CN101642825B - Method for automatically selecting circuit board engraver tool - Google Patents
Method for automatically selecting circuit board engraver tool Download PDFInfo
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- CN101642825B CN101642825B CN2009101841130A CN200910184113A CN101642825B CN 101642825 B CN101642825 B CN 101642825B CN 2009101841130 A CN2009101841130 A CN 2009101841130A CN 200910184113 A CN200910184113 A CN 200910184113A CN 101642825 B CN101642825 B CN 101642825B
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- color
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Abstract
The invention provides a method for automatically selecting a circuit board engraver tool, comprising the following steps: firstly, generating isolation path; secondly, cutting along the periphery of copper foil of all circuit on the top of circuit board or bottom thereof one time; thirdly, separating a copper layer which needs to be kept from the copper layer which needs to be milled off; fourthly, verifying and judging whether the circuit is completely separated or not by filled method of similar seeds; finally, checking parameters of various common tools by the above method to determine proper tool parameters. In the method of the invention, after software automatically analyzes and verifies cutting feed condition of the whole circuit chart, the optimal tool setting parameter which can achieve the requirement of circuit processing is obtained, thus leading the selection of parameters of the circuit board engraver to be very easy, and greatly reducing difficulty of the operation.
Description
Technical field
The present invention relates to milling in the circuit board engraver that quarter, mode realized carving with machinery, is the realization rapid processing, and analyzes, verifies, selects the method for suitable process tool automatically.
Background technology
Mill in the circuit board engraver that quarter, formula realized carving at machinery, use graver that unnecessary Copper Foil is divested, in order to accelerate process velocity, guarantee simultaneously machining accuracy again, usually adopt the graver of large and small two kinds of different sizes to make up processing: the cutter with the pocket knife footpath is carved the Copper Foil that removes slight part, divests large-area Copper Foil with machete cutter directly.Carry out the combination processing of wiring board engraving by the cutter of selecting different size, realize the optimization of process velocity and machining accuracy.
Existing various combinational processing method all is that tool dimension is set earlier, and the zone that whether cutter enters needs processing is checked by the path preview function again in the calculating processing path then.Consider process velocity, efficient and cutter life, add and always select large-sized cutter man-hour as much as possible.If but the tool dimension of selecting is excessive, has the trickle circuit bar of part and is not severed, and causes partial short-circuit, this never allows on wiring board is made.Conventional method all needs to rely on human eye the observation in path, everywhere is judged whether all the slight part circuit rules in the monoblock wiring board zone are severed, to determine that cutter is selected and whether setting is reasonable.If the plate face is big, circuit is closeer, then be difficult to the identification everywhere and whether can both carve the line pattern that needs, be easy to omit some slight part circuit bar, make to be made into power and to reduce, and give to manipulate and bring inconvenience.
Summary of the invention
At the loaded down with trivial details and inconvenience that whether dependence eye-observation slight part circuit bar is severed in combination processing of existing line plate engraving machine, the inventor improves through research, a kind of automatic selecting method of circuit board engraver tool is provided, automatically analyze, verify the feed situation of putting in order on the figure of bracing cable road by software, draw the optimum cutter that can reach the wiring board processing request parameter is set, make the cutter of circuit board engraver select to become very easy, greatly reduce operation easier.
