2007-08-22 |
| JP4787771B2 (en) | 2011-10-05 |
| TW200808506A (en) | 2008-02-16 |
| JP2007245331A (en) | 2007-09-27 |
| KR20070082560A (en) | 2007-08-21 |
| KR101273284B1 (en) | 2013-06-11 |
| DE102007007482A1 (en) | 2007-09-20 |
| CN101022701B (en) | 2010-07-28 |
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