Technical scheme of the present invention is as follows:
A kind of automatic selecting method of circuit board engraver tool comprises the steps:
(1) generate isolated path, walk cutter No. one time along the periphery of wiring board top layer or all circuit Copper Foils of bottom, the copper layer that keep is separated with the copper layer of wanting mill off, its concrete steps are as follows:
(1) according to the needs of using, configures graphics resolution, in calculator memory, open up a space, deposit figure;
(2) pixel in the above-mentioned pattern space all is set at color 0;
(3) diameter with optical path adds the point of a knife width drafting circuit board drawing of specifying the isolation cutter in above-mentioned pattern space, and the pixel of drawing the figure that comes out is set at color 1;
(4) scan whole pattern space, search color 0 and color 1 connecting place, one 0 pixel unit of all connecting places is set at color 2;
(5) color 2 is converted to routing information, obtain the isolated path of isolating under the cutter specifying;
(2) carry out circuit bar whether complete segregate checking and judgement, its concrete steps are as follows:
(1) pattern filling background color is drawn out actual size circuit bar figure in internal memory, and redistributes color for top layer or bottom figure: background color is a color 0, and the copper foil circuit bar partly is a color 1;
(2) fill new color, for the second time all figures are scanned, all circuit bars that connect together are assigned as with a kind of color, the color that disjunct distribution is different, color number increase progressively since 11, and concrete grammar is:
A. search figure, find first color 1, setpoint color is 11;
B. in color 1 place figure, carry out the seed filling of color 11;
C. color number increases progressively 1 on the basis of A step;
D. no longer there are color 1 in repeating step A, B and C in figure, are about to all colors 1 and all become color 11,12,13
(3) the actual isolated path of drawing, the actual isolated path of in above-mentioned figure, drawing, feed path is the isolated path that step () obtains, width is the graver diameter, and isolated path is represented with color 2;
(4) fill modification, in figure, search 11 above color pixel points,, then change this consecutive points color into 11, and continue to search with new color 11 if color 11 adjacent pixels points are color 0; If consecutive points are not color 0, then keep former consecutive points color constant; With same method Fill Color successively 12,13
(5) check judgement, after all fillings are finished, if adjacent two color of pixel differences are arranged, and all surpass 10, then parameter is incorrect, otherwise then parameter is correct;
With said method cutter parameters is checked that (three) to determine suitable cutter parameters, step is as follows:
(1) at first judges whether fully shielding wire travel permit of default size cutter, if the default size cutter correctly then changes step (2) over to, if the incorrect step (3) that then changes over to of default size cutter;
(2) judge than the big cutter of default size shielding wire travel permit whether fully, if the correct then selection of the cutter bigger than default size is used than the big cutter shielding wire travel permit of default size and milled carving; If incorrect then selection of the cutter bigger than default size isolated with the default size cutter, use the cutter bigger to mill carving than default size;
(3) judge whether the cutter littler than default size can isolate fully,, use the cutter bigger to mill carving than default size if correct then selection of the cutter littler than default size used the cutter shielding wire travel permit littler than default size; Then judge there is not suitable cutter if the cutter littler than default size is incorrect.
Its further technical scheme is: the described cutter littler than default size, default size cutter and the cutter bigger than default size are respectively that diameter width is the cutter of 0.1mm, 0.2mm and 0.3mm.
Substantive distinguishing features and obvious improvement that the present invention gives prominence to are:
The present invention analyzes automatically by software, can search for the best cutter parameters of wiring board processing automatically, when having avoided being provided with the cutter machined parameters, rely on eyes to observe to determine whether every circuit bar all to sever, accomplished not omit the circuit bar that does not sever at any one little place, improved the convenience of use and the success rate of processing greatly.Adopt the present invention can allow which kind of cutter of computer automatic analysis the most suitable, provide optimum cutter setting, improved the success rate of processing, and accelerated process velocity.
Description of drawings
Fig. 1 is the original figure space.
Fig. 2 is intermediateness Fig. 1-1 of embodiment 1.
Fig. 3 is intermediateness Fig. 2-1 of embodiment 2.
Fig. 4 is intermediateness Fig. 1-2 of embodiment 1.
Fig. 5 is intermediateness Fig. 2-2 of embodiment 2.
Fig. 6 is intermediateness Fig. 1-3 of embodiment 1.
Fig. 7 is intermediateness Fig. 2-3 of embodiment 2.
Fig. 8 is intermediateness Fig. 1-4 of embodiment 1.
Fig. 9 is intermediateness Fig. 2-4 of embodiment 2.
Figure 10 is intermediateness Fig. 1-5 of embodiment 1.
Figure 11 is intermediateness Fig. 2-5 of embodiment 2.
Figure 12 is intermediateness Fig. 2-6 of embodiment 2.
Figure 13 is the flow chart that cutter parameters is checked.
The specific embodiment
Below in conjunction with accompanying drawing, and by with the contrast of existing method, the specific embodiment of the present invention is described further.
Among the present invention, little cutter is used to generate isolated path, and big cutter is used to mill except that unnecessary Copper Foil (promptly milling carving).At first introduce the method that generates isolated path.
One, generates isolated path
So-called generation isolated path is exactly to walk cutter No. one time along the periphery of wiring board top layer or all circuit Copper Foils of bottom, and the copper layer that keep is separated with the copper layer of wanting mill off.Its concrete steps are as follows:
(1) according to the needs of using, configures graphics resolution, in calculator memory, open up a space, deposit figure; As shown in Figure 1, in calculator memory, open up the memory space of one 36 * 36 dot matrix as the original figure space.
(2) pixel in the above-mentioned pattern space all is set at color 0, as shown in Figure 1.
(3) in above-mentioned pattern space, draw circuit board drawing, the diameter of optical path need add and specify the width (for example 0.2mm) of isolating point of a knife during drafting, so the figure that drafting is come out than the big point of a knife width of actual graphical, is set at color 1 with drawing the graphical pixel of coming out.
In known PCB mapping software, the circuit board drawing picture description language Gerber coded representation of adopting international standards usually.For example, the test pattern descriptive language Gerber code of one section PCB figure is as follows:
%FSLAX44Y44*%
%MOMM*%
G71*
G01*
G75*
%ADD10C,2.0000*%
D10*
X1463040Y1380500D02*
D03*
Y1329700D02*
Above-mentioned coded representation is drawn straight line with the filled circles (being called optical path) of Φ 2.0mm from starting point coordinate (1463040,1380500) to terminal point coordinate (1463040,1329700).
For the implementation procedure of this method is described, adopt as Fig. 2, two examples shown in Figure 3.Above-mentioned two width of cloth figure form (shown in the zone that pixel 1 is surrounded among Fig. 2, Fig. 3) by the twolink bar, the spacing difference that different is between the circuit bar, and 1 pixel of Fig. 2 spacing, Fig. 3 is distance continuously.
(4) scan whole pattern space, isolate selected circuit bar, search color 0 and color 1 connecting place, one 0 pixel unit of all connecting places is set at color 2; Fig. 4, Fig. 5 are respectively the schematic diagrames after Fig. 2, Fig. 3 isolate.
(5) color 2 is converted to isolated path information, calculate the actual coordinate of each point and be optimized, obtain the isolated path of isolating under the cutter specifying.
Two, obtain isolated path after, adopt the method for similar seed filling of the prior art to carry out circuit whether complete segregate checking and judgement.Its concrete steps are as follows:
(1) pattern filling background color
Draw out the circuit bar figure of actual size according to the Gerber code in internal memory, and redistribute color for top layer or bottom figure: background color (part that does not have copper foil circuit) is color 0, and copper foil circuit partly is a color 1.As Fig. 6, shown in Figure 7.
(2) fill new color
For the second time all figures are scanned, all lines that connect together are assigned as with a kind of color the color that disjunct distribution is different.Color number increases progressively since 11.
Concrete grammar is:
A. search figure, find first color 1, setpoint color is 11;
B. in color 1 place figure, carry out the seed filling of color 11, the same prior art of this seed filling method;
C. color number increases progressively 1 on the basis of A step;
D. no longer there are color 1 in repeating step A, B and C in figure, are about to all colors 1 and all become color 11,12,13 ..., as Fig. 8, shown in Figure 9.(only use color 11,12 among Fig. 8, Fig. 9, as also having other circuit bar, color number corresponding increasing progressively.)
(3) the actual isolated path of drawing
The actual isolated path of in above-mentioned figure, drawing, the path of feed is the isolated path (shown in pixel 2 zones among Fig. 4, Fig. 5) that obtains in the step (), width is the diameter (being generally 0.1mm, 0.2mm or 0.3mm) of graver, embodiment is with the graver diameter of the width indication 0.2mm of 3 pixels, and actual isolated path is represented with color 2.As Figure 10, shown in Figure 11.
(4) fill modification
In the figure of Figure 10, Figure 11, find out 11 above color pixel points, color between these pixel zones is in 0 the zone, carry out seed filling: with color 11 pixel region adjacent pixels points as for color 0, then change this consecutive points color into 11, constitute new color and be 11 pixel region, and be that 11 pixel region continues to search with new color, continue as stated above to fill, till no longer including adjacent color 0 pixel; If consecutive points are not color 0, then keep former consecutive points color constant.As the circuit bar of being isolated more than two sections, with same method filler pixels color successively 12,13 ...Can see that by Figure 10 color 11, the 12 adjacent pixels points of Figure 10 are not 0, therefore not revise the color of any pixel; And the neighbor pixel of the color 11 of Figure 11 has color 0, thus these colors 0 all are revised as color 11, after the modification as shown in figure 12.Between pixel color 11 zones and pixel color 12 zones why color 0 zone being arranged among Figure 11, is that point of a knife can't enter because distance is too narrow between the circuit bar; And Figure 10 is not like this.
(5) check judgement
See Figure 10, Figure 12, after all fillings are finished, if adjacent two color of pixel differences are arranged, and all surpass 10, then cutter parameters is incorrect.As Figure 12, color 11 is adjacent with color 12, is because the part between the lines of the lines of color 11 and color 12 judges that the cutter point of isolating usefulness is too thick, can not enter, so the original color 0 of this part is modified to color 11, causes color 11 adjacent with color 12.And among Figure 10, because isolated path is arranged between color 11 and the color 12, then there is color 2 in this part, makes color 11 impossible adjacent with color 12, judges that the cutter of isolating usefulness can enter.
By to isolating whether completely checking, can judge whether this cutter parameters of use can correctly process this circuit board drawing.
It should be noted that above-mentioned each pixel map only is schematic diagram, the pixel of getting for convenience of explanation seldom.In actual applications, engraving pattern is far longer than above-mentioned 36 * 36 pixel-matrixs, and the width of engraving cutter also is far above several pixels, can not think that the foregoing description forms qualification to the present invention.
Three, in order to last method common several cutter parameters (in the present embodiment be example with 0.1mm, 0.2mm and 0.3mm) are checked, determining suitable cutter parameters, step as shown in figure 13:
Can (1) whether the cutter of at first judging 0.2 millimeter can isolate fully, if 0.2 millimeter cutter correctly then changes step (2) over to, see and select bigger cutter to finish isolation, to increase work efficiency; If can 0.2 millimeter the incorrect step (3) that then changes over to of cutter be seen and be selected a little bit smaller cutter to finish isolation.
(2) whether the cutter of judging 0.3 millimeter can isolate fully, if 0.3 millimeter cutter is correctly then selected 0.3 millimeter cutter isolation and milled carving; If incorrect 0.2 millimeter cutter isolation, 0.3 millimeter the cutter then selected of 0.3 millimeter cutter mills carving.
(3) whether the cutter of judging 0.1 millimeter can isolate fully, if 0.1 millimeter cutter correctly then selects 0.1 millimeter cutter isolation, 0.3 millimeter cutter to mill carving; Then judge there is not suitable cutter if 0.1 millimeter cutter is incorrect.
Above-described only is preferred implementation of the present invention, the invention is not restricted to above embodiment.Be appreciated that other improvement and variation that those skilled in the art directly derive or associate under the prerequisite that does not break away from spirit of the present invention and design, all should think to be included within protection scope of the present invention.
Claims (2)
1. the automatic selecting method of a circuit board engraver tool is characterized in that comprising the steps:
(1) generate isolated path, walk cutter No. one time along the periphery of wiring board top layer or all circuit Copper Foils of bottom, the copper layer that keep is separated with the copper layer of wanting mill off, its concrete steps are as follows:
(1) according to the needs of using, configures graphics resolution, in calculator memory, open up a space, deposit figure;
(2) pixel in the above-mentioned pattern space all is set at color 0;
(3) diameter with optical path adds the point of a knife width drafting circuit board drawing of specifying the isolation cutter in above-mentioned pattern space, and the pixel of drawing the figure that comes out is set at color 1;
(4) scan whole pattern space, search color 0 and color 1 connecting place, one 0 pixel unit of all connecting places is set at color 2;
(5) color 2 is converted to routing information, obtain the isolated path of isolating under the cutter specifying;
(2) carry out circuit bar whether complete segregate checking and judgement, its concrete steps are as follows:
(1) pattern filling background color is drawn out actual size circuit bar figure in internal memory, and redistributes color for top layer or bottom figure: background color is a color 0, and the copper foil circuit bar partly is a color 1;
(2) fill new color, for the second time all figures are scanned, all circuit bars that connect together are assigned as with a kind of color, the color that disjunct distribution is different, color number increase progressively since 11, and concrete grammar is:
A. search figure, find first color 1, setpoint color is 11;
B. in color 1 place figure, carry out the seed filling of color 11;
C. color number increases progressively 1 on the basis of A step;
D. no longer there are color 1 in repeating step A, B and C in figure, are about to all colors 1 and all become color 11,12,13
(3) the actual isolated path of drawing, the actual isolated path of in above-mentioned figure, drawing, feed path is the isolated path that step () obtains, width is the graver diameter, and isolated path is represented with color 2;
(4) fill modification, in figure, search 11 above color pixel points,, then change this consecutive points color into 11, and continue to search with new color 11 if color 11 adjacent pixels points are color 0; If consecutive points are not color 0, then keep former consecutive points color constant; With same method Fill Color successively 12,13
(5) check judgement, after all fillings are finished, if adjacent two color of pixel differences are arranged, and all surpass 10, then parameter is incorrect, otherwise then parameter is correct;
With said method cutter parameters is checked that (three) to determine suitable cutter parameters, step is as follows:
(1) at first judges whether fully shielding wire travel permit of default size cutter, if the default size cutter correctly then changes step (2) over to, if the incorrect step (3) that then changes over to of default size cutter;
(2) judge than the big cutter of default size shielding wire travel permit whether fully, if the correct then selection of the cutter bigger than default size is used than the big cutter shielding wire travel permit of default size and milled carving; If incorrect then selection of the cutter bigger than default size isolated with the default size cutter, use the cutter bigger to mill carving than default size;
(3) judge whether the cutter littler than default size can isolate fully,, use the cutter bigger to mill carving than default size if correct then selection of the cutter littler than default size used the cutter shielding wire travel permit littler than default size; Then judge there is not suitable cutter if the cutter littler than default size is incorrect.
2. according to the automatic selecting method of the described circuit board engraver tool of claim 1, it is characterized in that: the described cutter littler than default size, default size cutter and the cutter bigger than default size are respectively that diameter width is the cutter of 0.1mm, 0.2mm and 0.3mm.
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CN104827815B (en) * | 2015-05-20 | 2017-08-25 | 安徽一威贸易有限公司 | One kind layering engraving process |
CN105499676B (en) * | 2016-01-22 | 2017-09-29 | 上海与德科技有限公司 | The acquisition methods and simulation machining method of the feed path of casing bright border |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3415420A1 (en) * | 1984-04-25 | 1985-11-07 | Siemens AG, 1000 Berlin und 8000 München | Tool for interrupting conductor tracks on printed-circuit boards |
CN1282202A (en) * | 2000-08-29 | 2001-01-31 | 禾宇精密科技有限公司 | Engraving method of circuit board and its equipment |
CN101022701A (en) * | 2006-02-15 | 2007-08-22 | 日立比亚机械股份有限公司 | Printed circuit board processing device and drilling processing method therefor |
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2009
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3415420A1 (en) * | 1984-04-25 | 1985-11-07 | Siemens AG, 1000 Berlin und 8000 München | Tool for interrupting conductor tracks on printed-circuit boards |
CN1282202A (en) * | 2000-08-29 | 2001-01-31 | 禾宇精密科技有限公司 | Engraving method of circuit board and its equipment |
CN101022701A (en) * | 2006-02-15 | 2007-08-22 | 日立比亚机械股份有限公司 | Printed circuit board processing device and drilling processing method therefor |
Non-Patent Citations (1)
Title |
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JP特开2005-219177A 2005.08.18 |
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